TWI243905B - Thin-film testing tooling and testing method - Google Patents
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Abstract
Description
1243905 五、發明說明（1) 【發明所屬之技術領域】 本發明係關於一種測試治具及測試方法，尤指一種用 以測試記憶體模組等電子元件之電性的薄膜式測試治具及 測試方法。 【先前技術】 對目前已大量採用於半導體產品的記憶體模組或其他 電子元件而言，為確保其使用效能，常會於生產過程中進 行多次測試，以檢測其良率與電性，進而挑選出不良產品 予以廢棄。例如，晶片產業所進行的記憶體晶片測試、完 成封裝後的封裝可靠度測試、或完成模組化後的卡式記憶 體模組測試等，均屬產品化前所必要進行的檢測步驟。 對記憶體模組之測試技術而言，一般係將待測記憶體 模組接置且電性連接至一測試治具上，以藉該測試治具將 該記憶體模組上之訊號傳送至例如印刷電路板等測試板 上，並藉該測試板與該記憶體模組之電性導通關係測試該 記憶體模組之電性良劣，同時，該測試板亦外接一辨識裝 置，以顯示出該測試板與記憶體模組之電性導通狀況，俾 供操作者辨識該記憶體模組之測試結果。 習知測試治具係採自動化之探針電性連接待測記憶體 模組，如第4圖所示，藉兩排測試用之探針40 (Probe)分 別接觸卡式記憶體模組41一側邊之金質銲指部42 (Golden F i nger，俗稱金手指），以檢視該金質銲指部42與記憶體 晶片間的線路電性，完成其良率測試。然而，探針測試最 大的限制在於探針4 0本身佔有一定之尺寸空間，相鄰探針1243905 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a test fixture and a test method, particularly a thin film test fixture for testing the electrical properties of electronic components such as memory modules and Test Methods. [Previous technology] For memory modules or other electronic components that have been widely used in semiconductor products, in order to ensure their use efficiency, multiple tests are often performed in the production process to check their yield and electrical properties, and then Pick out defective products and discard them. For example, the memory chip test performed by the chip industry, the package reliability test after packaging, or the card-type memory module test after modularization are all required inspection steps before productization. For the test technology of a memory module, the memory module to be tested is generally connected and electrically connected to a test fixture, so that the signal on the memory module is transmitted to the test fixture by the test fixture. For example, a test board such as a printed circuit board, and the electrical conductivity of the memory module is used to test the electrical quality of the memory module. At the same time, the test board is externally connected with an identification device to display The electrical continuity between the test board and the memory module is obtained for the operator to identify the test results of the memory module. The conventional test fixture uses an automated probe to electrically connect the memory module under test. As shown in Figure 4, two rows of test probes 40 (Probe) are used to contact the card memory module 41- The gold soldering finger portion 42 (Golden Finger) (commonly known as gold finger) on the side is used to inspect the electrical property of the circuit between the gold soldering finger portion 42 and the memory chip and complete the yield test. However, the biggest limitation of the probe test is that the probe 40 itself occupies a certain size space, and the adjacent probes
17791 旭貿.ptd 第5頁 1243905 五、發明說明（2) 4 0之間距難以縮小，故而無法用以測試銲指部4 之記憶體模組41。而隨著記憶體模組線路之複雜間距過小 面電性連接端或銲指部的密度提升已是必杆化’其表 曰盈縮小的佈設間距顯然使得探針測試再也難符力、，此一 需。再者，採探針40測試尚有導致損及銲指部$產業所 如刮傷）、訊號失真、測試接觸壓力難以精確控表^面（例 點；且此類測試治具由於尚有各元件配合精度、、等缺 針經測試而變形等缺點，更將使得治具之製造。j /骨或探 管且成本難以降低，維修更新亦不盡便利，^ :貝難以控 測試方法取代之。 。而更新式之 因此，相關業界遂發展出其他測試治具，发^17791 Xumao.ptd Page 5 1243905 V. Description of the Invention (2) The distance between 4 and 0 is difficult to reduce, so it cannot be used to test the memory module 41 of the welding finger portion 4. As the complex pitch of the memory module circuit is too small, the density increase of the electrical connection end or the soldering finger part is necessary. Its reduced spacing obviously makes it difficult to test the probe. This is needed. Furthermore, the probe 40 test still causes damage to the welding finger department, such as scratches, signal distortion, and test contact pressure. It is difficult to accurately control the surface (examples; and because such test fixtures still have various Disadvantages of component matching accuracy, such as the lack of needles that are deformed after testing, will even make the fixture. J / bone or probe tube and the cost is difficult to reduce, maintenance and update are not convenient, ^: Shell is difficult to control the test method to replace it ... As a result of the update, the relevant industry has developed other test fixtures.
