TW201935008A - Probe card device and signal transmitting member thereof - Google Patents

Abstract

The present disclosure provides a probe card device and a signal transmitting member thereof, and the signal transmitting member includes a rectangular probe and a buffer. The rectangular probe includes a first contacting segment and a second contacting segment both respectively arranged on two opposite sides thereof. The buffer is fixed on a free end portion of the first contacting segment of the rectangular probe, and the buffer has an elastic compression smaller than 10 [mu]m. The free end portion and the buffer are provided for contacting an electrical contact of a space transformer.

Description

Probe card device and signal transmission part thereof

The invention relates to a detection device, in particular to a probe card device and a signal transmission member thereof.

As shown in FIG. 1, the conventional probe card device 100 a is a plurality of electrical contacts 11 a in a protruding shape connected to one end of a plurality of probes 2 a on the adapter board 1 a. The existing tolerances on the length and the tolerances of the multiple electrical contacts 11a on the adapter board 1a (for example, 50 microns) make the coplanarity of the other ends of the probes 2a poor. This further affects the measurement accuracy of the existing probe card device 100a for the object to be measured.

Therefore, the present inventor believes that the above-mentioned defects can be improved, and with special research and cooperation with the application of scientific principles, he finally proposes an invention with a reasonable design and effective improvement of the above-mentioned defects.

An embodiment of the present invention is to provide a probe card device and a signal transmission member thereof, which can effectively improve defects that may be generated by the existing probe card device.

An embodiment of the present invention discloses a probe card device, which includes: an adapter board including a board surface and a plurality of electrical contacts located on the board surface; a positioning base body correspondingly disposed on a plurality of the electric devices; One side of the contact point; and a plurality of signal transmission members, each including: a rectangular probe provided on the positioning base, and the rectangular probe includes opposite sides and penetrates the positioning base A first contact section and a second contact section; and a buffer body fixed to a first contact section of the rectangular probe An end portion, and the buffer body has an elastic compression amount; wherein the buffer bodies of a plurality of the signal transmission members respectively abut a plurality of the electrical contacts; and at each of the signal transmissions And the corresponding electrical contact, the free end can move relative to the electrical contact, so that the buffer body abuts against the electrical contact under pressure, and the A rectangular probe is electrically connected to the electrical contact; wherein the relative position of each of the free ends and the corresponding electrical contact can be adjusted within the elastic compression amount so that multiple The end edges of the second contact segments of the rectangular probes are substantially aligned with each other; wherein the elastic compression amount is less than 10 micrometers (μm).

An embodiment of the present invention also discloses a signal transmission member of a probe card device, which includes: a rectangular probe including a first contact section and a second contact section on opposite sides; and a buffer body fixed to the A free end portion of the first contact section of the rectangular probe, and the buffer body has an elastic compression amount; wherein the buffer body of the signal transmitting member can be used to abut against an adapter plate An electrical contact; wherein the elastic compression amount is less than 10 microns.

In summary, the probe card device and its signal transmitting member disclosed in the embodiments of the present invention can fix a buffer member that can pressively abut an electrical contact point at the free end of the rectangular probe. So that each free end and the corresponding electrical contact can adjust their relative positions within the amount of elastic compression and maintain electrical connection with each other, thereby effectively absorbing the length tolerances between the plurality of rectangular probes and the plurality of electrical contacts. The height tolerance of the sexual contacts further aligns the end edges of the second contact sections of the plurality of rectangular probes with each other, and effectively improves the measurement accuracy of the probe card device.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, and not to make any limitation to the scope of the present invention limit.

[Prior art]

100a‧‧‧probe card device

1a‧‧‧ Adapter Board

11a‧‧‧electric contact

2a‧‧‧ Probe

[This embodiment]

100‧‧‧ Probe Card Device

1‧‧‧ transfer board

11‧‧‧ plate surface

12‧‧‧electric contact

121‧‧‧ groove

122‧‧‧ bump

13‧‧‧ substrate

14‧‧‧metal pad

15‧‧‧ Insulation

151‧‧‧through hole

16‧‧‧metal plating

2‧‧‧ positioning base

21‧‧‧The first guide plate

211‧‧‧The first through hole

22‧‧‧Second Guide

221‧‧‧Second through hole

23‧‧‧ Spacer

3‧‧‧ rectangular probe

31‧‧‧ the first contact

311‧‧‧ free end

3111‧‧‧groove

312‧‧‧Fixed structure

3121‧‧‧Receiving slot

3122‧‧‧Support arm

32‧‧‧ second contact

4‧‧‧ buffer

M‧‧‧Signal transmission

FIG. 1 is a schematic diagram of a conventional probe card device in the prior art.

