TWI711535B - Processing device and processing method for plate processing - Google Patents

Abstract

Provided is a processing device and a processing method that can minimize the occurrence of cracks on the plate thickness surface after punching a plate, and can also prevent the generation of burrs.

In the first partial stamping step, the lower punch is only raised by 20% to 70% of the thickness of the metal plate, and the lower punch is pressed into the metal plate. The upper punch remains in a position not to abut the surface of the metal plate. Then the lower punch is moved downward to end the first partial punching step. In the second partial stamping step, the upper punch is moved downward so that the upper punch only drops 20% to 70% of the thickness of the metal plate, and the upper punch is pressed into the metal plate 20. The lower punch moves to a position below the bottom surface of the punching part. Then, lift the upper punch to end the second partial punching step. The punching part is in a state of being fitted into the punching hole and is held on the metal plate without falling from the punching hole.

Description

Processing device and processing method for plate processing

The present invention relates to a processing device and a processing method for processing metal plates and other plates, and in particular to a processing device and processing method capable of double-sided punching and cutting of metal plates.

The processing of metal parts, etc. applied to precision machines is performed using a processing device including a press device and a die. In addition, in recent years, the processing of metal parts applied to precision machines requires high precision. For example, metal terminals used in connectors such as mobile devices will require miniaturization of connectors and their terminals in accordance with the requirements for miniaturization of mobile devices. As such, when the size of the workpiece of the object to be processed is reduced, the processing device requires very high processing accuracy.

In the past, the inventor of this case has proposed a press device and die with high precision that can reduce the size of the device (please refer to Patent Document 1). Even if the press device described in Patent Document 1 is a so-called C-type press device with a relatively simple structure, it is also a press device with high processing accuracy.

[Patent Document 1] Japanese Patent No. 5636572.

However, in recent years, metal components made of processed metal sheets have been mass-produced, which are used in the terminals of micro-connectors of electronic devices such as smartphones, and lead frames of semiconductor devices such as LSIs.

This kind of metal parts are made by stamping sheet metal through a processing device. Therefore, there will be sagging parts and metal structure cracks caused by the punch and die of the processing device on the thick surface of the stamped metal plate. The fractured surface. In addition, under various conditions such as the gap between the punch and the die, burrs may be generated at the cracks including the thickness of the plate.

In recent years, as the processing speed of electronic equipment has increased, the signals flowing through connectors have also increased in speed and frequency. In this type of electronic equipment, if the connector or the like has burrs, the burrs may become antennas and may generate high-frequency noise. Since such high-frequency noise is the cause of operation errors in electronic equipment, in recent years, connectors in electronic equipment are required to have flat surface roughness without burrs.

In addition, as a processing device for cutting sheet materials, there is a device called a shearing machine. This kind of shearing machine is a device that clamps the plate by the upper blade and the lower blade, and then cuts it. The blades are provided with an angle called a shear angle. In the shearing machine, the upper and lower blades with this angle clamp the plate, and cut the plate like scissors.

In the case of cutting the plate by the shearing machine, cracked surfaces and burrs will be generated on the sheared surface, and warping or twisting of the plate will occur. Although these can be reduced to a certain extent by adjusting the gap between the upper blade and the lower blade, or reviewing the shear angle, etc., these problems cannot be completely resolved.

The purpose of the present invention is to solve the problems described above, and provide a processing device and a processing method that can minimize the occurrence of cracks on the plate thickness surface of the sheet after punching or cutting, and also prevent the generation of burrs.

The sheet metal processing device of the present invention is a processing device for punching sheet metal, and it is characterized by comprising: a pair of dies having punch holes of the same shape as the punching shape, and the sheet metal can be viewed from the front And back clamping; a pair of punches, which move freely in the punch hole, and can press the plate from the front and back; the extrusion punch, which is arranged separately from the pair of punches; and a driving device, which drives the The die, the punch, and the extrusion punch; the driving device clamps the plate in the initial position by driving the die, and relative to the die, a punch presses the plate to form a stamping part, the stamping The part is to make the plate move 20% to 70% of the plate thickness in the direction of the plate thickness from the initial position, Pressing the stamping part by the other punch, the stamping part moves 20% to 70% of the plate thickness in the direction of the plate thickness from the initial position, so that the plate and the stamping part move from the initial position , The stamping part is stamped from the sheet by the extrusion punch.

