TW201930903A - Sorting machine for testing electronic components capable of minimizing loss of a temperature environment and increasing a processing capacity - Google Patents

Abstract

The invention relates to a handler for testing electronic components. According to the handler of the present invention, after an opening and closing device of a first input and output port of a test chamber opens the first input and output port and before it closes the first input and output port, a testing tray loaded with electronic components after performing the test is moved out from the test chamber, and a testing tray loaded with electronic components to be tested is moved into the test chamber. With the present invention, it is able to minimize a loss of a temperature environment of the test chamber and improve a processing capacity of the test chamber.

Description

Electronic component test sorting machine

The invention relates to a sorting machine for testing electronic components.

The electronic components produced are divided into good and defective products after being tested by the tester, and only good products are shipped.

The electrical connection between the tester and the electronic component is performed by an electronic component test sorter (hereinafter referred to as "sorting machine"), and includes various types of sorting machines depending on the type of the electronic component. The present invention relates to a sorting machine using a test tray capable of stacking a plurality of electronic components.

The sorting machine to which the test tray is applied has various forms including the Korean Patent Publication No. 10-2013-0105104, and the like, as shown in the schematic plan view of FIG. 1, includes a loading device 110, a soak chamber 120, The test chamber 130, the connection device 140, the heat dissipation chamber (Desoak Chamber) 150, and the unloading device 160.

The loading device 110 loads the electronic components to be tested stacked on the passenger tray CT ₁ to the test tray TT at the loading position (LOADING POSITION) LP.

The soaking chamber 120 is for pre-adjusting the temperature (preheating or pre-cooling) by applying a thermal stimulus according to the test temperature before testing the electronic components stacked on the contained test tray TT.

The test chamber 130 is equipped for testing the electronic components of the test tray TT that are transferred to the test position (TEST POSITION) TP after the preheating chamber 120 is preheated/precooled. That is, the test chamber 130 provides a temperature environment for maintaining the temperature of the electronic components stacked on the contained test tray TT at the test temperature conditions.

The connecting device 140 electrically connects the electronic components of the test tray TT stacked at the test position TP to the tester.

The heat dissipation chamber 150 is configured to return the electronic components loaded on the test tray TT transferred from the test chamber 130 to a predetermined temperature to the extent of no problem at room temperature or unloading.

Unloading means 160 located at the unloading position from a (UNLOADING POSITION) UP test tray TT unloading (unloading) the electronic component and the electronic component by the classification level of the test, and further to move the tray to the empty passenger CT _2.

As described above, the test tray TT is circulated along the circulation path CC that is reconnected to the loading position LP via the loading position LP, the test position TP, and the unloading position UP, and for this, a plurality of conveyors not shown are forming the circulation path CC. The test tray TT is transferred in each interval.

In addition, the sorter 100 shown in FIG. 1 has a structure in which the test chamber 130 is disposed between the soaking chamber 110 and the heat radiating chamber 150, and a structure in which the test tray TT is transferred along the closed loop path CC, and thus is considered. It is difficult to equip more than four test windows TW to the width or height of the device. Here, the test window TW represents a window in which the electronic component is electrically connected to the tester TESTER, and one test window TW corresponds to one test tray TT. Obviously, the tester TESTER is combined with the sorter 100 through the test window TW. Therefore, the electronic components that can be tested at one time are limited to the number of loadings of 1 to 3 test trays TT, which makes the sorter 100 that cannot be infinitely expanded in size have a processing capacity limit.

Therefore, the applicant of the present invention has proposed a technique for a sorting machine of the following new concept (hereinafter referred to as "prior art") in the currently unpublished Korean Patent Application No. 10-2017-000080: equipped with the ability to enable testing The moving chamber of the tray moves, thereby greatly expanding the processing capacity.

[Problem to be Solved by the Invention] An object of the present invention is to provide a technique for reducing the test tray in the case where the moving chamber is realized as a soaking chamber by inheriting and developing the sorting machine according to the prior art. The overall time from movement of the respective soaking chamber to the test chamber and movement of the test tray from the test chamber to the respective soaking chamber.

