1270113 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種歲埋光學#導件之基板結構及其製 法，尤指-種藉由光傳導訊息之嵌埋光學傳導件之基板結 構及其製法。 【先前技術】 半導體技術之發展日新月異，除以往講求外形體積之 * ^專短小之封裝外’並且對於資料的儲存容量也逐漸提昇 1 除此ΐ外’由於資料的處理量愈來愈大，在相同大 位時間内能以最快的速度處理完畢，則能展 處理效率。而提高半導體處理速度最直接的方法 二 率’但在資料傳輸達猶以上時，則面臨 於更高性能之半導體的製作則愈加困==來對 =Γ二!Γ訊號傳送之媒介的方式，則受材料本 ::因此訊號傳送的速度無法再藉由提高導電性:方= 易受Π二:金屬線材傳送訊號的結構，在傳輸過程中容 又“。的干擾或内部線路之間的干 傳送過程中因干擾及干涉而造成訊號 =號在 或干涉對訊號產生影響，尤其在高頻傳 此種防護措施料電 18480 5 1270113 外的結構設計，使俱士凡 >突破現有的狀Γ 增加及s造成本提高，故難 :傳：：號傳送的方式係以電流通過導體的 式處理，而在讯號處理的方式現在多為數位 情況，Ρ〜达過程中經過轉換則容易造成失真的 付貝；斗在經過訊號轉換後之傳輸錯誤率提高。 用光統類比式訊號傳輸結構的缺失，新技術係採 ^不二:^皮：讯號傳輸方式’最明顯的效果係光訊號幾 =迭的失真。並且可減少設計防電磁波干擾的結構低： 已=^成本及製造成本。故以光作為訊號傳送的方式 已成為未來發展的方向。 而2知1^作為訊號傳送的主要構成係為光纖、光連 :、,、光/包轉換裔及電/光轉換器等訊號處理構件進行數 :貝I料傳ί :但因高精密度的光學對位及系統體積龐大而 I ⑥幸工付紐小之設計潮流，因此逐漸演化成將光電 輸系2設計在印刷電路板(ρ⑻上，藉以提高傳輸品質。、 白头將光兒傳輸結構設計在印刷電路板内的結構，係 在印刷包路板中加人—層有機光波導軟膜（〇哪心 waveguide fiim)的導光層，再將光電元件和驅動元件整 合組裝在電路板上；而可藉由該導光層作為光訊號傳導的 路控，以達到高速傳輸的目的。如第丄圖所示之美國專利 公告第6,839,476號，係於底層丨丨上形成有一芯層12, 方、4〜層12上形成有複數個溝槽j 2a，而在該溝槽丨2a内 6 18480 1270113 置入一光纖13(optical fiber)，再於該芯層12上面形成 一頂層14，俾以將光纖13埋在芯層i2之中，其中之光纖 13係於一纖核i3a(core)外包覆纖殼13b(cladding)。而 ，可在光纖13的兩端裝設光發射、接收模組及光被動元件 、等’以藉由光纖13傳送光訊號，而可免除電訊號傳送之缺 失。 然而该光纖13係埋置在芯層12的溝槽12a中，因此 該芯層12必須先經過開槽製程，然後再將光纖13製入溝 籲槽12a内。而該光纖丨3置於溝槽j 2a之製程係為機械置入 的動作，有如習知電路板插裝電子元件之插件動作，因此 製造速度緩慢，而無法達到快速生產的目的。 ， 再者，该光纖13必須依相對應的溝槽12a的長度先進 -行裁切，然後再將光纖13置於溝槽12a中，使其在製程中 又多一道加工製程，因而增加製作的困難度；且光鐵工3 的長度不一，故增加製程分類的複雜度，使得整體的製程 ❿增加’複雜度提高，相對地即增加製造成本。 而在芯層12上形成溝槽12a再製入光纖13，在尺寸 設計上因溝槽12a與溝槽12a之間必須保持相當的間隔， 方可將光纖13定位在芯層12中，而間隔大小即影響佈線 密度，並且佈線密度受到光纖丨3線徑大小的影響，因此無 法達到高密度佈線之目的。 此外，該用以傳導光訊號的光纖13係於一纖核“a 外包覆纖殼13b，而可藉由包覆在纖核13a外面的纖殼 内層作為反射面，使光訊號藉由纖殼13b内層不斷向前反 18480 7 1270113 射以達傳送訊號的目的。 -贺 |# 而該先緘13與電路板係為不同的 /必須以料的獨立製程 程整體的困難度，且整人 日加衣 度，“法達到大旦二 同製程的產品即增加困難 …去達到大里生產以降低製程成本的目的。 由於該光纖13必須埋置在—厗19 士 的困難产，…、士、 中，因而增加製作 用需求^而成Α案只增加；並且無法達到高密度佈線之使 "而成為業界所欲解決之課題。 .避免光傳導元件形成在電路板中製法，以 白 何之衣釦稷雜及低密度佈線等缺失，實已成爲 目前業界亟待解決之難題。 、已成4 【發明内容】 馨於上述習知技術之缺失，本發明之主要目 提供一種嵌埋光學傳導件其 卩在於 扁，曾企 v仵之基板結構及其製法，俾將用以 傳=號的結構形成在基板中，以降低製程困難戶，俾 可達到光學訊號在基板上傳輪之目的。口難度，俾 本發明之另-目的即在於提供一種嵌埋光學 基板結構及其製法，得提高& ¥ ^ $ 、 提高基板之功能。 緻先料線路之佈線密度以 本發明之又一目的即在於提供一種 基板結構及其製法’得簡化製程以降低製造成Γ :達上迷及其他目的，本發明揭露 =板_製法，係包括:提供一 := claddlngl啊);於該底披覆層上形成至少—隔離芦 在該隔離層中形成複數個通道；於該通道内的兩_成Γ 8 18480 1270113 ， !度：屬層二於該通道内形成一纖核材料，使該輝度金屬 嘈仅打纖松何料兩側；以及於該隔離^ ^ —頂披覆層wPcladdinglayer)。μ核讀上形成 透過前述製法’本發明亦揭露—種嵌埋光學傳導件之 :板結構，係包括：底披覆層；隔離層’具有複數個通道， 且位於該底披㈣上；輝度金屬層，係位㈣通道之兩側· 緘核材料’係位於該通道内，使該具金屬光澤之輝产金屬 :位於纖核材料之兩側；以及頂披覆層，係： 層及纖核材料的頂面。 二-其中該底披覆層及頂彼覆層係為有機高分子材料，而 該隔離層係為一金屬材料’俾可藉由該金屬之隔離層以電 .鑛的方式形成輝度金屬層，使光訊號以通道之兩側的輝度 金屬層連續反射光線，以達傳送訊號之目的。 由於該通道中先形成輝度金屬層，再於該通道中形成 =核材料，如此即可在該隔離層的通道中直接形成用以傳 籲導光訊號的結構，以免除習知將光纖一一埋置在芯層中之 缺失。 又該輝度金屬層及纖核材料係直接形成在隔離層之通 這中’而可達到細線路，以達高密度佈線之目的。 並且該用以傳導光訊號的結構係直接形成在隔離層 中，而可免除習知必須另製光纖之缺失，因而得簡化製程 以降低製造成本。 本發明之另一實施製法，係包括：提供一底彼覆層；於 该底披覆層上形成一輝度金屬層；於該輝度金屬層上形成 9 18480 1270113 · • ，並在該隔離層中形成複數個通道；於該通 厂成“材料；於該隔離層及纖核材料表面 Ζ輝度金屬層，使該輝度金屬層位於纖核#料之頂面及底 面；以及於該輝度金屬層上形成一頂披覆層。 - 又依上述之製法，本發明又揭露—種1 之基板結構，係包括：底披覆層；輝 先；'傳*件 ^之了m離層’具有複數個通道，係位於該輝度 =蜀曰上’緘核材料，係位於該通道内；另—輝度金屬層， 位於隔離層及纖核材料之頂面，使該纖核材料之底面及 頂面具有輝度金屬層；以及頂披覆層，係 度金屬層的頂面。 取上層之輝 .μ該底披覆層及頂㈣層係為金屬材料或有機高分 .:材料；若該底披㈣係為金屬材料，料藉由底披覆層 作為電鑛之傳導路徑，並在該底披覆層表面形成輝度金屬 層，而在該隔離層及纖核材料頂面再另外形成一輝度金屬 >層；反之’若該錢覆層係為有機高分子材料，則以非電 鑛或壓合方式在底披覆層表面形成輝度金屬層，並在隔离: 層及纖核材料頂面再另外形成一輝度金屬層，俾可使光訊 號以通道之底面及頂面的輝度金屬層連續反射光線，以達 傳送訊號之目的。 本發明之又另一實施製法，係包括：提供一底披覆層； =該底披覆層上形成至少一隔離層，並在該隔離層中形成 各數個通道，於該通這之兩側及底面形成一輝度金屬層； 於該通道内形成一纖核材料；於該隔離層及纖核材料表面 18480 10 1270113 形成-輝度金屬層π及於該輝度金屬層上形成—頂披覆 層。 或於該隔離層及纖核材料頂面之輝度金屬I形成—阻 層’而該阻層經圖案化製程並保留位於纖核材料頂面之輝 度金屬層上，然後移除非阻層所覆蓋之輝度金屬層；之後 移除阻層，最後於該輝度金屬層及隔離層上形成一頂披覆 層。 另依上述之製法’本發明又揭露一種嵌埋光學傳導件 :基板結構，係、包括··底披覆層；隔離層，具有複數個通 迢，且位於該底披覆層上；輝度金屬層，係位於通道之兩 側及底面；纖核材料，係位於該通道之輝度金屬層所包圍 的空間内；另一輝度金屬㉟’係位於纖核材料之頂面；以 及頂披覆層，係位於最上層之輝度金屬層及隔離層的頂面。 其中该底披覆層及頂披覆層係為金屬材料或有機高分 子材料，得以電鏟或非電鍍的方式在通道内形成一三周2 的輝度金屬層’再於該纖核材料頂面再另外形成_輝度金 屬層，使該纖核材料的四周面皆有輝度金屬層，俾可使光 訊號以通道四周的輝度金屬層連續反射光線，而可提供更 夕的反射面以達傳送訊號之目的。 【實施方式】 …以下藉由特定的具體實施例說明本發明之實施方式， 热悉此技蟄之人士可由本說明書所揭示之内容輕易地瞭解 :土月之其他優點及功效。本發明亦可藉由其他不同的具 體貫施例加以施行或應用，本說明書中的各項細節亦可基 18480 11 1270113 ==點與應用，在不恃離本發明之精神下進行各種 請參閲第2A圖至第2£圖，係 結構之製法剖面示意圖。音=本u之基板 之干立R ^ 只〆王心的疋，該等圖式均為簡化 二，’僅以示意方式說明本發明之電路板之製程。惟 遠寺圖式僅顯示與本發明有關之元件， 為實際實施時之態樣，p者 八”，、'不兀牛非 尺寸比例A 〇 時之元件數目、形狀及 ，行2 種域性之設計，且其元件佈局型態可能更 [第一實施例] 如弟2A及2 E圖所示，本發明 之基板結構之製法。 月之—種嵌埋光學傳導件 c 1 addln^g llyer)21 並於該底披二=;_:為:2機高分子材料; 之材料係為可導電之金屬 層22，該隔離層22 中形成複數個通道22a。 