CN1713364A - Thin-film test fixture and test method - Google Patents

Abstract

A thin film test fixture and a test method, the thin film test fixture includes: a base, a movable member, and a drive unit; aiming at an electronic component to be tested with an electrical contact, providing at least one movable part with a testing film arranged on the surface, and then after the electronic component to be tested is positioned, enabling a conducting circuit on the testing film to be in contact with the electrical contact on the electronic component to be tested by virtue of the movement of the movable part, and judging the testing result of the electronic component to be tested by virtue of testing equipment electrically connected with the testing film; the invention can avoid damaging the welding finger part on the surface of the electronic element to be tested, achieves the aim of automatic and rapid test, and greatly reduces the test cost and the manufacturing difficulty; the invention has the advantages of easy maintenance, long service life and the like; moreover, the invention can ensure the test quality which can not be achieved by the existing test method.

Description

Thin-film test fixture and test method

technical field

The invention relates to a test fixture and a test method, in particular to a thin-film test fixture and a test method for testing the electrical properties of electronic components such as memory modules.

Background technique

For memory modules or other electronic components that have been widely used in semiconductor products, in order to ensure their efficacy, multiple tests are often carried out during the production process to check their good rate and electrical properties, so that defective products are discarded. For example, memory chip testing in the chip industry, packaging reliability testing after packaging, or card-type memory module testing after modularization are all testing steps that must be carried out before the product is manufactured.

In the testing technology of the memory module, the memory module to be tested is generally electrically connected to the test fixture, and the signal on the memory module is transmitted to a test board such as a printed circuit board by the test fixture, and the test board passes through the test board. The electrical conduction relationship with the memory module is used to test the conductivity of the memory module; at the same time, the test board is also connected with an identification device to display the electrical conduction between the test board and the memory module for the operator to identify the memory module. Module test results.

Existing test fixtures are electrically connected to the memory module to be tested through automated probes. As shown in FIG. Welding finger 42 (Golden Finger, commonly known as gold finger), to check the electrical connection between the gold welding finger 42 and the memory chip, to complete the test of its good rate. However, the biggest limitation of the probe test is that the probes 40 themselves occupy a certain space, and the distance between adjacent probes 40 is difficult to reduce. Therefore, it is impossible to test the memory module 41 whose soldering fingers 42 are too small in distance. With the complexity of memory module circuits, the density of its surface electrical connection terminals or welding fingers must be increased. Therefore, the increasingly narrow layout spacing makes probe testing unable to meet the needs of the industry. Furthermore, the test of the probe 40 will also cause damage (such as scratches) on the surface of the welding finger portion 42, signal distortion, and the test contact pressure is difficult to accurately control; Defects such as deformation of the needle after testing make it difficult to control the manufacturing quality of the jig and reduce the cost, and it is also inconvenient to maintain and update. It needs to be replaced by a newer test method.

Therefore, other types of test fixtures have appeared, such as the plug-in test method shown in FIG. Each of the test sockets 51 has a slot 56 for disposing a plurality of electrical connection terminals 52 spaced and paralleled in double rows. The tester can insert one side of the welding finger portion 54 on the memory module 53 to be tested toward the slot 56, and then fasten the memory module 53 with the fastening parts 55 at both ends of the slot 56, as shown in FIG. 5B . In this slot 56 of inserting position, make each electrical connection terminal 52 in this slot 56 contact with the welding finger portion 54 on this memory module 53 respectively and electrically connect, and then carry out this welding finger portion 54 and Electrical testing of memory chips; patents including US Patent No. 6,357,022, Taiwan Patent Publication No. 492619, No. 561263 and No. 564945 have all disclosed this existing plug-in testing method.

This plug-in test method can change the design of the test socket 51 and the density of the electrical connection terminals 52 according to the size and circuit layout of the memory module 53, and can also precisely position the memory module 53, greatly improving the probe method. Test limitations and issues such as signal distortion. However, for plug-in testing, its biggest disadvantage is that the service life of the test socket 51 and the slot 56 is too short. After hundreds of times of plugging operations, the electrical connection terminals 52 in the slot 56 It may be damaged and need to be completely replaced; and the plugging and unplugging process of the memory module 53 is more likely to cause scraping of its welding finger portion 54 and damage it. Furthermore, since this test method must manually perform the plugging action, it is difficult to adopt accurate automated testing, and it is difficult to greatly increase the test speed. There are also operational limitations such as the unbalanced test contact pressure, which is difficult to meet the needs of mass production testing.

Therefore, how to develop a new test fixture and test method, so that it can connect test equipment including printed circuit boards and existing identification devices, so as to perform rapid testing, and at the same time, the electronic components under test will not be damaged during the test , and can take into account the needs of maintenance, service life and uniform contact pressure, etc., which has become an urgent subject to be solved in related fields.

