1268111 九、發明說明： 【發明所屬之技術領域】 本發明涉及-種電容式傳聲器 安聚在主响（印製電路板）上的電容式、傳聲器種可 【先前技術】 由於消費者更喜歡小型化的電子產品以及高性 子產品’因此為了滿足消費者的商电 常都集中在電子產品的小型化上。一般，通常:用= 面貼裝技術）來使電子產品小型化。然而，由於在高溫^ 進行SMD (表面貼裝器件）的回流工藝，因此對於具有^ 臨界溫度的電子元件並不採用SMT。 乂低 而且，由於即使對其採用SMT，電子元件也具有 厚度’因此當iPCB安裝在電子產品中時，纟咖的元件 安裝區域必須指向電子產品的内側。 同時，如第-圖和第二圖所示，傳統電容式 音㈣成在電容式傳聲器的殼體上。因此，在傳統的^ 式傳聲器中，很難將主PCB的元件安裝區域指向内側:谷 即’當主PCB的元件安裝區域指向内側時，由於 二專導路徑與聲源分開’因此傳統的電容式傳聲器的音a;: 第—圖為表示安裝在傳統主PCB上的電容式 體圖’而第二圖為表示安裝在傳統主 —:、 聲器的側視圖。 心谷式傳BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitive type and a microphone type in which a condenser microphone is condensed on a main sound (printed circuit board). [Prior Art] Since consumers prefer a small size "Electronic products and high-quality sub-products" Therefore, in order to satisfy consumers' commercial power, they are often concentrated on the miniaturization of electronic products. In general, it is common to use a = surface mount technology to miniaturize electronic products. However, since the SMD (Surface Mount Device) reflow process is performed at a high temperature, SMT is not used for an electronic component having a critical temperature. And because the electronic components have a thickness even if SMT is used, the component mounting area of the coffee must point to the inside of the electronic product when the iPCB is mounted in the electronic product. Meanwhile, as shown in the first and second figures, the conventional condenser sound (4) is formed on the housing of the condenser microphone. Therefore, in the conventional microphone, it is difficult to point the component mounting area of the main PCB to the inner side: the valley is 'when the component mounting area of the main PCB is directed to the inner side, since the two dedicated paths are separated from the sound source', the conventional capacitor The sound of the microphone a;: the first figure shows the capacitive body image mounted on the conventional main PCB' and the second figure shows the side view mounted on the conventional main::, sounder. Heart Valley
(I 5 1268111 如第-圖和第二圖所示，傳統電容式傳聲 心形成在殼體12上。傳統電容式傳聲器ι〇二的音孔 於主PCB 20上。傳統電容式傳聲器1〇的接觸 4位 通過焊接方法而粘結在主PCB2〇的岸面（ι时 a、l4b 為了將聲波從聲源直接傳導至傳統電 。因此， 2r元件安裝區域-必須指向聲; -电子產品中應該確保對應於元件厚度dl的=下，在 ,2〇b表示與主⑽的元件安裝區域的相對側。0圖標記 【發明内容】 、有鏗於習用電容式傳聲器之各項 、其產業需求，遂竭盡心智，、明人有感 業多年之經驗累積，進而研ς出，憑從事該項產 電容式傳聲器，它通過在電值私可女裝在主PCB上的(I 5 1268111 As shown in the first and second figures, a conventional capacitive sound-generating core is formed on the casing 12. The sound hole of the conventional condenser microphone 〇2 is on the main PCB 20. The conventional condenser microphone 1〇 The contact 4 positions are bonded to the shore of the main PCB 2 by soldering (1: a, l4b in order to conduct sound waves directly from the sound source to the conventional electricity. Therefore, the 2r component mounting area must be pointed to the sound; - in the electronic product It should be ensured that the component thickness dl corresponds to the lower side, and the second 在b represents the opposite side of the component mounting area of the main (10). The 0 mark [invention] is different from the conventional capacitive microphone, and its industrial requirements.遂 遂 遂 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,
