1292495 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種光傳輸結構及其埋 構，該光傳輸結構係由漭I筮土席、音 败<、、、。 i於，笛幻• 先傳導材料編織成-體， :於==傳導材料表面包覆有第二光傳導材料所構 線路增層結構，以構成具有光傳輸結構之 【先前技術】 〜二著電子產業的蓬勃發展，電子產品亦逐漸邁入多功 月'、南性能的研發方向。為滿足半導體封裝件高積集度 tegration )以及微型化（驗㈣士此⑽）的封裝 提供多數主、被動元件及線路載接之電路板（Circui/ 以叫亦逐漸由單層板演變成多層板（Multi七yer Board) 〇 再者，半導體技術之發展日新月卩，除以往講求外形 ft輕薄短小之封裝外，並且對於資料的儲存容量也逐 ::楗幵：除此之夕卜，由於資料的處理量愈來愈a，以相同 貧料在單位時間内能最快的速度處理完成，則能展現更高 勺處理放率。而提高半導體處理速度最直接的方法即提高 使^頻率，但在資料傳輸達到Gb/s以上時，則面臨高功率 之j熱、訊號時間延遲、電磁干擾（EMI)等瓶頸，對於更高 月匕之半V體的製作則愈加困難。尤其傳統以來一直以銅 線=作為貢料訊號傳送之媒介的方式，則受材料本身先天 之&電彳寸性的限制，其所能達到的導電性能有限，因此訊 19513 5 1292495 .號傳送的速度難以藉由提高導電性的方式提昇。 • 再者’以金屬線材傳送訊號的結構，在傳於迠"一 易受外界雜訊的干擾或内部線路 2傳輪，中谷 傳送過程令因干擾及干、井 、 、"使知讯號在 此訊號傳送的結構必須m〜广“㈣^兄’因 +井㈣^ 相當的防護措施，以防干擾或 干V對傳輪讯號產生影響， 而此種防尤/、在同頻傳迗中更為明顯。 Μ 電路設計則造成相當程度的困難产及 額外的結構設計，故難以突破現有的狀況。度及 又傳統訊號傳送的方式細電流 訊號傳送，而在夂帝攸由如 ’販W #比式 位式處理0 號處理的方式現在多為數 的情況。纟—過程中經過轉換則容易造成失真 ^訊號傳輸結構的缺失，新技術係採用光 心雷傳輸方式’最明顯的效果係光訊號幾乎不 擾，因此訊號傳送品質較佳，以降低訊號傳 槿Γ 情況’並且可減少設計防電磁波干擾的結 構。故以光作為訊號傳送的方式已成為未來發展的方向。 如弟1圖所示之美國專利公告第6,839,476號即為一 種以光作為訊號傳送之電路板，係於-底層U上形成有一 芯層12,於該芯層12上形成有複數個溝槽I2a，而在該溝 才曰12a中置入一光纖13(〇ptical fib⑺，再於該芯層上 面形成一頂層14，俾以將光纖13埋在芯層12之中，其中 之光纖13係於一纖核na(core)外包覆纖殼 13b(cladding)。而可在光纖i 3的兩端裂設光發射、接收模 19513 1292495 ==動:件及連接器等’藉由光纖13傳送光訊號，以 兄沛电汛號傳送之缺失。 然而該光纖13係埋置在芯層12的溝样 必須先經過開槽製程，然後再將;置二 二有而::纖13置於溝槽叫 速生產的目⑻製造速度緩慢，而無法達到快 中，光纖13佔妙又’由於光纖13係、置於尺寸較大溝槽12a 積辦大…的空間較大，致使最終形成的封褒結構體 预〜大而不易於微型化。 再者’該域13必驗相對應㈣槽⑸長度先進 丁^ ’然後再將t纖13置於溝槽12a中，使其在製程中1292495 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to an optical transmission structure and a buried structure thereof, which are composed of 漭I筮土席,音败<,,,. i, 笛幻 • The first conductive material is woven into a body, : the surface of the conductive material is coated with a second light-conducting material to form a layer-enhancing structure to form an optical transmission structure. [Prior Art] With the rapid development of the electronics industry, electronic products have gradually entered the development direction of multi-function month and south performance. In order to meet the high integration degree of semiconductor package and miniaturization (test (4) Shi (10)), most of the main and passive components and circuit-loaded circuit boards are provided (Circui/ is gradually evolved from single-layer board to multi-layer Board (Multi Seven yer Board) 〇 Again, the development of semiconductor technology, the new moon, in addition to the previous ft light and short package, and the storage capacity of the data is also: Since the processing capacity of the data is more and more a, and the same poor material can be processed at the fastest speed per unit time, it can display a higher scoop processing rate. The most direct way to improve the semiconductor processing speed is to increase the frequency. However, when the data transmission reaches Gb/s or higher, it faces high-power j-heat, signal time delay, electromagnetic interference (EMI) and other bottlenecks, which makes it more difficult for the production of the half-V body of the higher moon. Especially since the tradition The way of using copper wire = as the medium for the transmission of tributary signals is limited by the congenital and electrical conductivity of the material itself, and the conductivity that can be achieved is limited. Therefore, it is 19513 5 1292495 . The speed of sending is difficult to improve by improving the conductivity. • In addition, the structure of the signal transmitted by the metal wire is transmitted in the 迠" an external noise interference or the internal line 2 transmission, the transfer process of the Zhonggu transmission Due to interference and dry, well, " the structure of the signal transmitted by this signal must be m~ wide "(4) ^ brother 'cause + well (four) ^ equivalent protective measures to prevent interference or dry V to the transmission signal It has an impact, and this kind of defense is more obvious in the same frequency transmission. 