1261364 九、發明說明： 【發明所屬之技術領域】 本發明係有關於指紋感測器（fingerprint sensor)之底 部散熱技術，特別係有關於一種散熱型感測器封裝構造。 【先前技術】 習知感測器之封裝技術係以封膠體適當保護感測器 及其電連接元件，但其有著散熱不佳之問題。1261364 IX. Description of the Invention: [Technical Field] The present invention relates to a bottom heat dissipation technology of a fingerprint sensor, and more particularly to a heat dissipation type sensor package structure. [Prior Art] The packaging technology of the conventional sensor appropriately protects the sensor and its electrical connection elements with a sealant, but it has a problem of poor heat dissipation.
如第1圖所示，一種習知指紋感測器封裝構造1〇〇係 包含有一基板11 〇、一感測晶片i2〇及一封膠體13〇。該 感測晶片120係具有一感測區121，以供觸滑式（swipetype) 感測指紋。該感測晶片12〇係設置於該基板11〇上，並以 複數個銲線140電性連接該感測晶片12〇與該基板11〇。 該封膠體130係形成於該基板11〇上，以密封該些銲線14〇 與該感測晶片120之局部，但顯露該感測區121。該基板 丄1〇係具有複數個外連接墊lu。該指紋感測器封裝構造 100係藉由錫膏使該些外連接墊U1銲接至_外部電路 板。然而，該指紋感測器封裝構造100係有散熱不佳、無 法控制銲接間隔且該基板110容易翹曲之問題。 【發明内容】 :發明之主要目的係在於提供一種散熱型感測器封 其包含之一基板係具有一上表面及-下表面，該 I表面係形成有複數個外連接墊，—感測元件 上表面並電性連接至該基板，且-散熱片係設置 基板之該下表面’該散熱片係具有至少-缺口，以顯 5 1261364 該基板之該些外連接墊，其係可增進該感測器之底部散 j可防止該基板勉曲，並且藉由該散熱片係可控制該感 為封裝構造接合至一外部電路板之間隔高度。 露 献 * 測 本發明之次一目的係在於提 1 裡散熱型感測器封 裝構造，其中在一美你夕―丁主 ^ 土板 下表面係貼設有一散熱片，其 係具有複數個對稱缺口，例如該散熱片可為Η型或是雙T 型，以強化該基板之結構強度。As shown in Fig. 1, a conventional fingerprint sensor package structure 1 includes a substrate 11 一, a sensing wafer i2 〇 and a gel 13 〇. The sensing wafer 120 has a sensing region 121 for swipe type sensing fingerprints. The sensing wafer 12 is disposed on the substrate 11A and electrically connected to the sensing wafer 12A and the substrate 11A by a plurality of bonding wires 140. The encapsulant 130 is formed on the substrate 11 to seal the portions of the bonding wires 14 and the sensing wafer 120, but the sensing region 121 is exposed. The substrate has a plurality of external connection pads lu. The fingerprint sensor package structure 100 solders the outer connection pads U1 to the external circuit board by solder paste. However, the fingerprint sensor package construction 100 has a problem of poor heat dissipation, inability to control the soldering interval, and the substrate 110 being easily warped. SUMMARY OF THE INVENTION The main object of the invention is to provide a heat-dissipating sensor package comprising a substrate having an upper surface and a lower surface, the I surface being formed with a plurality of external connection pads, the sensing component The upper surface is electrically connected to the substrate, and the heat sink is disposed on the lower surface of the substrate. The heat sink has at least a notch to display the outer connecting pads of the substrate. The bottom of the detector prevents the substrate from being distorted, and the heat sink can control the sense of the height of the package structure to be bonded to an external circuit board.露献* The second purpose of the invention is to provide a heat-dissipating sensor package structure, in which a heat sink is attached to the lower surface of the sleek main body, which has a plurality of symmetry. The gap, for example, the heat sink may be a Η type or a double T type to strengthen the structural strength of the substrate.
