1270649 發明說明： 【發明所屬之技術領域】 纟發明係有關於-種液冷式金屬散熱元件之製造方法，其 主要係利用高分子材料製成具有通道模穴之模型，以供填充有 金屬粉末，於高溫燒結後，可使高分子材料氣化，而金屬粉末 則成型為具有多孔性之金屬件，以供充分發揮毛細現象，並增 加散熱效率者。 Φ 【先前技術】 ^按，一般電腦等電子設備由於cpu(中央處理器）工作時， 係會產生高溫，因此必須於⑽上設置有散熱元件，藉以降低 CPU之溫度，使其保持適#之卫作溫度，避免因溫度過高而影 響設備運作，及造成構件損壞，而常見之散熱元件主要係設有 :一真空之密封容室，而於該容室内灌注入有適量之熱交換流 體，並於容室内橫向設有若干之金屬件，該容室-端貼近CPU 形成X熱區，而另一端則形成與外界冷空氣接觸之散熱區，藉 受熱區接受到CPU所傳導之熱能，而使該受熱區内之熱交換 流體產生熱交換而被氣化，再利用毛細現象使氣化後的熱交換 流體上昇而移動到散熱區，而與溫度較低的散熱區再一次進行 熱父換，使氣化後的熱交換流體又轉變成為液態，再次落入至 文熱區，進行循環的熱交換散熱，其中主要係利用該等金屬件 設有多孔性，除了可增加散熱時之表面積，更可以提供較佳之 毛、、、田現象，以增加散熱時之效率，惟，該等金屬件大多為金屬 5 1270649 ’因此㈣造成财纽性之金屬件 到散熱之要求，因此在使用上並不甚理相。 難以達 【發明内容】 ~ 爰此’有鑑於習知具有多孔性金 :故本發明係在提供-種液冷式金屬散熱元V:造:法: ί置八^ 金胁树频狀賴模穴；C、 ίϋ: ·於該模型之通道模穴二端相對夾置有金屬片，並 屬片接觸，1、高溫燒結：係進行高溫燒結，使 -刀子材_焉溫被氣化，而金屬粉末與金屬片隨成一體； E、封閉金屬片··係在該金屬片 封閉’並職紐孔· F 屬片予以環繞 出开π直* /，/' ”、、讀將其内部空氣抽 灌、、熱交換流體;G、完成散熱元件:將該 ^ ^㈣，即形成具衫孔性金屬件之液冷式散熱元 本發明係具有下列之優點： 1.本發明可以_高分子材料預先製成具通道模穴之模 型，使成型後之封閉散熱元件内部形成具有多孔性之金屬件、 =供實施使科’金屬件相發揮毛細現象，以增加散熱效 準。 2.本發明可在封閉之散熱元件内部製造出多孔性之金屬 件，該金料雜係可概熱需科置成_之形狀以配合 1270649 3·本發明利用高分子材料所製成具有通道模穴之模型，於 燒結時係可被完全氣化，故不會殘留於散熱元件内部，而不致 於造成清理上之困難。 【實施方式】 首先，請參閱第一圖所示，本發明主要係包括有下列步 驟，其中： A、 製作模型·係首先利用加壓過後之高分子材料製作為一 φ 適當尺寸之模型（1)，如第二圖所示，該模型（1)中係設 有若干貫通之通道模穴（11)。 B、 填充金屬粉末：係在上述模型（丨）之通道模穴οι)中填 充有金屬粉末（2)，如第三圖所示，並予以填滿，但不 需加壓填實。 : C、夾置金屬片：係同時在於該模型（1)之通道模穴（H) 二端相對夾置有金屬片⑶’如第三圖所示，係可於模 型二外侧形成外壁，使該等通道模穴（⑴内之金屬粉 # 末（2)係可與二侧之金屬片（3)接觸。 D、高溫燒結：係將該模型（1)置入燒結設備（4)中，如第 四圖所示，開始進行高溫燒結，於高温燒結時並不需 對於該金屬粉末⑵加壓，以供可以燒結出具有多孔性 之孟屬金屬件，於燒結後則高分子材料之模型（1)因被 高溫氣化而消失，如第五圖所示，則可使金屬粉末⑵ 與金固結成—體，該金屬粉末财形成柱狀且 表面具有多孔性之金屬件（21)。 1270649 E、 封閉金屬片··係在於該二金屬片（3)之周緣利用其他金 屬片（5)予以環繞封閉，如第六圖所示，並於該金屬片 (5)上預留一灌注孔（51)。 F、 灌注熱交換流體··係由該灌注孔（51)將金屬片（3)、（5) 其内部之空氣抽出形成真空，然後於其中灌注入有熱 交換流體（6)，如第七圖所示，該熱交換流體（6)係可 為去離子水。 G、完成散熱元件：最後再將該灌注口（51)予以密封，如 此，則可形成有一具有多孔性金屬件（21)之液冷式散熱 元件。 … 使用時，如第八圖所示，係可將該散熱元件一端貼近於 CPU(7)形成受熱區（52)，而另一端則形成與外界冷空氣接觸之 散熱區（53)，藉由受熱區（52)接受到CPU(7)所傳導之熱能， 而使該受熱區⑽内之熱交換流體⑹產生缺換而被氣:， 再利用毛細現象使氣化制熱交換缝⑹上昇而移動到散熱 區（53) ’而與溫度較低的散熱區⑽再—次進行熱交換，使^ 化後的熱3C換越⑹又轉變成為液態，再次落人至受熱區⑽ 内，以供可以循環進行熱交換散熱，主要係利用該等柱狀之金 屬件(21)具有多孔性，除了可增加散熱時之表面積，更可以提 供較佳之毛細現象，以增加散熱時之效率。 【圖式簡單說明】 第一圖係為本發明之步驟流程圖。 第二圖係為本發明實施例由高分子材料製成之模型示意圖。 8 1270649 第三圖係為本發明實施例之模型夾置金屬片之示音圖。 第四圖係為本發明實施例之燒結示意圖。 第五圖係為本發明實施例成型有多孔性金屬件之示意圖 第六圖係為本發明實施例環繞封閉金屬片之示意圖。 第七圖係為本發明實施例灌注入熱交換流體之示意圖。 第八圖係為本發明實施例之散熱元件使用示意圖。1270649 Description of the Invention: [Technical Field] The invention relates to a method for manufacturing a liquid-cooled metal heat dissipating component, which mainly uses a polymer material to form a model having a channel cavity for filling with a metal powder After sintering at a high temperature, the polymer material can be vaporized, and the metal powder is molded into a porous metal member for the purpose of fully utilizing the capillary phenomenon and increasing the heat dissipation efficiency. Φ [Prior Art] ^ Press, general computer and other electronic equipment will generate high temperature when working with cpu (central processing unit), so it is necessary to set the heat dissipation component on (10) to reduce the temperature of the CPU and keep it suitable. Guarding the temperature, to avoid the high temperature, affecting the operation of the equipment, and causing damage to the components. The common heat dissipating components are mainly provided with a vacuum sealed chamber, and a proper amount of heat exchange fluid is poured into the chamber. And a plurality of metal parts are arranged laterally in the chamber, the chamber-end is close to the CPU to form an X-hot zone, and the other end forms a heat-dissipating zone in contact with the