FIG. 2 is a schematic diagram of a probe card device according to the first embodiment of the present invention.

FIG. 3 is a schematic diagram of a specific structure of the adapter plate of FIG. 2.

FIG. 4 is a schematic diagram of a probe card device according to a second embodiment of the present invention.

FIG. 5 is a schematic diagram of a probe card device according to a third embodiment of the present invention.

FIG. 6 is a schematic diagram (a) of a signal transmission element according to a fourth embodiment of the present invention.

FIG. 7 is a schematic diagram (2) of a signal transmission component according to the fourth embodiment of the present invention.

FIG. 8 is a schematic diagram of a probe card device according to a fifth embodiment of the present invention.

Please refer to FIG. 2 to FIG. 8, which are embodiments of the present invention. It should be noted that this embodiment corresponds to the related quantities and appearances mentioned in the drawings, and is only used to specifically describe the implementation of the present invention. Mode to facilitate understanding of the content of the present invention, but not to limit the protection scope of the present invention.

[Example 1]

As shown in FIG. 2 and FIG. 3, this is the first embodiment of the present invention. This embodiment discloses a probe card device 100 including an adapter plate 1, a positioning base 2 located on one side of the above-mentioned adapter plate 1, and a plurality of signal transmission members M disposed on the positioning base 2. Wherein, one end of each of the above-mentioned signal transmission members M is in contact with the adapter board 1, and the other end of each of the signal transmission members M is used to contact and test an object to be tested (such as a semiconductor wafer).

In addition, the signal transmission member M is not limited to being matched with the adapter plate 1 and the positioning base 2. That is, in other embodiments not shown in the present invention, the signal transmission member M may be sold separately or applied to other components. It should be noted that the diagram of this embodiment is a schematic diagram showing the needle implantation process of the rectangular probe 3 described above, but the present invention is not limited thereto. In addition, in order to facilitate understanding of this embodiment, the drawings only show a partial structure of the probe card device 100, so as to clearly show the structure and connection relationship of each element of the probe card device 100. The following describes the probe card device 100 separately. The structure of each element and its connection relationship.

The adapter board 1 includes a board surface 11 and a plurality of electrical contacts 12 located on the board surface 11. Each of the electrical contacts 12 in this embodiment includes a groove 121 recessed in the board surface 11, and an inner wall of the groove 121 is made of conductive material. It should be noted that this embodiment does not limit the specific structure of the adapter plate 1, so the adapter plate 1 of FIG. 2 is presented in a schematic manner.

For example, the structure of the adapter plate 1 in this embodiment may be shown in FIG. 3, but is not limited thereto. The adapter board 1 includes a substrate 13, a plurality of metal pads 14 on the substrate 13, an insulating layer 15 covering the substrate 13, and a plurality of metal plating layers 16 respectively connected to the plurality of metal pads 14. . Further, the outer surface of the insulating layer 15 is defined as the board surface 11 of the above-mentioned adapter board 1, the insulating layer 15 is formed with a plurality of through holes 151 respectively exposing a plurality of metal pads 14, and a plurality of metal plating layers 16 is plated on the inner sidewalls of the plurality of through holes 151. Wherein, each of the metal pads 14 and the connected metal plating layers 16 are combined and defined as one of the electrical contacts 12 and collectively surround and form the groove 121.

The positioning base 2 is correspondingly disposed on one side of the plurality of electrical contacts 12 of the adapter board 1, and the positioning base 2 includes a first die 21 (upper die) in this embodiment, which is substantially parallel to A second guide plate 22 (lower die) of the first guide plate 21 and a spacer plate 23 (not shown) clamped between the first guide plate 21 and the second guide plate 22. Wherein, the first guide plate 21 is formed with a plurality of first through holes 211, the second guide plate 22 is formed with a plurality of second through holes 221, and the positions of the plurality of second through holes 221 respectively correspond to The positions of the plurality of first through holes 211, and the diameter of each second through hole 221 is not larger than the diameter of the first through hole 211.

