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TW202409166A - Light processing device - Google Patents

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TW202409166A
TW202409166A TW112129809A TW112129809A TW202409166A TW 202409166 A TW202409166 A TW 202409166A TW 112129809 A TW112129809 A TW 112129809A TW 112129809 A TW112129809 A TW 112129809A TW 202409166 A TW202409166 A TW 202409166A
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gas
processing chamber
workpiece
processing
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清水昭宏
吉原啓太
竹元史敏
山森賢治
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日商牛尾電機股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • C08J7/123Treatment by wave energy or particle radiation
    • H10P72/0402
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/002Other surface treatment of glass not in the form of fibres or filaments by irradiation by ultraviolet light

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  • Geochemistry & Mineralogy (AREA)
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  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

An object of the present invention is to provide an optical processing apparatus that can perform processing stably and homogeneously when processing a workpiece in a processing chamber having a lowered ozone concentration. The solution includes a transporting workpiece. The transporting workpiece includes a transporting mechanism having a plurality of transporting rollers, a main processing chamber having a first transport inlet and a first transport outlet. The transporting workpiece further includes a partition member that divides at least one part of spaces between the plurality of transporting rollers into a processing space and a retention space in the main processing chamber along a direction orthogonal to a transporting direction of the workpiece and a direction of rotation axis of the transporting rollers. The transporting workpiece further includes an ultraviolet light source configured to emit ultraviolet light having a wavelength under 200nm toward a surface of the workpiece being transported by the transporting mechanism in the processing space of the main processing chamber, a gas inlet configured to introduce a processing gas into the main processing chamber, a second transport inlet, and a second transport outlet. The second transport outlet is connected to an inlet secondary processing chamber connected to the first transport inlet. At least a part of the transporting rollers is located at a position closer to a side of the processing space than the partition member.

Description

光處理裝置light processing device

本發明係關於光處理裝置。The present invention relates to a light processing device.

先前,已知有將膜材料、玻璃板等(以下,有將處理對象物統稱為「工件」的狀況。)暴露於透過向氧照射紫外光而生成的臭氧,從而來進行工件的表面處理的技術。例如,在後述專利文獻1中,公開了利用由臭氧所致的氧化反應,對膜材料的表面進行改質處理的方法。另外,在後述專利文獻2中,公開了利用由臭氧所致的氧化反應,對玻璃板的表面進行洗淨處理的方法。 [先前技術] [專利文獻] Conventionally, it has been known to perform surface treatment of the workpiece by exposing film materials, glass plates, etc. (hereinafter, the object to be processed is generally referred to as the "workpiece") to ozone generated by irradiating ultraviolet light to oxygen. Technology. For example, Patent Document 1 described below discloses a method of modifying the surface of a membrane material using an oxidation reaction caused by ozone. Patent Document 2 described below discloses a method of cleaning the surface of a glass plate using an oxidation reaction caused by ozone. [prior art] [Patent Document]

[專利文獻1]國際公開第2012/077553號 [專利文獻2]日本專利第5083318號公報 [Patent Document 1] International Publication No. 2012/077553 [Patent Document 2] Japanese Patent No. 5083318

[發明所欲解決之課題][The problem that the invention wants to solve]

近年來,透過將工件暴露於臭氧來處理工件表面的方法不僅用於膜材料的改質處理、玻璃板的清洗處理,還利用於構成薄型顯示器的液晶基板上之細微裝置的處理等。具體而言,例如,利用於由金屬層構成之薄膜電晶體的閘極電極表面的親水化處理中。In recent years, the method of treating the surface of a workpiece by exposing the workpiece to ozone has been used not only for the modification of film materials and the cleaning of glass plates, but also for the treatment of fine devices on liquid crystal substrates constituting thin displays. Specifically, for example, it is used to hydrophilize the surface of a gate electrode of a thin film transistor composed of a metal layer.

然而,在將半導體基板上、液晶基板上的金屬層暴露於臭氧而進行親水化處理的情況下,該金屬層的表面被親水化處理,並且逐漸被氧化而形成金屬氧化膜。尤其,當臭氧濃度過高時,促進金屬氧化膜的形成,在金屬層的表面形成的金屬氧化膜的厚度容易變大。However, when a metal layer on a semiconductor substrate or a liquid crystal substrate is exposed to ozone for hydrophilization, the surface of the metal layer is hydrophilized and gradually oxidized to form a metal oxide film. In particular, when the ozone concentration is too high, the formation of the metal oxide film is promoted, and the thickness of the metal oxide film formed on the surface of the metal layer tends to increase.

金屬氧化膜與被氧化前的金屬的物性不同,也取決於所使用的蝕刻溶液等,但一般來說,與被氧化前的金屬相比,反應性差,蝕刻速率慢。因此,金屬氧化膜形成得越厚,越容易產生無法透過蝕刻處理將裝置加工成所希望的形狀的問題。The physical properties of the metal oxide film are different from those of the metal before oxidation, and it also depends on the etching solution used, but in general, it is less reactive and has a slower etching rate than the metal before oxidation. Therefore, the thicker the metal oxide film is, the more likely it is that the device cannot be processed into the desired shape through etching.

在此,本發明者們為了抑制上述問題的發生,針對透過比以往的膜材料、玻璃板的處理中之臭氧濃度低的臭氧濃度進行處理的方法進行了研究。Here, in order to suppress the occurrence of the above-mentioned problems, the present inventors studied a method of performing treatment by transmitting an ozone concentration lower than that in the treatment of conventional membrane materials and glass plates.

然而,本發明者們等嘗試將處理室內的臭氧濃度控制得比以往低來實施工件的處理,結果臭氧濃度在所希望的範圍內並不穩定,多發生不能允許之程度的處理不均,能夠正常處理的工件非常少。However, the inventors of the present invention have attempted to control the ozone concentration in the processing chamber to be lower than before to achieve the processing of the workpieces. As a result, the ozone concentration was not stable within the desired range, and unacceptable processing unevenness often occurred, and very few workpieces could be processed normally.

本發明係有鑑於前述課題,目的為提供即使在使處裡室內的臭氧濃度降低而進行了工件的處理的情況下,也能夠穩定且均質地進行處理的光處理裝置。 [用以解決課題之手段] The present invention is made in view of the above-mentioned problem, and its purpose is to provide a light processing device that can perform processing stably and uniformly even when the ozone concentration in the processing room is reduced to process the workpiece. [Means for solving the problem]

本發明的光照射裝置,其特徵為具備: 搬送機構,係搬送前述工件,具有複數搬送滾筒; 主處理室,係具有搬入藉由前述搬送機構搬送的前述工件的第一搬入口,與搬出前述工件的第一搬出口; 分隔構件,係在前述主處理室內,在與前述工件的搬送方向和前述搬送滾筒的旋轉軸方向正交的方向上,將前述複數搬送滾筒之間的至少一部分劃分為處理空間與滯留空間; 紫外光源,係配置於前述主處理室的前述處理空間內,朝向沿著前述搬送機構搬送的前述工件的一面,出射主要發光波長為200nm以下的紫外光; 氣體導入口,係向前述主處理室內導入加工氣體;及 搬入副處理室,係具有搬入所搬送的前述工件的第二搬入口,與搬出前述工件的第二搬出口,前述第二搬出口連通於前述第一搬入口; 前述搬送滾筒的至少一部分位於比前述分隔構件靠前述處理空間側的位置。 The light irradiation device of the present invention is characterized by comprising: a conveying mechanism for conveying the workpiece and having a plurality of conveying rollers; a main processing chamber having a first inlet for carrying in the workpiece conveyed by the conveying mechanism and a first outlet for carrying out the workpiece; a partition member for dividing at least a portion between the plurality of conveying rollers into a processing space and a retention space in a direction orthogonal to the conveying direction of the workpiece and the direction of the rotation axis of the conveying roller in the main processing chamber; an ultraviolet light source disposed in the processing space of the main processing chamber and emitting ultraviolet light having a main emission wavelength of less than 200 nm toward one side of the workpiece conveyed along the conveying mechanism; a gas inlet for introducing processing gas into the main processing chamber; and The secondary processing chamber is provided with a second loading port for loading the workpiece to be transported and a second loading port for unloading the workpiece, and the second loading port is connected to the first loading port; At least a part of the transport drum is located closer to the processing space than the partition member.

於本說明書中「主要發光波長」係指在發射光譜上規定對於某波長λ±10nm的波長區域Z(λ)之狀況中,對於發射光譜內的總積分強度顯示40%以上的積分強度的波長區域Z(λi)之波長λi。In this specification, "main emission wavelength" refers to a wavelength that exhibits an integrated intensity of more than 40% of the total integrated intensity in the emission spectrum in a wavelength region Z (λ) specified for a certain wavelength λ ± 10 nm in the emission spectrum. The wavelength λi of area Z(λi).

在本說明書中,「加工氣體」是指將惰性氣體和在臭氧的生成中所使用之含氧氣體混合而生成的混合氣體。In this specification, "process gas" refers to a mixed gas produced by mixing an inert gas and an oxygen-containing gas used to generate ozone.

在本說明書中,搬入口與搬出口「連通」是指在工件的搬送方向上至少一部分連續地連接的狀態。例如,可以設想使主處理室與搬入副處理室接觸,將第一搬入口與第二搬出口連續地連接的狀態、或經由連結部件連續地連接的狀態等。In this specification, the "connection" between the import port and the transport port refers to a state in which at least part of them are continuously connected in the conveyance direction of the workpiece. For example, it is conceivable that the main processing chamber and the loading sub-processing chamber are brought into contact, and the first loading port and the second loading port are continuously connected, or a state is continuously connected via a connecting member.

