TW201834866A - 靜電放電聚醯亞胺標籤 - Google Patents
靜電放電聚醯亞胺標籤 Download PDFInfo
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- TW201834866A TW201834866A TW106146595A TW106146595A TW201834866A TW 201834866 A TW201834866 A TW 201834866A TW 106146595 A TW106146595 A TW 106146595A TW 106146595 A TW106146595 A TW 106146595A TW 201834866 A TW201834866 A TW 201834866A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
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Abstract
本發明提供具有聚酯-胺基頂塗層的ESD標籤。標籤還可在底漆層中包含聚酯-胺基樹脂。頂塗層和底漆層可包含導電顆粒，且粘合層中導電顆粒的百分數可降低。ESD標籤在頂塗層、底漆層和粘合層中具有降低的表面電阻，同時還具有降低的剝離電壓。
Description
本發明一般性地涉及靜電放電聚醯亞胺標籤。該標籤可包含在標籤的頂塗層中的聚酯-胺基樹脂和導電顆粒以及在底漆層和粘合層中的導電顆粒。
靜電放電(ESD)是由絕緣體如塑膠表面上電荷的累積導致的。這些電荷不能移動，因為不存在通向地面的路徑。因此，該電荷稱為靜電荷。絕緣體上的靜電荷可通過導體放電，例如通過電路板上的金屬引線或者相對導電的人皮膚放電。儘管ESD的電壓可能是非常低的，例如50V，並且可能甚至不產生火花，但這些ESD可能例如破壞集成晶片內部的柵極氧化物層，使它無用。甚至低電壓放電會損壞現代積體電路。 電子元件（例如集成晶片電路）通常包含標籤。這些標籤在應用於電子部件上以前從襯裡上剝離時可產生超過成千上萬V的靜電荷。標籤的重新佈置也可產生靜電荷。 靜電荷積累的一個常規解決方法是通過結合導電顆粒而賦予標籤的絕緣粘合劑導電性。CN203319919U公開了包含剝離紙層和基礎材料的抗靜電聚醯亞胺壓敏粘合劑。粘合層置於剝離紙層與基礎材料層之間，其中靜電塗層置於基礎材料層的外表面上，容許靜電在油印和印刷階段中有效地通過抗靜電塗層放出。因此降低靜電對精密儀器的影響或損害。 CN205313454U公開了改性kapton膜膠帶。底部背板的上部具有聚矽氧烷壓敏膜抗靜電層和薄膜。聚醯亞胺膜的上部具有保護層，所述保護層具有垂直排列的等距無機發光材料條。底板的下部具有刻度層且刻度層的兩側具有刻度。 CN204265680U公開了聚醯亞胺帶，其包含基底層、棉布層、有機矽壓敏膠層、抗靜電薄膜層和聚醯亞胺膜層。這些層從下至上順序地堆疊，且有機矽壓敏膠層的下側面具有多個非穿透膠層沉陷。 美國專利No. 5,958,573公開了靜電散逸型標籤，其包含層壓到導電底漆層上的聚酯或聚醯亞胺背膜，所述導電底漆層又層壓到壓敏粘合層上。底漆層和粘合層包含導電顆粒，例如金屬，且排列粘合層中的導電顆粒使得它們跨越層的厚度。 美國公開No. 2005/0019519公開了由未負載型鑄造面板層、粘合層和剝離襯裡組成的耐熱標籤紙，其特徵是面板、粘合層和剝離襯裡。該標籤紙通常為防拆封，即移除破壞或損害標籤。在某些具體實施例中，標籤紙為靜電散逸的。 然而，上述參考文獻都沒有提供具有有效靜電散逸性能的成本有效的標籤。鑒於上述缺點，需要具有低表面電阻和剝離電壓的成本有效的標籤。