圖所示之插接式測試方法，提供一例如主機板”係如第5Α 50，該測試板5〇上係設有與該測試板5〇電性 $測試板 座51，每一測試插座51均具有一插槽56，以配=測試插 並列的複數電性連接端子5 2。測試者可將待測雙排間隔 組5 3上具有銲指部5 4之一側朝向該插槽5 6插置之"己隐體模 槽56兩端之扣合件55扣纟，而如第5β 己二C 53插接定位於該插槽56中，俾使該插槽5 /，^肢杈組 接端子52分別與該記憶體模組53上的銲指部2觸== 連接，進而進行該銲指部5 4與記憶體晶片 、“， 括美國專利號案、台二=:包 案、第5 6 1 2 6 3號案、與第564945號案 。第4 92 6 1 9號 一習知插接式測試方法。 寺專利，均已揭示此 此插接式測試方法由於可依記憶體模組^之尺寸與線The plug-in test method shown in the figure provides, for example, a motherboard "series 5A 50". The test board 50 is provided with a test board socket 51 electrically connected to the test board 50, and each test socket 51 Each has a slot 56 with a plurality of parallel electrical connection terminals 5 2 = test plugs in parallel. The tester can place one side of the double row interval group 5 3 to be tested with a solder finger 5 4 side toward the slot 5 6 The “55” snap fasteners at the two ends of the recessed body mold slot 56 are inserted, and as the 5β-Second C 53 is inserted and positioned in the slot 56, so that the slot 5 /, ^ limbs The assembling terminals 52 are respectively connected to the solder finger portion 2 on the memory module 53, and then the solder finger portion 54 is connected to the memory chip, including the U.S. patent case and the second stage =: package case , No. 5 6 1 2 6 3, and No. 564945. No. 4 92 6 1 9 A plug-in test method is known. Temple patents have revealed this plug-in test method because the size and line of the memory module ^
1243905 五、發明說明（3) 路佈局變更該測試插座5 1之設計與該電性連接端子5 2之密 度，復可精密定位該記憶體模組5 3，確實大幅改善了探針 式測試之限制與訊號失真等問題。然而，對插接式測試而 言，其最大缺點在於該測試插座5 1與插槽5 6的使用壽命過 短，每當進行數百次的插接動作後，該插槽5 6内的電性連 接端子5 2即可能受損而需整個更換；且該記憶體模組5 3的 插接拔除過程，更可能導致其銲指部5 4的刮削傷害。再 者，此一測試方法由於必須人工柔巧之插接動作，故而不 易進行精確之自動化，測試速度仍難以大幅提升，且亦有 測試接觸壓力無法控制均勻等操作限制，同樣難符產業界 之量產測試需求。 因此，如何開發一種新式測試治具及測試方法，以連 接包括印刷電路板與習知辨識裝置之測試設備供進行快速 測試，同時，復不致於測試過程中損及待測電子元件，並 可兼顧維修、使用壽命、與接觸壓力均勻等需求，確已為 此相關研發領域所迫切待解之課題。 【發明内容】 有鑑於前述缺憾，本發明之一目的即在提供一種不致 於測試過程中損及待測電子元件的薄膜式測試治具及測試 方法。 本發明之復一目的即在提供一種自動化且可進行快速 測試的薄膜式測試治具及測試方法。 本發明之另一目的即在提供一種便於更替維修的薄膜 式測試治具及測試方法。1243905 V. Description of the invention (3) The layout of the test socket 5 1 is changed and the density of the electrical connection terminal 5 2 can be precisely positioned to accurately locate the memory module 5 3, which greatly improves the probe test. Limitations and signal distortion issues. However, for the plug-in test, the biggest disadvantage is that the service life of the test socket 51 and the socket 56 is too short. After hundreds of plug-in actions are performed, the power in the socket 5 6 The sexual connection terminal 5 2 may be damaged and need to be replaced entirely; and the plugging and unplugging process of the memory module 5 3 may further cause a scraping injury of the welding finger portion 54 thereof. In addition, this test method requires manual and flexible plugging action, so it is not easy to perform accurate automation, the test speed is still difficult to greatly increase, and there are also operating restrictions such as the test contact pressure cannot be controlled uniformly, which is also difficult to meet the industry standards. Mass production test requirements. Therefore, how to develop a new test fixture and test method to connect test equipment including a printed circuit board and a conventional identification device for rapid testing, meanwhile, it will not damage the electronic components under test during the test, and can take into account Demands for maintenance, service life, and uniform contact pressure are indeed urgent