、^銅，亚在該隔離層22 請參閱第2B圖，藉由該今屬 鐘的導通路徑，以㈣Λ 2 =^_22作為電 之輝度金屬層23，心,严之：側形成-具金屬光澤 銀、金、结、&钬 ^屬層23係可選自單元素之 今輝戶入^ 辞及欽所構成之群組之任一者"戈 d輝度金屬層23係可選自俞、+、—主 1君^ 層。 &自刖述兀素所組群組之多層金屬 内形成一纖核材料 18480 請參閱第2C圖，接著於該通道^ 12 1270113 且歲核材料24完全填充於隔離層22之通道22a内， 料^^纖核材料24之兩側，而該纖核材 你马具先傳辱性之高分子材料。 广麥閱第2D圖’最後於該隔離層22及纖核材料24 -有機高分子材料之頂披覆層25( t〇p cladding :::閱第2E圖，係為該纖核材料以之上視圖，於該 • =料24之兩端具有45度角之折射面24a，而可藉由 μ折射面24a使傳導路徑轉折九十度。 透過月ίΐ述製、去，本發明亦揭露一種嵌埋光學傳導件之 2結構’係包括：底披覆層21，係為—有機高分子材料； i &離層22 ’具有複數個通道22a，且該隔離層22 披覆層21上’而該隔離層22係為—金屬材料； ^屬層23，係位於該通道22a之兩側，而該輝度金屬 :23係可選自單元素之銀、金、叙、把、鉻、鋅及鈦所構 _成之群組之任—者’或該輝度金屬層23係可選自前述元素 所組群組之多層金屬層；纖核材料24，係位於該通道^ 内’使該輝度金屬層23位於纖核材料24之㈣；以及頂 披覆層25，係位於該隔離層22及纖核㈣％的頂面，且 該頂披覆層25係為一有機高分子材料。 +由於销度金屬層23及纖核材料24係直接形成在隔 離層22之通道22以，而可簡化製程，以降低製造成本； 且該輝度金屬層23及纖核材料24所構成之光傳導構件係 直接成形在底披覆層21與隔離層22之通道22a中，俾可 18480 13 1270113 達到光學訊號在基板上傳輪之目的。 [弟一貫施例] 如I 3A & 3E圖所示，係為本發明之嵌埋光學傳導件 •之基板…構之I法的另一實施例，與前一實施不同處在於 •該輝土金屬：係形成在纖核材料之底面及頂面。 月 > 閱第3 A圖，提供一底披覆層31，於該底披覆層 31上形成一輝度金屬層⑽，而該底披覆層μ可為金屬材 $或有機高分子材料。若該純覆層31為金屬材料，則可 藉由β底披覆層31作為電鐘之導電路徑，以在該底披覆層 31表面電鐘形成輝度金屬層32 ;反之，若該底披覆層3ι 2有機兩分子材料，得利用物理氣相沈積（PVD)、化學沈 積或化學氣相沈積（CVD)例如濺鍍（Sputtering)、蒸鍍 (aporation)、電弧热氣沈積（Arc vap〇r 仙）、 離子束濺鑛U〇nbeamsputtering)、雷射炼散沈積…槪 ablation depositi〇n)、無電電鍍或電漿促進之化學氣相 _ ^積等方式’以在该底披覆層3丨表面沉積形成輝度金屬層 32 ° 印#閱第3B圖，接著於該輝度金屬層％上形成至少 隔離層33，並在該隔離層33中形成複數個通道3%。 請參閱f 3C圖，然後於該通道33a内形成一纖核材料 ，使该纖核材料34完全填充於隔離層33内之通道％& 請參閱第3D圖，於該隔離層33及纖核材料34=面= 輝度金綱，’使該輝度金屬層32、 核 材枓34之頂面。 18480 14 1270113 ^凊苓閱第3E圖，最後於該輝度金屬層32,上形成一頂 披覆層3 5。 、 透過前述製法，本發明亦揭露—種嵌埋光學傳導件之 構’係包括··底披覆層31;輝度金屬層犯係位於 底披復層31之頂面；隔離層33，具有複數個通道咖，且 位於該輝度金屬層32上；纖核材料34，係位於該通道咖 :;另-輝度金屬層32，’係位於隔離層33及 =:使，金屬層32、32,位於纖核材料％之底面 披覆層35 ’係位於上層之輝度金屬層32, 由於該輝度金屬|32、32，係形成在纖 及頂面，使光線得以上下反射的方式傳導；並且該❹: 料34係直接形成在隔離層33之通道3 = 程，以降低製造成本；且該 間化衣 層33之通、曾φ，、，X ^料34係直接成形在隔離 曰 k a ，亚在纖核材料34底面及頂面分別# 成有輝度金屬層32、32,，而π、去^ / 刀別形 輸之目的。 到光學訊號在基板上傳 [第三實施例] " 如第4A及4E圖所示，係a ^ t 牙、马本發明之嵌埋光學傳暮杜 之基板結構之製法的又-實施例，與前述各實施 於該輝度金屬層係形成在輝度金屬層之四周面。在 声㈣’提供―底披覆層化並於該底披覆 w數㈣ΛΓ金^離層42,並在該隔離層42中形 成汗夂數個通道42a，而該底柚φ ^ -披後層41可為金屬或有機高分 18480 15 1270113 子材料。 猜夢閱第4B圖，若該底彼覆層41與隔離層42為金屬 材料，則得以電鍍方式在通道42a的兩側及底面形成一輝 度金屬層43。反之，若該底披覆層41為有機高分子材料， 則以物理氣相沈積（PVD)、化學沈積或化學氣相沈積（CVD) 例如濺鍍（Sputtering)、蒸鍍（Evaporation)、電弧蒸氣沈 積（Arc vapor deposition)、離子束濺鍍（i〇n beam sputtering)、雷射熔散沈積（Laser ablati〇n deposition)、無電電鍍或電漿促進之化學氣相沈積等方 式，以在该通這42a的兩側及底面形成一輝度金屬層43 形成輝度金屬層43。 θ 請參閱帛4C圖，接著於該通道42a内形成一纖核材料 44 ’使&該纖核材料44完全填充於隔離層42内之通道“a。 請參閱第4D圖，再於該隔離層42及纖核材料^表面 形成另一輝度金屬層43，，使該輝度金屬層43、伙位於纖 核材料44之兩侧及底面及頂面，以將纖核材料完全被 輝度金屬層43、43,所包覆。 請參閱第4E圖，最後於該輝度金屬層43，上 披覆層45。 透過則述製法，本發明揭露一種嵌埋光學傳導件之美 =構，係包括:底彼覆層化隔離層42,具有複數個； 隔=，4Γ於該底披覆層41上；輝度金屬層43,係位於 4層42之兩側及底面；纖核材料44，係位於該通道他 ，另一輝度金屬層43,係位於隔離層42及纖核材料^ 18480 16 1270113 、4 3位於織核材料4 4之周面； 上增之輝度金屬層43,的頂面。 金屬層43’移除非作用部份之 之頂面，使該輝度金屬層43 以及頂坡覆增4 5 ’係位於最 以下之s知係為該輝度 另一實施。 - 請參閱f 5A圖，於該隔離層42及纖核材料44頂面之 輝度金屬層43’形成—阻層46。 、 請參閱第5B圖，該阻層46經圖案化製程而保留位於 纖核材料44頂面之輝度金屬層，上。 •請參閱第5C圖，移除非阻層46所覆蓋之輝度金屬層 請爹閱第5D圖’最後移除該阻層46，並於該輝度金 屬層43’及隔離層42上形成一頂彼覆層45。 由於該輝度金屬層43、43，係形成在纖核材料“之底 面、頂面及兩侧’使光線得在四周面反射傳導，而可有更 佳的反射面以提供光傳導。 隔離層42之通道 ，·且該纖核材料44 ，並在纖核材料44 可達到光學訊號在 ⑩ 並且該纖核材料44係直接形成在 42a内，俾可簡化製程並降低製造成本 係直接成形在隔離層42之通道“a中 四周面形成有輝度金屬層43、43,，而 基板上傳輸之目的。 上述實施例僅為例示性說明本發明之原理及其功效， =用於限制本發明。任何熟習此項技藝之人士均可在不 本In精神及|& τ，對上述實施例進行修改。因 卷月之權利保護範圍，應如後述之申請專利範圍所列。 18480 17 1270113 【圖式簡單説明】 第1圖係為美國專利公告第6,839,476號之剖面示意1270113 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate structure of a seed-in-situ optical guide and a method of manufacturing the same, and more particularly to a substrate structure in which an optical conductive member is embedded by a light-conducting message And its method of production. [Prior Art] The development of semiconductor technology is changing with each passing day. In addition to the external volume, the size of the package is small, and the storage capacity of the data is gradually increased. 