本發明之再-目的係在於提供一種散熱型感測器封 裝構造，其係在-基板之—下表面設置有—具有缺口之散 熱片’且在該下表面係接合有複數個銲球，該些銲球係不 犬出於该散熱片’以在表面接合前防止該些銲球被碰傷。 本發月之種政熱型感測器封裝構造主要包含一基 板、一感測元件、複數個電連接元件、一封膠體以及一散 熱片。該基板係具有-上表面以及—下表面，該下表面係 心成有複數個外連接塾。該感測元件係設置於該基板之該 上表面，4感測元件係具有一感測區。該些電連接元件係 電性連接該基板與該感測元件。該封膠體係形成於 该基板 之4上表面，以密封該些電連接元件。該散熱片係貼設於 該基板之該下表面，該散熱片係具有至少一缺口，以顯露 該基板之該些外連接墊，以供複數個銲球接合。 【實施方式】 请參閱第2圖，在本發明之第一具體實施例中，一散 熱型感測器封裝構造200主要包含有一基板21〇、一感測 7G件220、複數個電連接元件23〇、一封膠體24〇以及一 1261364 月欠熱片250。該基板210係具有一上表面211以及一下表 面212,且在該下表面212係形成有複數個外連接墊213， 在該上表面211係形成有複數個内連接墊214,該基板210 係可為雙面電性導通之陶瓷基板或是印刷電路板。 該感測元件220係設置於該基板210之該上表面 211，該感測元件22〇係具有一感測區221以及複數個銲 墊222。在本實施例中，該感測元件22〇係為一觸滑式 (swipe type)指紋感測器晶片。在本實施例中，該感測元件 _ 220係具有一主動面223及一背面224，且該感測區221 與該些銲墊222係形成於該主動面223。 4些電連接元件230係電性連接該基板210與該感測 兀件220。在本實施例中，該些電連接元件23〇係為打線 形成之銲線，其係連接該基板21〇之該些内連接墊214與 該感測元件220之該些銲墊222。 該封膠體240係可利用點膠或壓模等技術形成於該基 _ 板210之該上表面211，以密封該些電連接元件230，並 且該封膠體240係不覆蓋該感測元件22〇之該感測區 221。在本實施例中，該封膠體24〇係包覆該感測元件22〇 之侧面以及該主動面223之部分。 如第2及3圖所示，該散熱片25〇係具有至少一缺口 251 ’该散熱片250其係可運用黏膠、焊接與共晶接合等 方式设置於該基板210之該下表面212，以增進該感測器 封裝構造200之底部散熱並可防止該基板翹曲，且該散熱 片250之該缺口 251係顯露該基板21〇之該些外連接墊 7 1261364 2口’以供複數個銲球26〇之接合。此外藉由具有該缺 口 251之該散熱片25〇係可控制該感測器封裝構造2⑹接A further object of the present invention is to provide a heat dissipation type sensor package structure in which a heat sink having a notch is provided on a lower surface of a substrate, and a plurality of solder balls are bonded to the lower surface. These solder balls are not for the heat sink 'to prevent the solder balls from being bumped before the surface is bonded. The genre thermal sensor package structure of the present month mainly comprises a substrate, a sensing component, a plurality of electrical connecting components, a gel and a heat sink. The substrate has an upper surface and a lower surface, the lower surface being centered into a plurality of outer joints. The sensing component is disposed on the upper surface of the substrate, and the sensing component has a sensing region. The electrical connection elements are electrically connected to the substrate and the sensing element. The encapsulation system is formed on the upper surface of the substrate 4 to seal the electrical connection elements. The heat sink is attached to the lower surface of the substrate, and the heat sink has at least one notch to expose the outer connecting pads of the substrate for bonding a plurality of solder balls. [Embodiment] Referring to FIG. 2, in a first embodiment of the present invention, a heat dissipation type sensor package structure 200 mainly includes a substrate 21A, a sensing 7G device 220, and a plurality of electrical connection elements 23. 〇, a colloid 24 〇 and a 12613364 owed hot film 250. The substrate 210 has an upper surface 211 and a lower surface 212. The lower surface 212 is formed with a plurality of outer connecting pads 213. The upper surface 211 is formed with a plurality of inner connecting pads 214. A ceramic substrate or a printed circuit board that is electrically conductive on both sides. The sensing component 220 is disposed on the upper surface 211 of the substrate 210. The sensing component 22 has a sensing region 221 and a plurality of pads 222. In this embodiment, the sensing element 22 is a swipe type fingerprint sensor wafer. In this embodiment, the sensing element _220 has an active surface 223 and a back surface 224, and the sensing region 221 and the pads 222 