TW201905024A - 有機ｅｌ顯示元件用密封劑 - Google Patents

有機ｅｌ顯示元件用密封劑

Info

Publication number: TW201905024A
Authority: TW; Taiwan
Prior art keywords: polymerizable compound; organic; boiling; display element; boiling point
Prior art date: 2017-06-15

Application number

TW107119416A

Other languages

English (en)

Chinese (zh)

Inventor

金千鶴

山本拓也

七里徳重

西出勝則

梁信烈

Original Assignee

日商積水化學工業股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-06-15

Filing date

2018-06-06

Publication date

2019-02-01

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=64660728&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW201905024(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

2018-06-06 Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司

2019-02-01 Publication of TW201905024A publication Critical patent/TW201905024A/zh

Links

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238000009835 boiling Methods 0.000 claims abstract description 106
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YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
239000012670 alkaline solution Substances 0.000 description 1
239000003963 antioxidant agent Substances 0.000 description 1
230000003078 antioxidant effect Effects 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
230000000740 bleeding effect Effects 0.000 description 1
150000001642 boronic acid derivatives Chemical class 0.000 description 1
238000005229 chemical vapour deposition Methods 0.000 description 1
238000013329 compounding Methods 0.000 description 1
230000001186 cumulative effect Effects 0.000 description 1
PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 1
GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
239000004205 dimethyl polysiloxane Substances 0.000 description 1
ONRGBXGMVZEZLY-UHFFFAOYSA-N dimethyl-[(4-methylphenyl)methyl]-phenylazanium Chemical compound C1=CC(C)=CC=C1C[N+](C)(C)C1=CC=CC=C1 ONRGBXGMVZEZLY-UHFFFAOYSA-N 0.000 description 1
229910001873 dinitrogen Inorganic materials 0.000 description 1
OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 1
GPAYUJZHTULNBE-UHFFFAOYSA-O diphenylphosphanium Chemical compound C=1C=CC=CC=1[PH2+]C1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-O 0.000 description 1
KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
238000005401 electroluminescence Methods 0.000 description 1
238000010894 electron beam technology Methods 0.000 description 1
125000003700 epoxy group Chemical group 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
125000001153 fluoro group Chemical group F* 0.000 description 1
229910052736 halogen Inorganic materials 0.000 description 1
150000002367 halogens Chemical class 0.000 description 1
KKIHZFRVYUJTHN-UHFFFAOYSA-N hexane-1,6-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OCCCCCCO KKIHZFRVYUJTHN-UHFFFAOYSA-N 0.000 description 1
239000007970 homogeneous dispersion Substances 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical class O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 description 1
239000003999 initiator Substances 0.000 description 1
238000007641 inkjet printing Methods 0.000 description 1
239000012948 isocyanate Substances 0.000 description 1
FPCCSQOGAWCVBH-UHFFFAOYSA-N ketanserin Chemical compound C1=CC(F)=CC=C1C(=O)C1CCN(CCN2C(C3=CC=CC=C3NC2=O)=O)CC1 FPCCSQOGAWCVBH-UHFFFAOYSA-N 0.000 description 1
150000007517 lewis acids Chemical class 0.000 description 1
239000007788 liquid Substances 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
239000012528 membrane Substances 0.000 description 1
229910001507 metal halide Inorganic materials 0.000 description 1
150000005309 metal halides Chemical class 0.000 description 1
150000004702 methyl esters Chemical class 0.000 description 1
239000000203 mixture Substances 0.000 description 1
150000004767 nitrides Chemical class 0.000 description 1
239000012044 organic layer Substances 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
229940044652 phenolsulfonate Drugs 0.000 description 1
NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
150000004714 phosphonium salts Chemical class 0.000 description 1
FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
239000004014 plasticizer Substances 0.000 description 1
HRGDZIGMBDGFTC-UHFFFAOYSA-N platinum(2+) Chemical compound [Pt+2] HRGDZIGMBDGFTC-UHFFFAOYSA-N 0.000 description 1
229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
230000001737 promoting effect Effects 0.000 description 1
238000010526 radical polymerization reaction Methods 0.000 description 1
239000002994 raw material Substances 0.000 description 1
239000012744 reinforcing agent Substances 0.000 description 1
RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 1
230000001235 sensitizing effect Effects 0.000 description 1
LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
229910052814 silicon oxide Inorganic materials 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
HMKGBOLFVMRQRP-UHFFFAOYSA-N tribenzyl(phenyl)azanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 HMKGBOLFVMRQRP-UHFFFAOYSA-N 0.000 description 1
ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
RIOQSEWOXXDEQQ-UHFFFAOYSA-O triphenylphosphanium Chemical compound C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-O 0.000 description 1
239000006097 ultraviolet radiation absorber Substances 0.000 description 1
239000004034 viscosity adjusting agent Substances 0.000 description 1
229910052724 xenon Inorganic materials 0.000 description 1
FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

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Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Theoretical Computer Science (AREA)
Chemical & Material Sciences (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Electroluminescent Light Sources (AREA)
Optics & Photonics (AREA)