在一個具體實施例中，本發明涉及一種標籤，其包含：(i) 包含聚酯-胺基樹脂的頂塗層；(ii) 聚烯烴膜；(iii) 底漆層；和(iv) 粘合層。該標籤可進一步包含(v)襯裡。頂塗層可包含20-70重量%聚酯-胺基樹脂。頂塗層可進一步包含10-30重量%導電顆粒。頂塗層可進一步包含選自金屬顆粒、金屬塗覆顆粒、具有導電殼的無機氧化物顆粒、碳顆粒、石墨顆粒、導電聚合物顆粒及其組合的導電顆粒。頂塗層可進一步包含導電二氧化鈦顆粒。底漆層可包含聚酯-胺基樹脂。底漆層可包含導電顆粒，例如導電二氧化鈦顆粒。在一些方面中，頂塗層、底漆層和粘合層可包含導電顆粒，且粘合層中的導電顆粒可不同於頂塗層和/或底漆層中的導電顆粒。在其它方面中，頂塗層和底漆層包含導電二氧化鈦顆粒，且粘合層包含導電鎳顆粒。聚烯烴膜可包含選自聚醯亞胺、聚酯、聚醚醯亞胺(PEl)、聚萘二甲酸乙二醇酯(PEN)、聚醚碸(PES)、聚碸、聚甲基戊烯(PMP)、聚偏二氟乙烯(PVDF)、乙烯-氯三氟乙烯(ECTFE)或其組合的材料。在一些方面中，聚烯烴膜包含至少一種聚醯亞胺。粘合層可包含壓敏粘合劑。粘合層可包含導電顆粒，例如導電鎳顆粒。粘合層可包含基於粘合層的總重量1-20重量%導電顆粒。頂塗層可具有1-50μm的厚度。聚烯烴膜可具有1-400μm的厚度。底漆層可具有0.01-50μm的厚度。粘合層可具有1-200μm的厚度。標籤可具有小於50V的剝離電壓。頂塗層可具有小於1011
歐姆的表面電阻。底漆層可具有小於109
歐姆的表面電阻。粘合層可具有小於109
歐姆的表面電阻。 在其它具體實施例中，本發明涉及包含粘附在印刷電路板的至少一個表面上的如上所述標籤的印刷電路板。
標籤通常在電路板應用中用於標示或保護。具有靜電散逸特徵的標籤可用於保護電子元件以防在標籤的應用和去除期間靜電放電。現在發現具體標籤層中特定導電顆粒的使用提供所得標籤出乎意料的性能。例如，發現包含聚酯-胺基樹脂的靜電散逸性頂塗層和底漆層中導電顆粒的使用改進靜電散逸。所得標籤有利地具有達到零的剝離電壓和標籤表面上改進的ESD功能。 標籤通常包含任選含有功能顆粒的粘合層。進一步發現當聚酯-胺基樹脂和導電顆粒包含在底漆層以及頂塗層中時，粘合層中要求的導電顆粒的量或百分數可有利地降低。粘合層中導電顆粒的這一降低產生改進的粘合性能，同時保持標籤的低表面電阻和剝離電壓。 如示例具體實施例，例如圖1的具體實施例中所示，ESD標籤1包含多個，例如5個基本層，儘管本發明可包含其它層。從上至下，各層包括頂塗層 2、聚烯烴膜3(“面材”)、底漆層4、壓敏粘合劑5和襯裡6。下面進一步詳細描述各個層。頂塗層
朝向基質向下透視，在一個具體實施例中，顧名思義，頂塗層為標籤的頂層，並且直接暴露於周圍環境。頂塗層與聚烯烴膜的頂表面直接相鄰地配置，例如頂塗層位於聚烯烴膜之上。頂塗層可用作標記有資訊（例如條碼或字母數位字元）的表面，並且可以為可熱轉印的。另外，頂塗層提供對其餘層的保護，例如設計/選擇頂塗層以抵抗極端溫度、溶劑和/或摩擦暴露。在一個具體實施例中，頂塗層具有低表面電阻，例如小於1011