分隔構件並不需要是將主處理室內的空間完全分離成處理空間與滯留空間的部件,部分地連通處理空間與滯留空間亦可。但是,在從處理空間側朝向滯留空間側觀察時,相對於分隔構件整體的面積,未配置有分隔構件及搬送機構的區域的面積的合計為10%以下為佳,6%以下更理想。The partitioning member does not need to be a member that completely separates the space in the main processing chamber into a processing space and a retention space, and may partially connect the processing space and the retention space. However, when viewed from the processing space side toward the retention space side, the total area of the area where the partitioning member and the transport mechanism are not arranged is preferably 10% or less, and more preferably 6% or less relative to the entire area of the partitioning member.

另外,關於該分隔構件的具體構成,在「實施方式」的項目中一邊參照圖式一邊進行說明。再者,分隔構件不僅可以設置在主處理室中,追加設置在搬入副處理室中亦可。The specific structure of the partition member will be described in the section "Embodiment" with reference to the drawings. The partition member may be installed not only in the main processing chamber but also in the loading sub-processing chamber.

本發明者們注意到,在要透過比先前低之臭氧濃度來處理工件的情況下,由於存在於外側的氣體(以下,有稱為「外部氣體」的狀況。)流入處理空間內而導致臭氧濃度的相對變動變大,因此無法進行穩定的處理。又,本發明者們還注意到,在將處理室的內部空間整體作為處理空間的情況下,由於自然對流,臭氧難以停留在工件周邊,產生工件未被處理的情況。再者,由於臭氧難以停留在工件周邊,臭氧濃度越低,越容易產生工件未被處理的現象。The inventors of the present invention noticed that when a workpiece is processed with an ozone concentration lower than before, the gas existing outside (hereinafter referred to as "external gas") flows into the processing space and causes ozone. The relative fluctuation in concentration becomes large, so stable processing cannot be performed. Furthermore, the present inventors also noticed that when the entire internal space of the processing chamber is used as the processing space, ozone is difficult to stay around the workpiece due to natural convection, and the workpiece may not be processed. Furthermore, since it is difficult for ozone to stay around the workpiece, the lower the ozone concentration, the easier it is for the workpiece to remain unprocessed.

因此,根據前述光處理裝置的構成,由於主處理室的第一搬入口連通於搬入副處理室的第二搬出口,因此外部氣體最初從第二搬入口流入搬入副處理室內。亦即,搬入副處理室具有作為緩衝空間的功能,抑制外部氣體直接從第一搬入口流入。Therefore, according to the structure of the optical processing apparatus described above, since the first import port of the main processing chamber communicates with the second import port of the import sub-processing chamber, external air initially flows into the import sub-processing chamber from the second import port. That is, the import sub-processing chamber functions as a buffer space and suppresses external air from directly flowing in from the first import port.

再者,存在於搬入副處理室內的氣體是主處理室的處理空間內的氣體與外部氣體混合而成的混合氣體。因此,在將工件搬入主處理室內時,搬入副處理室內的氣體流入主處理室內,但與外部氣體直接流入的情況相比,該氣體對處理空間內的臭氧濃度的影響較小。In addition, the gas present in the transport sub-processing chamber is a mixed gas in which the gas in the processing space of the main processing chamber and the external air are mixed. Therefore, when the workpiece is moved into the main processing chamber, the gas moved into the sub-processing chamber flows into the main processing chamber, but this gas has less influence on the ozone concentration in the processing space than when the external air flows directly into the main processing chamber.

另外,在主處理室內生成的臭氧的絕大多數藉由分隔構件,抑制了通過搬送滾筒而移動至滯留空間側。In addition, most of the ozone generated in the main processing chamber is suppressed by the partition member from passing through the conveyor drum and moving to the stagnation space side.

也就是說,前述構成的光處理裝置相較於外部氣體直接流入主處理室內的構成,可抑制主處理室內的臭氧濃度的變動,且在處理空間內生成的臭氧容易停留在工件周邊。所以,前述構成的光處理裝置相較於先前的光處理裝置,即使是較低的臭氧濃度,也能夠穩定且均質地處理工件整體。That is to say, compared with a structure in which external air flows directly into the main processing chamber, the optical processing device having the above-mentioned structure can suppress the fluctuation of the ozone concentration in the main processing chamber, and the ozone generated in the processing space can easily stay around the workpiece. Therefore, the light processing device having the above structure can stably and uniformly process the entire workpiece even at a lower ozone concentration than the previous light processing device.

前述光處理裝置亦可構成為具備: 至少一個主排氣口,係將前述主處理室內的氣體排出; 至少一個第一副排氣口,係將前述搬入副處理室內的氣體排出;及 排氣控制機構,係控制從前述主排氣口及前述第一副排氣口排出的氣體的量; 前述排氣控制機構,係以使每單位時間從前述主排氣口排出的氣體的總量比從前述第一副排氣口排出的氣體的總量少之方式進行控制亦可。 The aforementioned light processing device may also be configured to include: At least one main exhaust port is used to discharge the gas in the aforementioned main processing chamber; At least one first auxiliary exhaust port is used to discharge the aforementioned gas moved into the auxiliary treatment chamber; and An exhaust control mechanism controls the amount of gas discharged from the aforementioned main exhaust port and the aforementioned first auxiliary exhaust port; The exhaust gas control mechanism may control the total amount of gas exhausted from the main exhaust port per unit time to be smaller than the total amount of gas exhausted from the first auxiliary exhaust port.

透過採用前述構成,搬入副處理室內的氣壓比主處理室的處理空間內的氣壓低。透過形成此種氣壓關係,可抑制從搬入副處理室的第二搬入口流入的外部氣體流入主處理室的處理空間內。所以,光處理裝置在處理工件的過程中的主處理室的處理空間內的臭氧濃度的變動進一步變小,能夠更加均質地處理工件整體。By adopting the above-mentioned structure, the air pressure in the sub-processing chamber is lower than the air pressure in the processing space of the main processing chamber. By forming such an air pressure relationship, it is possible to suppress the external gas flowing in from the second carrying port into the sub-processing chamber from flowing into the processing space of the main processing chamber. Therefore, the variation of the ozone concentration in the processing space of the main processing chamber during the process of processing the workpiece by the optical processing device is further reduced, and the entire workpiece can be processed more uniformly.

前述光處理裝置亦可具備: 搬出副處理室,係形成搬入沿著前述搬送機構搬送的前述工件搬入的第三搬入口與搬出前述工件的第三搬出口,前述第三搬入口連接於前述第一搬出口。 The aforementioned light processing device may also be equipped with: The sub-processing chamber is formed with a third carry-in port for loading in the workpieces conveyed along the transport mechanism and a third carry-out port for carrying out the workpieces. The third carry-in port is connected to the first carry-out port.

進而,前述光處理裝置亦可構成為具備: 至少一個主排氣口,係將前述主處理室內的氣體排出; 至少一個第一副排氣口,係將前述搬入副處理室內的氣體排出; 至少一個第二副排氣口,係將前述搬出副處理室內的氣體排出;及 排氣控制機構,係控制從前述主排氣口、前述第一副排氣口及前述第二副排氣口排出的氣體的量; 前述排氣控制機構,係以使每單位時間從前述主排氣口排出的氣體的總量比從前述第一副排氣口排出的氣體的總量少,且比從前述第二副排氣口排出的氣體的總量少之方式進行控制。 Furthermore, the aforementioned light processing device may also be configured to include: At least one main exhaust port is used to discharge the gas in the aforementioned main processing chamber; At least one first auxiliary exhaust port is used to discharge the aforementioned gas moved into the auxiliary processing chamber; At least one second auxiliary exhaust port is used to discharge the gas moved out of the auxiliary processing chamber; and An exhaust control mechanism controls the amount of gas discharged from the aforementioned main exhaust port, the aforementioned first auxiliary exhaust port, and the aforementioned second auxiliary exhaust port; The exhaust gas control mechanism is configured to make the total amount of gas exhausted from the main exhaust port per unit time smaller than the total amount of gas exhausted from the first auxiliary exhaust port, and smaller than the total amount of gas exhausted from the second auxiliary exhaust port. The total amount of gas discharged from the port is controlled in such a way that it is small.

由於第一搬出口是將工件從主處理室內朝向外側搬出的開口,因此與搬入工件的第一搬入口相比,主處理室內的氣體容易與工件一同向外側漏出。這種氣體從主處理室內的漏出很可能成為處理空間內的臭氧濃度發生紊亂的重要原因。又,存在不少從第一搬出口流入的外部氣體,雖然其與第一搬入口相比很少。Since the first unloading port is an opening for unloading workpieces from the main processing chamber to the outside, the gas in the main processing chamber is more likely to leak to the outside together with the workpieces than the first unloading port for loading the workpieces. The leakage of this gas from the main treatment chamber is likely to be an important cause of disturbance in the ozone concentration in the treatment space. In addition, there is a lot of outside air flowing in from the first outlet, although it is small compared with the first outlet.

因此,透過採用前述構成,可進一步抑制從第一搬出口側流入的外部氣體的影響。所以,光處理裝置在處理工件的過程中的主處理室的處理空間內的臭氧濃度的變動進一步變小,能夠更加均質地處理工件整體。Therefore, by adopting the above-mentioned structure, the influence of the outside air flowing in from the first outlet side can be further suppressed. Therefore, the optical processing apparatus can further reduce the fluctuation of the ozone concentration in the processing space of the main processing chamber during processing of the workpiece, and can process the entire workpiece more uniformly.

