TWI686081B - Camera module - Google Patents

Abstract

A camera module includes a circuit board, an image sensor, a lens holder, and an adhesive layer. The circuit board has a surface and a recessed structure on the surface. The image sensor is disposed in the recessed structure. The lens holder is engaged at an inner edge of the recessed structure and covers the image sensor. The adhesive layer is adhered at an engagement location between the lens holder and the recessed structure.

Description

Image module

The invention relates to an image module.

At present, mobile phones are developing towards a multi-functional trend, and mobile phones with camera functions are very popular as soon as they are launched. The image module applied to the mobile phone must not only meet the requirements of lightness, thinness and shortness, but also have better camera performance.

For example, an existing image module includes a circuit board, a lens holder, a lens group, and an image sensor. The lens holder is hollow and cylindrical. The lens group is arranged inside the lens holder. The lens holder and the image sensor are disposed on the circuit board, and the lens holder covers the image sensor, so that the lens group and the image sensor are optically coupled.

However, as mentioned above, due to the increasingly miniaturized products, the wall thickness of the opposite lens holder is getting thinner and thinner, and the contact area between the bottom of the lens holder and the circuit board is getting smaller and smaller. If the amount of glue between the bottom of the lens holder and the circuit board is insufficient, it is easy to cause insufficient bonding force between the lens holder and the circuit board, causing the lens holder to fall off the circuit board.

In view of this, one object of the present invention is to provide an image module that can effectively prevent the lens holder from being separated from the circuit board.

In order to achieve the above object, according to one embodiment of the present invention, an image module includes a circuit board, an image sensor, a lens holder, and an adhesive layer. The circuit board has a surface and a concave structure located on the surface. The image sensor is disposed in the concave structure. The mirror base is embedded in the inner edge of the concave structure and covers the image sensor. The adhesive layer is adhered to the joint between the lens base and the recessed structure.

In one or more embodiments of the present invention, the above-mentioned concave structure has an inner wall surface and a bottom surface connected. The image sensor is arranged on the bottom surface. The lens holder includes an adhesive part. The adhesion part has a connected abutment surface and an external connection surface, respectively abutting the bottom surface and the inner wall surface. The adhesive layer is bonded between the contact surface and the bottom surface and between the circumscribed surface and the inner wall surface.

In one or more embodiments of the present invention, the above-mentioned concave structure has an inner wall surface and a bottom surface connected. The image sensor is arranged on the bottom surface. The lens holder includes an adhesive part. The adhesive part has a first abutting surface, a turning surface and a second abutting surface connected in sequence, respectively abutting the bottom surface, the inner wall surface and the surface. The adhesive layer is bonded between the first abutting surface and the bottom surface, between the turning surface and the inner wall surface, and between the second abutting surface and the surface.

In order to achieve the above object, according to another embodiment of the present invention, an image module includes a circuit board, an image sensor, a lens holder, and an adhesive layer. The circuit board has a surface and a protruding structure on the surface. The image sensor is arranged on the protruding structure. The mirror base is embedded in the outer edge of the protruding structure and covers the image sensor. The adhesive layer is adhered to the joint between the lens holder and the protruding structure and between the lens holder and the surface.

In one or more embodiments of the present invention, the above-mentioned protruding structure has an outer wall surface and a top surface. The image sensor is arranged on the top surface. The lens holder includes an adhesive part. The adhesive part has a connected abutting surface and an inner connecting surface, respectively abutting the surface and the outer wall surface. The adhesive layer is bonded between the contact surface and the surface and between the inner contact surface and the outer wall surface.

In one or more embodiments of the present invention, the above-mentioned protruding structure has a connected outer wall surface and a top surface. The image sensor is arranged on the top surface. The lens holder includes an adhesive part. The adhesive part has a first abutting surface, a turning surface and a second abutting surface connected in sequence, respectively abutting the top surface, the outer wall surface and the surface. The adhesive layer is bonded between the first contact surface and the top surface, between the turning surface and the outer wall surface, and between the second contact surface and the surface.