outside cold air, and the heat-receiving area receives the heat energy transmitted by the CPU, and The heat exchange fluid in the heated zone is subjected to heat exchange to be vaporized, and then the capillary fluid is used to raise the heat exchange fluid after vaporization to move to the heat dissipation zone, and the heat transfer zone with lower temperature is once again subjected to hot parent exchange. The gas-exchanged heat exchange fluid is again converted into a liquid state, and once again falls into the heat-heating zone to perform heat exchange for heat exchange in the cycle, wherein the metal parts are mainly provided with porosity, except It can increase the surface area during heat dissipation, and can provide better hair, and field phenomena to increase the efficiency of heat dissipation. However, most of these metal parts are metal 5 1270649 'Therefore, (4) the metal parts of the financial property are cooled to the heat. Requirements, so it is not very reasonable in use. Difficult to reach [invention] ~ 爰 ' 有 有 习 习 习 有 有 有 有 有 有 有 有 有 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Acupoints; C, ϋ: · At the two ends of the channel of the model, there are metal sheets sandwiched between the two ends, and the sheets are in contact with each other. 1. High-temperature sintering: high-temperature sintering is performed, so that the knife material is vaporized. The metal powder and the metal piece are integrated; E, the closed metal piece is closed in the metal piece 'the joint button hole · F piece is wrapped around the opening π straight * /, / ' ”, read the internal air Pumping, heat exchange fluid; G, complete heat dissipating component: the ^ ^ (4), that is, the formation of a liquid-cooled heat sink with a hole-shaped metal member. The invention has the following advantages: 1. The invention can be _ polymer The material is pre-formed into a model with a channel cavity, so that a metal member having porosity is formed inside the formed heat-dissipating component after molding, and the capillary portion of the metal component phase is exerted to increase the heat dissipation effect. A porous metal member can be fabricated inside the enclosed heat dissipating component, the gold matrix The shape of the heat can be set to _ shape to match 1270649. 3. The model of the channel cavity formed by the polymer material of the present invention can be completely vaporized during sintering, so that it does not remain inside the heat dissipating component. [First Embodiment] Referring to the first figure, the present invention mainly includes the following steps, wherein: A. Making a model is first made of a polymer material after pressurization. For a φ proper size model (1), as shown in the second figure, the model (1) is provided with a plurality of through-channel passage holes (11). B. Filled metal powder: in the above model (丨) The channel cavity οι) is filled with metal powder (2), as shown in the third figure, and filled, but does not need to be filled with pressure. C: Clamping metal piece: at the same time in the model (1 The channel cavity (H) has a metal piece (3) opposite to the other end. As shown in the third figure, an outer wall can be formed on the outer side of the model to make the channel cavity (the metal powder in (1)# (2) ) can be in contact with the metal sheet (3) on both sides. D, high temperature sintering: system The model (1) is placed in the sintering apparatus (4), and as shown in the fourth figure, high-temperature sintering is started, and it is not necessary to pressurize the metal powder (2) at the time of high-temperature sintering, so that the porous material can be sintered. Meng metal parts, after sintering, the polymer material model (1) disappears due to high temperature gasification, as shown in the fifth figure, the metal powder (2) can be consolidated with gold, the metal powder is formed. a metal member (21) having a columnar shape and a porous surface. 