1Besides this, the processing capacity of the data is increasing. The processing speed can be achieved at the fastest speed in the same large time period. The most direct method to improve the processing speed of semiconductors is the second rate. However, when the data transmission is more than the above, the production of semiconductors with higher performance is more difficult. == The right way to send the signal to the media According to the material:: Therefore, the speed of signal transmission can no longer be improved by the conductivity: square = susceptible to the second: the structure of the metal wire transmission signal, during the transmission process, the interference or the internal line between the interference Due to interference and interference during transmission, the signal = number interferes with or interferes with the signal, especially in the high-frequency transmission of such protective measures. The structural design of the power supply 18480 5 1270113 enables the company to break through the existing conditions. And s caused this improvement, it is difficult: pass:: The mode of transmission is based on the current through the conductor, and the way of signal processing is now mostly digital, and it is easy to cause distortion when converted. Paying the bill; the transmission error rate of the bucket after the signal conversion is improved. With the lack of optical analog analog signal transmission structure, the new technology system is not the same: ^ skin: signal transmission mode 'most obvious It is a kind of distortion of the optical signal and can reduce the low structure of the design to prevent electromagnetic interference: already = cost and manufacturing cost. Therefore, the way of transmitting light as a signal has become the direction of future development. The main components of signal transmission are optical fiber, optical connection, and optical/package conversion and electrical/optical converters. The number of signal processing components is: II material transmission: However, due to high precision optical alignment and system The huge size and I 6 lucky work to pay for the design trend of the small, so gradually evolved into the design of the optoelectronic transmission system 2 on the printed circuit board (ρ (8), in order to improve the transmission quality., the whitehead will be designed in the printed circuit board The structure is to add a light-guiding layer of a layer of organic optical waveguide soft film (the waveguide guide fiim) in the printed circuit board, and then integrate the photovoltaic element and the driving component on the circuit board; The optical layer serves as a path for the transmission of the optical signal to achieve the purpose of high-speed transmission. For example, U.S. Patent No. 6,839,476, which is shown on the bottom of the drawing, has a core layer 12 formed on the bottom layer, square, 4 to 12 Formed complex a trench j 2a, and an optical fiber 13 is placed in the trench 丨 2a 6 18480 1270113, and a top layer 14 is formed on the core layer 12 to bury the optical fiber 13 in the core layer i2 The optical fiber 13 is wrapped around a fiber core i3a (core) and covered with a fiber casing 13b. However, a light emitting and receiving module and a light passive component can be disposed at both ends of the optical fiber 13 The optical signal is transmitted by the optical fiber 13 to eliminate the loss of the electrical signal transmission. However, the optical fiber 13 is embedded in the trench 12a of the core layer 12, so the core layer 12 must first undergo a slotting process and then the optical fiber. 13 is made into the groove calling groove 12a. The process in which the optical fiber raft 3 is placed in the trench j 2a is mechanically inserted. As in the conventional plug-in operation of inserting electronic components into the circuit board, the manufacturing speed is slow and the rapid production cannot be achieved. Furthermore, the optical fiber 13 must be advanced and row-cut according to the length of the corresponding trench 12a, and then the optical fiber 13 is placed in the trench 12a, so that another processing process is performed in the process, thereby increasing the fabrication. Difficulty; and the length of the light ironwork 3 is different, so the complexity of the process classification is increased, so that the overall process is increased, the complexity is increased, and the manufacturing cost is relatively increased. The trench 12a is formed on the core layer 12 and then formed into the optical fiber 13. In order to maintain the spacing between the trench 12a and the trench 12a, the optical fiber 13 can be positioned in the core layer 12 with an interval size. That is, the wiring density is affected, and the