TW201946857A - Crimping mechanism for electronic component and applied for test classification equipment in which the crimper can minutely adjust to control the downward pressure of the pressing member so that the crimping member will accurately press down the electronic component - Google Patents
Crimping mechanism for electronic component and applied for test classification equipment in which the crimper can minutely adjust to control the downward pressure of the pressing member so that the crimping member will accurately press down the electronic component Download PDFInfo
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- TW201946857A TW201946857A TW107115319A TW107115319A TW201946857A TW 201946857 A TW201946857 A TW 201946857A TW 107115319 A TW107115319 A TW 107115319A TW 107115319 A TW107115319 A TW 107115319A TW 201946857 A TW201946857 A TW 201946857A
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- 238000002788 crimping Methods 0.000 title claims abstract description 106
- 238000012360 testing method Methods 0.000 title claims abstract description 70
- 230000007246 mechanism Effects 0.000 title claims abstract description 43
- 238000003032 molecular docking Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 13
- 230000013011 mating Effects 0.000 description 7
- 208000028659 discharge Diseases 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000001915 proofreading effect Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
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Abstract
Description
本發明係提供一種該壓接器之驅動單元可微調控制給壓件的下壓力量,並以給壓件下壓驅動該治具單元之壓接件,使壓接件精確下壓電子元件而執行測試作業,進而確保測試品質及提高電子元件良率之電子元件壓接機構。 The invention provides a driving unit of the crimper which can finely control the amount of pressing force applied to the crimping member, and drives the crimping member of the fixture unit with the crimping member to make the crimping member accurately press the electronic component. An electronic component crimping mechanism that performs test operations to ensure test quality and improve the yield of electronic components.
在現今,電子元件之類型繁多,例如邏輯IC、RF射頻IC等,然不論何種類型之電子元件,皆必須於測試設備上進行測試作業,以淘汰出不良品,而確保產品品質,但不同類型之IC會因表面材質或錫球數量等因素,而承受不同之測試下壓力,以邏輯IC為例,其表面可承受較大之測試下壓力,反觀該RF射頻IC,其表面則無法承受較大之測試下壓力,必須精確控制測試下壓力而避免壓損。 At present, there are many types of electronic components, such as logic ICs, RF radio frequency ICs, etc. However, no matter what type of electronic components, testing operations must be performed on test equipment to eliminate defective products and ensure product quality, but different The type of IC can withstand different test down pressures due to factors such as the surface material or the number of solder balls. Taking logic ICs as an example, the surface can withstand a large test down pressure. In contrast, the RF radio frequency IC can't withstand the surface. For larger test downforce, the test downforce must be accurately controlled to avoid pressure loss.
請參閱第1、2圖,電子元件測試設備係於機台11配置有測試裝置12及壓接機構13,該測試裝置12係設有電性連接之電路板121及測試座122,並以測試座122承置且測試電子元件(如RF射頻IC),該壓接機構13係於機架131設有馬達132,該馬達132之輸出軸以皮帶輪組133帶動一導螺桿134旋轉,該導螺桿134上之螺套連結帶動一L型架135作第一方向(如Z方向)位移,該L型架135之底面係裝配有壓接器136,該壓接器136於相對應測試座122之位置固設有可為吸嘴之下壓件1361,以取放及下壓電子元件14;於執行測試作業時,該壓接機構13係將電子元件14移載至測試裝置12之上方,並以馬達132經皮帶輪組133傳動該導螺桿134旋轉,而帶動L型架135及壓接器 136作Z方向位移,令下壓件1361將電子元件14移入測試座122中,然為使電子元件14之錫球確實接觸測試座122內之探針,馬達132會經由皮帶輪組133及導螺桿134而持續驅動L型架135及壓接器136作Z方向位移,令壓接器136之下壓件1361下壓電子元件14,使電子元件14之錫球與測試座122之探針確實相接觸,進而執行電子元件14之測試作業;惟,由於電子元件之類型繁多,且部分電子元件之表面並無法承受重壓,該壓接機構13係以馬達132經皮帶輪組133及導螺桿134而驅動壓接器136作Z方向位移下壓電子元件14,但馬達132之轉動精度並無法作精密微調,若待測電子元件之型式為邏輯IC,其表面尚可接受該馬達132經壓接器136所施予之較大下壓力,但若待測電子元件之型式為RF射頻IC時,其表面並無法承受重壓,當馬達132驅動壓接器136以較大之下壓力壓接該RF射頻IC時,易發生RF射頻IC之表面壓損破裂之狀況,不僅影響測試品質,亦造成RF射頻IC損壞而增加成本之問題;再者,由於該具下壓件1361之壓接器136係固設於L型架135之底部,欲取放不同尺寸之電子元件時,則需將整組壓接器136拆卸,方可視取放作業所需而更換具不同尺寸下壓件之壓接器,但於L型架135底部拆卸及更換整組壓接器136,必須耗費繁瑣校對壓接器136之組裝精度,以致降低生產效能。 Please refer to FIGS. 1 and 2. The electronic component testing equipment is equipped with a testing device 12 and a crimping mechanism 13 on the machine 11. The testing device 12 is provided with an electrically connected circuit board 121 and a test base 122. The base 122 receives and tests electronic components (such as RF radio frequency IC). The crimping mechanism 13 is provided on the frame 131 with a motor 132. The output shaft of the motor 132 drives a lead screw 134 to rotate by a pulley set 133. The lead screw The screw sleeve connection on 134 drives an L-shaped frame 135 to be displaced in the first direction (such as the Z direction). The bottom surface of the L-shaped frame 135 is equipped with a crimper 136, which is connected to the corresponding test seat 122. A pressing member 1361 below the suction nozzle is fixedly positioned to pick up and press down the electronic component 14; when performing the test