TW201902198A - Image module - Google Patents

Abstract

A camera module includes a circuit board, an image sensor, a lens holder, and an adhesive layer. The circuit board has a surface and a recessed structure on the surface. The image sensor is disposed in the recessed structure. The lens holder is engaged at an inner edge of the recessed structure and covers the image sensor. The adhesive layer is adhered at an engagement location between the lens holder and the recessed structure.

Description

   Image module   

The invention relates to an image module.

At present, mobile phones are moving towards a multifunctional trend, and mobile phones with a camera function are extremely popular once they are launched. The image module applied to the mobile phone must not only meet the requirements of lightness, thinness, and shortness, but also have good photographic performance.

For example, an existing image module includes a circuit board, a lens mount, a lens group, and an image sensor. The lens holder is hollow and cylindrical. The lens group is disposed inside the lens holder. The lens holder and the image sensor are arranged on a circuit board, and the lens holder covers the image sensor, so that the lens group is optically coupled with the image sensor.

However, as mentioned above, due to the increasing miniaturization of the products, the wall thickness of the opposite lens holders has become thinner and thinner, and the contact area between the bottom of the lens holder and the circuit board has become smaller. If the amount of glue between the bottom of the lens holder and the circuit board is insufficient, the bonding force between the lens holder and the circuit board is likely to be insufficient, causing the lens holder to fall off the circuit board.

In view of this, an object of the present invention is to provide an image module which can effectively prevent the lens holder from being separated from the circuit board.

In order to achieve the above object, according to an embodiment of the present invention, an image module includes a circuit board, an image sensor, a lens base, and an adhesive layer. The circuit board has a surface and a recessed structure located on the surface. The image sensor is disposed in the recessed structure. The lens holder is embedded on the inner edge of the recessed structure and covers the image sensor. The adhesive layer is bonded at the joint between the lens base and the recessed structure.

In one or more embodiments of the present invention, the aforementioned recessed structure has an inner wall surface and a bottom surface connected to each other. The image sensor is disposed on the bottom surface. The lens holder includes an adhesive portion. The adhesive portion has a contact surface and an external surface connected to the bottom surface and the inner wall surface, respectively. The adhesive layer is adhered between the abutting surface and the bottom surface and between the external surface and the inner wall surface.

In one or more embodiments of the present invention, the aforementioned recessed structure has an inner wall surface and a bottom surface connected to each other. The image sensor is disposed on the bottom surface. The lens holder includes an adhesive portion. The adhesive portion has a first abutment surface, a turning surface, and a second abutment surface which are sequentially connected, and respectively abut the bottom surface, the inner wall surface, and the surface. The adhesive layer is adhered between the first contact surface and the bottom surface, between the turning surface and the inner wall surface, and between the second contact surface and the surface.

In order to achieve the above object, according to another embodiment of the present invention, an image module includes a circuit board, an image sensor, a lens holder, and an adhesive layer. The circuit board has a surface and a protruding structure located on the surface. The image sensor is disposed on the protruding structure. The lens holder is embedded on the outer edge of the protruding structure and covers the image sensor. The adhesive layer is adhered between the lens base and the protruding structure, and between the lens base and the surface.

In one or more embodiments of the present invention, the above-mentioned protruding structure has an outer wall surface and a top surface. The image sensor is disposed on the top surface. The lens holder includes an adhesive portion. The adhesive portion has an abutting surface and an inner surface that are connected, and the abutting surface and the outer wall surface are respectively. The adhesive layer is adhered between the abutting surface and the surface and between the abutting surface and the outer wall surface.

In one or more embodiments of the present invention, the above-mentioned protruding structure has a continuous outer wall surface and a top surface. The image sensor is disposed on the top surface. The lens holder includes an adhesive portion. The adhesive portion has a first abutment surface, a turning surface and a second abutment surface which are sequentially connected, and respectively abut the top surface, the outer wall surface and the surface. The adhesive layer is adhered between the first contact surface and the top surface, between the turning surface and the outer wall surface, and between the second contact surface and the surface.