歐姆、小於1010
歐姆，或者小於108
歐姆。就範圍而言，表面電阻為105
-1011
歐姆，例如105
-1010
歐姆或105
-108
歐姆。低表面電阻提供製造方法期間累積靜態能的較快釋放速度以及降低的剝離電壓。製造方法可包括模切和複卷。 頂塗層的厚度可寬泛地變化。頂塗層可具有1-50μm，例如5-25μm，或者10-20μm的厚度。就下限而言，頂塗層可具有至少1μm，例如至少5μm，或者至少10μm的厚度。就上限而言，頂塗層可具有小於50μm，例如小於25μm，或者小於20μm的厚度。頂塗層的厚度可基於頂塗層的所需不透明性以及頂塗層的所需剛度選擇。 頂塗層包含聚酯-胺基樹脂。在較佳具體實施例中，頂塗層包含基於頂塗層的總重量20-70重量%，例如25-60重量%或30-50重量%聚酯-胺基樹脂，就上限而言，頂塗層包含至多70重量%，例如至多60重量%或至多50重量%聚酯-胺基樹脂。就下限而言，頂塗層包含至少20重量%，例如至少25重量%，或者至少30重量%聚酯-胺基樹脂。關於頂塗層的厚度，樹脂的量也可基於頂塗層的所需不透明性以及頂塗層的所需剛度選擇。在一些情況下，樹脂中聚酯與胺基的比可以為2:1-1:2，例如2:1-1:1，或者1.5:1-1:1。發明人發現，通過將聚酯與胺基的比保持在這些範圍內，頂塗層具有低表面電阻和良好熱轉印性能的有利特徵組合。一般而言，將導電材料引入頂塗層中對熱印刷性能具有有害影響。該有害影響通過使用聚酯-胺基樹脂而至少部分地改善。 聚酯可寬泛地變化。例如，任何合適的羥基化聚酯可用於聚酯-胺基樹脂中。在一些方面中，聚酯為包含羥基封端線性或支化聚合物的羥基化聚酯。例如，合適的羥基化聚酯可包括聚合共聚酯樹脂，例如VYLON 103、VYLON 200、VYLON 220、VYLON 240、VYLON 270、VYLON 300、VYLON 500、VYLON 226、VYLON 670和VYLON 550(都由Toyobo市購)。其它示例的羥基化聚酯可包括一系列高分子量和中分子量共聚酯(例如約2,000克/摩爾至約20,000克/摩爾的分子量)。示例的商品包括DYNAPOL L912、DYNAPOL L952、DYNAPOL L206、DYNAPOL L205、DYNAPOL L208、DYNAPOL L210、DYNAPOL L411、DYNAPOL L850、DYNAPOL L658、DYNAPOL LH815、DYNAPOL LH830、DYNAPOL LH828和DYNAPOL LH744(都由Evonik Degussa市購)。 聚酯可與胺基樹脂反應以形成聚酯-胺基樹脂。胺基樹脂的一些非限定性實例包括三聚氰胺類。然而，預期其它胺基樹脂。在一些具體實施例中，胺基為醚化三聚氰胺。儘管任何醚化三聚氰胺可以是合適的，但在一些具體實施例中，醚化三聚氰胺可包含被羥甲基和/或烷氧基甲基取代的三聚氰胺化合物。這類化合物可購自具有多個取代的羥甲基和/或烷氧基甲基基團的多個來源。例如，合適的醚化三聚氰胺化合物的實例包括CYMEL 300、CYMEL 303、CYMEL 325和CYMEL 725(都由Nihon Cytec Industries Inc.