operation, the crimping mechanism 13 transfers the electronic component 14 above the testing device 12, and The lead screw 134 is driven to rotate by the motor 132 via the belt wheel set 133, and the L-shaped frame 135 and the crimper 136 are moved in the Z direction, so that the lower pressing piece 1361 moves the electronic component 14 into the test base 122, so that the electronic component The solder ball of 14 does contact the probe in the test seat 122, and the motor 132 passes through the pulley set 133 and The lead screw 134 continuously drives the L-shaped frame 135 and the crimping device 136 for Z-direction displacement, so that the crimping member 136 below the crimping device 136 presses down the electronic component 14 so that the solder ball of the electronic component 14 and the probe of the test base 122 Make sure that they are in contact, and then perform the test operation of the electronic component 14. However, due to the many types of electronic components and the surface of some electronic components cannot withstand heavy pressure, the crimping mechanism 13 is a motor 132 via a pulley 133 and a lead screw. 134 drives the crimping device 136 to press down the electronic component 14 for Z-direction displacement, but the rotation accuracy of the motor 132 cannot be fine-tuned. If the type of the electronic component to be tested is a logic IC, the surface of the motor 132 can still accept the pressure of the motor 132. The large downforce provided by the connector 136, but if the type of electronic component to be tested is an RF radio frequency IC, its surface cannot withstand heavy pressure. When the motor 132 drives the crimper 136 to be crimped with a large downward pressure In the case of the RF radio frequency IC, the surface pressure loss and breakage of the RF radio frequency IC are prone to affect not only the test quality but also the RF radio frequency IC damage and increase the cost. Furthermore, because of the crimping device with the pressing member 1361, 136 is fixed on L-shaped frame 135 At the bottom, if you want to pick and place electronic components of different sizes, you need to disassemble the whole set of crimpers 136, and you can replace the crimpers with different size lower parts according to the needs of the pick and place operation, but at the bottom of the L-shaped frame 135 Disassembling and replacing the entire set of crimpers 136 must take tedious proofreading of the assembly accuracy of the crimpers 136, thereby reducing production efficiency.
本發明之目的一,係提供一種電子元件壓接機構,其係設置可由移動臂帶動位移之壓接器,該壓接器係設有驅動單元及治具單元,該驅動單元之第一承座係連結移動臂,並具有至少一給壓件,該治具單元之第二承座可裝配或分離該驅動單元之第一承座,該第二承座之內部係於相對應給壓件之位置設有一可彈性位移之壓接件,於移動臂帶動壓接器至預設位置時,該壓接器之驅動單元可微調控制該給壓件的下壓力量,並以該給壓件下 壓驅動該治具單元之壓接件位移,進而使壓接件精確下壓電子元件執行測試作業,達到確保測試品質及提高電子元件良率之實用效益。 An object of the present invention is to provide a crimping mechanism for electronic components, which is provided with a crimping device which can be driven by a moving arm. The crimping device is provided with a driving unit and a jig unit, and a first socket of the driving unit. It is connected to the moving arm and has at least one pressing member. The second bearing of the jig unit can be assembled or separated from the first bearing of the driving unit. The inside of the second bearing is connected to the corresponding pressing member. An elastically displaceable crimping member is provided at the position. When the moving arm drives the crimper to a preset position, the driving unit of the crimper can finely adjust the amount of pressing force of the crimping member, and lower the crimping member with the crimping member. The crimping part of the jig unit is driven by pressure, so that the crimping part can accurately press down the electronic component to perform the test operation, thereby achieving the practical benefits of ensuring the test quality and improving the yield of the electronic component.
本發明之目的二,係提供一種電子元件壓接機構,其中,該壓接器之驅動單元係固設於移動臂,而治具單元則以接合具連結或分離該驅動單元,欲取放不同尺寸之電子元件時,僅需利用接合具將治具單元之第二承座與驅動單元之第一承座分離,即可迅速更換該具不同尺寸壓接件之治具單元,毋須繁瑣校對壓接器,以有效縮減更換作業時間,達到提高生產效能之實用效益。 The second object of the present invention is to provide a crimping mechanism for electronic components, in which the driving unit of the crimping device is fixedly mounted on the moving arm, and the jig unit is connected or separated by the joint with the driving unit. For electronic components of different sizes, only the second holder of the jig unit and the first holder of the drive unit need to be separated by using a jig, and the jig unit with crimping pieces of different sizes can be quickly replaced without tedious proofreading and pressing. Connector to effectively reduce the replacement operation time and achieve practical benefits of improving production efficiency.