[Technical means for solving the problem] The electronic component testing sorting machine according to the present invention includes: a loading device that loads an electronic component carried on a passenger tray on a test tray at a loading position; a first soaking chamber, at Receiving a test tray carrying an electronic component through the loading device and applying thermal stimulation to the electronic component; the test chamber housing the test tray via the first heat equalizing chamber to provide a test tray capable of testing the containment a temperature environment of the electronic component and having a first inlet and outlet for allowing the test tray to enter and exit; a connecting device electrically connecting the electronic component of the test tray housed in the test chamber to the tester; opening and closing device, opening and closing the test cavity The first inlet and outlet of the chamber; an unloading device that unloads the electronic component that completes the test from the test tray that is moved to the unloading position after being carried out from the test chamber; and a transfer device for the first soaking chamber from the first Equipped in the process of moving to the test chamber or passing the test tray during the movement from the test chamber to the unloading position, The transfer device includes: a second soaking chamber that maintains thermal stimulation applied to the electronic component by the first soaking chamber after receiving the test tray received from the first soaking chamber a second inlet and outlet for allowing the test tray to enter and exit; a shutter to open and close the second inlet and outlet of the second soaking chamber; and a stacking block capable of stacking test trays carried out from the test chamber, and Equipped in a manner integrated with the second soaking chamber; the mover moves the second soaking chamber such that the second soaking chamber is located in the first soaking chamber Or one side of the test chamber, wherein the electronic component test sorter further includes: a supply, the test tray is supplied from the second soaking chamber to the test chamber; the recycler The test chamber recovers a test tray to the stacking block, the first inlet and the outlet being separated from each other when the second soaking chamber is located at one side of the test chamber Forming in a facing manner, opening the first out in the opening and closing device Before closing the first inlet and outlet, the supplier and the recycler are operated to recover a test tray containing electronic components for testing to the stack via the first inlet and outlet, and to be loaded A test tray having electronic components to be tested is sequentially supplied to the test chamber via the second inlet and outlet and the first inlet and outlet, so that the test chamber and the transfer device can be realized when the opening and closing device is operated once Exchange between test trays.

The test chamber and the connecting device are provided in plurality, at least one of the test chambers being spaced apart from the first soaking chamber, the mover being capable of positioning the second soaking chamber One side of each of the test chambers.

In order to minimize the loss of the temperature environment within the test chamber, when the test tray is exchanged between the test chamber and the transfer device, the time interval in which the supply is operated and the recycler are operated At least a portion of the time intervals overlap, and the movement lines of the test tray by the supply and the movement lines of the test tray by the recycler are separated from each other.

The stacking block is provided on an upper side of the second soaking chamber.

[Effect of the Invention] According to the present invention, the following effects are obtained.

First, since the time during which the test tray moves from the test chamber to the second soaking chamber and the time for moving the test tray from the second soaking chamber to the test chamber overlap, the temperature environment of the test chamber can be minimized Loss.

Second, since the action of supplying the test tray to the test chamber and recovering the test tray is realized in an exchange manner, it is possible to save time accordingly, and thus the processing capacity can be increased.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S) EMBODIMENT(S) EMBODIMENT(S) DESCRIPTION OF THE PREFERRED EMBODIMENT(S) </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; Description of the same composition.

<For the description of the composition>

Fig. 2 is a schematic plan view of a sorting machine for an electronic component test (hereinafter simply referred to as "sorting machine") 200 according to the present invention.

The sorting machine 200 according to the present embodiment includes a supply portion SP, a loading device 210, an identifier DA, a drive tester DT, a first buffer B1, a first opening device 220, a first soaking chamber 230, and 8 tests. The chamber TC, the eight connecting devices 220, the eight opening and closing devices OC, the heat dissipation chamber 240, the unloading device 250, the second buffer B2, the second opening device 260, the recovery portion RP, the transfer device 270, the supplier 280, and the recycling 290.