電容式傳聲器的殼體上形成音二PCB上而不是在 :,安裝在主PCB上以及在主 、电谷式傳聲器的PCB 的電容式傳聲器，它可安裝在主PCB上 在電容式傳聲器的殼m、奋式傳聲器的PCB上而不是 安裝在主PCBj^及在^音孔、將電容式傳聲器的PCB ，而允許主⑽自由地 上形—於料聲波的通孔 為達上述之目μ ; 電子產品中。 主咖上的電容式傳聲哭發:是這樣實現的：該可安裝在 〇π其包括：柱形殼體，其一側開 l2^\n 4:=广金屬環’其插入所迷殼體中，用於 屬音孔，該一 丨夺開口底和以棱供電絕緣以及機械 =::r並面向背板，== 片上間；第二金屬環，用於電連接在所述膜 件，’亚且錢地切賴片；mPGB，其安裝有電子元 亚且形成有音孔，該PCB通過所述第 連接在所述背板上，該PCB包括連接到外胆 【實施方式】 為使貞番查委員瞭解本發明之目的、特徵及功效， 茲藉由下料叙實_，並配合賴之料，對1發明 做一詳細說明，說明如后： 三圖為表示根據本發明的安裝於主pcB上的電容式 傳&的立體® ’而第四圖為表示根據本發明的安裝於主 PCB上的電容式傳聲器的侧視圖。 、苓考第二圖和第四圖，本發明的電容式傳聲器丨〇〇通 過焊接方法或SMD回流方法而粘結在主pCB 2〇〇的通孔2〇2 周圍的元件女裝區域2〇2a上，以便通過主pCB 2〇〇的通孔 2〇2^將聲波從聲源傳導至電容式傳聲器1〇〇。根據本發明的 電合式傳耸器100，由於主PCB 200的元件安裝區域200a 朝向電子產品的内側，因此主PCB 200在其最小厚度（d2) d 1268111 的狀恶下女裂在相應的電子口 , ，-^ X 兒于產0口（例如，可檇式電話或盒 式合錄機）上’而不用考慮安裝元件的厚度。 成在本發明的電容式傳聲器謂中，音孔11〇4 六 的上，而不是形成在殼體102上。裝配好的電The condenser microphone is formed on the housing of the acoustic microphone instead of: a capacitive microphone mounted on the main PCB and on the PCB of the main and electric valley microphones, which can be mounted on the main PCB in the housing of the condenser microphone m, the PCB of the microphone is not installed on the main PCBj^ and the PCB in the sound hole, the condenser microphone, and allows the main (10) to freely form the through hole of the material acoustic wave to achieve the above-mentioned purpose μ; In the product. Capacitive sound transmission on the main coffee: This is achieved: it can be installed in 〇π which includes: cylindrical shell, one side open l2^\n 4:= wide metal ring 'the insertion of the shell In the body, for the sound hole, the one is smashed and the bottom is insulated with ribs and the mechanical =::r and faces the back plate, == between the sheets; the second metal ring is used for electrical connection to the film a mPGB having an electronic component mounted thereon and having a sound hole formed by the first connection on the backplane, the PCB including the connection to the outer casing [embodiment] To understand the purpose, characteristics and efficacy of the present invention, the following is a detailed description of the invention, and the following is a description of the invention: The capacitive transmission & stereo® mounted on the main pcB and the fourth diagram is a side view showing the condenser microphone mounted on the main PCB according to the present invention. Referring to the second and fourth figures, the condenser microphone of the present invention is bonded to the component women's area around the through hole 2〇2 of the main pCB 2〇〇 by a soldering method or an SMD reflow method. 2a, in order to conduct sound waves from the sound source to the condenser microphone 1 through the through hole 2〇2^ of the main pCB 2〇〇. According to the electric hybrid type finder 100 of the present invention, since the component mounting region 200a of the main PCB 200 faces the inner side of the electronic product, the main PCB 200 is cracked at the corresponding electronic port at the minimum thickness (d2) d 1268111 , , -^ X is on the 0 port (for example, a squat phone or a cassette ram) without regard to the thickness of the mounting components. In the condenser microphone of the present invention, the sound holes 11 〇 4 are formed instead of being formed on the casing 102. Assembled electricity