前述光處理裝置亦可具備: 抽氣管,係具有配置於前述處理空間內的取入口與配置於前述處理空間外的排出口,從前述取入口抽出前述處理空間內的氣體;及 濃度計,係連接於前述抽氣管的前述排出口,測定從前述排出口流入之氣體的臭氧濃度。 The aforementioned light treatment device may also be equipped with: an exhaust pipe having an inlet disposed in the aforementioned treatment space and an outlet disposed outside the aforementioned treatment space, and extracting the gas in the aforementioned treatment space from the aforementioned inlet; and a concentration meter connected to the aforementioned outlet of the aforementioned exhaust pipe, and measuring the ozone concentration of the gas flowing in from the aforementioned outlet.

於前述光處理裝置中, 前述抽氣管具備複數前述取入口; 複數前述取入口,係沿著前述搬送滾筒的旋轉軸方向排列亦可。 In the aforementioned light processing device, the aforementioned exhaust pipe is provided with a plurality of aforementioned inlets; the plurality of aforementioned inlets may be arranged along the direction of the rotation axis of the aforementioned conveying drum.

透過採用前述構成,在發生某些異常、主處理室內的臭氧濃度超過了規定的範圍的情況下、或儘管搬入了工件但臭氧濃度未到達規定的範圍的情況下等,可緊急停止光處理裝置。又,在該構成中,由於可記錄主處理室內的臭氧濃度的變化,因此,例如在處理完畢的工件中發生了不良的情況下,可確認、分析在光處理裝置所致的處理中是否發生了異常。By adopting the above-mentioned structure, when some abnormality occurs, the ozone concentration in the main processing chamber exceeds the predetermined range, or the ozone concentration does not reach the predetermined range despite loading the workpiece, the light processing device can be stopped urgently. . Furthermore, in this configuration, since changes in the ozone concentration in the main processing chamber can be recorded, for example, when a defect occurs in a processed workpiece, it can be confirmed and analyzed whether it occurred during processing by the optical processing device. Exception.

前述光處理裝置亦可具備: 加工氣體控制部,係基於前述濃度計所測定的臭氧濃度,控制從前述氣體導入口導入至前述主處理室內之加工氣體的流量。 The aforementioned light processing device may also be equipped with: The processing gas control unit controls the flow rate of the processing gas introduced from the gas inlet into the main processing chamber based on the ozone concentration measured by the concentration meter.

前述光處理裝置亦可具備: 電力控制部,係基於前述濃度計所測定的臭氧濃度,控制向前述紫外光源供給的電力。 The aforementioned light processing device may also be equipped with: The power control unit controls the power supplied to the ultraviolet light source based on the ozone concentration measured by the densitometer.

透過採用前述構成,可監視主處理室之處理空間內的臭氧濃度,進而可進行回饋控制,以使處理空間內的臭氧濃度穩定在所希望的濃度。所以,光處理裝置在處理工件的過程中的主處理室的處理空間內的臭氧濃度的變動進一步變小,能夠更加均質地處理工件整體。 [發明的效果] By adopting the above structure, the ozone concentration in the processing space of the main processing chamber can be monitored, and feedback control can be performed to stabilize the ozone concentration in the processing space at a desired concentration. Therefore, the optical processing apparatus can further reduce the fluctuation of the ozone concentration in the processing space of the main processing chamber during processing of the workpiece, and can process the entire workpiece more uniformly. [Effects of the invention]

依據本發明,可實現即使在使處裡室內的臭氧濃度降低而進行了工件的處理的情況下,也能夠穩定且均質地進行處理的光處理裝置。According to the present invention, it is possible to realize a light processing device that can perform processing stably and uniformly even when processing a workpiece with the ozone concentration in the processing room being reduced.

[裝置構成][Device structure]

以下,針對本發明的光處理裝置,參照圖式來進行說明。再者,關於光處理裝置的以下的各圖式都是示意圖示者,圖式上的尺寸比及個數與實際的尺寸比及個數不一定一致。The light processing device of the present invention is described below with reference to the drawings. In addition, the following drawings of the light processing device are schematic illustrations, and the size ratios and numbers in the drawings are not necessarily consistent with the actual size ratios and numbers.

又,以下,在說明光處理裝置的構成的基礎上,有具體特定工件而進行說明的狀況。然而,本發明的光處理裝置作為對象的工件並不限定於以下的說明中所特定的工件。In addition, in the following description of the configuration of the light processing device, a workpiece is specifically specified and described. However, the workpiece that the light processing device of the present invention is targeted at is not limited to the workpiece specified in the following description.

(光處理裝置1) 圖1係從Y方向觀察光處理裝置的一實施方式時的示意圖,圖2係圖1的處理空間A1周邊的放大圖。如圖1所示,光處理裝置1具備主處理室2、搬入副處理室3、搬出副處理室4、由複數搬送滾筒5a構成的搬送機構5、加工氣體控制部10、氣體供給源11以及排氣控制部12。再者,排氣控制部12是一個控制部,但為了方便圖示,分成複數個進行圖示。 (Light processing device 1) FIG. 1 is a schematic diagram of an embodiment of the optical processing device viewed from the Y direction, and FIG. 2 is an enlarged view of the periphery of the processing space A1 in FIG. 1 . As shown in FIG. 1 , the optical processing apparatus 1 includes a main processing chamber 2, a loading sub-processing chamber 3, a transport sub-processing chamber 4, a transport mechanism 5 composed of a plurality of transport rollers 5a, a process gas control unit 10, a gas supply source 11, and Exhaust gas control unit 12. In addition, the exhaust control unit 12 is one control unit, but for convenience of illustration, it is divided into plural units and shown in the figure.

在以下的說明中,如圖1所示,將工件W1的搬送方向設為X方向,將搬送機構5所具備之搬送滾筒5a的旋轉軸方向設為Y方向,將與XY平面正交的方向設為Z方向。In the following description, as shown in FIG. 1 , the conveying direction of the workpiece W1 is defined as the X direction, the rotation axis direction of the conveying roller 5 a provided in the conveying mechanism 5 is defined as the Y direction, and the direction perpendicular to the XY plane is defined as the Z direction.

又,在表現方向時區別正負的方向時,如「+Z方向」、「-Z方向」般,附加正負的符號記載,不區別正負的方向來表現方向時,僅記載為「Z方向」。In addition, when expressing a direction by distinguishing between positive and negative directions, such as "+Z direction" and "-Z direction", positive and negative symbols are added and described. When a direction is expressed without distinguishing between positive and negative directions, it is simply described as "Z direction".

如圖1所示,在光處理裝置1中,朝向+X方向,依次排列有搬入副處理室3、主處理室2、搬出副處理室4。如圖1所示,搬送機構5將載置於搬送滾筒5a上的工件W1向+X方向搬送。As shown in FIG. 1 , in the optical processing apparatus 1 , a carry-in sub-processing chamber 3 , a main processing chamber 2 , and a carry-out sub-processing chamber 4 are arranged in order toward the +X direction. As shown in FIG. 1 , the conveyance mechanism 5 conveys the workpiece W1 placed on the conveyance drum 5a in the +X direction.

如圖2所示,搬入副處理室3與主處理室2以相互接觸的方式配置,後述的第一搬入口2a與第二搬出口3b連通。又,主處理室2與搬出副處理室4以相互接觸的方式配置,後述的第一搬出口2b與第三搬入口4a連通。As shown in Fig. 2, the loading sub-processing chamber 3 and the main processing chamber 2 are arranged in contact with each other, and the first loading port 2a and the second loading port 3b described later are connected. In addition, the main processing chamber 2 and the unloading sub-processing chamber 4 are arranged in contact with each other, and the first loading port 2b and the third loading port 4a described later are connected.

如圖2所示,加工氣體控制部10具備測定處理空間A1內之氣氛氣體的臭氧濃度的濃度計10a。濃度計10a測定藉由抽氣管22抽出的主處理室2內之氣氛氣體G2的臭氧濃度。然後,如圖1所示,加工氣體控制部10基於由濃度計10a測定的臭氧濃度,對氣體供給源11輸出包括與加工氣體G1之流量相關的資訊的控制信號d1。另外,加工氣體控制部10與濃度計10a也可以分體構成。As shown in FIG2 , the process gas control unit 10 is provided with a concentration meter 10a for measuring the ozone concentration of the atmospheric gas in the process space A1. The concentration meter 10a measures the ozone concentration of the atmospheric gas G2 in the main process chamber 2 extracted by the exhaust pipe 22. Then, as shown in FIG1 , the process gas control unit 10 outputs a control signal d1 including information related to the flow rate of the process gas G1 to the gas supply source 11 based on the ozone concentration measured by the concentration meter 10a. In addition, the process gas control unit 10 and the concentration meter 10a may also be separately configured.

氣體供給源11基於從加工氣體控制部10輸入的控制信號d1,向主處理室2的配置有紫外光源20的處理空間A1內,以指定的流量供給加工氣體G1。The gas supply source 11 supplies the processing gas G1 at a designated flow rate into the processing space A1 in the main processing chamber 2 in which the ultraviolet light source 20 is arranged, based on the control signal d1 input from the processing gas control unit 10 .

本實施形態中的加工氣體G1是含有氧氣與氮氣的混合氣體,典型來說不是空氣。再者,作為加工氣體G1,例如也可以採用混合了CDA(乾淨乾燥空氣)與氮氣的混合氣體。本實施形態中的加工氣體G1以氧的含有率為0.1%,氮的含有率為99.9%之方式進行調整。The processing gas G1 in this embodiment is a mixed gas containing oxygen and nitrogen, and is typically not air. Furthermore, as the processing gas G1, for example, a mixed gas of CDA (clean dry air) and nitrogen may be used. The processing gas G1 in this embodiment is adjusted so that the oxygen content is 0.1% and the nitrogen content is 99.9%.

