TW317575B - - Google Patents
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- Publication number
- TW317575B TW317575B TW083111508A TW83111508A TW317575B TW 317575 B TW317575 B TW 317575B TW 083111508 A TW083111508 A TW 083111508A TW 83111508 A TW83111508 A TW 83111508A TW 317575 B TW317575 B TW 317575B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- patent application
- foil
- item
- coating
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 70
- 239000011888 foil Substances 0.000 claims description 65
- 239000010949 copper Substances 0.000 claims description 54
- 229910052802 copper Inorganic materials 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 37
- 238000000576 coating method Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- 239000003792 electrolyte Substances 0.000 claims description 19
- 238000004140 cleaning Methods 0.000 claims description 14
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 13
- 239000000243 solution Substances 0.000 claims description 13
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 9
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 229910001431 copper ion Inorganic materials 0.000 claims description 8
- 229910001453 nickel ion Inorganic materials 0.000 claims description 7
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 238000005562 fading Methods 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 2
- 229960000999 sodium citrate dihydrate Drugs 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000000956 alloy Substances 0.000 description 16
- 239000011889 copper foil Substances 0.000 description 15
- 238000005530 etching Methods 0.000 description 9
- 230000010349 pulsation Effects 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- -1 nickel sodium citrate dihydrate Chemical compound 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- MENAYYMPBRSAAE-AWEZNQCLSA-N 3-[[5-[[(2s)-1-carboxy-3-oxopropan-2-yl]carbamoyl]pyridin-2-yl]methylsulfamoyl]benzoic acid Chemical compound N1=CC(C(=O)N[C@@H](CC(=O)O)C=O)=CC=C1CNS(=O)(=O)C1=CC=CC(C(O)=O)=C1 MENAYYMPBRSAAE-AWEZNQCLSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 101100518501 Mus musculus Spp1 gene Proteins 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 241001494479 Pecora Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920005822 acrylic binder Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- DQIPXGFHRRCVHY-UHFFFAOYSA-N chromium zinc Chemical compound [Cr].[Zn] DQIPXGFHRRCVHY-UHFFFAOYSA-N 0.000 description 1
- 229960004106 citric acid Drugs 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- HKIQZBZCKQBMJT-UHFFFAOYSA-J nickel(2+) disulfate Chemical compound [Ni++].[Ni++].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O HKIQZBZCKQBMJT-UHFFFAOYSA-J 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Description
517575 A7 B7 經濟部中央橾準局員工消費合作杜印製 五、發明説明(1) 本發明係關於一種用於印刷電路板之鋼箱。更特別地, 铜箔係以電解法塗裝一種具有超過5 0重量%之鋼之結節狀 钥/媒合金。 铜箔廣泛用於印刷電路板的製造。箔片的一個表面係屬 壓一介電受質,,例如玻璃填充乙氡基板 '。然後於相對面塗 裝一種光阻劑ί以照相平版印刷技術將電路圖蝕刻於箱片 中? 銅箔係不是以電鍍便是鍛鍊形成》•電鍍箔片係將不鐵鋼 或鈦陽極滾柱浸潰於含銅離子的電解質中製成?當電壓外 加通過電解質時,銅沉積於該滾柱上。該滚柱緩慢地轉 動,铜箔便被連績移除並捲曲於鬆緊捲曲的滾柱上,锻洛 係藉著多重通過軋輥機,減低鑄銅棒的厚度至所需的厚度 而形成,經常伴随中間退火。 電鍵洛片和锻箔的機械性質和蝕刻特徵是不同的。頃建 立以其後粗化處理使箔片變成的顏色區別箔片型態Λ電錢 箔片係以一種使箔片成爲粉紅或钢色的方法處理—種處 理’如同於美國專利第4,515,671號中由波爾蘭(P〇Un) e t a 1所揭示;揭示經由使用脈動電流在銅箔表面上鍍上銅 結節+.β _ 美國專利第4,131,517號由密茲歐(Mitsuo) et al揭示 一種使箔片成爲暗色的處理* 一種銅/鎳合金係以電解方法 沉積於箔片上》爲了增加該暗色塗裝物的粗糙•美國專利 弟5,114,543號由卡伊瓦拉(尺3_]丨评3以)揭示以化學浸潰 形成'種扭棱表面 < 例如將鋼箱漫演於一種每公升含1 Q 〇 4 - 本紙張尺度適用中國國家橾準(CNS ) A4规格(210X297公慶) J . —裝----,--,訂----「-線 .(請先閱讀背面之注意事項再填寫本頁) 317575 A7 B7 五、發明説明(2) 克過碗酸按之水3液中。、.接著將粗化表面塗裝一種鋼_線 合金層、 美國專利5,019,222號由海諸(Hino) et al揭示銅/線 合金不會迅速或均句蚀刻,減低的塗裝蚀刻速度需要於.缺 刻溶液中浸潰時間的增加和铜箔的下凹增加是一個問題.》 倘若蝕刻時間減低,殘餘的铜/鎳合金可以保留,在難難的 情況中,其減低介電受質的電阻係數並形成鄰近銅箔電路 痕跡之間的電流短路* 所以,需要一種改良鍛箔的層界強度且不會具有先前技 藝處理之不良蝕刻特徵的銅/鎳合金處理,。 