TW201906186A - Solar battery cell and solar battery module - Google Patents
Solar battery cell and solar battery module Download PDFInfo
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- TW201906186A TW201906186A TW107112729A TW107112729A TW201906186A TW 201906186 A TW201906186 A TW 201906186A TW 107112729 A TW107112729 A TW 107112729A TW 107112729 A TW107112729 A TW 107112729A TW 201906186 A TW201906186 A TW 201906186A
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- end portion
- light
- electrode
- solar battery
- receiving surface
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- 239000000758 substrate Substances 0.000 claims abstract description 159
- 239000004065 semiconductor Substances 0.000 claims abstract description 150
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 91
- 239000010410 layer Substances 0.000 description 34
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 31
- 229910052709 silver Inorganic materials 0.000 description 31
- 239000004332 silver Substances 0.000 description 31
- 238000009792 diffusion process Methods 0.000 description 25
- 239000012535 impurity Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 23
- 239000011295 pitch Substances 0.000 description 23
- 239000007772 electrode material Substances 0.000 description 22
- 238000005452 bending Methods 0.000 description 21
- 239000002003 electrode paste Substances 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 19
- 239000011521 glass Substances 0.000 description 14
- 238000010304 firing Methods 0.000 description 12
- 238000005476 soldering Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000003566 sealing material Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910052732 germanium Inorganic materials 0.000 description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000004575 stone Substances 0.000 description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 4
- 229910052707 ruthenium Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001392 phosphorus oxide Inorganic materials 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- VSAISIQCTGDGPU-UHFFFAOYSA-N tetraphosphorus hexaoxide Chemical compound O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Photovoltaic Devices (AREA)
Abstract
Description
本發明係關於以引線連接構成太陽電池模組的太陽電池單元以及使用此太陽電池單元的太陽電池模組。 The present invention relates to a solar battery unit that constitutes a solar battery module by wire bonding, and a solar battery module using the solar battery unit.
模組化太陽電池單元之際,電氣串聯連接複數的太陽電池單元,在取出電輸出的目標下,平角銅線構成的引線以焊接接合至各太陽電池單元。引線,通常直接在焊接之後從高溫狀態冷卻至常溫之際收縮。於是,引線在焊接之後的太陽電池單元中,由於引線的收縮產生彎曲。此太陽電池單元的彎曲,成為太陽電池單元的破損原因。 When the solar cell unit is modularized, a plurality of solar cell units are electrically connected in series, and a lead wire made of a rectangular copper wire is soldered to each solar cell unit under the target of taking out the electric output. The lead wire is usually shrunk directly after cooling from a high temperature state to a normal temperature after soldering. Thus, in the solar cell after soldering, the lead is bent due to shrinkage of the lead. The bending of the solar cell unit causes damage to the solar cell unit.
在太陽電池單元的受光面與背面,配置用以取出太陽電池單元中發生的電的柵電極以及從全部的柵電極收集電的匯流排電極。柵電極,為了使太陽電池單元的發電面積提高,增進細線化與多數量化。另一方面,匯流排電極,因為太陽電池單元與引線的接合強度的確保以及配置精度的關係,細線化有困難。又,因為柵電極與匯流排電極形成時的熱處理使發電層產生損壞,使太陽電池單元的發電效率下降,電極材料中必須使用高價銀再加上盡量降低其面積。 On the light-receiving surface and the back surface of the solar cell, a gate electrode for taking out electricity generated in the solar cell and a bus bar electrode for collecting electricity from all the gate electrodes are disposed. In order to increase the power generation area of the solar cell, the gate electrode is improved in thinning and majority quantization. On the other hand, the bus bar electrode has difficulty in thinning due to the relationship between the bonding strength of the solar cell and the lead wire and the arrangement accuracy. Further, since the heat treatment at the time of forming the gate electrode and the bus bar electrode causes damage to the power generation layer, the power generation efficiency of the solar cell unit is lowered, and high-priced silver must be used in the electrode material plus the area as much as possible.
專利文件1中揭示,半導體基板的主面上形成的匯流排(bus bar)部,沿著上述匯流排部的長邊方向部分具有配 置複數細縫的細縫部,以網版印刷法印刷電極膏。根據專利文件1的技術,維持匯流排電極與引線的良好接合強度的同時,可以使匯流排電極的面積降低,但不能解決關於引線接合後產生的太陽電池單元的彎曲。 According to Patent Document 1, a bus bar portion formed on a main surface of a semiconductor substrate has a slit portion in which a plurality of slits are arranged along a longitudinal direction portion of the bus bar portion, and the electrode paste is printed by a screen printing method. . According to the technique of Patent Document 1, while maintaining the good bonding strength between the bus bar electrode and the lead wire, the area of the bus bar electrode can be reduced, but the bending of the solar cell unit generated after the wire bonding can not be solved.
另一方面,關於太陽電池單元的背面,為了與受光面同樣與背面引線接合,需要匯流排電極,但因為直線狀配置的匯流排電極中需要大量電極材料,故研討配置不是直線狀的形狀而是島狀的接合電極。 On the other hand, in the back surface of the solar battery cell, the bus bar electrode is required to be bonded to the back surface wire in the same manner as the light receiving surface. However, since a large amount of electrode material is required in the bus bar electrode arranged in a straight line, the arrangement is not linear. It is an island-shaped joint electrode.
[專利文件1]專利第4284368號公報 [Patent Document 1] Patent No. 4284368
但是,近年來,太陽電池單元中使用的矽基板厚度逐年減少,可想得到今後也會繼續減少。因為太陽電池模組製造步驟中會產生起因於引線與太陽電池單元的熱膨脹係數的差而導致的彎曲,故必須降低模組製造步驟中的彎曲。於是,此彎曲的發生,矽基板的厚度越薄越顯著。 However, in recent years, the thickness of the ruthenium substrate used in the solar cell unit has been decreasing year by year, and it is expected to continue to decrease in the future. Since the bending due to the difference in thermal expansion coefficient between the lead and the solar cell unit occurs in the manufacturing process of the solar cell module, it is necessary to reduce the bending in the module manufacturing step. Thus, the occurrence of this bending is more pronounced as the thickness of the ruthenium substrate is thinner.
本發明,有鑑於上述而形成,目的在於得到可抑制起因於對太陽電池單元的引線接合的太陽電池單元彎曲的太陽電池單元。 The present invention has been made in view of the above, and an object thereof is to provide a solar battery cell capable of suppressing bending of a solar battery cell caused by wire bonding of a solar battery cell.
為了解決上述的課題,達到目的,本發明包括半導體基板,具有pn接合;受光面匯流排電極,在半導體基板 中的受光面側往第1方向延伸設置;以及複數的背面連接電極,在面向半導體基板中的受光面的相反側的背面側,沿著第1方向分散配置設置。受光面匯流排電極,沿著第1方向設置往受光面匯流排電極的厚度方向貫通的複數的貫通孔,背面連接電極,配置在半導體基板的厚度方向中相對受光面匯流排電極中除了複數的貫通孔之外的區域的位置上。 In order to solve the above problems, the present invention includes a semiconductor substrate having a pn junction, a light-receiving surface bus bar electrode extending in a first direction on a light-receiving surface side of the semiconductor substrate, and a plurality of back-side connecting electrodes facing the semiconductor The back side of the substrate on the opposite side to the light receiving surface is disposed to be dispersed along the first direction. The light-receiving surface bus bar electrode is provided with a plurality of through holes penetrating in the thickness direction of the light-receiving surface bus bar electrode in the first direction, and the back surface is connected to the electrode, and is disposed in the thickness direction of the semiconductor substrate in the thickness direction of the light-receiving surface bus bar electrode. The position of the area outside the through hole.
根據本發明的太陽電池單元,達到可抑制起因於對太陽電池單元的引線接合的太陽電池單元彎曲之效果。 According to the solar cell of the present invention, the effect of suppressing the bending of the solar cell unit caused by the wire bonding of the solar cell unit can be suppressed.
1、11‧‧‧半導體基板 1, 11‧‧‧ semiconductor substrate
2‧‧‧n型不純物擴散層 2‧‧‧n type impurity diffusion layer
3‧‧‧反射防止膜 3‧‧‧Anti-reflection film
4‧‧‧BSF層(背面電場層) 4‧‧‧BSF layer (back surface electric field layer)
10、110、210‧‧‧太陽電池單元 10, 110, 210‧‧‧ solar battery unit
11A‧‧‧受光面 11A‧‧‧Glossy surface
11B‧‧‧背面 11B‧‧‧Back
12、112、212‧‧‧受光面電極 12, 112, 212‧‧‧ light-receiving electrodes
12a‧‧‧銀電極膏 12a‧‧‧ Silver electrode paste
12B、112B、212B‧‧‧受光面匯流排電極 12B, 112B, 212B‧‧‧ light-receiving busbar electrodes
12Ba‧‧‧受光面匯流排電極的側面 12Ba‧‧‧Side side of the light-receiving busbar electrode
12G‧‧‧受光面柵電極 12G‧‧‧Glossy gate electrode
13、113、213‧‧‧背面電極 13, 113, 213‧‧‧ back electrode
13A‧‧‧背面集電電極 13A‧‧‧Back collector electrode
13B、113B、213B‧‧‧背面連接電極 13B, 113B, 213B‧‧‧ back connection electrode
1131~1138‧‧‧背面連接電極 1131~1138‧‧‧ back connection electrode
13a‧‧‧鋁電極膏 13a‧‧‧Aluminum electrode paste
13b‧‧‧銀電極膏 13b‧‧‧ Silver electrode paste
20‧‧‧引線 20‧‧‧ lead
20a‧‧‧彎曲部 20a‧‧‧Bend
20b‧‧‧引線在橫向方向的側面 20b‧‧‧The side of the lead in the lateral direction
25‧‧‧橫引線 25‧‧‧ horizontal lead
26‧‧‧輸出引線 26‧‧‧Output leads
31‧‧‧受光面保護部 31‧‧‧Glossy Surface Protection Department
32‧‧‧背面保護部 32‧‧‧Back Protection Department
33‧‧‧受光面側密封材 33‧‧‧Lighted side sealing material
34‧‧‧背面側密封材 34‧‧‧Back side sealing material
40‧‧‧框架 40‧‧‧Frame
50‧‧‧太陽電池串 50‧‧‧Sun battery string
60‧‧‧貫通孔 60‧‧‧through holes
61、611~618‧‧‧第1區域 61, 611~618‧‧‧1st area
62‧‧‧第2區域 62‧‧‧2nd area
63‧‧‧連接部 63‧‧‧Connecting Department
63a‧‧‧連接部的外側的側面 63a‧‧‧Side side of the joint
70‧‧‧太陽電池陣列 70‧‧‧Solar battery array
100‧‧‧太陽電池模組 100‧‧‧Solar battery module
101‧‧‧一端 101‧‧‧End
102‧‧‧另一端 102‧‧‧The other end
A1~A8‧‧‧第1區域長度 A1~A8‧‧‧1st area length
B1~B9‧‧‧距離 B1~B9‧‧‧Distance
C1~C8‧‧‧背面連接電極長度 C1~C8‧‧‧ back connection electrode length
D1~D9‧‧‧距離 D1~D9‧‧‧Distance
[第1圖]係從受光面側所見本發明第一實施形態的太陽電池模組之立體圖;[第2圖]係從受光面側所見本發明第一實施形態的太陽電池模組之分解立體圖;[第3圖]係本發明第一實施形態的太陽電池模組之主要部分剖面圖;[第4圖]係從背面側所見本發明第一實施形態的太陽電池陣列之立體圖;[第5圖]係從受光面側所見本發明第一實施形態的太陽電池串之立體圖;[第6圖]係從背面側所見本發明第一實施形態的太陽電池串之立體圖;[第7圖]係從受光面側所見本發明第一實施形態的太陽電 池單元之平面圖;[第8圖]係從面向受光面側的相反側的背面側所見本發明第一實施形態的太陽電池單元之平面圖;[第9圖]係顯示本發明第一實施形態的太陽電池單元的構成之剖面圖,係第7圖中的IX-IX線中的主要部分剖面圖;[第10圖]係顯示本發明第一實施形態的太陽電池單元的構成之剖面圖,係第7圖中的X-X線中的主要部分剖面圖;[第11圖]係顯示本發明第一實施形態的太陽電池單元的受光面匯流排電極形狀之平面圖;[第12圖]係顯示本發明第一實施形態的太陽電池單元的受光面匯流排電極上焊接引線的狀態之平面圖;[第13圖]係顯示本發明第一實施形態的太陽電池單元的構成之剖面圖,係第12圖中的XIII-XIII線中的主要部分剖面圖;[第14圖]係顯示本發明第一實施形態的太陽電池單元的構成之剖面圖,係第12圖中的XIV-XIV線中的主要部分剖面圖;[第15圖]係說明本發明第一實施形態的太陽電池單元的製造步驟的程序;[第16圖]係顯示本發明第一實施形態的太陽電池單元的製造步驟的主要部分剖面圖;[第17圖]係顯示本發明第一實施形態的太陽電池單元的製造步驟的主要部分剖面圖;[第18圖]係顯示本發明第一實施形態的太陽電池單元的製造步驟的主要部分剖面圖;[第19圖]係顯示本發明第一實施形態的太陽電池單元的 製造步驟的主要部分剖面圖;[第20圖]係顯示本發明第一實施形態的太陽電池單元的製造步驟的主要部分剖面圖;[第21圖]係顯示本發明第一實施形態的太陽電池單元的製造步驟的主要部分剖面圖;[第22圖]係顯示本發明第一實施形態的太陽電池單元的製造步驟的主要部分剖面圖;[第23圖]係說明本發明第一實施形態的太陽電池模組的製造方法的程序;[第24圖]係從受光面側所見本發明第二實施形態的太陽電池單元之平面圖;[第25圖]係從面向受光面側的相反側的背面側所見本發明第二實施形態的太陽電池單元之平面圖;[第26圖]係顯示本發明第二實施形態的太陽電池模組的構成之主要部分剖面圖;[第27圖]係顯示本發明第二實施形態的太陽電池單元的受光面電極的構成條件圖;[第28圖]係顯示本發明第二實施形態的太陽電池單元的背面連接電極的構成條件圖;[第29圖]係本發明第三實施形態的太陽電池單元構成的剖面圖;[第30圖]係顯示本發明第三實施形態的太陽電池單元的受光面電極的構成條件圖;以及[第31圖]係顯示本發明第三實施形態的太陽電池單元的 背面連接電極的構成條件圖。 [Fig. 1] is a perspective view of a solar battery module according to a first embodiment of the present invention as seen from the light receiving surface side. [Fig. 2] is an exploded perspective view of the solar battery module according to the first embodiment of the present invention as seen from the light receiving surface side. [Fig. 3] is a cross-sectional view of a main portion of a solar cell module according to a first embodiment of the present invention; [Fig. 4] is a perspective view of a solar cell array according to the first embodiment of the present invention as seen from the back side; [5th] Fig. 6 is a perspective view of a solar battery string according to a first embodiment of the present invention as seen from the side of the light receiving surface; [Fig. 6] is a perspective view of the solar battery string according to the first embodiment of the present invention as seen from the back side; [Fig. 7] A plan view of the solar battery cell according to the first embodiment of the present invention as seen from the side of the light receiving surface; [Fig. 8] is a plan view of the solar battery cell according to the first embodiment of the present invention as seen from the back side facing the side opposite to the light receiving surface side; Fig. 9 is a cross-sectional view showing a configuration of a solar battery cell according to a first embodiment of the present invention, which is a cross-sectional view of a main portion taken along line IX-IX in Fig. 7; [Fig. 10] shows the first aspect of the present invention. Embodiment of the solar cell unit The cross-sectional view of the main portion in the XX line in Fig. 7; [Fig. 11] is a plan view showing the shape of the light-receiving surface bus bar electrode of the solar cell unit according to the first embodiment of the present invention; Fig. 1 is a plan view showing a state in which a lead is welded to a light-receiving surface bus bar electrode of a solar battery cell according to the first embodiment of the present invention; and Fig. 13 is a cross-sectional view showing a configuration of a solar battery cell according to the first embodiment of the present invention. FIG. 14 is a cross-sectional view showing a main portion of the solar cell unit according to the first embodiment of the present invention, and FIG. 14 is a cross-sectional view showing the configuration of the solar cell according to the first embodiment of the present invention, which is the XIV-XIV in FIG. The cross-sectional view of the main part of the line; [Fig. 15] is a procedure for explaining the manufacturing steps of the solar cell according to the first embodiment of the present invention; [Fig. 16] shows the manufacture of the solar cell of the first embodiment of the present invention. [section 17] is a cross-sectional view showing a main part of a manufacturing process of a solar battery cell according to a first embodiment of the present invention; and [18] is a solar battery cell according to a first embodiment of the present invention. of [Fig. 19] is a cross-sectional view showing a main part of a manufacturing process of a solar cell according to a first embodiment of the present invention; [Fig. 20] shows a solar cell according to a first embodiment of the present invention. A cross-sectional view of a main part of a manufacturing process of a unit; [21] is a cross-sectional view showing a main part of a manufacturing process of a solar cell according to a first embodiment of the present invention; [Fig. 22] shows a first embodiment of the present invention. A cross-sectional view of a main part of a manufacturing process of a solar cell; [Fig. 23] is a program for explaining a method of manufacturing a solar cell module according to the first embodiment of the present invention; [Fig. 24] is a view of the present invention as seen from the side of a light receiving surface A plan view of a solar battery cell according to a second embodiment of the present invention; [Fig. 25] is a plan view of a solar battery cell according to a second embodiment of the present invention as seen from the back side facing the light-receiving surface side; [Fig. 26] shows the present invention A cross-sectional view of a configuration of a solar cell module according to a second embodiment of the present invention; [FIG. 27] FIG. 27 is a view showing a configuration condition of a light-receiving surface electrode of a solar cell according to a second embodiment of the present invention. [FIG. 28] FIG. 29 is a cross-sectional view showing a configuration of a solar cell of a third embodiment of the present invention; [30th] FIG. 4 is a view showing a configuration condition of a light-receiving surface electrode of a solar battery cell according to a third embodiment of the present invention; and FIG. 31 is a view showing a configuration condition of a back surface connection electrode of a solar battery cell according to a third embodiment of the present invention.
以下,根據圖面詳細說明本發明的實施形態的太陽電池單元以及太陽電池模組。又,並非以此實施形態限定此發明。 Hereinafter, the solar battery cell and the solar battery module according to the embodiment of the present invention will be described in detail based on the drawings. Further, the invention is not limited by this embodiment.
第1圖係從受光面側所見本發明第一實施形態的太陽電池模組100之立體圖。第2圖係從受光面側所見本發明第一實施形態的太陽電池模組100之分解立體圖。第3圖係本發明第一實施形態的太陽電池模組100之主要部分剖面圖。第一實施形態的太陽電池模組100,如第1到3圖所示,太陽電池陣列70中的受光面側以受光面側密封材33以及受光面保護部31覆蓋,面向太陽電池陣列70中的受光面的相反側的背面側以背面側密封材34及背面保護部32覆蓋的同時,外周緣部的周圍以補強用的框架40圍繞。 Fig. 1 is a perspective view of the solar battery module 100 according to the first embodiment of the present invention as seen from the side of the light receiving surface. Fig. 2 is an exploded perspective view of the solar battery module 100 according to the first embodiment of the present invention as seen from the side of the light receiving surface. Fig. 3 is a cross-sectional view showing the essential part of a solar battery module 100 according to the first embodiment of the present invention. In the solar battery module 100 of the first embodiment, as shown in FIGS. 1 to 3, the light-receiving surface side of the solar cell array 70 is covered by the light-receiving surface side sealing material 33 and the light-receiving surface protection portion 31, and faces the solar cell array 70. The back side of the opposite side of the light receiving surface is covered by the back side sealing material 34 and the back surface protecting portion 32, and the periphery of the outer peripheral edge portion is surrounded by the reinforcing frame 40.