电路 The circuit design causes considerable difficulty in production and additional structural design, so it is difficult to break through the existing situation. Fine current signal transmission, and in the case of the 夂 攸 攸 如 ' ' ' 贩 # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # # 过程 过程The technology department uses the optical heart lightning transmission method. The most obvious effect is that the optical signal is almost undisturbed, so the signal transmission quality is better to reduce the signal transmission situation' and the design can be designed to prevent electromagnetic interference. Therefore, the use of light as a means of signal transmission has become the direction of future development. As shown in US Pat. No. 6,839,476, which is shown in Figure 1, is a circuit board that transmits light as a signal, and is formed on the bottom layer U. The core layer 12 is formed with a plurality of trenches I2a on the core layer 12, and an optical fiber 13 (〇ptical fib (7) is placed in the trench 12a, and a top layer 14 is formed on the core layer. The optical fiber 13 is buried in the core layer 12, wherein the optical fiber 13 is wrapped around a fiber core na (core) and covered with a fiber casing 13b. The light emitting and receiving modes 19513 can be cracked at both ends of the optical fiber i3. 1292495 ==Motion: Parts and connectors, etc. 'The optical signal is transmitted by the optical fiber 13 and the transmission is lost by the singer. However, the groove 13 of the optical fiber 13 embedded in the core layer 12 must first pass through the grooving process, and then the second and second: and the fiber 13 is placed in the groove for rapid production (8). The manufacturing speed is slow, and cannot be In the fast-paced, the optical fiber 13 is superior, and the space of the optical fiber 13 system and the large-sized groove 12a is large, so that the finally formed sealing structure is large and not easy to be miniaturized. Furthermore, the field 13 must correspond to the corresponding (4) slot (5) length advanced D' and then the t-fiber 13 is placed in the trench 12a, so that it is in the process
又多一道加工製程，因而增加製作的困難度；且光纖U 的長度不-’故增加製程分類的複雜度， 增加，且複雜度提高。 體的衣权 而在芯層12上形成溝槽12a再置入光纖13，於尺寸 叹计上因溝槽12a與溝槽12a之間必須保持相當的間隔， 1可將光纖13定位在芯層12中，而間隔大小即影響佈線 山度，並且佈線密度受到光纖13線徑大小的影響，因此無 法達到高密度佈線之目白勺，相應的使得最終形成的封裝結 構之頻道數量受到限制。 。 此外，該用以傳導光訊號的光纖13係於_纖核 外包覆纖殼13b，而可藉由包覆在纖核13a外面的纖殼 内層作為反射面，使光訊號藉由纖殼i 3b内層不斷向前反 19513 7 1292495 .2以達傳达訊號的目的。而該光纖13與電路板 _、、度且整合兩種不同製程的產品即增加困難 度0 、 因此’如何提供—種種符合電子褒置輕薄短小、 減小訊號傳遞損失、縮短導電路徑、減少雜訊等問題1 及提升，電訊號傳輸品質、簡化製程、降低製程難度 升佈，密度、及提升量產性之光電路板嵌埋光電元件結 構，只為目剷業界亟欲解決的課題。 【發明内容】 鐾於習知技術的缺失，本發明之主要目的’係在提供 一種光傳輸結構及其埋入基板之結構，得詈 輕薄短小需求。 了。电于衣置 本發明之另—目的，係在提供—種光傳輸結構及其埋 入基板之結構，得以簡化製程、降低製程難度及提升量產 性。 U之X目的’係在提供—種光傳輸結構及其埋 入基板之結構，得以提升佈線密度。 本U之X目的，係在提供—種光傳輸結構及其埋 入基板之結構，該光傳輸結構係為預浸材，俾以增加該基 板之支撐強度，且該光傳輸結構係可為基板增層或核 之基材。 曰 本發明之又-目的，係在提供_種光傳輸結構及其埋 入基板之結構’传以縮短訊號傳輸路徑以降低訊號傳遞損 8 19513 1292495 失，亚減少雜訊及提升光電訊號傳輸品質。 /為達上述及其他目的，本發明提出—種光傳 係^括：複數第-光傳導材料，係經由編織而成—體。；以 及弟一光傳導材料，係包覆該第一 -^ U (V 1寻冷材枓表面以構成 預/又材（prepreg)，該第一光傳導材料可 增加該光傳輸結構之支撐強度。 、〜、’可 材料供—種光傳輸結構，係包括複數非光傳導 以及第-光傳導材料，係經編織而成一編織體； 導= ，係包覆該第—光料材料及非光傳 冷材料所編織成之編織體表面 光傳輸結構。 ㈣預4(prepreg)之 該第構復可包括有一線路增層結構，係形成於 數電性連2料表面，且該線路增層結構表面形成有複 ，錢該糾輸結構及線路增層結構中形成 百至V —電鍍導通孔（PTH)哎導帝亡 係包括有介電增層結構 介電声中之二： 上之線路層以及形成於 可於該線路增層結構表面形成有 、/于€ ’且雜焊層中形成有複數個開孔，俾以顯露線 路增層結構之電性連接墊。 、 M 5亥弟一光傳導材料係例如為光纖或有機光傳導材 ::又該第二光傳導材料係為有機樹脂材料，且該第一光 傳導材料之折射率係大於該第二光料材料之折射率。 本發明復提供-種光傳輸結構埋入基板之結構，係包 括.一基板，該基板形成有至少—開^，·以及至少一光傳 19513 9 1292495 •輸結構’係容置於該開Π中，該光傳輸結構係由複 •光傳導材料編織成-編織體，且於該編織體表 二光傳導材料。 G设有乐 本發明之ϋ光傳—里人基板之結構，係包 括.-基板，該基板形成有至少一開口；以及至少 =’係置於該開口中，該光傳輸結構係由複數非光】 及至少一第一光傳導材料經編織而成-編織體，且 、"玄編織體表面包覆有第二光傳導材料。 該光傳輸結構^基板之結難㈣ ::料表面及該基板表面形成有線路增層結構：二 增層結構表面形成有複數電性連接墊，並於=路 增層結構中形成有至少-電鑛導通孔（PTH)、或導^亡及孔泉路 孔，俾以顯露線路增層結構之電性連接塾。 I之靖^ 構係包括有介電層、疊置於該介1上 I之線路層以及形成於介帝 、邊；I包層上 構係利用線路增層，程；;一：電結構；該線路增層結 上，俾以構成— = Γ 成於該光傳輸結構 ，、有先傳輪結構之電路板。 