wiring density is affected by the size of the fiber 丨3 wire diameter, so that high-density wiring cannot be achieved. In addition, the optical fiber 13 for conducting the optical signal is attached to the outer core of the fiber core 13a, and the inner surface of the outer casing of the fiber core 13a can be used as a reflecting surface to make the optical signal pass through the fiber. The inner layer of the shell 13b is continuously forwarded and reversed 18480 7 1270113 to achieve the purpose of transmitting signals. -He|# And the 缄13 is different from the circuit board system/the necessity of the independent process of the material, and the whole person Days of clothing, "the law to achieve the Dadan two process of the product is to increase the difficulty ... to reach the Dali production to reduce the cost of the process. Since the optical fiber 13 must be embedded in the difficult production of 厗19, ..., 士, 中, and thus increase the production requirements ^ the case is only increased; and can not achieve high-density wiring. Solve the problem. It is a difficult problem to be solved in the industry to avoid the formation of light-conducting elements in the circuit board, and the lack of white-nosed and low-density wiring. [Invention] The present invention aims to provide a buried substrate, a substrate structure and a method for preparing the same, which will be used for transmission. The structure of the = sign is formed in the substrate to reduce the difficulty of the process, and the optical signal can be transferred to the substrate. Difficulty of mouth, 另 Another object of the present invention is to provide an embedded optical substrate structure and a method for manufacturing the same, which can improve the function of & ¥ ^ $ and improve the substrate. Another object of the present invention is to provide a substrate structure and a method for manufacturing the same, which is to simplify the process to reduce the manufacturing process, and to achieve other objects. The present invention discloses a method of forming a board. : providing one: = claddlngl ah); forming at least on the bottom cladding layer - the isolation of the reed forms a plurality of channels in the isolation layer; the two _ into the channel in the channel 8 18480 1270113, degree: genus layer two Forming a core material in the channel, so that the luminance metal crucible is only loosened on both sides of the material; and the isolation layer is wPcladding layer. The μ core read is formed by the above-mentioned method. The invention also discloses an embedded optical conductive member: a plate structure comprising: a bottom cladding layer; the isolation layer has a plurality of channels, and is located on the bottom (four); Metal layer, both sides of the (4) channel · The nucleus material ' is located in the channel, so that the metal-gloss-producing metal: on both sides of the core material; and the top coating, the layer: The top surface of the nuclear material. Secondly, wherein the bottom cladding layer and the top cladding layer are organic polymer materials, and the isolation layer is a metal material '俾, the tungsten metal layer can be formed by electricity or mineralization through the metal isolation layer. The optical signal is continuously reflected by the luminance metal layer on both sides of the channel for the purpose of transmitting signals. Since the luminance metal layer is formed first in the channel, and the core material is formed in the channel, the structure for transmitting the light guiding signal can be directly formed in the channel of the isolation layer, so as to avoid the conventional fiber-optic one by one. The absence of embedding in the core layer. Further, the luminance metal layer and the core material are directly formed in the passivation layer to achieve fine wiring for high-density wiring. Moreover, the structure for conducting the optical signal is directly formed in the isolation layer, and the elimination of the optical fiber must be eliminated, so that the manufacturing process can be simplified to reduce the manufacturing cost. Another embodiment of the present invention includes: providing a bottom cladding layer; forming a luminance metal layer