According to the processing device of the present invention, because one punch presses the sheet material, the sheet material is moved from the initial position along the thickness direction of the sheet material by 20% to 70% of the sheet thickness in the forward direction to form a stamping part. Sagging occurs on the other side of the sheet material used as the stamping part. In addition, by pressing the punching part by the other punch, the punching part moves 20% to 70% of the plate thickness in the direction of the plate thickness from the initial position, which can also cause one side of the punching part to sag. In addition, the punching part can be removed from the plate by the extrusion punch provided separately from the pair of punches. When the punching part is pressed by the other punch, the one punch can be released from the driving device, thereby preventing the punches from interfering with each other, or the driving device can make the one punch return in the reverse direction.

The rising amount of the punch is 20% to 70% of the plate thickness, and the lowering amount of the other punch is set to 20% to 70% of the plate thickness, so as to minimize the punching part and the punching hole after the punching part. Fractured surface on the side. In addition, sagging occurs on the front and back of the punching part and punching hole, thereby preventing the generation of burrs.

In addition, in the processing device of the present invention, since one punch is not inserted into the other punch hole (die), the punch and the die do not interfere. In addition, the punch on the other side will not interfere with the die on the other side. Therefore, the damage of each punch and each die is reduced, and the maintenance life of a pair of punches such as re-grinding can be greatly improved. Moreover, the processing device of the present invention may be a device like a punching machine, or a mold device using a punch and a mold as mold parts.

In addition, in the processing device of the present invention, before punching by the extrusion punch, the punching portion may be returned to the initial position by the one punch. With this structure, the plate can be moved while the press part is held on the plate.

In addition, in the processing device of the present invention, the extrusion punch is movably provided in the second punch hole, the second punch hole is provided on one side of the pair of dies, and on the other side of the pair of dies. , A punching opening may be formed, and the punching opening faces the second punch hole and opens in a larger manner than the punching part. Alternatively, the extrusion punch is freely arranged in the second punch hole, the second punch hole is arranged on one side of a pair of second dies, and the pair of second dies are arranged separately from the pair of dies. The other side of the second mold may be formed with a punching opening which faces the second punch hole and opens in a larger manner than the punching part. In this way, the extrusion punch, the second punch hole, and the punching opening may be provided in a pair of molds, or may be provided in a second mold that is provided separately from the pair of molds.

In addition, the processing method of the present invention is used for press processing of a sheet material, and is characterized in that a processing device is used, and the processing device is provided with a pair of dies having punch holes of the same shape as the punching shape. Clamping from the front and back; a pair of punches, which can move freely in the punch hole, and can press the plate from the front and back; the extrusion punch, which is arranged separately from the pair of punches; and a driving device, which Drive the die, the punch and the extrusion punch; the drive device clamps the plate at the initial position by driving the die, and relative to the die, a punch presses the plate to form a stamping part, The stamping part is to make the plate move 20% to 70% of the plate thickness in the direction of the plate thickness from the initial position, and press the stamping part by the other punch to make the stamping part move from the The initial position moves 20% to 70% of the plate thickness in the opposite direction along the plate thickness direction of the plate, so that the plate and the stamping part are moved from the initial position, and the stamping part is stamped from the plate by the extrusion punch.

In addition, the processing device of the present invention is used for cutting a sheet material, and is characterized by comprising: a pair of first cutters capable of clamping the sheet material from the front and back sides; and a pair of second cutters to interact with the first cutter A cutter is provided with a cutter in a manner in which a cutting line is clamped, which can clamp the plate from the front and back; and a driving device that drives the first cutter and the second cutter; the driving device passes through the first cutter and The second cutter clamps the plate at the initial position, so that one of the first cutter and the second cutter moves in the direction of the plate thickness of the plate from the initial position relative to the other. 20% to 70% of the plate thickness, and then make any one of the first cutter and the second cutter relative to the other from the initial position along the plate thickness direction of the plate, and move the plate thickness 20% to 70% to cut the board.