In order to achieve the above object, according to yet another embodiment of the present invention, an image module includes a circuit board, an image sensor, a lens holder, and an adhesive layer. The circuit board has a surface and a groove structure on the surface. The image sensor is arranged on the surface. The lens holder is arranged on the surface and covers the image sensor. The lens holder includes an adhesive part. The adhesive part is embedded in the inner edge of the trench structure. The adhesive layer is bonded to the embedding part between the adhesive part and the trench structure.

In one or more embodiments of the present invention, the above-mentioned trench structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence. The adhesive part has an inner joint surface, an abutting surface and an outer joint surface connected in sequence, respectively abutting the first inner wall surface, the bottom surface and the second inner wall surface. The adhesive layer is adhered between the inner connecting surface and the first inner wall surface, between the abutting surface and the bottom surface, and between the outer connecting surface and the second inner wall surface.

In one or more embodiments of the present invention, the above-mentioned trench structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence. The adhesive part has a first abutting surface, a first turning surface, a second abutting surface and a second turning surface connected in sequence, respectively abutting the surface, the first inner wall surface, the bottom surface and the second inner wall surface. The adhesive layer is adhered between the first abutting surface and the surface, between the first turning surface and the first inner wall surface, between the second abutting surface and the bottom surface, and between the second turning surface and the second inner wall surface.

In one or more embodiments of the present invention, the above-mentioned trench structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence. The adhesive part has a first abutting surface, a second turning surface, a second abutting surface and a first turning surface connected in sequence, respectively abutting the surface, the second inner wall surface, the bottom surface and the first inner wall surface. The adhesive layer is adhered between the first contact surface and the surface, between the second turning surface and the second inner wall surface, between the second contact surface and the bottom surface, and between the first turning surface and the first inner wall surface.

In summary, in the image module of the present invention, the circuit board is provided with an embedding structure that can be engaged with the adhesion part of the lens holder, so the assembly person can be assisted in quickly positioning the lens holder during the assembly process On the circuit board. Moreover, the embedding structure can increase the contact area between the adhesive part of the circuit board and the lens holder, so the adhesion area between the circuit board and the lens holder can be increased, which can effectively prevent the lens holder from detaching from the circuit board .

The above is only for explaining the problem to be solved by the present invention, the technical means for solving the problem, and the resulting effect, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

100, 300, 500 ‧‧‧ video module

110, 310, 510‧‧‧ circuit board

110a, 310a, 510a‧‧‧surface

111‧‧‧Concave structure

111a‧‧‧Inner wall

111b, 511b‧‧‧Bottom

120‧‧‧Image sensor

130, 230, 430, 630

131, 231, 431, 631

131a‧‧‧ abutment surface

131b‧‧‧External surface

131c‧‧‧Interface

140‧‧‧ lens group

150‧‧‧ filter

160‧‧‧adhesive layer

231a, 431a, 631a ‧‧‧ first abutment surface

231b, 431b ‧‧‧ turning point

231c, 431c, 631c ‧‧‧ second abutment surface

311‧‧‧ protruding structure

311a‧‧‧Outer wall

311b‧‧‧Top

511‧‧‧Trench structure

511a‧‧‧First inner wall

511c‧‧‧Second inner wall surface

631b‧‧‧The first turning surface

631d‧‧‧Second turning surface

In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the drawings are described as follows: FIG. 1A is a perspective view illustrating an image module according to an embodiment of the present invention.

FIG. 1B is another perspective view showing the image module in FIG. 1A, in which the circuit board is separated from the lens holder.

FIG. 2 is a cross-sectional view of the image module in FIG. 1A along line 2-2.

FIG. 3 is a partially enlarged view showing FIG. 2.

FIG. 4 is a partially enlarged view showing a lens holder and a circuit board according to another embodiment of the invention.

FIG. 5 is a perspective view showing an image module according to another embodiment of the present invention, in which the circuit board is separated from the lens holder.