In order to achieve the above object, according to another embodiment of the present invention, an image module includes a circuit board, an image sensor, a lens holder, and an adhesive layer. The circuit board has a surface and a trench structure on the surface. The image sensor is disposed on the surface. The lens holder is arranged on the surface and covers the image sensor. The lens holder includes an adhesive portion. The adhesive portion is embedded on the inner edge of the trench structure. The adhesive layer is adhered to the joint between the adhesive portion and the trench structure.

In one or more embodiments of the present invention, the above-mentioned groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface which are sequentially connected. The adhesive portion has an inner surface, an abutting surface, and an outer surface that are sequentially connected, and abut against the first inner wall surface, the bottom surface, and the second inner wall surface, respectively. The adhesive layer is adhered between the inner contact surface and the first inner wall surface, between the contact surface and the bottom surface, and between the outer contact surface and the second inner wall surface.

In one or more embodiments of the present invention, the above-mentioned groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface which are sequentially connected. The adhesive portion has a first abutment surface, a first turning surface, a second abutting surface, and a second turning surface sequentially connected, and the abutting surface, the first inner wall surface, the bottom surface, and the second inner wall surface are respectively connected. The adhesive layer is adhered between the first abutting surface and the surface, between the first turning surface and the first inner wall surface, between the second abutting surface and the bottom surface, and between the second turning surface and the second inner wall surface.

In one or more embodiments of the present invention, the above-mentioned groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface which are sequentially connected. The adhesive portion has a first abutting surface, a second turning surface, a second abutting surface, and a first turning surface sequentially connected, and the abutting surface, the second inner wall surface, the bottom surface, and the first inner wall surface are respectively connected. The adhesive layer is adhered between the first abutting surface and the surface, between the second turning surface and the second inner wall surface, between the second abutting surface and the bottom surface, and between the first turning surface and the first inner wall surface.

In summary, in the image module of the present invention, the circuit board is provided with an embedded structure that can be engaged with the adhesive portion of the lens holder, so it can assist the assembly personnel to quickly position the lens holder during the assembly process. On the circuit board. In addition, the embedding structure can increase the contact area between the circuit board and the bonding portion of the lens base, so the bonding area between the adhesive layer and the circuit board and the lens base can be increased, which can effectively prevent the lens base from detaching from the circuit board. .

The above is only used to explain the problem to be solved by the present invention, the technical means for solving the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

100, 300, 500‧‧‧ image modules

110, 310, 510‧‧‧ circuit board

110a, 310a, 510a‧‧‧ surface

111‧‧‧ sunken structure

111a‧‧‧Inner wall surface

111b, 511b‧‧‧ Underside

120‧‧‧Image Sensor

130, 230, 430, 630‧‧‧ mirror mounts

131, 231, 431, 631‧‧‧ Adhesion

131a‧‧‧ abutting surface

131b‧‧‧External surface

131c‧‧‧Inner face

140‧‧‧ lens group

150‧‧‧ Filter

160‧‧‧Adhesive layer

231a, 431a, 631a

231b, 431b‧‧‧ turning surface

231c, 431c, 631c‧‧‧Second abutment surface

311‧‧‧ protruding structure

311a‧‧‧outer wall surface

311b‧‧‧Top

511‧‧‧Trench Structure

511a‧‧‧first inner wall surface

511c‧‧‧Second inner wall surface

631b‧‧‧first turning surface

631d‧‧‧second turning surface

In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the description of the drawings is as follows: FIG. 1A is a perspective view illustrating an image module of an embodiment of the present invention.

FIG. 1B is another perspective view showing the image module in FIG. 1A, in which the circuit board is separated from the lens holder.

FIG. 2 is a cross-sectional view showing the image module in FIG. 1A along line segment 2-2.