issues to be solved in this related research and development field. SUMMARY OF THE INVENTION In view of the foregoing shortcomings, it is an object of the present invention to provide a thin-film test fixture and a test method that do not damage the electronic component under test during the test. Another object of the present invention is to provide a thin-film test fixture and a test method that are automated and capable of rapid testing. Another object of the present invention is to provide a thin-film test fixture and a test method which are convenient for replacement maintenance.
17791 旭貿.ptd 第7頁 1243905 五、發明說明（4) 本發明之再一目的即在提供一種可控制測試時之接觸 壓力均勻的薄膜式測試治具及測試方法。 本發明之又一目的即在提供一種具有極長使用壽命的 薄膜式測試治具及測試方法。 為達前述及其他目的，本發明所提供之薄膜式測試治 具，係用以電性連接一具有電性接點的待測電子元件與一 測試板，係包括：具有至少一定位部的基座，以定位該待 測電子元件；至少一可動件，其表面係設置一具有導電線 路的測試薄膜，以藉該可動件之作動而令該測試薄膜上之 導電線路接觸該待測電子元件上之電性接點，同時，該測 試薄膜上之導電線路係電性連接至該測試板上；以及用以 驅動該可動件作動的驅動單元。 同時，本發明所提出之薄膜式測試方法，其步驟係包 括：提供一待測電子元件，該待測電子元件上係具有電性 接點；提供至少一可動件，其表面係設置一具有導電線路 的測試薄膜，同時，該測試薄膜上之導電線路係電性連接 至一測試板上；定位該待測電子元件，以藉該可動件之作 動而令該測試薄膜上之導電線路接觸該待測電子元件上之 電性接點；以及藉該測試板判別該待測電子元件之測試結 果。 前述之測試薄膜係為一高分子聚合物材料，且該導電. 線路係包括銅質導電凸塊（Bump)與導電跡線，其係均以半 導體微影技術製成，同時，每一導電跡線係分別與一導電 凸塊連接，而相互平行地排列於該測試薄膜之表面，進而17791 Xumao.ptd Page 7 1243905 V. Description of the invention (4) Another object of the present invention is to provide a thin film test fixture and a test method capable of controlling the contact pressure during testing. Another object of the present invention is to provide a thin-film test fixture and a test method with extremely long service life. In order to achieve the foregoing and other objectives, the thin-film test fixture provided by the present invention is used to electrically connect an electronic component to be tested with an electrical contact and a test board, and includes a base having at least one positioning portion. A seat to locate the electronic component under test; at least one movable part, a test film with a conductive circuit is provided on the surface of the movable part, so that the conductive circuit on the test film contacts the electronic component under test by the action of the movable part At the same time, the conductive circuit on the test film is electrically connected to the test board; and a driving unit for driving the movable member to actuate. At the same time, the method of the thin-film test method provided by the present invention includes the steps of: providing an electronic component to be tested, the electronic component having electrical contacts on the electronic component to be tested; providing at least one movable component, and having a conductive surface on the surface. The test film of the circuit, and at the same time, the conductive circuit on the test film is electrically connected to a test board; the electronic component under test is positioned so that the conductive circuit on the test film contacts the target by the action of the movable member. Test the electrical contacts on the electronic component; and use the test board to determine the test results of the electronic component under test. The aforementioned test film is a high-molecular polymer material, and the conductive. The circuit includes copper conductive bumps (Bump) and conductive traces, which are all made by semiconductor lithography technology. At the same time, each conductive trace The lines are connected to a conductive bump, respectively, and are arranged on the surface of the test film in parallel with each other.