因此,本發明的一個目的在於提供一種鍛鍊铜箔處理'., 其使銅箔成爲暗色並以浸潰於傳統化學蝕刻溶液中而迅速 移除。本發明第二個目的在於提供一種此處理的沉積方 法。爲該暗色處理係沉積於銅箔表面上的銅/鎳合金層是本 發明的一個特點Λ該合金層含有至少50重量%銅‘。而在於 該銅/鎳合金處理係使用脈動直流電以電解方法從含銅離子 和鎳離子的溶液沉積則是本發明另一個特點、。 經濟部中央標準局員工消費合作社印製 -(請先閱讀背面之注意事項再填寫本頁) 本發明的一個優點在於該處理在铜箔上沉積一種暗色塗 装物,其改良層壓接合於介電受質的強度,和視需要地區-, 別鍛箔和電鍍箔片。本發明另一個優點在4該暗色處理易 4 於在傳統的化學蝕刻溶液中移除。而另一優點爲本發明的 铜/鎳處理妹氣度超過先前技藝铜/鎳處理的二倍。 本紙張尺度逋用中國國家標準(CNS ) Α4規格(210Χ297公A ) S17575 五、發明説明(3) 經濟部中央標準局員工消費合作社印裝 根據本發明,提供—種複合箔片◊該箔片含有—金屬受 質和一鄰近該金屬受質至少一値表面的結節狀塗裝物 結節係一種含有至少5 〇 |量%铜之鋼/鎳合金。 、、根據本發明之第二具體實施例,提供—種印刷電路板。 該印刷電路板有一介電質,其具有一種铜或銅合金箔片接 合;於至少一個表面。一種結節狀塗裝層位於介電受質和箔 片之間。該銅/鎳合金結節含有至少5 〇重量〇/〇銅。 根據本發明之第三具體實施例,提供一種在金屬受質上 沉積暗色塗裝物的方法》該方法包括下面步驟: U)將金屬箱片浸潰於具有陰極和大量電解質的電镀槽 中°該電解質含有一種銅離子和鎳離子的水溶液。 (2 )接著以金屬箔片作爲陽、極,外加第一電流密度通過 電解質持續第一時間。 (3) 接著以金屬箔片作爲陽極,外加第二電馮密度通過 電解質持續第二時間β第一電恩和第二電恩皆大於零。 (4) 連績重覆步驟(2)和(3),以沉積一種當層壓於介電 受質時’厚度有效增加金屬箔片剝落強度的暗色塗装物。 從所附之詳細敘述和附圖,以上提及之目的,特點和優 點將變得更顯而易見》 .. 圖1以截面表示一種根據本發明之方i處理之金屋箔 •片。 圖2以截面表示其後層蜃於—介電受質之圖I之箔片。 圖3以截面表示於金屬箔片光顯相後之圖2之層壓__構。
(請先閱讀背面之注意事項再填寫本頁) .裝. -訂 T丨線
五、發明説明() 經濟部中央標隼局員工消費合作社印製 圖4概要地表示許多用於根據本發明處理金屬箔片的電 解槽。 圖1 - 4中, 1 0 -複合箔片; 1 2 -金屬受質; 1 4 -結節狀塗層; 16 -金屬受質之某一表面; 2 0 -印刷電路板; 2 2 -介電受質; 2 4 -電路痕跡, 26 -銅或以铜爲主成分之合金箔的外表面; 2 8 -電路痕跡邊緣; 3 0 -介電受質的表面, 4 0 -處理線; 4 2 -未處理箔片; 4 4 -經處理箔片; 4 6 -清潔槽; 4 8-處理槽; 5 0 & 6 6 -後處理腐蝕抑制劑; 5 2 -鹼性水溶液; * 5 4 -第一動力控制器; 5 6 -電極, 5 8 -清潔箔片; 6 0 -電解質; (請先聞讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 第83111508號專利申請案 中丈説明書修正頁(86年2 3、 五、發明説明()
6 2 -脈衝動力控制器;以及 6 4 -陽極。 圖1以截面表示一種組合箔片丨〇,其具有_金屬受質12 和鄰近於該金屬受質12至少一個表面之結節狀塗層丨4。 廷些結節平均截面寬度H W "爲約〇 . 0 5微米至約5微米。子 均截面寬度爲約〇.〗微米至約1微米更佳。平均截面寬度 爲約0 . 1微米至約〇 5微米最佳。該結節的平均高度"H" 爲約〇 . 5微米至約3微米。平均高度同於約〇 7微米至約 1 . 5微米更佳。結節狀層的厚度約.等於平均高度"Η ,,。 該結節係由含銅和鎳且銅含量至少爲50重量%之合金形 成》結節中銅的重量百分比較佳爲約5 5 %至約9 9 %,约 7 0 %至約9 5 %更佳。 金屬文質10可以是任何適當的導電延展材料,例如銅 或銅基合金。該金屬受質12可以以任何適當的方法形 成例如电鍍或軋輥還原和退火的組合,如同锻箔製造的 特徵般。根據在鍛箔上沉積一種暗色處理的需要,該金屬 文質12較佳是—種鍛銅或銅基合金。