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TWD220260S - Power semiconductor package - Google Patents

Power semiconductor package Download PDF

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Publication number
TWD220260S
TWD220260S TW109305308F TW109305308F TWD220260S TW D220260 S TWD220260 S TW D220260S TW 109305308 F TW109305308 F TW 109305308F TW 109305308 F TW109305308 F TW 109305308F TW D220260 S TWD220260 S TW D220260S
Authority
TW
Taiwan
Prior art keywords
power semiconductor
semiconductor package
design
case
dotted line
Prior art date
Application number
TW109305308F
Other languages
Chinese (zh)
Inventor
寇蒂 沙席娜
Original Assignee
美商沃孚半導體有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商沃孚半導體有限公司 filed Critical 美商沃孚半導體有限公司
Publication of TWD220260S publication Critical patent/TWD220260S/en

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Abstract

【物品用途】;(省略之);【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。[Use of item]; (omitted); [Design description]; The dotted line portion disclosed in the drawing is the part for which design is not advocated in this case.

Description

功率半導體封裝 Power Semiconductor Packaging

圖式所揭露之虛線部分，為本案不主張設計之部分。 The dotted line part disclosed in the drawings is the part that does not claim design in this case.

TW109305308F 2020-04-06 2020-09-21 Power semiconductor package TWD220260S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/730,568 USD937231S1 (en) 2020-04-06 2020-04-06 Power semiconductor package
US29/730,568 2020-04-06

Publications (1)

Publication Number Publication Date
TWD220260S true TWD220260S (en) 2022-08-01

Family

ID=78703986

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109305308F TWD220260S (en) 2020-04-06 2020-09-21 Power semiconductor package
TW110304008F TWD220287S (en) 2020-04-06 2020-09-21 Power semiconductor package

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110304008F TWD220287S (en) 2020-04-06 2020-09-21 Power semiconductor package

Country Status (2)

Country Link
US (2) USD937231S1 (en)
TW (2) TWD220260S (en)

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USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
JP1711418S (en) * 2021-10-13 2022-03-31 Semiconductor element
US12224218B2 (en) 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
JP1725616S (en) * 2022-02-25 2022-09-26 semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1107671S1 (en) * 2022-05-12 2025-12-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1056862S1 (en) * 2022-08-24 2025-01-07 Wolfspeed, Inc. Semiconductor package
USD1098055S1 (en) * 2022-12-02 2025-10-14 Semiconductor Components Industries, Llc Power module package

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Publication number Priority date Publication date Assignee Title
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module

Also Published As

Publication number Publication date
USD969762S1 (en) 2022-11-15
TWD220287S (en) 2022-08-01
USD937231S1 (en) 2021-11-30

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