1270649 E. The closed metal piece is surrounded by the other metal piece (5) around the periphery of the two metal piece (3), as shown in the sixth figure. And a filling hole (51) is reserved on the metal piece (5) F. The perfusion heat exchange fluid is extracted from the air inside the metal piece (3), (5) by the filling hole (51) A vacuum is formed and then a heat exchange fluid (6) is poured therein, as shown in the seventh diagram, which may be deionized water. G. Finishing the heat dissipating component: Finally, the filling port (51) is sealed, and thus, a liquid-cooled heat dissipating member having a porous metal member (21) can be formed. ... In use, as shown in the eighth figure, one end of the heat dissipating component can be close to the CPU (7) to form a heat receiving zone (52), and the other end forms a heat dissipating zone (53) in contact with the outside cold air. The heat receiving zone (52) receives the heat energy transmitted by the CPU (7), and causes the heat exchange fluid (6) in the heat receiving zone (10) to be replaced by the gas: and then uses the capillary phenomenon to raise the gasification heat exchange seam (6). Move to the heat dissipation zone (53)' and heat exchange with the lower temperature heat dissipation zone (10) again, so that the heat 3C after the change (6) is changed into a liquid state, and then falls into the heat receiving zone (10) again for The heat exchange heat can be circulated, mainly by utilizing the cylindrical metal members (21) to have porosity, in addition to increasing the surface area during heat dissipation, and providing a better capillary phenomenon to increase the efficiency in heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart of the steps of the present invention. The second figure is a schematic diagram of a model made of a polymer material according to an embodiment of the present invention. 8 1270649 The third figure is a sound diagram of a model sandwiched metal piece according to an embodiment of the present invention. The fourth figure is a schematic view of sintering according to an embodiment of the present invention. The fifth drawing is a schematic view of a porous metal member formed in the embodiment of the present invention. The sixth drawing is a schematic view of a surrounding metal piece according to an embodiment of the present invention. Figure 7 is a schematic illustration of the infusion of a heat exchange fluid in accordance with an embodiment of the present invention. The eighth figure is a schematic view of the use of the heat dissipating component of the embodiment of the present invention.
【主要元件符號說明】 (1) 模型 (11) 通道模穴 (2) 金屬粉末 (21) 金屬件 (3) 金屬片 (4) 燒結設備 (5) 金屬片 (51) 灌注孔 (52) 受熱區 (53) 散熱區 (6) 熱交換流體 ⑺ CPU[Explanation of main component symbols] (1) Model (11) Channel cavity (2) Metal powder (21) Metal parts (3) Metal piece (4) Sintering equipment (5) Metal piece (51) Infusion hole (52) Heated Zone (53) Cooling zone (6) Heat exchange fluid (7) CPU