金屬受質的厚度通 常同於约0 013毫米至約0.15毫米(0.0005-0 006英 經濟部中央標準局員工消費合作社印製 吋),典型上同於約〇 〇25毫米至约〇1〇()毫米(〇 〇〇卜 〇 . 〇 04 英吋)》 圖2以截面表示—種使用本發明之複合’落片1 0的印刷電 路板20 ^該印刷電路板2〇具有一介電受質22。接合於該 介質至少一個表面者爲一種銅或銅基合金箔片12。一種 結節狀塗層14位於介電受質22和該銅或銅基合金箔片12 7a 本减尺奴科辟家^^^ii:(21Qx297公逢) ^17575 A7 B7 五、 經濟部中夬標準局!工消費合作社印«. 發明説明(5) 之間。該結節保一種含有至少5 0重量%之鋼的铜,媒合 金。該結節較佳的组成和大小係如上所述s 該钥或鋼合金箔圬係接合於介電受質2 2,例如藉由層壓 作用。然後電路痕跡2 4,如同於圖3中以截面所示,以該 技藝中已知之照相平版印别技術形成》典型上,該铜或銅 基合金箔片的外邵表面2 6係以一種光活性聚合物塗裝。一 種蔽光框插置於該塗装箔片和例口紫外光之頻影源之間。 該蔽光框允許顯影源在選擇區暴露光阻。然後之—種適當 溶劑移除未暴露之光阻。接著將印刷電路板2 〇漫潰於一種 触刻該箱片的溶液,例如一種氫氣酸和氣化銅的漏合物。 以本發明之結節狀銅/鎳合金處理’該塗裝層1 4有利且迅 速地蝕刻’避免電路痕跡24邊緣28的凹陷Ψ金屬殘餘物 不會保留於介電受質2 2的表面3 0上,其能夠減低受質的 電阻並引起電流短路。 根據本發明處理金屬受質的一個方法概要地示於圖4 中。一處理線40將未處理之金屬箔片42轉化爲已處理之 簿片42以便層壓爲一種介電受質。在較佳的具趙實施例 中’處理線4 0包括至少三個由沖洗槽或喷水器隔開之加工 槽。加工槽包括一清潔槽46,一處理槽48和—後處理腐. 蝕抑制劑50。而在使用全部三個槽> 較佳▲體實施例中, 對於在金屬受質上沉積暗色塗装物僅處理槽48需要的。 當未處理箔片42是銅或一種銅基合金時,任何適當的清 潔處理可以添加於清潔槽46。一種適當的清潔落液是本有 3〇克/升升氮礼化納之驗性水i液5 2 °以未處理落片| * 2作 本紙張尺度適用中國國家梂準(CNS ) A4规格(210X297公釐) ---------.1裝----r---訂----「I線 (請先閱讀背面之注意事項再填寫本頁) 第S3111508號專利申請案 中文説明書修正頁(86年:z at
五、發明説明( 經濟部中央標準局員工消費合作衽印製 爲陰極’第一動力控制器54於未處理 和不綠 極56之間外加-種電流密度…種適當的清潔1輞陰 40毫安培/平方公分持續10-40秒,接著在含有2〇 10-升鋼離子和4 5克/公升硫酸的水溶液中,. 克/公 何續1 0 · 1 〇 〇春 安培/平方公分之電流密度5_40秒,或是在含有約is ^ 克/公升銅離子和約4 0 - 5 0克/公升硫酸之電解質中,二2 5 爲約25T至約55«C之間,以交流電蝕刻約1〇1〇’〇 =度 培/平方公分持續5 - 4 0秒。 一種替換的單步驟清潔方法使甩一種含有氫氧化納, 鹼性金屬碳酸鹽,一鹼性金屬矽酸鹽和界面活性劑作爲 落4 2陽極蝕刻電解質5 2之清潔溶液。該箱片5 2製爲, 極,電極56變成陰極。電流密度介於約ι〇_1〇〇毫安培 平方公分之間,持續約1 〇 _ 4 0秒,溫度爲約4 〇。(:至r。 由清潔槽4 6流出之清潔箔片5 8接著如上所述般蚀刻 然後在去離子水中沖洗或簡單沖洗。接著將該細片浸潰 處理槽48中。該處理槽48含有一具有陽極64,大量電 槽6 〇之電解槽,該清潔箔片5 8作爲陰極。 - j 槽46之適當電解質60爲: 銅離子般銅 3-20克/公升 3 - 2 0克/公升’ 4 0 - 2 1 0克/公升
鎳離子般鎳 二水合檸檬酸鈉 PH 溫度
4-9 3 0 °C - 6 0 °C 良紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 安 銅 陽 6 0 於 解 種用於清潔 , ir—一裴 Γ —訂.--I咪 乂請先-83·讀背面之注意事項再填寫本頁j 第83111508號專利申請案 t文説明書修正頁(86羊2 fl、
五、 發明説明(