本《W之料輸結構及^入基;& 二訊號用之第-先傳導材料，經編織二之二==專輸 再形成有第二光傳導材科，《由”二於其表面 :❹一光傳導材料外表面以構成 光=全包 構成具有光傳輪結構之電路板;或者… ， 肝。亥先傳輪結構嵌埋 19513 10 1292495 板中，再於該基板及光傳輸結構表面形成有線路增 相㈣f知技術’本發明係於電路板内部 傳輪結構而無須額外形成容置該第一光傳導材料之溝二 2而可簡化製程’俾可降低製程難度 ： 線之密声、拇A旦* t, 风7T、深路佈 【實施㈤ 符合電子裝置微型化之發展趨勢。 =下係糟由特定的具體實施例說明 =热悉此技藝之人士可由本說明書所 二方 瞭解本發明之其他優點與功效。 〜“地 [第一實施例] 請麥閱第2A至2D圖，係為本發明 面示意圖。 几1寻掏結構之剖 如第2A圖所示，提供複數 -光傳導材料21係 九傳—材枓21;該第 一，且該第-光傳或父互編織以成為-編織 並不以此為ΡΡ，〜^為光纖或有機光傳導材料，但 -收、、义，而付依需要排列佈設，·或如第 不，將至少一筮—止扁宿L L , · 禾〜A圖所 21，以平行編織 21以及複數非光傳導材料 料2!，係為纖維強化材料。纟、4織體’且該非光傳導材 如第2B圖所示，於該第一 編織體表面形成m ¥#料21所編織成之 ,p 战弟一先傳導材料22以構成—預、、*& 仍啊g)之光傳輸結構2;或如2 霉成預4 一光傳導;^•祖0 ! . 圖所不’係將至少—笫 寻V材科21及複數非 ^ 子V材科21以平行編織或 19513 11 1292495 交互編織以成一編織體，再將該編織體 料22中，使該第二光傳導材料。 弟一先傳導材 一預浸材（Prepreg);前述該第二光傳^’以構成 =脂材料，該編織體係預浸於該第二光傳導材料=為有機 經預烘烤而未完全聚合以形成一 、" ，亚 ㈣之折射率係大於該第二二’:二：導 俾使光訊號得以在第-光傳導材料21中折射斤射率， ，參閱第2C圖，復可於該第二料 、 形成線路增層結構23 ,該線 之表面 β 曰⑭ 曰層結構23係包括有介電 曰31、畳置於該介電層231上之線路層 介電層23i中之導電結構233,且兮 2 =及形成於 形成有複數電性連接墊234;復；‘一構23表面 形成-防焊層24,且該防焊層復2::;=層結構23上 傀以曰s干μ a 中形成稷數個開孔240， 線路增層結構之電性連接塾234;且該線 ^ 23係利用線路增層製程或壓 >傳導材料22之表面。有關於哕綠&+、，a/欣於°亥弟一先 惟乃業界所周知之製程 予贅述。 一卩本案技術特徵，故未再 如弟2D圖所示，於該弁值仏 23中可來占心、.· 九傳輪、，構2及線路增層結構 甲了形成電鍍導通孔（PTH)25或導 以電性連㈣騎輸結構 (H)’俾 該線路增心槿2^^^有減電性連接墊234，復於 24切成表面形成有—防焊層24,又該防焊層 成有祕術耗綱，細顯料路增層結構之電 19513 12 1292495 性連接墊234。 本發明復提供—種光傳輪結構2 傳導材料21 ’係經由編織而成-體;以及第二 22,係包覆該第一光傳導 先傳V材料 2。 ¥叫21表㈣構成^傳輸結構 本發明另提供一種光傳輪 導材料織至少-第—光專傳輪導包括複數非光傳 編織體；以及第二光傳導上卿21，係經編織而成- >料2 i及非光傳導材料2編=係包覆該第—光傳導材 ~編織成之編織體表面以構成一 預汉材（Prepreg)之光傳輸結構：，該第一光 ， 供傳輸訊號，並可增加該光傳輸結構2之支撐強度。 再者’於該第二光傳導材料22之表面復可形成 ?:層:结：23,該線路增層結㈣係包括有介電層二 宜置方。亥介電層231上之線路層扣以及形成於介電層 231中之導電結構233，且該線路增層結構Μ ^ ,複數電性連接墊234，另於該線路增層結㈣上復可 一防知層24,又該防焊層24中具有複數個開孔跡俾以 顯露線路增層結構23之電性連接墊234,並構成一且有光 傳輸結構之電路板；利用本發明中之光傳輸結構2進 訊號傳輸時’可藉由包覆於該第—光傳導材料21表面之第 二光傳導材料22内側作爲反射面，使光訊號藉由該第一光 傳導材料21内層不斷向前反射以達到傳送訊號之目的；其 中，該光傳輸結構2係可依製程需要而為電路板之任一層 板材，如基板增層或核心層之基材，其實施不以本實施; 19513 13 1292495 為限。 [第一實施例] 結構圖’係為本發明之具光傳輪之基板 同處在例之剖面示意圖’與前-實施例不 ^ ^光傳輸、、、口構係形成於一基板之開口中。 二閱第3 Α圖，提供一基板3，且該美才 一開口 30，兮甘丄 且扳3具有至少 電路板。基板3料—絕緣m板、兩層或多層 月ΐ閱第3B圖，於該基板3開 輸結構2,而土 川中接置一光傳 平行編織或 龍結構2係由複㈣—光料材料 有第-純以編織以成—編織體，且於該編織表面包覆 有弟一先傳導材料22;或 匕復 2,係由複數非光傳導材料2=圖所不，该光傳輸結構 平行編心 及至少一第-光傳導材料2! 覆有第二光傳導材料22 “…於顧織體表面包 Φ導材：圖’接著於該基板3兩表面之第二光傳 V材枓22上形成線路增 包括有介雷厗θ 稱d 。亥線路增層結構23係 ⑽有"电層231、疊置於該介電層2 以及形成於介電層231中之 =線路層232 及線路增層° ，並於该基板3 w岡/一構23中可形成電錢導通孔（ΡΤΗ)25或導“ 孔（圖未不），俾以電性 '次―电目 23，且嗲綠枚，a 基板3兩面之線路增層結構 4，且:，層結構23表面形成有複數電性連接塾 該防_中形成有複二表:二成有，防焊層24’又 複數個開孔240,俾以顯露線路增層 19513 14 1292495 結構之電性連接墊234。 本=设揭τ—種具光傳輸之基板結構 =3’該基板3形成有至少-開口 30;以及至少，基 、、、：2’係置於該開口 3〇中，該光傳 =輸 :广#導材料21平行編織或交互編織以成一編^ 该編織體表面包覆有第二光傳導材料22。扁為體，且於 本發明另揭卜種具光傳輸之基板結構， •=該基板3形成有至少，3〇;以及至少一A further processing process increases the difficulty of fabrication; and the length of the fiber U does not increase the complexity, complexity, and complexity of the process classification. The groove 12a is formed on the core layer 12 and then placed in the optical fiber 13. The size must be kept at a considerable interval between the groove 12a and the groove 12a. 1 The fiber 13 can be positioned in the core layer. In 12, the interval size affects the wiring mountainity, and the wiring density is affected by the size of the fiber 13 wire diameter, so that the purpose of high-density wiring cannot be achieved, and accordingly, the number of channels of the finally formed package structure is limited. . In addition, the optical fiber 13 for conducting the optical signal is attached to the outer casing 13b of the nucleus, and the inner layer of the outer casing of the outer core of the core 13a can be used as a reflecting surface to make the optical signal pass through the outer casing. The inner layer of 3b continues to move forward to 19513 7 1292495 .2 in order to convey the purpose of the signal. The optical fiber 13 and the circuit board _, the degree and integration of two different processes of the product increase the difficulty of 0, so 'how to provide - all kinds of electronic devices are light and