According to the processing device for cutting the plate of the present invention, when the plate is cut, the plate is moved forward or backward by 20% to 70% of the plate thickness through the first cutter and the second cutter to cut the plate. The edges of the cut sheet will sag on the front and back to prevent burrs. In addition, it is possible to minimize the occurrence of cracks on the plate thickness surface of the sheet after punching.

In addition, the processing method of the present invention is used for cutting a sheet material, and is characterized in that a processing device is used, and the processing device includes: a pair of first cutters capable of clamping the sheet material from the front and back; Two cutters, the cutters are arranged in such a way that the first cutter clamps the planned cutting line, and the plate can be clamped from the front and the back; a driving device, which drives the first cutter and the second cutter; the driving device By driving the first cutter and the second cutter to clamp the plate in the initial position, one of the first cutter and the second cutter is moved along the plate thickness direction of the plate from the initial position relative to the other. Move 20% to 70% of the plate thickness in the opposite direction, and then make any one of the first cutter and the second cutter move relative to the other from the initial position along the plate thickness direction of the plate. % To 70% to cut the board.

According to the present invention, it is possible to provide a processing device and a processing method that can minimize the occurrence of cracks on the plate thickness surface of a sheet after punching or cutting, and can also prevent the generation of burrs.

1: Processing device

1B: Cutting device (processing device)

2: Upper punch

2a: Abutment surface (upper punch)

2b: Upper push pin

3: Upper module

3a: upper die

4: Upper punch hole

5: Lower punch

5a: Abutment surface (lower punch)

5b: Push pin down

6: Lower module

6a: Lower mold

7: Lower punch hole

8: Extrusion device

9: Squeeze the upper punch

10: Extrusion punch

10a: Abutment surface (extrusion punch)

11: Extrusion punch hole

12: Squeeze the lower punch

13: Punching opening

20: metal plate

21: Stamping department

22: Punching hole

22a: Surface sagging

22b: Surface sagging

22c: cutting surface

30: Terminal

31: side

31B: Surface sagging

40: First tool

41: Pedestal

42: Sheet pressed parts

50: Second tool

51: lower edge

52: upper edge

60: Drive

61: The first drive unit

62: second drive unit

63: Third Drive

L: Cutting line

Fig. 1(A) and Fig. 1(B) are explanatory diagrams of the holding step for explaining the processing method implemented by the processing device of the embodiment of the present invention.

2(A) and 2(B) are explanatory diagrams of the first partial punching step in the processing method of this embodiment.

3(A) to 3(C) are explanatory diagrams of the second partial punching step in the processing method of this embodiment.

4(A) and 4(B) are explanatory diagrams of the push-back step in the processing method of the present embodiment.

5(A) to 5(C) are explanatory diagrams of the extrusion step in the processing method of this embodiment.

The photo shown in FIG. 6(A) is the surface state of the processed plate, which was processed by the processing method of the processing device of the embodiment of the present invention.

The photo shown in FIG. 6(B) is the state of the back side of the processed plate, which was processed by the processing method of the processing device of the embodiment of the present invention.

7(A) to 7(C) are explanatory diagrams of the initial position holding step and the first part of the cutting step in the cutting processing method of this embodiment.

8(A) and 8(B) are explanatory diagrams of the second part of the cutting step and the returning step in the cutting processing method of this embodiment.

Next, the processing apparatus and processing method of the present invention will be described with reference to FIGS. 1 to 8. As shown in FIG. 1(A), the processing apparatus 1 of this embodiment includes an upper punch 2 and an upper die 3 arranged above the metal plate 20 of the plate to be processed, and a lower punch arranged below the metal plate 20 5 and the lower module 6. The upper punch 2 and the lower punch 5 correspond to a pair of punches of the present invention, and the upper mold 3 and the lower mold 6 are equivalent to a pair of molds of the present invention.