Contents of the invention

In order to overcome the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a thin-film test fixture and a test method that will not damage the electronic components to be tested during the test.

Another object of the present invention is to provide an automatic and rapid test film-type test fixture and test method.

Another object of the present invention is to provide a thin-film test fixture and a test method that are convenient for replacement and maintenance.

Another object of the present invention is to provide a thin-film test fixture and a test method that can make the contact pressure uniform during the test.

Another object of the present invention is to provide a thin-film test fixture and a test method with an extremely long service life.

In order to achieve the above and other purposes, the film-type test fixture of the present invention is used to electrically connect the electronic component to be tested and the test board with electrical contacts. The film-type test fixture includes: a base with at least one positioning portion, Positioning the electronic component to be tested; at least one movable part, the surface of which is provided with a test film with a conductive circuit, through the movement of the movable part, the conductive circuit on the test film is brought into contact with the electrical contact on the electronic component to be tested , at the same time, the conductive circuit on the test film is electrically connected to the test board; and the driving unit that drives the movable part to move.

At the same time, the steps of the thin-film test method proposed by the present invention include: providing an electronic component to be tested, with electrical contacts on the electronic component to be tested; providing at least one movable part, and a test film with a conductive circuit is provided on the surface, and at the same time, the The conductive circuit on the test film is electrically connected to the test board; the electronic component to be tested is positioned, and through the movement of the movable part, the conductive circuit on the test film contacts the electrical contact on the electronic component to be tested; And judge the test result of the electronic component under test through the test board.

The above-mentioned test film is made of high molecular polymer material, and the conductive circuit includes copper conductive bumps (Bump) and conductive traces, which are all made by semiconductor lithography technology. At the same time, each conductive trace is connected to a The conductive bumps are connected and arranged parallel to each other on the surface of the test film, and then electrically connected to the test circuit on the test board and the external identification device.

To sum up, when testing the electronic component to be tested, the contact conduction relationship between the electrical contact (such as the welding finger) of the electronic component to be tested and the test film can be used to form an electrical contact-film conductive bump -Thin film conductive traces-test board to test the electrical connection relationship of the circuit, and then complete the electrical test based on the electrical connection relationship, and judge the short circuit, open circuit and functional characteristic status of the electronic component. Therefore, the thin-film design of the present invention can avoid the problem that the existing test fixtures such as probe type or plug-in type damage the welding finger on the surface of the electronic component to be tested, and can also achieve the effect of automatic and rapid testing. At the same time, due to The conductive lines on these conductive films only need to use the existing semiconductor lithography technology to complete through a yellow light process, which greatly reduces the test cost and manufacturing difficulty; in addition, the test principle of the present invention will not damage the card even if it is used for a long time. The tool itself only needs to replace the low-cost test film regularly, which has the advantages of easy maintenance and high service life; moreover, because the present invention is driven by the control mode of air pressure, oil pressure and rocker mechanism 34 Therefore, the control of the two driving units 20 can be used to maintain a uniform contact pressure between the movable part and the electronic component to be tested, and the test quality will not be reduced due to incomplete contact. Efficacy that cannot be achieved by the method.

Description of drawings

Fig. 1A is the schematic diagram that test fixture of the present invention is not provided with test film;

Fig. 1B is a schematic diagram of the process of setting the test film in the test fixture of the present invention;

Fig. 1C is a schematic diagram of a test film set on the test fixture of the present invention;

Fig. 2 is the schematic diagram of test film of the present invention;

Fig. 3A and Fig. 3B are the schematic diagrams that the test fixture of the present invention is tested;

3C is a side view of the test fixture of the present invention for testing;

Fig. 4 is a test schematic diagram of an existing probe contact test fixture; and

5A and 5B are test schematic diagrams of the conventional plug-in contact test fixture.

Detailed ways

Example

The implementation of the present invention will be described below through specific specific examples.

The following embodiments all use the memory module as an example of the electronic component to be tested in the present invention, but the test fixture and testing method proposed by the present invention are also applicable to other electronic components to be tested with electrical contacts; meanwhile, the test card of the present invention The tool can also be externally connected to the existing test equipment including the test board and the identification device, and the existing test equipment will not be described again.

As shown in FIG. 1A and FIG. 1B , a preferred embodiment of the thin-film test fixture of the present invention includes a base 10 , a movable element 11 and driving units 20 located at two ends of the base 10 . The position on both sides of the base 10 close to the drive unit 20 includes two positioning parts 31 such as positioning grooves, the drive unit 20 is externally connected to the drive switch 21 with a solenoid valve; and the base 10 is also provided with two swingable The movable part 11 of the clip is located in the middle of the two positioning parts 31 and is connected to the drive unit 20, and is driven by the drive unit 20 to swing, thereby forming a groove-like gap 12 through its swing; meanwhile, the test card A printed circuit board 30 as a test board is further provided under the base 10 of the tool, and a test circuit externally connected to an identification device (not shown) is designed on the printed circuit board 30 for testing and result identification of the memory module. The printed circuit board 30 and the identification device are the same as the external test equipment used in the existing test fixture, and will not be described in detail here.