thin, reduce signal transmission loss, shorten the conductive path, reduce miscellaneous Issues 1 and upgrades, the transmission quality of the telecommunication signal, the simplification of the process, the difficulty of the process, the density, and the mass-produced optical circuit board embedding the optoelectronic component structure are only the problems that the industry wants to solve. SUMMARY OF THE INVENTION In view of the deficiencies of the prior art, the main object of the present invention is to provide an optical transmission structure and a structure for embedding the substrate, which is required for lightness, thinness, and shortness. It is. Electrical Installation The other object of the present invention is to provide an optical transmission structure and a structure for embedding the substrate, which simplifies the process, reduces the difficulty of the process, and improves mass productivity. The U-purpose of U is to provide a structure for the optical transmission structure and its buried substrate, thereby improving the wiring density. The purpose of this U is to provide an optical transmission structure and a structure embedded in the substrate, the optical transmission structure is a prepreg, to increase the support strength of the substrate, and the optical transmission structure can be a substrate A substrate that is layered or cored. The purpose of the present invention is to provide a light transmission structure and a structure for embedding the substrate to reduce the signal transmission path to reduce the loss of signal transmission loss, to reduce noise and improve the quality of the optical signal transmission. . In order to achieve the above and other objects, the present invention proposes a light transmission system comprising: a plurality of first-light-conducting materials which are woven into a body. And a light-conducting material coating the first surface of the V 1 cold-storing material to form a prepreg, the first light-conducting material increasing the support strength of the light-transmitting structure , ~, 'material supply-type light transmission structure, including a plurality of non-optical conduction and first-light-conducting materials, are woven into a braid; guide =, the coating of the first-light material and non-light The light transmission structure of the surface of the braid woven by the cooling material. (4) The pre-form of the prepreg may include a line build-up structure formed on the surface of the electrical connection material, and the surface of the line build-up structure Forming a complex, money-forming structure and line-forming structure to form a hundred to V-plated vias (PTH) 哎 帝 帝 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 : : : : : : : : Forming on the surface of the line build-up structure, and forming a plurality of openings in the solder layer, and exposing the electrical connection pads of the line build-up structure. The material is, for example, an optical fiber or an organic optical conductive material: The light-conducting material is an organic resin material, and the refractive index of the first light-conducting material is greater than the refractive index of the second light-material material. The present invention provides a structure in which the light-transmitting structure is embedded in the substrate, including a substrate formed with at least one opening, and at least one light transmission 19513 9 1292495. The transmission structure is housed in the opening, and the optical transmission structure is woven into a braid by a complex light-conducting material. And the structure of the light-transmitting material of the braided body. The structure of the light-transmitting substrate of the present invention includes a substrate, the substrate is formed with at least one opening; and at least = ' is placed in the In