In this embodiment, the punches and molds are part of the mold device 1A including a driving device such as a motor. As shown in FIG. 1(A), the mold apparatus 1A is equipped with the upper mold 3a and the upper push pin 2b, and the lower mold 6a and the lower push pin 5b (all are represented by a dotted chain line). In addition, in this case, the mold device 1A such as the upper mold 3a is omitted from the illustration after FIG. 1(B).

The upper die 3 is provided with an upper punch hole 4 for guiding the upper punch 2, and the upper punch 2 is kept in a freely forward and retreat state in the upper punch hole 4. The lower die 6 is provided with a lower punch hole 7 for guiding the lower punch 5, and the lower punch 5 is kept in a freely forward and retreat state in the lower punch hole 7.

The upper punch 2 and the lower punch 5 are formed to have the same shape as the contact surface 2a and the contact surface 5a that abut the metal plate. The shapes of the abutting surface 2a and the abutting surface 5a are determined according to the shape of the product (press part) formed by the processing device 1 of this embodiment. For example, if the terminal 30 of the board-to-board connector shown in FIG. 6 is formed, there are formed: a punch of "outer shape of the terminal 30" and a punch of "the punch hole 22 provided inside the terminal 30". Plane shape" shape.

The upper die 3, the upper punch 2 and the lower punch 5 are driven in the up-and-down direction by a drive device provided in the die device 1A. Specifically, the upper die 3 moves up and down by the driving device through the upper die 3a, the upper punch 2 is pressed forward (from top to bottom) by the upper push pin 2b, and the lower punch 5 is pressed by the lower push pin 5b. Press in the opposite direction (from bottom to top). In this embodiment, the movement from top to bottom is forward, and the movement from bottom to top is reverse.

The lower mold 6 is fixed to a punching device not shown through the lower mold 6a. In the driving device, when the upper die 3, the upper punch 2 and the lower punch 5 are driven, their respective movements are synchronized by a synchronization device such as a timing belt. Regarding the structure of the driving device, the structure described in Patent Document 1 proposed by the inventor of the present application can be used as an example.

In this embodiment, regardless of the thickness of the metal plate 20, the gap between the upper punch 2 and the upper punch hole 4 is set to 3.0 μm. The gap between the lower punch 5 and the lower punch hole 7 also has the same value. Generally speaking, the gap between the punch and the punch hole is usually set to about 5% of the thickness of the metal plate 20. For example, if it is a metal plate with a thickness of 0.08 mm (80 μm), the gap is set to 4.0 μm. However, this situation is unfavorable because a cracked surface is generated at the thick surface of the cut plate. In addition, unless otherwise specified, the gap in this case represents a unilateral gap.

Next, the processing method when processing the metal plate 20 by the processing apparatus 1 of this embodiment is demonstrated. In this embodiment, a metal plate 20 whose material is phosphor bronze for spring and whose plate thickness is 0.08 mm is used as an example and described.

The processing method of the present invention includes: a holding step, which holds the metal plate 20 by the upper die 3 and the lower die 6, and the first partial punching step, which uses the lower punch 5 to perform partial punching from the lower side of the metal plate 20 to The position of a part of its thickness; the second partial punching step, which uses the upper punch 2 to perform partial punching from the upper side of the metal plate 20; the push-back step, which uses the lower punch 5 to remove the cut punch from the metal plate 20 21 is pushed back to the punching hole 22; and an extrusion step, which extrudes the punching part 21 from the punching hole 22 of the metal plate 20.

First, in the holding step, as shown in Fig. 1(A), the metal plate is conveyed between the upper mold 3 and the lower mold 6 through a conveying device not shown, and then, as shown in Fig. 1(B), The upper mold 3 is pushed downward, and the metal plate 20 is clamped by the upper mold 3 and the lower mold 6 under a predetermined pressure. The position of the metal plate 20 in this state is the initial position. At this time, the metal plate 20 passes through a conveying device not shown, and is conveyed accurately at a certain interval in each step.