are formed on the active surface 223. The electrical connection elements 230 are electrically connected to the substrate 210 and the sensing element 220. In the present embodiment, the electrical connection elements 23 are wire bonds formed by wires, which are connected to the inner connection pads 214 of the substrate 21 and the pads 222 of the sensing element 220. The encapsulant 240 can be formed on the upper surface 211 of the base plate 210 by a technique such as dispensing or compression molding to seal the electrical connection elements 230, and the encapsulant 240 does not cover the sensing element 22〇. The sensing area 221. In the present embodiment, the encapsulant 24 is wrapped around the side of the sensing element 22 and the portion of the active surface 223. As shown in FIGS. 2 and 3, the heat sink 25 has at least one notch 251'. The heat sink 250 can be disposed on the lower surface 212 of the substrate 210 by means of adhesive, soldering, and eutectic bonding. The heat dissipation at the bottom of the sensor package structure 200 is enhanced to prevent the substrate from being warped, and the notch 251 of the heat sink 250 exposes the outer connection pads 7 1261364 2 of the substrate 21 for a plurality of The bonding of the solder balls 26〇. In addition, the sensor package structure 2 (6) can be controlled by the heat sink 25 having the opening 251.
外。卩電路板之間隔高度。較佳地，該散熱片係 具T複數個對稱缺口 251，例如該散熱片25〇係可為η型 或疋雙丁型，以強化該基板210之結構強度。在本實施例 中j該些料260係不突出於該散熱片25()，以在表面接 合該散熱型感測器封裝構造2⑽至—外部印刷電路板之前 防止該些銲球26G被碰傷。再者，在表面接合之後，藉由 該散熱片250可接觸於—外部電路板，使得該散熱型感測 器封裝構造200不易傾斜與偏移。 因此，該散熱型感測器封襄構造200係以該具有缺口 251之散熱片250貼設於該基板21〇之該下表面，可 以達到增進該感測元件22G之底部散熱、防止該些銲球26〇 被碰傷並可防止該基板21〇翹曲之功效。 此外在本發明之第：具體實施例巾係揭露另一種產 品型態之散熱型感測器封|構造则。如第5及6圖所示， 該散熱型感測器封裝構造3〇〇係主要包含有一基板31〇、 -感測元件320、-封膠體細以及—散熱片剔。在該 基板310之-上表面311係設置有該感測元件似並使 該感測元件320電性連接至該基板31()。在本實施例中， 該感測元件320係為一種魍始彳, 禋觸按式（touch type)指紋感測器陶 竞基板’其係具有一顯露可供手指觸按之感測區。該封膠 請係形成於該基板310之該上表面3ιι，以局部密封 該感測元件320及電連接分杜土认f 电連接7C件（圓未繪出）。該散熱片34〇 .1261364 係貼設於該基板310之該下表面312，利用該散熱片3扣 之至少一缺口 341使該散熱片不覆蓋位在該基板31〇之下 表面3 12之複數個外連接墊3丨3，可供複數個銲球之接合。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準’任肖熟知此項技藝*，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本發明之保護範 圍。 【圖式簡單說明】outer.间隔 The height of the board. Preferably, the heat sink has a plurality of symmetrical notches 251. For example, the heat sink 25 may be of an n-type or a double-twist type to strengthen the structural strength of the substrate 210. In the present embodiment, the materials 260 are not protruded from the heat sink 25 () to prevent the solder balls 26G from being scratched before the surface is bonded to the heat-dissipating sensor package structure 2 (10) to the external printed circuit board. . Moreover, after the surface bonding, the heat sink 250 can be contacted with the external circuit board, so that the heat sink type sensor package structure 200 is less inclined and offset. Therefore, the heat-dissipating sensor sealing structure 200 is configured such that the heat sink 250 having the notch 251 is attached to the lower surface of the substrate 21 to improve the heat dissipation of the bottom of the sensing component 22G and prevent the soldering. The ball 26 is bumped and can prevent the substrate 21 from warping. Further, in the first aspect of the present invention, the heat radiation type sensor package structure of another product