[go: up one dir, main page]

TWI263251B - Electronic component, mounted structure, electro-optical device, and electronic device - Google Patents

Electronic component, mounted structure, electro-optical device, and electronic device

Info

Publication number
TWI263251B
TWI263251B TW094111058A TW94111058A TWI263251B TW I263251 B TWI263251 B TW I263251B TW 094111058 A TW094111058 A TW 094111058A TW 94111058 A TW94111058 A TW 94111058A TW I263251 B TWI263251 B TW I263251B
Authority
TW
Taiwan
Prior art keywords
electronic component
electro
electronic
conductive film
mounted structure
Prior art date
Application number
TW094111058A
Other languages
English (en)
Other versions
TW200535921A (en
Inventor
Atsushi Saito
Shuichi Tanaka
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200535921A publication Critical patent/TW200535921A/zh
Application granted granted Critical
Publication of TWI263251B publication Critical patent/TWI263251B/zh

Links

Classifications

    • H10W72/20—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F6/00—Air-humidification, e.g. cooling by humidification
    • F24F6/12—Air-humidification, e.g. cooling by humidification by forming water dispersions in the air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/0008—Control or safety arrangements for air-humidification
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/30—Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
    • F24F8/20—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by sterilisation
    • F24F8/22—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by sterilisation using UV light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F2110/00—Control inputs relating to air properties
    • F24F2110/20—Humidity
    • H10W70/655—
    • H10W72/221—
    • H10W72/223—
    • H10W72/232—
    • H10W72/245—
    • H10W72/251—
    • H10W72/253—
    • H10W72/255—
    • H10W72/90—
    • H10W72/9415—
    • H10W72/952—
    • H10W74/15—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW094111058A 2004-04-16 2005-04-07 Electronic component, mounted structure, electro-optical device, and electronic device TWI263251B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004121645A JP3873986B2 (ja) 2004-04-16 2004-04-16 電子部品、実装構造体、電気光学装置および電子機器

Publications (2)

Publication Number Publication Date
TW200535921A TW200535921A (en) 2005-11-01
TWI263251B true TWI263251B (en) 2006-10-01

Family

ID=34940754

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094111058A TWI263251B (en) 2004-04-16 2005-04-07 Electronic component, mounted structure, electro-optical device, and electronic device

Country Status (6)

