[go: up one dir, main page]

TWI268747B - Cutting method of flexible printed circuit board capable of avoiding reduction of product yield due to the punching and cutting residual even plural kinds of punch pins and metal molds of molding tool having compatible size with the terminal portion are not available - Google Patents

Cutting method of flexible printed circuit board capable of avoiding reduction of product yield due to the punching and cutting residual even plural kinds of punch pins and metal molds of molding tool having compatible size with the terminal portion are not available

Info

Publication number
TWI268747B
TWI268747B TW092117045A TW92117045A TWI268747B TW I268747 B TWI268747 B TW I268747B TW 092117045 A TW092117045 A TW 092117045A TW 92117045 A TW92117045 A TW 92117045A TW I268747 B TWI268747 B TW I268747B
Authority
TW
Taiwan
Prior art keywords
cutting
terminal portion
circuit board
printed circuit
available
Prior art date
Application number
TW092117045A
Other languages
Chinese (zh)
Other versions
TW200402259A (en
Inventor
Hisashi Yasoda
Takashi Tsuchida
Original Assignee
Uht Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uht Corp filed Critical Uht Corp
Publication of TW200402259A publication Critical patent/TW200402259A/en
Application granted granted Critical
Publication of TWI268747B publication Critical patent/TWI268747B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

A cutting method, which is capable of avoiding reduction of product yield due to the stamping and cutting residual even plural kinds of punch pins and metal molds of die having compatible size with the terminal portion are not available, for flexible printed circuit board (PCB) is provided in the present invention. The invention also is adaptable to the terminal portions of products having different sizes such that it can be used to punch and process the product terminal portion. The method is provided with the followings: a pair of cutting knives S1, S1 parallel to each other and capable of adjusting the separation between them; and an intermediate cutting knife S2, which has at least a length between the paired parallel cutting knives S1, S1. Both terminal sides a1, a1 parallel to the product terminal portion (a) formed on the flexible PCB are punched and cut through the use of the paired parallel cutting knives S1, S1. In addition, the side a2 in between both terminal sides a1, a1 is punched and cut by the intermediate cutting knife S2.
TW092117045A 2002-06-28 2003-06-24 Cutting method of flexible printed circuit board capable of avoiding reduction of product yield due to the punching and cutting residual even plural kinds of punch pins and metal molds of molding tool having compatible size with the terminal portion are not available TWI268747B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002190354A JP2004034161A (en) 2002-06-28 2002-06-28 Method for cutting flexible printed wiring board

Publications (2)

Publication Number Publication Date
TW200402259A TW200402259A (en) 2004-02-01
TWI268747B true TWI268747B (en) 2006-12-11

Family

ID=30437048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092117045A TWI268747B (en) 2002-06-28 2003-06-24 Cutting method of flexible printed circuit board capable of avoiding reduction of product yield due to the punching and cutting residual even plural kinds of punch pins and metal molds of molding tool having compatible size with the terminal portion are not available

Country Status (4)

Country Link
JP (1) JP2004034161A (en)
KR (1) KR100672805B1 (en)
CN (1) CN100484730C (en)
TW (1) TWI268747B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385039B (en) * 2009-04-23 2013-02-11 Kuo Chung Wang Actuator tool for cutting board
TWI507119B (en) * 2010-07-16 2015-11-01 Zhen Ding Technology Co Ltd Flexible printed circuit board and method for manufacturing the same