The supply part SP supplies electronic components that need to be tested. Such a supply portion SP can be embodied in various forms, but in the present embodiment, a passenger pallet TM for loading a passenger pallet CT ₁ loaded with an electronic component to be tested is mounted on a passenger pallet CT of the truck TM ₁ is supplied _one by one at a time.

The loading device 210 grips the electronic component loaded on the passenger tray CT ₁ supplied from the supply portion SP and finally loads it to the test tray TT at the loading position LP.

The recognizer DA is provided in the case where it is necessary to separately manage the electronic components, and is only provided as a reader that can read the corresponding identifier according to the identifier. For example, in the case where the identifier is a barcode, the reader is equipped with a barcode reader (or a camera for taking a barcode) capable of reading a barcode. The recognizer DA of the present embodiment reads the identifier in a state where the electronic component is gripped by the loading device 210. Therefore, in the process of loading the electronic component into the test tray TT, the loading device 210 operates in a manner via the identifier DA.

The drive tester DT is equipped for simply testing whether the electronic component is operated by the application of a power source. In order to perform the drive test of the electronic component by means of such a drive tester DT, it is preferable to equip the separate test frame TF and the opener OD. In the present embodiment, in order to increase the processing capacity, the test frame TF and the opener OD are respectively provided as a pair on both sides of the drive tester DT. And, the test tray TF is moved in the left-right direction so as to be selectively located in the supply and demand area RA and the test area TA, and the opener OD is provided in a manner fixed to the supply and demand area RA.

In order to drive the test, the loading device 210 first loads the electronic components to the test frame TF opened by means of the opener OD before loading the electronic components to the test tray TT.

If the electronic components are all loaded to the test frame TF, the test frame TF is moved to the test area TA to implement a drive test by means of the drive tester DT. At this time, the loading device 20 stacks the electronic components to the test frame TF on the other side.

If the drive test ends, the test framework TF returns to the supply and demand area RA, and the opener OD opens the test framework TF. And, the loading device 210 grips the electronic component from the test frame TF and loads it to the test tray TT. At this time, the electronic component judged to be defective in the drive test is moved to the first buffer B1.

The first buffer B1 is provided for stacking electronic components that are judged to be defective in the drive test.

The first opening device 220 opens the test tray TT at the loading position LP so that the loading device 210 loads the electronic components to the test tray TT at the loading position LP.

The first soaking chamber 230 is configured to apply thermal stimulation to the electronic components after housing the test tray containing the electronic components through the loading device 210. Here, the thermal stimulation not only heats the electronic component but also cools the electronic component.

The eight test chambers TC are distributed in groups of four, and are arranged side by side in the front-rear direction behind the first soaking chamber 230 and the heat radiating chamber 240 via the transfer device 270. Each test chamber TC houses a test tray TT that is passed through the first soaking chamber 230 and the transfer device 270, and provides a temperature environment capable of testing the electronic components of the contained test tray TT. As shown in the partial view of FIG. 3, the test chambers TC described above each have a first inlet/outlet I/O1 formed toward the transfer device 270 side. Obviously, the test tray TT is carried into or out of the test chamber TC through the first inlet/outlet I/O1. Here, it is known that the test chamber TC is spaced apart from the first soaking chamber 230. According to an embodiment, the test chamber TC located directly behind the first soaking chamber 230 may be along with the first soaking chamber 230. The front-rear direction is combined, but at least the remaining test chamber TC cannot be equipped in combination with the first soaking chamber 230. That is, this is because the present invention adopts a mode in which the first soaking chamber 230 and the test chamber TC are provided separately and the test tray TT cannot move directly between the first soaking chamber 230 and the test chamber TC. In this case, the thermal stimulus applied to the electronic component is maximized and the electronic component is transferred from the first soaking chamber 230 to the test chamber TC.

Corresponding to each test chamber TC is provided with a connection device CA, and the connection device CA electrically connects the electronic components of the test tray TT received in the test chamber TC to the tester, and when the test is finished, in order to carry out the test tray The test tray TT is raised by TT. The technique of the above-described connection device CA is described in detail in the Korean Patent Application No. 10-2017-0160905, the entire disclosure of which is incorporated herein by reference.

The opening and closing device OC is provided corresponding to each test chamber TC, so that there are a total of eight, and as shown in FIG. 3, the cylinder C and the door D are respectively provided. Therefore, the door D opens or closes the first inlet/outlet I/O1 in accordance with the operating state of the cylinder C.

The heat equalizing chamber 240 houses the test tray TT carrying the electronic components for testing, and restores the electronic components of the test tray TT to normal temperature or near normal temperature, so that the unloading operation by the unloading device 250 can be appropriately performed in the future. And it can prevent damage to electronic components. Obviously, in the case where the thermal stimulation can be sufficiently removed from the electronic component only by exposure to normal temperature, it is not necessary to constitute the heat dissipation chamber 240.

The unloading device 250 unloads the electronic component that has completed the test from the test tray TT that has been moved to the unloading position UP via the transfer device 270 and the heat dissipation chamber 240 after being carried out from the test chamber TC. At this time, the unloading device 250 may unload the electronic component in accordance with the level of the test result, and move it to the second buffer B2 for the electronic component that needs to be retested.

The second buffer B2 is provided for stacking electronic components that need to be retested.

The second opening device 260 opens the test tray TT at the unloading position UP, so that the electronic components that have completed the test can be unloaded from the corresponding test tray TT by means of the unloading device 250.

The recovery section RP provides an empty passenger tray CT ₂ that can be loaded into the electronic component that completed the test, thereby recovering the electronic component that completed the test. That is, the unloading device 250 moves the electronic component to the empty passenger tray CT ₂ provided by the recovery portion RP after unloading the electronic component from the test tray TT located at the unloading position UP. For this reason, as in this embodiment, the recovery section may be provided with RP-off can accommodate a plurality of stacked trays ₂ of CT SK.

The transfer device 270 is configured to move to the heat dissipation chamber 250 during the process of moving from the first soaking chamber 230 to the test chamber TC or for moving from the test chamber TC to the unloading position UP as the final destination. Medium, pass the test tray TT. This transfer device 270 includes a second soaking chamber 271, a pair of shutters 272, a stack block 273, and a mover 274.

The second soaking chamber 271 houses the test tray TT received from the first soaking chamber 230 and maintains the thermal stimulus applied by the first soaking chamber 230 to the electronic component 271. To this end, the internal composition of the second soaking chamber 271 is a temperature environment for maintaining thermal stimulation of the electronic component or assimilation of the electronic component that is not sufficiently thermally stimulated into a temperature according to the test conditions. As shown in the partial view of FIG. 4, the second soaking chamber 271 has a second inlet/outlet I/O2 formed on the left and right sides toward the test chamber TC side, and the test tray TT passes through the second inlet/outlet I/. O2 is carried into the second soaking chamber 271 or is carried out from the second soaking chamber 271.

The second soaking chamber 271 as described above moves forward and backward so as to be selectively located on one side of each test chamber TC. Therefore, if the second soaking chamber 271 is located on one side of the test chamber TC, the first port I/O1 and the second port I/O2 are spaced apart from each other and face each other, so that the test tray TT passes through the first port I/O1 And moving from the second soaking chamber 271 to the test chamber TC with the second port I/O2.

The pair of shutters 272 have substantially the same configuration as the opening and closing device OC, and open and close the second port I/O 2 located on the left and right sides, respectively.

The stacking block 273 is provided on the upper side of the second soaking chamber 230, and can carry the test tray TT carried out from the test chamber TC. This stacking block 273 is provided in integral with the second soaking chamber to move in the front-rear direction together with the second soaking chamber 271. In the present embodiment, the stacking block 273 is configured to include a quadrangular frame SF in four directions of front, rear, left, and right directions, and a support rail SR that supports and guides the test tray TT, but according to an embodiment, a housing having an opening and closing door may be used instead of the quadrilateral frame. It is equipped in a chamber form. In the case of being equipped in a chamber form, it is also possible to have a function for removing thermal stimuli applied to the electronic components.

The mover 274 moves the second soaking chamber 271 in the front-rear direction in such a manner that the second soaking chamber 271 is located on one side of the first soaking chamber 230 or the test chamber TC.

The supplier 280 supplies the test tray TT from the second soaking chamber 271 to the test chamber TC.

The recycler 290 recovers the test tray TT from the test chamber TC to the stack block 273.

In the present embodiment, the following configuration is adopted: the structure in which the supplier 280 is provided in the second soaking chamber 271 and the collector 290 is mounted on the stacking block 273, so the supplier 280 and the recycler 290 and the first are both The heat chamber 271 and the stacking block 273 move together in the front-rear direction. However, according to an embodiment, an example in which the supplier 280 and the recycler 290 are provided corresponding to each test chamber TC may be employed.

<For instructions on operation>

Hereinafter, the operation of the above-described sorting machine 200 will be described.

If the passenger piles ₁ and CT tray truck mounted together supply portion TM SP, then the loading operation for the electronic component at a time and one off the supply tray CT Embodiment ₁ sequentially supplied off _a tray CT.

After loading means 210 grip the electronic component to be tested from customer trays CT ₁ via the DA identifier contained in the stack frame TF is located in the test region RA of supply and demand. In this process, the electronic components are individually identified by means of the identifier DA.

If the electronic components are all carried on the test tray TF, the electronic component and the drive tester DT are electrically connected in a state where the test frame TF is moved to the test area TA. And implement the driver test.

If the test is completed, the test frame TF returns to the supply and demand area RA, and the loading device 210 grips the electronic component from the test frame TF and loads it to the test tray TT at the loading position LP. At this time, the electronic component judged to be defective in the drive test is separated into the first buffer B1.

If the electronic components are all carried on the test tray TT at the loading position LP, the test tray TT is housed in the rear first heat equalizing chamber 230. Therefore, thermal stimulation is applied to the electronic components carried on the test tray TT. And, if the test tray TT moves toward the second soaking chamber 271 waiting on the right side of the first soaking chamber 230, the second soaking chamber 271 moves rearward to be placed on the electronic component to be tested. Test the test tray TT on one side of the test chamber TC. In this state, the opening and closing device OC and the shutter 272 are operated to open the first inlet and outlet I/O1 and the second inlet and outlet I/O2. Next, the supplier 280 operates to move the test tray TT from the soaking chamber 271 to the test chamber TC. At this time, if it is not the initial operation step of the sorting machine 200, the test tray TT carrying the electronic components that have been tested is already accommodated in the test chamber TC. This will be described in more detail with reference to FIG. 5.

Referring to the schematic diagram of Fig. 5, the test tray TT carrying the electronic component that has been tested is raised in advance by the connection device CA, so that the test tray TT from the second heat equalizing chamber 271 can be carried into the test chamber TC. In the state of FIG. 5, if the opening and closing device OC and the shutter 272 are operated to open the first port I/O1 and the second port I/O2, the supplier 280 operates to carry the test tray TT carrying the electronic component to be tested. It is supplied to the test chamber TC via the second port I/O 2 and the first port I/O1 in sequence. Further, in parallel with this, the recycler 290 operates to recover the test tray TT carrying the electronic component that has completed the test to the stacking block 273 via the first inlet/outlet I/O1. And, when the exchange of the test tray TT is completed, the opening and closing device OC and the shutter 272 close the first inlet and outlet I/O1 and the second inlet and outlet I/O2, respectively. That is, when the opening and closing device OC is operated once, an exchange of the test tray TT is formed between the test chamber TC and the transfer device 270. Therefore, the time interval in which the supplier 280 is operated overlaps with at least a portion of the time interval in which the recycler 290 is operated. Thus, the time to supply the test tray TT to the test chamber TC and the overall time to recover the test tray TT from the test chamber TC are correspondingly minimized, thereby minimizing temperature environmental losses within the test chamber TC. Obviously, the corresponding time minimization will also bring about an increase in processing capacity. The reason why the exchange of the test tray TT can be simultaneously performed between the test chamber TC and the transfer device 270 as described above is that the connection device CA raises the test tray TT to be carried out from the test chamber TC, thereby making it possible by means of the supply 280 The moving line ML1 of the test tray TT and the moving line ML2 of the test tray TT by the recycler 290 are spaced apart from each other in the up and down direction.

If the exchange of the test tray TT between the test chamber TC and the transfer device 270 is completed, the second soaking chamber 271 moves forward to be located on the left side of the heat dissipation chamber 240, and the test tray TT moves toward the heat dissipation chamber 240.

Next, the test tray TT is moved from the heat dissipation chamber 240 to the unloading position UP, and the unloading device 250 unloads the electronic component from the test tray TT located at the unloading position UP to move it to the passenger tray CT _{2 of the} recovery portion RP. During this process, the electronic components that need to be retested are moved to the second buffer B2.

<References>

1. In the above embodiment, a plurality of test chambers TC and connection devices CA are employed, but in the case where only one test chamber TC is provided, if the test tray TT cannot be directly moved from the first soaking chamber 230 The present invention can also be suitably applied to the test chamber TC.

2. The sorting machine 200 according to the present invention is equipped with a first soaking chamber 230 and a second soaking chamber 271, and can cause the test tray TT to stay more in the first soaking chamber depending on the processing speed. 230, or more, stays in the second soaking chamber 271. Obviously, it is not important which side of the first soaking chamber 230 or the second soaking chamber 271 is subjected to more thermal stimulation of the electronic components carried on the test tray TT. It is important that the electronic component is housed in the test chamber TC to be supplied to the test chamber TC in a state where it can be tested as quickly as possible, and therefore it is preferable to appropriately control the first soaking heat in consideration of the processing speed or the test speed and the like. The temperature environment within the chamber 230 or the second soaking chamber 271.

3. In the sorting machine 200 of FIG. 2, the loading device 210 and the unloading device 250 are separately provided separately, thereby performing the loading operation and the unloading operation separately, but considering the processing speed and the like, the loading device 210 and the unloading device may be considered. 250 is constructed as a single gripping device. Obviously, contrary to this, the loading device 210 can be divided into a first loader that moves electronic components from the passenger tray CT ₁ to the test tray TF and a movement from the test frame TF to the test tray TT for a quick loading operation. Two loaders are equipped.

4. With reference to the plan view of FIG. 2, the case where the test tray TT carried into the first heat equalizing chamber 230 is moved to the right side and moved to the second heat equalizing chamber 271 has been described, but in order to ensure sufficient application to the electronic component The time of the heat stimulation requires that the test tray TT stays in the first soaking chamber 230 for a longer period of time. To this end, the test tray TT can be carried into the upper region of the first soaking chamber 230, and the test tray TT can be translated downward and then moved out to the right. If the above manner is adopted, a plurality of test trays TT can be accommodated in the first soaking chamber 230, and the residence time of the test tray TT staying in the first soaking chamber 230 becomes long, so that the electronic components can be made the first soaking The chamber 230 is subjected to sufficient thermal stimulation.

5. In the above, the case where the supply and the recovery of the test tray TT are simultaneously formed when the exchange of the test tray TT is formed between the test chamber TC and the transfer device 270 is explained, but if the supply 280 is operated at a time The interval overlaps at least a part of the time interval in which the recycler 290 operates, and the effect according to the present invention can be obtained corresponding to the above-described overlap.

The detailed description of the present invention has been made by way of example with reference to the embodiments of the accompanying drawings, but the above-described embodiments are merely preferred embodiments of the invention, and therefore, The scope of the rights should be understood as the scope of the patent application and its equivalents.

200‧‧‧ sorting machine

210‧‧‧Loading device

230‧‧‧First soaking chamber

TC‧‧‧ test chamber

CA‧‧‧Connecting device

OC‧‧‧Opening and closing device

250‧‧‧Unloading device

270‧‧‧Transfer device

271‧‧‧Separate heat equalization chamber

272‧‧‧Opener

273‧‧‧Stacked blocks

274‧‧‧Mobile

280‧‧‧Supplier

290‧‧‧Recycler

Fig. 1 is a schematic plan view of a conventional sorter for testing electronic parts. 2 is a schematic plan view of a sorting machine for testing electronic parts according to an embodiment of the present invention. 3 is a schematic partial perspective view of a test chamber portion applied to the sorter of FIG. 2. 4 is a schematic partial perspective view of a second moving chamber portion applied to the sorting machine of FIG. 2. Figure 5 is a reference diagram for explaining the exchange of test trays performed between the transfer device and the test chamber in the sorter of Figure 2 .

Domestic deposit information (please note according to the order of the depository, date, number)

Foreign deposit information (please note in the order of country, organization, date, number)

Claims (4)

A sorting machine for testing electronic parts, comprising: a loading device for loading electronic components carried on a passenger tray to a test tray at a loading position; a first soaking chamber carrying electrons through the loading device Applying thermal stimulation to the electronic component after the test tray of the component; the test chamber housing the test tray via the first soaking chamber, providing a temperature environment capable of testing the electronic components of the contained test tray, and having the ability to enable Testing a first inlet and outlet of the tray; connecting means for electrically connecting the electronic component of the test tray housed in the test chamber to the tester; opening and closing means for opening and closing the first inlet and outlet of the test chamber; Disconnecting an electronic component that has completed testing from a test tray that is moved to the unloading position after being carried out from the test chamber; and a transfer device configured to move from the first soaking chamber to the test chamber Passing a test tray during the process of moving from the test chamber to the unloading position, wherein the transfer device comprises: a second a thermal chamber that maintains thermal stimulation applied by the first soaking chamber to the electronic component after accommodating the test tray received from the first soaking chamber, and has a second that enables the test tray to enter and exit a switch; opening and closing the second inlet and outlet of the second soaking chamber; and a stacking block capable of stacking a test tray carried out from the test chamber and with the second soaking chamber Equipped with a mover that moves the second soaking chamber such that the second soaking chamber is located on one side of the first soaking chamber or the test chamber, Wherein the electronic component testing sorting machine further includes: a supply, supplying a test tray from the second soaking chamber to the test chamber; and a recoverer from the test chamber to the stacking block Recycling the test tray, when the second soaking chamber is located at one side of the test chamber, the first inlet and the outlet are formed to face each other and face each other, in the opening and closing device Before opening the first entrance and exit and closing the first entrance and exit, The supply device and the recycler are operated to recover a test tray containing the electronic component for testing to the stacking block via the first inlet and outlet, and the test tray containing the electronic component to be tested is sequentially passed through The second inlet and outlet and the first inlet and outlet are supplied to the test chamber, so that exchange of the test tray between the test chamber and the transfer device can be achieved when the opening and closing device is operated once. The electronic component testing sorting machine of claim 1, wherein the test chamber and the connecting device are provided in plurality, at least one of the test chambers and the first soaking chamber Separately, the mover is capable of positioning the second soaking chamber on one side of each of the test chambers. The electronic component testing sorting machine according to claim 1, wherein, in order to minimize loss of a temperature environment in the test chamber, when a test tray is exchanged between the test chamber and the transfer device a time interval in which the supply is operated overlaps with at least a portion of a time interval in which the recycler is operated, and a movement line of the test tray by means of the supply and a movement line of the test tray by means of the recycler Separated from each other. The electronic component testing sorting machine according to claim 1, wherein the stacking block is provided on an upper side of the second soaking chamber.