第4圖係從背面側所見本發明第一實施形態的太陽電池陣列70之立體圖。第5圖係從受光面側所見本發明第一實施形態的太陽電池串50之立體圖。第6圖係從背面側所見本發明第一實施形態的太陽電池串50之立體圖。 Fig. 4 is a perspective view of the solar cell array 70 according to the first embodiment of the present invention as seen from the back side. Fig. 5 is a perspective view of the solar battery string 50 according to the first embodiment of the present invention as seen from the side of the light receiving surface. Fig. 6 is a perspective view of the solar battery string 50 according to the first embodiment of the present invention as seen from the back side.
如第4圖所示,太陽電池陣列70,構成為以橫引線25以及輸出引線26電氣及機械串聯或並聯接合複數的太陽電池串50。 As shown in FIG. 4, the solar cell array 70 is configured to electrically and mechanically connect a plurality of solar cell strings 50 in series and in parallel with the horizontal lead 25 and the output lead 26.
又,如第3到6圖所示,太陽電池串50,構成為以引線20電氣及機械串聯互相連接相鄰配置呈現四角形狀的複數的太陽電池單元10。複數的太陽電池單元10,如第3到6 圖所示,以引線20,往第1方向的圖中X方向串聯連接。第1方向,係以引線20連接的複數的太陽電池單元10的連結方向。 Further, as shown in FIGS. 3 to 6, the solar battery string 50 is configured such that the lead wires 20 are electrically and mechanically connected in series to each other to form a plurality of solar battery cells 10 having a quadrangular shape. The plurality of solar battery cells 10, as shown in Figs. 3 to 6, are connected in series by the lead wires 20 in the X direction in the drawing in the first direction. The first direction is a connection direction of a plurality of solar battery cells 10 connected by leads 20.
太陽電池串50中,相鄰的2個太陽電池單元10中一方的太陽電池單元10的第1主面的受光面側形成的電極與相鄰的2個太陽電池單元10中另一方的太陽電池單元10的第2主面的背面側形成的電極,交互以引線20連接。於是,引線20的一端側焊接至後述的太陽電池單元10的背面側形成的背面連接電極13B,另一端側焊接至鄰接的太陽電池單元10的受光面側形成的受光面匯流排電極12B。即,與太陽電池單元10的受光面側形成的受光面匯流排電極12B連接的引線20,由於連接至鄰接的太陽電池單元10的背面側形成的背面連接電極13B,串聯連接複數的太陽電池單元10。 In the solar battery string 50, the electrode formed on the light-receiving surface side of the first main surface of one of the adjacent two solar battery cells 10 and the other solar battery of the adjacent two solar battery cells 10 The electrodes formed on the back side of the second main surface of the unit 10 are alternately connected by a lead wire 20. Then, one end side of the lead wire 20 is welded to the back surface connection electrode 13B formed on the back surface side of the solar battery cell 10 to be described later, and the other end side is welded to the light-receiving surface bus bar electrode 12B formed on the light-receiving surface side of the adjacent solar battery cell 10. In other words, the lead wire 20 connected to the light-receiving surface bus bar electrode 12B formed on the light-receiving surface side of the solar battery cell 10 is connected to the back surface connecting electrode 13B formed on the back side of the adjacent solar battery cell 10, and a plurality of solar battery cells are connected in series. 10.
第7圖係從受光面側所見本發明第一實施形態的太陽電池單元10之平面圖。第8圖係從面向受光面側的相反側的背面側所見本發明第一實施形態的太陽電池單元10之平面圖。第9圖係顯示本發明第一實施形態的太陽電池單元10的構成之剖面圖,係第7圖中的IX-IX線中的主要部分剖面圖。第10圖係顯示本發明第一實施形態的太陽電池單元10的構成之剖面圖,係第7圖中的X-X線中的主要部分剖面圖。又,第9及10圖中,同時顯示連接至太陽電池單元10的引線20。 Fig. 7 is a plan view showing the solar battery cell 10 of the first embodiment of the present invention as seen from the side of the light receiving surface. Fig. 8 is a plan view showing the solar battery cell 10 according to the first embodiment of the present invention as seen from the back side facing the side opposite to the light receiving surface side. Fig. 9 is a cross-sectional view showing the configuration of a solar cell unit 10 according to the first embodiment of the present invention, and is a cross-sectional view of a principal part taken along line IX-IX in Fig. 7. Fig. 10 is a cross-sectional view showing the configuration of a solar cell unit 10 according to the first embodiment of the present invention, and is a cross-sectional view of a principal part taken along line X-X in Fig. 7. Further, in the ninth and tenth drawings, the lead wires 20 connected to the solar battery cells 10 are simultaneously displayed.
太陽電池單元10,包括半導體基板11,呈現形成不純物擴散層而構成pn接合的四角形狀。即,太陽電池單元10中,第1導電型的p型矽構成的半導體基板1的表面的受光面側,形成利用磷擴散擴散n型不純物的不純物擴散層之n型 不純物擴散層2。n型不純物擴散層2在半導體基板11的受光面11A側形成。半導體基板11的外形,在半導體基板11的面方向具有正方形狀,即長方形狀。 The solar cell unit 10, including the semiconductor substrate 11, exhibits a quadrangular shape in which an impurity diffusion layer is formed to constitute a pn junction. In the solar cell unit 10, on the light-receiving surface side of the surface of the semiconductor substrate 1 composed of the p-type ytterbium of the first conductivity type, an n-type impurity diffusion layer 2 in which an impurity diffusion layer of an n-type impurity is diffused and diffused by phosphorus is formed. The n-type impurity diffusion layer 2 is formed on the light-receiving surface 11A side of the semiconductor substrate 11. The outer shape of the semiconductor substrate 11 has a square shape in the surface direction of the semiconductor substrate 11, that is, a rectangular shape.
太陽電池單元10,在半導體基板11的第1主面即半導體基板的受光面11A側,為了提高光的集光率,利用紋理浸蝕(texture etching)形成凹凸形狀。即,半導體基板11的表面上,形成微小凹凸作為紋理構造。微小凹凸,增加受光面11A中吸收來自外部的光的面積,抑制受光面11A中的反射率,成為關入光的構造。又,第9及10圖中,方便起見,省略微小凹凸的圖示。又,太陽電池單元10,在半導體基板11的第1主面即半導體基板的受光面11A側,形成以氮矽化膜構成的反射防止膜3。 In the solar cell unit 10, on the light-receiving surface 11A side of the semiconductor substrate, which is the first main surface of the semiconductor substrate 11, in order to increase the light collection ratio of the light, the uneven shape is formed by texture etching. That is, on the surface of the semiconductor substrate 11, minute irregularities are formed as a texture structure. The fine unevenness increases the area of the light-receiving surface 11A that absorbs light from the outside, suppresses the reflectance in the light-receiving surface 11A, and becomes a structure that turns off light. Further, in the figures 9 and 10, for the sake of convenience, the illustration of the fine unevenness is omitted. In the solar cell unit 10, an anti-reflection film 3 made of a nitrogen-deposited film is formed on the light-receiving surface 11A side of the semiconductor substrate, which is the first main surface of the semiconductor substrate 11.
半導體基板1中,可以使用p型單結晶矽基板或p型多結晶矽基板。又,不限定半導體基板1於此,使用n型單結晶矽基板、n型多結晶矽基板或其它的矽系基板也可以。又,反射防止膜3中,使用氮氧化膜也可以。 In the semiconductor substrate 1, a p-type single crystal germanium substrate or a p-type polycrystalline germanium substrate can be used. Further, the semiconductor substrate 1 is not limited thereto, and an n-type single crystal germanium substrate, an n-type polycrystalline germanium substrate, or another germanium-based substrate may be used. Further, in the anti-reflection film 3, an oxynitride film may be used.
又,太陽電池單元10,在半導體基板的受光面11A側形成受光面電極12,在半導體基板11的第2主面即半導體基板的背面11B側形成背面電極13。 In the solar cell unit 10, the light-receiving surface electrode 12 is formed on the light-receiving surface 11A side of the semiconductor substrate, and the back surface electrode 13 is formed on the second main surface of the semiconductor substrate 11, that is, the back surface 11B side of the semiconductor substrate.
半導體基板1的受光面側,設置上述的受光面電極12穿過反射防止膜3電氣連接至n型不純物擴散層2。作為受光面電極12,在半導體基板11的受光面11A的面內方向排列設置複數長的細長受光面柵電極12G。受光面柵電極12G,係用以從半導體基板11的受光面11A側收集以太陽電池單元10發電的光電流之電極。受光面柵電極12G,在底面部電氣連接 至n型不純物擴散層2。受光面柵電極12G,係在所希望的範圍內塗佈具有金屬粒子的導電性膏材再燒成而形成的膏電極。 On the light-receiving surface side of the semiconductor substrate 1, the above-described light-receiving surface electrode 12 is electrically connected to the n-type impurity diffusion layer 2 through the anti-reflection film 3. As the light-receiving surface electrode 12, a plurality of elongated elongated light-receiving surface gate electrodes 12G are arranged in the in-plane direction of the light-receiving surface 11A of the semiconductor substrate 11. The light-receiving surface gate electrode 12G is an electrode for collecting photocurrent generated by the solar cell unit 10 from the light-receiving surface 11A side of the semiconductor substrate 11. The light-receiving surface gate electrode 12G is electrically connected to the n-type impurity diffusion layer 2 at the bottom surface portion. The light-receiving surface gate electrode 12G is a paste electrode formed by applying a conductive paste having metal particles and firing it in a desired range.
又,與受光面柵電極12G導通的受光面匯流排電極12B,設置為在半導體基板11的受光面11A的面內方向與受光面柵電極12G直交。受光面匯流排電極12B,如第7圖所示,沿著太陽電池單元10的連結方向的第1方向,遍及太陽電池單元10的大致全長線狀設置成4列。即,受光面匯流排電極12B的長邊方向,係與上述第1方向相同的方向,並以引線20連接的複數的太陽電池單元10的連結方向。又,受光面匯流排電極12B的排列方向,在半導體基板11的面內形成與第1方向直交的第2方向相同的方向。受光面匯流排電極12B,設置為與全部的受光面柵電極12G連接。受光面匯流排電極12B,在底面部電氣連接n型不純物擴散層2。又,方便起見,第1、2、4及5圖中,顯示設置2列受光面匯流排電極12B的情況。 In addition, the light-receiving surface bus bar electrode 12B that is electrically connected to the light-receiving surface gate electrode 12G is disposed to be orthogonal to the light-receiving surface gate electrode 12G in the in-plane direction of the light-receiving surface 11A of the semiconductor substrate 11. As shown in FIG. 7, the light-receiving surface bus bar electrode 12B is provided in four rows along the substantially full length of the solar battery cell 10 in the first direction along the connection direction of the solar battery cells 10. In other words, the longitudinal direction of the light-receiving surface bus bar electrode 12B is the same direction as the first direction, and the connection direction of the plurality of solar battery cells 10 connected by the lead wires 20 is obtained. Further, in the direction in which the light-receiving surface bus bar electrodes 12B are arranged, the same direction as the second direction orthogonal to the first direction is formed in the surface of the semiconductor substrate 11. The light-receiving surface bus electrode 12B is provided to be connected to all of the light-receiving surface gate electrodes 12G. The light-receiving surface bus bar electrode 12B electrically connects the n-type impurity diffusion layer 2 to the bottom surface portion. Further, for convenience, in the first, second, fourth, and fifth drawings, the case where two rows of light-receiving surface bus electrodes 12B are provided is shown.
受光面匯流排電極12B,係設置用以聚集受光面柵電極12G收集的光電流,以及用以與引線20電氣接合之電極。受光面匯流排電極12B,係在所希望的範圍內塗佈具有金屬粒子的導電性膏材再燒成而形成的膏電極。對受光面匯流排電極12B,在使用太陽電池單元10製造太陽電池模組100之際,如第9及10圖所示,焊接引線20。又,第9及10圖中,只顯示受光面電極12中受光面匯流排電極12B。 The light-receiving surface bus electrode 12B is provided with an optical current for collecting the light-receiving surface gate electrode 12G and an electrode for electrically bonding with the lead wire 20. The light-receiving surface bus bar electrode 12B is a paste electrode formed by applying a conductive paste having metal particles and firing it in a desired range. When the solar cell module 100 is manufactured using the solar battery cell 10, the lead wire 20 is soldered to the light-receiving surface bus electrode 12B as shown in Figs. Further, in the ninth and tenth drawings, only the light-receiving surface bus bar electrode 12B of the light-receiving surface electrode 12 is displayed.
第11圖係顯示本發明第一實施形態的太陽電池單元10的受光面匯流排電極12B的形狀之平面圖。受光面匯流排電極12B的內側,如第7及11圖所示,往厚度方向貫通受 光面匯流排電極12B的複數的貫通孔60,在太陽電池單元10的面內方向即半導體基板11的面內方向中沿著第1方向設置成間隔踏腳石狀。第7圖中,例如顯示關於沿著第1方向在受光面匯流排電極12B中設置7個貫通孔60之情況。 Fig. 11 is a plan view showing the shape of the light-receiving surface bus bar electrode 12B of the solar cell unit 10 according to the first embodiment of the present invention. As shown in FIGS. 7 and 11 , the inside of the light-receiving surface bus bar electrode 12B penetrates the plurality of through holes 60 of the light-receiving surface bus bar electrode 12B in the thickness direction, and is in the in-plane direction of the solar cell 10 , that is, the surface of the semiconductor substrate 11 . The inner direction is arranged to be spaced apart from the stepping stone shape along the first direction. In the seventh drawing, for example, seven through-holes 60 are provided in the light-receiving surface bus bar electrode 12B along the first direction.
即,受光面匯流排電極12B,在第1方向中,包括不設置貫通孔60的複數的第1區域61以及設置貫通孔60的複數的第2區域62。複數的第1區域61與複數的第2區域62,在受光面匯流排電極12B的伸長方向中,即第1方向中,交互設置。第2區域62中,經由受光面匯流排電極12B的橫向方向中設置在外緣區域的連接部63,在受光面匯流排電極12B的伸長方向中連接相鄰的第1區域61之間。因此,1條受光面匯流排電極12B中的全部第1區域61以及第2區域62電氣連接。 In other words, the light-receiving surface bus bar electrode 12B includes a plurality of first regions 61 in which the through holes 60 are not provided and a plurality of second regions 62 in which the through holes 60 are provided in the first direction. The plurality of first regions 61 and the plurality of second regions 62 are alternately arranged in the first direction of the light-receiving surface bus bar electrode 12B in the extending direction. In the second region 62, the connection portion 63 provided in the outer edge region in the lateral direction of the light-receiving surface bus bar electrode 12B is connected between the adjacent first regions 61 in the extending direction of the light-receiving surface bus bar electrode 12B. Therefore, all of the first region 61 and the second region 62 of one of the light-receiving surface bus electrodes 12B are electrically connected.
又,對受光面匯流排電極12B焊接引線20,主要經由第1區域61與引線20的焊接進行。因此,受光面匯流排電極12B與引線20的焊接面積,近似第1區域61與引線20的焊接面積。 Further, the lead wire 20 is soldered to the light-receiving surface bus bar electrode 12B mainly by soldering the first region 61 and the lead wire 20. Therefore, the welding area of the light-receiving surface bus bar electrode 12B and the lead wire 20 approximates the welding area of the first region 61 and the lead wire 20.
由於受光面匯流排電極12B中設置複數的貫通孔60,可以降低受光面匯流排電極12B中使用的電極材料使用量,可以降低太陽電池單元10的製造成本。 Since a plurality of through holes 60 are provided in the light-receiving surface bus bar electrode 12B, the amount of electrode material used in the light-receiving surface bus bar electrode 12B can be reduced, and the manufacturing cost of the solar cell unit 10 can be reduced.
又,貫通孔60的尺寸以及位置,只要配合後述的背面連接電極13B的尺寸以及位置即可。背面連接電極13B的尺寸以及位置,考慮太陽電池單元10的特性決定。 Moreover, the size and position of the through hole 60 may be a size and a position of a back surface connection electrode 13B to be described later. The size and position of the back surface connection electrode 13B are determined in consideration of the characteristics of the solar battery cell 10.
又,起因於受光面匯流排電極12B中設置複數的貫通孔60而引起受光面匯流排電極12B的電阻增加,可以藉 由增高受光面匯流排電極12B的高度來抑制。 In addition, the resistance of the light-receiving surface bus bar electrode 12B is increased by providing a plurality of through-holes 60 in the light-receiving surface bus bar electrode 12B, and can be suppressed by increasing the height of the light-receiving surface bus bar electrode 12B.
又,受光面匯流排電極12B,如第11圖所示,遍及長邊方向形成相同寬度,第1區域61中的寬度與第2區域62中的寬度相等,而且第2方向中的兩端部,形成往第1方向平行的直線狀。第2方向,在第11圖中對應Y方向。於是,對太陽電池單元10的電極連接引線20製造太陽電池模組100之際,與受光面匯流排電極12B相同寬度的引線20,在第2方向中的位置配合受光面匯流排電極12B重疊在受光面匯流排電極12B上的狀態下,焊接至受光面匯流排電極12B。 Further, as shown in FIG. 11, the light-receiving surface bus bar electrode 12B has the same width in the longitudinal direction, and the width in the first region 61 is equal to the width in the second region 62, and both ends in the second direction. A straight line parallel to the first direction is formed. The second direction corresponds to the Y direction in Fig. 11. Then, when the solar cell module 100 is manufactured for the electrode connection lead 20 of the solar cell unit 10, the lead wire 20 having the same width as the light-receiving surface bus bar electrode 12B is overlapped with the position of the light-receiving surface bus bar electrode 12B in the second direction. The light-receiving surface bus bar electrode 12B is welded to the light-receiving surface bus bar electrode 12B.
第12圖係顯示本發明第一實施形態的太陽電池單元10的受光面匯流排電極12B上焊接引線20的狀態之平面圖。第13圖係顯示本發明第一實施形態的太陽電池單元10的構成之剖面圖,係第12圖中的XIII-XIII線中的主要部分剖面圖。第14圖係顯示本發明第一實施形態的太陽電池單元10的構成之剖面圖,係第12圖中的XIV-XIV線中的主要部分剖面圖。 Fig. 12 is a plan view showing a state in which the lead wires 20 are welded to the light-receiving surface bus bar electrode 12B of the solar battery cell 10 according to the first embodiment of the present invention. Fig. 13 is a cross-sectional view showing the configuration of a solar cell unit 10 according to the first embodiment of the present invention, and is a cross-sectional view of a principal part taken along line XIII-XIII in Fig. 12. Fig. 14 is a cross-sectional view showing the configuration of a solar cell unit 10 according to the first embodiment of the present invention, and is a cross-sectional view of a main portion of the XIV-XIV line in Fig. 12.
如第13及14圖所示,引線20,與受光面匯流排電極12B平行,而且在引線20的橫向方向中與受光面匯流排電極12B重疊的位置,重疊配置在受光面匯流排電極12B上,焊接至受光面匯流排電極12B的上面。即,對受光面匯流排電極12B,在第2方向中,橫向方向中的受光面匯流排電極的側面12Ba上重疊引線在橫向方向的側面20b的狀態下,焊接引線20。焊接至受光面匯流排電極12B的狀態的引線20的長邊方向,與受光面匯流排電極12B的長邊方向相同方向,並與上述的第1方向相同方向,即X方向。焊接至受光面匯流排電極 12B的狀態的引線20的橫向方向,與受光面匯流排電極12B的寬度相同方向,並與上述的第2方向相同方向,即Y方向。 As shown in Figs. 13 and 14, the lead wire 20 is parallel to the light-receiving surface bus bar electrode 12B, and is disposed on the light-receiving surface bus bar electrode 12B at a position overlapping the light-receiving surface bus bar electrode 12B in the lateral direction of the lead wire 20. Soldered to the upper surface of the light-receiving surface bus bar electrode 12B. In other words, in the second surface, the lead surface of the light-receiving surface bus bar electrode 12B is soldered to the side surface 12b of the light-receiving surface bus bar electrode in the lateral direction in the lateral direction of the side surface 20b. The longitudinal direction of the lead 20 in a state of being welded to the light-receiving surface bus bar electrode 12B is the same as the longitudinal direction of the light-receiving surface bus bar electrode 12B, and is the same direction as the above-described first direction, that is, the X direction. The lateral direction of the lead 20 in a state of being welded to the light-receiving surface bus bar electrode 12B is the same as the width of the light-receiving surface bus bar electrode 12B, and is in the same direction as the above-described second direction, that is, the Y direction.