FIG. 6 is a cross-sectional view showing the combination of the image modules in FIG. 5.

FIG. 7 is a partially enlarged view illustrating FIG. 6.

FIG. 8 is a partial enlarged view showing a lens holder and a circuit board according to another embodiment of the invention.

FIG. 9 is a perspective view showing an image module according to another embodiment of the present invention, in which the circuit board is separated from the lens holder.

FIG. 10 is a cross-sectional view showing the combination of the image modules in FIG. 9.

FIG. 11 is a partially enlarged view illustrating FIG. 10.

FIG. 12 is a partially enlarged view showing a lens holder and a circuit board according to another embodiment of the invention.

In the following, a plurality of embodiments of the present invention will be disclosed in the form of diagrams. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings.

Please refer to Figure 1A to Figure 3. FIG. 1A is a perspective view showing an image module 100 according to an embodiment of the invention. FIG. 1B is another perspective view of the image module 100 shown in FIG. 1A, in which the circuit board 110 and the lens holder 130 are separated. FIG. 2 is a cross-sectional view of the image module 100 in FIG. 1A along line 2-2. FIG. 3 is a partially enlarged view showing FIG. 2. The structure, function, and connection relationship of each element included in the image module 100 of this embodiment will be described in detail below.

As shown in FIGS. 1A to 3, in this embodiment, the image module 100 includes a circuit board 110, an image sensor 120, a lens holder 130, a lens group 140, a filter 150 and an adhesive layer 160. The circuit board 110 has a surface 110a and a concave structure 111 located on the surface 110a. The image sensor 120 is disposed in the concave structure 111. The lens holder 130 is embedded in the inner edge of the concave structure 111 and covers the image sensor 120. The lens holder 130 has a hollow cylindrical shape. The lens group 140 is disposed inside the lens holder 130 and optically coupled with the image sensor 120. The filter 150 is disposed in the internal space of the lens holder 130 and is located between the lens group 140 and the image sensor 120. For example, the filter 150 can be used to filter infrared rays, but the invention is not limited thereto. The adhesive layer 160 (see FIG. 3) is adhered to the joint between the lens holder 130 and the recessed structure 111.

Specifically, as shown in FIG. 3, in this embodiment, the concave structure 111 on the circuit board 110 has an inner wall surface 111 a and a bottom surface 111 b connected. The image sensor 120 is disposed on the bottom surface 111b of the concave structure 111. The bottom of the lens holder 130 corresponding to the circuit board 110 includes an adhesive portion 131 for bonding the lens holder 130 and the circuit board 110. The adhesive portion 131 has a connected abutting surface 131a and an outer surface 131b, respectively abutting the bottom surface 111b and the inner wall surface 111a of the concave structure 111, and preferably, the abutting surface 131a is perpendicular to the outer surface 131b. The adhesive layer 160 is bonded between the contact surface 131a and the bottom surface 111b and between the circumscribed surface 131b and the inner wall surface 111a.

As can be seen from the foregoing structural configuration, in the image module 100 of this embodiment, the circuit board 110 is provided with a recessed structure 111 that can be embedded with the adhesive portion 131 of the lens holder 130, so the assembly personnel can be assisted during the assembly process The mirror base 130 is quickly positioned on the circuit board 110 by the inner edge of the concave structure 111. Moreover, the recessed structure 111 can increase the contact area between the circuit board 110 and the adhesive portion 131 of the lens holder 130, and thus can increase the adhesion area between the adhesive layer 160 and the circuit board 110 and the lens holder 130, which can be effective Prevent the mirror base 130 from being separated from the circuit board 110.

In practical applications, the distance of the lens holder 130 relative to the circuit board 110 can be calibrated by an automatic calibration machine (not shown), so that the lens group 140 in the lens holder 130 can focus on the image sensor 120. Therefore, in order for the automatic calibration machine to perform the calibration procedure, it is necessary to design such that the depth of the recessed structure 111 (that is, the vertical distance between the surface 110a of the circuit board 110 and the bottom surface 111b of the recessed structure 111) is greater than the calibration range of the automatic calibration machine . In an embodiment, the calibration range of the automatic calibration machine is less than 0.1 mm, and the depth of the concave structure 111 is 0.25 mm.

