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USD359028S - Socketed integrated circuit package - Google Patents

Socketed integrated circuit package Download PDF

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Publication number
USD359028S
USD359028S US29/012,499 US1249993F USD359028S US D359028 S USD359028 S US D359028S US 1249993 F US1249993 F US 1249993F US D359028 S USD359028 S US D359028S
Authority
US
United States
Prior art keywords
integrated circuit
circuit package
socketed
package
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/012,499
Inventor
Harry M. Siegel
Michael J. Hundt
Krishnan Kelappan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics Inc
Priority to US29/012,499 priority Critical patent/USD359028S/en
Assigned to SGS-THOMSON MICROELECTRONICS, INC. reassignment SGS-THOMSON MICROELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KELAPPAN, KRISHNAN, SIEGEL, HARRY M.
Assigned to SGS-THOMSON MICROELECTRONICS, INC. reassignment SGS-THOMSON MICROELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUNDT, MICHAEL J., KELAPPAN, KRISHNAN, SIEGEL, HARRY MICHAEL
Application granted granted Critical
Publication of USD359028S publication Critical patent/USD359028S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the integrated circuit package;
FIG. 2 is a side elevation view of the integrated circuit package;
FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;
FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;
FIG. 5 is a top plan view of the integrated circuit package; and,
FIG. 6 is a bottom plan view of the integrated circuit package.

Claims (1)

  1. The ornamental design for the socketed integrated circuit package, as shown and described.
US29/012,499 1993-09-02 1993-09-02 Socketed integrated circuit package Expired - Lifetime USD359028S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/012,499 USD359028S (en) 1993-09-02 1993-09-02 Socketed integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/012,499 USD359028S (en) 1993-09-02 1993-09-02 Socketed integrated circuit package

Publications (1)

Publication Number Publication Date
USD359028S true USD359028S (en) 1995-06-06

Family

ID=65242554

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/012,499 Expired - Lifetime USD359028S (en) 1993-09-02 1993-09-02 Socketed integrated circuit package

Country Status (1)

Country Link
US (1) USD359028S (en)

Cited By (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD389808S (en) 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD394844S (en) 1997-04-25 1998-06-02 Micron Technology, Inc. Temporary package for semiconductor dice
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396213S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396450S (en) 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD402273S (en) 1996-12-26 1998-12-08 Sony Corporation Connector for printed circuit boards
USD402274S (en) 1997-04-01 1998-12-08 Sony Corporation Connector for printed circuit boards
USD402638S (en) 1997-04-25 1998-12-15 Micron Technology, Inc. Temporary package for semiconductor dice
USD407383S (en) 1996-12-11 1999-03-30 Sony Corporation Connector for printed circuit boards
USD411512S (en) 1996-12-11 1999-06-29 Sony Corporation Connector for printed circuit boards
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD448738S1 (en) 2000-10-04 2001-10-02 Sony Corporation Semiconductor element
USD507248S1 (en) * 2004-07-27 2005-07-12 Yamaichi Electronics Co., Ltd. Semiconductor carrier
USD507545S1 (en) * 2004-02-20 2005-07-19 Yamaichi Electronics Co., Ltd. Semiconductor carrier
USD516528S1 (en) 2004-02-20 2006-03-07 Yamaichi Electronics Co., Ltd. Cover for a semiconductor carrier
USD525215S1 (en) 2004-01-27 2006-07-18 Yamaichi Electronics Co., Ltd. Base for a semiconductor carrier
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD594827S1 (en) * 2006-12-07 2009-06-23 Cree, Inc. Lamp package
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD788722S1 (en) * 2014-07-17 2017-06-06 Advantest Corporation Socket for an electronic device testing apparatus
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1031652S1 (en) * 2021-07-29 2024-06-18 Rohm Co., Ltd. Semiconductor module
USD1032517S1 (en) * 2021-07-29 2024-06-25 Rohm Co., Ltd. Semiconductor module
USD1033355S1 (en) * 2021-07-29 2024-07-02 Rohm Co., Ltd. Semiconductor module
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1107671S1 (en) * 2022-05-12 2025-12-30 Alpha And Omega Semiconductor International Lp Power semiconductor module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3891898A (en) 1973-10-11 1975-06-24 Augat Inc Panel board mounting and interconnection system for electronic logic circuitry
US4422703A (en) 1981-09-15 1983-12-27 Thomas & Betts Corporation Electrical connector for use with multi-pin arrays
US4868349A (en) 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
USD317592S (en) 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5119269A (en) 1989-08-23 1992-06-02 Seiko Epson Corporation Semiconductor with a battery unit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3891898A (en) 1973-10-11 1975-06-24 Augat Inc Panel board mounting and interconnection system for electronic logic circuitry
US4422703A (en) 1981-09-15 1983-12-27 Thomas & Betts Corporation Electrical connector for use with multi-pin arrays
USD317592S (en) 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US4868349A (en) 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
US5119269A (en) 1989-08-23 1992-06-02 Seiko Epson Corporation Semiconductor with a battery unit

Cited By (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD389808S (en) 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396212S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396213S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD407383S (en) 1996-12-11 1999-03-30 Sony Corporation Connector for printed circuit boards
USD411512S (en) 1996-12-11 1999-06-29 Sony Corporation Connector for printed circuit boards
USD396450S (en) 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD402273S (en) 1996-12-26 1998-12-08 Sony Corporation Connector for printed circuit boards
USD402274S (en) 1997-04-01 1998-12-08 Sony Corporation Connector for printed circuit boards
USD402638S (en) 1997-04-25 1998-12-15 Micron Technology, Inc. Temporary package for semiconductor dice
USD394844S (en) 1997-04-25 1998-06-02 Micron Technology, Inc. Temporary package for semiconductor dice
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD448738S1 (en) 2000-10-04 2001-10-02 Sony Corporation Semiconductor element
USD525215S1 (en) 2004-01-27 2006-07-18 Yamaichi Electronics Co., Ltd. Base for a semiconductor carrier
USD507545S1 (en) * 2004-02-20 2005-07-19 Yamaichi Electronics Co., Ltd. Semiconductor carrier
USD516046S1 (en) 2004-02-20 2006-02-28 Yamaichi Electronics Co. Base for a semiconductor carrier
USD516528S1 (en) 2004-02-20 2006-03-07 Yamaichi Electronics Co., Ltd. Cover for a semiconductor carrier
USD518798S1 (en) 2004-07-27 2006-04-11 Yamaichi Electronics Co., Ltd Cover for a semiconductor carrier
USD507248S1 (en) * 2004-07-27 2005-07-12 Yamaichi Electronics Co., Ltd. Semiconductor carrier
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD594827S1 (en) * 2006-12-07 2009-06-23 Cree, Inc. Lamp package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD788722S1 (en) * 2014-07-17 2017-06-06 Advantest Corporation Socket for an electronic device testing apparatus
USD819581S1 (en) 2014-07-17 2018-06-05 Advantest Corporation Socket for electronic device testing apparatus
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1032517S1 (en) * 2021-07-29 2024-06-25 Rohm Co., Ltd. Semiconductor module
USD1031652S1 (en) * 2021-07-29 2024-06-18 Rohm Co., Ltd. Semiconductor module
USD1033355S1 (en) * 2021-07-29 2024-07-02 Rohm Co., Ltd. Semiconductor module
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1107671S1 (en) * 2022-05-12 2025-12-30 Alpha And Omega Semiconductor International Lp Power semiconductor module

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