17791 旭貿.ptd 第8頁 1243905 五、發明說明（5) 電性連接至該測試板上之測試電路與外接辨識裝置。 因此，當該待測電子元件進行測試時，即可藉由該待 測電子元件之電性接點（例如銲指部）與測試薄膜的接觸導 通關係，形成一電性接點-薄膜導電凸塊-薄膜導電跡線-測試板測試電路之電性連接關係，進而藉此電性連接關係 完成電性測試，判別該電子元件上的短路、斷路及功能特 性狀況，進而發揮保護銲指部、自動化測試、維修容易與 高使用壽命等功效，解決習知測試方法之問題。 【實施方式】 以下係藉由特定的具體實例說明本發明之實施方式， 熟悉此技藝之人士可由本說明書所揭示之内容輕易地瞭解 本發明之其他優點與功效。本發明亦可藉由其他不同的具 體實例加以施行或應用，本說明書中的各項細節亦可基於 不同觀點與應用，在不悖離本發明之精神下進行各種修飾 與變更。 以下實施例均以記憶體模組作為本發明之待測電子元 件範例，惟本發明所提出之測試治具與測試方法亦可適用 於其他具有電性接點的待測電子元件中；同時，本發明之 測試治具係同樣外接至一包括測試板與辨識裝置的習知測 試設備上，此一習知測試設備於以下實施例中將不予贅 述。 本發明之薄膜式測試治具的較佳實施例係如第1 A、1 B 圖所示，包括一基座1 0與位列於該基座1 0兩端的驅動單元 2 0，該基座1 0兩側靠近驅動單元2 0之位置係包括兩例如定17791 Xumao.ptd Page 8 1243905 V. Description of the invention (5) The test circuit and external identification device are electrically connected to the test board. Therefore, when the electronic component under test is tested, an electrical contact-thin film conductive protrusion can be formed by the contact and conduction relationship between the electrical contact (such as a solder finger part) of the electronic component under test and the test film. The block-thin film conductive trace-test board tests the electrical connection relationship of the test circuit, and then uses this electrical connection relationship to complete the electrical test, determine the short circuit, open circuit, and functional characteristics of the electronic component, and then play a role in protecting the soldering fingers, Automated testing, easy maintenance, and high service life help solve problems with conventional testing methods. [Embodiment] The following is a description of specific embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. The following embodiments all take the memory module as an example of the electronic component under test of the present invention, but the test fixture and test method proposed by the present invention can also be applied to other electronic components under test with electrical contacts; meanwhile, The test fixture of the present invention is also externally connected to a conventional test device including a test board and an identification device. This conventional test device will not be described in the following embodiments. The preferred embodiment of the film-type test fixture of the present invention is shown in Figures 1A and 1B, and includes a base 10 and drive units 20 located at both ends of the base 10. The base The positions near the drive unit 2 on both sides of 1 0 include two fixed positions.