本發明之目的三,係提供一種應用電子元件壓接機構之測試分類設備,其包含機台、供料裝置、收料裝置、測試裝置、輸送裝置及中央控制裝置,該供料裝置係配置於機台上,並設有至少一容納待測電子元件之供料承置器,該收料裝置係配置於機台上,並設有至少一容納已測電子元件之收料承置器,該測試裝置係配置於機台上,並設有至少一對電子元件執行測試作業之測試器,該輸送裝置係配置於機台上,並設有至少一移載電子元件之移料器,以及設有至少一本發明之壓接機構,以下壓電子元件,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 A third object of the present invention is to provide a test classification device using an electronic component crimping mechanism, which includes a machine, a feeding device, a receiving device, a testing device, a conveying device, and a central control device. The machine is provided with at least one feeding holder for containing the electronic components to be tested. The receiving device is arranged on the machine and is provided with at least one receiving holder for containing the tested electronic components. The testing device is arranged on the machine platform and is provided with at least one pair of testers for performing test operations on the electronic components. The conveying device is arranged on the machine platform and is provided with at least one transfer device for transferring electronic components, and There is at least one crimping mechanism of the present invention, which presses down the electronic components. The central control device is used to control and integrate the actions of various devices to perform automated operations to achieve practical benefits of improving operation efficiency.
11‧‧‧機台 11‧‧‧machine
12‧‧‧測試裝置 12‧‧‧test device
121‧‧‧電路板 121‧‧‧Circuit Board
122‧‧‧測試座 122‧‧‧Test Block
13‧‧‧壓接機構 13‧‧‧ Crimping mechanism
131‧‧‧機架 131‧‧‧ Rack
132‧‧‧馬達 132‧‧‧ Motor
133‧‧‧皮帶輪組 133‧‧‧ pulley set
134‧‧‧導螺桿 134‧‧‧lead screw
135‧‧‧L型架 135‧‧‧L frame
136‧‧‧壓接器 136‧‧‧Crimper
1361‧‧‧下壓件 1361‧‧‧Pressing pieces
14‧‧‧電子元件 14‧‧‧Electronic components
20、20A‧‧‧壓接機構 20, 20A‧‧‧ Crimping mechanism
21、21A‧‧‧移動臂 21, 21A‧‧‧ Mobile Arm
22、22A‧‧‧壓接器 22, 22A‧‧‧ Crimping device
221‧‧‧第一承座 221‧‧‧First seat
2211‧‧‧氣室 2211‧‧‧Air chamber
2212‧‧‧入氣道 2212‧‧‧ Intake
2213‧‧‧第一對接部件 2213‧‧‧The first docking part
222‧‧‧給壓件 222‧‧‧ to press
223、223A‧‧‧第二承座 223, 223A‧‧‧Second Seat
2231‧‧‧第一對合部件 2231‧‧‧The first mating part
2232‧‧‧承跨部 2232‧‧‧Crossing Department
2233‧‧‧第一限位部件 2233‧‧‧The first limit part
2234‧‧‧第二對接部件 2234‧‧‧Second docking part
224、224A‧‧‧接合具 224, 224A‧‧‧Joint
225、225A‧‧‧壓接件 225, 225A‧‧‧Crimp
2251‧‧‧凸耳 2251‧‧‧ lug
2252‧‧‧第三限位部 2252‧‧‧The third limit department
2253、2253A‧‧‧壓接部 2253, 2253A‧‧‧ Crimping section
2254、2254A‧‧‧吸嘴 2254, 2254A‧‧‧ Nozzle
226、226A‧‧‧第三承座 226, 226A‧‧‧Third Seat
2261‧‧‧跨置部 2261‧‧‧Crossover
2262‧‧‧穿孔 2262‧‧‧perforation
2263‧‧‧穿槽 2263‧‧‧through groove
2264‧‧‧第二限位部件 2264‧‧‧Second limit component
227‧‧‧彈性件 227‧‧‧Elastic piece
2281‧‧‧第一吸氣段 2281‧‧‧First suction section
2282‧‧‧第二吸氣段 2282‧‧‧Second suction section
2283‧‧‧第三吸氣段 2283‧‧‧third suction section
229‧‧‧防雜訊件 229‧‧‧Anti-noise
31‧‧‧RF射頻IC 31‧‧‧RF RF IC
32‧‧‧機台 32‧‧‧machine
321‧‧‧定位銷 321‧‧‧positioning pin
33‧‧‧測試裝置 33‧‧‧Test device
331‧‧‧電路板 331‧‧‧Circuit board
332‧‧‧測試座 332‧‧‧Test Block
40‧‧‧機台 40‧‧‧machine
50‧‧‧供料裝置 50‧‧‧feeding device
51‧‧‧供料承置器 51‧‧‧feeder
60‧‧‧收料裝置 60‧‧‧Receiving device
61‧‧‧收料承置器 61‧‧‧Receiving container
70‧‧‧測試裝置 70‧‧‧test device
71‧‧‧電路板 71‧‧‧Circuit Board
72‧‧‧測試座 72‧‧‧Test Block
80‧‧‧輸送裝置 80‧‧‧ Conveying device
81‧‧‧第一移料器 81‧‧‧first feeder
82‧‧‧第一入料載台 82‧‧‧First loading stage
83‧‧‧第二入料載台 83‧‧‧Second loading stage
84‧‧‧第一出料載台 84‧‧‧First discharge stage
85‧‧‧第二出料載台 85‧‧‧Second discharge stage
86‧‧‧第二移料器 86‧‧‧second feeder
第1圖:習知測試裝置及壓接機構之配置示意圖。 Figure 1: Schematic diagram of the configuration of the conventional test device and crimping mechanism.
第2圖:習知測試裝置及壓接機構之使用示意圖。 Figure 2: Schematic diagram of the use of the conventional test device and crimping mechanism.
第3圖:本發明壓接機構之示意圖。 Fig. 3: Schematic diagram of the crimping mechanism of the present invention.
第4圖:本發明壓接機構之組裝示意圖(一)。 Fig. 4: Schematic diagram of assembly of the crimping mechanism of the present invention (1).
第5圖:本發明壓接機構之組裝示意圖(二)。 Figure 5: Assembly schematic diagram of the crimping mechanism of the present invention (2).
第6圖:本發明壓接機構之使用示意圖(一)。 Figure 6: Schematic diagram of the use of the crimping mechanism of the present invention (1).
第7圖:本發明壓接機構之使用示意圖(二)。 Figure 7: Schematic diagram of the use of the crimping mechanism of the present invention (2).
第8圖:本發明壓接機構之使用示意圖(三)。 Figure 8: Schematic diagram of the use of the crimping mechanism of the present invention (3).
第9圖:本發明壓接機構之使用示意圖(四)。 Figure 9: Schematic diagram of the use of the crimping mechanism of the present invention (4).
第10圖:該壓接機構更換治具單元之使用示意圖(一)。 Figure 10: Schematic diagram of using the crimping mechanism to replace the fixture unit (1).
第11圖:該壓接機構更換治具單元之使用示意圖(二)。 Figure 11: Schematic diagram of using the crimping mechanism to replace the fixture unit (2).
第12圖:本發明壓接機構應用於測試分類設備之示意圖。 FIG. 12 is a schematic diagram of the application of the crimping mechanism of the present invention to a test classification device.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第3、4、5圖,本發明電子元件壓接機構20包含移動臂21及壓接器22,其中,該移動臂21係由至少一驅動源(圖未示出)驅動作至少一第一方向(如Z方向)位移,由於驅動源非本申請案之技術特徵,故在此不予贅述,該驅動源係驅動移動臂21作較大行程之Z方向位移,使移動臂21帶動壓接器22位移至預設位置;該壓接器22係設有驅動單元及治具單元,該驅動單元係設有至少一裝配於移動臂21之第一承座221,該第一承座221可直接連結該移動臂21或連結於移動臂21下方之物件,於本實施例中,該第一承座221係裝配固設於移動臂21下方之物件,又該驅動單元係於第一承座221設有至少一給壓件222,更進一步,該給壓件222可為膜片或氣囊等,於本實施例中,該第一承座221之底面係凹設有容置空間,該給壓件222係為膜片,並裝配於第一承座221之底部且封閉容置空間,以使該容置空間形成一氣室2211,該氣室2211並連通至少一入氣道2212,該入氣道2212則連通供氣設備,於入氣道2212輸入氣體至氣室2211時,可令給壓件222向下弧凸而形成一下壓力量,進而該驅動單元可控制氣室2211的壓力值,以精確微調該給壓件222之下壓力量;該治具單元係設有至少一第二承座223,該治具單元之第二承座223可裝配或分離該驅動單元之第一承座221,更進一步,該第二承座223係以至少一接合具224連結或分離該驅動單元之第一承座221或移動臂21或移動臂 21下方之物件(如浮動頭),於本實施例中,該第二承座223以接合具224連結該移動臂21下方之物件時,係可裝配於第一承座221之下方,反之,該第二承座223以接合具224分離該移動臂21下方之物件時,則可脫離第一承座221;另該壓接器22係於第一承座221及第二承座223之間設有第一對位結構,以使第一承座221及第二承座223迅速組裝對位,該第一對位結構係於第一承座221及第二承座223之間設有相互配合之第一對接部件2213及第一對合部件2231,該第一對接部件2213及第一對合部件2231可分別為凹槽及凸塊,亦或為插孔及插銷,於本實施例中,該第一對位結構係於第一承座221之底面設有可為凸塊之第一對接部件2213,並於第二承座223之頂面相對應該第一對接部件2213之位置設有可為凹塊之第一對合部件2231;又該壓接器22係於第二承座223之內部相對應該給壓件222之位置設有至少一彈性位移之壓接件225,於本實施例中,該第二承座223之內部係設有至少一第三承座226,該第三承座226與第二承座223可為一體成型或分別為獨立元件,於本實施例中,該第三承座226與第二承座223分別為獨立元件,該第三承座226之頂部周側凸設有複數個跨置部2261,以跨置鎖固於第二承座223頂面之承跨部2232,該第三承座226係於相對應該給壓件222之位置開設有穿孔2262,以供穿置該壓接件225,並於壓接件225與第三承座226之間設有至少一彈性件227,於本實施例中,第三承座226係於周側開設有穿槽2263,以供裝配可為彈簧之彈性件227,該彈性件227之第一端頂抵於第三承座226,而第二端則頂抵於壓接件225之凸耳2251,以使壓接件225可作Z方向彈性位移,另於第二承座223相對應該壓接件225之凸耳2251位置設有第一限位部件2233,以防止壓接件225向上脫離,以及於第三承座226之穿孔2262頂部設有可為 凹槽之第二限位部件2264,並於壓接件225頂部相對應該第二限位部件2264之位置設有可為凸緣之第三限位部2252,以利用第二限位部件2264及第三限位部2252防止壓接件225向下脫離,又該壓接件225可為具單純下壓作用之壓接件,亦或具下壓及取放作用之壓接件,於本實施例中,該壓接件225係設有至少一具吸嘴2254之壓接部2253,該壓接部2253係下壓電子元件,該吸嘴2254並經由吸氣管路連接一吸氣設備,於本實施例中,該吸氣管路係於壓接件225之內部設有第一吸氣段2281,該第一吸氣段2281之兩端則分別連通該吸嘴2254及第二吸氣段2282,該第二吸氣段2282再連通一第三吸氣段2283,該第三吸氣段2283則連通吸氣設備,以使壓接件225具有下壓及取放電子元件之作用,另於第二承座223之外周圍設有具至少一第二對接部件2234之第二對位結構,以準確接合待裝配物件(如機台或外罩或測試座等),於本實施例中,該第二對接部件2234可為套合孔,以套接於機台上之定位銷(圖未示出),另該壓接器22係於治具單元之第二承座223設有至少一防雜訊件229,以防止外部雜訊干擾測試作業或防止測試訊號外洩,於本實施例中,係於第二承座223之底部設有可為導電棉之防雜訊件229。 In order for your reviewing committee to further understand the present invention, a preferred embodiment will be given in conjunction with the drawings, detailed as follows: Please refer to FIGS. 3, 4, and 5. The electronic component crimping mechanism 20 of the present invention includes movement The arm 21 and the crimping device 22, wherein the moving arm 21 is driven by at least one driving source (not shown) for displacement in at least a first direction (such as the Z direction). Because the driving source is not a technical feature of the present application Therefore, I will not repeat them here. The driving source drives the moving arm 21 to perform a larger Z-direction displacement, so that the moving arm 21 drives the crimper 22 to move to a preset position. The crimper 22 is provided with a driving unit. And a fixture unit, the driving unit is provided with at least a first socket 221 assembled on the movable arm 21, and the first socket 221 can be directly connected to the movable arm 21 or an object under the movable arm 21, In the embodiment, the first socket 221 is an object fixedly mounted under the movable arm 21, and the driving unit is provided with at least one pressing member 222 on the first bearing 221. Further, the pressing member 222 It can be a diaphragm or an airbag. In this embodiment, the bottom surface of the first socket 221 is concave. An accommodating space is provided. The pressing member 222 is a diaphragm, and is assembled on the bottom of the first bearing seat 221 and closes the accommodating space, so that the accommodating space forms an air chamber 2211, and the air chamber 2211 communicates with at least An air passage 2212 is connected to the air supply device. When gas is input into the air chamber 2212 from the air passage 2212, the pressure member 222 can be convexed downward to form a pressure, and the drive unit can control the air. The pressure value of the chamber 2211 is used to precisely fine tune the pressure amount under the pressure member 222. The fixture unit is provided with at least a second socket 223, and the second socket 223 of the fixture unit can be assembled or separated from the drive. The first socket 221 of the unit, further, the second socket 223 is connected to or separated from the first socket 221 of the driving unit or the moving arm 21 or an object below the moving arm 21 by at least one joint 224 (such as a floating (Head), in this embodiment, when the second socket 223 is connected to the object below the moving arm 21 by the coupling tool 224, it can be assembled below the first socket 221, otherwise, the second socket 223 is When the jig 224 separates the object under the moving arm 21, it can be disengaged from the first seat 2 21; In addition, the crimper 22 is provided with a first alignment structure between the first socket 221 and the second socket 223, so that the first socket 221 and the second socket 223 can be quickly assembled and aligned. The first alignment structure is provided with a first mating member 2213 and a first mating member 2231 that cooperate with each other between the first socket 221 and the second socket 223. The first mating member 2213 and the first mating member 2231 can be a groove and a bump, or a socket and a pin, respectively. In this embodiment, the first alignment structure is provided on the bottom surface of the first socket 221 with a first docking member that can be a bump. 2213, and a first mating member 2231 that can be a recess is provided on the top surface of the second socket 223 corresponding to the first mating member 2213; and the crimper 22 is inside the second socket 223 At least one elastically displaceable crimping member 225 is provided at a position corresponding to the pressing member 222. In this embodiment, at least one third socket 226 is provided inside the second socket 223, and the third socket 226 and the second socket 223 may be integrally formed or are separate components. In this embodiment, the third socket 226 and the second socket 223 are independent elements. A plurality of cross-sections 2261 are protruded from the top peripheral side of the third socket 226 to lock the cross-sections 2232 on the top surface of the second socket 223 in cross-connection. The third socket 226 is opposite to A hole 2262 should be provided at the position of the pressing member 222 to pass through the pressing member 225, and at least one elastic member 227 is provided between the pressing member 225 and the third socket 226. In this embodiment, The third socket 226 is provided with a through slot 2263 on the peripheral side for assembling an elastic member 227 that can be a spring. The first end of the elastic member 227 is against the third socket 226 and the second end is against. A first limiting member 2233 is provided at the position of the lug 2251 of the crimping member 225 so that the crimping member 225 can be elastically displaced in the Z direction, and the second bearing 223 is corresponding to the lug 2251 of the crimping member 225. In order to prevent the crimping member 225 from detaching upward, a second limiting member 2264 that can be a groove is provided on the top of the through hole 2262 of the third socket 226, and the top of the crimping member 225 corresponds to the second limiting member 2264. A third limiting portion 2252, which can be a flange, is provided at the position to prevent the crimping member 225 from falling downward by using the second limiting member 2264 and the third limiting portion 2252. The connecting piece 225 may be a pressing piece with a simple pressing function, or a pressing piece with a pressing and removing function. In this embodiment, the pressing piece 225 is provided with at least one suction nozzle 2254. A crimping portion 2253, which presses down the electronic component, and the suction nozzle 2254 is connected to a suction device via a suction line. In this embodiment, the suction line is connected to the crimping piece 225. A first suction section 2281 is provided inside, and two ends of the first suction section 2281 are respectively connected to the suction nozzle 2254 and the second suction section 2282, and the second suction section 2282 is further connected to a third suction section. 2283, the third suction section 2283 communicates with the suction device, so that the crimping member 225 has the function of pressing down and taking in and placing electronic components, and at least one second docking is provided around the second socket 223 The second alignment structure of the component 2234 is used to accurately join the object to be assembled (such as a machine table or a cover or a test base, etc.). In this embodiment, the second docking component 2234 may be a fitting hole to be connected to the machine. The positioning pin (not shown) on the table, and the crimper 22 is attached to the second socket 223 of the jig unit, and at least one anti-noise piece 229 is provided to prevent external noise. Noise interference test job or prevent leakage of the test signal, in this embodiment, the bottom line of the second socket 223 may be provided with noise preventing member 229 of the conductive cotton.
請參閱第6、7圖,由於壓接器22之壓接件225的吸嘴2254已吸附待測之RF射頻IC31,該壓接機構20之移動臂21即帶動壓接器22作第二方向(如Y方向)位移至機台32之測試裝置33上方,該測試裝置33係設有電性連接之電路板331及測試座332,該測試座332係承置及測試該RF射頻IC31;接著該移動臂21即帶動壓接器22作較大行程之Z方向向下位移至預設位置,令治具單元之第二承座223的第二對接部件2234對位套合於機台32上之定位銷321而定位,並使第二承座223底部之防雜訊件229貼 合於機台32上,以防止外部雜訊干擾測試作業或防止測試訊號外洩,此時,該壓接件225之吸嘴2254係將待測之RF射頻IC31移入測試裝置33之測試座332。 Please refer to FIGS. 6 and 7, because the suction nozzle 2254 of the crimping member 225 of the crimper 22 has absorbed the RF IC 31 to be measured, the moving arm 21 of the crimping mechanism 20 drives the crimper 22 to the second direction. (Such as the Y direction) is moved above the test device 33 of the machine 32, which is provided with a circuit board 331 and a test base 332 which are electrically connected, and the test base 332 is for receiving and testing the RF radio frequency IC 31; The moving arm 21 drives the crimper 22 to move downward in the Z direction to a preset position, so that the second docking part 2234 of the second socket 223 of the fixture unit is positioned on the machine 32 and aligned. The positioning pin 321 is positioned, and the anti-noise piece 229 at the bottom of the second socket 223 is attached to the machine 32 to prevent external noise from interfering with the test operation or preventing the test signal from leaking. At this time, the crimping The nozzle 2254 of the piece 225 moves the RF radio frequency IC 31 to be tested into the test base 332 of the test device 33.
請參閱第8、9圖,然為使待測之RF射頻IC31的接點確實接觸測試座332之探針,而必須令壓接件225之壓接部2253持續對待測之RF射頻IC31施以下壓力,由於RF射頻IC31之表面不能承受較大之下壓力,因此,必須精確控制壓接件225對RF射頻IC31之下壓力,當待測之RF射頻IC31移入測試座332後,該壓接器22之驅動單元即以第一承座221之入氣道2212輸入氣體至氣室2211,令該給壓件222向下凸出而形成一下壓力量,並以該給壓件222向下頂壓該壓接件225作Z方向位移,進而該壓接器22可微調控制氣室2211之壓力值及給壓件222之下壓力量,以利精確控制壓接件225之下壓力量,該壓接件225即於第三承座226之穿孔2262內作精確之Z方向位移,並以凸耳2251壓縮彈性件227,進而使壓接件225之壓接部2253以精確下壓力下壓該待測之RF射頻IC31,不僅確保待測之RF射頻IC31的接點接觸測試座332之探針,並可防止RF射頻IC31被壓損,進而執行RF射頻IC31之測試作業。 Please refer to Figs. 8 and 9. However, in order to make sure that the contact point of the RF RF IC31 to be tested actually contacts the probe of the test base 332, the crimping part 2253 of the crimping member 225 must be continuously applied to the RF RF IC31 to be tested. Pressure, since the surface of the RF radio-frequency IC31 cannot withstand a large downward pressure, the pressure of the crimping member 225 on the RF radio-frequency IC31 must be accurately controlled. When the RF radio-frequency IC31 to be tested is moved into the test base 332, the crimper The driving unit of 22 inputs the gas to the air chamber 2211 through the air inlet 2212 of the first bearing seat 221, so that the pressing member 222 protrudes downward to form a pressure amount, and presses the pressing member 222 downward to press the The crimping member 225 is displaced in the Z direction, and the crimper 22 can finely adjust the pressure value of the air chamber 2211 and the amount of pressure under the crimping member 222, so as to accurately control the amount of pressure under the crimping member 225. The piece 225 is precisely displaced in the Z direction in the perforation 2262 of the third bearing seat 226, and the elastic piece 227 is compressed by the lug 2251, so that the crimping part 2253 of the crimping piece 225 is pressed down by the precise pressing force to the measured object. The RF RF IC31 not only ensures that the contact point of the RF RF IC31 to be tested contacts the probe of the test base 332, and RF radio is prevented IC31 pressure loss, and thus perform RF RF IC31 of the test job.