on the bottom cladding layer; forming 9 18480 1270113 · · on the luminance metal layer, and in the isolation layer Forming a plurality of channels; forming a material in the factory; illuminating the metal layer on the surface of the isolation layer and the core material such that the luminance metal layer is located on the top surface and the bottom surface of the core material; and on the luminance metal layer Forming a top cover layer. - According to the above method, the present invention further discloses a substrate structure of the type 1, which comprises: a bottom cladding layer; Hui Xian; 'passing the piece ^ the m separation layer' has a plurality of The channel is located on the luminance = 蜀曰 '缄 缄 nuclear material, which is located in the channel; the other - the luminescent metal layer is located on the top surface of the isolation layer and the core material, so that the bottom surface and the top surface of the core material have brightness a metal layer; and a top cladding layer, the top surface of the metal layer. The upper layer of the cladding layer and the top (four) layer are metal materials or organic high scores: material; if the bottom layer (four) system For the metal material, the bottom coating layer serves as the conduction path for the electric ore. And forming a luminance metal layer on the surface of the bottom cladding layer, and additionally forming a luminance metal layer on the top surface of the isolation layer and the core material; otherwise, if the money coating is an organic polymer material, Forming a bright metal layer on the surface of the bottom cladding layer by non-electrical ore-bonding, and separately forming a bright metal layer on the top surface of the layer and the core material, so that the light signal can be the bottom surface and the top surface of the channel The luminance metal layer continuously reflects the light for the purpose of transmitting the signal. Yet another embodiment of the present invention includes: providing a bottom cladding layer; = forming at least one isolation layer on the bottom cladding layer, and Forming a plurality of channels in the isolation layer, forming a luminance metal layer on the two sides and the bottom surface of the through hole; forming a core material in the channel; forming a -luminous metal on the surface of the isolation layer and the core material 18480 10 1270113 a layer π and a top cladding layer formed on the luminance metal layer. Or a luminance metal I on the top surface of the isolation layer and the core material forms a resist layer, and the resist layer is patterned and retained in the core material. Top surface gold On the genus layer, the photoresist metal layer covered by the non-resistive layer is removed; then the resist layer is removed, and finally a top cladding layer is formed on the luminance metal layer and the isolation layer. Further, according to the above method, the invention discloses An embedded optical conductive member: a substrate structure, comprising: a bottom cladding layer; an isolation layer having a plurality of vias located on the bottom cladding layer; and a luminance metal layer on both sides and a bottom surface of the channel The core material is located in the space surrounded by the luminance metal layer of the channel; the other luminance metal 35' is located on the top surface of the core material; and the top cladding layer is located on the uppermost layer of the luminance metal layer and is isolated The top surface of the layer, wherein the bottom cladding layer and the top cladding layer are metal materials or organic polymer materials, and a three-week 2 luminance metal layer is formed in the channel by electric shovel or electroless plating. The top surface of the core material is additionally formed with a luminosity metal layer, so that the periphery of the core material has a bright metal layer, so that the light signal can continuously reflect light through the bright metal layer around the channel, and can provide a brighter reflection. To reach The purpose of sending the signal. [Embodiment] Hereinafter, embodiments of the present invention will be described by way of specific embodiments, and those skilled