(主處理室2) 如圖1所示,主處理室2具備複數紫外光源20、配管21、抽氣管22、主排氣口2c、分隔構件2p以及排氣用風扇2f。在主處理室2中收容有搬送機構5的一部分。然後,如圖2所示,在主處理室2的壁面上設有在X方向上對向的第一搬入口2a與第一搬出口2b,構成為工件W1從第一搬入口2a搬入,從第一搬出口2b搬出。 (Main processing chamber 2) As shown in FIG1 , the main processing chamber 2 has a plurality of ultraviolet light sources 20, piping 21, exhaust pipe 22, main exhaust port 2c, partition member 2p, and exhaust fan 2f. A portion of the conveying mechanism 5 is accommodated in the main processing chamber 2. Then, as shown in FIG2 , a first loading port 2a and a first loading port 2b facing each other in the X direction are provided on the wall surface of the main processing chamber 2, so that the workpiece W1 is loaded from the first loading port 2a and unloaded from the first loading port 2b.

如圖2所示,紫外光源20是對藉由搬送機構5搬送的工件W1照射紫外光的光源。本實施形態中的紫外光源20是在管體內封入含有氙(Xe)氣的發光氣體,並透過從電源部(未圖示)施加電壓而出射主要發光波長為172nm的紫外光的準分子燈。As shown in FIG. 2 , the ultraviolet light source 20 is a light source that irradiates ultraviolet light to the workpiece W1 conveyed by the conveyance mechanism 5 . The ultraviolet light source 20 in this embodiment is an excimer lamp in which a luminescent gas containing xenon (Xe) gas is sealed in a tube body, and a voltage is applied from a power supply unit (not shown) to emit ultraviolet light with a main emission wavelength of 172 nm.

紫外光源20以在Z方向上與藉由搬送機構5搬送的工件W1的間隔距離為10mm以下之方式配置。The ultraviolet light source 20 is disposed so as to be spaced apart from the workpiece W1 transported by the transport mechanism 5 in the Z direction by 10 mm or less.

再者,紫外光源20只要是可出射主要發光波長為200nm以下的紫外光的光源,採用準分子燈以外的光源亦可。又,即使在採用準分子燈的情況下,也可以採用封入有含有氙(Xe)氣以外之氣體的發光氣體的準分子燈。Furthermore, the ultraviolet light source 20 may be a light source other than an excimer lamp as long as it can emit ultraviolet light with a main emission wavelength of 200 nm or less. Furthermore, even when an excimer lamp is used, an excimer lamp containing a luminescent gas other than xenon (Xe) gas may be used.

又,本實施形態中的準分子燈是以與管軸正交的面切斷時的形狀呈矩形狀的準分子燈,且為呈也被稱為扁平管形狀的準分子燈,但也可以採用呈扁平管形狀以外的形狀(例如被稱為單管形狀、雙重管形狀的形狀)的準分子燈。In addition, the excimer lamp in this embodiment is an excimer lamp that has a rectangular shape when cut along a plane orthogonal to the tube axis, and is also called a flat tube shape, but it may also be An excimer lamp having a shape other than a flat tube shape (for example, a shape called a single tube shape or a double tube shape) is used.

配管21是將從氣體供給源11供給的加工氣體G1導向主處理室2內的構件。在本實施形態中,如圖2所示,配管21的一部分分歧,成為從複數氣體導入口21a供給加工氣體G1的構成。再者,關於配管21的構成或形狀、設置氣體導入口21a的數量等,考慮主處理室2的大小、內部構造等而決定。例如,也可以在X方向上,在主處理室2的中央部側即燈管20之間的空間進一步設置配管21。The piping 21 is a member that guides the processing gas G1 supplied from the gas supply source 11 into the main processing chamber 2 . In this embodiment, as shown in FIG. 2 , a part of the pipe 21 is branched, and the processing gas G1 is supplied from a plurality of gas inlets 21 a. In addition, the structure or shape of the piping 21, the number of the gas introduction ports 21a, etc. are determined taking into account the size, internal structure, etc. of the main processing chamber 2. For example, the pipe 21 may be further provided in the space between the lamp tubes 20 on the center side of the main processing chamber 2 in the X direction.

在此,如圖2所示,在本實施形態中,配置於搬入副處理室3側的配管21構成為向+X方向噴射加工氣體G1,並且也向-Z方向噴射加工氣體G1。根據該構成,可抑制伴隨著工件W1的搬入之包含外部氣體的氣體從搬入副處理室3向主處理室2流入。Here, as shown in Fig. 2, in this embodiment, the pipe 21 disposed on the side of the loading sub-processing chamber 3 is configured to spray the processing gas G1 in the +X direction and also spray the processing gas G1 in the -Z direction. According to this configuration, the gas including the external gas accompanying the loading of the workpiece W1 can be suppressed from flowing from the loading sub-processing chamber 3 into the main processing chamber 2.

圖3是從X方向觀察主處理室2時的圖式。如圖1~圖3所示,在抽氣管22中,配置於主處理室2內的一端部即取入口22a配置於處理空間A1內,另一端部即排出口22b連接於加工氣體控制部10所具備之測定臭氧濃度的濃度計10a。藉由該構成,抽氣管22將處理空間A1內的含有臭氧的氣氛氣體G2導向濃度計10a。FIG. 3 is a diagram of the main processing chamber 2 when viewed from the X direction. As shown in FIGS. 1 to 3 , in the exhaust pipe 22 , one end, that is, the inlet 22 a disposed in the main processing chamber 2 is disposed in the processing space A1 , and the other end, that is, the discharge port 22 b, is connected to the processing gas control unit 10 Equipped with a concentration meter 10a for measuring ozone concentration. With this configuration, the exhaust pipe 22 guides the ozone-containing atmospheric gas G2 in the processing space A1 to the concentration meter 10a.

取入口22a也可以配置於處理空間A1內的任意的位置,但在本實施形態中,為了更準確地監視工件W1周邊的臭氧濃度是否處於所希望的範圍內,在Z方向上配置於與紫外光源20的光出射面20a相同的位置。The inlet 22a can also be arranged at any position in the processing space A1, but in this embodiment, in order to more accurately monitor whether the ozone concentration around the workpiece W1 is within the desired range, it is arranged at the same position as the light emitting surface 20a of the ultraviolet light source 20 in the Z direction.

如圖3所示,本實施形態的抽氣管22設有合流部22c,複數取入口22a在Y方向上等間隔地排列。再者,在主處理室2足夠小、透過從一處吸引處理空間A1內的氣氛氣體G2,可穩定地測量臭氧濃度的情況下,抽氣管22不具備合流部22c,取入口22a僅為一個亦可。As shown in Fig. 3, the exhaust pipe 22 of this embodiment is provided with a confluence portion 22c, and a plurality of inlets 22a are arranged at equal intervals in the Y direction. Furthermore, if the main processing chamber 2 is small enough and the ozone concentration can be stably measured by sucking the atmosphere gas G2 in the processing space A1 from one place, the exhaust pipe 22 does not have the confluence portion 22c, and the inlet 22a may be only one.

如圖1所示,主排氣口2c是將主處理室2內的氣氛氣體G2向主處理室2的外側排出的排氣口。在本實施形態中,藉由排氣控制部12控制排氣用風扇2f的轉速來調整從主排氣口2c排出的氣氛氣體G2的量。1, the main exhaust port 2c is an exhaust port for exhausting the atmosphere G2 in the main processing chamber 2 to the outside of the main processing chamber 2. In this embodiment, the exhaust control unit 12 controls the rotation speed of the exhaust fan 2f to adjust the amount of the atmosphere G2 exhausted from the main exhaust port 2c.

圖4A是示意揭示主處理室2內之搬送機構5的構成的立體圖,圖4B是從+Z側觀察圖4A的搬送機構5時的圖式,圖4C是從Y方向觀察圖4A的搬送機構5時的圖式。如圖4A~圖4C所示,分隔構件2p形成有與複數搬送滾筒5a分別對應的複數孔2pb,透過在孔2pb中插通搬送滾筒5a的狀態下進行固定,從而將主處理室2內的空間在Z方向上劃分為處理空間A1與滯留空間A2。而且,如圖4C所示,搬送滾筒5a的一部分比分隔構件2p的主面2pa更向+Z側突出,由此工件W1不被分隔構件2p阻擋地向X方向搬送。FIG. 4A is a perspective view schematically showing the structure of the conveying mechanism 5 in the main processing chamber 2, FIG. 4B is a view of the conveying mechanism 5 in FIG. 4A viewed from the +Z side, and FIG. 4C is a view of the conveying mechanism 5 in FIG. 4A viewed from the Y direction. As shown in FIG. 4A to FIG. 4C, the partition member 2p is formed with a plurality of holes 2pb corresponding to the plurality of conveying rollers 5a, and the conveying rollers 5a are inserted into the holes 2pb and fixed, thereby dividing the space in the main processing chamber 2 into a processing space A1 and a retention space A2 in the Z direction. Moreover, as shown in FIG. 4C, a portion of the conveying roller 5a protrudes further to the +Z side than the main surface 2pa of the partition member 2p, so that the workpiece W1 is conveyed in the X direction without being blocked by the partition member 2p.