FIG. 3 is a partially enlarged view showing FIG. 2.

FIG. 4 is a partial enlarged view showing a lens holder and a circuit board according to another embodiment of the present invention.

FIG. 5 is a perspective view illustrating an image module according to another embodiment of the present invention, in which a circuit board is separated from a lens holder.

FIG. 6 is a cross-sectional view showing the combination of the image modules in FIG. 5.

FIG. 7 is a partially enlarged view showing FIG. 6.

FIG. 8 is a partial enlarged view illustrating a lens holder and a circuit board according to another embodiment of the present invention.

FIG. 9 is a perspective view illustrating an image module according to another embodiment of the present invention, in which a circuit board is separated from a lens holder.

FIG. 10 is a cross-sectional view showing the combination of the image modules in FIG. 9.

FIG. 11 is a partially enlarged view showing FIG. 10.

FIG. 12 is a partial enlarged view showing a lens holder and a circuit board according to another embodiment of the present invention.

In the following, a plurality of embodiments of the present invention will be disclosed graphically. For the sake of clarity, many practical details will be described in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and components will be shown in the drawings in a simple and schematic manner.

Please refer to Figure 1A to Figure 3. FIG. 1A is a perspective view illustrating an image module 100 according to an embodiment of the present invention. FIG. 1B is another perspective view showing the image module 100 in FIG. 1A, in which the circuit board 110 and the lens holder 130 are separated. FIG. 2 is a cross-sectional view showing the image module 100 in FIG. 1A along the line segment 2-2. FIG. 3 is a partially enlarged view showing FIG. 2. The structure, function, and connection relationship of each element included in the image module 100 of this embodiment will be described in detail below.

As shown in FIGS. 1A to 3, in this embodiment, the image module 100 includes a circuit board 110, an image sensor 120, a lens holder 130, a lens group 140, a filter 150, and an adhesive layer 160. The circuit board 110 has a surface 110 a and a recessed structure 111 located on the surface 110 a. The image sensor 120 is disposed in the recessed structure 111. The lens base 130 is embedded on the inner edge of the recessed structure 111 and covers the image sensor 120. The lens mount 130 is hollow and cylindrical. The lens group 140 is disposed inside the lens base 130 and is optically coupled with the image sensor 120. The filter 150 is disposed in an internal space of the lens holder 130 and is located between the lens group 140 and the image sensor 120. For example, the filter 150 can be used to filter out infrared rays, but the invention is not limited thereto. The adhesive layer 160 (see FIG. 3) is adhered to the joint between the lens base 130 and the recessed structure 111.

Specifically, as shown in FIG. 3, in the present embodiment, the recessed structure 111 on the circuit board 110 has an inner wall surface 111 a and a bottom surface 111 b connected to each other. The image sensor 120 is disposed on the bottom surface 111 b of the recessed structure 111. The bottom of the mirror base 130 corresponding to the circuit board 11 includes an adhesive portion 131 for bonding the mirror base 130 and the circuit board 11. The adhesive portion 131 has a contact surface 131a and an outer surface 131b connected to the bottom surface 111b and the inner wall surface 111a of the recessed structure 111, respectively. Preferably, the abutment surface 131a is perpendicular to the outer surface 131b. The adhesive layer 160 is adhered between the abutting surface 131a and the bottom surface 111b, and between the outer surface 131b and the inner wall surface 111a.

It can be known from the foregoing structural configuration that, in the image module 100 of this embodiment, the circuit board 110 is provided with a recessed structure 111 that can be engaged with the adhesive portion 131 of the lens base 130, so it can assist the assembly personnel during the assembly process. The mirror base 130 is quickly positioned on the circuit board 110 through the inner edge of the recessed structure 111. In addition, the recessed structure 111 can increase the contact area between the circuit board 110 and the bonding portion 131 of the lens base 130, so that the bonding area between the adhesive layer 160 and the circuit board 110 and the lens base 130 can be increased, which can be effective. Avoid the lens holder 130 from coming off the circuit board 110.