Features of the present invention as shown in Figure 1B, on two movable parts 11, test film 15 is pasted and set respectively, so that the surfaces of these two movable parts 11 that these two test films 15 wrap respectively, the test film 15 is a high molecular polymer (Polymer) material, and its surface is shown in Figure 2, forms a plurality of groups of conductive circuits arranged in a row, and each conductive circuit includes a conductive bump 16 (Bump) and a conductive trace 17 , so that the plurality of conductive traces 17 are arranged in parallel with intervals between them. Wherein, the conductive bump 16 and the conductive trace 17 are all copper materials with a nickel alloy layer (Ni Alloy) on the surface; 1C, the test film 15 will be partially located on the inner wall of the groove-shaped gap 12, and the plurality of conductive bumps 16 and conductive traces 17 will respectively protrude from the groove-shaped gap 12 and pass through the groove-shaped gap 12. The electrical connection of the conductive trace 17 to the printed circuit board 30 under the base 10 enables the test film 15 to be electrically connected to the test circuit on the printed circuit board 30 .

Therefore, when performing the electrical test of the memory module, as shown in Fig. 3A and Fig. 3B, the memory module 25 to be tested is placed in the grooves of the positioning parts 31 on both sides of the base 10 at the same time. Between the two positioning parts 31 that the movable part 11 is set, so the memory module 25 to be tested will also be accommodated between the two movable parts 11; the memory module 25 here is a double-rate synchronous dynamic Random access memory (DDR DRAM) is an example, which is a card module with a plurality of memory chips 26, and one side of the memory module 25 is formed with a whole row of electrical contacts connected to the memory chips 26, such as gold soldering fingers 27 (Golden Finger). Therefore, when the memory module 25 is placed between the two movable parts 11 with its side having the welding fingers 27, the tester can activate the external driving switch 21, and the two driving units 20 drive the two movable parts. The movable part 11 swings, so that the two movable parts 11 swing to form the groove-shaped gap 12 and clamp and contact the memory module 25 to be tested, so that a plurality of conductive bumps 16 on the test film 15 contact the memory module 25 respectively Corresponding welding finger portion 27 on the top (side view as shown in Figure 3C), at this moment, the conductive trace 17 on the test film 15 is conducted with the memory module 25, and then can be conducted through the conductive trace 17 The test circuit on the printed circuit board 30 and the external identification device (not shown in the figure) complete the electrical test, and determine the good rate of the memory module 25 and the welding finger portion 27 through the printed circuit board 30 and the identification device.

The drive unit 20 of this embodiment may include a drive source 33 and a motion mechanism 34. The motion mechanism 34 is a rocker mechanism as shown in the figure, and the drive source 33 is a pneumatic cylinder. Therefore, when the tester activates the drive switch 21 , the pneumatic cylinder 33 will drive the rocker mechanism 34 to swing, and then the two movable parts 11 pivotally connected to the drive unit 20 will swing to clamp and contact the memory module 25 to be tested, but the drive source 33 Other driving sources such as hydraulic cylinders can also be used instead, and the rocker arm mechanism 34 can also be replaced with other mechanisms with the same effect.

The above-mentioned positioning parts 31 designed on both sides of the base 10 are exemplified by the positioning grooves that can accommodate and position the memory module 25 to be tested, but the number and positioning methods of the positioning parts 31 are not limited to this, and any memory module to be tested can The module 25 is positioned on the base 10, and the positioning part 31 that is clamped and contacted by the movable member 11 is applicable; meanwhile, the installation quantity of the movable member 11 can also vary with the memory module 25 to be tested, for example, If the welding finger portions 27 of the memory module 25 to be tested are all on the same side, then after positioning the memory module 25, the single movable member 11 can be swung to make the conductive bumps 16 on the test film 15 contact these. Welding finger portion 27, which can be determined according to the needs of the tester.