Next, in the first partial stamping step, as shown in FIG. 2(A), the lower punch 5 is raised by 20% to 70% of the thickness of the metal plate 20, and the lower punch 5 is pressed into the metal plate 20 and combined The punching part 21 is formed. At this time, the upper punch 2 is held at the upper position so as not to abut on the surface of the punched portion 21 raised by the ascent of the lower punch 5. From this state, as shown in FIG. 2(B), the lower punch 5 is moved downward to end the first partial punching step.

Next, in the second partial stamping step, as shown in FIG. 3(A), the upper punch 2 is moved downward, and as shown in FIG. 3(B), the upper punch 2 is lowered by 20% of the thickness of the metal plate 20 To 70%, the punching part 21 is pressed into the metal plate 20 by the upper punch 2. At this time, the lower punch 5 moves to a position below the bottom surface of the punching portion 21 that is lowered due to the lowering of the upper punch 2.

Next, as shown in FIG. 3(C), the upper punch 2 is lifted upward to end the second partial punching step. At this time, the punching part 21 is in a state of being fitted into the punching hole 22 and held on the metal plate 20 without falling from the punching hole 22.

Next, as shown in FIG. 4(A), in the push-back step, the lower punch 5 is pushed upward. As shown in FIG. 4(B), the pushing of the lower punch 5 is performed until the punching portion 21 enters the punching hole 22 and is held at the position (initial position) of the punching hole 22. At this time, the lower edge of the stamping part 21 can be matched with the height of the upper surface of the lower mold 6, or the upper edge of the stamping part 21 can be matched with the height of the lower surface of the upper mold 3.

Next, as shown in FIG. 5(A), in the pressing step, the metal plate 20 is moved to a predetermined position of the pressing device 8 used in the pressing step, and the state of the metal plate 20 is that the pressing portion 21 has been inserted. Close to the punching hole 22. The extrusion device 8 includes an extrusion upper punch 9, an extrusion punch 10, and an extrusion lower punch 12. The extrusion upper punch 9 and the extrusion lower punch 12 correspond to a pair of second dies of the present invention. The upper extrusion punch 9 is provided with an extrusion punch hole 11 (second punch hole) through which the extrusion punch 10 is guided upward and downward. In addition, the pressing lower punch 12 is provided with a punching opening 13 penetrating and opening in the vertical direction.

The extrusion punch 10 is formed such that the area of the abutting surface 10 a is smaller than the surface area of the pressing portion 21. On the other hand, the punch opening 13 provided in the lower extrusion punch 12 is formed to be larger than the surface area of the punch 21. The extrusion device 8 is provided on the downstream side of the processing device 1 and is formed separately from the processing device 1.

In the pressing step, as shown in FIG. 5(A), the metal plate 20 is moved to a predetermined position of the pressing device 8 for the pressing step on the downstream side. Fitting into the punching hole 22 after the pressing step, as shown in FIG. 5(B), the pressing upper punch 9 is lowered, and the metal plate is pressed by pressing the upper punch 9 and pressing the lower punch 12 20 remains in the specified position.

Next, as shown in FIG. 5(C), the pressing punch 10 is lowered, and the pressing part 21 fitted in the punch hole 22 is pressed toward the punch opening 13 by the pressing punch 10. Then, while returning the pressing punch 10 to the upper side, the pressing upper punch 9 is raised, and the holding of the metal plate 20 is released.

Through the above steps, the metal plate 20 with the punched hole 22 is formed, so that the side surface of the punched hole 22 becomes the state shown in FIGS. 6(A) and 6(B). The photograph of Fig. 6(A) is a front view of the connector terminal 30 formed of the metal plate 20. The photograph of Fig. 6(B) shows the terminal 30 viewed from the back.

In addition, the side surface 31 of the terminal 30 disclosed in FIG. 6(A) and FIG. 6(B) is not processed by the above-mentioned steps, but by using a punch for side processing and a die for side processing not shown in the figure. 6(A) is a cross section of the result of punching the front side in one direction.

As shown in FIG. 6(A), observing the front side of the terminal 30, the upper edge portion of the front side of the punching hole 22 is processed by the second partial punching step of the upper punch 2 to show a surface sag 22a. The upper edge part of the front side of the side surface 31 of the terminal 30 is also punched by the punch for side surface processing, and the surface sag 31B appears.