In practical applications, the distance of the lens holder 130 relative to the circuit board 110 can be calibrated by an automatic calibration machine (not shown), so that the lens group 140 in the lens holder 130 can focus on the image sensor 120. Therefore, in order to enable the automatic calibration machine to perform the calibration procedure, it is necessary to design the depth of the recessed structure 111 (that is, the straight distance of the zirconium between the surface 110a of the circuit board 110 and the bottom surface 111b of the recessed structure 111) to be greater than the calibration of the automatic calibration machine. range. In one embodiment, the calibration range of the automatic calibration machine is less than 0.1 mm, and the depth of the recessed structure 111 is 0.25 mm.

Please refer to FIG. 4, which is a partially enlarged view illustrating a lens holder 230 and a circuit board 110 according to another embodiment of the present invention. As shown in FIG. 4, in this embodiment, the adhesive portion 231 of the lens holder 230 has a first abutting surface 231 a, a turning surface 231 b, and a second abutting surface 231 c that are sequentially connected, and respectively abut the concave structure 111. The bottom surface 111b, the inner wall surface 111a, and the surface 110a of the circuit board 110. It should be noted that the first abutting surface 231a, the turning surface 231b, and the second abutting surface 231c are all located at the bottom of the adhesive portion 231. Preferably, the first abutting surface 231a and the second abutting surface 231c are respectively It is perpendicular to the turning surface 231b. The adhesive layer 160 is adhered between the first contact surface 231a and the bottom surface 111b, between the turning surface 231b and the inner wall surface 111a, and between the second contact surface 231c and the surface 110a.

It can be known from the foregoing structural configuration that, compared with the embodiment shown in FIG. 3, the adhesive portion 231 of the lens holder 230 in this embodiment has more faces that can abut against the circuit board 110, so the adhesive can be further increased The layer 160 is adhered to the adhesion area between the circuit board 110 and the lens base 230, and this structure configuration is suitable for being applied to the thicker adhesion portion 231.

Please refer to Figure 5 to Figure 7. FIG. 5 is a perspective view illustrating an image module 300 according to another embodiment of the present invention, in which the circuit board 310 and the lens base 130 are separated. FIG. 6 is a cross-sectional view showing the combination of the image module 300 in FIG. 5. FIG. 7 is a partially enlarged view showing FIG. 6. As shown in FIGS. 5 to 7, in this embodiment, the image module 300 includes a circuit board 310, an image sensor 120, a lens holder 130, a lens group 140, a filter 150, and an adhesive layer 160. The image sensor 120, the lens base 130, the lens group 140, the filter 150, and the adhesive layer 160 are the same as the embodiments shown in Figs. 1A to 3, and therefore will not be described again here. Related instructions.

It should be noted here that the difference between this embodiment and the embodiment shown in FIGS. 1A to 3 is that the circuit board 310 in this embodiment has a surface 310a and a protruding structure 311 on the surface 310a. . The image sensor 120 is disposed on the protruding structure 311. The lens base 130 is embedded on the outer edge of the protruding structure 311. The adhesive layer 160 is adhered to the joint between the lens base 130 and the protruding structure 311 and between the lens base 130 and the surface 310a.

Specifically, as shown in FIG. 7, in this embodiment, the protruding structure 311 has an outer wall surface 311 a and a top surface 311 b. The image sensor 120 is disposed on a top surface 311 b of the protruding structure 311. The abutment surface 131 a and the inner contact surface 131 c of the adhesive portion 131 abut the surface 310 a and the outer wall surface 311 a of the protruding structure 311, respectively. Preferably, the abutment surface 131 a is perpendicular to the inner contact surface 131 c. The adhesive layer 160 is adhered between the contact surface 131a and the surface 310a, and between the inner contact surface 131c and the outer wall surface 311a.

It can be known from the foregoing structural configuration that in the image module 300 of this embodiment, the circuit board 310 is provided with a protruding structure 311 that can be engaged with the adhesive portion 131 of the lens base 130, so it can assist in assembly during the assembly process. A person quickly positions the mirror base 130 on the circuit board 310 by the outer edge of the protruding structure 311. In addition, the protruding structure 311 can increase the contact area between the circuit board 310 and the bonding portion 131 of the lens base 130, so that the bonding area between the adhesive layer 160 and the circuit board 310 and the lens base 130 can be increased. The lens holder 130 is effectively prevented from being separated from the circuit board 310.

Please refer to FIG. 8, which is a partial enlarged view illustrating a lens holder 430 and a circuit board 310 according to another embodiment of the present invention. As shown in FIG. 8, in this embodiment, the protruding structure 311 has a continuous outer wall surface 311 a and a top surface 311 b. The adhesive portion 431 of the lens holder 430 has a first abutting surface 431a, a turning surface 431b, and a second abutting surface 431c which are sequentially connected, and respectively abut the top surface 311b, the outer wall surface 311a of the protruding structure 311, and the circuit board 310. Surface 310a. It should be noted that the first abutment surface 431a, the turning surface 431b, and the second abutment surface 431c are all located at the bottom of the adhesive portion 431. Preferably, the first abutment surface 431a and the second abutment surface 431c are respectively It is perpendicular to the turning surface 431b. The adhesive layer 160 is adhered between the first contact surface 431a and the top surface 311b, between the turning surface 431b and the outer wall surface 311a, and between the second contact surface 431c and the surface 310a.

As can be seen from the foregoing structural configuration, compared with the embodiment shown in FIG. 7, the adhesive portion 431 of the lens holder 430 in this embodiment has more faces that can abut against the circuit board 310, so the adhesive can be further increased. The layer 160 is adhered to the adhesion area between the circuit board 310 and the lens holder 430, and this structure configuration is suitable for being applied to a thicker adhesive portion 431.

Please refer to Figure 9 to Figure 11. FIG. 9 is a perspective view illustrating an image module 500 according to another embodiment of the present invention, in which the circuit board 510 and the lens base 130 are separated. FIG. 10 is a cross-sectional view showing the combination of the image module 500 in FIG. 9. FIG. 11 is a partially enlarged view showing FIG. 10. As shown in FIGS. 9 to 11, in this embodiment, the image module 500 includes a circuit board 510, an image sensor 120, a lens holder 130, a lens group 140, a filter 150, and an adhesive layer 160. The image sensor 120, the lens base 130, the lens group 140, the filter 150, and the adhesive layer 160 are the same as the embodiments shown in Figs. 1A to 3, and therefore will not be described again here. Related instructions.

It should be noted here that the difference between this embodiment and the embodiment shown in FIGS. 1A to 3 is that the circuit board 510 of this embodiment has a surface 510a and a trench structure 511 on the surface 510a. . The image sensor 120 is disposed on a surface 510 a of the circuit board 510. The lens mount 130 is disposed on a surface 510 a of the circuit board 510 and covers the image sensor 120. The adhesive portion 131 of the lens base 130 is embedded in the inner edge of the groove structure 511. The adhesive layer 160 is adhered to the joint between the adhesive portion 131 and the trench structure 511.

Specifically, as shown in FIG. 11, in this embodiment, the trench structure 511 has a first inner wall surface 511 a, a bottom surface 511 b, and a second inner wall surface 511 c that are sequentially connected. The adhesive portion 131 has an inner contact surface 131c, an abutment surface 131a, and an outer contact surface 131b which are sequentially connected, and respectively abut the first inner wall surface 511a, the bottom surface 511b, and the second inner wall surface 511c of the groove structure 511, and preferably, The inner contact surface 131c and the outer contact surface 131b are perpendicular to the contact surface 131a, respectively. The adhesive layer 160 is adhered between the inner contact surface 131c and the first inner wall surface 511a, between the contact surface 131a and the bottom surface 511b, and between the outer contact surface 131b and the second inner wall surface 511c.

It can be known from the foregoing structural configuration that, in the image module 500 of this embodiment, the circuit board 510 is provided with a groove structure 511 that can be engaged with the adhesive portion 131 of the lens base 130, so it can assist in assembly during the assembly process. The person quickly positions the mirror base 130 on the circuit board 510 through the inner edge of the groove structure 511. In addition, the groove structure 511 can increase the contact area between the circuit board 510 and the bonding portion 131 of the lens base 130, and therefore can increase the bonding area between the circuit board 510 and the lens base 130. The lens holder 130 is effectively prevented from detaching from the circuit board 510.

As shown in FIG. 9, the trench structure 511 of this embodiment is a closed annular trench structure and is suitable for embedding all the adhesive portions 131 of the lens base 130, but the present invention is not limited thereto. It may also be a strip-shaped groove structure that is only embedded with a part of the adhesive portion 131. In some embodiments, the trench structure 511 of this embodiment may also be a non-closed trench structure. For example, the circuit board 510 may have only two groove structures 511 located on two opposite sides of the lens holder 130, respectively, and adapted to be embedded in two opposite adhesive portions 131 of the lens holder 130 (that is, the two The length of the relative adhesive portion 131 extending downward is greater than that of other adhesive portions 131), and the same purpose of quickly positioning the lens holder 130 on the circuit board 510 can be achieved.

Please refer to FIG. 12, which is a partially enlarged view illustrating a lens holder 630 and a circuit board 510 according to another embodiment of the present invention. As shown in FIG. 12, in this embodiment, the trench structure 511 has a first inner wall surface 511 a, a bottom surface 511 b, and a second inner wall surface 511 c that are sequentially connected. The adhesive portion 631 of the lens holder 630 has a first abutting surface 631a, a first turning surface 631b, a second abutting surface 631c, and a second turning surface 631d connected in order, and the second turning surface 631d is connected back to the first The abutment surface 631a. The first abutting surface 631a, the first turning surface 631b, the second abutting surface 631c, and the second turning surface 631d respectively abut the surface 510a of the circuit board 510 and the first inner wall surface 511a, the bottom surface 511b, and the first Two inner wall surfaces 511c. The adhesive layer 160 is bonded between the first abutting surface 631a and the surface 510a, between the first turning surface 631b and the first inner wall surface 511a, between the second abutting surface 631c and the bottom surface 511b, and the second turning surface 631d and Between the second inner wall surfaces 511c.

It can be known from the foregoing structural configuration that, compared with the embodiment shown in FIG. 11, the adhesive portion 631 of the lens holder 630 in this embodiment has more faces that can abut against the circuit board 510, so the adhesive can be further increased. The layer 160 is adhered to the adhesion area between the circuit board 510 and the lens holder 630, and this structure configuration is suitable for being applied to the thicker adhesion portion 631.

In some embodiments, the adhesive portion 631 can be modified without the first contact surface 631a on the left side, so that the shape of the modified adhesive portion 631 is similar to the adhesive portion 231 shown in FIG. 4. In some embodiments, the adhesive portion 631 may be modified without the first abutting surface 631a on the right side, so that the shape of the modified adhesive portion 631 is similar to the adhesive portion 431 shown in FIG. 8.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that, in the image module of the present invention, the circuit board is provided with an embedding structure that can be engaged with the adhesive portion of the lens holder. During the assembly process, it can assist the assembly personnel to quickly position the lens holder on the circuit board. In addition, the embedding structure can increase the contact area between the circuit board and the bonding portion of the lens base, so the bonding area between the adhesive layer and the circuit board and the lens base can be increased, which can effectively prevent the lens base from detaching from the circuit board. .

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. The scope shall be determined by the scope of the attached patent application.