Each of the signal transmitting members M includes a rectangular probe 3 and a buffer body 4, and each rectangular probe 3 is disposed on the positioning base 2. Specifically, the above The rectangular probes 3 of the plurality of signal transmitting members M are arranged in a substantially matrix shape and penetrate the positioning base 2. One end of the rectangular probes 3 respectively penetrates the first through holes of the first guide plate 21. 211, and the other ends of the plurality of rectangular probes 3 pass through the plurality of second through holes 221 of the second guide plate 22 respectively. That is to say, each of the rectangular probes 3 is sequentially passed through the corresponding first through hole 211, the spacer 23, and the corresponding second through hole of the first guide plate 21. 221, and the opposite sides of each rectangular probe 3 passing through the positioning base 2 are defined as a first contact section 31 and a second contact section 32, respectively.

Furthermore, in each of the above signal transmission members M, the buffer body 4 is fixed to a free end portion 311 of the first contact section 31 of the rectangular probe 3, and the buffer body 4 has an elastic compression amount, and the elasticity The amount of compression is less than 10 micrometers (μm), and preferably less than 5 micrometers in this embodiment. Wherein, the elastic modulus of the conductive buffer body 4 is greater than the elastic modulus of the rectangular probe 3, and the elastic modulus of the conductive buffer body 4 is 65 GPa, and the elastic modulus of the rectangular probe 3 is 60GPa.

In addition, in this embodiment, the buffer body 4 may be made of gold, silver, copper, or other conductive materials, and the conductivity of the conductive buffer body 4 is preferably ⁴ × ^{10 4} S. m ^-1 , but the present invention is not limited to the above. Further, the conductivity of the buffer body 4 is preferably greater than or equal to the conductivity of the rectangular probe 3, and the conductivity of the rectangular probe 3 in this embodiment is ⁴ × ^{10 4} S. m ^-1 .

One ends of the plurality of signal transmission members M are respectively inserted into the grooves 121 of the plurality of electrical contacts 12, and the plurality of buffer bodies 4 are respectively abutted against the plurality of electrical contacts. In more detail, in each of the signal transmitting member M and the corresponding electrical contact 12, the free end portion 311 and the buffer body 4 are inserted into the groove 121, and the free end portion 311 can move relative to the groove 121 so that the buffer body 4 abuts against a groove bottom of the groove 121 under pressure.

Furthermore, in each of the signal transmitting members M and the corresponding electrical contact 12, the free end portion 311 can be moved relative to the electrical contact 12 so that the relief The punch 4 abuts against the electrical contact 12 under pressure, and the rectangular probe 3 (can pass through the buffer body) maintains an electrical connection with the electrical contact 12. It should be noted that the electrical connection between the rectangular probe 3 and the electrical contact 12 in this embodiment is achieved through the buffer body 4, that is, the rectangular probe 3 may not be in contact with The electrical contact 12 is not limited thereto.

According to this, the relative position of each free end portion 311 and the corresponding electrical contact 12 can be adjusted within the elastic compression amount, so that the end edge of the second contact section 32 of the plurality of rectangular probes 3 is approximately Align with each other. The “substantially aligned with each other” in this embodiment means that the height difference between the end edges of any two second contact segments 32 is less than 10 micrometers, which is much smaller than the length tolerance between multiple rectangular probes 3 (eg, 50 Micrometers), or the height tolerance of the plurality of electrical contacts 12.

To put it another way, the elastic compression amount of the conductive buffer body 4 can be used to absorb the length tolerance between the plurality of rectangular probes 3 and the height tolerance of the plurality of electrical contacts 12 in this embodiment. For example, as shown in FIG. 2, when two rectangular probes 3 located on the left and right outer sides but having different lengths, the first contact segments 31 of the two rectangular probes 3 are inserted into the grooves 121 of the two electrical contacts 12. The two first contact sections 31 can move different distances within the elastic compression amount, so that the end edges of the second contact sections 32 of the two outer rectangular probes 3 are substantially coplanar. Furthermore, as shown in FIG. 2, when two rectangular probes 3 with the same length are located on the left and the center, the first contact segments 31 of the two rectangular probes 3 are inserted into two grooves 121 having different depths. A contact segment 31 can move the same distance within the elastic compression amount, so that the end edges of the second contact segments 32 of the two left rectangular probes 3 are substantially coplanar.

In addition, although the structures of the multiple signal transmission members M and the multiple electrical contacts 12 respectively matched in this embodiment are substantially the same, in an embodiment not shown in the present invention, the probe card device 100 The plurality of signal transmission members M and the plurality of electrical contacts 12 respectively matched with each other may have different structures.

[Example 2]

As shown in FIG. 4, this is the second embodiment of the present invention. This embodiment is similar to the first embodiment described above, and the same technical features are not described again. The main differences between this embodiment and the first embodiment are as follows. Set.

Specifically, in this embodiment, the buffer body 4 of each signal transmission member M may be made of a polymer material or other non-conductive material, so the rectangular probe 3 must be kept in contact with electrical properties. Contact 12. Further, the connection between the free end portion 311 of each rectangular probe 3 and the corresponding electrical contact 12 in this embodiment is a concave-convex fit (such as a concave-convex fit structure with a tight-fitting effect) and can be The relative displacement is kept in contact with each other, so that the relative position of the free end portion 311 of each first contact section 31 and the corresponding electrical contact 12 can be adjusted within the relative displacement; wherein the relative displacement The amount is less than the elastic compression amount, and is less than 10 micrometers (preferably less than 5 micrometers).

Furthermore, the specific structure of the probe card device 100 in this embodiment can be adjusted and changed according to the needs of the designer, without being limited to the drawings. For example, as shown in FIG. 4, in each signal transmission member M and the corresponding electrical contact 12, the groove 121 of the electrical contact 12 has a substantially dovetail cross section, and the rectangular probe 3 The free end portion 311 is configured to be inserted into the above groove. Furthermore, when the free end portion 311 moves in the groove 121, the side edge of the free end portion 311 can remain in contact with the inner side wall of the groove 121 (eg, a tight fit).

[Example Three]

As shown in FIG. 5, this is Embodiment 3 of the present invention. This embodiment is similar to the above-mentioned Embodiment 2. The same technical features of the two are not described again. The main differences between this embodiment and the above-mentioned Embodiment 2 are as follows. Set.

Specifically, in this embodiment, in each of the signal transmitting members M and the corresponding electrical contacts 12, the electrical contacts 12 are protruding from the board surface 11 of the above-mentioned adapter board 1, and the grooves 121 is formed by recessing the end surface of the electrical contact 12. Where the said The groove 121 is located outside the plate surface 11 of the adapter plate 1 in this embodiment, but the present invention is not limited thereto.

[Example 4]

As shown in FIG. 6 and FIG. 7, this is the fourth embodiment of the present invention. This embodiment is similar to the first embodiment. The same technical features of the two are not described again. The main features of this embodiment and the first embodiment are as follows. The differences are set out below.

Specifically, in each of the above signal transmission members M, the rectangular probe 3 is formed with at least one fixing structure 312 on the side of the free end portion 311, and the free end portion 311 and the at least one fixing structure 312 are embedded. In the buffer body 4. Wherein, as shown in FIG. 6, the fixing structure 312 may be at least one receiving groove 3121 recessed on the side of the free end portion 311 to receive the buffer body 4 and strengthen the connection strength between them. Furthermore, as shown in FIG. 7, the fixing structure 312 may also be at least one support arm 3122 formed on the side of the free end portion 311, and the support arms 3122 are embedded in the buffer body 4 to strengthen each other. Connection strength.

[Example 5]

As shown in FIG. 8, this is the fifth embodiment of the present invention. This embodiment is similar to the first embodiment described above. The same technical features of the two are not described again. The main differences between this embodiment and the first embodiment are as follows. Set.

Specifically, in this embodiment, in each of the signal transmitting members M and the corresponding electrical contacts 12, the electrical contacts 12 are not formed with a groove 121, but include a plate protruding from the above-mentioned adapter plate 1. A bump 122 on the surface 11, a free end 311 of the rectangular probe 3 is formed with a groove 3111, the buffer body 4 is fixed in the groove 3111, and the groove 3111 is movable within the relative displacement amount The ground 122 is sleeved on the bump 122 of the electrical contact 12 to press the buffer body 4.

[Technical effect of the embodiment of the present invention]

In summary, the probe card device 100 and its signal transmission member M disclosed in the embodiment of the present invention can be fixed to the free end portion 311 of the rectangular probe 3 and can be pressed against the electrical contact. The buffer body 4 of 12 so that each free end 311 and the corresponding electrical contact 12 can adjust their relative positions within the amount of elastic compression and maintain electrical connection with each other, thereby effectively absorbing the plurality of rectangular probes 3 described above. The length tolerance between the plurality of electrical contacts 12 and the height tolerance of the plurality of electrical contacts 12 further align the end edges of the second contact segments 32 of the plurality of rectangular probes 3 with each other, and effectively promote the probe card device 100 Measurement accuracy.

Furthermore, during the process of inserting the rectangular probe 3 into the groove 121, the probe card device 100 can provide the functions of rebound and shock absorption through the buffer body 4, thereby further improving the number of rectangular probes 3. Coplanarity of the end edges of the two contact segments 32.