再者,雖然僅為一例,但本實施形態中的分隔構件2p的大小為(X,Y)=(280mm,3400mm)。另外,設於分隔構件2p的孔2pb的大小為(X,Y)=(28mm,13mm),一個搬送滾筒5a的直徑為45mm,Y方向的長度為11mm。而且,在主處理室2內配置有60個搬送滾筒5a。Furthermore, although this is only an example, the size of the partition member 2p in this embodiment is (X, Y)=(280 mm, 3400 mm). In addition, the size of the hole 2pb provided in the partition member 2p is (X, Y)=(28mm, 13mm), the diameter of one conveying roller 5a is 45mm, and the length in the Y direction is 11mm. Furthermore, 60 conveyance rollers 5a are arranged in the main processing chamber 2.

(搬入副處理室3) 如圖1所示,搬入副處理室3具備複數副排氣口(3c1、3c2)和分隔構件3p,收容有搬送機構5的一部分。而且,如圖1所示,在搬入副處理室3的壁面設有在X方向上對向的第二搬入口3a與第二搬出口3b,工件W1從第二搬入口3a搬入,從第二搬出口3b搬出。 (Move into sub-processing room 3) As shown in FIG. 1 , the loading sub-processing chamber 3 is provided with a plurality of sub-exhaust ports (3c1, 3c2) and a partition member 3p, and accommodates a part of the transport mechanism 5. Furthermore, as shown in FIG. 1 , a second import port 3 a and a second export port 3 b facing each other in the X direction are provided on the wall surface of the import sub-processing chamber 3 . The workpiece W1 is imported from the second import port 3 a and from the second import port 3 b . Move out through exit 3b.

如圖1所示,在搬入副處理室3中設有分隔構件3p,內側的空間被劃分為搬送機構5的+Z側的空間B1和-Z側的空間B2。As shown in FIG. 1 , the loading sub-processing chamber 3 is provided with a partition member 3 p, and the space inside is divided into a space B1 on the +Z side of the transport mechanism 5 and a space B2 on the -Z side.

副排氣口3c1是用以吸引存在於空間B1內之氣氛氣體G3並向搬入副處理室3的外側排氣的開口。The sub-exhaust port 3c1 is an opening for sucking in the atmospheric gas G3 existing in the space B1 and exhausting it to the outside of the sub-processing chamber 3.

副排氣口3c2是用以吸引存在於空間B2內之氣氛氣體G3並向搬入副處理室3的外側排氣的開口。The sub-exhaust port 3c2 is an opening for sucking in the atmospheric gas G3 existing in the space B2 and exhausting it to the outside of the sub-processing chamber 3.

本實施形態中的副排氣口(3c1、3c2)是將存在於搬入副處理室3之內側的氣氛氣體G3向外側排氣的開口,均相當於第一副排氣口。The auxiliary exhaust ports (3c1, 3c2) in this embodiment are openings for exhausting the atmospheric gas G3 existing inside the loading sub-processing chamber 3 to the outside, and each of them corresponds to the first auxiliary exhaust port.

如圖1所示,在副排氣口(3c1、3c2)的每一個上設有用於排出搬入副處理室3內的氣氛氣體G3的排氣用風扇3f,透過排氣控制部12控制排氣用風扇3f的轉速,調整對搬入副處理室3內的氣氛氣體G3進行排氣的量。As shown in FIG. 1 , each of the auxiliary exhaust ports (3c1, 3c2) is provided with an exhaust fan 3f for exhausting the ambient gas G3 carried into the auxiliary processing chamber 3, and the exhaust is controlled by the exhaust control unit 12. The amount of exhaust gas G3 carried into the sub-processing chamber 3 is adjusted by the rotation speed of the fan 3f.

再者,排氣控制部12以使每單位時間從主排氣口2c排出的氣氛氣體G2的量比從副排氣口(3c1、3c2)排出的氣氛氣體G3的總量少之方式控制排氣用風扇3f。藉此,搬入副處理室3的空間B1的氣壓比主處理室2的處理空間A1的氣壓低,可抑制氣氛氣體G3從搬入副處理室3流入主處理室2。Furthermore, the exhaust control unit 12 controls the exhaust fan 3f in such a manner that the amount of the atmosphere gas G2 exhausted from the main exhaust port 2c per unit time is less than the total amount of the atmosphere gas G3 exhausted from the auxiliary exhaust ports (3c1, 3c2). Thus, the air pressure of the space B1 carried into the auxiliary processing chamber 3 is lower than the air pressure of the processing space A1 of the main processing chamber 2, and the flow of the atmosphere gas G3 from the carried-in auxiliary processing chamber 3 into the main processing chamber 2 can be suppressed.

在本實施形態中,調整為從主排氣口2c每單位時間排出的氣氛氣體G2的量為10L/min,從副排氣口(3c1、3c2)每單位時間排出的氣氛氣體G3的量為950L/min。也就是說,以每單位時間從主排氣口2c排出的氣氛氣體G2的總量比從副排氣口(3c1、3c2)排出的氣氛氣體G3的總量少之方式進行控制。In this embodiment, the amount of ambient gas G2 discharged from the main exhaust port 2c per unit time is adjusted to 10 L/min, and the amount of ambient gas G3 discharged from the auxiliary exhaust ports (3c1, 3c2) per unit time is adjusted to 10L/min. 950L/min. That is, it is controlled so that the total amount of the atmosphere gas G2 discharged from the main exhaust port 2c per unit time is smaller than the total amount of the atmosphere gas G3 discharged from the auxiliary exhaust ports (3c1, 3c2).

(搬出副處理室4) 如圖1所示,搬出副處理室4具備複數第二副排氣口(4c1、4c2)與分隔構件4p,收容有搬送機構5的一部分。而且,如圖1所示,在搬出副處理室4的壁面上設有在X方向上對向的第三搬入口4a與第三搬出口4b,工件W1從第三搬入口4a搬入,從第三搬出口4b搬出。 (Carry-out sub-processing chamber 4) As shown in FIG. 1 , the carry-out sub-processing chamber 4 has a plurality of second sub-exhaust ports (4c1, 4c2) and a partition member 4p, and accommodates a portion of the conveying mechanism 5. Furthermore, as shown in FIG. 1 , a third carry-in port 4a and a third carry-out port 4b facing each other in the X direction are provided on the wall surface of the carry-out sub-processing chamber 4, and the workpiece W1 is carried in from the third carry-in port 4a and carried out from the third carry-out port 4b.

如圖1所示,在搬出副處理室4中設有分隔構件4p,內側的空間被劃分為搬送機構5的+Z側的空間C1與-Z側的空間C2。As shown in FIG. 1 , a partition member 4 p is provided in the unloading sub-processing chamber 4 , and the space inside is divided into a space C1 on the +Z side of the transport mechanism 5 and a space C2 on the −Z side.

副排氣口4c1是用以吸引存在於空間C1內的氣氛氣體G4並向搬出副處理室4的外側排氣的開口。The sub-exhaust port 4c1 is an opening for sucking in the atmospheric gas G4 existing in the space C1 and exhausting it out of the sub-processing chamber 4.

副排氣口4c2是用以吸引存在於空間C2內的氣氛氣體G4並向搬出副處理室4的外側排氣的開口。The sub-exhaust port 4c2 is an opening for sucking the atmospheric gas G4 existing in the space C2 and exhausting it to the outside of the sub-processing chamber 4.

本實施形態中的副排氣口(4c1、4c2)是將存在於搬出副處理室4的內側的氣氛氣體G4向外側排氣的開口,均相當於第二副排氣口。The auxiliary exhaust ports (4c1, 4c2) in this embodiment are openings for exhausting the atmospheric gas G4 existing inside the unloading sub-processing chamber 4 to the outside, and each of them corresponds to the second auxiliary exhaust port.

如圖1所示,在副排氣口(4c1、4c2)的每一個上設有用於排出搬出副處理室4內的氣氛氣體G4的排氣用風扇4f,排氣控制部12控制排氣用風扇4f的轉速,調整對搬出副處理室4內的氣氛氣體G4進行排氣的量。As shown in Figure 1, an exhaust fan 4f is provided on each of the auxiliary exhaust ports (4c1, 4c2) for exhausting the atmospheric gas G4 carried out of the auxiliary processing chamber 4. The exhaust control unit 12 controls the speed of the exhaust fan 4f to adjust the amount of exhaust of the atmospheric gas G4 carried out of the auxiliary processing chamber 4.

在本實施形態中,以從副排氣口(4c1、4c2)每單位時間排出的氣氛氣體G4的量為950L/min之方式進行調整。也就是說,以每單位時間從主排氣口2c排出的氣氛氣體G2的總量比從副排氣口(4c1、4c2)排出的氣氛氣體G4的總量少之方式進行控制。In this embodiment, the amount of ambient gas G4 discharged from the auxiliary exhaust ports (4c1, 4c2) per unit time is adjusted so that it becomes 950 L/min. That is, it is controlled so that the total amount of the atmosphere gas G2 discharged from the main exhaust port 2c per unit time is smaller than the total amount of the atmosphere gas G4 discharged from the auxiliary exhaust ports (4c1, 4c2).