市購)，NI ALAC MW-30M、NIKALAC MW-30、NIKALAC MW- 30HM、NIKALAC MW-390和NIKALAC MW-IOOLM(都由Sanwa Chemical Co.，Ltd.市購)。上述產品各自包含甲氧基甲基化三聚氰胺化合物。例如，適於本發明某些具體實施例的其它醚化三聚氰胺化合物包括甲基化甲氧基甲基化三聚氰胺化合物，例如CYMEL 370和CYMEL 701(都由Nihon Cytec Industries Inc.市購)；甲氧基甲基化丁氧基甲基化三聚氰胺化合物，例如CYMEL 266、CYMEL 285和CYMEL 212(都由Nihon Cytec Industries Inc.市購)；和甲基化甲氧基甲基化三聚氰胺化合物，例如CYMEL 272和CYMEL 202(都由Nihon Cytec Industries Inc.市購)。另外，可使用甲氧基甲基化異丁氧基甲基化三聚氰胺化合物，例如可由Nihon Cytec Industries Inc.得到的CYMEL 238，和丁氧基甲基化三聚氰胺化合物，例如可由Nihon Cytec Industries Inc.得到的MY COAT 506。 頂塗層還可包含導電顆粒。導電顆粒可以以基於頂塗層的總重量1-50重量%，例如5-40重量%，或者10-30重量%存在。就上限而言，頂塗層包含基於頂塗層的總重量不多於50重量%，例如不多於40重量%，或者不多於30重量%導電顆粒。就下限而言，頂塗層包含基於頂塗層的總重量至少1重量%，例如至少5重量%或至少10重量%導電顆粒。將導電顆粒分散在整個頂塗層中，通常用高速分散機器將導電顆粒分散在整個頂塗層中，其後通過過濾袋過濾。導電顆粒可包括金屬顆粒、金屬塗覆顆粒、具有導電殼的無機氧化物顆粒、碳顆粒、石墨顆粒和導電聚合物顆粒中的至少一種。在一些方面中，可使用導電二氧化鈦顆粒，具體而言，可使用針型導電二氧化鈦。導電顆粒的加入貢獻於低表面電阻和降低的剝離電壓的驚訝優點。 在其中使用金屬顆粒的具體實施例中，金屬顆粒可包括銀、金、銅、鎳、鋁、鐵和鋼的那些。當使用金屬塗覆顆粒時，金屬塗覆顆粒可包括其中這些或其它金屬中的一種或多種塗覆在芯材料如碳、石墨、聚合物或玻璃球或另一金屬上的那些。用於頂塗層中的導電顆粒基於大量因素選擇，例如負載要求、顆粒賦予頂塗層的表面電阻率的量、和成本。 在一些方面中，導電顆粒為其中非導電芯(通常氧化物或礦物顆粒)帶有薄導電材料外殼的芯-殼顆粒。實例包括來自E. I. Du Pont de Nemours，Co.的Zelec牌號導電顏料，其中芯為二氧化鈦顆粒或雲母片，且導電殼為銻摻雜的氧化錫。Zelec ECP 3410T(其具有二氧化鈦芯)為示例的導電顆粒。由Monsanto Co.得到的聚苯胺為顆粒或可溶形式的導電聚合物的代表。 根據本發明的某些具體實施例，頂塗層可通過本領域中的任何已知技術，例如噴霧、輥壓、刷塗或其它技術施塗於聚烯烴膜(面材)上。在一些具體實施例中，頂塗層可作為溶劑基體系塗覆。頂塗層組合物中載體和/或溶劑的量可取決於所需塗層粘度改變。根據某些具體實施例，溶劑可包含用於聚酯和三聚氰胺樹脂體系的任何常規溶劑。例如，這類溶劑可包括3-15個碳原子的酮(例如甲乙酮或甲基異丁基酮)，具有3-20個碳原子的亞烷基二醇和/或亞烷基二醇烷基醚，乙酸酯及其衍生物，碳酸亞乙酯，和其它合適的溶劑。合適的醇溶劑包括單醇，例如甲醇、乙醇、丙醇、丁醇，以及環醇，例如環己醇。在某些具體實施例中，可使用多數乙酸酯類溶劑，例如乙酸正丁酯、乙酸正丙酯和其它乙酸酯類溶劑。根據某些具體實施例，如果需要的話，一部分溶劑體系可包含水。然而，在其它具體實施例中，溶劑體系可不含水。聚烯烴膜
