JP2010028062A - Sheet peeling device and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet peeling device and peeling method that smoothly peel an adhesive sheet from an adherend such as a wafer while suppressing raising and cracking of the adherend. <P>SOLUTION: The adhesive sheet is peeled from the adherend in a peeling process while a foldable area R4 is folded by sticking a release tape on the adhesive sheet in a sticking process by using a press head 33 having a foldable area forming portion 355 formed between a first press portion 351 and a second press portion 352. Therefore, a peeling state wherein the whole adhesion area is raised at the same time is avoidable, and the adhesive sheet is peeled in order from its end, so that the adhesive sheet is smoothly peeled while raising of an adherend end is suppressed to prevent the adherend from deforming. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method for peeling a sheet attached to an adherend.

  Conventionally, in a semiconductor manufacturing process, there is a process of grinding and thinning the back surface of a semiconductor wafer (hereinafter simply referred to as a wafer) in order to reduce the size of a semiconductor chip. In this grinding process, an adhesive sheet is bonded to the wafer surface (surface on which the circuit is formed), and after the grinding process, the adhesive sheet is peeled off from the wafer. And as such a peeling method of the adhesive sheet, a method is proposed in which a peeling tape is bonded to an end of the adhesive sheet, and the peeling sheet is pulled from the wafer by pulling the peeling tape (for example, a patent) Reference 1).

Japanese Patent Laid-Open No. 11-16862

  By the way, in the conventional peeling method as described in Patent Document 1, the length of the circumferential direction along the outer periphery of the wafer and the diameter toward the center of the wafer are used as the adhesive region of the peeling tape at the end of the adhesive sheet. It is defined by the length in the direction (distance d and d ≦ 3 mm in Patent Document 1), and this adhesion region is set based on a surplus region where no circuit surface is formed.

Here, as shown in FIG. 7A, when the adhesive sheet 91 is peeled off using the peeling tape T having a heat-sensitive adhesive, the adhesive is aged with the adhesive region 90 when the adhesive is welded. There is a tendency to harden together. When the adhesive sheet 91 is peeled by pulling the thus-cured peeling tape T, as shown in FIG. 7B, the adhesive region 90 pulled by the peeling tape T tends to rise simultaneously in a planar shape. . As a result, the stress acting on the boundary portion W1 of the wafer W adjacent to the adhesion region 90 becomes large, and the wafer W rises together with the peeling tape T at the boundary portion W1. Further, when the rising of the wafer W is increased, the wafer W may be broken in some cases. Even if the wafer W is cracked, the bonding region 90 is provided in the surplus region of the wafer W as described above, so that there is no major problem in manufacturing semiconductor chips from the wafer W.
In order to prevent such rising and cracking of the wafer W, the problem can be solved by shortening the length (distance d0) in the radial direction toward the center of the wafer W in the bonding region 90, but from the entire surface of the wafer W. The adhesive force cannot be withstood by the tension for peeling the adhesive sheet 91, and the peeling tape T is separated from the adhesive sheet 91 in the middle of peeling, which causes a disadvantage that peeling failure occurs. In particular, as the wafer outer diameter increases in recent years, the tension required for peeling off the adhesive sheet tends to increase.

  The present invention has been devised by paying attention to the above disadvantages, and its purpose is to smoothly peel off the adhesive sheet from the adherend while suppressing the rising and cracking of the adherend such as a wafer. It is providing the sheet peeling apparatus and peeling method which can be performed.

  In order to achieve the above object, the sheet peeling apparatus of the present invention removes the adhesive sheet from the adherend by relative movement between the adherend having an adhesive sheet attached to the surface and the peeling tape attached to the adhesive sheet. A sheet peeling device for peeling, the holding means for holding the adherend, the feeding means for feeding out the peeling tape, and the pasting means for pressing and sticking the fed peeling tape against the adhesive sheet And a moving means for moving the adherend and the peeling tape relative to each other, the sticking means having a pressing head for pressing the peeling tape against the adhesive sheet, and the pressing head Includes a first pressing portion for attaching the first adhesive region of the peeling tape to the adhesive sheet, a second pressing portion for attaching the second adhesive region of the peeling tape to the adhesive sheet, and the first adhesive. Territory When it is configured to include at least a variable folding area forming section for forming a variable folding region over the second adhesive region.

At this time, in the sheet peeling apparatus of the present invention, it is preferable that the outer edge of the first pressing portion has a shape along the outer edge of the adhesive sheet and the pressing head is formed.
Furthermore, in the sheet peeling apparatus of the present invention, it is preferable that the peeling tape is a heat-sensitive adhesive sheet, and the sticking means includes a heating means for heating the pressing head. .
In the sheet peeling apparatus of the present invention, the foldable region forming portion of the pressing head includes the third pressing portion for attaching the third adhesive region of the peeling tape to the adhesive sheet, and the adhesive tape. It is preferable to have a non-sticking portion that does not stick to the sheet.

  On the other hand, the sheet peeling method of the present invention is a sheet peeling method in which the adhesive sheet is peeled from the adherend by relative movement between an adherend having an adhesive sheet attached to the surface thereof and a peeling tape attached to the adhesive sheet. The step of holding the adherend, the step of feeding out the peeling tape, and pressing the fed-off peeling tape against the adhesive sheet, the first and second adhesive regions and the foldable A step of affixing the peeling tape to the adhesive sheet divided into regions, and moving the adherend and the peeling tape relative to each other, bending the foldable region following the first adhesive region, And a step of sequentially peeling the second adhesive region.

  According to the present invention as described above, the first and second adhesive regions of the peeling tape are affixed to the adhesive sheet by the first and second pressing portions of the pressing head, and the foldable region is formed by the foldable region forming portion. By forming the detachable state, when the peeling tape is pulled to peel the adhesive sheet from the adherend, the foldable region is bent, and the peeling state in which the entire adhesive region is raised at the same time can be avoided. Therefore, it is possible to smoothly peel the adhesive sheet from the adherend while suppressing the rise of the adherend end to prevent the adherend from rising or cracking.

At this time, if the outer edge of the first pressing portion has a shape along the outer edge of the adhesive sheet, the first adhesive region can be formed along the outer edge of the adhesive sheet. The sheet can be reliably peeled from the end.
Furthermore, if the peeling tape is a heat-sensitive adhesive tape, a higher adhesive force can be obtained compared to a pressure-sensitive adhesive tape, so that the adhesive area of each adhesive region can be reduced, It is possible to further suppress the rising of the body. And by using a heat-sensitive adhesive tape, it is possible to accurately bond only predetermined adhesive regions (first and second adhesive regions), and since there is no adhesive force at room temperature, pressure-sensitive adhesiveness Thus, it is not necessary to pay attention to the configuration of the apparatus such as applying non-adhesion treatment to various parts of the apparatus as in the case of using the adhesive tape.

  In addition, if the foldable area formation of the pressing head is configured to have the third pressing part and the non-sticking part, the adhesive area of the third bonding area can be made relatively small when peeling. It is possible to ensure that the folding area bends. The non-sticking portion may be a non-contact portion formed in a concave shape so as not to come into contact with the peeling tape, and even if it comes into contact with the peeling tape, the pressing force is higher than that of the first to third pressing portions. May be configured to be small. Further, if the peeling tape is a heat-sensitive adhesive sheet, the non-sticking part may be a non-heated part that does not heat the peeling tape.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a side view showing a sheet peeling apparatus 1 according to the present embodiment. FIG. 2 is a side view of the main part of the sheet peeling apparatus 1.
1 and 2, a sheet peeling apparatus 1 is an apparatus for peeling an adhesive sheet S attached to the surface of a wafer W as an adherend using a tape T that is a peeling tape. A table 10 as holding means for holding, a feeding unit 20 as feeding means for feeding out the tape T, a pasting unit 30 as pasting means for sticking the fed tape T to the adhesive sheet S, a wafer W and a tape T And moving means 40 for relatively moving them. The wafer W is integrated with the ring frame 12 via the dicing tape D.

  The table 10 includes a flat table main body 11 that sucks and holds the wafer W through a suction port (not shown), and is configured to suck and hold the wafer W integrated with the ring frame 12 from the dicing tape D side. .

  The feeding unit 20 includes a feeding unit main body 21 that is supported by a detaching device (not shown) so as to be movable up and down, support rollers 22 and guide rollers 23 and 24 provided in the feeding unit main body 21, and a lower part of the feeding unit main body 21. The tape support part 25 that is provided to support the tape T from below, the chuck member 28 that includes the gripping claws 27 that grip the tape T, and the tape T that is provided and fed above the tape support part 25 are cut. And a tape cutting unit 26. The tape support portion 25 includes a bush 251 fixed to the feeding unit main body 21, a rod 252 supported by the bush 251 so as to freely advance and retract, and a tape receiving plate fixed to the tip of the rod 252 and having a cutter groove 255. 253 and a coil spring 254 that urges the tape receiving plate 253 in a direction protruding from the bush 251. The tape cutting unit 26 includes a cutter blade 261 that cuts the tape T, a vertical cylinder 262 that drives the cutter blade 261 up and down to guide the cutter blade 261 into the cutter groove 255 when cutting the tape T, and a cutter. A cutting cylinder 263 for cutting the tape T by driving the blade 261 in the direction orthogonal to the paper surface in FIG. 1 is configured. The tape T is a heat-sensitive adhesive tape, and is supported by the support roller 22 in a state of being wound in a roll shape.

  The sticking unit 30 is supported on a unit support portion (not shown) and is provided on the left side of the feeding unit 20 in FIG. The affixing unit 30 includes a pressing motor 31 connected to the unit support portion and a pressing head 33 provided at the lower end portion of the output shaft 32 of the pressing motor 31. The pressing head 33 is pushed downward by driving the pressing motor 31. Further, the pressing head 33 incorporates a heater 34 as a heating means, and the pressing head tip 35 is heated by the heater 34. In such an affixing unit 30, as shown in FIG. 2, the pressure head tip 35 heats and presses the tape T, thereby melting the heat-sensitive adhesive layer of the tape T and attaching the tape T to the adhesive sheet. It is comprised so that it may weld to S.

Here, the structure of the pressing head 33 will be described with reference to FIGS.
The pressing head tip portion 35 of the pressing head 33 is formed in a substantially arc shape in plan view along the outer edge of the adhesive sheet S, and is provided on the inner periphery side of the arc, the first pressing portion 351 provided on the outer periphery side of the arc. And a third pressing portion 353 and a non-pressing portion 354 provided between the first and second pressing portions 351 and 352. That is, the first pressing portion 351 is formed so that the outer edge thereof has a shape along the outer peripheral edge of the wafer W. The first pressing portion 351 is separated from the first pressing portion 351 by a predetermined interval (reference symbol A in FIG. 4). The second pressing portion 352 is formed to be spaced apart in the direction indicated by. The plurality of third pressing portions 353 and the non-pressing portion 354 constitute the foldable region forming portion 355 of the present embodiment.

  The third pressing portion 353 and the non-pressing portion 354 are provided so as to span the first pressing portion 351 and the second pressing portion 352, and the non-pressing portion 354 is recessed with respect to the pressing portions 351, 352, and 353. It is formed with. These non-pressing portions 354 do not come into contact with the tape T during the sticking step shown in FIG. 2, and the tape T is pressed against the adhesive sheet S with such a pressing head 33 and heated. 4 (A), an adhesive region (first to third adhesive regions R1, R2, R3) of the tape T and a non-adhesive region N not attached to the adhesive sheet S are formed. .

  4A, the first adhesive region R1 where the tape T and the adhesive sheet S are bonded is formed along the outer peripheral edge of the adhesive sheet S, and the second adhesive region R2 is the first adhesive region R1. It is formed closer to the center of the wafer W along the peeling direction A. The third adhesive region R3 connects the first adhesive region R1 and the second adhesive region R2 and extends along the peeling direction A, and the non-adhesive region N includes the first adhesive region R1 and the second adhesive region R2. Between the adjacent third adhesive regions R3. Thereby, the foldable region R4 of the present embodiment is constituted by the third adhesion region R3 and the non-adhesion region N. In order to peel the adhesive sheet S in the foldable region R4 from the wafer W while bending the foldable region R4, the third adhesive region R3 has a larger area than the adhesive areas of the first and second adhesive regions R1 and R2. The bonding area is set to be small, and the rigidity of the foldable region R4 including the third bonding region R3 is set to be relatively smaller than that of the first and second bonding regions R1 and R2. That's fine.

  As shown in FIG. 4B, the first to third adhesion regions R1, R2, R3 and the non-adhesion region N may be formed in a substantially triangular shape in plan view as shown in FIG. The third adhesive region R3 is a substantially isosceles triangle having a base along the first adhesive region R1 and a vertex in contact with the second adhesive region R2. That is, as the shape and the adhesive area of the first to third adhesive regions R1, R2, R3 and the non-adhesive region N, the rigidity is such that the third adhesive region R3 can be bent when the adhesive sheet S is peeled off. It can be set appropriately according to the diameter of the wafer W, the adhesive strength of the adhesive sheet S, and the like.

  The moving means 40 includes a single-axis robot 41 provided on the back side of the drawing unit 20 in FIG. 1 and its slider 42, a single-axis robot 43 provided below the table body 11, and its slider 44. ing. The slider 42 is attached to the chuck member 28 and is movable in the left-right direction in FIG. 1, and the slider 44 is attached to the table main body 11 and is movable in the left-right direction in FIG. As a result, the chuck member 28 grips the tape T affixed to the adhesive sheet S to enable relative movement with the wafer W, and the adhesive sheet S can be peeled from the wafer W.

Next, the operation of the sheet peeling apparatus 1 will be described with reference to FIGS. 5 and 6 as a method for peeling the adhesive sheet S in the present embodiment.
As a procedure for peeling the adhesive sheet S from the wafer W, first, as shown in FIG. 1, the wafer W is held at a predetermined position of the table 10 and each part of the sheet peeling apparatus 1 is set to the initial position. The chuck member 28 moves toward the feeding unit 20 via the single-axis robot 41 after the tape cutting unit 26 and the pasting unit 30 are moved upward and retracted. When the gripping claws 27 positioned below contact the tape receiving plate 253, the tape receiving plate 253 is pushed in the direction of the bush 251 and the tip of the tape T is received between the upper and lower gripping claws 27. The chuck member 28 closes the gripping claws 27 to grip the tip of the tape T, moves in a direction away from the feeding unit 20 while gripping the tape T, pulls out the tape T by a predetermined length, and stops.

  Next, as shown in FIG. 2, in a state where the tape T is stretched between the chuck member 28 and the tape receiving plate 253, the sticking unit 30 operates the pressing motor 31 to push down the pressing head 33. Then, the intermediate portion of the tape T is lowered by the pressing head tip 35 and pressed against the adhesive sheet S. At this time, the pressure head tip 35 is heated by the heater 34, and the first to third adhesion regions R 1, R 2, R 3 of the tape T are bonded to the adhesive sheet S by the first to third pressure portions 351, 352, 353. Affixed to (attachment process). At this time, since the non-pressing portion 354 does not contact the tape T, a non-adhesive region N that is not bonded to the adhesive sheet S is formed. Thereafter, the tape cutting unit 26 lowers the cutter blade 261 into the cutter groove 255 by the upper and lower cylinders 262, drives the cutting cylinder 263, and cuts the tape T by the cutter blade 261.

Next, as shown in FIG. 5 (A), the single-axis robot 41 holds the tip of the tape T in the state where the feeding unit main body 21, the tape cutting unit 26, and the pasting unit 30 are retracted upward. While moving the member 28 in the peeling direction A (right direction in the figure), the single-axis robot 43 moves the table 10 in the direction opposite to the peeling direction A. As described above, the single-axis robot 41 and the single-axis robot 43 cause the tape T and the wafer W to move in opposite directions, and the adhesive sheet S is sequentially peeled from the wafer W by pulling the adhesive sheet S through the tape T. Then, the entire adhesive sheet S is peeled off.
In this peeling operation, first, as shown in FIG. 5B, the adhesive sheet S is bent in the foldable region R4 at the moment when the first adhesive region R1 is pulled in the peeling direction A and peeled off, and the wafer The end portion is peeled off without raising W. Thereafter, the peeling operation is continued, and as shown in FIG. 6A, the second adhesive region R2 is pulled to peel the adhesive sheet S from the wafer W as shown in FIG. 1. The adhesive sheet S is securely held by a part of the first, second adhesive regions R1, R2 and the third adhesive region R3, and the entire adhesive sheet S is peeled from the wafer W. Thereafter, the tape T to which the peeled adhesive sheet S is bonded is collected from the chuck member 28, and the wafer W from which the adhesive sheet S has been peeled is unloaded from the table 10 by an appropriate transport device, and each part of the sheet peeling device 1 is moved. It returns to an initial position and the peeling procedure of the adhesive sheet S is completed.

According to this embodiment as described above, the following effects are obtained.
That is, the first to third adhesive regions R1, R2, and R3 are affixed to the adhesive sheet S, and the adhesive sheet S is peeled off from the wafer W while the third adhesive region R3 is folded, so that the adhesive sheet S becomes planar. The peeling state that gets up can be avoided, and the adhesive sheet S can be smoothly peeled from the wafer W.
Furthermore, since the non-pressing portion 354 is provided in the pressing head 33, the non-adhesive region N can be formed and the foldable region R4 can be easily bent.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above embodiment, the case where the adherend is a semiconductor wafer is shown, but the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate are used. The substrate can also be a target, and the semiconductor wafer can be exemplified by a silicon wafer, a compound wafer, and the like, and a peeling apparatus and a peeling method for peeling an adhesive sheet (sheet, film, tape, etc.) affixed to the adherend The present invention can also be applied to.
Moreover, in the said embodiment, although the tape T which is a heat sensitive adhesive sheet was used as a peeling tape, it is not restricted to this, The peeling tape may be comprised with a pressure sensitive adhesive tape etc. Moreover, although the adhesive sheet S is shown as the adhesive sheet to be peeled off, it is not limited to this, and an appropriate sheet, film, tape, or the like may be used.
Further, in the sheet peeling apparatus 1 of the embodiment, the description of the parts that are not the main part of the present invention is omitted or simplified, but the omitted configuration and operation are those disclosed in Patent Document 1. Can be used, and is not necessarily limited to the form disclosed in Patent Document 1, and may be appropriately modified according to the function of each part.

  Moreover, as a press head, the thing provided with the 4th or more press part other than the 1st-3rd press part may be provided, and it is a center side of a to-be-adhered body rather than the said 2nd press part 352 as a press head. The fourth pressing portion may be formed, and the second foldable region forming portion 355 may be formed between the second pressing portion and the fourth pressing portion.

Furthermore, in the said embodiment, although it comprised with the feeding unit 20 which has the supporting roller 22 and the guide rollers 23 and 24 which wind up and support the peeling tape in roll shape as a feeding means, it is limited to such a structure. Not. That is, the feeding means is not limited to the one that feeds out the roll-like peeling tape, and a cut sheet tape having an appropriate length may be adopted as the peeling tape.
In the above embodiment, the moving means 40 is configured to move both the wafer W and the tape T and move them relative to each other. However, the present invention is not limited to this, and only one of the wafer W and the tape T is moved. Alternatively, the moving means 40 may be configured.

The side view which shows the sheet peeling apparatus which concerns on embodiment of this invention. Operation | movement explanatory drawing of the sheet peeling apparatus of FIG. The perspective view of the press head in the sheet | seat peeling apparatus of FIG. (A), (B) is a figure explaining the adhesion area | region of the tape for peeling. (A), (B) is operation | movement explanatory drawing of the sheet peeling apparatus following FIG. (A), (B) is operation | movement explanatory drawing of the sheet peeling apparatus following FIG. (A), (B) is explanatory drawing which shows the example of a conventional malfunction.

Explanation of symbols

1 Sheet peeling device 10 Table (holding means)
20 Feeding unit (feeding means)
30 Sticking unit (sticking means)
33 Pressing head 34 Heater (heating means)
40 moving means 351 first pressing portion 352 second pressing portion 353 third pressing portion 354 non-pressing portion (non-sticking portion)
355 foldable region forming portion R1 first adhesive region R2 second adhesive region R3 third adhesive region R4 foldable region S adhesive sheet T tape (peeling tape)
W Wafer (Substrate)

Claims (5)

A sheet peeling device for peeling the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet attached to the surface and a peeling tape attached to the adhesive sheet,
Holding means for holding the adherend;
A feeding means for feeding out the peeling tape;
A sticking means for pressing and sticking the fed peeling tape to the adhesive sheet;
A moving means for relatively moving the adherend and the peeling tape;
The affixing means includes a pressing head that presses the peeling tape against the adhesive sheet, and the pressing head is a first pressing unit that affixes a first adhesive region of the peeling tape to the adhesive sheet. And a second pressing part that affixes the second adhesive area of the peeling tape to the adhesive sheet, and a foldable area forming part that forms a foldable area across the first adhesive area and the second adhesive area. A sheet peeling apparatus characterized by comprising at least.   The sheet peeling apparatus according to claim 1, wherein the pressing head is formed such that an outer edge of the first pressing portion has a shape along the outer edge of the adhesive sheet. The peeling tape is a heat-sensitive adhesive sheet,
The sheet peeling apparatus according to claim 1, wherein the sticking unit includes a heating unit that heats the pressing head.   The foldable region forming portion of the pressing head has a third pressing portion for attaching the third adhesive region of the peeling tape to the adhesive sheet, and a non-sticking portion for not attaching the peeling tape to the adhesive sheet. The sheet peeling apparatus according to any one of claims 1 to 3, wherein the sheet peeling apparatus is configured as described above. A sheet peeling method for peeling the adhesive sheet from the adherend by relative movement between an adherend having an adhesive sheet attached to the surface and a peeling tape attached to the adhesive sheet,
Holding the adherend;
A step of feeding out the peeling tape;
Pressing the fed release tape against the adhesive sheet to divide the tape into the first and second adhesive regions and the foldable region and affixing the peel tape to the adhesive sheet;
A step of relatively moving the adherend and the peeling tape, bending the foldable region following the first adhesive region, and then sequentially peeling the second adhesive region. Peeling method.

Images