每單位時間從副排氣口(3c1、3c2)排出的氣氛氣體G3的總量和從副排氣口(4c1、4c2)排出的氣氛氣體G4的總量如本實施形態般設定為相同為佳。更詳細地說,每單位時間從副排氣口3c1排出的氣氛氣體G3和從副排氣口4c1排出的氣氛氣體G4的量相同,並且每單位時間從副排氣口3c2排出的氣氛氣體G3和從副排氣口4c2排出的氣氛氣體G4的量相同為佳。但是,從各個排氣口(3c1、3c2、4c1、4c2)排出的氣氛氣體(G3、G4)的量各不相同亦可。It is preferred that the total amount of the atmosphere gas G3 discharged from the auxiliary exhaust ports (3c1, 3c2) and the total amount of the atmosphere gas G4 discharged from the auxiliary exhaust ports (4c1, 4c2) are set to be the same as in the present embodiment. More specifically, it is preferred that the amount of the atmosphere gas G3 discharged from the auxiliary exhaust port 3c1 and the amount of the atmosphere gas G4 discharged from the auxiliary exhaust port 4c1 are the same per unit time, and it is preferred that the amount of the atmosphere gas G3 discharged from the auxiliary exhaust port 3c2 and the amount of the atmosphere gas G4 discharged from the auxiliary exhaust port 4c2 are the same per unit time. However, the amount of the atmosphere gas (G3, G4) discharged from each exhaust port (3c1, 3c2, 4c1, 4c2) may be different.

再者,排氣控制部12以使每單位時間從主排氣口2c排出的氣氛氣體G2的量比從副排氣口(4c1、4c2)排出的氣氛氣體G4的總量少之方式控制排氣用風扇4f,。藉此,搬出副處理室4的空間C1的氣壓比主處理室2的處理空間A1的氣壓低,可抑制氣氛氣體G4從搬出副處理室4流入主處理室2。Furthermore, the exhaust gas control unit 12 controls the exhaust gas so that the amount of the atmosphere gas G2 discharged from the main exhaust port 2c per unit time is smaller than the total amount of the atmosphere gas G4 discharged from the auxiliary exhaust ports (4c1, 4c2). Gas fan 4f,. Thereby, the air pressure of the space C1 of the unloading sub-processing chamber 4 is lower than the air pressure of the processing space A1 of the main processing chamber 2 , thereby suppressing the flow of the ambient gas G4 from the unloading sub-processing chamber 4 into the main processing chamber 2 .

[驗證實驗] 在此,由於實施了確認本實施形態的光處理裝置1與先前構成的光處理裝置相比,使主處理室2的處理空間A1內的臭氧濃度穩定在更低的濃度的驗證實驗,以下進行說明。 [Verification Experiment] Here, a verification experiment was conducted to confirm that the light processing device 1 of this embodiment can stabilize the ozone concentration in the processing space A1 of the main processing chamber 2 at a lower concentration than the light processing device of the previous configuration, and the following is an explanation.

(實施例) 實施例作為上述本實施形態的光處理裝置1。 (Example) The example is the light processing device 1 of the above-mentioned embodiment.

(比較例1) 圖5A是從Y方向觀察比較例1的構成時的示意圖。如圖5A所示,比較例1除了不具備分隔構件(2p、3p、4p)以外,與實施例相同的構成。 (Comparative example 1) FIG. 5A is a schematic diagram of the structure of Comparative Example 1 viewed from the Y direction. As shown in FIG. 5A , Comparative Example 1 has the same structure as the Example except that it does not include the partition members (2p, 3p, 4p).

(比較例2) 圖5B是從Y方向觀察比較例2的構成時的示意圖。如圖5B所示,比較例2除了不具備搬入副處理室3、搬出副處理室4及分隔構件2p以外,與實施例相同的構成。 (Comparative example 2) FIG. 5B is a schematic diagram of the structure of Comparative Example 2 when viewed from the Y direction. As shown in FIG. 5B , Comparative Example 2 has the same structure as the Example except that it does not include the loading sub-processing chamber 3 , the transporting sub-processing chamber 4 , and the partition member 2 p.

(條件) 臭氧濃度的測定藉由濃度計10a進行。又,不搬送工件W1,臭氧濃度的測定時間設為5分鐘。 (Conditions) The ozone concentration is measured by the concentration meter 10a. In addition, the workpiece W1 is not transported, and the ozone concentration measurement time is set to 5 minutes.

(結果) 圖6是揭示濃度計10a所測定之臭氧濃度的時間變化的圖表。如圖6所示,可以確認比較例1的臭氧濃度相對於比較例2,變動被抑制,在更低的濃度下穩定。然後,可以確認實施例相對於比較例1,變動被進一步抑制,在更低的臭氧濃度下穩定。 (Results) Figure 6 is a graph showing the time variation of the ozone concentration measured by the concentration meter 10a. As shown in Figure 6, it can be confirmed that the ozone concentration of Comparative Example 1 is suppressed in variation and stabilized at a lower concentration than that of Comparative Example 2. Then, it can be confirmed that the variation of the embodiment is further suppressed and stabilized at a lower ozone concentration than that of Comparative Example 1.

依據以上內容,光處理裝置1與外部氣體直接流入主處理室2內之先前的構成相比,抑制了主處理室2內的臭氧濃度的變動,且在處理空間A1內生成的臭氧容易停留在工件W1周邊。所以,光處理裝置1相較於先前的光處理裝置,即使是較低的臭氧濃度,也能夠穩定且均質地處理工件整體。According to the above, the optical processing device 1 suppresses the change of the ozone concentration in the main processing chamber 2, and the ozone generated in the processing space A1 tends to stay around the workpiece W1, compared with the previous optical processing device, even with a lower ozone concentration, the optical processing device 1 can stably and uniformly process the entire workpiece.

再者,流入主處理室2內的氣體中,伴隨著工件W1的搬入從第一搬入口2a流入處理空間A1內的氣體的比例非常大。因此,根據主處理室2、第一搬入口2a及第一搬出口2b的尺寸,即使光處理裝置1不具備搬出副處理室4,也有可使主處理室2的處理空間A1內的臭氧濃度充分地穩定的狀況。Furthermore, of the gas flowing into the main processing chamber 2, a large proportion of the gas flowing into the processing space A1 from the first loading port 2a accompanying the loading of the workpiece W1 is present. Therefore, even if the optical processing apparatus 1 does not have a sub-processing chamber 4 for unloading, the ozone concentration in the processing space A1 of the main processing chamber 2 can be sufficiently stabilized according to the sizes of the main processing chamber 2, the first loading port 2a, and the first loading port 2b.

又,在副處理室(3、4)內,氣氛氣體(G3、G4)的循環對主處理室2的處理空間A1內之臭氧濃度幾乎沒有影響。因此,對於副處理室(3、4),不設置分隔構件(3p、4p)亦可。Furthermore, the circulation of the atmosphere gas (G3, G4) in the auxiliary processing chambers (3, 4) has almost no effect on the ozone concentration in the processing space A1 of the main processing chamber 2. Therefore, the auxiliary processing chambers (3, 4) do not need to be provided with partition members (3p, 4p).

圖7A及圖7B是揭示搬送機構5及分隔構件2p之一構成例的示意圖。如圖7A所示,分隔構件2p作為不設置使搬送滾筒5a貫通的孔2pb而設置收容搬送滾筒5a的收容袋2pc的構成亦可,作為配置於搬送滾筒5a的-Z側之未設有孔2pb、收容袋2pc的板狀的構件亦可。又,在此對分隔構件2p的構成進行了說明,但設於各副處理室(3、4)的分隔構件(3p、4p)作為如上所述的構成亦可,進而,分隔構件(2p、3p、4p)的形狀各不相同亦可。Fig. 7A and Fig. 7B are schematic diagrams showing an example of the structure of the conveying mechanism 5 and the partition member 2p. As shown in Fig. 7A, the partition member 2p may be a structure in which a receiving bag 2pc for receiving the conveying roller 5a is provided without a hole 2pb for passing the conveying roller 5a, or may be a plate-shaped member disposed on the -Z side of the conveying roller 5a without a hole 2pb or a receiving bag 2pc. In addition, although the structure of the partition member 2p is described here, the partition members (3p, 4p) provided in each auxiliary processing chamber (3, 4) may be the structure as described above, and further, the shapes of the partition members (2p, 3p, 4p) may be different from each other.

而且,如圖4A及圖4B所示,搬送滾筒5a在X方向及Y方向上排列,但配置位置可為任意,只要可沒有問題地搬送工件W1,採用不規則的配置亦可。然後,搬送滾筒5a單體的形狀可為任意,如圖7B所示,呈沿Y方向延伸的形狀亦可。4A and 4B, the conveying rollers 5a are arranged in the X direction and the Y direction, but the arrangement position can be arbitrary, and an irregular arrangement can be adopted as long as the workpiece W1 can be transported without problems. Then, the shape of the conveying roller 5a unit can be arbitrary, and as shown in FIG. 7B, it can be a shape extending in the Y direction.