the opening, the optical transmission structure is woven from a plurality of non-lights and at least one first light-conducting material, and the surface of the black fabric is coated with a second light-conducting material. ^The junction of the substrate is difficult (4): The surface of the material and the surface of the substrate are formed with a line-adding structure: a plurality of electrical connection pads are formed on the surface of the second build-up structure, and at least - an electric conductive via hole is formed in the surface-added structure. (PTH), or lead and hole The road hole, the 俾 is used to reveal the electrical connection of the line-adding structure. The jing system of I includes a dielectric layer, a circuit layer stacked on the dielectric layer I, and formed in the emperor and the side; The upper structure uses the line to add layers, the process; one: the electrical structure; the line is added to the junction, the 俾 is formed - = Γ is formed in the optical transmission structure, and the circuit board has the first transmission structure. Material transmission structure and ^ base; & second signal used for the first - first conductive material, after weaving two of two == special transmission and then formed a second optical conduction material, "by" two on its surface: ❹一光The outer surface of the conductive material is configured to constitute a circuit board having a light-transmitting structure; or, the liver is embedded in a plate of 19513 10 1292495, and a circuit is formed on the surface of the substrate and the optical transmission structure. Phase-enhancing (four) f-knowledge technology' The invention is based on the inner wheel structure of the circuit board without additionally forming a groove 2 for accommodating the first light-conducting material, which simplifies the process '俾 can reduce the difficulty of the process: the dense sound of the line, the thumb A Dan*t, wind 7T, deep road cloth [implementation (5) is in line with the development trend of miniaturization of electronic devices. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; ~ "[First Embodiment] Please refer to Figures 2A to 2D for a schematic view of the present invention. A section of the search structure of several 1 is shown in Fig. 2A, and a plurality of -optical conductive materials are provided. Material 21; the first, and the first-light transmission or the parent inter-weaving to become - weaving is not a sputum, ~ ^ is an optical fiber or organic light-conducting material, but - receiving, meaning, and paying according to needs Arrangement, or, if not, at least one 筮 止 宿 LL, · 禾 ~ A Figure 21, parallel weave 21 and a plurality of non-optical conductive material 2!, is a fiber reinforced material. 纟, 4 The woven body' and the non-optical conductive material are woven by forming m ¥# material 21 on the surface of the first braided body as shown in FIG. 2B, and the squadron first conducts the material 22 to form a pre-, *& Still g) the light transmission structure 2; or such as 2 mold into the pre-four light transmission; ^ • ancestors 0 !. Figure does not 'system will at least - look for V material section 21 and plural non-^ V material section 21 Interwoven with parallel weave or 19513 11 1292495 to form a braid, and then the braided material 22 to make the second light-conducting material. Brother first conductive material-prepreg The second light transmission is configured to constitute a fat material, and the woven system is pre-impregnated with the second light-conducting material=the organic pre-bake is not completely polymerized to form a refraction of the sub-(four) The rate is greater than the second two: two: the guide light causes the optical signal to be refracted in the first light-conducting material 21, see FIG. 2C, and the second material is formed to form the line build-up structure 