如第12圖所示,引線20,遍及長邊方向相同寬度,以與受光面匯流排電極12B的寬度相同的寬度構成。因此,如第13圖所示,設置貫通孔60的複數的第2區域62中,引線20的寬度,與第2區域62的寬度即第2方向中對向的2個連接部的外側的側面63a間的長度相同尺寸。連接部的外側的側面63a,對應第2區域62中的受光面匯流排電極的側面12Ba。如第14圖所示,沒設置貫通孔60的複數的第1區域61中,引線20的寬度,與第1區域61的寬度即第2方向中的第1區域61的長度相同尺寸。 As shown in Fig. 12, the lead wires 20 have the same width in the longitudinal direction and are formed to have the same width as the width of the light-receiving surface bus bar electrode 12B. Therefore, as shown in Fig. 13, in the second region 62 in which the plurality of through holes 60 are provided, the width of the lead 20 and the width of the second region 62, that is, the side of the outer side of the two connecting portions in the second direction The length between 63a is the same size. The side surface 63a of the outer side of the connecting portion corresponds to the side surface 12Ba of the light-receiving surface bus bar electrode in the second region 62. As shown in Fig. 14, in the first region 61 in which the plurality of through holes 60 are not provided, the width of the lead 20 is the same as the length of the first region 61, that is, the length of the first region 61 in the second direction.
設置貫通孔60的複數的第2區域62中,對受光面匯流排電極12B焊接引線20,係經由受光面匯流排電極12B的橫向方向中設置在外緣區域的連接部63與引線20的焊接,在引線20的橫向方向中的兩端部進行。 In the second region 62 in which the plurality of through holes 60 are provided, the lead wire 20 is soldered to the light receiving surface bus bar electrode 12B, and is soldered to the lead wire 20 via the connection portion 63 provided in the outer edge region in the lateral direction of the light receiving surface bus bar electrode 12B. Both ends of the lead 20 in the lateral direction are performed.
受光面匯流排電極12B的寬度,在0.6mm(毫米)以上、1.2mm以下。受光面柵電極12G的寬度在30μm(微米)以上、80μm(微米)以下。連接部63的寬度,在60μm(微米)以上、160μm(微米)以下。連接部63的寬度,相對於受光面匯流排電極12B的寬度,是1/15以上、1/5以下左右的寬度。受光面匯流排電極12B的寬度是上述範圍時,考慮受光面匯流排電極12B中使用的電極材料使用量降低以及起因於設置貫通孔60的受光面匯流排電極12B的電阻增加等時,連接部63的寬度,最好是受光面匯流排電極12B的寬度的1/10左右的寬度。 The width of the light-receiving surface bus bar electrode 12B is 0.6 mm (mm) or more and 1.2 mm or less. The width of the light-receiving surface gate electrode 12G is 30 μm (micrometers) or more and 80 μm (micrometers) or less. The width of the connecting portion 63 is 60 μm (micrometers) or more and 160 μm (micrometers) or less. The width of the connecting portion 63 is 1/15 or more and 1/5 or less in width with respect to the width of the light-receiving surface bus bar electrode 12B. When the width of the light-receiving surface bus bar electrode 12B is in the above-described range, the connection portion is reduced in consideration of the decrease in the amount of use of the electrode material used in the light-receiving surface bus bar electrode 12B and the increase in the resistance of the light-receiving surface bus bar electrode 12B in which the through-hole 60 is provided. The width of 63 is preferably about 1/10 of the width of the light-receiving surface bus bar electrode 12B.
又,受光面柵電極12G的寬度是上述範圍時,連接部63的寬度,相對於受光面柵電極12G的寬度,是2倍左右的寬度。考慮受光面匯流排電極12B中使用的電極材料使用量降低以及起因於設置貫通孔60的受光面匯流排電極12B的電阻增加等時,連接部63的寬度,雖然也根據受光面匯流排電極12B的高度,但最好是受光面柵電極12G的寬度的2倍左右的寬度。 When the width of the light-receiving surface gate electrode 12G is in the above range, the width of the connecting portion 63 is about twice as large as the width of the light-receiving surface gate electrode 12G. When the amount of use of the electrode material used in the light-receiving surface bus electrode 12B is lowered and the electric resistance of the light-receiving surface bus bar electrode 12B in which the through-hole 60 is provided is increased, the width of the connecting portion 63 is also based on the light-receiving surface bus bar electrode 12B. The height is preferably a width which is about twice the width of the glossy gate electrode 12G.
將受光面柵電極12G的寬度細線化時,細線化受光面柵電極12G的寬度多少就增加多少受光面柵電極12G的條數時,受光量與電極電阻損失在相同的狀態下,載子到達受光面柵電極12G為止,因為流過n型不純物擴散層2的距離變短,n型不純物擴散層2中的電阻損失減少。因此,受光面柵電極12G的寬度的細線化,根據電阻損失的觀點是理想的。但是,受光面柵電極12G的寬度,根據製造上的限制,選擇下限寬度。特別是以廉價的網版印刷形成受光面柵電極12G時,細線化中可形成的受光面柵電極12G的下限寬度以30μm(微米)以上、100μm(微米)以下為界限。 When the width of the light-receiving surface gate electrode 12G is thinned, how much the width of the thinned light-receiving surface-gate electrode 12G increases, and the number of light-receiving surface-gate electrodes 12G increases, and the amount of received light and the electrode resistance loss are in the same state, and the carrier arrives. Since the distance passing through the n-type impurity diffusion layer 2 is shortened by the light-emitting surface gate electrode 12G, the resistance loss in the n-type impurity diffusion layer 2 is reduced. Therefore, the thinning of the width of the light-receiving surface gate electrode 12G is desirable from the viewpoint of resistance loss. However, the width of the light-receiving surface gate electrode 12G is selected in accordance with the manufacturing limit. In particular, when the light-receiving surface gate electrode 12G is formed by inexpensive screen printing, the lower limit width of the light-receiving surface gate electrode 12G which can be formed in the thinning is limited to 30 μm (micrometer) or more and 100 μm (micrometer) or less.
關於連接部63的寬度,也根據電極材料使用量降低的觀點,最好細線化。但是,根據製造上的限制以及太陽電池單元10的特性限制,選擇下限寬度。受光面柵電極12G與連接部63,和受光面匯流排電極12B共同使用1片印刷光罩同時以網版印刷印刷。因此,以網版印刷印刷的受光面柵電極12G的高度、連接部63的高度以及受光面匯流排電極12B的高度,成為同程度的高度。受光面柵電極12G的高度與連接部63的高度是相同高度時,對連接部63,因為流入數條即2、3 條到5、6條的受光面柵電極12G的分量的電流流入,連接部63的寬度最好是受光面柵電極12G的2倍左右。 The width of the connecting portion 63 is also preferably thinned in view of the decrease in the amount of use of the electrode material. However, the lower limit width is selected in accordance with manufacturing constraints and characteristics limitations of the solar cell unit 10. The light-receiving surface gate electrode 12G and the connecting portion 63 and the light-receiving surface bus bar electrode 12B are simultaneously printed by screen printing using one printing mask. Therefore, the height of the light-receiving surface gate electrode 12G printed by the screen printing, the height of the connecting portion 63, and the height of the light-receiving surface bus bar electrode 12B are the same height. When the height of the light-receiving surface gate electrode 12G and the height of the connection portion 63 are the same, the current flowing into the connection portion 63, that is, the components of the light-receiving surface gate electrode 12G of two, three, five, or six, flows in, and is connected. The width of the portion 63 is preferably about twice as large as that of the light-receiving surface gate electrode 12G.
如上述,受光面匯流排電極12B,在第2方向中的兩端部,往第1方向形成平行直線狀。即,受光面匯流排電極12B,在第2方向中對向的2個連接部的外側的側面63a,形成往第1方向平行的直線狀。於是,對太陽電池單元10的電極連接引線20製造太陽電池模組100之際,對受光面匯流排電極12B,在第2方向中,在橫向方向中的受光面匯流排電極的側面12Ba上,重疊引線的橫向方向的側面20b的狀態下,焊接引線20。即,受光面匯流排電極的側面12Ba的位置與引線的橫向方向的側面20b的位置,在半導體基板11的受光面11A的面內方向中位於相同位置。 As described above, the light-receiving surface bus bar electrodes 12B are formed in parallel linear directions in the first direction at both end portions in the second direction. In other words, the light-receiving surface bus bar electrode 12B has a linear shape parallel to the first direction in the side surface 63a on the outer side of the two connecting portions opposed in the second direction. Then, when the solar cell module 100 is manufactured for the electrode connection lead 20 of the solar cell unit 10, the light-receiving surface bus bar electrode 12B is on the side surface 12Ba of the light-receiving surface bus bar electrode in the lateral direction in the second direction. The lead 20 is soldered in a state in which the side surface 20b of the lead in the lateral direction is overlapped. In other words, the position of the side surface 12Ba of the light-receiving surface bus bar electrode and the position of the side surface 20b in the lateral direction of the lead wire are located at the same position in the in-plane direction of the light-receiving surface 11A of the semiconductor substrate 11.
因此,在引線20焊接至受光面匯流排電極12B的狀態中,連接部63不比第1區域61更往外側突出。即,焊接引線20至受光面匯流排電極12B的狀態中,連接部63在半導體基板11的受光面11A的面內方向中,包含在引線20內。 Therefore, in a state where the lead wire 20 is welded to the light-receiving surface bus bar electrode 12B, the connecting portion 63 does not protrude further outward than the first region 61. In other words, in a state in which the lead wire 20 is soldered to the light-receiving surface bus bar electrode 12B, the connection portion 63 is included in the lead wire 20 in the in-plane direction of the light-receiving surface 11A of the semiconductor substrate 11.
因此,太陽電池單元10,在半導體基板11的受光面11A的面內方向中,可以防止存在起因於不與引線20的下面焊接而從引線20露出的狀態的連接部63之太陽電池單元10的受光量下降。即,防止從引線20露出的狀態的受光面匯流排電極12B在半導體基板11的受光面11A上形成不要的陰影引起的受光面積減少,可以防止光電轉換效率下降。 Therefore, in the in-plane direction of the light-receiving surface 11A of the semiconductor substrate 11, the solar battery cell 10 can prevent the solar battery cell 10 of the connection portion 63 from being exposed from the lead wire 20 without being welded to the lower surface of the lead wire 20 The amount of light received decreases. In other words, the light-receiving surface of the light-receiving surface bus bar electrode 12B exposed to the lead wire 20 on the light-receiving surface 11A of the semiconductor substrate 11 is reduced in light-receiving area, and the photoelectric conversion efficiency can be prevented from being lowered.
例如,設置連接部63在第2方向中比第1區域61更往外側突出時,連接部63從連接至受光面匯流排電極12B 的引線20露出的面積有多少,太陽電池單元10的受光量就會下降多少,成為光電轉換效率下降的原因。 For example, when the connection portion 63 is protruded outward from the first region 61 in the second direction, the area of the connection portion 63 exposed from the lead wire 20 connected to the light-receiving surface bus bar electrode 12B is small, and the amount of light received by the solar battery cell 10 is large. How much will fall, which is the reason for the decline in photoelectric conversion efficiency.
又,受光面匯流排電極12B,在第2方向中的兩端部,因為形成往第1方向平行的直線狀,連接部63在半導體基板11的面內方向以最短的距離連接在第1方向中相鄰的第1區域61。因此,受光面匯流排電極12B中聚集的光電流,可以抑制起因於流過比第1區域61寬度窄的連接部63之第2區域62中的電阻損失。 Further, the light-receiving surface bus bar electrode 12B is formed in a linear shape parallel to the first direction at both end portions in the second direction, and the connection portion 63 is connected to the first direction at the shortest distance in the in-plane direction of the semiconductor substrate 11. The first adjacent region 61 in the middle. Therefore, the photocurrent accumulated in the light-receiving surface bus bar electrode 12B can suppress the electric resistance loss in the second region 62 which is caused by the connection portion 63 which is narrower than the width of the first region 61.
又,焊接受光面柵電極12G與引線20時,焊接至受光面柵電極12G時的應力集中,受光面柵電極12G有可能斷線。太陽電池單元10中,在第2區域62焊接連接部63與引線20,不焊接受光面柵電極12G與引線20。因此,太陽電池單元10可以抑制受光面柵電極12G與引線20的焊接引起的受光面柵電極12G斷線。 When the light-receiving surface gate electrode 12G and the lead 20 are welded, stress concentration at the time of soldering to the light-receiving surface gate electrode 12G is concentrated, and the light-receiving surface gate electrode 12G may be broken. In the solar cell unit 10, the connection portion 63 and the lead 20 are soldered in the second region 62, and the light-receiving surface gate electrode 12G and the lead 20 are not soldered. Therefore, the solar battery cell 10 can suppress the disconnection of the light-receiving surface gate electrode 12G due to the welding of the light-receiving surface gate electrode 12G and the lead wire 20.
又,太陽電池單元10,連接引線20至太陽電池單元10的電極製造太陽電池模組100之際,可使用遍及長邊方向形成相同寬度的一般引線20,不用具有太陽電池單元10的專用形狀的引線20。 Moreover, when the solar cell unit 10 is connected to the electrode of the solar cell unit 10 to form the solar cell module 100, the general lead 20 having the same width can be formed over the longitudinal direction without using the special shape of the solar cell unit 10. Lead 20.
太陽電池模組100,使用遍及長邊方向形成相同寬度的一般引線20。藉此,對太陽電池單元10焊接引線20之際,受光面匯流排電極12B與引線20的長邊方向中太陽電池單元10與引線20的位置決定即受光面匯流排電極12B與引線20的位置決定變得不需要。因此,太陽電池模組100,在受光面匯流排電極12B與引線20的長邊方向中的任意位置,因為可 以焊接受光面匯流排電極12B與引線20,製造是容易的。 The solar cell module 100 uses a general lead 20 having the same width throughout the longitudinal direction. When the lead wire 20 is welded to the solar battery cell 10, the position of the solar cell unit 10 and the lead 20 in the longitudinal direction of the light-receiving surface bus bar electrode 12B and the lead wire 20 is determined, that is, the position of the light-receiving surface bus bar electrode 12B and the lead wire 20. The decision became unnecessary. Therefore, in the solar battery module 100, at any position in the longitudinal direction of the light-receiving surface bus bar electrode 12B and the lead wire 20, since the light-receiving surface bus bar electrode 12B and the lead wire 20 can be welded, it is easy to manufacture.
另一方面,在半導體基板的背面11B側,如第6及8圖所示,形成含鋁(Al)的背面集電電極13A以及含銀(Ag)的點狀的複數的背面連接電極13B,構成背面電極13。又,與半導體基板1的背面的表層中的背面集電電極13A相接的區域周邊,從用以提高開放電壓以及短路電流的背面電場層即背面電場層13A,形成鋁往半導體基板1的背面側的表層高濃度擴散的p+區域的背面電場(BSF:Back Surface Filed)層4。 On the other hand, as shown in FIGS. 6 and 8 on the back surface 11B side of the semiconductor substrate, a back surface collector electrode 13A containing aluminum (Al) and a plurality of dot back surface connection electrodes 13B containing silver (Ag) are formed. The back electrode 13 is formed. Further, aluminum is formed on the back surface of the semiconductor substrate 1 from the back surface electric field layer 13A which is a back surface electric field layer for increasing the open voltage and the short-circuit current, in the vicinity of the region in contact with the back surface collector electrode 13A in the surface layer of the back surface of the semiconductor substrate 1. The back surface electric field (BSF: Back Surface Filed) layer 4 of the p+ region where the surface layer is highly diffused.
背面集電電極13A,係為了形成BSF層4以及為了從半導體基板11的背面11B側收集以太陽電池單元10發電的光電流而設置的電極,覆蓋太陽電池單元10的背面大致全區。背面集電電極13A,係在所希望的範圍內塗佈具有電極材料Al的金屬粒子之導電性膏材再燒成而形成的膏電極。 The back surface collector electrode 13A covers the BSF layer 4 and an electrode provided to collect the photocurrent generated by the solar cell 10 from the back surface 11B side of the semiconductor substrate 11, and covers the entire back surface of the solar cell unit 10. The back collector electrode 13A is a paste electrode formed by applying a conductive paste of metal particles having an electrode material Al to a desired range and then firing.
又,背面連接電極13B,取出背面集電電極13A收集的光電流至外部,係設置用以取得與外部電極接觸的電極。即,背面連接電極13B,係設置用以與引線20接合的電極。背面連接電極13B,與受光面匯流排電極12B相同,係沿著太陽電池單元10的連結方向即第1方向設置。背面連接電極13B,係在所希望的範圍內塗佈具有電極材料Ag的金屬粒子之導電性膏材再燒成而形成的膏電極。 Further, the back surface of the electrode 13B is connected, and the photocurrent collected by the back surface collector electrode 13A is taken out to the outside, and an electrode for bringing in contact with the external electrode is provided. That is, the back surface connection electrode 13B is provided with an electrode for bonding to the lead wire 20. The back surface connection electrode 13B is provided in the first direction along the connection direction of the solar cell unit 10, similarly to the light receiving surface bus bar electrode 12B. The back surface connection electrode 13B is a paste electrode formed by applying a conductive paste of metal particles having an electrode material Ag and firing it in a desired range.
背面連接電極13B,夾住半導體基板11,配置在對向受光面匯流排電極12B的位置。又,背面連接電極13B,如第8圖所示,沿著太陽電池單元10的連結方向即第1方向,遍及太陽電池單元10的大致全長分散配置成間隔踏腳石狀, 設置成4列。藉由將背面連接電極13B形成間隔踏腳石狀,抑制銀的使用量,可以抑制製造成本。 The back surface connection electrode 13B sandwiches the semiconductor substrate 11 and is disposed at a position facing the light-receiving surface bus bar electrode 12B. Further, as shown in FIG. 8, the back surface connection electrode 13B is disposed in a row of stepping stones in a substantially uniform manner over the entire length of the solar cell unit 10 along the first direction of the solar cell unit 10, and is arranged in four rows. By forming the back surface connection electrode 13B in a stepping stone shape, the amount of silver used can be suppressed, and the manufacturing cost can be suppressed.
於是,背面連接電極13B的位置,如第9及10圖所示,太陽電池單元10的面內方向即半導體基板11的面內方向中,位於與受光面匯流排電極12B中的貫通孔60的位置不一致的位置。換言之,受光面匯流排電極12B的第1區域61與背面連接電極13B,以半導體基板11介於其間,配置在半導體基板11的厚度方向中相對的位置。因此,受光面匯流排電極12B的第1區域61與背面連接電極13B,配置在半導體基板11的面內對應的位置。 Then, as shown in FIGS. 9 and 10, the in-plane direction of the solar cell unit 10, that is, the in-plane direction of the semiconductor substrate 11, is located in the through-hole 60 in the light-receiving surface bus bar electrode 12B. Locations where the location is inconsistent. In other words, the first region 61 and the back surface connection electrode 13B of the light-receiving surface bus bar electrode 12B are disposed between the semiconductor substrate 11 in the thickness direction of the semiconductor substrate 11 with the semiconductor substrate 11 interposed therebetween. Therefore, the first region 61 and the back surface connection electrode 13B of the light-receiving surface bus bar electrode 12B are disposed at positions corresponding to the surface of the semiconductor substrate 11.