B7^痛充 fs α 86. 2. 27 此電解質較佳的範圍爲: 銅離子般銅 鎳離子般鎳 二水合檸檬酸鈉ΡΗ 溫度 9-15克/公升 9 · 1 5克/公升 9 5 ' 1 5 5克/公升 經濟部中央標準局員工消費合作社印袈 4 0 r - 5 〇。。 以由任何適#_離子和鎳離子源製成, 如^銅和硫酸鎳。任何適當的離子源亦可以用於化學 2无。在-個較佳具體實施例中,.係使用钥和鎳的碳酸鹽 和氫氧化物以及檸檬酸和氫氧化鈉。 使用-種能夠外加二種分離電流密度(二者皆大於零)之 脈衝動力控制器62,其橫過清“片58,以清潔羯片58 作爲陰極,且一不銹鋼陽極64係相對於該落片放置。脈 f動力控制器62施加約100至約4〇〇毫安培/平方公分之 第電流密度"波峰脈動"橫過處理槽4 8 »接著施加約i 〇 至约1 0 0毫安培/平方公分之第二電流密度,,基底脈動"^ 波峰脈動的期間爲約10至約5〇毫秒’基底電流脈動爲約 5至约2 0毫秒。 種更佳的強力循環使用一種約丨〇 〇毫安培/平方公分 至約250毫安培/平方公分之波峰脈動和約25至約75毫安 培/平方公分之基底脈動。波峰脈動爲约ί 5至約2 5毫秒, 基底脈動爲約1 0至約2 0毫秒。 重覆波峰脈動接著基底脈動的順序持續整個電鍍時間約 5至約4 0秒,約1 〇至約2 0秒較佳。足以沉積厚度有效以增 -10 -
本纸乐尺度適用中國國家標準(CNS ) Α4規格(210X297公变) ----- 817575 A7 s^ ---— B7五'發明説明(s) ' 經濟部中央標準局員工消費合作社印裝 全其,羑/a壓作用心強度的結節狀層的整個時間通常同於爲 勺〇 _ 5 3毫杉。處理箔片4 4,爲暗褐色至黑色a 了改民處理搭片4 4 ,的褪色抗力,該處裡落片較佳係 '受々於種後處理腐蝕抑制劑6 6中》適當的腐妹抑制劑包 括如茲技藝中已知之水性鉻酸鹽和磷酸鹽溶液。 另一種腐蚀抑制劑爲一種具有鋅鉻比例超過約4 : 1重量 比 < 路-辞批被色層。該鋅鉻比例爲約6 : 1至約1 〇 : 1較 佳’如同在陳恩(Chen) et al之美國專利第5,230,932 號中更疋全揭示般,此抗腐蝕抑制劑提供處理箔片4 4稍微 較暗的顏色並改良褪色抗力4 r面的實例説明本發明之處理的優點。該實例係説明但 非限制本發明之範圍9 實例1 將一片每平方英呎1盎司之鍛練铜箔(厚度=3 5微米 (0 · 0 0 1 4英吋))於3 0克/公升氫氧化鈉之鹼性溶液中以1 1 毫安培/平方公分陽極清潔4〇秒,接著在含有2〇克/公升金 屬銅離子和45克/公升硫酸之水溶液中以56毫安培/平方公 分交流電蝕刻1 〇秒,電解質的溫度爲5 〇。(:。. 以去離子水沖洗後,使用1 4 3毫安培/平方公分之波峰脈/ 動和48毫安培/平方公分之基底脈動以波♦電流23毫秒和 '基底電流1 3毫秒之強力循環將箔片電鍍銅/鎳結節。該電 鍍溶液含有15克/公升金屬铜之銅離子,9克/公升硫酸鎳 之鎳離子,131克/公升二水合檸檬酸鈉,pH 5且,電解質 溫度爲4 0 °C。 ! -11 - 本紙張尺度逋用中國國家標率(CNS ) A4规格(2l〇x297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝. tr- -線 A7 B7 五、發明説明(9 ) 然後將處理箔片塗·裝一層鉻/鋅抗褪色塗裝物並使用丙埽 敗系接合劑層壓爲厚金屬受質。處理箔片爲深褐色至黑 色a然後測量將壓箔片從介電受質剝落所需的力。得到根 據本發明處理之箔片的剝落賭度爲2 0 5 0牛頓/公尺(每英吋 Ϊ1.7磅)《工業標準經常需要超過1400床頓/公尺(每英吋 8磅)之拉力強度。未處理片箔片之剝落強度爲7 〇 〇牛頓/公 尺(每英叶4碲)。 實例2 根據實例1之方法處理一銅箔。根據美國專利第 4,1 3 1,5 1 7號之技術將一對照樣品塗裝一種傳統銅/鎳合 金塗裝物。然後將二種樣品皆浸潰於典型的蚀刻溶液i 〇 秒。計算樣品損失的重量並外插測定每分鐘移除的密耳數 (0.001英吋)決定所移除的處理量。如同於表中所示,在 每一種溶液中,本發明之處理具有較高重量損失所表示之 較快姓刻速度。 蚀刻速度 (請先閱讀背面之注意事項再填寫本頁) •裝 -i'r 經濟部中央標準局員工消費合作社印裂 麵溶笔 發明處理 傳統處理 毫米XI000/分 英吋X 1000/分 毫米X 1000/分 英吋X 1000/分 氣化鐵 3.81 0.150 ·. 