in the art can easily understand the other advantages and functions of the earth moon. The present invention may also be implemented or applied by other different specific embodiments. The details in the present specification may also be based on the application of 18480 11 1270113 == points and applications, without departing from the spirit of the present invention. See Fig. 2A to Fig. 2 for a schematic cross-sectional view of the structure of the structure. Sound = the basis of the substrate of the present u ^ 〆 〆 〆 疋 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The Weiyuan Temple diagram only shows the components related to the present invention, and is the actual implementation mode, the number of the components is eight, and the number and shape of the components are not the same as the non-size ratio A ,. The design, and the component layout type may be more [First Embodiment] As shown in the drawings 2A and 2E, the substrate structure of the present invention. The moon-embedded optical conduction member c 1 addln^g llyer 21 and at the bottom of the second =; _: is: 2 machine polymer material; the material is a conductive metal layer 22, the isolation layer 22 forms a plurality of channels 22a. Layer 22 Please refer to Figure 2B. With the conduction path of the current clock, (4) Λ 2 = ^_22 is used as the electrical luminance metal layer 23, the heart, the strict: side formation - with metallic luster silver, gold, knot, & The 23^ layer 23 series can be selected from the unit of the unit of the current Huihui into the ^ and any of the groups formed by the group of "Q" d radiance metal layer 23 can be selected from Yu, +, - Master 1 ^ 层. & A core material 18480 is formed in the multilayer metal of the group of narcissus groups. See Figure 2C, followed by the channel ^ 12 1270113 and the nucleus The material 24 is completely filled in the channel 22a of the isolation layer 22, and the two sides of the material core material 24, and the fiber material of the fiber material is the first to insult the polymer material. The isolation layer 22 and the core material 24 - the top cladding layer 25 of the organic polymer material (t〇p cladding ::: see Figure 2E, is the top view of the core material, in the material = 24 The two ends have a refractive surface 24a with a 45-degree angle, and the conduction path can be turned by ninety degrees by the μ refractive surface 24a. The present invention also discloses a structure 2 for embedding an optical conductive member. The system includes: a bottom cladding layer 21, which is an organic polymer material; i & the separation layer 22' has a plurality of channels 22a, and the isolation layer 22 is coated on the layer 21 and the isolation layer 22 is a metal Material; ^ genus layer 23, located on both sides of the channel 22a, and the luminance metal: 23 series may be selected from the group consisting of silver, gold, ruthenium, rhodium, chromium, zinc and titanium. Any of the 'luminous metal layers 23 may be selected from the group of metal layers of the group of elements described above; the core material 24 is located within the channel ^ The luminance metal layer 23 is located at (4) of the core material 24; and the top cladding layer 25 is located on the top surface of the isolation layer 22 and the core (4%), and the top cladding layer 25 is an organic polymer material. + Since the metallization layer 23 and the core material 24 are directly formed in the channel 22 of the isolation layer 22, the process can be simplified to reduce the manufacturing cost; and the light conduction of the luminance metal layer 23 and the core material 24 The component is directly formed in the channel 22a of the bottom cladding layer 21 and the isolation layer 22, and the optical signal is applied to the substrate uploading wheel at 18480 13 1270113. [Brief Example] As shown in the figure of I 3A & 3E, it is another embodiment of the method of embedding the optical waveguide of the present invention, which is different from the previous embodiment. Earth metal: formed on the bottom and top surfaces of the core material. Month > Referring to Figure 3A, a bottom cladding layer 31 is provided, and a golden metal layer (10) is formed on the bottom cladding layer 31, and the bottom cladding layer μ may be a metal material or an organic polymer material. If the pure cladding layer 31 is a metal material, the β-bottom cladding layer 31 can be used as a conductive path of the electric clock to form a luminance metal layer 32 on the surface of the bottom cladding layer 31; Coating 3ι 2 organic two-molecule material, by physical vapor deposition (PVD), chemical deposition or chemical vapor deposition (CVD) such as sputtering, apocation, arc hot gas deposition (Arc vap〇 r )), ion beam splashing U〇nbeamsputtering), laser refining deposition... 