如上所述，標籤可包含至少一個與頂塗層直接相鄰的聚烯烴膜。聚烯烴膜具有頂表面和底表面。朝向基質向下透視，聚烯烴膜可配置在頂塗層下面，例如聚烯烴膜的頂表面與頂塗層相鄰。 聚烯烴膜可寬泛地變化。在一些具體實施例中，聚烯烴膜可包含顯示出良好機械強度和熱阻的任何聚烯烴材料。示例的聚烯烴膜可包含以下至少一種：聚醯亞胺、聚酯、聚醚醯亞胺(PEI)、聚萘二甲酸乙二醇酯(PEN)、聚醚碸(PES)、聚碸、聚甲基戊烯(PMP)、聚偏二氟乙烯(PVDF)、乙烯-氯三氟乙烯(ECTFE)或其組合。在某些具體實施例中，尤其是當標籤可在高溫下使用時，聚烯烴膜包含至少一種聚醯亞胺。 由聚醯亞胺製備的示例聚烯烴膜包括可由DuPont得到的Kapton®
和可由Kaneka Texas Corporation得到的Apical©
。由聚酯製備的示例聚烯烴膜包括可由DuPont得到的Mylar©
和可由American Hoechst得到的2600聚對苯二甲酸乙二醇酯。其它市售的聚烯烴膜包括可由Westlake Plastics Company得到的Tempalux™(PEI)；可由Mitsubishi Plastics得到的Superio-UT™(PEI)；可由DuPont得到的Kaladex™(PEN)和Teonex(PEN)。 根據本發明某些具體實施例的聚烯烴膜可包含1-400μm，例如10-300μm、25-200μm，或者50-150μm的厚度，以及上述量中的其它範圍。就下限而言，聚烯烴膜可具有至少1μm，例如至少10μm、至少25，或者至少50μm的厚度。就上限而言，聚烯烴膜可具有小於400μm，例如小於300μm、小於200μm，或者小於150μm的厚度。底漆層
底漆層可在聚烯烴膜與頂塗層相反的表面上與聚烯烴膜直接相鄰，例如，聚烯烴膜可配置在頂塗層與底漆層之間。底漆層可包含聚酯-胺基樹脂和導電顆粒。用於底漆層中的聚酯-胺基樹脂和導電顆粒可以為上文關於頂塗層所述的，儘管底漆層和頂塗層的最終組成可以是不同的。關於頂塗層所述的任選添加劑也可用於底漆層中。在一些具體實施例中，頂塗層的組成與底漆層的組成不同。例如，底漆層可包含與頂塗層相同的聚酯-胺基樹脂、相同的導電顆粒，但不同的本文所述的添加劑。在一些情況下，頂塗層的組成可以與底漆層的組成相同。在其它情況下，底漆層可包含比頂塗層更大百分數的導電顆粒，因為不存在底漆層上的熱轉印。例如，導電顆粒可以以基於頂塗層的總重量1-90重量%，例如5-80重量%，或者10-70重量%存在。就上限而言，頂塗層包含基於頂塗層的總重量不多於90重量%導電顆粒，例如不多於80重量%，或者不多於70重量%。就下限而言，頂塗層包含基於頂塗層的總重量至少1重量%導電顆粒，例如至少5重量%或至少10重量%。 在較佳具體實施例中，底漆層中的導電顆粒包括以下至少一種：金屬顆粒、金屬塗覆顆粒、具有導電殼的無機氧化物顆粒、碳顆粒、石墨顆粒和導電聚合物顆粒。在一些方面中，可使用導電二氧化鈦顆粒，尤其是，針型導電二氧化鈦可用於頂塗層和底漆層中。底漆層可具有小於109