3.20 0.126 驗性铵 6.40 0.252 1.68 ' 0.066 -氱化銅 0.61 0.024 0.015 0.0006 當本發明頃被敘述爲用於印刷電路板之銅箔的處理,同 樣可應用於其它不減低受質蝕刻特徵而改良機械黏性的金 -12 - 本紙張尺度適用中國國家榡準(CNS )从规格(210X297公釐) 317575 五、 發明説明(ίο) A7 B7 屬泊π處!,同樣可應用於其它除了铜或鋼基合金之金屬 受質,例如線或鎳基合金。 办倘若貝根據本發明提供—種改良接合強度之銅簿電化學 :里且.、疋全滿足該目的,上文中所述之方法和優點是顯 叫易見的。當本.㈣頃與其特^具趙實施例组合敘述,明 :地’:牛多替代方法,調整和變化對於諳熟該技藝且按照 ^文敌述者將是顯而易見的。因此,纟圈宏揚該精義中和 請專利範圍廣義之所有此類替代方法,調整和變化。 (請先閱讀背面之注意事項再填寫本頁) 裝 '、!! 線 經濟部中央榡準局員工消費合作社印褽 -13
修王 衣年月ΰ 痛充 一 第83111508號專利申請案 中文補充説明書(86年2月) Α.層秦經本發明之結節狀銅/鎳塗裝物處理之鋼箔,〇〇〇1英呼(〇〇25 毫米),於一聚醯亞胺受質上,該受質爲18χ1〇·6米厚的環氧化物 黏著層,移除該經層壓铜箔所需的剥離強度爲1〇牛頓/米(57磅/英 忖)。該剝離強度優於未經處理箱片者。雖然此剥離強度低於對金 屬受質上之_而言之王業標準,但其値對於介電受質,如聚酿亞 胺’上之銅箔而言係令人滿意者? R以本發明之結節狀銅/鎳塗裝物與傳_銅/鎳合金塗覆銅受質。將 受質浸入CuCl2的蚀刻水溶液中並以視覺加以觀察。記錄銅/錄合金 黑色消失的時間。對本發明之結節狀塗裝物而言,時間爲2到3秒 間。對傳统塗裝物而言則介於8和9秒之間。
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Claims (1)
- ABCD83111508號專利申請案 文申請專利範圍修正本(86年2扪 六、申請專利範圍 1. —種複合箔片(1 〇 ),其特徵在於: —金屬箔片(12),係選自銅、銅合金、鎳及鎳合金: 和 —鄰近該金屬受質(12)之至少一表面之結節狀塗層 (1 4 )’該結節狀塗層(1 4 )係一種含有至少5 〇重量。/〇銅 的銅和錄合金。 2. —種印刷電路板(20),其特徵在於一介電受質(22); 和根據申請專利範圍第1項之複合箔片(! 〇),該箔片係 接合於該介電受質(2 2 )之至少一側。 3. 根據申請專利範圍第1項之複合箔片(丨〇 ),其特徵在於 该結節狀塗層(1 4 )含有約5 5至約9 9重量%的銅。 4. 根據申請專利範圍第3項之複合箔片(丨〇 ),其特徵在於 遠結郎狀塗置(1 4 )含有約7 0至約9 5重量%的銅。 5_根據申請專利範圍第3項之複合箔片(丨〇 ),其特徵在於 形成該結節狀塗層(1 4)之結節具有約〇 〇 5微米至約5微 米之平均截面寬("W"),和約〇.5至約3微米之平均高 度。 經濟部中央標隼局員工消費合作社印製 6. 根據申請專利範圍第5項之複合箔片(i 〇 ),其特徵在於 該結節具有約0 · 1微米至約!裰米之平均截面寬 ("W ”),和約〇 7至約1 5微米之平均高度。 7. —種在金屬箔片(42)上沉積一暗色塗裝物之方法,特 徵在於下列步驟: 本纸張尺度適用中g國家標準(CNS ) ( 2⑴χ 297公 A8 B8 D8 丨修正 ; 牟、* Η ^ 2. 27 六、申請專利範圍 (a)將該金屬箱片(42)漫潰於一種具有陽極(64)和一體 積電解質(60)的電解槽(48)中,該電解質(6〇)含有一 種銅離子和鎳離子的水溶液; (b )以該金屬il片(4 2 )作爲陰極,外加一第—電流密度 通過該電解質(6 0 )持續—第一時間; (c )以該金屬沾片(4 2 )作,爲陰極,外加一第二電流密度 通過該電解質(6 0 )持續—第二時間,其中該第—電流 密度和該第二電流密度皆大於零;和 (d)連續重覆步驟(b)和(c)直到沉積之暗色塗裝物具有 一有效增加剝落強度之厚度。 8. 根據中請專利範圍第7項之方法,其特徵在於該第一電 流密度介於約1 0 0至約4 0 〇毫安培/平方公分,該第一 時間爲約1 〇毫秒至約5 0毫秒之間,該第二電流密度介 於約1 0至約1 0 0毫安培/平方公分之間,該第二時間介 於約5毫秒至約2 0毫秒之間。 9. 根據申請專利範圍第8項之方法,其特徵在於該步驟(b ) 和(c )係重覆約5至約4 0秒。 