23 The surface β 曰 14 曰 layer structure 23 of the line includes a conductive structure 233 having a dielectric 曰 31 and a dielectric layer 23i disposed on the dielectric layer 231, and 兮 2 = and formed in the formation There are a plurality of electrical connection pads 234; complex; 'a structure 23 surface forming - solder resist layer 24, and the solder resist layer 2::; = layer structure 23 on the layer 曰 s dry μ a formed a number of open The hole 240, the electrical connection structure 234 of the line build-up structure; and the line 23 is formed by a line build-up process or a pressure> surface of the conductive material 22. Regarding the green color & +,, a / Xin in ° Hai The younger brother is the industry's well-known process for the description. A look at the technical characteristics of this case, so it is not as shown in the 2D picture of the brother, in the depreciation 仏23 can come to the heart, .. The transfer wheel, the structure 2 and the line build-up structure A form a plated through hole (PTH) 25 or lead to an electrical connection (4) a ride structure (H) '俾 The line is increased 槿 2^^^ has a power reduction connection The pad 234 is formed on the surface of the cut-off 24 to form a solder resist layer 24, and the solder resist layer is formed into a mystery-consuming structure, and the electric connection pad 234 of the material layer build-up structure is 19513 12 292495. A light-transmitting wheel structure 2 a conductive material 21' is woven into a body; and a second 22 is coated with the first light-conducting V material 2. The invention further provides a light-transmitting wheel guide material woven at least - the first light-transmitting wheel guide comprises a plurality of non-light-transmitting braids; and the second light-conducting upper layer 21 is woven造- >Material 2 i and non-optical conductive material 2 编 = coating the surface of the first-light-conducting material-woven fabric to form a prepreg optical transmission structure: the first light , for transmitting signals, and increasing the support strength of the optical transmission structure 2. Further, the surface of the second light-conducting material 22 is formed by a layer: a junction: 23, and the wiring layer-forming junction (4) includes a dielectric layer. a circuit layer buckle on the dielectric layer 231 and a conductive structure 233 formed in the dielectric layer 231, and the circuit build-up structure Μ ^, the plurality of electrical connection pads 234, and the line build-up junction (four) a protection layer 24, the solder resist layer 24 has a plurality of open traces to expose the electrical connection pads 234 of the line build-up structure 23, and constitutes a circuit board having an optical transmission structure; The light transmission structure 2 can transmit the signal inside the second light-conducting material 22 coated on the surface of the first light-conducting material 21 as a reflecting surface, so that the optical signal is continuously passed through the inner layer of the first light-conducting material 21. Reflecting forward to achieve the purpose of transmitting signals; wherein the optical transmission structure 2 can be any layer of the board, such as the substrate of the substrate build-up or core layer, which is not required by the present embodiment; 19513 13 1292495 is limited. [First Embodiment] A structural diagram is a schematic cross-sectional view of a substrate having a light-transmitting wheel in the present invention, and a front view of an embodiment in which an optical transmission, and a mouth structure are formed in a substrate. in. Referring to Figure 3, a substrate 3 is provided, and the opening is 30, and the panel 3 has at least a circuit board. The substrate 3 material-insulating m plate, two or more layers are seen in Figure 3B, and the structure 2 is opened on