17791旭貿.ptd 第9頁 1243905 五、發明說明（6) 位槽之定位部3 1，該驅動單元2 〇則係 驅動開關2 1，且該基座丨〇上復設置 接一具有電磁閥之 之可動件1 1，其係位於該兩定位部=例如可擺動夾固件 2〇軸接，以藉該驅動單元2〇之驅動而間並與該驅動單元 擺動形成一槽狀間隙1 2 ;同時，該測订擺動，進而藉其 係另設置有一作為測試板之用的印刷二冶具之基座i 〇下方 路板3 0上則設計有一外接至辨識裴置路板_ 3 0，該印刷電 路，以進行記憶體模組之測試與結果=圖示）的剛試電 板30與辨識裝置均與習知測試治具識，此一印刷電路 同，此處不再另加詳述。 木之外接測試設備相 本發明之特徵即如第丨3圖所示， 分別黏貼設置一測試薄膜i 5， ' :可動件1 i上 覆於該兩可動之表面，該測試薄==膜15分別包 ，物（p〇iymer)材料，且其表面係如、1為—高分子聚 數組排成-列的導電線路，# 弟=:紅形成有多 塊H (Bump)與—導電跡線1?，而令該氣路均包括一導電凸 ::排列且相互間隔一間距之狀態…數ζ電二線"呈 料；此時…丨鎳合t層（Nl Alloy)之銅材 隙u時，該；:;：：動:牛11受驅Γ動而擺動並形成該槽狀間 間隙12之内：j 如第1C圖所示’部份位於該槽狀 突出於該槽“ Ξ ” ΐ 16與導電跡線17將分別 1接至守印^ ί 的電性連接，俾使該測試薄膜15電性連 Α印刷電路板30上之測試電路。17791 旭 贸 .ptd Page 9 1243905 V. Description of the invention (6) Positioning part 31 of the slot, the drive unit 20 is a drive switch 21, and a solenoid valve is provided on the base. The movable part 1 1 is located at the two positioning parts = for example, the swingable clamp member 20 is shaft-connected to be driven by the driving unit 20 and swings with the driving unit to form a groove-shaped gap 1 2; At the same time, the test order swings, and furthermore, it is provided with a printing base for the test board. The base i 〇 below the road board 30 is designed with an external connection to the identification Pei board _ 30, the printing The circuit for testing and results of the memory module = the diagram) The just-tested electrical board 30 and the identification device are the same as the conventional test fixtures. This printed circuit is the same and will not be described in detail here. The characteristics of the present invention are as follows: as shown in FIG. 3, a test film i 5 is attached to each other. ': The movable member 1 i is overlaid on the two movable surfaces, and the test thin == film 15 respectively. Package material, and its surface system is, for example, 1 is a conductive line in which polymer polymer arrays are arranged in rows. # 弟 =: Red forms a plurality of H (Bump) and-conductive traces 1 ?, So that the gas paths all include a conductive bump :: a state of being arranged and spaced from each other ... a number of z electric wires "presenting; at this time ... 丨 the copper gap of the nickel layer t (Nl Alloy) u At this time, the :::: moving: The cattle 11 are driven to swing and form the gap between the grooves 12: j As shown in FIG. 1C, the portion is located in the groove and protrudes from the groove "Ξ" The 16 and the conductive trace 17 are respectively connected to the electrical connection of the printed circuit board 俾, so that the test film 15 is electrically connected to the test circuit on the printed circuit board 30.