因此,1個太陽電池單元10中,受光面側中焊接至受光面匯流排電極12B的引線20與背面側中連接至背面連接電極13B的引線20,在太陽電池單元10的面內方向即半導體基板11的面內方向中,在相同的位置焊接至太陽電池單元10。即,1個太陽電池單元10中,焊接至太陽電池單元10的受光面側的引線20與焊接至太陽電池單元10的背面側的引線20,在半導體基板11的厚度方向中相對的位置焊接。 Therefore, in one solar battery cell 10, the lead 20 welded to the light-receiving surface bus bar electrode 12B on the light-receiving surface side and the lead wire 20 connected to the back surface connection electrode 13B on the back surface side are in the in-plane direction of the solar cell unit 10, that is, the semiconductor. In the in-plane direction of the substrate 11, the solar cell unit 10 is soldered at the same position. In other words, in one solar battery cell 10, the lead wire 20 welded to the light-receiving surface side of the solar battery cell 10 and the lead wire 20 soldered to the back surface side of the solar battery cell 10 are welded at positions opposed to each other in the thickness direction of the semiconductor substrate 11.
於是,太陽電池單元10的面內方向中,由於使受光面匯流排電極12B的第1區域61的面積與背面連接電極13B的面積大致相同,受光面匯流排電極12B與引線20的焊接面積和背面連接電極13B與引線20的焊接面積幾乎相等。 Therefore, in the in-plane direction of the solar battery cell 10, the area of the first region 61 of the light-receiving surface bus bar electrode 12B is substantially the same as the area of the back surface connection electrode 13B, and the welding area of the light-receiving surface bus bar electrode 12B and the lead wire 20 is The welding area of the back connection electrode 13B and the lead 20 is almost equal.
因此,本第一實施形態的太陽電池單元10中,為了形成複數的太陽電池單元10,焊接引線20至太陽電池單元10之際的引線20與受光面匯流排電極12B的連接部以及引線 20與背面連接電極13B的連接部中產生的內部應力幾乎相抵。 Therefore, in the solar battery cell 10 of the first embodiment, in order to form the plurality of solar battery cells 10, the connection portion of the lead wire 20 and the light-receiving surface bus bar electrode 12B when the lead wire 20 is welded to the solar battery cell 10, and the lead wire 20 are The internal stress generated in the connection portion of the back surface connection electrode 13B is almost offset.
連接引線20至太陽電池單元10的電極製造太陽電池模組100之際,如第9及10圖所示,焊接引線20至受光面匯流排電極12B以及背面連接電極13B。受光面匯流排電極12B不具有貫通孔60,背面連接電極13B分散配置成間隔踏腳石狀時,半導體基板11的面內的受光面匯流排電極12B的面積與半導體基板11的面內的背面連接電極13B的面積之間的差變大。因此,起因於製作太陽電池模組100時的引線20焊接產生之引線20與受光面匯流排電極12B的連接部中產生的內部應力以及引線20與背面連接電極13B的連接部中產生的內部應力之間的差變大。在此情況下,在太陽電池單元10的受光面側引線20與受光面匯流排電極12B的連接部中產生的內部應力以及在太陽電池單元10的背面側引線20與背面連接電極13B的連接部中產生的內部應力之間不能取得平衡,內部應力的差成為太陽電池單元10彎曲的主因。 When the lead wire 20 is connected to the electrode of the solar cell unit 10 to manufacture the solar cell module 100, as shown in Figs. 9 and 10, the soldering lead 20 is connected to the light-receiving surface bus bar electrode 12B and the back surface connecting electrode 13B. When the light-receiving surface bus electrode 12B does not have the through hole 60 and the back surface connection electrode 13B is dispersed and arranged in a stepping stone shape, the area of the light-receiving surface bus bar electrode 12B in the in-plane of the semiconductor substrate 11 and the in-plane back surface of the semiconductor substrate 11 The difference between the areas of the connection electrodes 13B becomes large. Therefore, the internal stress generated in the connection portion between the lead 20 and the light-receiving surface bus electrode 12B which is produced by the soldering of the lead 20 in the production of the solar cell module 100, and the internal stress generated in the connection portion between the lead 20 and the back-side connecting electrode 13B are caused. The difference between them becomes larger. In this case, the internal stress generated in the connection portion between the light-receiving surface side lead 20 of the solar cell unit 10 and the light-receiving surface bus bar electrode 12B and the connection portion between the back surface side lead 20 and the back surface connection electrode 13B of the solar cell unit 10 There is no balance between the internal stresses generated in the middle, and the difference in internal stress becomes the main cause of the bending of the solar cell unit 10.
結果,產生起因於金屬構成的引線20與半導體基板11的矽的熱膨脹係數差的彎曲。一般構成引線20的金屬的熱膨脹係數,比矽的熱膨脹係數大。因此,受光面匯流排電極12B不具有貫通孔60而背面連接電極13B分散配置成間隔踏腳石狀時,即半導體基板11的面內的受光面匯流排電極12B的面積比半導體基板11的面內的背面連接電極13B的面積大時,焊接後在太陽電池單元10產生往背面側凸的彎曲。 As a result, a curve due to a difference in thermal expansion coefficient between the lead 20 made of metal and the turn of the semiconductor substrate 11 is generated. Generally, the coefficient of thermal expansion of the metal constituting the lead 20 is larger than the coefficient of thermal expansion of the crucible. Therefore, when the light-receiving surface bus electrode 12B does not have the through hole 60 and the back surface connection electrode 13B is dispersed and arranged in a stepping stone shape, that is, the area of the light-receiving surface bus bar electrode 12B in the surface of the semiconductor substrate 11 is larger than the surface of the semiconductor substrate 11. When the area of the back surface connection electrode 13B is large, the solar cell unit 10 is bent toward the back side after soldering.
另一方面,太陽電池單元10中,受光面匯流排電極12B的第1區域61與背面連接電極13B,在半導體基板11的面 內配置在對應的位置,而且太陽電池單元10的面內方向中,由於使受光面匯流排電極12B的第1區域61的面積與背面連接電極13B的面積大致相同,受光面匯流排電極12B與引線20的焊接面積和背面連接電極13B與引線20的焊接面積變得大致相等。藉此,焊接的受光面匯流排電極12B與引線20的固定位置以及焊接的背面連接電極13B與引線20的固定位置,在半導體基板11的面內成為相同的位置,太陽電池單元10中,可以取得太陽電池單元10的受光面側與背面側中的上述內部應力的平衡。因此,太陽電池單元10,可以抑制起因於製作太陽電池模組100時焊接引線20至太陽電池單元10的太陽電池單元10彎曲。因此,太陽電池單元10,能夠使製作太陽電池模組100時太陽電池單元10彎曲引起的太陽電池單元10破損率降低。 On the other hand, in the solar battery cell 10, the first region 61 and the back surface connection electrode 13B of the light-receiving surface bus bar electrode 12B are disposed at corresponding positions in the plane of the semiconductor substrate 11, and in the in-plane direction of the solar cell unit 10 Since the area of the first region 61 of the light-receiving surface bus bar electrode 12B is substantially the same as the area of the back surface connection electrode 13B, the welding area of the light-receiving surface bus bar electrode 12B and the lead wire 20 and the welding area of the back surface connection electrode 13B and the lead wire 20 become It is roughly equal. Thereby, the fixed position of the welded light-receiving surface bus bar electrode 12B and the lead wire 20 and the fixed position of the soldered back surface connection electrode 13B and the lead wire 20 are at the same position in the surface of the semiconductor substrate 11, and the solar battery cell 10 can be used. The balance of the internal stress in the light receiving surface side and the back surface side of the solar battery cell 10 is obtained. Therefore, the solar battery unit 10 can suppress the bending of the solar battery cells 10 which are caused by the welding leads 20 to the solar battery cells 10 when the solar battery module 100 is manufactured. Therefore, the solar battery unit 10 can reduce the breakage rate of the solar battery unit 10 caused by the bending of the solar battery unit 10 when the solar battery module 100 is manufactured.
於是,由於太陽電池單元10的面內方向中受光面匯流排電極12B的第1區域61的面積與背面連接電極13B的面積正確形成相同面積,可以高精度取得太陽電池單元10的受光面側與背面側中的上述內部應力的平衡。 Therefore, since the area of the first region 61 of the light-receiving surface bus electrode 12B in the in-plane direction of the solar battery cell 10 and the area of the back surface connection electrode 13B are correctly formed in the same area, the light-receiving surface side of the solar battery cell 10 can be obtained with high precision. The balance of the above internal stresses in the back side.
又,太陽電池單元10中,如上述,因為可以抑制製作太陽電池模組100時太陽電池單元10的彎曲,能夠對應半導體基板11的薄板化,使用更薄的半導體基板11降低半導體基板11的成本,可對應廉價的太陽電池單元10的實現。 Further, in the solar battery unit 10, as described above, it is possible to suppress the bending of the solar battery cell 10 when the solar battery module 100 is manufactured, and it is possible to reduce the cost of the semiconductor substrate 11 by using the thinner semiconductor substrate 11 in accordance with the thinning of the semiconductor substrate 11. It can correspond to the realization of the inexpensive solar cell unit 10.
又,上述的第一實施形態的太陽電池單元10的構成係一例,關於大型太陽電池單元的構造不限定於上述記載。 Moreover, the configuration of the solar battery cell 10 of the above-described first embodiment is an example, and the structure of the large-sized solar battery cell is not limited to the above description.
又,第7及8圖中,作為代表例,顯示關於受光面匯流排電極12B以及背面連接電極13B是4條的情況,但受光面匯 流排電極12B以及背面連接電極13B的條數不限定於上述記載。 In addition, in the case of the seventh embodiment, the number of the light-receiving surface bus bar electrodes 12B and the back surface connection electrode 13B is four, but the number of the light-receiving surface bus bar electrodes 12B and the back surface connection electrode 13B is not limited to The above description.
其次,關於第一實施形態的太陽電池單元10的製造方法,參照第15到22圖說明。第15圖係說明本發明第一實施形態的太陽電池單元10的製造步驟的程序之流程圖。第16到22圖,係顯示本發明第一實施形態的太陽電池單元10的製造步驟的主要部分剖面圖。又,第20到22圖,係顯示對應第9圖的圖。 Next, a method of manufacturing the solar battery cell 10 of the first embodiment will be described with reference to Figs. 15 to 22. Fig. 15 is a flow chart for explaining the procedure of the manufacturing steps of the solar battery cell 10 according to the first embodiment of the present invention. Figs. 16 to 22 are cross-sectional views showing main parts of a manufacturing process of the solar battery cell 10 according to the first embodiment of the present invention. Further, in the figures 20 to 22, the map corresponding to Fig. 9 is shown.
首先,作為半導體基板1,如第16圖所示,例如準備針對民生用太陽電池使用最多的正方形狀的p型單結晶矽基板。在此,不特別限定半導體基板1的厚度以及尺寸,但作為一例,半導體基板1的厚度是200μm,半導體基板1的面方向中的外形尺寸是156mm×156mm。 First, as shown in Fig. 16, the semiconductor substrate 1 is prepared, for example, in a square-shaped p-type single crystal germanium substrate which is most used for solar cells for people's livelihood. Here, the thickness and size of the semiconductor substrate 1 are not particularly limited. However, as an example, the thickness of the semiconductor substrate 1 is 200 μm, and the outer dimension of the semiconductor substrate 1 in the plane direction is 156 mm × 156 mm.
因為以線鋸切片冷卻固化熔融的矽形成的矽錠製造半導體基板1,表面上留下切片時的損傷。於是,首先也兼著除去損傷層,經由浸泡半導體基板1在酸溶液或加熱的鹼溶液中蝕刻表面,除去切出半導體基板1時發生而存在半導體基板1的表面附近的損傷區域。作為鹼溶液的一例,舉出氫氧化鈉水溶液。 Since the semiconductor substrate 1 is produced by the wire saw blade cooling and solidified molten yttrium formed by the ruthenium ingot, the surface is left with damage on the surface. Then, first, the damaged layer is removed, and the surface is etched by the immersion semiconductor substrate 1 in an acid solution or a heated alkali solution to remove the damaged region which occurs near the surface of the semiconductor substrate 1 when the semiconductor substrate 1 is cut out. An example of the alkali solution is an aqueous sodium hydroxide solution.
其次,步驟S10中,作為半導體基板1中受光面側的表面上紋理構造,形成不圖示的微小凹凸。微小凹凸,例如在鹼性水溶液的氫氧化鈉與異丙醇的混合溶液內浸泡半導體基板1,經由進行半導體基板1的濕蝕刻而形成。 Then, in the step S10, fine unevenness (not shown) is formed as a texture on the surface on the light-receiving surface side of the semiconductor substrate 1. The fine unevenness is formed, for example, by immersing the semiconductor substrate 1 in a mixed solution of sodium hydroxide and isopropyl alcohol in an alkaline aqueous solution, and performing wet etching of the semiconductor substrate 1.
其次,步驟S20中,將表面上形成微小凹凸作為紋理構造的半導體基板1投入熱擴散爐內,在n型不純物的磷(P)的空氣中加熱,在半導體基板1的基板全面形成pn接合。根據此步驟,使磷從半導體基板1的表面擴散至半導體基板1,如 第17圖所示,在半導體基板1的表層形成n型不純物擴散層2,形成pn接合。藉此,得到構成pn接合的半導體基板11。 Next, in step S20, the semiconductor substrate 1 having fine texture as a texture on the surface thereof is placed in a thermal diffusion furnace, heated in air of phosphorus (P) of an n-type impurity, and pn junction is formed on the entire substrate of the semiconductor substrate 1. According to this step, phosphorus is diffused from the surface of the semiconductor substrate 1 to the semiconductor substrate 1. As shown in Fig. 17, the n-type impurity diffusion layer 2 is formed on the surface layer of the semiconductor substrate 1, thereby forming a pn junction. Thereby, the semiconductor substrate 11 which comprises a pn junction is obtained.
n型不純物擴散層2的形成,例如將半導體基板1投入熱擴散爐內,三氯氧磷(POCl3)氣體與氧氣的混合空氣中,以例如750℃到900℃左右的溫度進行加熱。擴散至半導體基板1的表層的磷的濃度,可以由三氯氧磷氣體的濃度、空氣溫度及加熱時間等的條件控制。在此,n型不純物擴散層2形成後的表面上,形成以磷的氧化物為主成分的矽氧化膜與磷氧化物的混成物之未圖示的磷玻璃層。因此,n型不純物擴散層2的表面的磷玻璃層,利用氟酸水溶液等的藥劑除去。 For the formation of the n-type impurity diffusion layer 2, for example, the semiconductor substrate 1 is placed in a thermal diffusion furnace, and the mixed air of phosphorus oxychloride (POCl 3 ) gas and oxygen is heated at a temperature of, for example, about 750 ° C to 900 ° C. The concentration of phosphorus diffused to the surface layer of the semiconductor substrate 1 can be controlled by conditions such as the concentration of the phosphorus oxychloride gas, the air temperature, and the heating time. Here, on the surface after the formation of the n-type impurity diffusion layer 2, a phosphorus glass layer (not shown) in which a mixture of a tantalum oxide film containing phosphorus oxide as a main component and a phosphorus oxide is formed is formed. Therefore, the phosphorus glass layer on the surface of the n-type impurity diffusion layer 2 is removed by a chemical agent such as a hydrofluoric acid aqueous solution.
其次,步驟S30中,進行電氣絕緣p型電極的背面電極13與n型電極的受光面電極12之pn分離步驟,如第18圖所示除去半導體基板11的端部的n型不純物擴散層2。n型不純物擴散層2,因為在半導體基板1的表面上同樣形成,所以半導體基板11的受光面11A與背面11B在電氣連接的狀態。因此,半導體基板11中形成背面電極13與受光面電極12時,電氣連接背面電極13與受光面電極12。為了切斷此電氣連接,進行pn分離。例如利用電漿蝕刻的端面蝕刻或利用雷射加工的熔融分離等,例示pn分離。 Next, in step S30, a step of pn separating the back surface electrode 13 of the electrically insulating p-type electrode and the light-receiving surface electrode 12 of the n-type electrode is performed, and the n-type impurity diffusion layer 2 at the end of the semiconductor substrate 11 is removed as shown in FIG. . Since the n-type impurity diffusion layer 2 is formed similarly on the surface of the semiconductor substrate 1, the light-receiving surface 11A and the back surface 11B of the semiconductor substrate 11 are electrically connected. Therefore, when the back surface electrode 13 and the light-receiving surface electrode 12 are formed in the semiconductor substrate 11, the back surface electrode 13 and the light-receiving surface electrode 12 are electrically connected. In order to cut off this electrical connection, pn separation is performed. For example, pn separation is exemplified by end face etching by plasma etching or melt separation by laser processing.
其次,步驟S40中,在半導體基板11的受光面側,即n型不純物擴散層2上,為了表面保護以及光電轉換效率改善,如第19圖所示例子,形成氮化矽(SiN)膜作為反射防止膜3。對於反射防止膜3的形成,例如利用電漿化學氣相沉積(Plasma-Enhanced Chemical Vapor Deposition:PECVD)法,使用 矽烷(silane)與氨(ammonia)的混合氣體形成氮化矽膜作為反射防止膜3。反射防止膜3的膜厚以及折射率,設定為最抑制光反射的值。 Next, in step S40, on the light-receiving surface side of the semiconductor substrate 11, that is, on the n-type impurity diffusion layer 2, for the surface protection and photoelectric conversion efficiency improvement, as shown in Fig. 19, a tantalum nitride (SiN) film is formed as The anti-reflection film 3. For the formation of the anti-reflection film 3, for example, a plasma-chemical vapor deposition (PECVD) method is used to form a tantalum nitride film as a reflection preventing film using a mixed gas of silane and ammonia. 3. The film thickness and refractive index of the anti-reflection film 3 are set to values that most suppress light reflection.
其次,形成電極。首先,步驟S50中,在半導體基板11的受光面側,以網版印刷印刷受光面電極12。即,如第20圖所示,包含銀以及玻璃熔塊(glass frit)的電極材料膏的銀電極膏12a,在半導體基板11的受光面側的反射防止膜3上,印刷成受光面電極12的形狀。在此,銀電極膏12a,印刷成第7及11圖所示包括複數的第1區域61與複數的第2區域62的受光面匯流排電極12B的形狀。之後,使銀電極膏12a乾燥。 Next, an electrode is formed. First, in step S50, the light-receiving surface electrode 12 is printed on the light-receiving surface side of the semiconductor substrate 11 by screen printing. In other words, as shown in Fig. 20, the silver electrode paste 12a containing the electrode material paste of the silver and the glass frit is printed on the light-receiving surface side of the semiconductor substrate 11 as the light-receiving surface electrode 12 shape. Here, the silver electrode paste 12a is printed in the shape of the light-receiving surface bus bar electrode 12B including the plurality of first regions 61 and the plurality of second regions 62 as shown in FIGS. 7 and 11. Thereafter, the silver electrode paste 12a is dried.
其次,步驟S60中,在半導體基板11的背面以網版印刷印刷背面電極13。背面集電電極13A的印刷與背面連接電極13B的印刷,哪個先進行都沒問題,但在此顯示先印刷背面連接電極13B的情況。 Next, in step S60, the back surface electrode 13 is printed on the back surface of the semiconductor substrate 11 by screen printing. The printing of the back surface collector electrode 13A and the printing of the back surface connection electrode 13B are performed first, but the case where the back surface connection electrode 13B is printed first is shown here.
