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TWD220260S - 功率半導體封裝 - Google Patents

功率半導體封裝 Download PDF

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Publication number
TWD220260S
TWD220260S TW109305308F TW109305308F TWD220260S TW D220260 S TWD220260 S TW D220260S TW 109305308 F TW109305308 F TW 109305308F TW 109305308 F TW109305308 F TW 109305308F TW D220260 S TWD220260 S TW D220260S
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TW
Taiwan
Prior art keywords
power semiconductor
semiconductor package
design
case
dotted line
Prior art date
Application number
TW109305308F
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English (en)
Inventor
寇蒂 沙席娜
Original Assignee
美商沃孚半導體有限公司
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Publication date
Application filed by 美商沃孚半導體有限公司 filed Critical 美商沃孚半導體有限公司
Publication of TWD220260S publication Critical patent/TWD220260S/zh

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Abstract

【物品用途】;(省略之);【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。

Description

功率半導體封裝
圖式所揭露之虛線部分,為本案不主張設計之部分。
TW109305308F 2020-04-06 2020-09-21 功率半導體封裝 TWD220260S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/730,568 USD937231S1 (en) 2020-04-06 2020-04-06 Power semiconductor package
US29/730,568 2020-04-06

Publications (1)

Publication Number Publication Date
TWD220260S true TWD220260S (zh) 2022-08-01

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Family Applications (2)

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TW109305308F TWD220260S (zh) 2020-04-06 2020-09-21 功率半導體封裝
TW110304008F TWD220287S (zh) 2020-04-06 2020-09-21 功率半導體封裝

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110304008F TWD220287S (zh) 2020-04-06 2020-09-21 功率半導體封裝

Country Status (2)

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US (2) USD937231S1 (zh)
TW (2) TWD220260S (zh)

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USD1107671S1 (en) * 2022-05-12 2025-12-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
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Also Published As

Publication number Publication date
USD969762S1 (en) 2022-11-15
TWD220287S (zh) 2022-08-01
USD937231S1 (en) 2021-11-30

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