Country Link
US (1) US7166920B2 (zh)
EP (1) EP1587142A1 (zh)
JP (1) JP3873986B2 (zh)
KR (1) KR100699666B1 (zh)
CN (1) CN1683961A (zh)
TW (1) TWI263251B (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100573839C (zh) * 2005-04-14 2009-12-23 松下电器产业株式会社 电子电路装置及其制造方法
JP4221606B2 (ja) 2005-06-28 2009-02-12 セイコーエプソン株式会社 半導体装置の製造方法
JP4284544B2 (ja) 2005-06-29 2009-06-24 セイコーエプソン株式会社 半導体装置及びその製造方法
JP4269173B2 (ja) 2005-07-06 2009-05-27 セイコーエプソン株式会社 半導体装置及びその製造方法
JP4224717B2 (ja) 2005-07-11 2009-02-18 セイコーエプソン株式会社 半導体装置
JP4645832B2 (ja) * 2005-08-02 2011-03-09 セイコーエプソン株式会社 半導体装置及びその製造方法
JP4708148B2 (ja) 2005-10-07 2011-06-22 ルネサスエレクトロニクス株式会社 半導体装置
JP4305667B2 (ja) 2005-11-07 2009-07-29 セイコーエプソン株式会社 半導体装置
JP4862390B2 (ja) * 2005-12-20 2012-01-25 セイコーエプソン株式会社 電子基板の製造方法
JP4887948B2 (ja) * 2006-07-10 2012-02-29 セイコーエプソン株式会社 半導体装置及び半導体モジュール
US7514799B2 (en) * 2006-07-26 2009-04-07 Lotes Co., Ltd. Connecting structure used in a chip module
JP4273356B2 (ja) * 2007-02-21 2009-06-03 セイコーエプソン株式会社 半導体装置の製造方法
JP4572376B2 (ja) * 2007-07-30 2010-11-04 セイコーエプソン株式会社 半導体装置の製造方法および電子デバイスの製造方法
JP4353289B2 (ja) 2007-08-20 2009-10-28 セイコーエプソン株式会社 電子デバイス及び電子機器
TWI329221B (en) * 2007-09-04 2010-08-21 Au Optronics Corp Touch panel
JP4645635B2 (ja) * 2007-11-02 2011-03-09 セイコーエプソン株式会社 電子部品
JP4462332B2 (ja) * 2007-11-05 2010-05-12 セイコーエプソン株式会社 電子部品
TWI364146B (en) * 2008-03-27 2012-05-11 Taiwan Tft Lcd Ass Contact structure and connecting structure
TWI377632B (en) * 2008-03-27 2012-11-21 Taiwan Tft Lcd Ass Contact structure and forming method thereof and connecting structure thereof
WO2010013530A1 (ja) * 2008-07-28 2010-02-04 シャープ株式会社 表示パネル及びそれを備えた表示装置
JP2010093674A (ja) * 2008-10-10 2010-04-22 Epson Toyocom Corp 圧電デバイス及び圧電基板の製造方法
KR101185859B1 (ko) 2010-10-19 2012-09-25 에스케이하이닉스 주식회사 반도체 패키지용 범프, 상기 범프를 갖는 반도체 패키지 및 적층 반도체 패키지
KR101594484B1 (ko) * 2012-11-20 2016-02-16 제일모직주식회사 이방성 도전 필름 및 반도체 장치
CN105259720B (zh) * 2015-10-23 2018-11-27 深超光电（深圳）有限公司 阵列基板以及使用该阵列基板的显示面板
KR102581793B1 (ko) 2016-09-01 2023-09-26 삼성디스플레이 주식회사 회로 기판, 이를 포함하는 표시 장치 및 회로 기판의 제조 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027435A (ja) 1988-06-25 1990-01-11 Nec Corp 金属パンプ電極を有する半導体装置
JPH02272737A (ja) * 1989-04-14 1990-11-07 Citizen Watch Co Ltd 半導体の突起電極構造及び突起電極形成方法
JPH05251455A (ja) * 1992-03-04 1993-09-28 Toshiba Corp 半導体装置
JP2809088B2 (ja) * 1994-01-31 1998-10-08 カシオ計算機株式会社 半導体装置の突起電極構造およびその突起電極形成方法
US5427382A (en) * 1994-05-09 1995-06-27 Pate; Elvis O. Repair kit for three-dimensional animal targets
US5707902A (en) * 1995-02-13 1998-01-13 Industrial Technology Research Institute Composite bump structure and methods of fabrication
TW324847B (en) * 1996-12-13 1998-01-11 Ind Tech Res Inst The structure of composite bump
JPH11233545A (ja) * 1997-11-10 1999-08-27 Citizen Watch Co Ltd 半導体装置とその製造方法
EP1186035A1 (de) * 1999-06-17 2002-03-13 Infineon Technologies AG Elektronisches bauelement mit flexiblen kontaktierungsstellen und verfahren zum herstellen eines derartigen bauelements
JP2001110831A (ja) 1999-10-07 2001-04-20 Seiko Epson Corp 外部接続突起およびその形成方法、半導体チップ、回路基板ならびに電子機器
JP4362996B2 (ja) * 2001-08-22 2009-11-11 富士ゼロックス株式会社 格子状配列構造の圧電／電歪アクチュエータ及びその製造方法
JP2003068777A (ja) 2001-08-28 2003-03-07 Sharp Corp 粘性物質転写装置および粘性物質転写方法
JP3969295B2 (ja) 2002-12-02 2007-09-05 セイコーエプソン株式会社 半導体装置及びその製造方法と回路基板及び電気光学装置、並びに電子機器

Also Published As

Publication number Publication date
JP2005310815A (ja) 2005-11-04
EP1587142A1 (en) 2005-10-19
KR100699666B1 (ko) 2007-03-23
US20050230773A1 (en) 2005-10-20
TW200535921A (en) 2005-11-01
KR20060045689A (ko) 2006-05-17
US7166920B2 (en) 2007-01-23
JP3873986B2 (ja) 2007-01-31
CN1683961A (zh) 2005-10-19

Similar Documents

Publication Publication Date Title
TWI263251B (en) Electronic component, mounted structure, electro-optical device, and electronic device
TW200603308A (en) Semiconductor device, circuit substrate, electro-optic device and electronic appliance
TWI266394B (en) Semiconductor device and method of fabricating the same
TW200742249A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
TW200620502A (en) Semiconductor device, circuit board, electro-optic device, electronic device
TW200625564A (en) Method for manufacturing wafer level chip scale package using redistribution substrate
WO2009066504A1 (ja) 部品内蔵モジュール
TW200705643A (en) Method of manufacturing semiconductor device
TW200511534A (en) Tape circuit substrate and semiconductor chip package using the same
EP2006908A3 (en) Electronic device and method of manufacturing the same
JP2009141169A5 (zh)
TW200802828A (en) Semiconductor device
SG148987A1 (en) Inter-connecting structure for semiconductor device package and method of the same
DE60219161D1 (de) Integration optoelektronischer bauelemente
WO2009028596A1 (ja) 受動素子内蔵基板、製造方法、及び半導体装置
WO2005112113A3 (en) Mounting with auxiliary bumps
TW200744180A (en) Stack structure of circuit board having embedded with semiconductor component
TW200731433A (en) Semiconductor device and manufacturing method for the same
TW200625475A (en) Package structure and fabrication method thereof
TW200802647A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
TW200603352A (en) Semiconductor device
TW200721418A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronlc device
TWI256708B (en) Flip-chip package, and flip-chip packaging method
TW200632993A (en) Electronic component, electro-optical device, and electronic apparatus
TW200603300A (en) Chip structure

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent