TW201946210A - Tape peeling device for satisfactorily peeling off a protective tape from a wafer in a short time - Google Patents

Abstract

[Problem] The protective film was peeled off from the wafer well in a short time. [Solution] An adhesive film peeling device (1) has the following structure: a protective adhesive film (51) adhered to one side of a wafer (W) is pasted with a protective adhesive film (54), and the adhesive film is stretched to The protective adhesive film is peeled from the wafer and includes: a pressing part (32), which presses the peeling adhesive film on the upper surface of the protective adhesive film of the wafer; a heating means (35), which heats the pressing part, and a clamping means (25), Clamped at one end of the release adhesive film to which the protective adhesive film is attached; and a moving means (37), which relatively moves the clamping means and the holding table, stretches the release adhesive film to peel the protective adhesive film from the wafer; The interface shape has at least a circular arc shape. The circular arc shape is positioned on the outer periphery of the wafer, and the peeling adhesive film is pressed against the upper surface of the protective adhesive film and adhered.

Description

Film peeling device

The invention relates to a peeling device for peeling a protective adhesive film pasted on a wafer.

During the grinding of the wafer formed by the element, a protective adhesive film is stuck on the front surface of the wafer in order to protect the element. After the wafer is ground, a strip-shaped release adhesive film is adhered to the protective adhesive film of the wafer, and the protective adhesive film is peeled from the wafer through the release adhesive film (for example, see Patent Documents 1 and 2). The release adhesive film described in Patent Document 1 is adhered to the protective adhesive film by an adhesive paste applied on the entire back surface area of the release adhesive film. The release adhesive film described in Patent Document 2 is a hot-pressed adhesive film, and the hot-pressed adhesive film is adhered to the protective adhesive film by pressing the abutting member with the protective adhesive film being heated.
[Xizhi technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-028478
[Patent Document 2] Japanese Patent No. 5918928

[Problems to be Solved by the Invention]
However, when the thermal adhesive film is stretched to peel the protective adhesive film from the wafer protective adhesive film, the outer peripheral portion of the wafer may be broken at a peeling starting point at which the protective adhesive film is peeled from the wafer. Therefore, it is necessary to carefully peel off the protective adhesive film from the wafer when the peeling speed becomes slow.

In view of the above-mentioned problems, one object of the present invention is to provide a film peeling device capable of peeling a protective film well from a wafer in a short time.

[Technical means to solve the problem]
One aspect of the present invention is an adhesive film peeling device. A protective adhesive film is adhered to a protective adhesive film adhered to one side of a wafer, and the protective adhesive film is stretched from the wafer by stretching the release adhesive film. The method includes: a holding table for holding the other side of the wafer; a peeling film adhesive means for pasting the peeling film on the upper surface of the protective adhesive film of the wafer held by the holding table; One end of the release adhesive film pasted by the release adhesive film sticking means; and a moving means for relatively moving the clamping means and the holding table to stretch the release adhesive film from the outside of the wafer toward the center to peel off the wafer The protective adhesive film; the peeling adhesive film sticking means includes: a pressing part, which presses the peeling adhesive film on the upper surface of the protective adhesive film of the wafer; an elevating means for bringing the pressing part close to or separated from the holding table And a heating means for heating the pressing part; the abutting surface shape of the peeling adhesive film abutting the pressing part has at least a circular arc shape, and the circular arc shape is positioned near the outer peripheral edge of the wafer, and the peeling is performed; Film To the upper surface of the protective film and adhesive.

According to this configuration, since the contact surface shape of the pressing portion has at least an arc shape, the arc shape of the pressing portion is as close to the outer peripheral edge of the wafer as possible, and the release adhesive film can be pressed against the upper surface of the protective adhesive film. Thereby, the release adhesive film is thermally pressed on the upper surface of the protective adhesive film in a circular arc shape on the outer periphery of the wafer, and the protection area is close to the outer peripheral edge of the wafer from the adhesion area of the release adhesive film relative to the protective adhesive film to protect. The starting point of the peeling of the adhesive film. When the release adhesive film is stretched, a tensile force acts directly in a direction in which the protective adhesive film is peeled off the outer periphery of the wafer through the release adhesive film. Therefore, since the outer peripheral edge of the wafer is not easily damaged when the peeling of the protective film is started, the peeling speed can be increased and the protective film can be peeled off from the wafer in a short time.

[Inventive effect]
According to the present invention, since the contact surface shape of the pressing portion has at least an arc shape, the arc shape of the pressing portion is thermally pressed as close to the outer periphery of the wafer as possible, and can be performed from the wafer in a short time. Peel off the protective film.

Hereinafter, the adhesive film peeling apparatus of this embodiment is demonstrated with reference to accompanying drawings. FIG. 1 is a schematic diagram of a film peeling device according to this embodiment. FIG. 2 is an explanatory diagram of a peeling operation of a protective film of a comparative example. In addition, in the schematic diagram of the adhesive film peeling apparatus shown in FIG. 1, for convenience of explanation, the members describing a part of the transport path forming the adhesive film are omitted.

As shown in FIG. 1, the adhesive film peeling device 1 is configured to adhere a peeling adhesive film 54 to the protective adhesive film 51 of the wafer W on the holding table 11, and peel the protective adhesive film 51 from the wafer W through the peeling adhesive film 54. A large number of elements are formed on one side of the wafer W, and the elements are protected when the back surface of the wafer W in the previous stage is ground by a UV-curable protective adhesive film 51. An adhesive film 52 is adhered to the other surface of the wafer W, and an annular frame 53 is adhered to the outer periphery of the adhesive film 52. The wafer W is carried into the film peeling apparatus 1 with the ring frame 53 being supported while passing through the adhesive film 52.

The holding surface 11 of the adhesive film peeling device 1 is formed of a porous ceramic material, and the other surface of the wafer W is held by the negative pressure generated on the holding surface 12. Above the holding table 11, a film roll (not shown) that rotatably supports a strip-shaped release adhesive film 54 in a roll shape is rotatably supported. The peeling adhesive film 54 is a heat-adhesive tape-shaped adhesive film, and is pressed against the protective adhesive film 51 by pressing under a heating state. Above the holding table 11 are provided a driven roller 21 that is driven to rotate as the peeling adhesive film 54 is pulled out, and a pair of holding rollers 22 that hold only the peeling adhesive film 54 with a predetermined length pulled out.

The driven roller 21 reversely folds the release adhesive film 54 pulled out from the film roll toward a pair of holding rollers 22, and applies tension to the release adhesive film 54 by the refolding of the release adhesive film 54. A pair of holding rollers 22 are sandwiched between the paths of the peeling adhesive film 54 that is folded back by the driven roller 21 and face each other, and are disposed in a rolling contact with respect to both surfaces of the peeling adhesive film 54. The rolling contact surfaces of the pair of holding rollers 22 are formed of a material capable of sandwiching the release film 54 from both sides. The pair of holding rollers 22 are connected to a braking mechanism (not shown) and apply tension to the peeling film 54 pulled out from the film roll.

The adhesive film peeling device 1 is provided at a position separated in a direction in which the release adhesive film 54 is pulled out from the pair of holding rollers 22, and a clamping means 25 is provided to clamp the tip of the release adhesive film 54. The clamping means 25 clamps the release adhesive film 54 by bringing the movable claw 27 close to the fixed claw 26, and releases the front end of the release adhesive film 54 by separating the movable claw 27 from the fixed claw 26. A pull-out mechanism 39 is connected to the gripping means 25, and the gripping means 25 is moved from the gripping position to the pull-out direction by the pull-out mechanism 39 in a state where the release adhesive film 54 is gripped by the gripping means 25. Thereby, only the release adhesive film 54 of a predetermined length for peeling off the protective adhesive film 51 is pulled out from the adhesive film roll.

Between the pair of holding rollers 22 and the clamping means 25, a peeling adhesive film sticking means 31 is provided, which sticks the peeling adhesive film 54 to the upper surface of the protective adhesive film 51 of the wafer W on the holding table 11. The release adhesive film sticking means 31 is provided with a pressing portion 32 that presses the release adhesive film 54 on the upper surface of the protective adhesive film 51. The pressing portion 32 approaches or is separated from the holding table 11 by the lifting means 34 and is heated by a heating means 35 such as a heater. The release adhesive film 54 is pressed against the upper surface of the protective adhesive film 51 by the pressing portion 32 while being heated, thereby thermally pressing the release adhesive film 54 onto the protective adhesive film 51 on the contact surface 33 of the pressing portion 32.

A cutting portion 36 is provided between the pair of holding rollers 22 and the pressing portion 32 to cut the release adhesive film 54 adhered to the protective adhesive film 51. The cutting section 36 is configured to be movable in the vertical direction, and cuts the release adhesive film 54 by moving it downward while the protective adhesive film 51 is adhered to the release adhesive film 54. The holding table 11 is connected to a moving means 37 that peels off the protective film 51 from the wafer W. The moving means 37 moves the holding table 11 in a substantially horizontal direction in a state where the peeling adhesive film 54 is held by the clamping means 25, thereby stretching the peeling adhesive film 54 from the outside of the wafer W toward the center to remove the adhesive film 54 from the crystal. Circle W is peeled.

Incidentally, as shown in the comparative example of FIG. 2A, when the protective adhesive film 51 is pulled in one direction from the wafer W through the peeling adhesive film 54, the outer periphery of the wafer W may be damaged. For example, when the adhesion position of the peeling adhesive film 54 is separated from the outer periphery of the wafer W, even if the peeling adhesive film 54 is stretched in the rolling direction shown by the arrow F1, the force will still be in accordance with other directions shown by the arrow F2 The direction acts on the outer periphery of the wafer W. Since it is difficult to peel off the protective adhesive film 51 from the outer periphery of the wafer W, if the peeling speed is not slowly and carefully peeled, the thin wafer W or the like may be damaged at the outer periphery.

In addition, as shown in FIG. 2B, even if the release adhesive film 54 can be adhered to the outer periphery of the wafer W, when the adhesion area of the release adhesive film 54 and the protective adhesive film 51 is large, it becomes difficult to harden at the adhered portion and It is difficult for the release adhesive film 54 and the protective adhesive film 51 to be rolled up without being bent. Therefore, even if the release adhesive film 54 is stretched in the winding direction shown by the arrow F3, the force is applied to the entire sticking area in the direction shown by the arrow F4. Since it is difficult to roll up the protective film 51 on the outer periphery of the wafer W, if the peeling speed is not slowly and carefully peeled, the thin wafer W may be damaged at the outer periphery.

In this case, it is necessary to form a front-end peeling region that peels the protective film 51 only slightly from the outer peripheral edge of the wafer at the ultra-low-speed peeling speed at the beginning of rolling, and peel at a low-speed peeling speed until the wafer W Until the protective film 51 in the center is peeled. For example, the front end peeling region is formed at a peeling speed of 0.5 [mm / s], and then the protective adhesive film 51 is peeled to the center of the wafer W at a peeling speed of 1.0 [mm / s]. As described above, in the peeling operation of the protective adhesive film shown in the comparative example, the peeling speed cannot be increased, and it takes a lot of time to peel the protective adhesive film 51 from the wafer W, and it is impossible to work efficiently.

As shown in FIG. 2C, the peeling starting point P from which the protective adhesive film 51 is peeled off from the outer peripheral edge of the wafer W is the intersection position between the outer peripheral edge of the wafer W and the tensile direction of the peeling adhesive film 54. Therefore, if this peeling starting point P can be brought close to the adhesion position of the peeling adhesive film 54 and the protective adhesive film 51, the protective adhesive film 51 can be pulled at the peeling starting point P by stretching in the direction in which the peeling adhesive film 54 is rolled up. The protective adhesive film 51 can be smoothly peeled off from the outer periphery of the wafer W by being rolled up. However, in the case of the square-shaped sticking area A1, there is a limit for the peeling starting point P of the protective adhesive film 51 to be close to the square-shaped sticking area A1.

In this regard, as shown in FIG. 2D, in the case of the triangular adhesive region A2, the apex of the adhesive region A2 can be positioned at the peeling starting point P of the protective film 51. However, when the film is stretched in the direction in which the release adhesive film 54 is rolled up, the pulling force is concentrated on the apex of the adhesion area A2. Before the protective adhesive film 51 is peeled off from the wafer W, the release adhesive film 54 starts from the protective adhesive film 51. Was stripped. That is, the peeling adhesive film 54 is peeled off from the protective adhesive film 51 starting from the apex of the adhesive region A2, and the adhesive region A2 becomes smaller from the apex to the peeling direction in an orthogonal direction with respect to the peeling direction and thus cannot be sufficiently obtained. Adhesion. Therefore, a part of the peeling adhesive film 54 is peeled off from the protective adhesive film 51, and as a result, the adhesion position of the peeling adhesive film 54 and the protective adhesive film 51 is separated from the peeling starting point P. In addition, there is also a concern that the entire peeling adhesive film 54 is peeled from the protective adhesive film 51.

Therefore, in the present embodiment, the abutting position is close to the peeling starting point P while suppressing the peeling of the adhesive film of the peeling adhesive film 54, and the abutting surface of the pressing portion 32 abuts the area of the adhesive region to be reduced. The shape is a circular shape including at least an arc shape with respect to the release film 54. Thereby, the arc shape of the pressing portion 32 is positioned near the outer periphery of the wafer, and the release adhesive film 54 can be pressed against the upper surface of the protective adhesive film 51 and adhered. By stretching the peeling adhesive film 54, a force can be applied to the direction of rolling at the peeling starting point P, and the protective adhesive film 51 can be smoothly peeled from the wafer W even if the peeling speed is increased.

Hereinafter, referring to FIG. 3 and FIG. 4, the peeling adhesive film sticking method will be described. FIG. 3 is an explanatory diagram of a release adhesive film sticking means according to the present embodiment. FIG. 4 is an explanatory diagram of a peeling film sticking means according to a modification.

As shown in FIG. 3A, the peeling adhesive film sticking means 31 projects the pressing portion 32 from the lower surface of the heating means 35. The contact surface of the pressing portion 32 has a circular shape, and is formed so that the release adhesive film 54 can be thermally pressed against the upper surface of the protective adhesive film 51 in a circular shape. The abutting surface 33 of the pressing portion 32 is formed, for example, in a small diameter of 2.5 [mm], and the adhesion area of the peeling adhesive film 54 to the protective adhesive film 51 is suppressed. The outer edge of the abutting surface 33 has an arc shape, and the curvature of the arc shape is greater than the curvature of the outer peripheral edge of the wafer W. Therefore, the arc shape of the contact surface 33 can be positioned on the outer peripheral edge of the wafer W.

As shown in FIG. 3B, the abutting surface 33 of the pressing portion 32 is positioned on the outer periphery of the wafer W, and the pressing portion 32 presses the peeling adhesive film 54 on the protective adhesive film 51 in a heated state, in a circular adhesive region A3 The release adhesive film 54 is thermally pressed against the protective adhesive film 51. Thereby, the adhesion area A3 of the peeling adhesive film 54 with respect to the peeling adhesive film 51 can be positioned at the peeling starting point P of the protective adhesive film 51. Since the circular adhesive region A3 is adhered in an arc shape along the outer periphery of the wafer W, it becomes difficult to peel the release adhesive film 54 from the protective adhesive film 51 by the pulling force of the release adhesive film 54. That is, the adhesive region A3 faces the peeling direction and becomes larger in an orthogonal direction with respect to the peeling direction, so that the adhesive force becomes stronger.

As shown in FIG. 3C, when the release adhesive film 54 is stretched in the direction shown by the arrow F5, a force acts on the rolled-up direction at the peeling starting point P. Since the tensile force of the peeling adhesive film 54 is dispersed in the adhesion area A3, the peeling adhesive film 54 is not peeled off from the protective adhesive film 51 before peeling the protective adhesive film 51 from the wafer W. Since the tensile force of the peeling adhesive film 54 directly acts on the direction in which the protective adhesive film 51 is rolled up from the wafer W, the outer peripheral edge of the wafer W is not damaged, and the protective adhesive film 51 can be smoothly smoothed by a weak tensile force. Stripped away. In addition, because it can be peeled off smoothly, breakage can be suppressed and the peeling speed can be increased.

In addition, as shown in a modification of FIG. 4A, the peeling film adhesive means 41 may form the contact surface shape of the pressing portion 42 on the lower surface of the heating means 45 into an arc shape having a predetermined width. The abutting surface 43 of the pressing portion 42 is formed of, for example, a short arc having a length of 5.0 [mm] and a width of 0.5 [mm], so that the adhesion area of the release adhesive film 54 to the protective adhesive film 51 is minimized. The curvature of the arc-shaped contact surface 43 may be formed to be the same as the curvature of the outer periphery of the wafer W, or may be slightly smaller than the curvature of the outer periphery of the wafer W. Therefore, the arc shape of the contact surface 43 can be brought closer to the outer peripheral edge of the wafer W.

As shown in FIG. 4B, the abutting surface 43 of the pressing portion 42 is positioned on the outer periphery of the wafer W, and the pressing portion 42 presses the release adhesive film 54 on the protective adhesive film 51 in a heated state, in an arc-shaped adhesive area A4 heat-presses the release adhesive film 54 on the protective adhesive film 51. Thereby, the adhesion area A4 of the release adhesive film 54 with respect to the release adhesive film 51 can be positioned at the peeling start point P of the protective adhesive film 51 with respect to the wafer W. Since the arc-shaped adhesive region A4 is adhered along the outer periphery of the wafer W over a wide range, it is difficult for the peeling adhesive film 54 to peel from the protective adhesive film 51 by the pulling force of the peeling adhesive film 54. That is, the adhesive region A4 faces the peeling direction and becomes larger in an orthogonal direction with respect to the peeling direction, so that the adhesive force becomes stronger.

As shown in FIG. 4C, when the release adhesive film 54 is stretched in the direction indicated by the arrow F6, a force acts on the peeling starting point P in the direction of the roll-up. At this time, since the tensile force of the release adhesive film 54 is dispersed in the adhesion area A4, the release adhesive film 54 is not peeled from the protective adhesive film 51. In addition, since the width in the peeling direction of the adhesive region A4 is small, the folding-back angle (peeling start angle) of the peeling adhesive film 54 is also small, and the protective adhesive film 51 is easily rolled up from the wafer W at the peeling starting point P. The pulling force of the peeling adhesive film 54 directly acts on the direction in which the protective adhesive film 51 is rolled up from the wafer W, and the protective adhesive film 51 can be peeled off by a weaker pulling force. In this way, since the width of the arc-shaped abutting surface 43 is narrowed, the starting point of the turn-back can be made small and damage can be suppressed.

Next, referring to Fig. 5, the peeling operation of the protective adhesive film by the adhesive film peeling device will be described. FIG. 5 is an explanatory diagram of a peeling operation of a protective adhesive film according to this embodiment.

As shown in FIG. 5A, when the wafer W is held on the holding table 11, the outer peripheral edge of the wafer W is positioned directly below the pressing portion 32 of the peeling film sticking means 31. In addition, the release adhesive film 54 is pulled out from a film roll (not shown) above the wafer W, and the release adhesive film 54 is held by a pair of holding rollers 22 in a state of protruding in the pull-out direction. In this initial state, the holding means 25 is evacuated from one end of the release film 54. In addition, by irradiating the protective film 51 with ultraviolet rays by an ultraviolet lamp (not shown), the adhesive layer of the protective film 51 is hardened and the adhesive force is decreased.

As shown in FIG. 5B, one end of the peeling adhesive film 54 is clamped by the clamping means 25. When the peeling adhesive film 54 is pulled out only a predetermined length from the pair of holding rollers 22 in the pulling direction, the clamp The adhesive film 54 is peeled off and the contact surface 33 of the pressing portion 32 faces the upper surface of the protective adhesive film 51. Then, the pressing portion 32 moves downward, and the release adhesive film 54 is pressed against the protective adhesive film 51 by the pressing portion 32 in a heated state. At this time, since the abutting surface 33 is formed in a circular shape, and the arc shape of the outer edge of the abutting surface 33 is close to the outer peripheral edge of the wafer W, the release adhesive film 54 is thermally pressed against the protective film 51.

As shown in FIG. 5C, in a state where the release adhesive film 54 is pressed against the protective adhesive film 51 by the pressing portion 32, the cutting portion 36 moves downward to cut off the release adhesive film 54. The release adhesive film 54 is cut and separated from the adhesive film roll to form a strip-shaped sheet when the protective adhesive film 51 is peeled off by the release adhesive film 54. As shown in FIG. 5D, the holding table 11 is moved in the peeling direction with respect to the holding means 25 by the moving means 37 (see FIG. 1), and the protective adhesive film is started to be formed from the wafer W by stretching the peeling adhesive film 54. 51 stripped. Then, the protective sheet 51 is completely peeled from the wafer W by the holding table 11 under the clamping means 25.

At this time, since the release adhesive film 54 and the protective adhesive film 51 are thermally pressed along the outer peripheral edge of the wafer W, the release adhesive film 54 becomes difficult to peel off from the protective adhesive film 51, and at the same time, the protective adhesive P is peeled off. The film 51 is easily peeled from the wafer W. Therefore, the outer peripheral edge of the wafer W can be prevented from being damaged during the peeling of the protective film 51, and the peeling speed can be increased and the work time required for the peeling operation can be shortened. For example, the peeling speed at the time of forming the front-end peeling region is increased from the existing 0.5 [mm / s] to 5.0 [mm / s], and the peeling when the protective film 51 is peeled to the center of the wafer W can be performed. The speed was increased from the existing 1.0 [mm / s] to 10.0 [mm / s].

(Experimental example)
Experimental examples are described below. In the experimental example, the release adhesive film 54 was thermally pressed against the protective adhesive film by pressing portions having different abutting surface shapes, and the peeling of the release adhesive film after peeling the protective adhesive film from the wafer under the same conditions was observed. Or wafer damage. Here, a wafer with a diameter of 300 [mm], a thickness of 25 [µm], and a wafer size of 8x8 [mm] is used. PO (polyolefin; polyolefin), PET (polyethylene terephthalate; polyethylene terephthalate) are used. A BG film (back grinding tape) composed of a multilayer substrate is used as a protective film, and a PET film is used as a release film. In addition, a circular contact surface or an arc-shaped contact surface is used as the contact surface-shaped pressing portion.

As a result, regardless of whether the contact surface is circular or arc-shaped contact surface, when the contact area is 0.4 [mm ² ], the peeling adhesive film does not peel off from the protective adhesive film, and the contact area is In the case of 0.5 [mm ² ], the adhesive film is not peeled from the protective film. In addition, when the abutting area is 17.0 [mm ² ], the wafer is not damaged even if the peeling speed at the time of forming the leading-end peeling area is 5.00 [mm / s], and the abutting area is 17.5 [mm ² In the case of [], if the peeling speed at the time of forming the tip peeling region is set to 5.00 [mm / s], it is confirmed that the wafer is damaged. In addition, the same results have been confirmed for a wafer with a diameter of 200 [mm]. Therefore, the shape of the contact surface of the pressing portion is preferably 0.5 [mm ² ] to 17.0 [mm ² ] with respect to the contact area of the wafer having a diameter of 200 to 300 [mm].

As described above, according to the adhesive film peeling device 1 of this embodiment, since the contact surface shape of the pressing portion 32 has at least a circular arc shape, the circular arc shape of the pressing portion 32 can be as close to the outer peripheral edge of the wafer W as possible. The release adhesive film 54 is pressed against the upper surface of the protective adhesive film 51. Thereby, the release adhesive film 54 is thermally pressed on the upper surface of the protective adhesive film 51 in a circular arc shape on the outer periphery of the wafer W, and the thermally pressed portion of the release adhesive film 54 with respect to the protective adhesive film 51 is bonded to the wafer. The outer peripheral edge of W is close to the peeling starting point P that starts peeling of the protective film 51. When the peeling adhesive film 54 is stretched, a tensile force acts directly on the outer peripheral edge of the wafer W in the direction of peeling the protective adhesive film 51 through the peeling adhesive film 54. Therefore, since the outer peripheral edge of the wafer W is not easily damaged when the peeling of the protective adhesive film 51 is started, the peeling speed can be increased and the protective adhesive film 51 can be peeled off from the wafer W in a short time.

In addition, in this embodiment, although it is a structure which hold | maintains a wafer on the holding surface of a holding stage through an adhesive film, it is not limited to this structure. For example, a plurality of clamps may be provided around the holding surface of the holding table, and the ring frame may be fixed by the clamps.

In addition, in this embodiment, the configuration is such that the movable claw approaches the fixed claw and clamps the peeling adhesive film, but the configuration is not limited to this configuration. The clamping means may be configured to clamp one end of the release adhesive film, and for example, the tip of the release adhesive film may be fixed by a pair of movable claws approaching each other.

In addition, in this embodiment, although the structure which peeled the peeling adhesive film mechanically by the cutting part was demonstrated, it is not limited to this structure. The cutting section may have a configuration capable of cutting the release adhesive film, and for example, may be a configuration that performs thermal cutting with an electrically heated wire.

In addition, in this embodiment, although the structure which irradiates an ultraviolet-ray to a protective film and reduces the adhesive force of a protective film is demonstrated, it is not limited to this structure. It is also possible to perform a peeling operation of the protective film so as not to reduce the adhesive force of the protective film. In addition, instead of the ultraviolet curing resin of the protective film, a thermosetting resin may be used. In this case, it is preferable to heat the protective film before the peeling operation of the protective film.

In addition, in the present embodiment described above, the configuration is described in which the protective adhesive film is peeled from the ground wafer by the peeling adhesive film, but it is not limited to this configuration. The peeling adhesive film is to peel off the protective adhesive film adhered to the wafer, and is not limited to peeling off the protective adhesive film of the wafer after grinding.

In addition, in the embodiment described above, the moving means is a configuration that moves the holding table with respect to the holding means and thereby peels the protective adhesive film from the wafer, but it is not limited to this configuration. The moving means may be a configuration in which the holding means is moved relatively to the holding table, and thereby the protective adhesive film is peeled from the wafer. For example, the moving means may be a structure in which the holding means is moved relative to the holding table and the protective adhesive film is peeled from the wafer.

In addition, in the present embodiment described above, the peeling adhesive film sticking means has a configuration in which the peeling adhesive film is thermally pressed against the protective adhesive film, but it is not limited to this configuration. The peeling adhesive film sticking method only needs to be able to stick the peeling adhesive film to the protective adhesive film. For example, the peeling film can be pasted to the protective adhesive film through an adhesive.

In addition, various workpieces such as a semiconductor substrate, an inorganic material substrate, and a package substrate can be used as the wafer. Various substrates such as silicon, gallium arsenide, gallium nitride, and silicon carbide can be used as the semiconductor substrate. As the inorganic material substrate, various substrates such as sapphire, ceramics, and glass can also be used. The semiconductor substrate and the inorganic material substrate may be formed with or without an element. As the package substrate, various substrates for CSP (Chip Size Package), SIP (System In Package), and FOWLP (Wafer Level Fan Out Package) can be used. The package substrate may be formed with a barrier against EMI (Electro Magnetic Interference). In addition, as the wafer, lithium tantalate or lithium niobate after element formation or before element formation, or unsintered ceramics or piezoelectric materials may be used.

In addition, although this embodiment and a modification have been described, a combination of all or part of the above-mentioned embodiment and modification can be regarded as another embodiment of the present invention.

In addition, the embodiments of the present invention are not limited to the above-mentioned embodiments or modified examples, and various changes, substitutions, and modifications can be made without departing from the technical idea of the present invention. Furthermore, due to the advancement of technology and other techniques derived from it, if the technical idea of the present invention can be implemented by other methods, it can also be implemented by other methods. Therefore, the scope of the patent application covers all embodiments included in the technical idea of the present invention.

[Industrial availability]
As described above, the present invention has the effect of well peeling the protective film from the wafer in a short time, and is particularly effective for a film peeling device that peels the protective film from a wafer after grinding.

1‧‧‧ Adhesive film peeling device

11‧‧‧ holding table

25‧‧‧ Clamping means

31‧‧‧ Peeling Adhesive Means

32‧‧‧Pressing section

33‧‧‧ abutment

34‧‧‧ Lifting means

35‧‧‧ heating means

37‧‧‧ Means of movement

51‧‧‧ protective film

52‧‧‧ Adhesive film

P‧‧‧ Stripping Start

W‧‧‧ Wafer

FIG. 1 is a schematic diagram of a film peeling device according to this embodiment.

FIG. 2 is an explanatory diagram of a peeling operation of a protective film of a comparative example.

FIG. 3 is an explanatory diagram of a release adhesive film sticking means according to the present embodiment.

FIG. 4 is an explanatory diagram of a peeling film sticking means according to a modification.

FIG. 5 is an explanatory diagram of a peeling operation of a protective adhesive film according to this embodiment.

Claims (1)

An adhesive film peeling device, which pastes a peeling adhesive film on a protective adhesive film adhered on one side of a wafer, stretches the peeling adhesive film to peel the protective adhesive film from the wafer, and is characterized in that: Holding table, holding the other side of the wafer; A peeling adhesive film sticking means, pasting the peeling adhesive film on the upper surface of the protective adhesive film of the wafer held by the holding table; Clamping means for clamping one end of the release adhesive film pasted by the release adhesive film sticking means; and Moving means for relatively moving the clamping means and the holding table, stretching the peeling adhesive film from the outside of the wafer to the center, and peeling the protective adhesive film from the wafer; The peeling adhesive film sticking means has: A pressing part for pressing the peeling adhesive film on an upper surface of the protective adhesive film of the wafer; a lifting means for bringing the pressing part close to or separated from the holding table; and a heating means for heating the pressing part; The shape of the abutting surface of the release adhesive film that abuts the pressing portion has at least a circular arc shape, and in a state where the circular arc shape is positioned near the outer periphery of the wafer, the release adhesive film is pressed against the upper surface of the protective adhesive film. And paste.