請參閱第5、10、11圖,當壓接機構20欲取放及下壓尺寸較小之電子元件時,僅需更換該壓接器22之治具單元,於更換時,僅需開啟接合具224,令原治具單元之第二承座223脫離驅動單元之第一承座221,由於驅動單元係固設於移動臂21之下方,而毋須更換整組壓接器22,不僅可節省成本,並可迅速換裝新的治具單元,該新治具單元與原治具單元的差異在於第三承座226A的內部係設有一具較小面積壓接部2253A之壓接件225A,並於壓接部2253A設有吸嘴2254A,該新治具單元之第二承座223A係設有接合具 224A,可裝配連結於該移動臂21下方之物件,使壓接器22迅速換裝新治具單元,並令壓接件225A對應於驅動單元之給壓件222,使壓接件225A可由該給壓件222驅動作精確行程之Z方向位移,並取放及下壓尺寸較小之電子元件。 Please refer to Figures 5, 10, and 11. When the crimping mechanism 20 wants to pick up and push down small electronic components, only the fixture unit of the crimper 22 needs to be replaced. When replacing, it only needs to open the joint. 224, so that the second holder 223 of the original jig unit is separated from the first holder 221 of the drive unit. Because the drive unit is fixed below the moving arm 21, it is not necessary to replace the entire set of crimpers 22, which not only saves Cost, and can be quickly replaced with a new jig unit. The difference between the new jig unit and the original jig unit is that a crimping piece 225A with a smaller crimping portion 2253A is provided inside the third holder 226A, and A suction nozzle 2254A is provided on the crimping part 2253A. The second holder 223A of the new jig unit is provided with a jig 224A, which can be assembled with the objects connected below the moving arm 21, so that the crimper 22 can be quickly replaced with a new jig. Unit, and make the crimping piece 225A correspond to the crimping piece 222 of the driving unit, so that the crimping piece 225A can be driven by the crimping piece 222 to move in the Z direction of the precise stroke, and pick and place and press down the smaller electronic component .
請參閱第3、4、5、12圖,係本發明壓接機構20應用於電子元件測試分類設備之示意圖,該測試分類設備係於機台40上配置有供料裝置50、收料裝置60、測試裝置70、具本發明壓接機構20之輸送裝置80及中央控制裝置(圖未示出);該供料裝置50係裝配於機台40,並設有至少一為供料盤之供料承置器51,用以容納至少一待測之電子元件;該收料裝置60係裝配於機台40,並設有至少一為收料盤之收料承置器61,用以容納至少一已測之電子元件;該測試裝置70係裝配於機台40上,並設有至少一對電子元件執行測試作業之測試器,於本實施例中,該測試器係設有電性連接之電路板71及測試座72,以對電子元件執行測試作業;該輸送裝置80係裝配於機台40上,並設有至少一移載電子元件之移料器,以及設有至少一本發明之壓接機構20,於本實施例中,該輸送裝置80係設有第一移料器81,以於供料裝置50之供料承置器51取出待測之電子元件,並移載至第一、二入料載台82、83,第一、二入料載台82、83將待測之電子元件載送至測試裝置70之側方,二本發明之壓接機構20、20A係分別以移動臂21、21A帶動壓接器22、22A作Y-Z方向位移,令二壓接器22、22A於第一、二入料載台82、83取出待測之電子元件,並移載至測試裝置70之測試座72而執行測試作業,以及將測試座72之已測電子元件移載至第一、二出料載台84、85,第一、二出料載台84、85載出已測之電子元件,該輸送裝置80係設有第二移料器86於第一、二出料載台84、85上取出已測之電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置60之收料承置器61處而分類收置;該 中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Please refer to FIGS. 3, 4, 5 and 12, which are schematic diagrams of the application of the crimping mechanism 20 of the present invention to an electronic component test and classification device. The test and classification device is provided with a feeding device 50 and a receiving device 60 on the machine 40. Test device 70, conveying device 80 and central control device (not shown) provided with the crimping mechanism 20 of the present invention; the feeding device 50 is assembled on the machine table 40, and is provided with at least one supply tray for the feeding tray. The receiving device 51 is used for accommodating at least one electronic component to be tested. The receiving device 60 is assembled on the machine 40 and is provided with at least one receiving device 61 as a receiving tray for receiving at least A tested electronic component; the testing device 70 is mounted on the machine 40 and is provided with at least one pair of testers for performing test operations on the electronic components. In this embodiment, the tester is provided with an electrical connection. The circuit board 71 and the test base 72 are used to perform test operations on electronic components. The conveying device 80 is assembled on the machine 40 and is provided with at least one transfer device for transferring electronic components, and at least one of the present invention. The crimping mechanism 20, in this embodiment, the conveying device 80 is provided with a first movement The feeder 81 is used to take out the electronic components to be tested in the feeding holder 51 of the feeding device 50, and transfer the electronic components to the first and second loading platforms 82, 83, and the first and second loading platforms 82, 83 The electronic component to be tested is carried to the side of the testing device 70. The crimping mechanism 20 and 20A of the present invention respectively use the moving arms 21 and 21A to drive the crimping devices 22 and 22A to move in the YZ direction to make the second pressure The connectors 22 and 22A