Π791旭貿邛切 第10頁 1243905 五、發明說明（7) 因此，當壤& 3B圖所示，將5己憶體模組之電性測試時，係如第3A、 之定位部31的槽$測記憶體模組25同時置於該基座1〇兩側 位部3 1之間，故’此時由於該兩可動件1 1係設於該兩 件1 1之間；此處=待測記憶體模組25亦將容設於該兩可 憶體（DDR DRam記憶體模組25係以倍率動態隨機存 之卡式模組，且f係為一具有多數個記憶體晶片°26 體晶片26連接之電25之一邊側係形成有整排與該記憶 Finger)。故，當嗲/ ’例如金質銲指部27 (G〇lden 置入該兩可動件/。己體杈組25以其具銲指部27之一侧 21，而藉該兩驅動二驅= : = :接 兩可動件11經擺動形成 了動件11擺冑，以令該 憶體模組，j卑使該測試“ ；5上J觸該待測記 接觸该记憶體模組2 5上之對座 電凸塊1 6分別 圖），此時，該導電薄膜15上‘^、^指部27 (見第3C圖之侧視 模組25形成導通，進而可藉該導w跡ϋ印與該記憶體 測試，並藉該印刷電路二：=(未圖”，完成電性 2 5及銲指部2 7良率。 ”哉I置判別該記憶體模組 本只方也例之驅動單元2 〇择 機構34，該作動機構34係如圖°包括一驅動源33與一作動 源33則為一氣壓缸，故而去=斤示為一搖臂機構，該驅動 該氣壓缸33將驅動該搖二椹，者啟動該驅動開關21時， 動單元20上之兩可動件# 3罐動，進而使輪接於該驅 丁罷動以夾固接觸待測之記憶Π791 Asahi Trading Co., Ltd. Page 10 1243905 V. Description of the Invention (7) Therefore, when the electrical test of the 5 module is shown in Figure 3B, it is as shown in Figure 3A and the positioning section 31. The slot test memory module 25 is simultaneously placed between the two positions 31 on both sides of the base 10. Therefore, 'at this time, since the two movable parts 11 are located between the two parts 11; here = The memory module 25 to be tested will also be accommodated in the two memorable bodies (DDR DRam memory module 25 is a card-type module that is dynamically and randomly stored at a rate, and f is a chip with a plurality of memory chips.26 An entire row is formed with one side of the electric power 25 connected to the body chip 26 and the memory Finger). Therefore, when 嗲 / 'for example, the gold welding finger 27 (Gollden puts the two movable members /. The body block 25 has one side 21 with the welding finger 27, and the two drive two drives = : =: The two movable parts 11 are swinged to form the movable part 11 pendulum, so that the memory module, j, the test "; 5 on J touching the test record to contact the memory module 2 5 The above figure shows the electrical bumps 16 and 16 respectively. At this time, the '^ and ^ finger portions 27 on the conductive film 15 (see the side view module 25 in FIG. 3C) are turned on, and the conductive traces can be used. Printed with the memory test, and borrowed the printed circuit two: = (not shown), complete the electrical 25 and the solder finger 27 yield. ”哉 I set to judge the memory module is also an exception The drive unit 2 selects a mechanism 34, and the actuating mechanism 34 includes a driving source 33 and an actuating source 33 as a pneumatic cylinder, so it is shown as a rocker arm mechanism. The driving of the pneumatic cylinder 33 will When driving the shaker, when the drive switch 21 is activated, the two movable parts # 3 on the moving unit 20 can be moved, and then the wheel is connected to the drive to move the clamp to contact the memory to be measured.
17791 旭貿.Ptd 1243905 五、發明說明（8) 體模組2 5，惟該驅動源3 3亦可改用其他例如油壓缸之驅動 源，而該搖臂機構3 4亦可替換成其他具有相同作動效果之 機構。 前述設計於基座1 0兩側之定位部3 1係以可收納定位待 測記憶體模組2 5的定位槽為例，惟該定位部3 1之數量與定 位方式並非僅限於此，任何可令該待測記憶體模組2 5定位 於該基座1 0上以受該可動件1 1夾固接觸之定位部3 1均可適 用；同時，該可動件11之裝設數量亦可隨待測記憶體模組 2 5而變，例如，若該待測記憶體模組2 5之待測銲指部2 7均 位於同一側，則亦可於定位該記憶體模組2 5後，擺動單一 可動件1 1而令其測試薄膜1 5上之導電凸塊1 6接觸該些銲指 部2 7即可，端視測試者之需求而定。 因此，藉由本發明之薄膜式設計，即可避免如探針式 或插接式等習知測試治具傷及記憶體模組2 5表面銲指部2 7 之問題，亦可收自動化且快速測試之功效，同時，由於該 些薄膜1 5上之導電線路僅需利用習知之半導體微影技術， 而藉一道黃光製程完成，更大幅減低了測試成本與製造難 度；此外，本發明之測試機制即便經長期使用亦不致損及 治具本身，僅需定期更換該低成本的測試薄膜1 5即可，兼 有維修容易與高使用壽命等優點；再者，由於本發明係藉 由氣壓、油壓與搖臂機構3 4之控制方式驅動該可動件1 1， 故而更可利用該兩驅動單元2 0之控制，維持該可動件1 1與 記憶體模組2 5間的均勻接觸壓力，不致因其接觸之不完全 而降低測試品質，此皆為習知測試方法所無之功效。