Please refer to FIG. 4, which is a partially enlarged view illustrating the lens holder 230 and the circuit board 110 according to another embodiment of the invention. As shown in FIG. 4, in this embodiment, the adhesive portion 231 of the lens holder 230 has a first abutting surface 231 a, a turning surface 231 b, and a second abutting surface 231 c connected in sequence, each abutting the concave structure 111 The bottom surface 111b, the inner wall surface 111a and the surface 110a of the circuit board 110. It should be noted that the first abutting surface 231a, the turning surface 231b and the second abutting surface 231c are all located at the bottom of the adhesive portion 231, and preferably, the first abutting surface 231a and the second abutting surface 231c are respectively It is perpendicular to the turning surface 231b. The adhesive layer 160 is bonded between the first abutting surface 231a and the bottom surface 111b, between the turning surface 231b and the inner wall surface 111a, and between the second abutting surface 231c and the surface 110a.

As can be seen from the foregoing structural configuration, compared to the embodiment shown in FIG. 3, the adhesive portion 231 of the lens holder 230 of this embodiment has more surfaces that can abut against the circuit board 110, so the adhesive can be further increased The layer 160 is bonded to the bonding area between the circuit board 110 and the lens holder 230, and this structural configuration is suitable for application to the thick bonding portion 231.

Please refer to Figure 5 to Figure 7. FIG. 5 is a perspective view showing an image module 300 according to another embodiment of the present invention, in which the circuit board 310 is separated from the lens holder 130. FIG. 6 is a cross-sectional view illustrating the combination of the image module 300 in FIG. 5. FIG. 7 is a partially enlarged view illustrating FIG. 6. As shown in FIGS. 5 to 7, in this embodiment, the image module 300 includes a circuit board 310, an image sensor 120, a lens holder 130, a lens group 140, a filter 150 and an adhesive layer 160, The image sensor 120, the lens holder 130, the lens group 140, the filter 150, and the adhesive layer 160 are the same as the embodiments shown in FIGS. 1A to 3, so they will not be described here again, and please refer to the foregoing Related instructions.

It should be explained here that the difference between this embodiment and the embodiments shown in FIGS. 1A to 3 is that the circuit board 310 of this embodiment has a surface 310a and a protruding structure 311 on the surface 310a . The image sensor 120 is disposed on the protruding structure 311. The lens base 130 is embedded in the outer edge of the protruding structure 311. The adhesive layer 160 is adhered to the joint between the lens holder 130 and the protruding structure 311 and between the lens holder 130 and the surface 310a.

Specifically, as shown in FIG. 7, in this embodiment, the convex structure 311 has an outer wall surface 311 a and a top surface 311 b. The image sensor 120 is disposed on the top surface 311b of the protruding structure 311. The contact surface 131a and the inner contact surface 131c of the adhesive portion 131 abut the surface 310a and the outer wall surface 311a of the protruding structure 311, respectively. Preferably, the contact surface 131a is perpendicular to the inner contact surface 131c. The adhesive layer 160 is bonded between the contact surface 131a and the surface 310a and between the inner contact surface 131c and the outer wall surface 311a.

As can be seen from the foregoing structural configuration, in the image module 300 of this embodiment, the circuit board 310 is provided with a protruding structure 311 that can be embedded with the adhesive portion 131 of the lens holder 130, so it can assist the assembly during the assembly process The person quickly positions the lens holder 130 on the circuit board 310 by the outer edge of the protruding structure 311. Moreover, the protruding structure 311 can increase the contact area between the circuit board 310 and the adhesive portion 131 of the lens holder 130, and thus can increase the adhesion area between the adhesive layer 160 and the circuit board 310 and the lens holder 130. The mirror base 130 is effectively prevented from being separated from the circuit board 310.