谷式傳聲态1 Q 〇通過# I .r ^ 、时連接端子112、114焊接在主PCB200 、、文厗面）上，而定位並安裝在主PCB 200的通孔202 周圍的元件安裝區域20(^上。 私谷式傳聲态100通過主pCB的通孔2〇2接收來自聲 源的聲波。聲波通過PCB 11〇的音孔11〇讀導進入内部空 間（腔室）中。膜片在聲壓的作用下振動，從而使膜片盥 背板之間的_生變化。此時，電容發生變化，並且聲 =皮轉換為電信號。因此’根據本發明，即使在電容式傳 聲器1GGS裝於其上的主ρ(：β 2⑽的元件安裝區域按昭需 要朝向内側的情況下’由於自聲源的聲波傳導路徨較短， 因此音質仍可保持在良好的狀態。 第五圖為表示根據本發明的電容式傳聲器的外視圖。 為了通過SMD回流方法將本發明的電容式傳聲器3〇〇 安裝在主PCB200上，其中電容式傳聲器3〇〇的音孔^形成在 PCB上而不是形成於殼體上，如第五圖所*，ρ(：Β的電連接 電極306、308與殼體302的卷邊側相比較向外突出。音孔 304形成在電連接電極308的中心。期望地，電連接+曰極 306、308形成有兩個内和外環形圓盤。此時， /、有從内側 到外側梯度的三個排放槽310形成在電連接電極306中 以排放在SMD回流工藝中的氣體。 1268111 【第一實施例】 第^圖為表示根據本發明的電容•&㈣ 剖視圖=第七圖為表示根據本發明的電容式 寻耳為的弟一優選貫施例的分解立體圖。 參考第六圖和第七圖，本發明的電容式傳聲器包括： ^形殼體402，其-側開口而另-側封閉；第—金屬環娜， :插入殼體402中，以與背板408電連接；盤狀背板彻， 、具有音孔408a;薄環形墊片410;柱形絕緣環414，直且 有開口頂部和開π底部’以提供電絕緣功能以及機械支撐 功能；膜片元件412 ’其插入所述絕緣環414中，並且面向 背板408’同時將所述塾片410插設在所述膜片元件412 和月板408之間，第二金屬環416，用於將所述膜片元件 412電連接在PCB 418上，並機械地支樓該膜片元件412 ; 以及PCB418，其上安裝有諸如1(：和ML(x的部件並形成 有音孔418a。第一金屬環406、背板4〇8、墊片41〇、絕緣 % 414、膜片兀件412第二金屬環416以及pcB418依次疊 放在殼體402巾。然後’為了形成—個元件，使殼體的開 口端卷邊。 這裏，膜片兀件412形成有電連接到pCB 418上的極 環412a以及在聲壓的作用下振動的膜片412b。通過在金屬 板上熱粘結具有駐極體的有機薄膜而形成背板4〇8。 此外，由於與殼體402的卷邊側相比較向外突出的連The valley-type sounding state 1 Q 焊接 is soldered on the main PCB 200, the surface of the main PCB 200 through the # I.r ^, the time connecting terminals 112, 114, and is positioned and mounted on the component mounting area around the through hole 202 of the main PCB 200. 20 (^. The private valley type sound state 100 receives the sound wave from the sound source through the through hole 2〇2 of the main pCB. The sound wave is read into the internal space (chamber) through the sound hole 11 of the PCB 11〇. The sheet vibrates under the action of sound pressure, thereby causing a change between the diaphragm and the back panel. At this time, the capacitance changes, and the sound is converted into an electrical signal. Therefore, according to the present invention, even in the condenser microphone When the component mounting area of the main ρ (: β 2 (10) mounted on the 1GGS is directed toward the inside as shown in the figure, the sound quality can be maintained in a good state because the acoustic conduction path of the self-sound source is short. To show an external view of the condenser microphone according to the present invention. In order to mount the condenser microphone 3 of the present invention on the main PCB 200 by the SMD reflow method, the sound hole of the condenser microphone 3 is formed on the PCB. Not formed on the housing, as shown in the fifth figure *, ρ(: 电 electrical connection electrodes 306, 308 protrude outwardly from the curl side of the housing 302. The sound hole 304 is formed at the center of the electrical connection electrode 308. Desirably, the electrical connection + the drain 306, 308 Two inner and outer annular disks are formed. At this time, three discharge grooves 310 having a gradient from the inner side to the outer side are formed in the electrical connection electrode 306 to discharge the gas in the SMD reflow process. 