17791 Xumao. Ptd 1243905 V. Description of the invention (8) Body module 25, but the drive source 3 3 can also be changed to another drive source such as a hydraulic cylinder, and the rocker mechanism 3 4 can also be replaced with other A mechanism with the same effect. The above-mentioned positioning portions 31 on both sides of the base 10 are taken as examples of positioning grooves that can store the memory module 25 to be tested, but the number and positioning methods of the positioning portions 31 are not limited to this, any The memory module 25 to be tested can be positioned on the base 10 to be positioned by the movable part 11 and the positioning part 31 can be applied. At the same time, the number of the movable part 11 can be installed. It varies with the memory module 25 to be tested. For example, if the soldering finger portions 27 of the memory module 25 to be tested are located on the same side, it is also possible to locate the memory module 25 after It is enough to swing the single movable part 11 to make the conductive bumps 16 on the test film 15 contact the solder finger portions 27, depending on the needs of the tester. Therefore, with the thin-film design of the present invention, the problems of conventional test fixtures such as probe type or plug-in type can be avoided and the problems of the surface welding finger portion 2 5 of the memory module 25 can also be automated and fast. At the same time, because the conductive circuits on the thin films 15 only need to use the conventional semiconductor lithography technology and are completed by a yellow light process, the test cost and manufacturing difficulty are greatly reduced; moreover, the test of the present invention The mechanism does not damage the fixture even after long-term use. It only needs to periodically replace the low-cost test film 15, which has the advantages of easy maintenance and high service life. Furthermore, since the present invention uses air pressure, The control method of the oil pressure and the rocker arm mechanism 34 drives the movable member 11, so the control of the two driving units 20 can be used to maintain a uniform contact pressure between the movable member 11 and the memory module 25. It does not reduce the quality of the test due to incomplete contact, which is the effect of conventional test methods.
17791 旭貿.ptd 第12頁 1243905 五、發明說明（9) 藉由本發明所揭示之薄膜式測試機制，即可得一新式 薄膜式測試方法，其步驟係為：準備一具有多數銲指部2 7 的待測記憶體模組2 5，並提供至少一可動件1 1，該可動件 1 1表面係設置一具有導電凸塊1 6與導電跡線1 7的測試薄膜 1 5，同時，該測試薄膜1 5上之導電跡線1 7係電性連接至一 印刷電路板3 0上；接著，定位該待測記憶體模組2 5，以藉 該可動件1 1之作動而令該測試薄膜1 5上之導電凸塊1 6接觸 該待測記憶體模組2 5上之對應銲指部2 7 ;最後，藉由該印 刷電路板3 0與該測試薄膜1 5、記憶體模組2 5之電性導通關 係，而藉該印刷電路板3 0與一外接辨識裝置判別該記憶體 模組2 5之測試結果，判得該記憶體模組2 5上每一銲指部2 7 之電性良率，以瞭解該記憶體模組2 5之短路、斷路與功能 特性狀況。 因此，藉由前述實施例之揭示，即知本發明所提出之 薄膜式測試治具及測試方法，即係藉由該測試薄膜與導電 凸塊、導電線路之設計，而捨棄習用之探針或插槽接觸， 進而發揮保護待測電子元件銲指部之功效，同時，又兼可 發揮快速測試、維修容易、高使用壽命、與均勻控制接觸 壓力等優點。 上述實例僅為例示性說明本發明之原理及其功效，而 非用於限制本發明。任何熟習此項技藝之人士均可在不違 背本發明之精神及範疇下，對上述實施例進行修飾與變 化。因此，本發明之權利保護範圍，應如後述之申請專利 範圍所列。17791 Xumao.ptd Page 12 1243905 V. Description of the invention (9) By using the thin-film testing mechanism disclosed in the present invention, a new thin-film testing method can be obtained. The steps are as follows: preparing a welding finger 2 7 memory module 2 5 to be tested, and provided with at least one movable member 1 1, a surface of the movable member 1 1 is provided with a test film 15 having conductive bumps 16 and conductive traces 17, and at the same time, the The conductive traces 17 on the test film 15 are electrically connected to a printed circuit board 30; then, the memory module 25 to be tested is