其次,如第21圖所示,在半導體基板11的背面,包含銀與玻璃熔塊的電極材料膏的銀電極膏13b,印刷成背面連接電極13B的形狀。銀電極膏13b,在半導體基板11的背面的面內,半導體基板11的受光面中受光面匯流排電極12B的第1區域61形成的位置對應的位置上,使用具有開口圖案的印刷光罩印刷。之後,以200℃的溫度讓銀電極膏13b乾燥5分鐘。 Next, as shown in Fig. 21, on the back surface of the semiconductor substrate 11, a silver electrode paste 13b containing an electrode material paste of silver and glass frit is printed in the shape of the back surface connection electrode 13B. The silver electrode paste 13b is printed on the surface of the back surface of the semiconductor substrate 11 at a position corresponding to the position where the first region 61 of the light-receiving surface bus bar electrode 12B is formed on the light-receiving surface of the semiconductor substrate 11, and is printed using a printing mask having an opening pattern. . Thereafter, the silver electrode paste 13b was dried at a temperature of 200 ° C for 5 minutes.
其次,如第21圖所示,在半導體基板11的背面,印刷包含鋁與玻璃熔塊的電極材料膏即鋁電極膏13a成背面集電電極13A的形狀。鋁電極膏13a,在半導體基板11的背面的面內,背面連接電極13B的印刷區域以及除了外緣區域的一部分的背面全體使用具有開口圖案的印刷光罩印刷。又,鋁電 極膏13a的至少一部分印刷成電氣連接至銀電極膏13b的狀態。之後,以200℃的溫度讓鋁電極膏13a乾燥5分鐘。 Next, as shown in Fig. 21, on the back surface of the semiconductor substrate 11, an aluminum electrode paste 13a which is an electrode material paste containing aluminum and a glass frit is printed in the shape of the back surface collector electrode 13A. The aluminum electrode paste 13a is printed on the back surface of the semiconductor substrate 11, the printing region of the back surface connection electrode 13B, and the entire back surface except a part of the outer edge region, using a printing mask having an opening pattern. Further, at least a part of the aluminum electrode paste 13a is printed in a state of being electrically connected to the silver electrode paste 13b. Thereafter, the aluminum electrode paste 13a was dried at a temperature of 200 ° C for 5 minutes.
之後,步驟S70中,進行實施印刷膏材的燒成處理的電極燒成,藉由燒成半導體基板11上印刷的電極膏,如第22圖所示,得到作為受光面電極12的受光面柵電極12G以及受光面匯流排電極12B與作為背面電極13的背面集電電極13A以及背面連接電極13B。燒成,係使用紅外線加熱爐,在大氣空氣中以750℃以上且900℃以下左右進行。燒成溫度的選擇,係考慮太陽電池單元10的構造以及電極膏的種類進行。 After that, in step S70, the electrode baking process for performing the baking process of the printing paste is performed, and the electrode paste printed on the semiconductor substrate 11 is fired, and as shown in Fig. 22, the light-receiving surface grating as the light-receiving surface electrode 12 is obtained. The electrode 12G and the light-receiving surface bus electrode 12B and the back surface collector electrode 13A and the back surface connection electrode 13B as the back surface electrode 13. The firing is carried out in an infrared heating furnace at about 750 ° C to 900 ° C in atmospheric air. The selection of the firing temperature is carried out in consideration of the structure of the solar battery cell 10 and the type of the electrode paste.
根據燒成,在半導體基板11的受光面側,燒穿(fire through)貫通受光面電極12的銀絕緣膜的反射防止膜3,電氣連接n型不純物擴散層2與受光面電極12。因此,n型不純物擴散層2,可以得到與受光面電極12良好的電阻性接合。 On the light-receiving surface side of the semiconductor substrate 11, the anti-reflection film 3 that penetrates the silver insulating film of the light-receiving surface electrode 12 is fired, and the n-type impurity diffusion layer 2 and the light-receiving surface electrode 12 are electrically connected. Therefore, the n-type impurity diffusion layer 2 can obtain good resistive bonding with the light-receiving surface electrode 12.
另一方面,在半導體基板11的背面側,燒成鋁電極膏13a以及銀電極膏13b,形成背面集電電極13A與背面連接電極13B的同時,形成鋁與銀構成的未圖示的合金部。 On the other hand, the aluminum electrode paste 13a and the silver electrode paste 13b are fired on the back surface side of the semiconductor substrate 11, and the back surface collector electrode 13A and the back surface connection electrode 13B are formed, and an alloy portion (not shown) made of aluminum and silver is formed. .
形成背面集電電極13A之際,鋁電極膏13a,也與半導體基板11的背面的p型單結晶矽反應,經由反應後固化,形成包含鋁的p+層BSF層4。即,在半導體基板11的背面11B側形成的n型不純物擴散層2中背面集電電極13A的正下方區域,利用鋁的擴散轉換成BSF層4。又,在半導體基板11的背面側形成的n型不純物擴散層2中,背面集電電極13A正下方以外的區域,擴散鋁成為p型區域。 When the back surface collector electrode 13A is formed, the aluminum electrode paste 13a also reacts with the p-type single crystal ruthenium on the back surface of the semiconductor substrate 11, and is cured by the reaction to form a p+ layer BSF layer 4 containing aluminum. In other words, in the n-type impurity diffusion layer 2 formed on the back surface 11B side of the semiconductor substrate 11, a region directly under the back surface collector electrode 13A is converted into the BSF layer 4 by diffusion of aluminum. Further, in the n-type impurity diffusion layer 2 formed on the back surface side of the semiconductor substrate 11, in a region other than directly below the back surface collector electrode 13A, the diffusion aluminum becomes a p-type region.
其次,說明關於製造包括本第一實施形態的太陽電 池單元10的太陽電池模組100的方法。第23圖係顯示本發明第一實施形態的太陽電池模組100的製造方法程序的流程圖。 Next, a method of manufacturing the solar battery module 100 including the solar battery unit 10 of the first embodiment will be described. Fig. 23 is a flow chart showing the procedure of the method of manufacturing the solar battery module 100 according to the first embodiment of the present invention.
首先,步驟S110中,經由焊接引線20至一方的太陽電池單元10的受光面匯流排電極12B與另一方的太陽電池單元10的背面連接電極13B而接合,以引線20電氣連接複數的太陽電池單元10,形成太陽電池串50。 First, in step S110, the light-receiving surface bus bar electrode 12B of one of the solar battery cells 10 is joined to the back surface connection electrode 13B of the other solar cell unit 10 via the bonding wire 20, and the plurality of solar cells are electrically connected by the lead wires 20. 10, forming a solar cell string 50.
其次,步驟S120中,受光面保護部31上,依序積層受光面側密封材33的薄片、太陽電池串50、背面側密封材34的薄片、背面保護部32,形成積層體。 Then, in the step S120, the sheet of the light-receiving surface side sealing material 33, the solar cell string 50, the sheet of the back side sealing material 34, and the back surface protecting portion 32 are sequentially laminated on the light-receiving surface protecting portion 31 to form a laminated body.
其次,步驟S130中,安裝積層體至積層(laminate)裝置,以例如140℃以上且160℃以下左右的溫度進行30分鐘前後的熱處理以及積層處理。藉此,積層體的各構件,經由受光面側密封材33以及背面側密封材34一體化,得到太陽電池模組100。 Next, in step S130, the laminated body is attached to the laminate device, and heat treatment and lamination processing are performed for 30 minutes or so at a temperature of, for example, 140 ° C or more and 160 ° C or less. Thereby, each member of the laminated body is integrated via the light-receiving surface side sealing material 33 and the back surface side sealing material 34, and the solar cell module 100 is obtained.
之後,太陽電池模組100的外緣部遍及全周以框架40保持。 Thereafter, the outer edge portion of the solar cell module 100 is held by the frame 40 throughout the entire circumference.
如上述,第一實施形態的太陽電池單元10,在受光面匯流排電極12B設置複數的貫通孔60。藉此,太陽電池單元10中,能夠降低受光面匯流排電極12B中使用的電極材料使用量,能夠降低太陽電池單元10的製造成本。 As described above, in the solar battery cell 10 of the first embodiment, a plurality of through holes 60 are provided in the light receiving surface bus bar electrode 12B. Thereby, in the solar battery cell 10, the amount of use of the electrode material used in the light-receiving surface bus bar electrode 12B can be reduced, and the manufacturing cost of the solar cell unit 10 can be reduced.
又,第一實施形態的太陽電池單元10,將受光面匯流排電極12B的第1區域61與背面連接電極13B配置在半導體基板11的面內對應的位置,以半導體基板11介於其間,在半導體基板11的厚度方向中相對。藉此,太陽電池單元10,可以抑制起因於製作太陽電池模組100時對太陽電池單元10焊接引線 20之太陽電池單元10彎曲,能夠使製作太陽電池模組100時太陽電池單元10彎曲引起的太陽電池單元10的破損率降低。 Further, in the solar battery cell 10 of the first embodiment, the first region 61 and the back surface connection electrode 13B of the light-receiving surface bus bar electrode 12B are disposed at positions corresponding to the surface of the semiconductor substrate 11, with the semiconductor substrate 11 interposed therebetween. The semiconductor substrate 11 is opposed to each other in the thickness direction. As a result, the solar battery unit 10 can suppress the bending of the solar battery unit 10 that causes the solar battery unit 10 to solder the lead 20 when the solar battery module 100 is manufactured, and can cause the solar battery unit 10 to bend when the solar battery module 100 is manufactured. The breakage rate of the solar cell unit 10 is lowered.
又,本第一實施形態的太陽電池單元10中,受光面匯流排電極12B,遍及長邊方向形成相同寬度,第2方向中的兩端部是往第1方向平行的直線狀。受光面匯流排電極12B的寬度,與連接至受光面匯流排電極12B的寬度之遍及長邊方向形成相同寬度的引線20的寬度形成相同寬度。於是,製作太陽電池模組100時,第2方向中的受光面匯流排電極12B的兩側受光面匯流排電極的側面12Ba的位置與第2方向中的引線20的兩側引線的橫向方向的側面20b的位置,在半導體基板11的受光面11A的面內方向中位於相同位置。受光面匯流排電極的側面12Ba的位置與引線在橫向方向的側面20b的位置,在半導體基板11的受光面11A的面內方向中位於相同位置。藉此,太陽電池單元10,防止半導體基板11的受光面11A的面內方向中起因於從引線20露出的受光面匯流排電極12B之太陽電池單元10的受光量下降,可以防止光電轉換效率下降。 In the solar battery cell 10 of the first embodiment, the light-receiving surface bus bar electrode 12B has the same width in the longitudinal direction, and both ends in the second direction are linear in parallel to the first direction. The width of the light-receiving surface bus bar electrode 12B is the same as the width of the lead wire 20 which is formed to have the same width in the longitudinal direction as the width of the light-receiving surface bus bar electrode 12B. Then, when the solar cell module 100 is fabricated, the position of the side surface 12Ba of the light-receiving surface bus bar electrode on both sides of the light-receiving surface bus bar electrode 12B in the second direction and the lateral direction of the lead wires on both sides of the lead wire 20 in the second direction are formed. The position of the side surface 20b is located at the same position in the in-plane direction of the light receiving surface 11A of the semiconductor substrate 11. The position of the side surface 12Ba of the light-receiving surface bus bar electrode and the position of the side surface 20b of the lead wire in the lateral direction are located at the same position in the in-plane direction of the light-receiving surface 11A of the semiconductor substrate 11. In the solar cell unit 10, the amount of light received by the solar cell unit 10 caused by the light-receiving surface bus bar electrode 12B exposed from the lead 20 in the in-plane direction of the light-receiving surface 11A of the semiconductor substrate 11 is prevented from decreasing, and the photoelectric conversion efficiency can be prevented from being lowered. .
又,太陽電池單元10,因為可以抑制製作太陽電池模組100時太陽電池單元10彎曲,可以使用更薄的半導體基板11降低半導體基板11的成本,能夠對應廉價太陽電池單元10的實現。 Further, in the solar battery unit 10, since the solar battery unit 10 can be prevented from being bent when the solar battery module 100 is manufactured, the cost of the semiconductor substrate 11 can be reduced by using the thinner semiconductor substrate 11, and the realization of the inexpensive solar battery unit 10 can be achieved.
因此,根據本第一實施形態的太陽電池單元10,達到能夠抑制起因於對太陽電池單元接合引線的太陽電池單元彎曲之效果。 Therefore, according to the solar battery cell 10 of the first embodiment, it is possible to suppress the effect of bending the solar battery cells caused by the bonding of the solar battery cells.
第24圖係從受光面側所見本發明第二實施形態的太陽電池單元110之平面圖。第25圖係從面向受光面側的相反側的背面側所見本發明第二實施形態的太陽電池單元110之平面圖。第26圖係本發明第二實施形態的太陽電池模組的構成之主要部分剖面圖。第26圖,係對應第3圖的圖,以太陽電池單元110構成的本第二實施形態的太陽電池模組的主要部分剖面圖。第26圖中的太陽電池單元110的剖面圖,係第24圖中的XXII-XXIII線中的主要部分剖面圖。第27圖係顯示本發明第二實施形態的太陽電池單元110的受光面電極112的構成條件圖。第28圖係顯示本發明第二實施形態的太陽電池單元110的背面連接電極113B的構成條件圖。 Fig. 24 is a plan view showing the solar battery cell 110 of the second embodiment of the present invention as seen from the side of the light receiving surface. Fig. 25 is a plan view showing the solar battery cell 110 according to the second embodiment of the present invention from the back side facing the side opposite to the light receiving surface side. Fig. 26 is a cross-sectional view showing the main part of the configuration of a solar battery module according to a second embodiment of the present invention. Fig. 26 is a cross-sectional view showing the main part of the solar battery module of the second embodiment, which is constituted by the solar battery unit 110, corresponding to Fig. 3; A cross-sectional view of the solar battery unit 110 in Fig. 26 is a cross-sectional view of a main portion in the line XXII-XXIII in Fig. 24. Fig. 27 is a view showing a configuration condition of the light-receiving surface electrode 112 of the solar battery cell 110 according to the second embodiment of the present invention. Fig. 28 is a view showing a configuration condition of the back surface connection electrode 113B of the solar battery cell 110 according to the second embodiment of the present invention.
本第二實施形態的太陽電池單元110,取代由受光面柵電極12G與受光面匯流排電極12B構成的受光面電極12,包括由受光面柵電極12G與受光面匯流排電極112B構成的受光面電極112。又,太陽電池單元110,取代由背面集電電極13A與背面連接電極13B構成的背面電極13,包括由背面集電電極13A與背面連接電極113B構成的背面電極113。太陽電池單元110,除了受光面電極112以及背面電極113之外,具有與第一實施形態的太陽電池單元10相同的構成。關於太陽電池單元110中與第一實施形態的太陽電池單元10相同的構成,附上相同的符號,省略詳細的說明。 In the solar battery cell 110 of the second embodiment, the light-receiving surface electrode 12 including the light-receiving surface electrode 12G and the light-receiving surface bus electrode 12B includes a light-receiving surface including the light-receiving surface electrode 12G and the light-receiving surface bus electrode 112B. Electrode 112. Further, the solar battery unit 110 includes a back surface electrode 113 including a back surface collecting electrode 13A and a back surface connecting electrode 113B instead of the back surface electrode 13 including the back surface collecting electrode 13A and the back surface connecting electrode 13B. The solar battery cell 110 has the same configuration as the solar battery cell 10 of the first embodiment except for the light-receiving surface electrode 112 and the back surface electrode 113. In the solar battery unit 110, the same components as those of the solar battery unit 10 of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
受光面匯流排電極112B,與受光面匯流排電極12B的配置不同。背面連接電極113B,與背面連接電極13B的配置不同。 The light-receiving surface bus bar electrode 112B is different from the arrangement of the light-receiving surface bus bar electrode 12B. The back surface connection electrode 113B is different from the arrangement of the back surface connection electrode 13B.
受光面匯流排電極112B,在太陽電池單元110中設置4條。太陽電池單元110,具有長方形狀半導體基板11,有互相平行的一對端部,第1端邊部與第2端邊部。在此,第1端邊部,係第1方向中的太陽電池單元110的一方端部的一端101側的邊。又,第2端邊部,係第1方向中的太陽電池單元110的另一方端部,與一端101平行,在第1方向中與一端101相反側的另一端102側的邊。各個受光面匯流排電極112B中,在第1方向中從太陽電池單元110的一端101側往另一端102側,配置第1區域611、第1區域612、第1區域613、第1區域614、第1區域615、第1區域616、第1區域617、第1區域618。 The light-receiving surface bus electrode 112B is provided in four solar battery cells 110. The solar battery unit 110 has a rectangular semiconductor substrate 11 and has a pair of end portions which are parallel to each other, and a first end side portion and a second end side portion. Here, the first end side portion is a side on the one end 101 side of one end portion of the solar battery cell 110 in the first direction. Further, the second end portion is the other end portion of the solar battery cell 110 in the first direction, parallel to the one end 101, and the other end 102 side opposite to the one end 101 in the first direction. In each of the light-receiving surface bus electrodes 112B, the first region 611, the first region 612, the first region 613, and the first region 614 are disposed from the one end 101 side to the other end 102 side of the solar battery cell 110 in the first direction. The first region 615, the first region 616, the first region 617, and the first region 618.
在此,第1方向中的太陽電池單元110的一端101側,係以引線20連接受光面匯流排電極112B的鄰接的太陽電池單元110配置側的端部側,對應第24到26圖中的太陽電池單元110的左側。太陽電池單元110中,以引線20連接受光面匯流排電極112B的鄰接的太陽電池單元110配置側的端部,係受光面側中互相連接側的端部。 Here, the one end 101 side of the solar battery cell 110 in the first direction is connected to the end side of the arrangement side of the solar cell unit 110 adjacent to the light-receiving surface bus bar electrode 112B by the lead wire 20, corresponding to the 24th to 26th views. The left side of the solar battery unit 110. In the solar battery unit 110, the end portion on the side where the adjacent solar battery cells 110 are disposed on the light-receiving surface bus bar electrode 112B is connected to the end portion on the light-receiving side.
又,第1方向中的太陽電池單元110的另一端102側,係以引線20連接受光面匯流排電極112B的鄰接的太陽電池單元110未配置側的端部側,對應第24到26圖中的太陽電池單元110的右側。太陽電池單元110中,以引線20連接受光面匯流排電極112B的鄰接的太陽電池單元110未配置側的端部,係受光面側中非互相連接側的端部。 Further, the other end 102 side of the solar battery cell 110 in the first direction is connected to the end portion side of the adjacent solar battery cell 110 on the side where the light-receiving surface bus bar electrode 112B is not disposed, and corresponds to the 24th to 26th views. The right side of the solar battery unit 110. In the solar battery unit 110, the end portion on the side where the adjacent solar battery cells 110 are not disposed on the light-receiving surface bus bar electrode 112B is connected by the lead wires 20, and is the end portion on the light-receiving side that is not connected to each other.
又,受光面匯流排電極112B的長邊方向中第1區域的長度即第1方向中的第1區域的長度,其第1區域611的長度 是第1區域長度A1、第1區域612的長度是第1區域長度A2、第1區域613的長度是第1區域長度A3、第1區域614的長度是第1區域長度A4、第1區域615的長度是第1區域長度A5、第1區域616的長度是第1區域長度A6、第1區域617的長度是第1區域長度A7、第1區域618的長度是第1區域長度A8。 Further, the length of the first region in the longitudinal direction of the light-receiving surface bus bar electrode 112B is the length of the first region in the first direction, and the length of the first region 611 is the length of the first region length A1 and the length of the first region 612. The length of the first region length A2, the first region 613 is the first region length A3, the length of the first region 614 is the first region length A4, and the length of the first region 615 is the first region length A5 and the first region 616. The length of the first region is A6, the length of the first region 617 is the length A7 of the first region, and the length of the first region 618 is the length A8 of the first region.
