CN201051111Y - piercing probe - Google Patents

Abstract

The utility model discloses a puncture type probe, it mainly contains for the probe sleeve of the hollow columnar body, by this probe sleeve inside protruding a plurality of probe terminals and the wire of electric connection to these some probe terminals of establishing and going out. The plurality of sharp and hard probe terminals penetrate the surface insulation layer of the printed circuit board to electrically contact the connection circuit, and transmit the test signal to the connection circuit through the wire to perform the electrical test. According to the circuit design, the pierced connecting circuit is the connecting circuit of the printed circuit board to the package Body (BGA), so that the package body is tested indirectly through the connecting circuit of the printed circuit board, and the package body is completely prevented from being damaged.

Description

piercing probe

technical field

The utility model relates to a probe, in particular to a piercing probe.

Background technique

Electronic assembly testing consists of two basic types: bare board testing and loading testing. The bare board test is carried out after the circuit board production is completed, mainly to check the short circuit, open circuit and the continuity of the netlist. There are many other inspection and verification methods during the manufacturing process. Load testing is performed after the assembly process and is more complex than bare board testing.

The testing in the assembly phase includes: production defect analysis (MDA), in-circuit testing (ICT) and functional testing (making the product work in the application environment) and a combination of the three. In recent years, assembly testing has also added automated optical inspection (AOI) and automated X-ray inspection. They provide static images of the board as well as layered images of the X-ray board on different planes, enabling the identification of open solder joints and solder bridging defects.

There are usually five types of tests, and their main functions are as follows: 1. Bare board test: check for open and short circuits on circuit boards with unattached components; 2. Production defect analysis: check for circuit boards with attached components Short-circuit and open-circuit defects of solder joints; 3. Online test: certify the operation of each individual component; 4. Functional test: certify the operation of the functional module of the circuit; 5. Combination test: a combination test of online test and functional test.

In addition to the above-mentioned tests for printed circuit boards, there are of course tests for integrated circuits or integrated circuit substrates (such as ball grid array BGA packages). For example: Taiwan Patent Publication No. 490077 patent: test fixture for semiconductor packaging components.

As shown in FIG. 1 , which is a schematic diagram of a test fixture for a package in the prior art. As shown in FIG. 1 , the test fixture of the existing package mainly includes a needle board 14 and a plurality of probes 16 disposed in the needle board 14 , while the package 10 has a plurality of solder balls 12 .

When testing, after the package body 10 is put into the groove of the needle board 14, a plurality of solder balls 12 of the package body 10 will touch a plurality of relative probes 16, and the package body 10 will be touched by these probes 16. Input the test signal to carry out the test work.

However, when the plurality of solder balls 12 of the package 10 contact the corresponding plurality of probes 16, the probes 16 will easily cause the solder balls 12 to fall off, causing the package 10 to be unable to be used normally and must be sent back to the package 10. It can only be used after refilling the solder ball 12 at the manufacturer.

Utility model content

The main purpose of the utility model is to provide a piercing probe, which uses a plurality of sharp and hard probe terminals according to the circuit design to pierce the connection circuit between the printed circuit board and the package (BGA), and can The package is tested indirectly through the connection lines of the printed circuit board, which can completely avoid damage to the package.

Based on the above purpose, the piercing probe described in the utility model, the probe structure includes:

A probe sleeve, which is a hollow column;

a plurality of probe terminals, which are made of metal and protrude from the inside of the probe sleeve;

and a wire electrically connected to the probe terminals and electrically connected to a test signal source.

Using a plurality of sharp and hard probe terminals to pierce the surface insulation layer of the printed circuit board to electrically contact the connection line, and transmit the test signal to the connection line through the wire to perform electrical testing.

The beneficial effect of the utility model is that, using the multiple sharp and hard probe terminals in the piercing probe of the utility model, the package body can be tested indirectly through the connection line of the printed circuit board, which can completely avoid damage to the package body. Therefore, the problem that the solder balls of the package body are likely to fall off due to the relationship between the probes during the test in the prior art is also avoided.