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100646452B1 (en) 2004-10-18 2006-11-15 주식회사 써키트 플렉스 FPC Blade Mold
KR100615074B1 (en) * 2004-10-18 2006-08-22 주식회사 써키트 플렉스 Punching method of FPC with unconnected compound hard toolings
JP2007098546A (en) * 2005-10-07 2007-04-19 Kyocera Mita Corp Punch device
KR100733250B1 (en) * 2005-10-26 2007-06-27 삼성전기주식회사 Manufacturing method of flexible printed circuit board using two-stage shear mold
KR100651467B1 (en) * 2005-10-31 2006-11-29 삼성전기주식회사 Shear method of flexible printed circuit board
CN100420553C (en) * 2005-11-02 2008-09-24 富展电子（上海）有限公司 Die cutting method of flexible circuit board
KR100809218B1 (en) 2006-08-16 2008-02-29 삼성전기주식회사 Array board with bridge for easy cutting
JP5305733B2 (en) * 2008-05-16 2013-10-02 京セラ株式会社 Printed circuit board dividing apparatus and method
CN101686604B (en) * 2008-09-24 2011-05-18 比亚迪股份有限公司 Flexible printed circuit whole board punching method
JP2011029451A (en) * 2009-07-27 2011-02-10 Fujitsu Ltd Printed circuit board, electronic apparatus, and method for manufacturing printed circuit board
JPWO2015147010A1 (en) 2014-03-28 2017-04-13 日本ゼオン株式会社 DIP MOLDING COMPOSITION AND DIP MOLDED ARTICLE
CN105415436A (en) * 2015-12-11 2016-03-23 苏州米达思精密电子有限公司 Production process of glue retraction reinforced sheet
JP6897937B2 (en) * 2016-11-17 2021-07-07 住友電工プリントサーキット株式会社 Flexible printed wiring board manufacturing method, plate jigs, flexible printed wiring board piece handling tools, and flexible printed wiring board manufacturing equipment
CN108124385B (en) * 2017-12-21 2019-12-27 上达电子（深圳）股份有限公司 Flexible circuit board forming method and die
CN110139486B (en) * 2019-05-14 2022-09-16 广东顺德施瑞科技有限公司 Continuous production method of flexible circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05177582A (en) * 1991-12-24 1993-07-20 Nikko Kogyo Kk Method and device for cutting board
JPH06132628A (en) * 1992-10-19 1994-05-13 Fujikura Ltd Manufacturing method of single-sided flexible printed wiring board
JP2000024991A (en) 1998-07-10 2000-01-25 Amada Co Ltd Cut die for sheet for protecting plate material and cutting method
JP2000198020A (en) 1998-12-29 2000-07-18 Fujita Seisakusho:Kk Manufacturing method and apparatus for difficult-to-cut plate materials
JP2002283292A (en) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd Method of cutting polyether sulfonic acid resin film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385039B (en) * 2009-04-23 2013-02-11 Kuo Chung Wang Actuator tool for cutting board
TWI507119B (en) * 2010-07-16 2015-11-01 Zhen Ding Technology Co Ltd Flexible printed circuit board and method for manufacturing the same

Also Published As

Publication number Publication date
CN1470370A (en) 2004-01-28
KR20040002756A (en) 2004-01-07
JP2004034161A (en) 2004-02-05
TW200402259A (en) 2004-02-01
CN100484730C (en) 2009-05-06
KR100672805B1 (en) 2007-01-22

Similar Documents

Publication Publication Date Title
TWI268747B (en) Cutting method of flexible printed circuit board capable of avoiding reduction of product yield due to the punching and cutting residual even plural kinds of punch pins and metal molds of molding tool having compatible size with the terminal portion are not available
CN106424296B (en) A double-sided burr-free punching process for a metal strip and a burr-free punching die
EP0384675A3 (en) Waste removal apparatus for use in a punching machine
AU6596201A (en) Device for die cutting a stack consisting of sheet-type materials
CN103991106A (en) Circuit board shearing and splitting mold and splitting method
CN105013943A (en) A stamping die for an automobile B-pillar inner panel
MXPA02011223A (en) Device for punching plastic materials.
TWI711535B (en) Processing device and processing method for plate processing
CN203863757U (en) Circuit board shear sectional die
MX2007000203A (en) Method and device for the production of stamped parts.
CN210676585U (en) Rib cutting forming device of semiconductor device
AU2003217584A8 (en) Punching statio, punch pin, punch plate, die set, angled aligner, a method of making punch pins and a method of punching in line with a processing machine
CN201423402Y (en) Continuous Die Machine
JP2005297126A (en) Half cut die
KR100655456B1 (en) Link member manufacturing method and manufacturing mold
CN206215737U (en) A burr-free punching die
CN215941220U (en) Terminal punching, bending and cutting tool for production of surface mount device touch switch
JPH11207418A (en) Press working free from burr
AU2001292440A1 (en) Punching apparatus, particularly suitable for forming labels and such foil elements
CN221436689U (en) Universal die for die-cutting piece
CN215467400U (en) Non-cross-cutting type bending and stamping equipment
JP2007061836A (en) Scrap cutter of trimming apparatus and cutting method using the same
KR200463535Y1 (en) Compound mold apparatus for pcb
CN101912931A (en) Processing method and device for arc-shaped freezer metal shell enclosure
CN110369608B (en) Semiconductor device cutting and forming device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees