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PH12014500716A1 - Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil - Google Patents

Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil

Info

Publication number
PH12014500716A1
PH12014500716A1 PH1/2014/500716A PH12014500716A PH12014500716A1 PH 12014500716 A1 PH12014500716 A1 PH 12014500716A1 PH 12014500716 A PH12014500716 A PH 12014500716A PH 12014500716 A1 PH12014500716 A1 PH 12014500716A1
Authority
PH
Philippines
Prior art keywords
copper foil
electrolytic copper
negative electrode
wiring board
electrode material
Prior art date
Application number
PH1/2014/500716A
Inventor
Michiya Kohiki
Terumasa Moriyama
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12014500716A1 publication Critical patent/PH12014500716A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/70—Carriers or collectors characterised by shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
    • H01M2004/027—Negative electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 µm. Provided is the electrolytic copper foil capable of, without deteriorating various characteristics of the electrolytic copper foil, improving a roughening treatment layer on the copper foil and enhancing the adhesion strength between the copper foil and a resin substrate, especially, capable of obtaining a stronger peeling strength in comparison with a general-purpose epoxy resin substrate (FR-4, etc.) when used in combination with a semiconductor package substrate having a generally low adhesion with a copper foil and a liquid crystal polymer substrate, and also provided is a method for manufacturing the electrolytic copper foil. The present invention addresses the problem of providing the electrolytic copper foil useful as an electrolytic copper foil to be used for a printed wiring board or a battery (LiB, etc.) negative electrode material.
PH1/2014/500716A 2011-09-30 2012-09-16 Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil PH12014500716A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011216623 2011-09-30
PCT/JP2012/073839 WO2013047272A1 (en) 2011-09-30 2012-09-18 Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil

Publications (1)

Publication Number Publication Date
PH12014500716A1 true PH12014500716A1 (en) 2014-05-12

Family

ID=47995304

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2014/500716A PH12014500716A1 (en) 2011-09-30 2012-09-16 Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil

Country Status (7)

Country Link
JP (1) JP6029590B2 (en)
KR (3) KR20140054435A (en)
CN (1) CN103857833B (en)
MY (1) MY175198A (en)
PH (1) PH12014500716A1 (en)
TW (1) TWI605735B (en)
WO (1) WO2013047272A1 (en)

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TWI515342B (en) * 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 Surface-treated copper foil, and copper clad laminate and printed wiring board obtained by using the same
TWI616122B (en) * 2014-05-28 2018-02-21 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, laminated body, printed wiring board, electronic device, method for producing surface-treated copper foil, and method for producing printed wiring board
JP6323261B2 (en) * 2014-08-29 2018-05-16 住友金属鉱山株式会社 Manufacturing method of flexible copper wiring board and flexible copper-clad laminate with support film used therefor
KR101912765B1 (en) * 2014-09-05 2018-10-29 후루카와 덴키 고교 가부시키가이샤 Copper foil, copper clad laminated plate, and substrate
KR101852671B1 (en) * 2015-01-21 2018-06-04 제이엑스금속주식회사 Copper foil with carrier, laminate, printed circuit board and method of manufacturing printed circuit board
KR102273442B1 (en) * 2015-03-31 2021-07-06 미쓰이금속광업주식회사 Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
JP6083619B2 (en) * 2015-07-29 2017-02-22 福田金属箔粉工業株式会社 Processed copper foil for low dielectric resin substrate, copper-clad laminate and printed wiring board using the treated copper foil
WO2017051897A1 (en) * 2015-09-24 2017-03-30 Ｊｘ金属株式会社 Metal foil, metal foil with mold release layer, laminate, printed wiring board, semiconductor package, electronic device and method for producing printed wiring board
KR20170038969A (en) * 2015-09-30 2017-04-10 일진머티리얼즈 주식회사 Surface-treated Copper Foil for PCB having fine-circuit pattern and Method of manufacturing of the same
CN109716871B (en) * 2016-10-06 2023-02-17 三井金属矿业株式会社 Manufacturing method of multilayer wiring board
JP7492807B2 (en) 2016-12-06 2024-05-30 Ｊｘ金属株式会社 Surface-treated copper foil, carrier-attached copper foil, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JP7193915B2 (en) * 2017-02-03 2022-12-21 Ｊｘ金属株式会社 Surface-treated copper foil and current collector, electrode and battery using the same
CN111194362B (en) * 2017-07-24 2022-03-11 古河电气工业株式会社 Surface-treated copper foil, and copper clad laminates and printed wiring boards using the same
JP7127861B2 (en) * 2017-11-10 2022-08-30 ナミックス株式会社 composite copper foil
JP7056167B2 (en) * 2018-01-23 2022-04-19 株式会社豊田自動織機 Power storage module and manufacturing method of power storage module
TWI679314B (en) 2018-06-07 2019-12-11 國立中興大學 Method for manufacturing copper foil with rough surface in single plating tank and its product
JP6845382B1 (en) * 2019-06-07 2021-03-17 古河電気工業株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
TWM593711U (en) * 2019-06-12 2020-04-11 金居開發股份有限公司 Advanced reverse electrolytic copper foil and copper foil substrate thereof
JP7392996B2 (en) * 2019-06-19 2023-12-06 金居開發股▲分▼有限公司 Advanced electrolytic copper foil and copper-clad laminates using it
TWI776168B (en) * 2019-06-19 2022-09-01 金居開發股份有限公司 Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same
JP7421208B2 (en) * 2019-12-24 2024-01-24 日本電解株式会社 Surface treated copper foil and its manufacturing method
CN112469194B (en) * 2020-11-27 2022-08-05 广东嘉元科技股份有限公司 Low-profile electrolytic copper foil for high-density interconnected circuit board
WO2022153580A1 (en) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
WO2023281759A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
CN115044947B (en) * 2022-06-17 2023-09-29 山东金宝电子有限公司 Surface treatment method for improving adhesion of copper foil and resin
CN116180174A (en) * 2023-02-23 2023-05-30 九江德福科技股份有限公司 Micro roughening surface treatment method for electrolytic copper foil
CN117661046A (en) * 2023-11-30 2024-03-08 九江德福科技股份有限公司 An electrolytic copper foil with double-sided loose structure and its production method and use

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Also Published As

Publication number Publication date
KR102059280B1 (en) 2019-12-24
JP6029590B2 (en) 2016-11-24
CN103857833A (en) 2014-06-11
WO2013047272A1 (en) 2013-04-04
JPWO2013047272A1 (en) 2015-03-26
KR20140054435A (en) 2014-05-08
TW201330719A (en) 2013-07-16
KR20180026584A (en) 2018-03-12
KR20160119875A (en) 2016-10-14
TWI605735B (en) 2017-11-11
CN103857833B (en) 2018-09-07
MY175198A (en) 2020-06-15

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