在本實施形態中,具備從各排氣口(2c、3c1、3c2、4c1、4c2)排出各處理室(2、3、4)內之氣氛氣體(G2、G3、G4)的排氣控制機構,但光處理裝置1不具備排氣控制機構亦可。例如,藉由向處理空間A1內供給加工氣體G1,處理空間A1內的氣壓變高,在充分抑制氣氛氣體(G3、G4)的流入而使臭氧濃度穩定的情況下,不具備排氣控制機構亦可。又,氣氛氣體(G2、G3、G4)的排氣量的控制使用排氣用風扇(2f,3f,4f)以外的機構來進行亦可。例如,以可調整排出的氣氛氣體(G2、G3、G4)的量之方式,各排氣口(2c、3c1、3c2、4c1、4c2)經由風量調整用的風門、可變閥等,連通於設置在設施內的排氣用管道亦可。依據該構成,透過風量調整用的風門、可變閥等來調整引入排氣用管道之氣體的量,由此調整從各排氣口(2c、3c1、3c2、4c1、4c2)排出之氣氛氣體(G2、G3、G4)的量。再者,風量調整用的風門、可變閥的控制藉由排氣控制機構自動進行亦可,藉由人手動進行亦可。In this embodiment, an exhaust control mechanism is provided for exhausting the ambient gas (G2, G3, G4) in each processing chamber (2, 3, 4) from each exhaust port (2c, 3c1, 3c2, 4c1, 4c2). , but the light processing device 1 does not need to be equipped with an exhaust control mechanism. For example, when the pressure in the processing space A1 is increased by supplying the processing gas G1 into the processing space A1, and the inflow of the atmosphere gas (G3, G4) is sufficiently suppressed to stabilize the ozone concentration, an exhaust control mechanism is not provided. Yes. In addition, the exhaust volume of the ambient gas (G2, G3, G4) may be controlled using a mechanism other than the exhaust fan (2f, 3f, 4f). For example, each of the exhaust ports (2c, 3c1, 3c2, 4c1, 4c2) is connected to the exhaust port (2c, 3c1, 3c2, 4c1, 4c2) via a damper for air volume adjustment, a variable valve, etc., so that the amount of the discharged atmospheric gas (G2, G3, G4) can be adjusted. Exhaust ducts installed in the facility may also be used. According to this structure, the amount of gas introduced into the exhaust duct is adjusted through the air volume adjustment damper, variable valve, etc., thereby adjusting the atmospheric gas discharged from each exhaust port (2c, 3c1, 3c2, 4c1, 4c2) (G2, G3, G4) amount. Furthermore, the control of the damper and the variable valve for adjusting the air volume may be performed automatically by the exhaust control mechanism or manually.

在本實施形態中,透過濃度計10a測定處理空間A1內之氣氛氣體G2的臭氧濃度,控制從氣體供給源11供給之加工氣體G1的流量,但作為不具備濃度計10a,而以一定的流量從氣體供給源11供給加工氣體G1的構成亦可。In this embodiment, the ozone concentration of the atmospheric gas G2 in the processing space A1 is measured by the transmission concentration meter 10a, and the flow rate of the processing gas G1 supplied from the gas supply source 11 is controlled. However, the concentration meter 10a is not provided, and a constant flow rate is used. The processing gas G1 may be supplied from the gas supply source 11 .

[其他實施形態] 以下,針對其他實施形態進行說明。 [Other embodiments] Next, other embodiments will be described.

<1>圖8是從Y方向觀察光處理裝置1的其他實施形態時的示意圖。如圖8所示,光處理裝置1亦可具備:具有濃度計10a,因應濃度計10a所測定之主處理室2內的氣氛氣體G2的臭氧濃度,控制向紫外光源20供給的電力的電力控制部80。<1> FIG. 8 is a schematic diagram of another embodiment of the light processing device 1 viewed from the Y direction. As shown in FIG. 8 , the light processing apparatus 1 may include a concentration meter 10 a and power control for controlling the power supplied to the ultraviolet light source 20 in response to the ozone concentration of the atmospheric gas G2 in the main processing chamber 2 measured by the concentration meter 10 a. Department 80.

在前述構成的情況下,例如,使從氣體供給源11供給的加工氣體G1的量設為一定,藉由從紫外光源20出射之紫外光的強度,控制在處理空間A1內生成之臭氧的量。In the case of the above-mentioned structure, for example, the amount of the processing gas G1 supplied from the gas supply source 11 is set constant, and the amount of ozone generated in the processing space A1 is controlled by the intensity of the ultraviolet light emitted from the ultraviolet light source 20.

從紫外光源20出射之紫外光的強度係例如透過驅動電壓、供給的電流的大小、在以交流供給的情況下可藉由頻率、工作比的調整等,與氣體的供給量的調整相比更細微地進行調整。The intensity of the ultraviolet light emitted from the ultraviolet light source 20 can be adjusted more finely than the adjustment of the supply amount of gas by, for example, adjusting the driving voltage, the magnitude of the supplied current, and, in the case of AC supply, adjusting the frequency and the duty ratio.

<2>圖9是從Y方向觀察光處理裝置1之與圖8不同的其他實施形態時的示意圖。如圖9所示,光處理裝置1具備用以監視處理空間A1的氣氛氣體G2之臭氧濃度的濃度計90a亦可,進而具備記錄濃度計90a所測定之氣氛氣體G2的臭氧濃度的資料的記錄部90b亦可。又,,光處理裝置1具備將該資料透過無線或有線發送到外部機器的發送部亦可。再者,記錄部90b例如是微電腦等所具備之記憶體、外部機器所具備之硬碟等、或記憶體裝置等單體的記錄媒體等。<2> FIG. 9 is a schematic diagram of another embodiment of the light processing device 1 different from FIG. 8 when viewed from the Y direction. As shown in FIG. 9 , the light processing device 1 may be provided with a concentration meter 90a for monitoring the ozone concentration of the atmosphere gas G2 of the processing space A1, and may be provided with a recording unit 90b for recording data of the ozone concentration of the atmosphere gas G2 measured by the concentration meter 90a. Furthermore, the light processing device 1 may be provided with a transmission unit for transmitting the data to an external device via wireless or wired means. Furthermore, the recording unit 90b is, for example, a memory provided in a microcomputer, a hard disk provided in an external device, or a single recording medium such as a memory device.

透過作為前述構成,例如在處理完畢的工件W1中發生了不良的情況下,可確認處理空間A1內的臭氧濃度是否發生了異常、對不良原因進行分析。又,在以可始終監視處理空間A1內之臭氧濃度的方式構成的情況下,在工件W1的處理中,可偵測處理空間A1內之臭氧濃度的異常。With the above-mentioned configuration, for example, when a defect occurs in the processed workpiece W1, it can be confirmed whether the ozone concentration in the processing space A1 is abnormal and the cause of the defect can be analyzed. Furthermore, in the case where the ozone concentration in the processing space A1 is always monitored, an abnormality in the ozone concentration in the processing space A1 can be detected during processing of the workpiece W1.

<3>前述之光處理裝置1所具備的構成僅為一例,本發明並不限定於圖示的各構成。<3> The configuration of the light processing device 1 described above is only an example, and the present invention is not limited to the configurations shown in the figures.

1:光處理裝置 2:主處理室 2a:第一搬入口 2b:第一搬出口 2c:主排氣口 2f:排氣用風扇 2p:分隔構件 2pa:主面 2pb:孔 2pc:收容袋 3:搬入副處理室 3a:第二搬入口 3b:第二搬出口 3c1:副排氣口 3c2:副排氣口 3f:排氣用風扇 3p:分隔構件 4:搬出副處理室 4a:第三搬入口 4b:第三搬出口 4c1:副排氣口 4c2:副排氣口 4f:排氣用風扇 4p:分隔構件 5:搬送機構 5a:搬送滾筒 10:加工氣體控制部 10a:濃度計 11:氣體供給源 12:排氣控制部 20:紫外光源 20a:光出射面 21:配管 21a:氣體導入口 22:抽氣管 22a:取入口 22b:排出口 22c:合流部 80:電力控制部 90a:濃度計 90b:記錄部 A1:處理空間 A2:滯留空間 B1:空間 B2:空間 C1:空間 C2:空間 d1:控制信號 G1:加工氣體 G2:氣氛氣體 G3:氣氛氣體 G4:氣氛氣體 W1:工件 1:Light processing device 2: Main processing room 2a: First entrance 2b: First exit 2c: Main exhaust port 2f: Exhaust fan 2p: Separate components 2pa: Main side 2pb: hole 2pc: Containment bag 3: Move into the deputy processing room 3a: Second entrance 3b: Second exit 3c1: Sub-exhaust port 3c2: Sub-exhaust port 3f: Exhaust fan 3p: Separate components 4: Move out of the deputy processing room 4a:The third entrance 4b: The third exit 4c1: Sub-exhaust port 4c2: Sub-exhaust port 4f: Exhaust fan 4p: Separate components 5:Transportation mechanism 5a:Conveying roller 10: Processing gas control department 10a:Concentrator 11:Gas supply source 12:Exhaust control department 20:UV light source 20a:Light exit surface 21:Piping 21a:Gas inlet 22:Suction tube 22a: Entrance 22b: Discharge outlet 22c: Convergence Department 80:Power Control Department 90a:Concentrator 90b:Records Department A1: Processing space A2: Detention space B1: Space B2: Space C1: Space C2: Space d1: control signal G1: Processing gas G2: Atmospheric gas G3: Atmospheric gas G4: Atmospheric gas W1: workpiece

[圖1]從Y方向觀察光處理裝置的一實施方式時的示意圖。 [圖2]圖1的處理空間A1周邊的放大圖。 [圖3]從X方向觀察主處理室時的圖式。 [圖4A]示意揭示主處理室內之搬送機構的構成的立體圖。 [圖4B]從+Z側觀察圖4A的搬送機構時的圖式。 [圖4C]從Y方向觀察圖4A的搬送機構時的圖式。 [圖5A]從Y方向觀察比較例1的構成時的示意圖。 [圖5B]從Y方向觀察比較例2的構成時的示意圖。 [圖6]揭示濃度計所測定之臭氧濃度的時間變化的圖表。 [圖7A]揭示搬送機構及分隔構件之一構成例的示意圖。 [圖7B]揭示搬送機構及分隔構件之一構成例的示意圖。 [圖8]從Y方向觀察光處理裝置的其他實施形態時的示意圖。 [圖9]從Y方向觀察光處理裝置的其他實施形態時的示意圖。 [Fig. 1] A schematic diagram of an embodiment of a light processing device viewed from the Y direction. [Fig. 2] An enlarged view of the periphery of the processing space A1 in Fig. 1. [Fig. 3] A view of the main processing chamber when viewed from the X direction. [Fig. 4A] A perspective view schematically showing the structure of the transport mechanism in the main processing chamber. [Fig. 4B] A view of the transport mechanism of Fig. 4A when viewed from the +Z side. [Fig. 4C] A view of the conveying mechanism of Fig. 4A when viewed from the Y direction. [Fig. 5A] A schematic view of the structure of Comparative Example 1 when viewed from the Y direction. [Fig. 5B] A schematic view of the structure of Comparative Example 2 when viewed from the Y direction. [Fig. 6] A graph showing temporal changes in ozone concentration measured by a densitometer. [Fig. 7A] A schematic diagram showing a structural example of a conveying mechanism and a partition member. [Fig. 7B] A schematic diagram showing a structural example of a conveying mechanism and a partition member. [Fig. 8] A schematic view of another embodiment of the light processing apparatus when viewed from the Y direction. [Fig. 9] A schematic diagram of another embodiment of the light processing apparatus viewed from the Y direction.