10. 根據申請專利範圍第9項之方法,其特徵在於該電解質 (6 0 )係經選擇以含有約3至約2 0克7公升呈金屬銅形式 之銅離子,約3至約20克/公升呈金屬鎳形式之鎳離 子,約40至約210克/公升的二水合檸檬酸鈉,操作pH 値爲約4至約9,操作溫度爲约3 〇。(:至約6 Ο Ό = --------;—寒----^—·ΐτ-----「-'t 一 ί (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製AS 年 Λ 衫 B8 D8 乾圍 317579^ ^ 六、申請專利範圍 11. 根據申請專利範圍第1 〇項之方法,其特徵在於步驟之 前該金屬箔片(4 2 )係經清潔。 12. 根據申請專利範圍第Μ項之方法,其特徵在於該清潔 步隸包括以該金屬箔片(4 2 )作爲陰極,在約1 0至約4 〇 毫安培/平方公分之電流密度下將該金屬箔片(4 2 )浸潰 於驗性水溶液(5 2 )中持續約1 〇至約4 0秒,然後以電解 方法蝕刻該清潔金屬箔片(4 2 )。 13. 根據申請專利範圍第u項之方法,其特徵在於該清潔 步猓包括以該金屬箔片作爲.陽極,電解質溫度爲約4 0 °C至約6 0 °C,在約1 〇厓約1 〇 〇毫安培/平方公分之電流 密度下將該金屬箔片(4 2 )浸潰於鹼性水溶液(5 2 )中, 並外加電流通過該溶液,持續約1 〇至約4 〇秒。 14. 根據申請專利範圍第1 1項之方法,其特徵在於在該步 驟(d)後,該經處理金屬箔片(4 4)係以一種抗褪色層塗 覆。 15. 根據申請專利範圍第1 4項之方法,其特徵在於該抗褪 色塗裝物(6 6 )係一種鋅路比例超過約4 : 1重量比之路和 鋅的混合物。 本紙張尺度逋用中國國家標準(CNS ) A4規格(210X297公釐) I I n ^ ;^r-------'^ - 二 . 厂 (請先閲讀背面之注意事項再填寫本頁) 、 經濟部中央標準局員工消費合作社印製
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-
1994
- 1994-12-10 TW TW083111508A patent/TW317575B/zh not_active IP Right Cessation
-
1995
- 1995-01-12 MY MYPI95000075A patent/MY111671A/en unknown
- 1995-01-19 GB GB9501075A patent/GB2285813B/en not_active Expired - Lifetime
- 1995-01-20 KR KR1019950000902A patent/KR100407732B1/ko not_active Expired - Lifetime
- 1995-01-20 JP JP00750395A patent/JP3459964B2/ja not_active Expired - Lifetime
-
1997
- 1997-06-24 US US08/879,689 patent/US5800930A/en not_active Expired - Lifetime
-
1998
- 1998-06-10 HK HK98105142A patent/HK1006065A1/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| GB2285813A (en) | 1995-07-26 |
| KR950032718A (ko) | 1995-12-22 |
| JPH07243088A (ja) | 1995-09-19 |
| JP3459964B2 (ja) | 2003-10-27 |
| KR100407732B1 (ko) | 2004-03-25 |
| US5800930A (en) | 1998-09-01 |
| HK1006065A1 (zh) | 1999-02-05 |
| GB2285813B (en) | 1997-12-10 |
| GB9501075D0 (en) | 1995-03-08 |
| MY111671A (en) | 2000-10-31 |
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