positioned to make the test by the action of the movable member 11 The conductive bumps 16 on the film 15 contact the corresponding solder finger portions 27 on the memory module 25 to be tested; finally, the printed circuit board 30 and the test film 15 and the memory module The electrical conduction relationship of 2 5 is determined by the test result of the memory module 25 by the printed circuit board 30 and an external identification device, and each solder finger portion 2 5 of the memory module 2 5 is determined. Electrical yield to understand the short circuit, open circuit, and functional characteristics of the memory module 25. Therefore, through the disclosure of the foregoing embodiments, it is known that the thin-film test fixture and test method proposed by the present invention are based on the design of the test film, conductive bumps, and conductive lines, and the conventional probes or The contact of the socket can further protect the welding finger of the electronic component under test, and at the same time, it can also take advantage of fast testing, easy maintenance, high service life, and uniform control of contact pressure. The above examples are merely illustrative to illustrate the principle of the present invention and its effects, and are not intended to limit the present invention. Anyone skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application mentioned later.
17791旭貿.ptd 第13頁 1243905 圖式簡單說明 【圖式簡單說明】 第1 A圖係本發明之測試治具未設置測試薄膜之示意 圖； 第1 B圖係本發明之測試治具於設置測試薄膜過程之示 意圖； 第1 C圖係本發明之測試治具已設置測試薄膜之示意 圖， 第2圖係本發明之測試薄膜之示意圖； 第3A及3B圖係本發明之測試治具進行測試之示意圖； 第3 C圖係本發明之測試治具進行測試之側視圖； 第4圖係習知探針接觸式測試治具之測試示意圖；以 及 · 第5A及5B圖係習知插接接觸式測試治具之測試示意 圖。 (元件符號說明） 10 基座 11 可動件 12 槽狀間隙 15 測試薄膜 16 導電凸塊 17 導電跡線 2 0 驅動單元 21 驅動開關 2 5 記憶體模組17791 旭 贸 .ptd Page 13 1243905 Brief description of the drawings [Simplified description of the drawings] Figure 1 A is a schematic diagram of the test fixture of the present invention without a test film; Figure 1 B is a test fixture of the present invention in a setting Schematic diagram of the test film process; Figure 1C is a schematic diagram of the test film of the present invention with a test film, Figure 2 is a schematic diagram of the test film of the present invention; Figures 3A and 3B are test fixtures of the present invention for testing Figure 3C is a side view of the test fixture of the present invention for testing; Figure 4 is a schematic diagram of a conventional probe contact test fixture; and Figures 5A and 5B are conventional plug contacts Schematic diagram of the test fixture. (Description of component symbols) 10 Base 11 Movable 12 Slot-shaped gap 15 Test film 16 Conductive bump 17 Conductive trace 2 0 Drive unit 21 Drive switch 2 5 Memory module
17791 旭貿.ptd 第14頁 124390517791 Xumao.ptd Page 14 1243905
圖式簡單說明 26 記憶體晶片 27 銲指部 30 印刷電路板 31 定位部 33 驅動源 34 作動機構 40 探針 41 記憶體模組 42 銲指部 50 測試板 51 測試插座 52 電性連接端子 53 記憶體模組 54 銲指部 55 扣合件 56 測試插槽 1779]旭貿.ptd 第15頁Brief description of the drawing 26 Memory chip 27 Welding finger part 30 Printed circuit board 31 Positioning part 33 Driving source 34 Actuating mechanism 40 Probe 41 Memory module 42 Welding finger part 50 Test board 51 Test socket 52 Electrical connection terminal 53 Memory Body Module 54 Welding Fingers 55 Fasteners 56 Test Slots 1779] Xumao.ptd Page 15
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| TWI243905B true TWI243905B (en) | 2005-11-21 |
| TW200540424A TW200540424A (en) | 2005-12-16 |
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