槪ablation depositi〇n), electroless plating or plasma-promoting chemical vapor phase _ ^ product in a way to coat the layer 3 The surface of the crucible is deposited to form a luminance metal layer 32°. FIG. 3B, and then at least the isolation layer 33 is formed on the luminance metal layer %, and a plurality of channels 3% are formed in the isolation layer 33. Please refer to the f 3C diagram, and then form a core material in the channel 33a to completely fill the channel of the core material 34 in the isolation layer 33. Please refer to FIG. 3D for the isolation layer 33 and the core. Material 34 = face = luminance gold, 'top surface of the luminance metal layer 32, the core material 34. 18480 14 1270113 ^ Referring to Figure 3E, a top cladding layer 35 is formed on the luminance metal layer 32. Through the foregoing method, the present invention also discloses that the structure of the embedded optical conductive member includes a bottom cladding layer 31; the luminance metal layer is located on the top surface of the bottom cladding layer 31; and the isolation layer 33 has a plurality of a channel coffee, located on the luminance metal layer 32; a core material 34, located in the channel:; another - luminance metal layer 32, ' is located in the isolation layer 33 and =: make, metal layer 32, 32, located The bottom cladding layer 35' of the core material is located in the upper layer of the luminance metal layer 32, and the luminance metal|32, 32 is formed on the fiber and the top surface, so that the light is reflected up and down; and the ❹: The material 34 is directly formed in the channel 3 of the isolation layer 33 = to reduce the manufacturing cost; and the pass of the chemical layer 33, the φ,,, X ^ material 34 is directly formed in the isolation 曰ka, the sub-fiber The bottom surface and the top surface of the core material 34 are respectively formed with the luminance metal layers 32 and 32, and the π, the ^^/knife shape is lost. The optical signal is uploaded on the substrate. [Third Embodiment] " As shown in Figs. 4A and 4E, a further embodiment of the method for fabricating the substrate structure of the embedded optical transmission system of the a ^ t tooth and the horse invention, Each of the above-described embodiments is formed on the peripheral surface of the luminance metal layer. In the sound (four) 'providing a bottom coating layer and coating the bottom number w (4) sheet metal ^ separation layer 42 and forming a plurality of channels 42a of sweat in the isolation layer 42, and the bottom pomelo φ ^ - Layer 41 can be a metal or organic high score 18480 15 1270113 sub-material. As can be seen from Fig. 4B, if the bottom cladding layer 41 and the spacer layer 42 are made of a metal material, a luminance metal layer 43 is formed on both sides and the bottom surface of the via 42a by electroplating. On the other hand, if the underlying cladding layer 41 is an organic polymer material, physical vapor deposition (PVD), chemical deposition, or chemical vapor deposition (CVD) such as sputtering, evaporation, and arc vaporization are used. Arc vapor deposition, ion beam sputtering, laser ablati〇 deposition, electroless plating or plasma-induced chemical vapor deposition, etc. A bright metal layer 43 is formed on both sides and the bottom surface of the 42a to form a luminance metal layer 43. θ Referring to Figure 4C, a core material 44' is formed in the channel 42a to completely fill the channel "a" in the isolation layer 42. See Figure 4D for further isolation. The layer 42 and the surface of the core material form another luminance metal layer 43 