Claims (10)

    An image module includes: a circuit board having a surface and a recessed structure located on the surface; an image sensor disposed in the recessed structure; and a mirror seat embedded in the inner edge of the recessed structure, And covering the image sensor; and an adhesive layer adhered to the joint between the lens base and the recessed structure.         The image module according to claim 1, wherein the recessed structure has an inner wall surface and a bottom surface connected to each other, the image sensor is disposed on the bottom surface, the lens holder includes an adhesive portion, and the adhesive portion There is an abutting surface and an outer surface connected to the bottom surface and the inner wall surface, respectively, and the adhesive layer is adhered between the abutting surface and the bottom surface and between the outer surface and the inner wall surface.         The image module according to claim 1, wherein the recessed structure has an inner wall surface and a bottom surface connected to each other, the image sensor is disposed on the bottom surface, the lens holder includes an adhesive portion, and the adhesive portion A first abutment surface, a turning surface, and a second abutment surface are sequentially connected, respectively, abut the bottom surface, the inner wall surface and the surface, and the adhesive layer is bonded to the first abutment surface and Between the bottom surface, the turning surface and the inner wall surface, and between the second abutting surface and the surface.         An image module includes: a circuit board having a surface and a protruding structure located on the surface; an image sensor disposed on the protruding structure; and a mirror seat embedded in the protruding structure The outer edge covers the image sensor; and an adhesive layer is adhered between the lens mount and the protruding structure and between the lens mount and the surface.         The image module according to claim 4, wherein the protruding structure has an outer wall surface and a top surface, the image sensor is disposed on the top surface, the lens holder includes an adhesive portion, and the adhesive The part has an abutting surface and an inner abutting surface connected to the surface and the outer wall surface, respectively, and the adhesive layer is adhered between the abutting surface and the surface and between the inner abutting surface and the outer wall surface. between.         The image module according to claim 4, wherein the protruding structure has an outer wall surface and a top surface connected to each other, the image sensor is disposed on the top surface, the lens holder includes an adhesive portion, and The adhesive portion has a first abutment surface, a turning surface, and a second abutment surface sequentially connected to the top surface, the outer wall surface, and the surface, respectively, and the adhesive layer is adhered to the first surface. Between the abutting surface and the top surface, between the turning surface and the outer wall surface, and between the second abutting surface and the surface.         An image module includes: a circuit board having a surface and a groove structure located on the surface; an image sensor disposed on the surface; and a mirror seat disposed on the surface and covering the image sensor In the measuring device, the lens base includes an adhesive portion, which is embedded on the inner edge of the groove structure; and an adhesive layer, which is adhered on the joint between the adhesive portion and the groove structure. .         The image module according to claim 7, wherein the groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence, and the adhesive portion has an internal connection connected in order. Surface, an abutting surface, and an outer surface, respectively, abut the first inner wall surface, the bottom surface, and the second inner wall surface, and the adhesive layer is bonded between the inner surface and the first inner wall surface, the Between the abutting surface and the bottom surface, and between the outer surface and the second inner wall surface.         The imaging module according to claim 7, wherein the groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence, and the adhesive portion has a first connected wall in sequence. The abutting surface, a first turning surface, a second abutting surface, and a second turning surface respectively abut the surface, the first inner wall surface, the bottom surface and the second inner wall surface, and the adhesive layer is bonded Between the first abutting surface and the surface, between the first turning surface and the first inner wall surface, between the second abutting surface and the bottom surface, and between the second turning surface and the second inner wall surface between.         The imaging module according to claim 7, wherein the groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence, and the adhesive portion has a first connected wall in sequence. The abutting surface, a second turning surface, a second abutting surface, and a first turning surface respectively abut the surface, the second inner wall surface, the bottom surface and the first inner wall surface, and the adhesive layer is bonded Between the first abutting surface and the surface, between the second turning surface and the second inner wall surface, between the second abutting surface and the bottom surface, and between the first turning surface and the first inner wall surface between.