歐姆，例如小於108
歐姆，或者小於107
歐姆的表面電阻。不受理論束縛，通過底漆層中包含導電顆粒，剝離電壓的ESD性能令人驚訝地改進，同時不損失標籤的附著力。標籤可得到小於50V，例如小於40V、小於30V，或者小於25V的剝離電壓。 底漆層可通過凹版印刷塗覆在聚烯烴膜上。在約150-180°C的溫度下固化以後，底漆粘附在膜上。另外，當交聯劑包含在底漆層中時，聚烯烴膜上的羥基與交聯劑反應，因此底漆層可化學鍵合在聚烯烴膜上。 底漆層的厚度可以為0.01-50μm，例如0.1-25μm，或者0.5-10μm。就下限而言，底漆層可具有至少0.01μm，例如至少0.1μm，或者至少0.5μm的厚度。就上限而言，底漆層可具有小於50μm，例如小於25μm，或者小於10μm的厚度。粘合層
根據本發明的某些具體實施例，粘合層可包含有效將標籤粘合在標籤可粘附的基質的外表面上的任何粘合劑。 如上所述，粘合層也可包含如關於頂塗層所述的導電顆粒。粘合層中的導電顆粒可與頂塗層和/或底漆層相同，或者可以為不同的。例如，頂塗層和底漆層可包含相同的導電顆粒，例如導電二氧化鈦，同時粘合層可包含不同的導電顆粒，例如鎳顆粒。在其它具體實施例中，粘合層可包含與頂塗層和底漆層相同的導電顆粒。在甚至其它具體實施例中，粘合層包含與頂塗層相同的導電顆粒，同時底漆層包含不同的導電顆粒，或者粘合層包含與底漆層相同的導電顆粒，且頂塗層具有不同的導電顆粒。較佳地，粘合層的導電顆粒包括以下至少一種：金屬顆粒、金屬塗覆顆粒、具有導電殼的無機氧化物顆粒、碳顆粒、石墨顆粒和導電聚合物顆粒。在一些方面中，使用導電鎳顆粒。通過頂塗層和底漆層中包含導電顆粒，可降低粘合層中導電顆粒的量。所得標籤有利地證明有益的性能，例如改進的附著力、ESD功能和/或剝離電壓。 粘合層中的導電顆粒可以以基於粘合層的總重量1-20重量%，例如2-15重量%或2-10重量%存在。就下限而言，粘合層包含基於粘合層的總重量至少1重量%導電顆粒，例如至少2重量%或至少5重量%。就上限而言，粘合層包含基於粘合層的總重量不多於20重量%導電顆粒，例如不多於15重量%或不多於10重量%。如本文所解釋的，通過與常規標籤相比降低粘合層中導電顆粒的重量百分數，標籤具有改進的耐熱性和剝離強度。粘合層可包含小於75%，例如小於50%、小於25%，或者小於10%的常規標籤中導電顆粒重量百分數。 在一些具體實施例中，粘合劑顯示出良好的耐熱性和剝離強度，例如在鋼板上至少9N/英寸，例如至少9.5N/英寸或至少10N/英寸的剝離強度。在一些方面中，粘合劑可以為壓敏粘合劑。重要的是，當使用上述頂塗層和/或底漆層組合物時，粘合層中導電顆粒的量可降低，這產生改進的粘附性，同時保持標籤的低表面電阻和剝離電壓。因此，粘合層可具有較低的導電顆粒含量，同時仍提供合適的性能。 粘合層可具有1-200μm，例如5-100μm，或者10-50μm的厚度。就下限而言，粘合層可具有至少1μm，例如至少5μm，或者至少10μm的厚度。就上限而言，底漆層可具有小於200μm，例如小於100μm，或者小於50μm的厚度。 在一些具體實施例中，粘合劑可顯示出在至多200°C、225°C、250°C、260°C，或者270°C的溫度下的耐熱性。在一些具體實施例中，粘合劑還可顯示出內聚強度和高耐剪切性。粘合層可具有小於109
