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TWD191626S - Target profile for a physical vapor deposition chamber target - Google Patents

Target profile for a physical vapor deposition chamber target

Info

Publication number
TWD191626S
TWD191626S TW106301373D01F TW106301373D01F TWD191626S TW D191626 S TWD191626 S TW D191626S TW 106301373D01 F TW106301373D01 F TW 106301373D01F TW 106301373D01 F TW106301373D01 F TW 106301373D01F TW D191626 S TWD191626 S TW D191626S
Authority
TW
Taiwan
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
case
Prior art date
Application number
TW106301373D01F
Other languages
Chinese (zh)
Inventor
萊克馬丁李
張富宏
王曉東
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TWD191626S publication Critical patent/TWD191626S/en

Links

Abstract

【物品用途】;本設計係應用於物理氣相沉積室靶。;【設計說明】;(圖式包括色彩者，如不主張色彩，應於本欄敘明之);本案與第106301373號專利申請案(原設計)的差異在於本案進一步主張位於下側之較大圓板結構。;圖式所揭露之虛線部分，為本案不主張設計之部分。;圖式第8頁，係圖示出沿著第2頁俯視圖中的16-16線的剖面圖。【Item Usage】;This design is used for physical vapor deposition chamber targets. ;[Design description];(If the drawing includes color, if color is not advocated, it should be stated in this column);The difference between this case and patent application No. 106301373 (original design) is that this case further advocates a larger circle located on the lower side. board structure. ;The dotted line parts disclosed in the diagram are the parts of this case that are not intended to be designed. ;Page 8 of the drawing shows a cross-section along line 16-16 in the top view on page 2.

Description

物理氣相沉積室靶Physical vapor deposition chamber target

本設計係應用於物理氣相沉積室靶。This design is applied to physical vapor deposition chamber targets.

(( 圖式包括色彩者，如不主張色彩，應於本欄敘明之The pattern includes the color, if it does not claim color, it should be stated in this column. ))

本案與第106301373號專利申請案(原設計)的差異在於本案進一步主張位於下側之較大圓板結構。The difference between this case and the patent application No. 106301373 (original design) is that the present case further claims a larger circular plate structure located on the lower side.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line section disclosed in the figure is not part of the design of this case.

圖式第8頁，係圖示出沿著第2頁俯視圖中的16-16線的剖面圖。Figure 8 is a cross-sectional view taken along line 16-16 of the top view of page 2.

TW106301373D01F 2016-09-30 2017-03-17 Target profile for a physical vapor deposition chamber target TWD191626S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/579,470 2016-09-30
US29/579,470 USD836572S1 (en) 2016-09-30 2016-09-30 Target profile for a physical vapor deposition chamber target

Publications (1)

Publication Number Publication Date
TWD191626S true TWD191626S (en) 2018-07-11

Family

ID=61066246

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106301373D01F TWD191626S (en) 2016-09-30 2017-03-17 Target profile for a physical vapor deposition chamber target
TW106301373F TWD188898S (en) 2016-09-30 2017-03-17 Target profile for a physical vapor deposition chamber target

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106301373F TWD188898S (en) 2016-09-30 2017-03-17 Target profile for a physical vapor deposition chamber target

Country Status (3)

Country Link
US (2) USD836572S1 (en)
JP (2) JP1596742S (en)
TW (2) TWD191626S (en)

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TWD202101S (en) 2018-03-09 2020-01-11 美商應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
TWD212866S (en) 2020-05-20 2021-07-21 美商應用材料股份有限公司 Replaceable substrate carrier interfacing film
TWD214766S (en) 2019-08-26 2021-10-21 美商應用材料股份有限公司 Sputtering target for a physical vapor deposition chamber
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber

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Cited By (10)

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Publication number Priority date Publication date Assignee Title
TWD202101S (en) 2018-03-09 2020-01-11 美商應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
TWD203691S (en) 2018-03-09 2020-04-01 美商應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
TWD207532S (en) 2018-12-17 2020-10-01 美商應用材料股份有限公司 Deposition ring for pvd chamber
TWD209650S (en) 2018-12-17 2021-02-01 美商應用材料股份有限公司 Deposition ring for pvd chamber
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD1040304S1 (en) 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
TWD214766S (en) 2019-08-26 2021-10-21 美商應用材料股份有限公司 Sputtering target for a physical vapor deposition chamber
TWD212866S (en) 2020-05-20 2021-07-21 美商應用材料股份有限公司 Replaceable substrate carrier interfacing film
USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber

Also Published As

Publication number Publication date
JP1596742S (en) 2018-02-05
USD869409S1 (en) 2019-12-10
TWD188898S (en) 2018-03-01
USD836572S1 (en) 2018-12-25
JP1599074S (en) 2018-03-05

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