1268111 [First Embodiment Example: FIG. 4 is a cross-sectional view showing a capacitor according to the present invention. FIG. 7 is an exploded perspective view showing a preferred embodiment of the capacitive ear-seeking method according to the present invention. The condenser microphone of the present invention comprises: a ^-shaped housing 402, which is open to the side and closed on the other side; a metal ring, inserted into the housing 402 for electrical connection with the backing plate 408; a plate having a sound hole 408a; a thin annular gasket 410; a cylindrical insulating ring 414 having an open top and an open bottom π to provide an electrical insulating function and a mechanical support function; the diaphragm member 412' is inserted into the In the insulating ring 414, and facing the backing plate 408' at the same time 410 is interposed between the diaphragm member 412 and the moon plate 408, and a second metal ring 416 for electrically connecting the diaphragm member 412 to the PCB 418 and mechanically supporting the diaphragm member 412; a PCB 418 on which components such as 1 (: and ML (x) are formed and formed with sound holes 418a. The first metal ring 406, the back plate 4 〇 8, the spacer 41 〇, the insulation % 414, and the diaphragm element 412 The two metal rings 416 and pcB 418 are sequentially stacked on the housing 402. Then, in order to form an element, the open end of the housing is crimped. Here, the diaphragm member 412 is formed with a pole ring 412a electrically connected to the pCB 418 and a diaphragm 412b which vibrates under the action of sound pressure. The back sheet 4〇8 is formed by thermally bonding an organic film having an electret on a metal plate. In addition, due to the outwardly protruding connection compared to the curled side of the housing 402
接端子420、422形成在PCB 418的暴露側上，因此通過SMD 1268111 回流方法可將電容式值故, A n， 电奋式傳耸為400粘結在主PCB 2〇〇 ( 可檇式電話的PCB)上。A + j如， 一 上為此’連接端子420、422 I古& 第五圖所示相同的結構。卓 “有14 再運接鳊子420、422形成有遠妞 Vdd的圓形端子422以接至 叹形接地端子42〇形成a 子422外侧以規則的間隔分開。 X马在端 攸:面的.羊、、、田祂述中，本發明的電容 將變得清晰。 ％^作 當將本發明的電容式值舞 傳耳w的接線端子420、422連接 在主PCB 200上並且向Vdd和 供電時，膜片412b通過 極ί哀412a和弟二金屬環41fi带 _ 卜 獨衣4ib笔連接在PCB418上，而背板 408通過第一金屬環406和殼 々又肢4〇2電連接在PCB 418上。 在上述狀恶下’當使用者對 ^广 可對者電容式傳聲器講話時， 耸壓通過主PCB200的通孔2〇?屯prD ^ ,^ ⑶2和pCB 418的音孔418a而 鈿加在膜片412b上。此時，名^ p n ^ ^在膜片412b和背板408之間 的間隙在耸壓的作用下發生變 又化攸而由膜片412b和背板 彻形成的電容發生變化。從電容的變化根據聲波獲得電信 號（電壓）的變化。電信號通過上述電連接線傳w418 的IC上’以便放大。經放大的信號通過連接端子倒、422 傳導至主PCB 200。 【第二實施例】 弟八圖為表示根據本發明沾+六斗 一 d的電谷式傳耸器的第二優選 實施例的側剖視圖，而第九圖A本— 口為表不根據本發明的電容式 傳聲器的第二優選實施例的分解立體圖。 他8111 每：知考第八圖和第九圖，本發明的電容式傳聲器500包 5〇6殼體502 ’其一側開口而另—側封閉；第—金屬環 5〇δ，款、插入殼體502中以與背㈣8電連接；盤狀背板 其具有、具有音孔508a ;薄環形墊片51〇 ;柱形絕緣環514， 以後佴不平部分514a、514b’以及開口頂部和開口底部， ，、電絕緣功能和機械支稽功能；膜片元件512 、^所述絕緣環514中，並且面向背板娜，同時將所 屬片㈣插設在所述膜片512和背板5〇8之間；第二金 =16 ’用於將所述膜片元件512電連接在pcB 518上， ，械地支樓該膜片元件512 ;以及pcB 518，其上安裝有 和·的部件，並形成有音孔伽。第一金屬環 ⑽、背板5〇8、墊片510、絕緣環514、膜片元件512、第 =屬環㈣以及PCB 518依次叠放在殼體巾。然後， 為了形成以一個元件，使殼體的開口端卷邊。 ^绝裏，膜片兀件512形成有電連接在PCB 518上的極 %512am在聲壓作用下振動的料5ΐ，通過在金屬板 上熱粘結具有駐極體的有機薄膜而形成背板5〇8。 此外由於與设體502的卷邊側相比較向外突出的連 接端子520、522形成在卩(^518的暴露侧上，因此通過· 回流方法可將電容式傳聲器5〇〇粘結在主pCB 2〇〇 (例如， 可檇式電活的PCB)上。為此，連接端子52〇、522形成有 連接至Vdd的圓形端子422和圓形接地端子52〇,該圓形接 地端子520形成為在端子522外側以規則的間隔分開。 