Please refer to FIG. 8, which is a partially enlarged view illustrating the lens holder 430 and the circuit board 310 according to another embodiment of the invention. As shown in FIG. 8, in this embodiment, the protruding structure 311 has an outer wall surface 311 a and a top surface 311 b that are connected. The adhesive portion 431 of the lens holder 430 has a first abutting surface 431a, a turning surface 431b and a second abutting surface 431c connected in sequence, respectively abutting the top surface 311b, the outer wall surface 311a of the protruding structure 311 and the circuit board 310的面310a。 The surface 310a. It should be noted that the first contact surface 431a, the turning surface 431b, and the second contact surface 431c are all located at the bottom of the adhesion portion 431, and preferably, the first contact surface 431a and the second contact surface 431c are respectively Vertical to the turning surface 431b. The adhesive layer 160 is bonded between the first contact surface 431a and the top surface 311b, between the turning surface 431b and the outer wall surface 311a, and between the second contact surface 431c and the surface 310a.

It can be seen from the foregoing structural configuration that, compared with the embodiment shown in FIG. 7, the adhesive portion 431 of the lens holder 430 of this embodiment has more surfaces that can abut the circuit board 310, so the adhesive can be further increased The layer 160 is bonded to the bonding area between the circuit board 310 and the lens holder 430, and this structural configuration is suitable for application to the thick bonding portion 431.

Please refer to Figure 9 to Figure 11. FIG. 9 is a perspective view showing an image module 500 according to another embodiment of the present invention, in which the circuit board 510 is separated from the lens holder 130. FIG. 10 is a cross-sectional view showing the combination of the image module 500 in FIG. 9. FIG. 11 is a partially enlarged view illustrating FIG. 10. As shown in FIGS. 9 to 11, in this embodiment, the image module 500 includes a circuit board 510, an image sensor 120, a lens holder 130, a lens group 140, a filter 150, and an adhesive layer 160. The image sensor 120, the lens holder 130, the lens group 140, the filter 150, and the adhesive layer 160 are the same as the embodiments shown in FIGS. 1A to 3, so they will not be described here again, and please refer to the foregoing Related instructions.

It should be explained here that the difference between this embodiment and the embodiments shown in FIGS. 1A to 3 is that the circuit board 510 of this embodiment has a surface 510a and a trench structure 511 on the surface 510a . The image sensor 120 is disposed on the surface 510a of the circuit board 510. The lens holder 130 is disposed on the surface 510a of the circuit board 510 and covers the image sensor 120. The adhesive portion 131 of the lens holder 130 is embedded in the inner edge of the trench structure 511. The adhesive layer 160 is adhered to the joint between the adhesive portion 131 and the trench structure 511.

Specifically, as shown in FIG. 11, in this embodiment, the trench structure 511 has a first inner wall surface 511a, a bottom surface 511b, and a second inner wall surface 511c that are connected in sequence. The adhesive portion 131 has an inner contact surface 131c, a contact surface 131a, and an outer surface 131b connected in sequence, respectively abutting the first inner wall surface 511a, the bottom surface 511b, and the second inner wall surface 511c of the trench structure 511, and preferably The inner contact surface 131c and the outer contact surface 131b are perpendicular to the contact surface 131a, respectively. The adhesive layer 160 is adhered between the inner contact surface 131c and the first inner wall surface 511a, between the contact surface 131a and the bottom surface 511b, and between the outer contact surface 131b and the second inner wall surface 511c.

As can be seen from the foregoing structural configuration, in the image module 500 of the present embodiment, the circuit board 510 is provided with a groove structure 511 that can be embedded with the adhesive portion 131 of the lens holder 130, so the assembly can be assisted during the assembly process The person quickly positions the mirror base 130 on the circuit board 510 by the inner edge of the trench structure 511. In addition, the groove structure 511 can increase the contact area between the circuit board 510 and the adhesive portion 131 of the lens holder 130, and thus can increase the adhesion area between the adhesive layer 160 and the circuit board 510 and the lens holder 130. The mirror base 130 is effectively prevented from being separated from the circuit board 510.

As shown in FIG. 9 again, the groove structure 511 of this embodiment is a closed annular groove structure, and is suitable for embedding all the adhesive parts 131 of the lens holder 130, but the invention is not limited to this. It may also be a strip-shaped groove structure embedded only with a part of the adhesion part 131. In some embodiments, the trench structure 511 of this embodiment may also be a non-closed trench structure. For example, the circuit board 510 may only have two groove structures 511 located on two opposite sides of the lens holder 130, respectively, and suitable for embedding two opposite adhesive parts 131 of the lens holder 130 (that is, the two The length of the downward extension of the relative adhesive portion 131 is greater than that of the other adhesive portions 131), which can also achieve the purpose of positioning the mirror base 130 on the circuit board 510 quickly.

Please refer to FIG. 12, which is a partially enlarged view illustrating a lens holder 630 and a circuit board 510 according to another embodiment of the present invention. As shown in FIG. 12, in this embodiment, the trench structure 511 has a first inner wall surface 511a, a bottom surface 511b, and a second inner wall surface 511c that are sequentially connected. The adhesive portion 631 of the lens holder 630 has a first abutting surface 631a, a first turning surface 631b, a second abutting surface 631c and a second turning surface 631d connected in sequence, and the second turning surface 631d is connected back to the first Abutting surface 631a. The first abutting surface 631a, the first turning surface 631b, the second abutting surface 631c and the second turning surface 631d abut the surface 510a of the circuit board 510 and the first inner wall surface 511a, the bottom surface 511b and the first Two inner wall surfaces 511c. The adhesive layer 160 is bonded between the first contact surface 631a and the surface 510a, between the first turning surface 631b and the first inner wall surface 511a, between the second contact surface 631c and the bottom surface 511b, and the second turning surface 631d and Between the second inner wall surfaces 511c.

It can be seen from the foregoing structural configuration that, compared with the embodiment shown in FIG. 11, the adhesive portion 631 of the lens holder 630 of this embodiment has more surfaces that can abut against the circuit board 510, so the adhesive can be further increased The layer 160 is bonded to the bonding area between the circuit board 510 and the lens holder 630, and this structural configuration is suitable for application to the thicker bonding portion 631.

In some embodiments, the adhesive portion 631 may be modified without omitting the first abutting surface 631a on the left side, so that the modified adhesive portion 631 is similar in shape to the adhesive portion 231 shown in FIG. 4. In some embodiments, the adhesive portion 631 may be modified without omitting the first abutment surface 631a on the right side, so that the modified adhesive portion 631 is similar in appearance to the adhesive portion 431 shown in FIG. 8.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that in the image module of the present invention, the circuit board is provided with an embedding structure that can be engaged with the adhesive portion of the lens holder, so During the assembly process, the assembly personnel can be assisted to quickly position the lens holder on the circuit board. Moreover, the embedding structure can increase the contact area between the adhesive part of the circuit board and the lens holder, so the adhesion area between the circuit board and the lens holder can be increased, which can effectively prevent the lens holder from detaching from the circuit board .

Although the present invention has been disclosed as above in an embodiment, it is not intended to limit the present invention. Any person skilled in this art can make various modifications and retouching without departing from the spirit and scope of the present invention, so the protection of the present invention The scope shall be determined by the scope of the attached patent application.