the substrate 3, and the light transmission parallel knitting or the dragon structure 2 is connected to the Tuchuan. The composite (four)-light material is used. There is a first-pure weaving to form a braid, and the braided surface is coated with a first conductive material 22; or a complex 2, which is composed of a plurality of non-photoconductive materials 2 = the optical transmission structure is parallel The core and at least one of the first-light-conducting material 2! is covered with the second light-conducting material 22 "...the surface of the woven body is covered by the Φ-guide material: the figure is followed by the second light-transmitting V-material 22 on both surfaces of the substrate 3. The upper line formation includes a dielectric θ θ d. The HV line enhancement structure 23 is provided with an electric layer 231, a dielectric layer 2 stacked thereon, and a circuit layer 232 formed in the dielectric layer 231 and The circuit is layered by °, and in the substrate 3 w / a structure 23 can form a money money via (ΡΤΗ) 25 or a "hole" (not shown), 俾 electrically - times - electricity 23, and 嗲The green layer, the augmented structure 4 of the two sides of the substrate 3, and: the surface structure 23 is formed with a plurality of electrical connections on the surface of the layer 23, and the second table is formed in the anti-_: two, anti-welding 24 'and a plurality of openings 240 serve to reveal up trace 19513141292495 structure of electrically connecting pads 234. The substrate structure of the optical transmission is 3', the substrate 3 is formed with at least an opening 30; and at least, the base, the: 2' is placed in the opening 3, the light transmission = loss The conductive material 21 is woven in a parallel or interwoven manner to form a braid. The surface of the braid is coated with a second light-conducting material 22. Flat body, and in addition to the present invention, a substrate structure having optical transmission, •= the substrate 3 is formed with at least 3 〇; and at least one
St置於該WO中，該光傳輸結構2係由複3 先傳導材料至少—第―光傳導材料 互編織以成一編舛麯 η从# 丁仃、、届織或父 導材料22 4體"於錢織體表*包覆有第二先傳 又於該基板3表面及第二光傳導材料22表面形 層結構23，該線路增層結構23係包括有介電層 層23^ί於2電層231上之線路層232以及形成於介電 ^之導電結構2 3 3，且該線路增層結構2 3表面 ==電性連接墊234;另於該基板3及線路增層結構以 令形成有電鑛導通孔（ΡΤΗ)25或導電盲孔（未圖示），俾以 電性連接位於基板3兩表面上之線路增層結構沈又於鲸 線路增層結構23表面復可形成有—防焊層24，又該防谭/ 層24中形成有複數㈣孔跡俾㈣料路增層結構之 電性連接墊234，並構成-具有光傳輸結構之電路板；並 中，該光傳輸結構2係嵌埋於該基板3中，該光傳輸結構 2及該基板3係可依製程需要而為該電路板之任一層板 19513 15 1292495 材如基板增層或核心層之莫从、， 因+ 基材，亚不以本實施例為限。 因此，本發明之光傳輪結構及其埋入 為傳輸光訊號用之第—光傳導八 土 、、、口構，係 .+ 九傳導材料，經編織而成―俨，^ 其表面再形成有第二光傳導^ 取體，於 几1寻¥材枓，以由該第二# 完全包覆該第一光傳導材料外I 、V材料 ;;構，:f復可於該第二光傳導材料上形成有線路增 構，以構成具有光傳輸結構之電路板；或者 :二、、，。 r線路增層結構。再"亥基板及光傳輸結構表面形成有 而本發明係於電路板内部直接佈設光傳輸結構， 而無須如習知技術額外形成容 M .. , φ, 弟先傳導材料之溝 氕，仉而可間化製程，俾可降 路佈線之穷产、接斗”“ 冋時可提升線 趨勢。 才〇冤千衣置镟型化之發展 ★上述實施例僅為例示性說明本發明之原理及其功 > 而非用於限制本發明。任何熟f此項技藝之人士均可 背本發明之精神及範脅下，對上述實施例進行修饰 =交化°因此，本發明之權利保護範圍，應如後述 專利範圍所列。 τ 【圖式簡單說明】 第1圖係為美國專利公告第6,839,476號之剖面示意 圖； 社第fA至2D圖係為本發明光傳輸結構及其埋入基板之 、、、°構之第一實施例之剖面示意圖； 19513 16 1292495 第2A，及2B，圖係為本發明光傳輪結構及其埋入基板 =結構之第-光傳導材料及複數非光傳導材料編 織體之剖面示意圖； 第3 A至3 C圖係為本發明|也爲 ^ 5具先傳輪之基板結構及其製 /之弟一貫施例之剖面示意圖·，以及 #一乐3B®1係為本發明具光傳輪之基板結構及其製法之 =光傳導材料及複數非光傳導材料編織成—編織體之剖St is placed in the WO, the light transmission structure 2 is made of a complex 3 first conductive material, at least - the first light-conducting material is interwoven to form a braided η from the #丁仃, 织, or parent material 22 4 body " The surface of the substrate is coated with a second first pass and a surface layer structure 23 on the surface of the substrate 3 and the second light-conducting material 22. The line build-up structure 23 includes a dielectric layer 23 a circuit layer 232 on the electrical layer 231 and a conductive structure 23 3 formed on the dielectric layer, and the surface of the circuit build-up structure 23 == electrical connection pad 234; and the substrate 3 and the line build-up structure The