又,第1方向中,太陽電池單元110的一端101到第1區域611的距離是距離B1、第1區域611與第1區域612之間的距離是距離B2、第1區域612與第1區域613之間的距離是距離B3、第1區域613與第1區域614之間的距離是距離B4、第1區域614與第1區域615之間的距離是距離B5、第1區域615與第1區域616之間的距離是距離B6、第1區域616與第1區域617之間的距離是距離B7、第1區域617與第1區域618之間的距離是距離B8、第1區域618到太陽電池單元110的另一端102的距離是距離B9。 Further, in the first direction, the distance from the one end 101 of the solar battery cell 110 to the first region 611 is the distance B1, the distance between the first region 611 and the first region 612 is the distance B2, the first region 612, and the first region. The distance between 613 is distance B3, the distance between first region 613 and first region 614 is distance B4, the distance between first region 614 and first region 615 is distance B5, first region 615 and first The distance between the regions 616 is the distance B6, the distance between the first region 616 and the first region 617 is the distance B7, the distance between the first region 617 and the first region 618 is the distance B8, and the first region 618 to the sun. The distance from the other end 102 of the battery unit 110 is the distance B9.
背面連接電極113B,在太陽電池單元110中設置4條。半導體基板11的面內對應第1區域61的位置上,設置與受光面匯流排電極112B的第1區域61的數量相同數量的背面連接電極113B。各個背面連接電極113B中,第1方向中從太陽電池單元110的一端101側往另一端102側,配置背面連接電極1131、背面連接電極1132、背面連接電極1133、背面連接電極1134、背面連接電極1135、背面連接電極1136、背面連接電極1137、背面連接電極1138。 The back surface connection electrode 113B is provided in four solar battery cells 110. The back surface connection electrode 113B of the same number as the number of the first regions 61 of the light-receiving surface bus bar electrode 112B is provided in the in-plane corresponding to the first region 61 of the semiconductor substrate 11. In each of the back surface connection electrodes 113B, the back surface connection electrode 1131, the back surface connection electrode 1132, the back surface connection electrode 1133, the back surface connection electrode 1134, and the back surface connection electrode are disposed from the one end 101 side of the solar cell unit 110 to the other end 102 side in the first direction. 1135, a back surface connection electrode 1136, a back surface connection electrode 1137, and a back surface connection electrode 1138.
背面連接電極113B,配置在半導體基板11的面內對應第1區域61的位置。因此,半導體基板11的面內,背面連 接電極1131配置在與第1區域611對應的位置,背面連接電極1132配置在與第1區域612對應的位置,背面連接電極1133配置在與第1區域613對應的位置,背面連接電極1134配置在與第1區域614對應的位置,背面連接電極1135配置在與第1區域615對應的位置,背面連接電極1136配置在與第1區域616對應的位置,背面連接電極1137配置在與第1區域617對應的位置,背面連接電極1138配置在與第1區域618對應的位置。 The back surface connection electrode 113B is disposed at a position corresponding to the first region 61 in the plane of the semiconductor substrate 11. Therefore, in the in-plane of the semiconductor substrate 11, the back surface connection electrode 1131 is disposed at a position corresponding to the first region 611, the back surface connection electrode 1132 is disposed at a position corresponding to the first region 612, and the back surface connection electrode 1133 is disposed in the first region 613. In the corresponding position, the back surface connection electrode 1134 is disposed at a position corresponding to the first region 614, the back surface connection electrode 1135 is disposed at a position corresponding to the first region 615, and the back surface connection electrode 1136 is disposed at a position corresponding to the first region 616, and the back surface The connection electrode 1137 is disposed at a position corresponding to the first region 617, and the back surface connection electrode 1138 is disposed at a position corresponding to the first region 618.
在此,上述的第1方向中太陽電池單元110的一端101側,係以引線20連接背面連接電極113B的鄰接太陽電池單元110未配置側的端部側。太陽電池單元110中,以引線20連接背面連接電極113B的鄰接太陽電池單元110未配置側的端部,係背面側中非互相連接側的端部。 Here, in the first direction, the one end 101 side of the solar battery cell 110 in the first direction is connected to the end portion side of the back surface connection electrode 113B adjacent to the undisposed side of the solar battery cell 110 by the lead wire 20. In the solar battery unit 110, the end portion of the back surface connection electrode 113B adjacent to the undisposed side of the solar battery cell 110 is connected by the lead wire 20, and is the end portion on the back side which is not connected to each other.
又,第1方向中太陽電池單元110的另一端102側,以引線20連接背面連接電極113B的鄰接太陽電池單元110配置側的端部側。太陽電池單元110中,以引線20連接背面連接電極113B的鄰接太陽電池單元110配置側的端部,係背面側中互相連接側的端部。 Further, on the other end 102 side of the solar battery cell 110 in the first direction, the end portion side of the back surface connection electrode 113B adjacent to the arrangement side of the solar battery cells 110 is connected by a lead wire 20. In the solar battery unit 110, the end portion of the back surface connection electrode 113B adjacent to the arrangement side of the solar battery cell 110 is connected by the lead wire 20, and the end portion on the back side of the back side is connected.
又,第1方向中的背面連接電極113B的長度,其背面連接電極1131的長度是背面連接電極長度C1、背面連接電極1132的長度是背面連接電極長度C2、背面連接電極1133的長度是背面連接電極長度C3、背面連接電極1134的長度是背面連接電極長度C4、背面連接電極1135的長度是背面連接電極長度C5、背面連接電極1136的長度是背面連接電極長度C6、背面連接電極1137的長度是背面連接電極長度C7、背面 連接電極1138的長度是背面連接電極長度C8。 Further, the length of the back surface connection electrode 113B in the first direction is such that the length of the back surface connection electrode 1131 is the length of the back surface connection electrode C1, the length of the back surface connection electrode 1132 is the length of the back surface connection electrode C2, and the length of the back surface connection electrode 1133 is the back side connection. The length of the electrode length C3, the length of the back surface connection electrode 1134 is the length of the back surface connection electrode C4, the length of the back surface connection electrode 1135 is the length of the back surface connection electrode C5, the length of the back surface connection electrode 1136 is the length of the back surface connection electrode C6, and the length of the back surface connection electrode 1137 is The length of the back surface connection electrode length C7 and the back surface connection electrode 1138 is the back surface connection electrode length C8.
又,第1方向中,太陽電池單元110的一端101到背面連接電極1131的距離是距離D1、背面連接電極1131與背面連接電極1132之間的距離是距離D2、背面連接電極1132與背面連接電極1133之間的距離是距離D3、背面連接電極1133與背面連接電極1134之間的距離是距離D4、背面連接電極1134與背面連接電極1135之間的距離是距離D5、背面連接電極1135與背面連接電極1136之間的距離是距離D6、背面連接電極1136與背面連接電極1137之間的距離是距離D7、背面連接電極1137與背面連接電極1138之間的距離是距離D8、背面連接電極1138到太陽電池單元110的另一端102的距離是距離D9。 Further, in the first direction, the distance from the one end 101 of the solar battery cell 110 to the back surface connection electrode 1131 is the distance D1, the distance between the back surface connection electrode 1131 and the back surface connection electrode 1132 is the distance D2, the back surface connection electrode 1132 and the back surface connection electrode The distance between 1133 is the distance D3, the distance between the back connection electrode 1133 and the back connection electrode 1134 is the distance D4, the distance between the back connection electrode 1134 and the back connection electrode 1135 is the distance D5, and the back connection electrode 1135 is connected to the back side. The distance between the electrodes 1136 is the distance D6, the distance between the back surface connection electrode 1136 and the back surface connection electrode 1137 is the distance D7, the distance between the back surface connection electrode 1137 and the back surface connection electrode 1138 is the distance D8, and the back surface connection electrode 1138 to the sun. The distance from the other end 102 of the battery unit 110 is the distance D9.
半導體基板11,例如是156mm邊長的正方形狀。第1區域長度A1、第1區域長度A2、第1區域長度A3、第1區域長度A4、第1區域長度A5、第1區域長度A6以及第1區域長度A7,例如是5mm。第1區域長度A8,比第1區域長度A1到第1區域長度A7長,例如是11mm。距離B1以及距離B9,例如是0.5mm。距離B2以及距離B8,例如是7mm。距離B3、距離B4、距離B5、距離B6以及距離B7,例如是19mm。 The semiconductor substrate 11 is, for example, a square shape having a side length of 156 mm. The first region length A1, the first region length A2, the first region length A3, the first region length A4, the first region length A5, the first region length A6, and the first region length A7 are, for example, 5 mm. The first region length A8 is longer than the first region length A1 to the first region length A7, and is, for example, 11 mm. The distance B1 and the distance B9 are, for example, 0.5 mm. The distance B2 and the distance B8 are, for example, 7 mm. The distance B3, the distance B4, the distance B5, the distance B6, and the distance B7 are, for example, 19 mm.
背面連接電極長度C1、背面連接電極長度C2、背面連接電極長度C3、背面連接電極長度C4、背面連接電極長度C5、背面連接電極長度C6、背面連接電極長度C7、背面連接電極長度C8,例如是5mm。距離D9比距離D1長,有距離D1<距離D9的關係。例如距離D1=0.5mm、距離D9=6.5mm。 距離D2以及距離D8,例如是7mm。距離D3、距離D4、距離D5、距離D6以及距離D7,例如是19mm。 The back surface connection electrode length C1, the back surface connection electrode length C2, the back surface connection electrode length C3, the back surface connection electrode length C4, the back surface connection electrode length C5, the back surface connection electrode length C6, the back surface connection electrode length C7, and the back surface connection electrode length C8 are, for example, 5mm. The distance D9 is longer than the distance D1 and has a relationship of distance D1 < distance D9. For example, the distance D1 = 0.5 mm and the distance D9 = 6.5 mm. The distance D2 and the distance D8 are, for example, 7 mm. The distance D3, the distance D4, the distance D5, the distance D6, and the distance D7 are, for example, 19 mm.
太陽電池單元110的受光面側,在第1方向中,最好設置受光面匯流排電極112B直到太陽電池單元110的兩端為止。另一方面,太陽電池單元110的背面側,特別在成為引線連接側的另一端102側,在第1方向中,最好加長太陽電池單元110的端面到背面連接電極113B的距離。 On the light-receiving surface side of the solar cell unit 110, it is preferable to provide the light-receiving surface bus bar electrode 112B to both ends of the solar cell unit 110 in the first direction. On the other hand, on the back side of the solar battery cell 110, particularly in the other end 102 side which is the lead connection side, it is preferable to lengthen the distance from the end surface of the solar battery cell 110 to the back surface connection electrode 113B in the first direction.
太陽電池單元110的受光面側,成為凸狀的曲面。即,因為使用包含鋁的電極材料的背面集電電極13A在太陽電池單元110的背面全體形成,起因於鋁與矽的熱膨脹係數的差之彎曲在太陽電池單元110中發生。一般,因為鋁的熱膨脹係數比矽的熱膨脹係數大,電極燒成的熱處理後,在太陽電池單元110中發生受光面側變凸的彎曲。 The light receiving surface side of the solar cell unit 110 has a convex curved surface. That is, since the back surface collector electrode 13A using the electrode material containing aluminum is formed on the entire back surface of the solar cell unit 110, the bending due to the difference in thermal expansion coefficient between aluminum and tantalum occurs in the solar cell unit 110. In general, since the coefficient of thermal expansion of aluminum is larger than the coefficient of thermal expansion of ytterbium, after the heat treatment for firing of the electrode, the light-receiving surface side is convexly curved in the solar cell unit 110.
於是,對太陽電池單元110焊接引線20之際,因為受光面是凸狀,太陽電池單元110與引線20之間,產生太陽電池單元110的受光面的垂直方向上剝離引線20的應力。於是,此剝離的應力,在太陽電池單元110端部變得最大。 Then, when the lead wire 20 is soldered to the solar battery cell 110, since the light receiving surface is convex, the stress of the lead wire 20 is peeled off in the vertical direction of the light receiving surface of the solar battery cell 110 between the solar battery cell 110 and the lead wire 20. Thus, the stress of the peeling becomes maximum at the end of the solar cell unit 110.
在此,在太陽電池單元110的受光面側,由於直到第1方向中的半導體基板11的兩端為止設置受光面匯流排電極112B,可以加強太陽電池單元110端部側的受光面匯流排電極112B與引線20之間的接合強度。即,如上述,直到第1方向中距離B1以及距離B9形成0.5mm的位置為止,形成受光面匯流排電極12G。於是,直到第1方向中的兩端受光面匯流排電極12G為止設置受光面匯流排電極112B,直到第1方 向中的半導體基板11兩端的位置為止設置受光面匯流排電極112B。藉此,太陽電池單元110,可以更加強端部側中的受光面匯流排電極112B與引線20之間的接合強度。於是,藉由第1方向中的受光面匯流排電極112B兩端以第1區域構成,可以加強端部側中的受光面匯流排電極112B與引線20之間的接合強度。第1方向中的受光面匯流排電極112B兩端以第2區域62構成時,因為受光面匯流排電極112B的端部只以連接部63與引線20焊接,接合強度下降。 Here, on the light-receiving surface side of the solar cell unit 110, since the light-receiving surface bus bar electrode 112B is provided up to both ends of the semiconductor substrate 11 in the first direction, the light-receiving surface bus bar electrode on the end side of the solar cell unit 110 can be reinforced. Bond strength between 112B and lead 20. In other words, as described above, the light-receiving surface bus bar electrode 12G is formed until the distance B1 and the distance B9 in the first direction form a position of 0.5 mm. Then, the light-receiving surface bus bar electrode 112B is provided until the light-receiving surface bus bar electrode 12G is received at both ends in the first direction, and the light-receiving surface bus bar electrode 112B is provided until the position of both ends of the semiconductor substrate 11 in the first direction. Thereby, the solar battery unit 110 can further strengthen the joint strength between the light-receiving surface bus bar electrode 112B and the lead wire 20 in the end side. Then, both ends of the light-receiving surface bus bar electrode 112B in the first direction are formed by the first region, and the joint strength between the light-receiving surface bus bar electrode 112B and the lead wire 20 in the end portion side can be enhanced. When the both ends of the light-receiving surface bus bar electrode 112B in the first direction are formed by the second region 62, the end portion of the light-receiving surface bus bar electrode 112B is welded only to the lead wire 20 by the connecting portion 63, and the joint strength is lowered.
又,太陽電池單元110中,半導體基板11,具有長方形狀,具有第1方向中的太陽電池單元110的端部即第1端邊部以及第1方向中與第1端邊部相反側的太陽電池單元110的端部即第2端邊部。於是,相鄰第2端邊部的背面連接電極113B與第2端邊部的距離,比相鄰第1端邊部的背面連接電極113B與第1端邊部的距離長。 Further, in the solar cell unit 110, the semiconductor substrate 11 has a rectangular shape, and has a first end side portion which is an end portion of the solar cell unit 110 in the first direction, and a sun opposite to the first end side portion in the first direction. The end of the battery unit 110 is the second end portion. Then, the distance between the back surface connection electrode 113B adjacent to the second end side portion and the second end side portion is longer than the distance between the back surface connection electrode 113B and the first end side portion of the adjacent first end side portion.
上述第一實施形態的太陽電池單元10,在第1方向中,對第1方向中的中央位置具有對稱的構成。因此,太陽電池單元10之間以引線20連接時,如第3圖所示,引線20從圖中的左下到右上延續配置,連接相鄰的太陽電池單元10之間的構成,以及對於第3圖所示的相鄰的太陽電池單元10,引線20從圖中的左上到右下延續配置,連接相鄰的太陽電池單元10之間的構成是等價的構成。 The solar battery cell 10 of the first embodiment has a symmetrical configuration with respect to the center position in the first direction in the first direction. Therefore, when the solar battery cells 10 are connected by the lead wires 20, as shown in FIG. 3, the lead wires 20 are continuously disposed from the lower left to the upper right in the drawing, and the configuration between the adjacent solar battery cells 10 is connected, and for the third. In the adjacent solar battery cells 10 shown in the drawing, the lead wires 20 are arranged from the upper left to the lower right in the drawing, and the configuration between the adjacent solar battery cells 10 is equivalent.
相對於此,本第二實施形態的太陽電池單元110,在第1方向中,對第1方向中的中央位置具有非對稱的構成。因此,太陽電池單元110之間以引線20連接時,如第26圖所 示,引線20從圖中的左下到右上延續配置,連接相鄰的太陽電池單元110之間的構成,以及對於第26圖所示的相鄰的太陽電池單元110,引線20從圖中的左上到右下延續配置,連接相鄰的太陽電池單元110之間的構成不是等價的構成。 On the other hand, in the solar battery unit 110 of the second embodiment, the central position in the first direction has an asymmetrical configuration in the first direction. Therefore, when the solar battery cells 110 are connected by the lead wires 20, as shown in FIG. 26, the lead wires 20 are continuously disposed from the lower left to the upper right in the drawing, and the configuration between the adjacent solar battery cells 110 is connected, and for the 26th. In the adjacent solar battery cells 110 shown in the drawing, the lead wires 20 are arranged from the upper left to the lower right in the drawing, and the configuration between the adjacent solar battery cells 110 is not equivalent.
在此,引線20從左下到右上延續配置,連接相鄰的太陽電池單元10之間的構成,如第3圖所示係左右配置的太陽電池單元10中,左側的太陽電池單元10的背面連接電極13B與右側的太陽電池單元10的受光面匯流排電極12B以引線20連接的構成。又,引線20從左上到右下延續配置,連接相鄰的太陽電池單元10之間的構成,係左右配置的太陽電池單元10中,左側的太陽電池單元10的受光面匯流排電極12B與右側的太陽電池單元10的背面連接電極13B以引線20連接的構成。 Here, the lead wires 20 are continuously disposed from the lower left to the upper right, and the configuration between the adjacent solar battery cells 10 is connected. As shown in FIG. 3, the solar battery cells 10 disposed in the left and right directions are connected to the rear side of the solar battery cells 10 on the left side. The electrode 13B is connected to the light-receiving surface bus bar electrode 12B of the solar battery cell 10 on the right side by a lead wire 20. Further, the lead wires 20 are arranged from the upper left to the lower right, and the configuration between the adjacent solar battery cells 10 is connected to the solar cell unit 10 disposed on the left and right sides, and the light receiving surface of the solar cell unit 10 on the left side is connected to the drain electrode 12B and the right side. The back surface of the solar battery cell 10 is connected to the electrode 13B by a lead wire 20.
具有上述構成的太陽電池單元110的背面側,在太陽電池單元110中的背面側的互相連接側的端部即太陽電池單元110的另一端102側,由於加長太陽電池單元110的端面到背面連接電極113B的距離,即背面連接電極1138到太陽電池單元110的另一端102的距離D9,有以下的效果。 The rear surface side of the solar battery cell 110 having the above-described configuration is the end surface to the back surface of the solar battery cell 110 which is lengthened on the side of the rear side of the solar battery cell 110 on the side of the interconnection side, that is, the other end 102 side of the solar battery cell 110. The distance of the electrode 113B, that is, the distance D9 from the back surface connection electrode 1138 to the other end 102 of the solar cell unit 110 has the following effects.
如第26圖所示,本第二實施形態的太陽電池模組,以引線20連接複數的太陽電池單元110,從一方的太陽電池單元110a的背面側曲線狀連接引線20到另一方的太陽電池單元110b的受光面側。即,本第二實施形態的太陽電池模組,以第26圖中配置在左側的一方的太陽電池單元110的第2端邊部與第26圖中配置在右側的另一方的太陽電池單元110的第1端邊部對向的狀態配置,一方的太陽電池單元110與另一 方的太陽電池單元110在第1方向中相鄰。又,本第二實施形態的太陽電池模組,具有連接一方的太陽電池單元110的背面連接電極113B與另一方的太陽電池單元110的受光面匯流排電極112B之引線20。於是,引線20,連接一方的太陽電池單元110中在第2端邊部側的背面連接電極113B與另一方的太陽電池單元110中在第1端邊部側的受光面匯流排電極112B。 As shown in Fig. 26, in the solar battery module of the second embodiment, a plurality of solar battery cells 110 are connected by leads 20, and the lead wires 20 are connected in a curved shape from the back side of one of the solar battery cells 110a to the other solar battery. The light receiving surface side of the unit 110b. In other words, in the solar battery module according to the second embodiment, the second end portion of the solar battery unit 110 disposed on the left side in FIG. 26 and the other solar battery unit 110 disposed on the right side in FIG. 26 are provided. The first end side portion is disposed opposite to each other, and one of the solar battery cells 110 and the other solar battery unit 110 are adjacent to each other in the first direction. Further, the solar battery module according to the second embodiment has the lead wire 20 that connects the back surface connection electrode 113B of one of the solar battery cells 110 and the light receiving surface bus bar electrode 112B of the other solar battery cell 110. Then, the lead wire 20 is connected to the light-receiving surface of the solar cell unit 110 on the second end side and the light-receiving surface of the other solar cell 110 on the light-receiving surface of the other end side.
距離D1<距離D9,而且由於從太陽電池單元110a的背面側往旁邊的太陽電池單元110b的受光面側配置引線20,因為彎曲引線20為曲線狀的彎曲部20a的長度變長,引線20的彎曲部20a的彎曲半徑變大,降低對引線20的彎曲部20a的應力集中。尤其,雖然期待太陽電池模組10年以上的壽命而設計,但起因於成為受光面保護部31的受光面玻璃與引線20的線膨脹係數的差等,由於日夜的溫度循環引線20的彎曲部20a中產生重複應力而發生斷線,成為故障的主因。在此,藉由增大引線20的彎曲部20a的彎曲半徑,因為可以縮小施加於彎曲部20a的重複應力,可以實現長期可靠性優異的太陽電池模組。 The distance D1 is the distance D9, and since the lead wire 20 is disposed on the light-receiving surface side of the solar battery cell 110b from the back side of the solar battery cell 110a, the length of the bent portion 20a of the curved lead wire 20 is long, and the lead wire 20 is long. The bending radius of the curved portion 20a is increased to reduce the stress concentration on the curved portion 20a of the lead wire 20. In particular, although the solar cell module is expected to have a life of more than 10 years, it is caused by a difference in linear expansion coefficient between the light-receiving surface glass and the lead 20 of the light-receiving surface protecting portion 31, and the curved portion of the temperature-circulating lead 20 is turned on day and night. Repeated stress occurs in 20a and breaks, which becomes the main cause of failure. Here, by increasing the bending radius of the curved portion 20a of the lead 20, it is possible to reduce the repeated stress applied to the curved portion 20a, and it is possible to realize a solar battery module excellent in long-term reliability.
太陽電池單元110中,受光面側中非互相連接側的端部側以外的第1區域61,即另一端102側以外的第1區域61與背面連接電極113B,最好設置在受光面與背面中對應的位置。即,第1區域611到第1區域617,最好分別設置在背面連接電極1131到背面連接電極1137與太陽電池單元110的面內對應的位置。藉此,第1區域618與背面連接電極1138以外,受光面匯流排電極112B與引線20的固定位置以及利用焊接的背面連接電極113B與引線20的固定位置,在半導體基 板11的面內成為相同的位置。藉此,太陽電池單元110,與上述太陽電池單元10相同,可以抑制起因於製作太陽電池模組時對太陽電池單元110焊接引線20之太陽電池單元110的彎曲。因此,太陽電池單元110,能夠使製作太陽電池模組時太陽電池單元110的彎曲引起的太陽電池單元110破損率降低。 In the solar battery unit 110, the first region 61 other than the end portion side on the non-interconnecting side of the light receiving surface side, that is, the first region 61 and the back surface connecting electrode 113B other than the other end 102 side are preferably provided on the light receiving surface and the back surface. The corresponding position in . In other words, it is preferable that the first region 611 to the first region 617 are provided at positions corresponding to the inside of the surface of the solar cell unit 110 from the back surface connection electrode 1131 to the back surface connection electrode 1137. Thereby, the fixed position of the light-receiving surface bus bar electrode 112B and the lead 20 and the fixed position of the back surface connection electrode 113B and the lead 20 by soldering are the same in the surface of the semiconductor substrate 11 except for the first region 618 and the back surface connection electrode 1138. s position. Thereby, the solar battery unit 110 can suppress the bending of the solar battery unit 110 which welds the lead wires 20 to the solar battery cells 110 when the solar battery module is manufactured, similarly to the above-described solar battery unit 10. Therefore, the solar battery unit 110 can reduce the breakage rate of the solar battery unit 110 caused by the bending of the solar battery unit 110 when the solar battery module is manufactured.
受光面匯流排電極112B中,第1方向的端部側中相鄰的第1區域間的間隔,最好比包含第1方向的中央部中相鄰的第1區域間的間隔之第1方向的內部側中相鄰的第1區域間的間隔短。即,受光面匯流排電極112B中,第1方向的端部側的第2區域的長度,最好比第1方向的內部側的第2區域的長度短。因此,最好形成(距離B2=距離D2=距離B8=距離D8)<(距離B3=距離D3、距離B4=距離D4、距離B5=距離D5、距離B6=距離D6、距離B7=距離D7)。 In the light-receiving surface bus bar electrode 112B, the interval between the adjacent first regions in the first-direction end portion is preferably the first direction of the interval between the adjacent first regions in the central portion including the first direction. The interval between adjacent first regions in the inner side is short. In other words, in the light-receiving surface bus bar electrode 112B, the length of the second region on the end side in the first direction is preferably shorter than the length of the second region on the inner side in the first direction. Therefore, it is preferable to form (distance B2 = distance D2 = distance B8 = distance D8) < (distance B3 = distance D3, distance B4 = distance D4, distance B5 = distance D5, distance B6 = distance D6, distance B7 = distance D7) .
如上述,對太陽電池單元110焊接引線20之際,太陽電池單元110,因為受光面側是凸狀,太陽電池單元110與引線20之間,太陽電池單元110的受光面的垂直方向上剝離引線20的應力在第1方向的端部側變最大。相對於此,藉由使第1方向的端部側的第2區域的長度比第1方向的內部側的第2區域的長度短,可以加強第1方向的端部側的受光面匯流排電極112B與引線20的接合強度。 As described above, when the solar battery cell 110 is soldered to the lead wire 20, the solar battery cell 110 has a convex shape on the light receiving surface side, and the lead wire is peeled off between the solar battery cell 110 and the lead wire 20 in the vertical direction of the light receiving surface of the solar battery cell 110. The stress of 20 becomes maximum on the end side in the first direction. On the other hand, the length of the second region on the end side in the first direction is shorter than the length of the second region on the inner side in the first direction, so that the light-receiving surface bus bar electrode on the end side in the first direction can be reinforced. Bond strength of 112B to lead 20.
如上述,本第二實施形態的太陽電池單元110中,除了第1區域618與背面連接電極1138以外,受光面匯流排電極112B與引線20的固定位置以及利用焊接的背面連接電極113B與引線20的固定位置,在半導體基板11的面內成為相 同位置。因此,太陽電池單元110,與上述太陽電池單元10相同,能夠使製作太陽電池模組時太陽電池單元110的彎曲引起的太陽電池單元110破損率降低。 As described above, in the solar battery cell 110 of the second embodiment, in addition to the first region 618 and the back surface connection electrode 1138, the fixing position of the light-receiving surface bus bar electrode 112B and the lead wire 20 and the back surface connection electrode 113B and the lead wire 20 by soldering are used. The fixed position is the same position in the plane of the semiconductor substrate 11. Therefore, the solar battery unit 110 can reduce the breakage rate of the solar battery unit 110 caused by the bending of the solar battery unit 110 when the solar battery module is manufactured, similarly to the solar battery unit 10 described above.
又,本第二實施形態的太陽電池單元110中,太陽電池單元110中的背面側的互相連接側的端部即太陽電池單元110的另一端102側,加長太陽電池單元110的端面到背面連接電極113B的距離。因此,將連接相鄰的太陽電池單元110的引線20彎曲成曲線狀的彎曲部20a的長度變長。因此,可以降低對引線20的彎曲部20a的應力集中,起因於成為受光面保護部31的受光面玻璃與引線20的線膨脹係數的差等,因為可以減小由於日夜的溫度循環施加至彎曲部20a的重複應力,可以實現長期可靠性優異的太陽電池模組。 Further, in the solar battery unit 110 of the second embodiment, the end portion on the side of the back side of the solar battery cell 110, that is, the other end 102 side of the solar battery unit 110, lengthens the end surface to the back surface of the solar battery unit 110. The distance of the electrode 113B. Therefore, the length of the curved portion 20a that bends the lead 20 connecting the adjacent solar battery cells 110 into a curved shape becomes long. Therefore, it is possible to reduce the stress concentration on the curved portion 20a of the lead 20, which is caused by the difference in the linear expansion coefficient between the light-receiving surface glass and the lead 20 of the light-receiving surface protecting portion 31, because the temperature cycle due to day and night can be reduced to the bending. The repetitive stress of the portion 20a can realize a solar cell module excellent in long-term reliability.
第29圖係本發明第三實施形態的太陽電池單元210構成的剖面圖。第29圖,係通過貫通孔60並沿著受光面電極212的長邊方向的剖面,為了容易理解省略背面集電電極13A的圖示。第30圖係顯示本發明第三實施形態的太陽電池單元210的受光面電極212的構成條件圖。第31圖係顯示本發明第三實施形態的太陽電池單元210的背面連接電極213B的構成條件圖。 Figure 29 is a cross-sectional view showing the configuration of a solar battery cell 210 according to a third embodiment of the present invention. Fig. 29 is a cross section through the through hole 60 along the longitudinal direction of the light receiving surface electrode 212, and the back surface collecting electrode 13A is omitted for easy understanding. Fig. 30 is a view showing a configuration condition of the light-receiving surface electrode 212 of the solar battery cell 210 according to the third embodiment of the present invention. Fig. 31 is a view showing a configuration condition of the back surface connection electrode 213B of the solar battery cell 210 according to the third embodiment of the present invention.
本第三實施形態的太陽電池單元210,包括取代受光面匯流排電極112B,具有受光面匯流排電極212B的受光面電極212。又,本第三實施形態的太陽電池單元210,包括取代背面連接電極113B具有背面連接電極213B的背面電極213。太陽電池單元210,除了受光面電極212以及背面電極 213以外,具有與第二實施形態的太陽電池單元110相同的構成。關於太陽電池單元210中與第一實施形態的太陽電池單元10或第二實施形態的太陽電池單元110相同的構成,附上相同的符號,省略詳細的說明。 The solar battery cell 210 of the third embodiment includes a light-receiving surface electrode 212 having a light-receiving surface bus bar electrode 212B instead of the light-receiving surface bus bar electrode 112B. Further, the solar battery cell 210 of the third embodiment includes a back surface electrode 213 having a back surface connection electrode 213B instead of the back surface connection electrode 113B. The solar battery cell 210 has the same configuration as the solar battery cell 110 of the second embodiment except for the light-receiving surface electrode 212 and the back surface electrode 213. In the solar battery unit 210, the same components as those of the solar battery unit 10 of the first embodiment or the solar battery unit 110 of the second embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
受光面匯流排電極212B,與受光面匯流排電極112B的配置不同。背面連接電極213B,與背面連接電極113B的配置不同。 The light-receiving surface bus bar electrode 212B is different from the arrangement of the light-receiving surface bus bar electrode 112B. The back surface connection electrode 213B is different from the arrangement of the back surface connection electrode 113B.
受光面匯流排電極212B,與受光面匯流排電極112B相同,在太陽電池單元210中設置4條。又,各個受光面匯流排電極212B中,與受光面匯流排電極112B相同,沿著第1方向配置第1區域611、第1區域612、第1區域613、第1區域614、第1區域615、第1區域616、第1區域617、第1區域618。背面連接電極213B,與背面連接電極113B相同,沿著第1方向,遍及太陽電池單元210的大致全長分散8處配置成間隔踏腳石狀,設置成4列。 The light-receiving surface bus bar electrode 212B is the same as the light-receiving surface bus bar electrode 112B, and four solar cell units 210 are provided. Further, in each of the light-receiving surface bus bar electrodes 212B, the first region 611, the first region 612, the first region 613, the first region 614, and the first region 615 are arranged along the first direction, similarly to the light-receiving surface bus bar electrode 112B. The first region 616, the first region 617, and the first region 618. Similarly to the back surface connection electrode 113B, the back surface connection electrode 213B is disposed in four rows along the first direction so as to be spaced apart from each other over substantially the entire length of the solar battery cell 210.
半導體基板11的面內對應第1區域61的位置上,設置與受光面匯流排電極212B的第1區域61的數量相同數量的背面連接電極213B。 The back surface connection electrode 213B of the same number as the number of the first regions 61 of the light-receiving surface bus bar electrode 212B is provided in the in-plane corresponding to the first region 61 of the semiconductor substrate 11.
於是,受光面匯流排電極212B中位於第1方向中的端部側以外即第1方向中位於內部側之第1區域61與背面連接電極213B,從半導體基板11的面內方向的垂直方向透視半導體基板11時,第1方向中的中心位置位於相同位置。即,第1方向中,第1區域612的中心位置,與背面連接電極1132的中心位置位於相同位置。關於第1區域613的中心位置與背 面連接電極1133的中心位置、第1區域614的中心位置與背面連接電極1134的中心位置、第1區域615的中心位置與背面連接電極1135的中心位置、第1區域616的中心位置與背面連接電極1136的中心位置以及第1區域617的中心位置與背面連接電極1137的中心位置也相同。 Then, the first region 61 and the back surface connection electrode 213B located on the inner side in the first direction other than the end portion side in the first direction of the light-receiving surface bus bar electrode 212B are seen from the vertical direction of the in-plane direction of the semiconductor substrate 11. In the case of the semiconductor substrate 11, the center position in the first direction is at the same position. That is, in the first direction, the center position of the first region 612 is located at the same position as the center position of the back surface connection electrode 1132. The center position of the first region 613 and the center position of the back surface connection electrode 1133, the center position of the first region 614, the center position of the back surface connection electrode 1134, the center position of the first region 615, and the center position of the back surface connection electrode 1135, The center position of the 1 region 616 and the center position of the back surface connection electrode 1136 and the center position of the first region 617 are also the same as the center position of the back surface connection electrode 1137.
另一方面,受光面匯流排電極212B中位於第1方向中的端部側的第1區域611與背面連接電極1131,從半導體基板11的面內方向的垂直方向透視半導體基板11時,第1方向中的中心位置不是位於相同位置。即,第1方向中,第1區域611的中心位置,與背面連接電極1131的中心位置不同。同樣地,第1方向中,第1區域618的中心位置,與背面連接電極1138的中心位置不同。 On the other hand, when the first region 611 and the back surface connection electrode 1131 located on the end side in the first direction of the light-receiving surface bus bar electrode 212B are seen from the vertical direction of the in-plane direction of the semiconductor substrate 11, the first semiconductor substrate 11 is seen. The center position in the direction is not at the same position. That is, in the first direction, the center position of the first region 611 is different from the center position of the back surface connection electrode 1131. Similarly, in the first direction, the center position of the first region 618 is different from the center position of the back surface connection electrode 1138.
第1方向的內部側中相鄰的2個第1區域61的配置間距,係全部相同的配置間距。又,第1方向的內部側中相鄰的2個背面連接電極213B的配置間距,係全部相同的配置間距。於是,第1方向的內部側中相鄰的2個第1區域61的配置間距與第1方向的內部側中相鄰的2個背面連接電極213B的配置間距,是相同的配置間距。第1區域61的配置間距,是第1方向中第1區域61的中心位置間的距離。背面連接電極213B的配置間距,是第1方向中背面連接電極213B的中心位置間的距離。 The arrangement pitch of the adjacent two first regions 61 in the inner side in the first direction is the same arrangement pitch. Further, the arrangement pitches of the adjacent two back surface connection electrodes 213B on the inner side in the first direction are all the same arrangement pitch. Then, the arrangement pitch of the adjacent two first regions 61 in the inner side in the first direction is the same as the arrangement pitch of the two back surface connection electrodes 213B adjacent to the inner side in the first direction. The arrangement pitch of the first region 61 is the distance between the center positions of the first regions 61 in the first direction. The arrangement pitch of the back surface connection electrodes 213B is the distance between the center positions of the back surface connection electrodes 213B in the first direction.
即,第1區域612與第1區域613的配置間距、第1區域613與第1區域614的配置間距、第1區域614與第1區域615的配置間距、第1區域615與第1區域616的配置間距、第1區域616與第1區域617的配置間距、背面連接電 極1132與背面連接電極1133的配置間距、背面連接電極1133與背面連接電極1134的配置間距、背面連接電極1134與背面連接電極1135的配置間距、背面連接電極1135與背面連接電極1136的配置間距、背面連接電極1136與背面連接電極1137的配置間距,是相同的配置間距。 That is, the arrangement pitch of the first region 612 and the first region 613, the arrangement pitch of the first region 613 and the first region 614, the arrangement pitch of the first region 614 and the first region 615, and the first region 615 and the first region 616 Arrangement pitch, arrangement pitch of the first region 616 and the first region 617, arrangement pitch of the back surface connection electrode 1132 and the back surface connection electrode 1133, arrangement pitch of the back surface connection electrode 1133 and the back surface connection electrode 1134, and connection of the back surface connection electrode 1134 and the back surface The arrangement pitch of the electrodes 1135, the arrangement pitch of the back surface connection electrodes 1135 and the back surface connection electrodes 1136, and the arrangement pitch of the back surface connection electrodes 1136 and the back surface connection electrodes 1137 are the same arrangement pitch.
第1區域長度A2、第1區域長度A3、第1區域長度A4、第1區域長度A5、第1區域長度A6以及第1區域長度A7,是相同的。背面連接電極長度C2、背面連接電極長度C3、背面連接電極長度C4、背面連接電極長度C5、背面連接電極長度C6以及背面連接電極長度C7,是相同的。於是,第1區域長度A2比背面連接電極長度C2長。 The first region length A2, the first region length A3, the first region length A4, the first region length A5, the first region length A6, and the first region length A7 are the same. The back surface connection electrode length C2, the back surface connection electrode length C3, the back surface connection electrode length C4, the back surface connection electrode length C5, the back surface connection electrode length C6, and the back surface connection electrode length C7 are the same. Therefore, the length A2 of the first region is longer than the length C2 of the back surface connection electrode.
距離B3、距離B4、距離B5、距離B6以及距離B7,是相同的。距離D3、距離D4、距離D5、距離D6以及距離D7是相同的。於是,距離D3比距離B3長。 The distance B3, the distance B4, the distance B5, the distance B6, and the distance B7 are the same. The distance D3, the distance D4, the distance D5, the distance D6, and the distance D7 are the same. Thus, the distance D3 is longer than the distance B3.
因此,(第1區域長度A2+距離B3)=(第1區域長度A3+距離B4)=(第1區域長度A4+距離B5)=(第1區域長度A5+距離B6)=(第1區域長度A6+距離B7)=(背面連接電極長度C2+距離D3)=(背面連接電極長度C3+距離D4)=(背面連接電極長度C4+距離D5)=(背面連接電極長度C5+距離D6)=(背面連接電極長度C6+距離D7)。 Therefore, (first region length A2+ distance B3) = (first region length A3 + distance B4) = (first region length A4 + distance B5) = (first region length A5 + distance B6) = (first region length A6 + distance B7) )=(back connection electrode length C2+ distance D3)=(back connection electrode length C3+distance D4)=(back connection electrode length C4+distance D5)=(back connection electrode length C5+distance D6)=(back connection electrode length C6+distance D7) ).