Therefore, the thin-film design of the present invention can avoid the problem of damage to the welding finger portion 27 on the surface of the memory module 25 such as the existing test fixtures such as the probe type or plug-in type, and can also achieve the effect of automatic and rapid testing. At the same time, due to The conductive lines on these conductive films 15 only need to use the existing semiconductor lithography technology to complete through a yellow light process, which greatly reduces the test cost and manufacturing difficulty; in addition, the test principle of the present invention will not be damaged even if it is used for a long time. The jig itself only needs to replace the low-cost test film 15 regularly, which has the advantages of easy maintenance and high service life; moreover, because the present invention is driven by the control mode of air pressure, oil pressure and rocker mechanism 34 The movable part 11, so the control of the two drive units 20 can be used to maintain the uniform contact pressure between the movable part 11 and the memory module 25, and the test quality will not be reduced due to incomplete contact, which is Efficacy that cannot be achieved by existing testing methods.

Utilizing the thin-film testing principle disclosed by the present invention, the steps of the thin-film testing method of the present invention are: prepare a plurality of memory modules 25 to be tested with welding fingers 27, and provide at least one movable part 11, the movable part 11 The surface is provided with a test film 15 having conductive bumps 16 and conductive traces 17, and at the same time, the conductive traces 17 on the test film 15 are electrically connected to the printed circuit board 30; then, the memory module 25 to be tested is positioned to Through the movement of the movable member 11, the conductive bump 16 on the test film 15 contacts the corresponding welding finger portion 27 on the memory module 25 to be tested; finally, use the printed circuit board 30 and the test film 15, memory The electrical conduction relationship of the module 25, the test result of the memory module 25 is determined by the printed circuit board 30 and the external identification device, and the electrical excellent rate of each solder finger portion 27 on the memory module 25 is judged, so as to understand the memory module 25. Short circuit, open circuit and functional characteristic status of the module 25.

Therefore, it can be seen from the above-mentioned embodiments that the film-type test fixture and test method proposed by the present invention are based on the design of the test film and conductive bumps and conductive lines, and abandon the commonly used probe or slot contact, thereby protecting At the same time, the invention also has the advantages of rapid testing, easy maintenance, long service life and uniform control of contact pressure.

Claims (12)

1. A film-type test fixture, electrically connected with an electronic component to be tested and a test board with electrical contacts, is characterized in that the film-type test fixture comprises: The base has at least one positioning part to position the electronic component to be tested; The movable part is provided with a test film with a conductive circuit on the surface. Through the movement of the movable part, the conductive circuit on the test film contacts the electrical contact on the electronic component to be tested. At the same time, the conductive circuit on the test film Circuits are electrically connected to the test board; and The driving unit drives the movable member to move. 2. The film-type test fixture as claimed in claim 1, wherein the conductive circuit on the test film comprises a plurality of groups of conductive bumps and conductive traces connected together, and the test film passes through the conductive bump contact with the electrical contacts on the electronic component under test. 3. The thin-film test fixture as claimed in claim 1, wherein the electronic component to be tested is a memory module, and the electrical contacts on the electronic component to be tested are solder fingers. 4. The thin-film test fixture as claimed in claim 1, wherein the test board is a printed circuit board with a test circuit, and the test circuit is externally connected to an identification device capable of displaying test results. 5. The thin-film test fixture according to claim 1, wherein the positioning portion is two positioning grooves respectively located on both sides of the base, so that the simultaneously inserted and positioned in the two positioning grooves The electronic component to be tested is located between the two positioning grooves. 6. The film-type test fixture according to claim 1, wherein the movable part is two swingable clips respectively located between the two positioning grooves, so that they can be inserted and positioned in the two positioning grooves at the same time. The electronic components to be tested in the two positioning grooves are clamped and contacted by the two swingable clamps. 7. The thin-film test fixture according to claim 1, wherein the drive unit comprises a drive source and a motion mechanism, and the movable member is connected and driven by the motion mechanism, wherein the motion mechanism is a rocker mechanism, The driving source is one of a pneumatic cylinder and a hydraulic cylinder. 8. A thin-film test method, characterized in that the steps of the test method comprise: providing an electronic component to be tested, with electrical contacts on the electronic component to be tested; At least one movable part is provided, and a test film with conductive lines is arranged on the surface, and at the same time, the conductive lines on the test film are electrically connected to the test board; positioning the electronic component to be tested, and through the movement of the movable member, the conductive circuit on the test film is brought into contact with the electrical contacts on the electronic component to be tested; and The test result of the electronic component to be tested is judged through the test board. 9. The thin-film test method according to claim 8, wherein the conductive circuit on the test film comprises a plurality of groups of conductive bumps and conductive traces connected together, and the test film is contacted by the conductive bumps. to the electrical contacts on the electronic component under test. 10. The thin-film testing method according to claim 8, wherein the electronic component to be tested is a memory module, and the electrical contacts on the electronic component to be tested are solder fingers. 11. The thin-film testing method according to claim 8, wherein the test board is a printed circuit board with a test circuit, and the test circuit is externally connected to an identification device capable of displaying test results. 12. The thin-film testing method as claimed in claim 8, wherein the movable member is a swingable clamp.

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