歐姆，例如小於1*109
歐姆，或者小於5*109
歐姆的表面電阻。 可使用侵蝕性壓敏粘合劑，例如高強度的或橡膠改性的丙烯酸壓敏粘合劑中的一種，例如可由National Starch and Chemical Co.得到的Duro-Tak®
80-115 A或者可由Ashland Specialty Chemical Company得到的Aroset™ 1860-Z-45。合適的壓敏粘合劑可包括例如具有4-12個碳原子的直鏈的丙烯酸烷基酯與次要含量的高極性可共聚單體如丙烯酸的共聚物。這些粘合劑更完整地描述於美國專利Re. 24,906和美國專利No. 2,973,286中，通過引用將其各自的內容全部結合到本文中。備選的壓敏粘合劑包括可紫外線固化壓敏粘合劑，例如可由National Starch and Chemical Co.得到的Duro-Tak 4000。 粘合層還可包含基於粘合層的總重量小於5重量%，例如小於4重量%或小於3重量%的量的如本文所述的添加劑，包括抗氧化劑和交聯劑。襯裡
根據本發明某些具體實施例，標籤可包含可釋離襯裡。可釋離襯裡可在粘合層與底漆層相反的面上與粘合層直接相鄰地佈置。就這點而言，可釋離襯裡可在將標籤應用(或者意欲應用)於物體或面材上以前，例如在製造、印刷、運輸、儲存期間和其它時間保護粘合層。可使用用於可釋離襯裡的任何合適材料。可適於本發明具體實施例的典型和市售可釋離襯裡可包括聚矽氧烷處理的剝離紙或膜，例如可由Loparex得到的那些，包括產品如1011、22533和11404、CP Films和Akrosil™。添加劑
頂塗層、底漆和/或粘合層可任選包含一種或多種填料和/或添加劑。這類填料和/或添加劑例如可使用常規設備和技術以常規量結合到頂塗層中。例如，代表性填料可包括滑石、碳酸鈣、有機粘土、玻璃纖維、大理石粉、水泥粉、長石、二氧化矽或玻璃、熱解法二氧化矽、矽酸鹽、氧化鋁、各種磷化合物、溴化銨、二氧化鈦、三氧化銻、三氧化銻、氧化鋅、硼酸鋅、硫酸鋇、聚矽氧烷、矽酸鋁、矽酸鈣、玻璃微球、白堊、雲母、粘土、鈣矽石、八鉬酸銨、膨脹型化合物和這些材料中兩種或更多種的混合物。填料也可帶有或者包含各種表面塗層或處理，例如矽烷、脂肪酸等。又其它填料可包括阻燃劑，例如鹵化有機化合物。在某些具體實施例中，頂塗層可包含一種或多種與層的其它組分相容的熱塑性彈性體，例如醚化三聚氰胺、羥基化聚酯、聚酯-三聚氰胺和其它合適的彈性體。 頂塗層、底漆和/或粘合層還可包含顏料分散劑，例如可由Elementis Specialties得到的Nuosperse®
657。根據某些具體實施例，頂塗層還可包含碳顏料，例如炭黑、象牙黑等，和/或多種其它顏料中的一種或多種，例如銅顏料(例如酞菁染料，例如酞菁藍)、鎘顏料(例如鎘黃)、鉻顏料(例如鉻黃)、鈷顏料(例如鈷藍)、氧化鐵顏料(例如氧化鐵紅)和任何其它合適的顏料。在它們不干擾所需負載和/或頂塗層的物理或機械性能的程度上，任何著色劑、顏料和顏料分散劑是合適的。 根據某些具體實施例，頂塗層、底漆和/或粘合層還可包含一種或多種流動和/或均染劑以減輕任何表面缺陷(例如針孔、凹坑、剝離、疤痕、水泡、氣泡等)的發生。所用合適的流動和/或均染劑為不干擾所需負載和/或頂塗層的物理或機械性能的那些。