TWD240187S - Substrate retaining ring - Google Patents
Substrate retaining ringInfo
- Publication number
- TWD240187S TWD240187S TW113306147F TW113306147F TWD240187S TW D240187 S TWD240187 S TW D240187S TW 113306147 F TW113306147 F TW 113306147F TW 113306147 F TW113306147 F TW 113306147F TW D240187 S TWD240187 S TW D240187S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- substrate
- retaining ring
- substrate retaining
- filed
- Prior art date
Links
Abstract
【物品用途】;本設計物品，以整體而言是基板保持環，其用於在半導體等物的製造上的基板研磨工序，將晶圓等基板保持在環內，研磨基板的一個面。;【設計說明】;以實線表現的部分是主張設計之部分，對於該部分，申請部分設計之設計專利。以虛線表現的部分是不主張設計之部分，對於該部分，不申請設計專利。[Application]: This design item is a substrate holding ring, used in the substrate polishing process in the manufacture of semiconductors and other products. It holds a substrate, such as a wafer, within the ring and polishes one surface of the substrate. [Design Description]: The portion indicated by solid lines represents the claimed design, for which a design patent application is being filed. The portion indicated by dashed lines represents the unclaimed design, for which no design patent application is being filed.
Description
本設計物品，以整體而言是基板保持環，其用於在半導體等物的製造上的基板研磨工序，將晶圓等基板保持在環內，研磨基板的一個面。 This design item is generally a substrate holding ring, used in the substrate polishing process in the manufacture of semiconductors and other products. It holds a substrate such as a wafer within the ring and polishes one surface of the substrate.
以實線表現的部分是主張設計之部分，對於該部分，申請部分設計之設計專利。以虛線表現的部分是不主張設計之部分，對於該部分，不申請設計專利。 The portion indicated by a solid line is the portion for which the design is claimed, and a design patent for a partial design is applied for for this portion. The portion indicated by a dotted line is the portion for which the design is not claimed, and a design patent is not applied for for this portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024-011051 | 2024-05-31 | ||
| JP2024011051F JP1782527S (en) | 2024-05-31 | 2024-05-31 | Substrate Retaining Ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD240187S true TWD240187S (en) | 2025-09-01 |
Family
ID=93058223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113306147F TWD240187S (en) | 2024-05-31 | 2024-11-21 | Substrate retaining ring |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1782527S (en) |
| TW (1) | TWD240187S (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD228348S (en) | 2022-09-16 | 2023-11-01 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | Shower plate |
-
2024
- 2024-05-31 JP JP2024011051F patent/JP1782527S/en active Active
- 2024-11-21 TW TW113306147F patent/TWD240187S/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD228348S (en) | 2022-09-16 | 2023-11-01 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | Shower plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1782527S (en) | 2024-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWD215398S (en) | Process shield for a substrate processing chamber | |
| TWD204260S (en) | Vented susceptor | |
| TWD206688S (en) | Vented susceptor | |
| TWD211363S (en) | Substrate carrier | |
| TWI264772B (en) | Manufacturing method of semiconductor wafer and wafer | |
| JP1741175S (en) | Susceptor | |
| JP1717341S (en) | Board retaining ring | |
| TWD225633S (en) | Heat-shielding component covers for semiconductor manufacturing equipment | |
| TWD240186S (en) | Substrate retaining ring | |
| TWD240187S (en) | Substrate retaining ring | |
| TWD220881S (en) | Part of the substrate cleaning tool | |
| TWD227852S (en) | Grounding ring of a process kit for semiconductor substrate processing | |
| TWD208042S (en) | A vessel for plasma processing device | |
| JP1781446S (en) | Retainer ring for semiconductor wafer polishing | |
| JP1781445S (en) | Retainer ring for semiconductor wafer polishing | |
| JP1683319S (en) | Elastic film for polishing semiconductor wafers | |
| TWD239981S (en) | Processing carrier for semiconductor wafers | |
| JPH1116844A (en) | Manufacturing method of epitaxial silicon wafer and wafer for material | |
| TWD232851S (en) | Purge ring for a substrate processing chamber | |
| TWD235345S (en) | Part of substrate cleaning equipment | |
| JP1743081S (en) | polishing pad | |
| JP1743080S (en) | polishing pad | |
| JP1743012S (en) | polishing pad | |
| JP1743011S (en) | polishing pad | |
| JP1683320S (en) | Elastic film for polishing semiconductor wafers |