On the other hand, as shown in FIG. 6(B), observing the back side of the terminal 30, the lower edge of the punch hole 22 on the back side is processed by the first partial punching step of the lower punch 5 to present a surface Drooping 22b. On the other hand, the lower edge portion on the back side of the side surface 31 of the terminal 30 is the surface on one side of the side surface processing die punched by the side surface processing punch, and here is the fracture surface.

In this way, in the punch hole 22 processed by the processing device 1 and the processing method of this embodiment, the upper edge portion on the front side and the lower edge portion on the back side are both formed as surface sags 22a and 22b. In addition, there is no fracture surface on the inner peripheral surface of the punch hole 22, and the portion between the surface sag 22a and 22b is formed as a cut surface 22c.

Therefore, when the processing device 1 and the processing method of the present embodiment are applied to the processing of the connector terminal 30, by inserting the counterpart terminal into the punch hole 22, the surface contacting the counterpart terminal will not be cracked. , And can make the connection status of the connector good.

In addition, according to the processing device 1 and the processing method of the present embodiment, burrs generated at the processing place can be suppressed. Thereby, when the processing device 1 and the processing method of the present embodiment are applied to the processing of lead frames for semiconductors, for example, a lead frame with no burrs and high reliability can be provided.

Moreover, in the above-mentioned embodiment, although the lower punch 5 is raised in the first partial punching step, and the upper punch 2 is lowered in the second partial punching step, conversely, it can also be used in the first partial punching step. The upper punch 2 is lowered, and the lower punch 5 is raised in the second partial punching step. At this time, in the push-back step, the lower punch 5 is lowered so as not to contact the metal plate 20, and at the same time the upper punch 2 is lowered, thereby returning the punched portion 21 produced by the second partial punching step to Punch the hole 22.

In addition, in the above embodiment, the upper mold 3 is moved up and down by the driving device, and the lower mold 6 is fixed to the punching device, but it is not limited to this, and the upper mold 3 may also be fixed to the punching device. And the lower mold 6 is moved up and down by the driving device.

In addition, in the above embodiment, in the first partial pressing step, the lower punch 5 is raised by 20% to 70% of the thickness of the metal plate 20, and the ratio is appropriately determined according to the material or thickness of the metal plate 20. The same is true for the upper punch 2 in the second partial punching step.

In addition, in the above-mentioned embodiment, the extrusion device 8 is composed of an extrusion upper punch 9, an extrusion punch 10, and an extrusion lower punch 12. However, it is not limited to this, and the extrusion upper punch The head 9 and the upper mold 3 are formed as an integral structure. At this time, the lower die 6 and the extrusion lower punch 12 can be formed as an integral structure.

In addition, in the above-mentioned embodiment, the metal plate 20 is taken as an example and illustrated as a plate, but it is not limited to this, and it can also be a plate of other materials, such as a paper plate, a mica plate, a synthetic resin plate, and the like. In addition, the present invention is particularly effective for plates with a plate thickness of 0.3 mm or less. In addition, the gap between the upper punch hole 4 and the upper punch 2 and the gap between the lower punch hole 7 and the lower punch 5 are all set to 3.0 μm, but only 1.5 μm to 3.0 μm.

Next, the processing device and processing method for cutting the plate material in the present invention will be described with reference to FIGS. 7 to 8. The cutting device 1B, which is a processing device for cutting the metal plate 20, is provided with a pair of first cutters 40 capable of clamping the metal plate 20 from the front and back sides, and a pair of second cutters 50 to interact with the first The cutter 40 is provided with the cutter in such a manner that the planned cutting line L is clamped therein; and the driving device 60 drives the first cutter 40 and the second cutter 50.

For the first cutter 40, the lower part is a pedestal 41 fixed at the set position, and the upper part is a plate pressing piece 42 that moves up and down through the driving device 60. The second cutter 50 has a lower blade 51 at the bottom and an upper blade 52 at the top. The planned cutting line L is a line indicating the edge of the metal plate 20 after being cut (please refer to FIG. 8(B)), and is actually an imaginary line that does not appear on the surface of the metal plate 20.