take out the electronic components to be tested from the first and second loading platforms 82 and 83, and transfer them to the test base 72 of the testing device 70 to perform the test operation, and the tested electronic components of the test base 72 Transfer to the first and second discharge stages 84 and 85. The first and second discharge stages 84 and 85 carry the measured electronic components. The conveying device 80 is provided with a second transfer device 86 on the first 2. Take out the tested electronic components from the two loading platforms 84 and 85, and transport the measured electronic components to the receiving device 61 of the receiving device 60 to classify them according to the test results; the central control The device is used to control and integrate the actions of various devices to perform automated operations to achieve practical benefits of improving operation efficiency.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107115319A TWI639546B (en) | 2018-05-04 | 2018-05-04 | Electronic component crimping mechanism and test classification device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107115319A TWI639546B (en) | 2018-05-04 | 2018-05-04 | Electronic component crimping mechanism and test classification device |
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| Publication Number | Publication Date |
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| TWI639546B TWI639546B (en) | 2018-11-01 |
| TW201946857A true TW201946857A (en) | 2019-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107115319A TWI639546B (en) | 2018-05-04 | 2018-05-04 | Electronic component crimping mechanism and test classification device |
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| TW (1) | TWI639546B (en) |
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| TWI741747B (en) * | 2020-08-20 | 2021-10-01 | 鴻勁精密股份有限公司 | Pressing mechanism of handler |
| TWI761752B (en) * | 2020-01-15 | 2022-04-21 | 鴻勁精密股份有限公司 | The crimping mechanism for electronic component and the application thereof in the crimping device and in the testing classification equipment |
| TWI794985B (en) * | 2021-09-16 | 2023-03-01 | 鴻勁精密股份有限公司 | Connecting mechanism, testing device, and processing machine |
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| TWI695175B (en) * | 2019-03-18 | 2020-06-01 | 鼎弘國際科技有限公司 | Wafer detection pushing device |
| TWI685461B (en) * | 2019-07-16 | 2020-02-21 | 鴻勁精密股份有限公司 | Electronic component operation device and application operation classification equipment |
| TWI717803B (en) * | 2019-08-14 | 2021-02-01 | 日月光半導體製造股份有限公司 | Testing apparatus and testing method |
| TWI741432B (en) * | 2019-12-05 | 2021-10-01 | 鴻勁精密股份有限公司 | Radio frequency electronic component test device and its application test equipment |
| TWI733318B (en) * | 2020-01-22 | 2021-07-11 | 台灣福雷電子股份有限公司 | Press testing mechanism, testing apparatus and testing method |
| CN113866456A (en) * | 2020-06-11 | 2021-12-31 | 鸿劲精密股份有限公司 | Crimping mechanism, operation device and operation equipment applying same |
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| CN115728564A (en) * | 2021-08-30 | 2023-03-03 | 鸿劲精密股份有限公司 | Crimping mechanism, testing device and operation machine |
| TWI849688B (en) * | 2023-01-13 | 2024-07-21 | 鴻勁精密股份有限公司 | Connection mechanism of electronic component, testing device, and processing machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4180163B2 (en) * | 1998-10-27 | 2008-11-12 | 株式会社アドバンテスト | Adsorption device for electronic component testing equipment |
| JP4327335B2 (en) * | 2000-06-23 | 2009-09-09 | 株式会社アドバンテスト | Contact arm and electronic component testing apparatus using the same |
| TWI513986B (en) * | 2014-10-13 | 2015-12-21 | 矽品精密工業股份有限公司 | Radiofrequency testing device |
-
2018
- 2018-05-04 TW TW107115319A patent/TWI639546B/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI761752B (en) * | 2020-01-15 | 2022-04-21 | 鴻勁精密股份有限公司 | The crimping mechanism for electronic component and the application thereof in the crimping device and in the testing classification equipment |
| TWI741747B (en) * | 2020-08-20 | 2021-10-01 | 鴻勁精密股份有限公司 | Pressing mechanism of handler |
| TWI794985B (en) * | 2021-09-16 | 2023-03-01 | 鴻勁精密股份有限公司 | Connecting mechanism, testing device, and processing machine |
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| Publication number | Publication date |
|---|---|
| TWI639546B (en) | 2018-11-01 |
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