1:光處理裝置 1:Light processing device

2:主處理室 2: Main processing room

2a:第一搬入口 2a: First entrance

2b:第一搬出口 2b: First exit

2c:主排氣口 2c: Main exhaust port

2f:排氣用風扇 2f: Exhaust fan

2p:分隔構件 2p: Separating components

3:搬入副處理室 3: Move into the deputy processing room

3a:第二搬入口 3a: Second entrance

3b:第二搬出口 3b: Second exit

3c1:副排氣口 3c1: Sub-exhaust port

3c2:副排氣口 3c2: Auxiliary exhaust port

3f:排氣用風扇 3f: Exhaust fan

3p:分隔構件 3p: Separate components

4:搬出副處理室 4: Move out of the deputy processing room

4a:第三搬入口 4a:The third entrance

4b:第三搬出口 4b: The third exit

4c1:副排氣口 4c1: Sub-exhaust port

4c2:副排氣口 4c2: Sub-exhaust port

4f:排氣用風扇 4f: Exhaust fan

4p:分隔構件 4p: Separating components

5:搬送機構 5:Transportation mechanism

5a:搬送滾筒 5a: Transport roller

10:加工氣體控制部 10: Processing gas control department

10a:濃度計 10a: Concentration meter

11:氣體供給源 11:Gas supply source

12:排氣控制部 12: Exhaust control unit

21a:氣體導入口 21a:Gas inlet

A1:處理空間 A1: Processing space

A2:滯留空間 A2: Stagnation space

B1:空間 B1: Space

B2:空間 B2: Space

C1:空間 C1: Space

C2:空間 C2: Space

d1:控制信號 d1: control signal

G1:加工氣體 G1: Processing gas

G2:氣氛氣體 G2: Atmosphere gas

G3:氣氛氣體 G3: Atmospheric gas

G4:氣氛氣體 G4: Atmospheric gas

W1:工件 W1: workpiece

Claims (8)

一種光處理裝置,係對所搬送的工件照射紫外光的光處理裝置,其特徵為具備: 搬送機構,係搬送前述工件,具有複數搬送滾筒; 主處理室,係具有搬入藉由前述搬送機構搬送的前述工件的第一搬入口,與搬出前述工件的第一搬出口; 分隔構件,係在前述主處理室內,在與前述工件的搬送方向和前述搬送滾筒的旋轉軸方向正交的方向上,將前述複數搬送滾筒之間的至少一部分劃分為處理空間與滯留空間; 紫外光源,係配置於前述主處理室的前述處理空間內,朝向沿著前述搬送機構搬送的前述工件的一面,出射主要發光波長為200nm以下的紫外光; 氣體導入口,係向前述主處理室內導入加工氣體;及 搬入副處理室,係具有搬入所搬送的前述工件的第二搬入口,與搬出前述工件的第二搬出口,前述第二搬出口連通於前述第一搬入口; 前述搬送滾筒的至少一部分位於比前述分隔構件靠前述處理空間側的位置。 A light processing device is a light processing device that irradiates a workpiece being transported with ultraviolet light, and is characterized by comprising: a transport mechanism that transports the workpiece and has a plurality of transport rollers; a main processing chamber that has a first inlet for carrying in the workpiece transported by the transport mechanism and a first outlet for carrying out the workpiece; a partition member that divides at least a portion between the plurality of transport rollers in the main processing chamber in a direction orthogonal to the transport direction of the workpiece and the direction of the rotation axis of the transport roller into a processing space and a retention space; an ultraviolet light source that is disposed in the processing space of the main processing chamber and emits ultraviolet light having a main emission wavelength of less than 200 nm toward one side of the workpiece being transported along the transport mechanism; a gas inlet that introduces processing gas into the main processing chamber; and The secondary processing chamber is provided with a second loading port for loading the workpiece to be transported and a second loading port for unloading the workpiece, and the second loading port is connected to the first loading port; At least a part of the transport drum is located closer to the processing space than the partition member. 如請求項1所記載之光處理裝置,其中,具備: 至少一個主排氣口,係將前述主處理室內的氣體排出; 至少一個第一副排氣口,係將前述搬入副處理室內的氣體排出;及 排氣控制機構,係控制從前述主排氣口及前述第一副排氣口排出的氣體的量; 前述排氣控制機構,係以使每單位時間從前述主排氣口排出的氣體的總量比從前述第一副排氣口排出的氣體的總量少之方式進行控制。 The light processing device as described in claim 1, which includes: At least one main exhaust port is used to discharge the gas in the aforementioned main processing chamber; At least one first auxiliary exhaust port is used to discharge the aforementioned gas moved into the auxiliary treatment chamber; and An exhaust control mechanism controls the amount of gas discharged from the aforementioned main exhaust port and the aforementioned first auxiliary exhaust port; The exhaust control mechanism controls the total amount of gas discharged from the main exhaust port per unit time to be smaller than the total amount of gas discharged from the first auxiliary exhaust port. 如請求項1所記載之光處理裝置,其中,具備: 搬出副處理室,係形成搬入沿著前述搬送機構搬送的前述工件搬入的第三搬入口與搬出前述工件的第三搬出口,前述第三搬入口連接於前述第一搬出口。 The optical processing device as described in claim 1, wherein: A secondary processing chamber for carrying out the workpiece transported along the transport mechanism is formed with a third carrying inlet for carrying in the workpiece and a third carrying outlet for carrying out the workpiece, wherein the third carrying inlet is connected to the first carrying outlet. 如請求項3所記載之光處理裝置,其中,具備: 至少一個主排氣口,係將前述主處理室內的氣體排出; 至少一個第一副排氣口,係將前述搬入副處理室內的氣體排出; 至少一個第二副排氣口,係將前述搬出副處理室內的氣體排出;及 排氣控制機構,係控制從前述主排氣口、前述第一副排氣口及前述第二副排氣口排出的氣體的量; 前述排氣控制機構,係以使每單位時間從前述主排氣口排出的氣體的總量比從前述第一副排氣口排出的氣體的總量少,且比從前述第二副排氣口排出的氣體的總量少之方式進行控制。 The light processing device as described in claim 3, which includes: At least one main exhaust port is used to discharge the gas in the aforementioned main processing chamber; At least one first auxiliary exhaust port is used to discharge the aforementioned gas moved into the auxiliary processing chamber; At least one second auxiliary exhaust port is used to discharge the gas moved out of the auxiliary processing chamber; and An exhaust control mechanism controls the amount of gas discharged from the aforementioned main exhaust port, the aforementioned first auxiliary exhaust port, and the aforementioned second auxiliary exhaust port; The exhaust gas control mechanism is configured to make the total amount of gas exhausted from the main exhaust port per unit time smaller than the total amount of gas exhausted from the first auxiliary exhaust port, and smaller than the total amount of gas exhausted from the second auxiliary exhaust port. The total amount of gas discharged from the port is controlled in such a way that it is small. 如請求項1所記載之光處理裝置,其中,具備: 抽氣管,係具有配置於前述處理空間內的取入口與配置於前述處理空間外的排出口,從前述取入口抽出前述處理空間內的氣體;及 濃度計,係連接於前述抽氣管的前述排出口,測定從前述排出口流入之氣體的臭氧濃度。 The light processing device as described in claim 1, which includes: The exhaust pipe has an inlet arranged in the processing space and an exhaust outlet arranged outside the processing space, and the gas in the processing space is extracted from the inlet; and A concentration meter is connected to the outlet of the exhaust pipe and measures the ozone concentration of the gas flowing in from the outlet. 如請求項5所記載之光處理裝置,其中, 前述抽氣管具備複數前述取入口; 複數前述取入口,係沿著前述搬送滾筒的旋轉軸方向排列。 The light processing device as described in claim 5, wherein: the aforementioned exhaust pipe has a plurality of aforementioned inlets; the plurality of aforementioned inlets are arranged along the direction of the rotation axis of the aforementioned conveying drum. 如請求項5或6所記載之光處理裝置,其中,具備: 加工氣體控制部,係基於前述濃度計所測定的臭氧濃度,控制從前述氣體導入口導入至前述主處理室內之加工氣體的流量。 The light processing device as described in claim 5 or 6, which includes: The processing gas control unit controls the flow rate of the processing gas introduced into the main processing chamber from the gas inlet based on the ozone concentration measured by the concentration meter. 如請求項5或6所記載之光處理裝置,其中,具備: 電力控制部,係基於前述濃度計所測定的臭氧濃度,控制向前述紫外光源供給的電力。 The light processing device as described in claim 5 or 6, wherein the device comprises: A power control unit that controls the power supplied to the ultraviolet light source based on the ozone concentration measured by the concentration meter.
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