In addition, the signal transmission member M can further be provided with at least one fixing structure 312 on the free end portion 311, and the fixing structure 312 is embedded in the buffer body 4 to strengthen the connection strength between each other.

The above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Any equal changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the protection scope of the claims of the present invention .

Claims (10)

A probe card device includes: an adapter board including a board surface and a plurality of electrical contacts located on the board surface; a positioning base corresponding to one side of the plurality of electrical contacts And a plurality of signal transmission members, each including: a rectangular probe disposed on the positioning base, and the rectangular probe includes a first contact located on opposite sides and penetrating the positioning base Segment and a second contact segment; and a buffer body fixed to a free end portion of the first contact segment of the rectangular probe, and the buffer body has an elastic compression amount; The buffer bodies of the signal transmission member are respectively abutted against a plurality of the electrical contacts; and in each of the signal transmission member and the corresponding electrical contact, the free end portion can be opposite to The electrical contacts move so that the buffer body abuts against the electrical contacts under pressure, and the rectangular probe maintains electrical connection with the electrical contacts; wherein each of the The relative position of the free end and the corresponding electrical contact can be within the elastic compression amount Adjusted, so that the plurality of the rectangular probe tip contacts the second edge section is substantially aligned with one another; wherein the amount of elastic compression of less than 10 micrometers (μm). The probe card device according to claim 1, wherein in each of the signal transmitting members, the rectangular probe is formed with at least one fixed structure on a side of the free end portion, and the free end portion And at least one of the fixing structures is embedded in the buffer body. The probe card device according to claim 1, wherein in each of the signal transmission members and the corresponding electrical contact, the electrical contact is formed with a recess recessed in the board surface. A groove, the free end and the buffer body are inserted in the groove Inside, and the free end can move relative to the groove, so that the buffer body abuts against a groove bottom of the groove under pressure. The probe card device according to claim 3, wherein the adapter board includes a substrate, a plurality of metal pads located on the substrate, an insulating layer covering the substrate, and a plurality of connections to the plurality of substrates, respectively. A plurality of metal plating layers of the metal pad; wherein an outer surface of the insulating layer is defined as the board surface, and the insulating layer is formed with a plurality of through holes respectively exposing a plurality of the metal pads, a plurality of the A metal plating layer is plated on the inner side walls of a plurality of the through holes, and each of the metal pads and the metal plating layers connected to each other are defined as one of the electrical contacts, and the grooves are formed by enclosing the electrical contacts. The probe card device according to claim 1, wherein in each of the signal transmitting members, an elastic modulus of the buffer body is greater than an elastic modulus of the rectangular probe, and The elastic modulus is 65 GPa, and the elastic modulus of the rectangular probe is 60 GPa. The probe card device according to claim 1, wherein in each of the signal transmitting members and the corresponding buffer body, the buffer body is made of a conductive material, and the conductivity of the buffer body is Is greater than or equal to the conductivity of the rectangular probe, and the conductivity of the buffer is ⁴ × ^{10 4} S. m ^-1 , and the electrical conductivity of the rectangular probe is ⁴ × ^{10 4} S. m ^-1 . The probe card device according to claim 1, wherein the elastic compression amount is further limited to less than 5 microns. A signal transmission piece of a probe card device includes: A rectangular probe includes a first contact section and a second contact section on opposite sides; and a buffer body fixed to a free end portion of the first contact section of the rectangular probe, and The buffer body has an elastic compression amount; wherein the buffer body of the signal transmission member can be used to abut an electrical contact of an adapter board; wherein the elastic compression amount is less than 10 microns. The signal transmission member of the probe card device according to claim 8, wherein the rectangular probe is formed with at least one fixing structure on a side surface of the free end portion, and the free end portion and the at least one fixing portion A structure is buried in the buffer body; wherein at least one of the fixing structures includes a receiving groove recessed in the side of the free end and / or extends from the side of the free end A fixed bracket. The signal transmission member of the probe card device according to claim 8, wherein an elastic modulus of the buffer body is greater than an elastic modulus of the rectangular probe, and the elastic modulus of the buffer body is 65 GPa And the elastic modulus of the rectangular probe is 60 GPa; the buffer body is made of a conductive material, and the conductivity of the buffer body is greater than or equal to the conductivity of the rectangular probe, the The conductivity of the buffer is ⁴ × ^{10 4} S. m ^-1 , and the electrical conductivity of the rectangular probe is ⁴ × ^{10 4} S. m ^-1 ; the amount of elastic compression is further limited to less than 5 microns.