110‧‧‧ circuit board

110a‧‧‧Surface

111‧‧‧Concave structure

111a‧‧‧Inner wall

111b‧‧‧Bottom

130‧‧‧Mirror holder

131‧‧‧ Adhesive Department

131a‧‧‧ abutment surface

131b‧‧‧External surface

160‧‧‧adhesive layer

Claims (10)

An image module includes: a circuit board having a surface and a recessed structure located on the surface; an image sensor disposed in the recessed structure; a mirror mount embedded in the inner edge of the recessed structure, and Covering the image sensor; and an adhesive layer adhered to the joint between the lens holder and the recessed structure. The image module according to claim 1, wherein the recessed structure has an inner wall surface and a bottom surface connected, the image sensor is disposed on the bottom surface, the lens holder includes an adhesive portion, and the adhesive portion It has a contact surface and a circumscribed surface connected to each other, respectively abutting the bottom surface and the inner wall surface, and the adhesive layer is bonded between the contact surface and the bottom surface and between the circumscribed surface and the inner wall surface. The image module according to claim 1, wherein the recessed structure has an inner wall surface and a bottom surface connected, the image sensor is disposed on the bottom surface, the lens holder includes an adhesive portion, and the adhesive portion It has a first abutting surface, a turning surface and a second abutting surface connected in sequence, respectively abutting the bottom surface, the inner wall surface and the surface, and the adhesive layer is bonded to the first abutting surface and Between the bottom surface, between the turning surface and the inner wall surface, and between the second abutment surface and the surface. An image module includes: a circuit board having a surface and a protruding structure located on the surface; An image sensor is disposed on the protruding structure; a mirror base is embedded in the outer edge of the protruding structure and covers the image sensor; and an adhesive layer is adhered to the mirror base and the convex structure The joint between the structures and between the lens base and the surface. The image module according to claim 4, wherein the protruding structure has an outer wall surface and a top surface, the image sensor is disposed on the top surface, and the lens holder includes an adhesive portion, the adhesive The part has a contact surface and an inner contact surface connected to each other, respectively abutting the surface and the outer wall surface, and the adhesive layer is bonded between the contact surface and the surface and between the inner contact surface and the outer wall surface between. The image module according to claim 4, wherein the protruding structure has an outer wall surface and a top surface connected to each other, the image sensor is disposed on the top surface, and the lens holder includes an adhesive part, the The adhesive part has a first abutting surface, a turning surface and a second abutting surface connected in sequence, respectively abutting the top surface, the outer wall surface and the surface, and the adhesive layer is bonded to the first Between the abutment surface and the top surface, between the turning surface and the outer wall surface, and between the second abutment surface and the surface. An image module includes: a circuit board having a surface and a ring-shaped groove structure located on the surface; an image sensor disposed on the surface; and a mirror holder disposed on the surface and covering the surface Image sensor It includes an adhesive part, which is embedded in the inner edge of the ring-shaped trench structure; and an adhesive layer, which is bonded to the embedded part between the adhesive part and the ring-shaped trench structure. The image module according to claim 7, wherein the annular groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence, and the adhesive portion has one The inner joint surface, an abutting surface and an outer joint surface respectively abut against the first inner wall surface, the bottom surface and the second inner wall surface, and the adhesive layer is bonded between the inner joint surface and the first inner wall surface , Between the contact surface and the bottom surface and between the circumscribed surface and the second inner wall surface. The image module according to claim 7, wherein the annular groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence, and the adhesive portion has one The first abutting surface, a first turning surface, a second abutting surface and a second turning surface, respectively abut the surface, the first inner wall surface, the bottom surface and the second inner wall surface, and the adhesive The layer is bonded between the first abutting surface and the surface, between the first turning surface and the first inner wall surface, between the second contacting surface and the bottom surface, and between the second turning surface and the second surface Between the inner wall surface. The image module according to claim 7, wherein the annular groove structure has a first inner wall surface, a bottom surface, and a second inner wall surface connected in sequence, and the adhesive portion has one The first abutting surface, a second turning surface, a second abutting surface and a first turning surface, respectively abut the surface, the second inner wall surface, the bottom surface and the first inner wall surface, and the adhesive Layer bonding Between the first abutting surface and the surface, between the second turning surface and the second inner wall surface, between the second contacting surface and the bottom surface, and between the first turning surface and the first inner wall surface between.

Images