such that the luminance metal layer 43 is located on both sides and the bottom surface and the top surface of the core material 44 to completely surround the core material 43 by the luminance metal layer 43. Referring to FIG. 4E, and finally to the luminance metal layer 43, the upper cladding layer 45. Through the method of describing the invention, the present invention discloses an embedded optical transmission component, including: The cladding layer 42 has a plurality of layers; the spacer layer 4 is disposed on the bottom cladding layer 41; the luminance metal layer 43 is located on both sides and the bottom surface of the 4 layer 42; the core material 44 is located in the channel The other luminance metal layer 43 is located on the isolation layer 42 and the core material 18880 16 1270113, 4 3 is located on the peripheral surface of the weaving core material 44; and the top surface of the increased luminance metal layer 43, the metal layer 43' Removing the top surface of the inactive portion, so that the luminance metal layer 43 and the top slope are increased by 4 5 ' It is another implementation of the luminance. - Referring to FIG. 5A, a resistive layer 46 is formed on the isolation layer 42 and the luminance metal layer 43' on the top surface of the core material 44. Please refer to FIG. 5B. The resist layer 46 is patterned by the process to retain the phosphor metal layer on the top surface of the core material 44. • Refer to Figure 5C to remove the luminance metal layer covered by the non-resistive layer 46. Please refer to Figure 5D. The resist layer 46 is removed, and a top cladding layer 45 is formed on the luminance metal layer 43' and the isolation layer 42. The luminance metal layers 43 and 43 are formed on the bottom surface and the top surface of the core material. On both sides, the light is reflected and transmitted around the surface, and a better reflective surface is provided to provide light transmission. The channel of the isolation layer 42, and the core material 44, and the optical material 44 can reach the optical signal at 10 and the core material 44 is directly formed in the 42a, which can simplify the process and reduce the manufacturing cost. The purpose of transmitting the luminance metal layers 43 and 43 on the peripheral surface of the channel "a" of the isolation layer 42 is the purpose of transmission on the substrate. The above embodiments are merely illustrative of the principle and function of the present invention, and are used to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without the spirit of In & In & τ. The scope of protection of the rights of the month shall be as listed in the patent application scope mentioned later. 18480 17 1270113 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of U.S. Patent Publication No. 6,839,476
第2A圖至第2E圖係為本發明之嵌埋光學傳導件之基 板結構及其製法的第一實施例剖面示意圖； 第3A圖至第3E圖係為本發明之嵌埋光學傳導件之基 板結構及其製法的第二實施例剖面示意圖； 第4A圖至第4E圖係為本發明之嵌埋光學傳導件之基 鲁板結構及其製法的第三實施例剖面示意圖；以及 第5A圖至第5D圖係為本發明之嵌埋光學傳導件之基 板結構及其製法的第三實施例的另一實施例剖面示意圖。 【主要元件符號說明】 11 底層 12 芯層 12a 溝槽 13a 纖核 14、 頂層 21、31、41底披覆層 22a、33a、42a 通道 13 光纖 13b 纖殼 25、35、45頂彼覆層 22、 33、42隔離層 23、 32、32’、43、43’ 輝度金屬層 24、34、44纖核材料 24a 折射面 46 阻層 18 184802A to 2E are cross-sectional views showing a first embodiment of a substrate structure of an embedded optical waveguide of the present invention and a method for fabricating the same; FIGS. 3A to 3E are diagrams showing a substrate for embedding an optical waveguide of the present invention; FIG. 4A to FIG. 4E are cross-sectional views showing a third embodiment of the base plate structure of the embedded optical waveguide of the present invention and a method of manufacturing the same; and FIG. 5A to Fig. 5D is a schematic cross-sectional view showing another embodiment of the substrate structure of the embedded optical waveguide of the present invention and a third embodiment thereof. [Main component symbol description] 11 bottom layer 12 core layer 12a trench 13a core 14, top layer 21, 31, 41 bottom cladding layer 22a, 33a, 42a channel 13 fiber 13b fiber shell 25, 35, 45 top cladding layer 22 , 33, 42 isolation layer 23, 32, 32', 43, 43' luminance metal layer 24, 34, 44 core material 24a refractive surface 46 resist layer 18 18480