為了避免重複’將簡化對根據本發明第二優選實施例 1268111 的電容式傳聲器的操作的詳細描述 工業適應性 如上所述’在音孔形成在PCB上而不是電容式傳聲器 的殼體上之後，本發明的電容式傳聲器由通過主pcB的通 孔傳導的聲壓進行操作。因此，極大地改進了主pcB的安 裝環境。即’即使在本發明電料傳聲器安裝其上的主pcB 的元件安裝區域按照需要朝向電子產品的内側的情況下， 由於聲波傳導路徑較短，因此音質仍可轉在良好 。 儘管已Γ、ϊ=Γ為最實用且優選的實施例描： 了本發明，但疋應該理解，本發明並不限 例，而且相反，其試圖涵蓋包含於所附^ 開的貝施 範圍内的各種修改及等同結構。 萑，要求的精神和 【圖式簡單說明】 聲器的立 第一圖為表示安裝于傳統的主PCB上的電容式傳 體圖， 、 第二圖為表示安裝于傳統駐PCB上的電 私奋式傳琴器的側 視圖， 第三圖為表示根據本發明的安裝於主pCB : ㈣iLM ; 的電容式傳聲The terminals 420, 422 are formed on the exposed side of the PCB 418, so that the capacitive return value can be made by the SMD 1268111 reflow method, and the electrical connection is 400 bonded to the main PCB 2〇〇 (removable telephone) On the PCB). A + j is, for example, the same structure as shown in the fifth figure for the connection terminals 420, 422 I. Zhuo "There are 14 re-transporting dice 420, 422 forming a circular terminal 422 with Yuan Vdd to be connected to the sinus ground terminal 42 〇 to form the outer side of the sub-sub 422 at regular intervals. X horse at the end: face In the description of the sheep, the field, the capacitance of the present invention will become clear. When the terminals 420, 422 of the capacitive value of the present invention are connected to the main PCB 200 and to the Vdd and When power is supplied, the diaphragm 412b is connected to the PCB 418 through the pole 412a and the second metal ring 41fi, and the back plate 408 is electrically connected through the first metal ring 406 and the shell 々 4 〇 2 On the PCB 418. Under the above-mentioned situation, when the user speaks to the condenser microphone, the pressure passes through the through holes 2 of the main PCB 200, 屯prD^, ^(3)2 and the sound hole 418a of the pCB 418. The ruthenium is applied to the diaphragm 412b. At this time, the gap between the diaphragm 412b and the backing plate 408 is changed and swelled under the action of the pressure, and is formed by the diaphragm 412b and the backing plate. The capacitance changes. The change from the capacitance is based on the acoustic wave to obtain the change of the electrical signal (voltage). The electrical signal is transmitted through the above electrical connection line w418 'on the IC' for amplification. The amplified signal is inverted by the connection terminal, 422 is conducted to the main PCB 200. [Second embodiment] The eighth figure shows the electric valley type pyramider according to the present invention A side cross-sectional view of a second preferred embodiment, and a ninth diagram A is an exploded perspective view of a second preferred embodiment of a condenser microphone according to the present invention. He 8111: Knowing the eighth and ninth In the figure, the condenser microphone 500 of the present invention includes a casing 5502 having one side open and the other side closed; the first metal ring 5〇δ, inserted into the casing 502 to be electrically connected to the back (four) 8; The back plate has, has a sound hole 508a; a thin annular gasket 51〇; a cylindrical insulating ring 514, a later uneven portion 514a, 514b', and an open top and an open bottom, electrical insulation function and mechanical inspection function; The