type is disclosed. As shown in FIGS. 5 and 6, the heat-dissipating sensor package structure 3 mainly includes a substrate 31, a sensing element 320, a sealing body, and a heat sink. The sensing element is disposed on the upper surface 311 of the substrate 310 and electrically connected to the substrate 31 (). In the present embodiment, the sensing element 320 is a type of touch sensor, and the touch type fingerprint sensor has a sensing area for revealing a finger touch. The encapsulant is formed on the upper surface 3 of the substrate 310 to partially seal the sensing element 320 and the electrical connection. The electrical connection 7C (circle not shown). The heat sink 34 126 .1261364 is attached to the lower surface 312 of the substrate 310, and the heat sink 3 is not covered by the heat sink 3 to cover the bottom surface of the substrate 31 An outer connecting pad 3丨3 can be used for joining a plurality of solder balls. The scope of the present invention is defined by the scope of the appended claims. Any changes and modifications made without departing from the spirit and scope of the present invention are protected by the present invention. range. [Simple description of the map]
第1圖··習知指紋感測器封裝構造之截面示意圖。 第2圖依據本發明之第一具體實施例，一種散熱型感測 器封裝構造之截面示意圖。 第3圖：依據本發明之第一具體實施例，該散熱型感測器 封裝構造之下表面示意圖。 第4圖·依據本發明之第一具體實施例，該散熱型感測器 封裝構造之上表面示意圖。 第5圖：依據本發明之第二具體實施例，另一種散熱型感 測器封裝構造之上表面示意圖。 第6圖：依據本發明之第二具體實㈣，該散熱型感測器 封裝構造之下表面示意圖。 【主要元件符號說明】 100指紋感測器封裝構造 110基板 12 0感測晶片 130封膠體 111外連接墊 121感測區 140銲線 9 螓1261364 200指紋感測器封裝構造 210 基板 211 上表面 212 下表面 213 外連接墊 214 内連接墊 220 感測元件 221 感測區 222 銲墊 223 主動面 224 背面 230 電連接元件 240 封膠體 250 散熱片 251 缺口 260 鮮球 300 指紋感測器封裝構造 310 基板 311 上表面 312 下表面 313 外連接墊 320 感測元件 330 封膠體 340 散熱片 341 缺口Fig. 1 is a schematic cross-sectional view showing a conventional fingerprint sensor package structure. Fig. 2 is a cross-sectional view showing a package structure of a heat radiation type sensor in accordance with a first embodiment of the present invention. Figure 3 is a schematic illustration of the underlying surface of the heat sink type sensor package construction in accordance with a first embodiment of the present invention. Fig. 4 is a schematic view showing the upper surface of the heat dissipation type sensor package structure according to the first embodiment of the present invention. Fig. 5 is a top plan view showing another heat dissipating type sensor package structure in accordance with a second embodiment of the present invention. Figure 6 is a schematic view showing the surface of the heat-dissipating sensor package structure according to the second embodiment of the present invention. [Main component symbol description] 100 fingerprint sensor package structure 110 substrate 12 0 sensing wafer 130 encapsulant 111 outer connection pad 121 sensing area 140 bonding wire 9 螓 12613364 200 fingerprint sensor package structure 210 substrate 211 upper surface 212 Lower surface 213 outer connection pad 214 inner connection pad 220 sensing element 221 sensing area 222 pad 223 active surface 224 back side 230 electrical connection element 240 encapsulant 250 heat sink 251 notch 260 fresh ball 300 fingerprint sensor package construction 310 substrate 311 upper surface 312 lower surface 313 outer connection pad 320 sensing element 330 encapsulant 340 heat sink 341 notch
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