As shown in FIG. 7(A), the driving device 60 includes a first driving part 61 which moves the sheet material pressing 42 up and down; a second driving part 62 which moves the lower blade 51 up and down; and a third driving part 63 which The upper blade 52 is moved up and down. In this case, these driving parts are exemplarily shown. Specifically, as such a cutting device, it is constituted by a generally widely used cylinder or cam mechanism. The driving device 60 composed of these drives synchronizes the respective driving parts and drives. In addition, the illustration of the driving device 60 is omitted in FIGS. 7(B) to 8.

The cutting device 1B of this embodiment is adjusted such that the gap between the first knife 40 and the second knife 50 is from 0 to about 5% of the thickness of the metal plate 20. The gap is appropriately adjusted in accordance with the thickness or material of the metal plate 20 so that the metal plate 20 is cut without burrs or the like.

Next, a method for cutting the metal plate 20 with the cutting device 1B of this embodiment will be described with reference to FIG. 7. The cutting method (processing method) of this embodiment is composed of the following steps: an initial position maintaining step, which holds the metal plate 20 at the initial position by the first cutter 40 and the second cutter 50; the first partial cutting step, A cutter 40 and a second cutter 50 are relatively moved in the forward direction; the second partial cutting step is to move the first cutter 40 and the second cutter 50 to the opposite direction; and the return step is to move the first cutter 40 and the second cutter 50 returns to the initial position.

FIG. 7(A) shows a state where the metal plate 20 is moved to the surface of the table 41 of the first cutter 40. At this time, the plate pressing part 42 of the first cutter 40 is kept away from the upper part of the base 41, and the upper blade 52 and the lower blade 51 are also kept away from the upper and lower positions of the metal plate 20.

Next, as shown in FIG. 7(B), the plate pressing member 42 of the first cutter 40 is lowered, and the metal plate 20 is pressed onto the base 41 by the plate pressing member 42 to hold the metal plate 20. In addition, in the second cutter 50, the upper blade 52 is also lowered to abut against the metal plate 20, and the lower blade 51 is raised to abut against the metal plate 20. Pick up. In this embodiment, the positions of the first cutter 40 and the second cutter 50 in FIG. 7(B) are taken as initial positions.

Next, as shown in FIG. 7(C), while maintaining the positions of the base 41 as the first cutter 40 and the plate pressing member 42, move the lower blade 51 and the upper blade 52 as the second cutter 50 upward (the plate Press and push (the first part of the cutting step). At this time, the rising height is set to a height from the initial position to 20% to 70% of the thickness of the metal plate 20. Since this ratio varies with the thickness and material of the metal plate 20, the ratio of the metal plate 20 to be cut neatly is different. Therefore, an appropriate ratio is calculated according to the actual cutting operation.

Next, as shown in FIG. 8(A), while maintaining the positions of the base 41 and the plate pressing member 42 as the first cutter 40, move the lower blade 51 and the upper blade 52 as the second cutter 50 downward (the plate The opposite direction of the plate thickness direction) push (the second part of the cutting step). At this time, the descending height is also set from the initial position to a height of 20% to 70% of the thickness of the metal plate 20. At this time, the rising ratio of FIG. 7(C) and the falling ratio of FIG. 8(A) may be the same ratio or may be different ratios.

Next, as shown in FIG. 8(B), the lower blade 51 and the upper blade 52 as the second blade 50 are returned to their initial positions while maintaining the positions of the pedestal 41 and the plate pressing member 42 as the first blade 40 (Return to step). Through these series of steps, the metal plate 20 is cut.

Here, according to the thickness or material of the metal plate 20, the metal plate 20 may be cut by the second partial cutting step of FIG. 8(A). In this case, the subsequent return step can be performed or not. step.

Moreover, in the method of cutting the metal plate 20 with the cutting device 1B of this embodiment, the moving directions of the first knife 40 and the second knife 50 can also be moved downward in the first partial cutting step, and in the second partial cutting step Move up. In addition, according to the thickness or material of the metal plate 20, the first cutter 40 and the second cutter 50 can move multiple times.

1: Processing device

2: Upper punch

3: Upper module

5: Lower punch

6: Lower module

20: metal plate

21: Stamping department

22: Punching hole

Claims (7)

A processing device for punching a plate, comprising: a pair of dies with punch holes of the same shape as the punching shape, which can clamp the plate from the front and back; a pair of punches, It is free to advance and retreat in the punch hole, which can press the plate from the front and back; an extrusion punch, which is arranged separately from the pair of punches; and a driving device, which drives the die, the punch and the extrusion Punch; The driving device clamps the plate in the initial position by driving the die. With respect to the die, a punch presses the plate to form a punching part, which is to make the plate from the initial position It is formed by moving 20% to 70% of the plate thickness in the forward direction along the thickness direction of the plate. The punching part is pressed by the other punch to make the punching part move in the opposite direction from the initial position in the thickness direction of the plate 20% to 70% of the plate thickness, the plate and the punching part are moved from the initial position, and the punching part is punched from the plate by the extrusion punch. The processing device according to claim 1, wherein the punching portion is returned to the initial position by the one punch before punching by the extrusion punch. The processing device according to claim 2, wherein the extrusion punch is freely arranged in the second punch hole, the second punch hole is arranged on one side of the pair of dies, and the other On one side, a punching opening is formed, and the punching opening faces the second punch hole and opens in a larger manner than the punching part. The processing device according to claim 2, wherein the extrusion punch is freely arranged in the second punch hole, the second punch hole is arranged in one of a pair of second dies, and the pair of second dies It is arranged separately from the pair of molds; on the other side of the second mold, a punching opening is formed, and the punching opening faces the second punch hole and opens in a larger manner than the punching part. A processing method for punching sheet metal, which is characterized in that a processing device is used. The processing device is provided with a pair of molds having punch holes of the same shape as the punching shape, and the sheet metal can be viewed from the front and back sides. Clamping; a pair of punches, which are free to advance and retreat in the punch hole, and can press the plate from the front and back; extrusion punches, which are arranged separately from the pair of punches; and a driving device, which drives the mold, The punch and the extrusion punch; the driving device clamps the plate in the initial position by driving the die, and relative to the die, a punch presses the plate to form a stamping part, the stamping part is The plate is formed by moving 20% to 70% of the plate thickness in the direction of the plate thickness from the initial position, and pressing the punching part by the other punch makes the punching part along the The plate thickness direction of the plate is reversely moved by 20% to 70% of the plate thickness, so that the plate and the stamping part are moved from the initial position, and the stamping part is stamped from the plate by the extrusion punch. A processing device for cutting a plate, characterized by being provided with: a pair of first cutters capable of clamping the plate from the front and back; A pair of second knives are provided with knives in such a way that the first knives clamp the planned cutting line, and can clamp the plate from the front and back; and a driving device which drives the first knives and the second knives ; The driving device clamps the plate in the initial position through the first cutter and the second cutter, so that any one of the first cutter and the second cutter relative to the other from the initial position along the plate thickness of the plate Direction, move 20% to 70% of the plate thickness in the forward direction, and then make any one of the first cutter and the second cutter move the plate relative to the other from the initial position along the plate thickness direction of the plate. 20% to 70% thick to cut the sheet. A processing method for cutting a plate, characterized in that a processing device is used, the processing device is provided with: a pair of first cutters capable of clamping the plate from the front and back; a pair of second cutters A cutter is provided with the first cutter to clamp the predetermined cutting line therein, which can clamp the plate from the front and back; and a driving device that drives the first cutter and the second cutter; the driving device drives the The first cutter and the second cutter clamp the plate in the initial position, so that either one of the first cutter and the second cutter moves the plate in the direction of the plate thickness from the initial position relative to the other. 20% to 70% of the plate thickness, and then make any one of the first cutter and the second cutter move 20% to 70% of the plate thickness in the opposite direction from the initial position along the plate thickness direction of the plate relative to the other. % To cut the board.

Images