Description of drawings

1 is a schematic diagram of a prior art package test fixture;

Fig. 2 is the schematic diagram of piercing type probe structure of the present utility model;

FIG. 3A and FIG. 3B are schematic diagrams of the operation of the piercing probe structure of the present invention.

Wherein, the reference signs are explained as follows:

10 packages

12 solder balls

14-pin board

16 probes

20 probe sleeves

22 probe terminals

24 wires

30 printed circuit boards

32 connecting lines

34 insulating layer

36 substrates

Detailed ways

Please refer to FIG. 2 and FIGS. 3A-3B . Fig. 2 is a schematic diagram of the structure of the piercing probe of the present invention. 3A-3B are schematic diagrams of the operation of using the piercing probe structure of the present invention.

In simple terms, as shown in FIG. 3B , in order to avoid the solder balls 12 of the package 10 falling off due to the relationship between the probes 16 during the test, a plurality of sufficiently sharp and hard piercing probes of the present invention can be used. The probe terminal 22 pierces the insulating layer 34 of the printed circuit board 30 , electrically contacts the connection line 32 of the package body 10 (such as BGA) on the printed circuit board 30 , and indirectly passes through the connection line of the printed circuit board 30 32 to test the package 10 to completely avoid damage to the package 10 . The piercing probe of the present invention and how to use the piercing probe of the present invention for testing operation will be described in detail below.

As shown in Figure 2, the piercing probe structure of the present invention mainly includes a hollow cylindrical probe sleeve 20, a plurality of probe terminals 22 protruding from the inside of the probe sleeve 20, and electrical connections. Lead wires 24 to the probe terminals 22 . The plurality of probe terminals 22 are metal wires, and the wires 24 are electrically connected to the probe terminals 22 inside the probe sleeve 20, and are also electrically connected to a test signal source (not shown in the figure) , so the test signal of the test signal source can be transmitted to a plurality of probe terminals 22 through the wire 24 at the same time.

As shown in Figures 3A to 3B, the printed circuit board 30 to be tested has a connection circuit 32 (only one of the circuits is depicted here for convenience of explanation, but in fact there should be multiple circuits), and it is installed in a predetermined position. Package 10. According to a predetermined circuit design diagram, the connecting circuit 32 is not only electrically connected to a predetermined pin of the package body 10 (ie, the solder ball 12 shown in FIG. 1 ), but also electrically connected to other electronic components or circuits. In addition, as shown in FIG. 3B , the printed circuit board 30 to be tested further includes a substrate 36 and an insulating layer 34 (such as solder resist green paint) covering the connecting lines 32 .

As shown in Figure 3B, when testing, first find out the connection line 32 electrically connected to the specific pin of the package body 10 according to the circuit design diagram, and then use the piercing probe structure of the utility model to sufficiently A plurality of sharp and hard probe terminals 22 pierce the insulating layer 34 of the printed circuit board 30, and electrically contact the connecting lines 32, so as to indirectly test the package body 10 through the connecting lines 32 of the printed circuit board 30, The purpose of completely avoiding damage to the package body 10 .

In addition, in the piercing probe structure of the present invention, the plurality of probe terminals 22 can be arranged symmetrically in number. In this way, when piercing the insulating layer 34 of the printed circuit board 30, because the piercing force is evenly dispersed, excessive piercing is avoided to cause accidental piercing beyond the connection line 32, and the electrical contact is made to the lines in other layers, causing Circumstances that cannot be successfully tested occur.

Through the above detailed description of the preferred embodiments, it is hoped that the features and protection scope of the present utility model can be described more clearly, and the protection scope of the present utility model is not intended to be limited by the preferred specific embodiments disclosed above.

Claims (2)

1. a penetration type probe is characterized in that, this probe comprises:

One probe sleeve is hollow column;

A plurality of probe terminals, it is a metal material, and is convexly equipped with by this probe sleeve inner; And

One lead is electrically connected to those probe terminals, and is electrically connected to a test signal source.

2. penetration type probe as claimed in claim 1 is characterized in that, described probe terminal is sharp-pointed and firm and be enough to pierce through the printed circuit board surface insulation course.

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