因為使第1方向中第1區域612的中心位置與第1方向中背面連接電極1132的中心位置一致,第1方向中,太陽電池單元210的一端101到第1區域612的中心位置的距離與太陽電池單元210的一端101到背面連接電極1132的中心 位置的距離,形成相同的距離。即,形成(距離B1+第1區域長度A1+距離B2+第1區域長度A2/2)=(距離D1+背面連接電極長度C1+距離D2+背面連接電極長度C2/2)。 The center position of the first region 612 in the first direction coincides with the center position of the back surface connection electrode 1132 in the first direction, and the distance between the one end 101 of the solar battery cell 210 and the center position of the first region 612 in the first direction is The distance from the one end 101 of the solar cell unit 210 to the center position of the back surface connection electrode 1132 forms the same distance. That is, (distance B1 + first region length A1 + distance B2 + first region length A2/2) = (distance D1 + back surface connection electrode length C1 + distance D2 + back surface connection electrode length C2 / 2).
因為使第1方向中第1區域617的中心位置與第1方向中背面連接電極1137的中心位置一致,第1方向中,太陽電池單元210的另一端102到第1區域617的中心位置的距離與太陽電池單元210的另一端102到背面連接電極1137的中心位置的距離,形成相同的距離。即,形成(距離B9+第1區域長度A8+距離B8+第1區域長度A7/2)=(距離D9+背面連接電極長度C8+距離D8+背面連接電極長度C7/2)。 The center position of the first region 617 in the first direction coincides with the center position of the back surface connection electrode 1137 in the first direction, and the distance from the other end 102 of the solar battery cell 210 to the center position of the first region 617 in the first direction. The distance from the other end 102 of the solar cell unit 210 to the center position of the back surface connection electrode 1137 forms the same distance. That is, formation (distance B9 + first region length A8 + distance B8 + first region length A7/2) = (distance D9 + back surface connection electrode length C8 + distance D8 + back surface connection electrode length C7 / 2).
第1區域長度A1,比背面連接電極長度C1長。從半導體基板11的面內方向的垂直方向透視半導體基板11時,第1方向中,背面連接電極1131,配置在第1區域611的內側重疊第1區域611的位置,即第1方向中,背面連接電極1131,在第1區域611內包含的位置上。 The first region length A1 is longer than the back surface connection electrode length C1. When the semiconductor substrate 11 is seen in a direction perpendicular to the in-plane direction of the semiconductor substrate 11, the back surface connection electrode 1131 in the first direction is disposed at a position where the first region 611 is overlapped inside the first region 611, that is, in the first direction, the back surface The connection electrode 1131 is located at a position included in the first region 611.
第1區域長度A8,比背面連接電極長度C8長。從半導體基板11的面內方向的垂直方向透視半導體基板11時,第1方向中,背面連接電極1138,配置在第1區域618的內側重疊第1區域618的位置,即第1方向中,背面連接電極1138,在第1區域618內包含的位置上。 The first region length A8 is longer than the back surface connection electrode length C8. When the semiconductor substrate 11 is seen from the vertical direction of the in-plane direction of the semiconductor substrate 11, the back surface connection electrode 1138 is disposed in the first direction, and the first region 618 is placed on the inner side of the first region 618, that is, in the first direction, the back surface. The connection electrode 1138 is at a position included in the first region 618.
背面連接電極長度C1及背面連接電極長度C8,與背面連接電極長度C2相同。 The back surface connection electrode length C1 and the back surface connection electrode length C8 are the same as the back surface connection electrode length C2.
第1方向中,第1方向的端部側中相鄰的2個第1區域61的配置間距,比第1方向的內部側中相鄰的2個第1區 域61的配置間距短。即,受光面匯流排電極212B中,第1方向的端部側中相鄰的2個第1區域61間的間隔,比包含第1方向的中央部中相鄰的2個第1區域61間的間隔之第1方向的內部側中相鄰的2個第1區域61間的間隔短。因此,距離B2以及距離B8,比距離B3、距離B4、距離B5、距離B6以及距離B7短。 In the first direction, the arrangement pitch of the adjacent two first regions 61 in the end portion side in the first direction is shorter than the arrangement pitch of the two first regions 61 adjacent to the inner side in the first direction. In other words, in the light-receiving surface bus bar electrode 212B, the interval between the adjacent two first regions 61 in the end portion side in the first direction is larger than the interval between the two first regions 61 adjacent to the central portion including the first direction. The interval between the adjacent two first regions 61 in the inner side in the first direction is short. Therefore, the distance B2 and the distance B8 are shorter than the distance B3, the distance B4, the distance B5, the distance B6, and the distance B7.
第1方向中,第1方向的端部側中相鄰的2個背面連接電極213B的配置間距,比第1方向的內部側中相鄰的2個背面連接電極213B的配置間距短。即,一列的背面連接電極213B中,第1方向的端部側中相鄰的2個背面連接電極213B間的間隔,比包含第1方向的中央部中相鄰的2個背面連接電極213B間的間隔之第1方向的內部側中相鄰的2個背面連接電極213B間的間隔短。因此,距離D2以及距離D8,比距離D3、距離D4、距離D5、距離D6以及距離D7短。 In the first direction, the arrangement pitch of the two adjacent back surface connection electrodes 213B in the end side in the first direction is shorter than the arrangement pitch of the two back surface connection electrodes 213B adjacent to the inside in the first direction. In other words, in the back surface connection electrode 213B of one row, the interval between the adjacent two rear surface connection electrodes 213B on the end side in the first direction is larger than the interval between the two rear connection electrodes 213B adjacent to the center portion including the first direction. The interval between the adjacent two back surface connection electrodes 213B on the inner side in the first direction is short. Therefore, the distance D2 and the distance D8 are shorter than the distance D3, the distance D4, the distance D5, the distance D6, and the distance D7.
本第三實施形態的太陽電池單元210中,第1方向中的受光面匯流排電極212B的第1區域長度的合計,比第二實施形態的太陽電池單元110的受光面匯流排電極112B的第1區域長度的合計大幅加長。即,如第30圖所示,太陽電池單元210中的第1區域長度的合計,即第1區域長度A1到第1區域長度A8的合計,係76mm。另一方面,如第27圖所示,第二實施形態的太陽電池單元110的受光面匯流排電極112B中的第1區域長度的合計,即第1區域長度A1到第1區域長度A8的合計,係46mm。 In the solar battery cell 210 of the third embodiment, the total length of the first region of the light-receiving surface bus bar electrode 212B in the first direction is larger than that of the light-receiving surface bus bar electrode 112B of the solar battery cell 110 of the second embodiment. The total length of the 1 area is greatly lengthened. That is, as shown in Fig. 30, the total length of the first region in the solar battery cell 210, that is, the total of the first region length A1 to the first region length A8 is 76 mm. On the other hand, as shown in Fig. 27, the total length of the first region in the light-receiving surface bus bar electrode 112B of the solar battery cell 110 of the second embodiment is the total of the first region length A1 to the first region length A8. , is 46mm.
對受光面匯流排電極212B焊接引線20,主要進行第1區域61與引線20的焊接。因此,第1方向中受光面匯流 排電極212B與引線20的連接區域的長度,近似第1區域長度的合計。因此,第1區域長度的合計,可想為第1方向中受光面匯流排電極212B與引線20的連接區域的長度。 The lead wire 20 is soldered to the light-receiving surface bus bar electrode 212B, and the first region 61 and the lead wire 20 are mainly soldered. Therefore, the length of the connection region between the light-receiving surface bus bar electrode 212B and the lead wire 20 in the first direction is approximately the total length of the first region. Therefore, the total length of the first region is considered to be the length of the connection region between the light-receiving surface bus bar electrode 212B and the lead 20 in the first direction.
又,本第三實施形態的太陽電池單元210中,第1方向中的受光面匯流排電極212B的第1區域長度的合計,比第1方向中背面連接電極213B長度的合計長。因此,本第三實施形態的太陽電池單元210中,第1方向中受光面匯流排電極212B與引線20的連接區域的長度,比第1方向中背面連接電極213B與引線20的連接區域的長度長。即,如第31圖所示,背面連接電極長度C1到背面連接電極長度C8的合計,係48mm。另一方面,如第30圖所示,第1區域長度的合計,即第1區域長度A1到第1區域長度A8的合計,係76mm。 Further, in the solar battery cell 210 of the third embodiment, the total length of the first region of the light-receiving surface bus bar electrode 212B in the first direction is longer than the total length of the back surface connection electrode 213B in the first direction. Therefore, in the solar battery cell 210 of the third embodiment, the length of the connection region of the light-receiving surface bus bar electrode 212B and the lead wire 20 in the first direction is longer than the length of the connection region of the back surface connection electrode 213B and the lead wire 20 in the first direction. long. That is, as shown in Fig. 31, the total length of the back surface connection electrode length C1 to the back surface connection electrode length C8 is 48 mm. On the other hand, as shown in Fig. 30, the total length of the first region, that is, the total length of the first region A1 to the first region length A8 is 76 mm.
太陽電池單元210,因為使用包含鋁的電極材料的背面集電電極13A在太陽電池單元210的背面全體形成,電極燒成的熱處理後,在太陽電池單元210中發生受光面側變凸的彎曲。因此,凸狀曲面的太陽電池單元210的受光面側,比太陽電池單元210的背面側施加更多電極與引線20之間剝離引線20的應力。 In the solar battery cell 210, the back surface collector electrode 13A using an electrode material containing aluminum is formed on the entire back surface of the solar battery cell 210, and after the heat treatment for firing the electrode, the light-receiving surface side is convexly curved in the solar battery cell 210. Therefore, on the light-receiving surface side of the convex-curved solar battery cell 210, the stress of the lead wire 20 is peeled off between the electrode and the lead 20 more than the back surface side of the solar cell unit 210.
太陽電池單元210中,形成第1方向中的受光面匯流排電極212B與引線20的連接區域的長度,比第1方向中的背面連接電極213B的長度長。於是,太陽電池單元210中,形成第1方向中的受光面匯流排電極212B與引線20的連接區域的長度,比第二實施形態的太陽電池單元110中第1方向中的受光面匯流排電極112B與引線20的連接區域的長度長。因此,太陽電池單元210,由於確保第1方向中的受光面匯流排電極212B與 引線20的連接區域的長度長,提高第1方向中的受光面匯流排電極212B與引線20的接合強度,可以抑制引線20的剝離。 In the solar battery cell 210, the length of the connection region between the light-receiving surface bus bar electrode 212B and the lead 20 in the first direction is longer than the length of the back surface connection electrode 213B in the first direction. Then, in the solar battery cell 210, the length of the connection region between the light-receiving surface bus bar electrode 212B and the lead wire 20 in the first direction is formed, which is higher than the light-receiving surface bus bar electrode in the first direction of the solar battery cell 110 of the second embodiment. The length of the connection area between 112B and the lead 20 is long. Therefore, the solar battery cell 210 can increase the length of the connection region between the light-receiving surface bus bar electrode 212B and the lead wire 20 in the first direction, thereby improving the bonding strength between the light-receiving surface bus bar electrode 212B and the lead wire 20 in the first direction. The peeling of the lead 20 is suppressed.
另一方面,塗佈以及燒成使用包含銀的電極材料之銀膏而形成的銀膏電極之背面連接電極213B,比銀膏電極之受光面電極212,在燒成處理後的狀態中,形成玻璃成分較多的構成。銀膏電極,在燒成處理後,大半部分以銀與玻璃構成。銀膏電極中,銀具有使電流流動的功能。銀膏電極中,玻璃具有維持半導體基板11與電極的接合強度的機能。 On the other hand, the back surface connection electrode 213B of the silver paste electrode formed by coating and firing the silver paste containing the electrode material of silver is formed in a state after the firing treatment than the light-receiving surface electrode 212 of the silver paste electrode. A composition with a large amount of glass. The silver paste electrode is composed of silver and glass after the firing treatment. Among the silver paste electrodes, silver has a function of causing a current to flow. Among the silver paste electrodes, the glass has a function of maintaining the bonding strength between the semiconductor substrate 11 and the electrodes.
比較銀膏電極的受光面電極212與銀膏電極的背面連接電極213B時,受光面電極212,為了降低電極中的電阻,使電極材料中銀的比率比背面連接電極213B高。受光面電極212中,為了降低電極中的電阻,最好盡量提高電極材料中銀的比率。另一方面,在太陽電池單元210的背面側,根據半導體基板11的集電功能,由使用包含鋁的電極材料的背面集電電極13A擔當。因此,背面連接電極213B中,藉由降低電極材料中銀的比率,提高電極材料中玻璃成分的比率,可以提高與半導體基板11的接合強度。 When the light-receiving surface electrode 212 of the silver paste electrode and the back surface connection electrode 213B of the silver paste electrode are compared, the light-receiving surface electrode 212 has a higher ratio of silver in the electrode material than the back surface connection electrode 213B in order to lower the electric resistance in the electrode. In the light-receiving electrode 212, in order to reduce the electric resistance in the electrode, it is preferable to increase the ratio of silver in the electrode material as much as possible. On the other hand, on the back side of the solar battery cell 210, the back surface collector electrode 13A using an electrode material containing aluminum is used according to the current collecting function of the semiconductor substrate 11. Therefore, in the back surface connection electrode 213B, the ratio of the silver in the electrode material is lowered, and the ratio of the glass component in the electrode material is increased, whereby the bonding strength with the semiconductor substrate 11 can be improved.
因此,太陽電池單元210,藉由使燒成處理後的狀態的背面連接電極213B中在電極材料中的玻璃成分的比率,比燒成處理後的狀態的受光面電極212中在電極材料中的玻璃成分的比率更高,能夠維持半導體基板11與背面連接電極213B之間的接合強度在背面連接電極213B不剝離的高水準。藉此,太陽電池單元210,即使縮短第1方向中背面連接電極213B的長度合計,比第1方向中受光面匯流排電極212B的第1區域 長度的合計更短,也能夠維持半導體基板11與背面連接電極213B之間的接合強度在背面連接電極213B不剝離的程度。 Therefore, in the solar battery cell 210, the ratio of the glass component in the electrode material in the back surface connection electrode 213B in the state after the firing treatment is higher than that in the electrode material in the light-receiving surface electrode 212 in the state after the baking treatment. The ratio of the glass component is higher, and it is possible to maintain a high level of bonding strength between the semiconductor substrate 11 and the back surface connection electrode 213B without peeling off the back surface connection electrode 213B. In this way, even if the total length of the back surface connection electrode 213B in the first direction is shortened, the total length of the first region length of the light-receiving surface bus electrode 212B in the first direction is shorter, and the semiconductor substrate 11 can be maintained. The bonding strength between the back surface connection electrodes 213B is such that the back surface connection electrodes 213B are not peeled off.
如上述,本第三實施形態的太陽電池單元210中,受光面匯流排電極212B的第1區域61與背面連接電極213B,配置在半導體基板11面內對應的位置。因此,太陽電池單元210,與上述太陽電池單元10以及太陽電池單元110相同,能夠使製作太陽電池模組時的太陽電池單元210彎曲引起的太陽電池單元210破損率降低。 As described above, in the solar battery cell 210 of the third embodiment, the first region 61 and the back surface connection electrode 213B of the light-receiving surface bus bar electrode 212B are disposed at positions corresponding to the surface of the semiconductor substrate 11. Therefore, the solar battery unit 210 can reduce the breakage rate of the solar battery unit 210 caused by the bending of the solar battery unit 210 when the solar battery module is manufactured, similarly to the solar battery unit 10 and the solar battery unit 110 described above.
又,本第三實施形態的太陽電池單元210中,在太陽電池單元210中的背面側中互相連接側的端部之太陽電池單元210的另一端102側,加長太陽電池單元210的端面到背面連接電極213B的距離。藉此,與第二實施形態的太陽電池單元110相同,可以降低對引線20的彎曲部20a的應力集中,因為起因於成為受光面保護部31的受光面玻璃與引線20的線膨脹係數差等,由於日夜的溫度循環對彎曲部20a施加的重複應力可以縮小,可以實現長期可靠性優異的太陽電池模組。 Further, in the solar battery cell 210 of the third embodiment, the end surface to the back surface of the solar battery cell 210 is lengthened on the other end 102 side of the solar battery cell 210 at the end portion on the back side of the solar battery cell 210. The distance connecting the electrodes 213B. In the same manner as the solar battery cell 110 of the second embodiment, the stress concentration on the curved portion 20a of the lead 20 can be reduced, because the linear expansion coefficient of the light-receiving surface glass and the lead 20 which is the light-receiving surface protection portion 31 is different. The repetitive stress applied to the curved portion 20a by the temperature cycle of day and night can be reduced, and a solar cell module excellent in long-term reliability can be realized.
又,本第三實施形態的太陽電池單元210中,使第1方向中受光面匯流排電極212B與引線20的連接區域長度,比第1方向中背面連接電極213B與引線20的連接區域長度長。因此,太陽電池單元210,藉由確保第1方向中受光面匯流排電極212B與引線20的連接區域長度長,提高第1方向中受光面匯流排電極212B與引線20的接合強度,可以抑制引線20的剝離。 Further, in the solar battery cell 210 of the third embodiment, the length of the connection region between the light-receiving surface bus bar electrode 212B and the lead wire 20 in the first direction is longer than the length of the connection region of the back surface connection electrode 213B and the lead wire 20 in the first direction. . Therefore, the solar battery cell 210 can increase the length of the connection region between the light-receiving surface bus bar electrode 212B and the lead wire 20 in the first direction, thereby improving the bonding strength between the light-receiving surface bus bar electrode 212B and the lead wire 20 in the first direction, thereby suppressing the lead wire. 20 peeling.
顯示以上的實施形態的構成,顯示本發明內容的一例,也能夠讓實施形態的技術之間組合,也能夠與其它眾所 周知的技術組合,在不脫離本發明的主旨的範圍內,也能夠省略、變更一部分構成。 The configuration of the above-described embodiment is shown, and an example of the present invention is shown, and the technologies of the embodiments can be combined with other well-known technologies, and the invention can be omitted without departing from the scope of the present invention. Change part of the composition.
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| JP5355709B2 (en) * | 2009-11-13 | 2013-11-27 | 三菱電機株式会社 | Solar cells |
| WO2013090607A2 (en) * | 2011-12-14 | 2013-06-20 | Dow Corning Corporation | A photovoltaic cell and an article including an isotropic or anisotropic electrically conductive layer |
| US20130255784A1 (en) * | 2012-03-30 | 2013-10-03 | Applied Materials, Inc. | Gas delivery systems and methods of use thereof |
| DE112014002992T5 (en) * | 2013-06-28 | 2016-03-24 | Panasonic Intellectual Property Management Co., Ltd. | Solar cell module and method of making the same |
| CN106206761B (en) * | 2014-10-31 | 2018-06-26 | 比亚迪股份有限公司 | Solar cell chip arrays, solar cell module and preparation method thereof |
| CN106033782A (en) * | 2015-03-11 | 2016-10-19 | 英属开曼群岛商精曜有限公司 | Solar cell, solar cell module and manufacturing method thereof |
| TW201633553A (en) * | 2015-03-11 | 2016-09-16 | 精曜有限公司 | Solar cell, solar cell module and manufacturing method thereof |
-
2017
- 2017-06-21 WO PCT/JP2017/022889 patent/WO2018235202A1/en not_active Ceased
- 2017-12-21 JP JP2019525048A patent/JP6785964B2/en not_active Expired - Fee Related
- 2017-12-21 WO PCT/JP2017/045880 patent/WO2018235315A1/en not_active Ceased
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2018
- 2018-04-13 TW TW107112729A patent/TWI692113B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI692113B (en) | 2020-04-21 |
| JPWO2018235315A1 (en) | 2019-11-07 |
| WO2018235315A1 (en) | 2018-12-27 |
| JP6785964B2 (en) | 2020-11-18 |
| WO2018235202A1 (en) | 2018-12-27 |
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