TWI639009B - Probe card device and signal transferring module thereof - Google Patents

Abstract

The invention discloses a probe card device and a signal switching module thereof. The signal switching module comprises an adapter plate and a plurality of conductive buffer bodies. The adapter plate includes a plurality of electrical contacts, and each of the electrical contacts includes a recess. A plurality of conductive buffers are respectively mounted in the recesses of the plurality of electrical contacts, and each of the conductive buffers has an amount of elastic compression of less than 50 microns. In each of the electrical contacts and the corresponding conductive buffer, the groove can be used to provide the probe to be movably inserted and pressed against the conductive buffer to pass the conductive buffer, and the probe and the electrical The contacts remain electrically connected.

Description

Probe card device and signal switching module thereof

The invention relates to a detecting device, in particular to a probe card device and a signal switching module thereof.

As shown in FIG. 1, the conventional probe card device 100a is a plurality of protruding electrical contacts 11a connected to the adapter plate 1a at one end of a plurality of probes 2a, but the plurality of probes 2a are There is a tolerance in length and a tolerance of the height of the plurality of electrical contacts 11a on the adapter plate 1a, so that the coplanarity of the other end of the plurality of probes 2s is poor, thereby affecting the existing probes. The card device 100a measures the accuracy of the object to be tested.

Accordingly, the inventors believe that the above-mentioned defects can be improved, and that the invention has been studied with great interest and with the use of scientific principles, and finally proposes a present invention which is rational in design and effective in improving the above-mentioned defects.

Embodiments of the present invention provide a probe card device and a signal switching module thereof, which can effectively improve defects that may be generated by an existing probe card device.

The embodiment of the invention discloses a probe card device, comprising: a signal switching module, comprising: an adapter board, comprising a board surface and a plurality of electrical contacts located on the board surface, and each of the The electrical contact includes a recess; and a plurality of conductive buffers respectively mounted in the recesses of the plurality of electrical contacts, and each of the conductive buffers has an elastic compression amount; a positioning body corresponding to one side of the plurality of electrical contacts; and a plurality of rectangular probes disposed on the positioning body, and Each of the rectangular probes includes a first contact segment and a second contact segment on opposite sides and extending out of the positioning body; wherein the first contact segments of the plurality of rectangular probes Separably movably inserted into the recesses of the plurality of electrical contacts; wherein each of the rectangular probes, the corresponding electrical contact, and the corresponding conductive buffer The conductive buffer body is pressed against the first contact segment and a groove bottom of the groove to pass the conductive buffer body to connect the rectangular probe to the electrical connection. Maintaining an electrical connection; wherein a relative position of each of the first contact segments and the corresponding electrical contacts can be adjusted within the amount of elastic compression to enable a plurality of the rectangular probes The end edges of the second contact segments are substantially aligned with each other; wherein the amount of elastic compression is 50 micrometers (μm) or less.

The embodiment of the invention further discloses a signal switching module of a probe card device, comprising: an adapter board, comprising a board surface and a plurality of electrical contacts located on the board surface, and each of the electrical properties The contact includes a recess; and a plurality of conductive buffers respectively mounted in the recesses of the plurality of electrical contacts, and each of the conductive buffers has an amount of elastic compression; wherein In the electrical contact and the corresponding conductive buffer, the groove can be used to provide a probe movably inserted and pressed against the conductive buffer body to pass through the conductive buffer body. And maintaining the probe electrically connected to the electrical contact; wherein the elastic compression amount is 50 micrometers or less.

In summary, the probe card device and the signal switching module thereof disclosed in the embodiments of the present invention can have each of the rectangular probes by installing a conductive buffer body in the groove of each electrical contact. The first contact segment and the corresponding electrical contact can be adjusted relative to each other within the elastic compression amount and kept electrically connected to each other, thereby effectively absorbing the length tolerance and the plurality of electrical connections between the plurality of rectangular probes The tolerances in the height point, so that the end edges of the second contact segments of the plurality of rectangular probes are substantially aligned with each other, and the measurement accuracy of the probe card device is effectively improved.

Furthermore, the probe card device can provide the function of rebounding and shock absorption through the conductive buffer body during the insertion of the rectangular probe into the groove, thereby further improving The coplanarity of the end edges of the second contact segments of the plurality of rectangular probes.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying claims limit.

[Prior technology]

100a‧‧‧Probe card device

1a‧‧‧Adapter plate

11a‧‧‧Electrical contacts

2a‧‧‧Probe

[This embodiment]

100‧‧‧ probe card device

1‧‧‧Adapter plate

11‧‧‧ board

12‧‧‧Electrical contacts

121‧‧‧ Groove

122‧‧‧Limited

13‧‧‧Substrate

14‧‧‧Metal pad

15‧‧‧Insulation

151‧‧‧through hole

16‧‧‧Metal plating

2‧‧‧ Positioning body

21‧‧‧First guide

211‧‧‧ first through hole

22‧‧‧Second guide

221‧‧‧second through hole

23‧‧‧ Spacer

3‧‧‧Rectangular probe

31‧‧‧First contact segment

32‧‧‧Second contact

33‧‧‧ barbed

4‧‧‧Electrical buffer

M‧‧‧Signal adapter module

1 is a schematic diagram of a prior art probe card device in the prior art.

2 is a schematic view of a probe card device according to Embodiment 1 of the present invention.

3 is a schematic diagram of one specific configuration of the signal switching module of FIG. 2.

4 is a schematic diagram of a probe card device according to a second embodiment of the present invention.

FIG. 5 is a schematic diagram (1) of a probe card device according to a third embodiment of the present invention.

FIG. 6 is a schematic diagram (2) of a probe card device according to a third embodiment of the present invention.

FIG. 7 is a schematic diagram (1) of a probe card device according to a fourth embodiment of the present invention.

8 is a schematic view (2) of a probe card device according to a fourth embodiment of the present invention.

Please refer to FIG. 2 to FIG. 8 , which are embodiments of the present invention. It should be noted that the related embodiments refer to the related quantities and appearances of the drawings, and only specifically describe the implementation of the present invention. The manner in which the present invention is to be understood is not to be construed as limiting the scope of the invention. It is to be noted that the technical features disclosed in the following various embodiments can be referred to each other and used interchangeably to constitute other embodiments not illustrated in the present invention.

[Example 1]

As shown in FIG. 2 and FIG. 3, it is the first embodiment of the present invention. The embodiment of the present invention discloses a probe card device 100 including a signal conversion module M, a positioning base 2 on the side of the signal conversion module M, and a plurality of rectangular probes disposed on the positioning body 2. Needle 3. Wherein, one end of each rectangular probe 3 abuts on the signal transfer module M, The other end of each rectangular probe 3 is used to abut and test a test object (such as a semiconductor wafer).

Furthermore, the signal switching module M is not limited to the positioning base 2 and the rectangular probe 3. That is to say, in other embodiments not shown in the present invention, the signal switching module M can also be sold separately or applied to other components. It should be noted that the drawing of the present embodiment is a schematic diagram of the implantation process of the rectangular probe 3 described above, but the invention is not limited thereto. In addition, in order to facilitate the understanding of the present embodiment, the drawings only present a partial configuration of the probe card device 100 in order to clearly present the respective component configurations and connection relationships of the probe card device 100. The respective component configurations of the probe card device 100 and their connection relationships will be separately described below.

The signal transfer module M includes an interposer 1 and a plurality of conductive buffers 4 . The interposer 1 includes a board surface 11 and a plurality of electrical contacts 12 on the board surface 11 . Each of the electrical contacts 12 of the embodiment includes a recess 121 recessed in the plate surface 11 , and the inner sidewall of the recess 121 is made of a conductive material. It should be noted that the embodiment does not limit the specific configuration of the adapter plate 1, so the adapter plate 1 of the drawing is presented in a schematic manner.

For example, the configuration of the adapter plate 1 of this embodiment may be as shown in FIG. 3, but is not limited thereto. The interposer 1 includes a substrate 13 , a plurality of metal pads 14 on the substrate 13 , an insulating layer 15 covering the substrate 13 , and a plurality of metal plating layers 16 respectively connected to the plurality of metal pads 14 . . Further, an outer surface of the insulating layer 15 is defined as a plate surface 11 of the interposer 1 , and the insulating layer 15 is formed with a plurality of through holes 151 each exposing a plurality of metal pads 14 , and a plurality of metal plating layers 16 is plated on the inner side walls of the plurality of through holes 151. Each metal pad 14 and the connected metal plating layer 16 are collectively defined as one of the electrical contacts 12 and collectively surround the groove 121.

The plurality of conductive buffer bodies 4 are respectively mounted in the recesses 121 of the plurality of electrical contacts 12, and each of the conductive buffer bodies 4 has a modulus of elasticity. Wherein, the elastic compression amount is less than 50 micrometers (μm), and preferably less than 10 micrometers in the embodiment. The conductive buffer body 4 may be made of gold, silver, copper, or other conductive materials in the embodiment, and the conductive buffer 4 preferably has a conductivity of ⁴ × ^{10 4} S. m ^-1 or more, but the present invention is not limited to the above.

The positioning body 2 is disposed on the side of the plurality of electrical contacts 12 of the adapter plate 1 , and the positioning body 2 includes a first die 21 (parallel die) in the embodiment. A second guide 22 of the first guide 21 and a spacer 23 (not shown) sandwiched between the first guide 21 and the second guide 22 are provided. The first guide plate 21 is formed with a plurality of first through holes 211, the second guide plate 22 is formed with a plurality of second through holes 221, and the positions of the plurality of second through holes 221 respectively correspond to The positions of the plurality of first through holes 211, and the diameter of each of the second through holes 221 are not larger than the diameter of the first through holes 211.

The plurality of rectangular probes 3 are arranged in a matrix and are disposed in the positioning base 2, and one end of the plurality of rectangular probes 3 respectively pass through the plurality of first through holes 211 of the first guide plate 21, and the plurality of rectangles The other end of the probe 3 passes through the plurality of second through holes 221 of the second guide 22, respectively. In other words, each of the rectangular probes 3 is sequentially disposed on the corresponding first through hole 211 of the first guiding plate 21, the partitioning plate 23, and the corresponding second through hole of the second guiding plate 22. 221, and opposite sides of each rectangular probe 3 that passes through the positioning base 2 are defined as a first contact segment 31 and a second contact segment 32, respectively, and the first contact of the plurality of rectangular probes 3 The segments 31 are movably inserted into the recesses 121 of the plurality of electrical contacts 12 and respectively pressed against the plurality of conductive buffers 4 .

Wherein, in each rectangular probe 3 and the corresponding conductive buffer 4, the elastic modulus of the conductive buffer 4 is greater than the elastic modulus of the rectangular probe 3, and the elastic mode of the conductive buffer 4 The amount is 65 GPa, and the elastic modulus of the rectangular probe 3 is 60 GPa; the conductivity of the conductive buffer 4 is greater than or equal to the conductivity of the rectangular probe 3, that is, the rectangular probe 3 The conductivity is 4x10 ⁴ S. m ^-1 or more.

Further, in each of the rectangular probes 3, the corresponding electrical contacts 12, and the corresponding conductive buffer 4, the conductive buffer 4 is pressed against the first contact segment 31 and A groove bottom of the groove 121 is passed through the conductive buffer body 4 to keep the rectangular probe 3 electrically connected to the electrical contact 12. That is to say, the first contact segment 31 of the rectangular probe 3 of the present embodiment may not need to be in contact with the corresponding electrical contact 12, but the invention is not limited thereto. Accordingly, the relative position of each of the first contact segments 31 and the corresponding electrical contacts 12 can be adjusted within the elastic compression amount such that the end edges of the second contact segments 32 of the plurality of rectangular probes 3 are substantially parallel to each other. Align. Furthermore, "substantially aligned with each other" in the present embodiment means that the height difference between the end edges of any two second contact segments 32 is 10 micrometers or less, which is much smaller than the length tolerance between the plurality of rectangular probes 3 ( Approximately 50 microns), or a tolerance of a plurality of electrical contacts 12 in height (about 50 microns).

In other words, the elastic compression amount of the conductive buffer body 4 can be used to absorb the length tolerance between the plurality of rectangular probes 3 and the tolerance of the plurality of electrical contacts 12 in height in the embodiment. For example, as shown in FIG. 2, two rectangular probes 3 located on the left and right outside but having different lengths, when the first contact segments 31 are inserted into the grooves 121 of the two electrical contacts 12, The two first contact segments 31 are movable a different distance within the amount of elastic compression such that the end edges of the second contact segments 32 of the two outer rectangular probes 3 are substantially coplanar. Furthermore, as shown in FIG. 2, two rectangular probes 3 located on the left side and the center and having the same length, when the first contact segments 31 are inserted into the two grooves 121 having different depths, the two A contact segment 31 can be moved the same distance within the amount of elastic compression such that the end edges of the second contact segments 32 of the two left rectangular probes 3 are substantially coplanar.

In addition, although the plurality of rectangular probes 3 of the embodiment and the plurality of electric lights respectively matched thereto The configuration of the plurality of conductive buffers 4 is substantially the same as that of the plurality of conductive buffers 4, but in the embodiment not shown in the present invention, the plurality of rectangular probes 3 of the probe card device 100 are respectively matched with a plurality of electrodes. The sexual contact 12 and the plurality of conductive buffers 4 may also be configured to be different from each other.

In addition, the signal switching module M of the present invention can also be combined with other components. For example, in other embodiments not shown in the present invention, in each of the electrical contacts 12 and the corresponding conductive buffer 4, the recess 121 can be used to provide a probe (eg, a circular probe). Or the rectangular probe is movably inserted and pressed against the conductive buffer 4 to pass the conductive buffer 4 to electrically connect the rectangular probe 3 to the electrical contact 12 .

[Embodiment 2]

As shown in FIG. 4, it is the second embodiment of the present invention. The present embodiment is similar to the above-mentioned first embodiment. The same technical features are not described in detail. The main differences between the present embodiment and the first embodiment are as follows. Loaded.

Specifically, the connection between each of the first contact segments 31 and the corresponding electrical contacts 12 of the embodiment is a concave-convex fit (eg, a concave-convex fit structure having a tight fit effect) and can be within a relative displacement amount. Keeping in contact with each other such that the relative position of each of the first contact segments 31 and the corresponding electrical contacts 12 can be adjusted within the relative displacement amount; wherein the relative displacement amount is less than the elastic compression amount, and 10 micrometers The following (preferably 5 microns or less).

Furthermore, the specific structure of the probe card device 100 of this embodiment can be adjusted and changed according to the needs of the designer, and is not limited to the embodiment. For example, as shown in FIG. 4, in each of the rectangular probes 3 and the corresponding electrical contacts 12, the groove 121 of the electrical contact 12 has a substantially trapezoidal cross section, and the end of the rectangular probe 3 The cross-sectional shape of the portion is a shape corresponding to the cross section of the groove 121 described above. That is, when the end portion of the rectangular probe 3 moves within the groove 121, the side edge of the end portion of the rectangular probe 3 can remain in contact with the inner side wall of the groove 121, and along with the rectangle The deeper the end portion of the probe 3 is inserted into the groove 121, the greater the force between the end portion of the rectangular probe 3 and the groove 121 (e.g., tight fit).

[Embodiment 3]

As shown in FIG. 5 and FIG. 6 , it is the third embodiment of the present invention. The present embodiment is similar to the foregoing embodiment 2. The same technical features are not described in detail. The main embodiments of the present embodiment and the second embodiment are the same. The differences are as follows.

Specifically, as shown in FIG. 5, in the rectangular probe 3 and the corresponding electrical contact 12, the electrical contact 12 protrudes from the board surface 11 of the adapter board 1. And the groove 121 is formed by being recessed from the end surface of the electrical contact 12. The groove 121 is located outside the plate surface 11 of the adapter plate 1 in this embodiment, but the invention is not limited thereto.

Furthermore, as shown in FIG. 6, each of the rectangular probes 3 can be formed with a plurality of barbs 33 extending at the side edges of the end portions of the first contact segments 31 thereof, and the plurality of barbs 33 can be inserted into the concave portions. The inner side wall of the slot 121 is used to enhance the electrical connection between the rectangular probe 3 and the corresponding electrical contact 12. Wherein, the distance between any barb 33 and the side edge of the end portion of the first contact segment 31 may be gradually reduced by the direction of the second contact segment 32 toward the first contact segment 31, but the invention is not limited thereto. this.

[Embodiment 4]

As shown in FIG. 7 and FIG. 8 , it is the fourth embodiment of the present invention. The present embodiment is similar to the first embodiment, and the same technical features are not described herein. The main embodiment and the first embodiment are the same. The differences are as follows.

Specifically, in each of the electrical contacts 12 and the corresponding conductive buffer 4 of the embodiment, the recess 121 is formed with a limiting portion 122, so that the conductive buffer 4 is embedded in the concave portion. Inside the slot 121. The first contact segment 31 of the rectangular probe 3 may be spaced apart from the limiting portion 122 of the recess 121 (eg, FIG. 7) or abutting the limiting portion 122 of the recess 121 ( Such as: Figure 8) and form an electrical connection, The invention is not limited herein.

[Technical Effects of Embodiments of the Invention]

In summary, the probe card device 100 and the signal switching module M thereof disclosed in the embodiments of the present invention can be provided with a conductive buffer body that is pressed against the rectangular probe 3 and the electrical contacts 12 by pressure. 4, so that each of the first contact segments 31 and the corresponding electrical contacts 12 can be adjusted relative to each other within the amount of elastic compression and remain electrically connected to each other, thereby effectively absorbing between the plurality of rectangular probes 3 The length tolerance and the tolerance of the plurality of electrical contacts 12 in height, thereby causing the end edges of the second contact segments 32 of the plurality of rectangular probes 3 to be substantially aligned with each other, and effectively improving the measurement of the probe card device 100 Precision.

Furthermore, the probe card device 100 can provide a function of rebounding and shock absorption through the conductive buffer body 4 during the insertion of the rectangular probe 3 into the recess 121, thereby further enhancing the plurality of rectangular probes 3. The coplanarity of the end edge of the second contact segment 32.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. The equivalents and modifications made by the scope of the present invention should fall within the scope of the claims of the present invention. .

Claims (8)

A probe card device includes: a signal switching module, comprising: an adapter board, including a board surface and a plurality of electrical contacts located on the board surface, and each of the electrical contacts a plurality of conductive buffers are respectively mounted in the grooves of the plurality of electrical contacts, and each of the conductive buffers has an elastic compression amount; a positioning body corresponding to a plurality of rectangular contacts disposed on one side of the plurality of electrical contacts; and a plurality of rectangular probes disposed on the positioning base, and each of the rectangular probes includes the opposite sides and the positioning seat a first contact segment and a second contact segment of the body; wherein the first contact segments of the plurality of rectangular probes are respectively movably inserted into the grooves of the plurality of the electrical contacts Wherein, in each of the rectangular probes, the corresponding electrical contacts, and the corresponding conductive buffer, the conductive buffer is pressed against the first contact segment and a groove bottom of the groove to pass the conductive buffer body to make the rectangular probe and the The electrical contact maintains an electrical connection; wherein a relative position of each of the first contact segments and the corresponding electrical contact can be adjusted within the elastic compression amount to enable a plurality of the rectangular probes The end edges of the second contact segments are substantially aligned with each other; wherein the amount of elastic compression is 50 micrometers (μm) or less; wherein, in each of the rectangular probes and the corresponding conductive buffer, the The elastic modulus of the conductive buffer is larger than the elastic modulus of the rectangular probe, and the elastic modulus of the conductive buffer is 65 GPa or more, and the elastic modulus of the rectangular probe is 60 GPa or more. The probe card device of claim 1, wherein each of the first contact segments and the corresponding electrical contacts are capable of maintaining contact with each other within a relative displacement amount such that each of the first The relative position of a contact segment and the corresponding electrical contact can The relative displacement amount is adjusted; wherein the relative displacement amount is less than the elastic compression amount and is 10 micrometers or less. The probe card device of claim 1, wherein in each of the rectangular probes and the corresponding conductive buffer, the conductivity of the conductive buffer is greater than or equal to the conductivity of the rectangular probe And the conductivity of the rectangular probe is ⁴ x ^{10 4} S. m ^-1 or more. The probe card device of claim 1, wherein in each of the electrical contacts and the corresponding conductive buffer, the recess is formed with a limiting portion to enable the conductive buffer Embedded in the groove. The probe card device of claim 1, wherein the elastic compression amount is further limited to 5 μm or less. A signal switching module of a probe card device includes: an adapter plate including a board surface and a plurality of electrical contacts on the board surface, and each of the electrical contacts includes a recess And a plurality of conductive buffers respectively mounted in the recesses of the plurality of electrical contacts, and each of the conductive buffers has an amount of elastic compression; wherein each of the electrical contacts And corresponding to the conductive buffer body, the groove can be used to provide a probe movably inserted and pressed against the conductive buffer body to pass the conductive buffer body to make the probe Maintaining an electrical connection with the electrical contact; wherein the elastic compression amount is 50 microns or less; wherein each of the conductive buffers has a modulus of elasticity of 65 GPa, and each of the conductive buffers is electrically conductive The rate is 4x10 ⁴ S. Above m ^-1 , the amount of elastic compression is further limited to 5 μm or less. The signal switching module of the probe card device of claim 6, wherein the adapter plate comprises a substrate, a plurality of metal pads on the substrate, an insulating layer covering the substrate, And a plurality of metal plating layers respectively connected to the plurality of metal pads; wherein an outer surface of the insulating layer is defined as the board surface, and the insulating layer is formed with a plurality of through-exposed portions of the metal pads Hole, a plurality of said metals The plating layer is plated on the inner side walls of the plurality of through holes, and each of the metal pads and the metal plating layers connected are combined to define one of the electrical contacts and collectively surround the groove. The signal switching module of the probe card device of claim 6, wherein in each of the electrical contacts and the corresponding conductive buffer body, the recess is formed with a limiting portion to The conductive buffer is embedded in the recess.