diaphragm element 512, the insulating ring 514, and facing the back plate, while the associated piece (four) is interposed between the diaphragm 512 and the back plate 5〇8; the second gold = 16 'for The diaphragm element 512 is electrically connected to the pcB 518, and the diaphragm element 5 is mechanically supported. And a pcB 518 having a component mounted thereon and having a sound hole gamma. The first metal ring (10), the back plate 5〇8, the spacer 510, the insulating ring 514, the diaphragm element 512, and the genus The ring (four) and the PCB 518 are sequentially stacked on the housing towel. Then, in order to form an element, the open end of the case is crimped. The film element 512 is formed with a very large percentage electrically connected to the PCB 518. The 512am is vibrated under the action of sound pressure, and the back sheet 5〇8 is formed by thermally bonding an organic film having an electret on a metal plate. Further, since the connection terminals 520, 522 which protrude outward from the curled side of the body 502 are formed on the exposed side of the 518 518, the condenser microphone 5 〇〇 can be bonded to the main pCB by the reflow method. 2〇〇 (for example, a portable electro-active PCB). To this end, the connection terminals 52A, 522 are formed with a circular terminal 422 connected to Vdd and a circular ground terminal 52A, the circular ground terminal 520 is formed To be separated at regular intervals outside the terminal 522. To avoid repetition, a detailed description of the operation of the condenser microphone according to the second preferred embodiment 1268111 of the present invention will be simplified. Industrial adaptability is as described above. Instead of the housing of the condenser microphone, the condenser microphone of the present invention is operated by the sound pressure conducted through the through hole of the main pcB. Therefore, the installation environment of the main pcB is greatly improved. That is, even in the present invention In the case where the component mounting area of the main pcB on which the microphone is mounted is directed toward the inside of the electronic product as needed, the sound quality can still be turned well due to the short acoustic path. The present invention is described as the most practical and preferred embodiment, but it should be understood that the invention is not limited thereto, but rather, it is intended to cover various modifications within the scope of the appended Equivalent structure. 萑, the spirit of the request and the [simplified description of the figure] The first picture of the sounder represents the capacitive type body diagram mounted on the traditional main PCB, and the second figure shows the installation on the traditional station PCB. Side view of the electric self-propelled musical instrument, the third figure shows the capacitive sound transmission mounted on the main pCB according to the invention: (iv) iLM;