TW107119416A 2017-06-15 2018-06-06 有機ｅｌ顯示元件用密封劑 TW201905024A (zh)

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JP (1)	JP7007272B2 (fr)
KR (1)	KR102658948B1 (fr)
CN (1)	CN110731127B (fr)
TW (1)	TW201905024A (fr)
WO (1)	WO2018230388A1 (fr)

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JP6573089B1 (ja) *	2018-05-31	2019-09-11	パナソニックＩｐマネジメント株式会社	紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置
CN111989378B (zh) *	2018-06-20	2023-12-29	三井化学株式会社	显示元件用密封剂及其固化物
CN112310302A (zh) *	2019-07-30	2021-02-02	陕西坤同半导体科技有限公司	一种有机发光器件
CN115804245B (zh) *	2020-09-18	2025-09-12	三井化学株式会社	显示元件用密封剂、其固化物和显示装置

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JP3817081B2 (ja)	1999-01-29	2006-08-30	パイオニア株式会社	有機ｅｌ素子の製造方法
JP2001307873A (ja)	2000-04-21	2001-11-02	Toppan Printing Co Ltd	有機エレクトロルミネッセンス表示素子およびその製造方法
US8808457B2 (en)	2002-04-15	2014-08-19	Samsung Display Co., Ltd.	Apparatus for depositing a multilayer coating on discrete sheets
JP2008059945A (ja) *	2006-08-31	2008-03-13	Nagase Chemtex Corp	電子デバイスの製造方法
JP2008149710A (ja)	2006-11-22	2008-07-03	Fujifilm Corp	バリア性積層体の製造方法、バリア性積層体、バリア性フィルム基板および有機ｅｌ素子。
JP5949094B2 (ja) *	2012-04-25	2016-07-06	Jsr株式会社	ポジ型感放射線性組成物、表示素子用層間絶縁膜及びその形成方法
JPWO2014126034A1 (ja) *	2013-02-14	2017-02-02	富士フイルム株式会社	インクジェット塗布用感光性樹脂組成物、熱処理物及びその製造方法、樹脂パターン製造方法、液晶表示装置、有機ｅｌ表示装置、タッチパネル及びその製造方法、並びに、タッチパネル表示装置
JP6200203B2 (ja) *	2013-05-16	2017-09-20	積水化学工業株式会社	有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
WO2015068454A1 (fr) *	2013-11-07	2015-05-14	積水化学工業株式会社	Agent d'étanchéité pour éléments d'affichage électroluminescents organiques
JP6391491B2 (ja) *	2014-02-18	2018-09-19	積水化学工業株式会社	静電塗布用有機薄膜素子封止剤、樹脂保護膜、電子デバイス、及び、電子デバイスの製造方法
CN107849362B (zh) *	2015-10-23	2020-09-15	东丽株式会社	显示器基板用树脂组合物、以及使用其的耐热性树脂膜、有机el显示器基板及有机el显示器的制造方法

2018
- 2018-06-05 KR KR1020197022901A patent/KR102658948B1/ko active Active
- 2018-06-05 JP JP2018530922A patent/JP7007272B2/ja active Active
- 2018-06-05 WO PCT/JP2018/021437 patent/WO2018230388A1/fr not_active Ceased
- 2018-06-05 CN CN201880038844.1A patent/CN110731127B/zh active Active
- 2018-06-06 TW TW107119416A patent/TW201905024A/zh unknown

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Publication number	Publication date
WO2018230388A1 (fr)	2018-12-20
JP7007272B2 (ja)	2022-01-24
CN110731127A (zh)	2020-01-24
JPWO2018230388A1 (ja)	2020-04-16
CN110731127B (zh)	2022-08-19
KR20200019110A (ko)	2020-02-21
KR102658948B1 (ko)	2024-04-18

Publication	Publication Date	Title
TWI695059B (zh)	2020-06-01	電子裝置用密封劑及電子裝置之製造方法
KR102416054B1 (ko)	2022-07-01	유기 el 표시 소자용 봉지제 및 유기 el 표시 소자용 봉지제의 제조 방법
JP6404494B2 (ja)	2018-10-10	有機ｅｌ表示素子用封止剤
CN111567143A (zh)	2020-08-21	电子设备用密封剂及有机el显示元件用密封剂
TW201905024A (zh)	2019-02-01	有機ｅｌ顯示元件用密封劑
JP2022027778A (ja)	2022-02-14	有機ｅｌ表示素子用封止剤
CN111837457A (zh)	2020-10-27	有机el显示元件用密封剂
JP2023109860A (ja)	2023-08-08	有機ｅｌ表示素子用封止剤
JP7479843B2 (ja)	2024-05-09	有機ｅｌ表示素子用封止剤
TWI834647B (zh)	2024-03-11	有機el顯示元件用密封劑
JP7065746B2 (ja)	2022-05-12	有機ｅｌ表示素子用封止剤
TW201905154A (zh)	2019-02-01	有機ｅｌ顯示元件用密封劑