electric ore conducting hole (ΡΤΗ) 25 or the conductive blind hole (not shown) is formed, and the line-increasing structure on the two surfaces of the substrate 3 is electrically connected to the surface of the whale line-adding structure 23. a solder resist layer 24, and an anti-tank/layer 24 is formed with a plurality of (four) aperture traces (four) material path build-up structure electrical connection pads 234, and constitutes a circuit board having an optical transmission structure; The optical transmission structure 2 is embedded in the substrate 3, and the optical transmission structure 2 and the substrate 3 can be any one of the circuit boards according to process requirements. Laminates 19513 15 1292495 Materials such as substrate build-up or core layer, due to + substrate, are not limited to this embodiment. Therefore, the structure of the optical transmission wheel of the present invention and the burial is the first light-conducting eight earth, the mouth structure, the .+ nine-conducting material for the transmission of the optical signal, which is woven into a 俨, ^ surface thereof Having a second light-conducting body, the material of the first light-conducting material is completely covered by the second material, and the second light is completely covered by the second light-conducting material; A line is formed on the conductive material to form a circuit board having an optical transmission structure; or: two, ,,. r line buildup structure. Further, the surface of the substrate and the optical transmission structure are formed, and the present invention directly aligns the optical transmission structure inside the circuit board, without the need to additionally form a capacitance as in the prior art. φ, the first groove of the conductive material, 仉And the process can be inter-processed, and the low-yield and pick-up of the down-route wiring can increase the trend of the line. The development of the present invention is merely illustrative of the principles and functions of the present invention and is not intended to limit the present invention. Any person skilled in the art can modify the above embodiments under the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the following patent scope. τ [Simplified description of the drawings] Fig. 1 is a schematic cross-sectional view of U.S. Patent No. 6,839,476; the fA to 2D drawings are the first implementation of the optical transmission structure of the present invention and the embedded structure of the substrate BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2A and 2B are schematic cross-sectional views showing a structure of a light transmission wheel of the present invention and a buried substrate=structured-light-conducting material and a plurality of non-optical-conducting material braids; The A to 3 C picture is the invention|also a cross-sectional schematic diagram of the substrate structure of the first transmission wheel and the system of the system, and #一乐3B®1 is the light transmission wheel of the invention Substrate structure and its manufacturing method = light-conducting material and complex non-optical conductive material woven into a braid
【主要元件符號說明 11 12 12a 13 13a 13b 底層 芯層 溝槽 光纖 核纖 纖殼[Main component symbol description 11 12 12a 13 13a 13b bottom layer core trench fiber core fiber fiber shell
14 2 21 22 22, 23 231 232 233 頂層 光傳輸結構 第一光傳導材料 第二光傳導材料 非光傳導材料 線路增層結構 介電層 線路層 導電結構 19513 1292495 234 電性連接墊 24 防焊層 240 開孔 25 電鍍導通孔 3 基板 30 開口14 2 21 22 22, 23 231 232 233 Top layer optical transmission structure First light-conducting material Second light-conducting material Non-light-conducting material Line build-up structure Dielectric layer Line layer Conductive structure 19513 1292495 234 Electrical connection pad 24 Solder mask 240 opening 25 plating via 3 substrate 30 opening
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