第四圖為表示根據本發明的安裝於主prD ㈤· 王PCB上的電容式傳聲 器的側視圖， 、丨寻耳 第五圖為表示根據本發明的電容式值爽。。 、得耷态的外視圖； 1268111 第六圖為表示根據本發明的電容式傳聲器的第一優選實施 • 例的侧剖視圖； ^ 第七圖為表示根據本發明的電容式傳聲器的第一優選實施 例的分解立體圖； 第八圖為表示根據本發明的電容式傳聲器的第二優選實施 例的侧剖視圖，以及 第九圖為表示根據本發明的電容式傳聲器的第二優選實施 例的分解立體圖。 【主要元件符號說明】 電容式傳聲器· · · · 10 外殼........12 音孔........12a 印刷電路板（PCB) · · 14The fourth figure is a side view showing a condenser microphone mounted on the main prD (5)· Wang PCB according to the present invention, and the fifth drawing shows the capacitive value according to the present invention. . 2681 is a side cross-sectional view showing a first preferred embodiment of the condenser microphone according to the present invention; and the seventh figure is a first preferred embodiment showing the condenser microphone according to the present invention. An exploded perspective view of an example; an eighth perspective view showing a second preferred embodiment of the condenser microphone according to the present invention, and a ninth perspective view showing a second preferred embodiment of the condenser microphone according to the present invention. [Explanation of main component symbols] Capacitive microphone · · · · 10 Case........12 Sound hole........12a Printed circuit board (PCB) · · 14
主 PCB · · · · • · · 20 接觸端子· · · 14a 、14b 元件安裝區域· • · · 20a 元件安裝區域相對侧 • 20b 電容式傳聲器· • · · 100 主 PCB...... • 200 1^孑匕..... • · · 202 元件安裝區域· · · • 202a 元件安裝區域· • · 200a 音孔....... •110a PCB..... • · · 110 殼體....... • 102 連接端子·· · 112 、 114 電容式傳聲器·· · • 300 電連接電極·· 306 、 308 殼體....... • 302 音孔..... • · · 304 排放槽······ • 310 殼體..... • · · 402 弟一金屬環· · · · • 406 背板..... • · · 408 音孔....... • 408a 薄環形墊片·· • · · 410 絕緣環...... • 414 13 d 1268111 膜片元件......412 • PCB........418 ^ 極壞.......412a 連接端子· · · 420、422 電容式傳聲器· · · · 500 第一金屬環.....506 音孔.......508a 絕緣環.......514 膜片元件·.....512 PCB........518 殼體........502 ^ 膜片.......512b _ 第二金屬環· · · · · 416 音孔........418a 膜片........412b 電容式傳聲器· · · · 400 殼體........502 背板........508 墊片........510 不平部分··· 514a、514b 第二金屬環.....516 音孔........518a 極環........512a 連接端子· · · 520、522 14Main PCB · · · · • · · 20 Contact terminals · · · 14a , 14b Component mounting area · • · · 20a Component mounting area opposite side • 20b condenser microphone · • · · 100 main PCB... 200 1^孑匕..... • · · 202 Component mounting area · · · • 202a Component mounting area · • · 200a sound hole.... • 110a PCB..... • · · 110 Housing ..... 102 Connection terminal ·· · 112 , 114 Capacitive microphone ·· · • 300 Electrical connection electrode ·· 306 , 308 Housing ........ • 302 sound hole.. ... • · · 304 Drainage Tank······· 310 Housing ..... • · · 402 Brother-Metal Ring · · · · • 406 Backplane..... • · · 408 Hole....... • 408a Thin Ring Gasket ·· • · · 410 Insulation Ring... • 414 13 d 1268111 Diaphragm Components...412 • PCB..... ...418 ^ Extremely bad.......412a Connection terminal · · · 420, 422 Capacitive microphone · · · · 500 First metal ring.....506 Sound hole....... 508a Insulation Ring.......514 Diaphragm Components·.....512 PCB........518 Housing........502 ^ Diaphragm..... ..512b _ second gold圈 · · · · · 416 sound hole ..... 418a diaphragm ..... 412b condenser microphone · · · · 400 housing ..... 502 back Board ..... 508 shims........510 uneven parts··· 514a, 514b second metal ring ..... 516 sound hole ..... 518a Polar ring ..... 512a connection terminal · · · 520, 522 14