在某些具體實施例中，例如可使用幾種市售的流動和/或均染劑，包括例如來自BYK Additives & Instruments的BYK-392 (聚丙烯酸酯溶液)；來自BYK Additives & Instruments的BY -310(聚酯改性的聚二甲基矽氧烷溶液)；來自BASF的EFKA 3277(氟碳改性聚丙烯酸酯)和/或來自BASF的EFKA 3740(聚丙烯酸酯)。 頂塗層、底漆和/或粘合層還可包含一種或多種消泡劑。消泡劑通常降低或減輕沉積或者通常處理或從一個位置轉移至另一個位置時頂塗層中泡沫的形成。一般而言，在一些具體實施例中，可使用不干擾所需負載和/或頂塗層的物理或機械性能的任何消泡劑。例如，消泡劑可以為礦物型、聚矽氧烷型或非聚矽氧烷型的。 根據一些具體實施例，頂塗層、底漆和/或粘合層還可包含一種或多種抗氧化劑。對於特定具體實施例，可使用任何合適的抗氧化劑。在一些具體實施例中，可選擇顯示出良好的耐熱性並減輕聚合物基製品/塗層變色的抗氧化劑。根據本發明某些具體實施例適用的示例抗氧化劑包括但不限於CHINOX 626、CHINOX 62S(有機亞磷酸鹽抗氧化劑)、CHINOX 245(位阻酚抗氧化劑)和CHINOX 30N(受阻酚抗氧化劑的摻混物)，其各自由Double Bond Chemical Ind.，Co.，Ltd.市購。 頂塗層、底漆和/或粘合層還可包含一種或多種可促進光滑層形成的消光劑。對於特定具體實施例，可使用任何合適的消光劑。在一些具體實施例中，消光劑可具有小細微性。例如，在一些具體實施例中，消光劑可具有平均小於10μm或者平均小於5μm的細微性，例如改性或表面處理的二氧化矽。取決於頂塗層中所用的特定樹脂體系，二氧化矽可處理多種有機聚合物。在某些具體實施例中，消光劑可包括未處理的二氧化矽。 根據本發明的某些具體實施例，可使用合適的催化劑。例如，頂塗層的組分可包含一種或多種酸催化劑，例如對甲苯磺酸(PTSA)或甲基磺酸(MSA)。有用的酸催化劑可包括例如硼酸、磷酸、硫酸、hypochlonde、草酸及其銨鹽、鈉或鋇乙基硫酸鹽、磺酸和類似的酸催化劑。根據某些具體實施例，其它有用的催化劑可包括十二烷基苯磺酸(DDBSA)、胺封端鏈烷烴磺酸(MCAT 12195)、胺封端十二烷基對甲苯磺酸(B YK 460)和胺封端十二烷基苯磺酸(Nacure 5543)。 預期以下具體實施例。預期特徵和具體實施例的所有組合。 具體實施例1：一種標籤，其包含：(i) 包含聚酯-胺基樹脂的頂塗層；(ii) 聚烯烴膜；(iii) 底漆層；和(iv) 粘合層。 具體實施例2：具體實施例1的具體實施例，其中標籤進一步包含：(v) 可釋離襯裡。 具體實施例3：具體實施例1-2的具體實施例中任一項的具體實施例，其中頂塗層包含20-70重量%聚酯-胺基樹脂。 具體實施例4：具體實施例1-3的具體實施例中任一項的具體實施例，其中頂塗層進一步包含10-30重量%導電顆粒。 具體實施例5：具體實施例1-4的具體實施例中任一項的具體實施例，其中頂塗層進一步包含選自金屬顆粒、金屬塗覆顆粒、具有導電殼的無機氧化物顆粒、碳顆粒、石墨顆粒、導電聚合物顆粒及其組合的導電顆粒。 具體實施例6：具體實施例1-5的具體實施例中任一項的具體實施例，其中頂塗層進一步包含導電二氧化鈦顆粒。 具體實施例7：具體實施例1-6的具體實施例中任一項的具體實施例，其中底漆層包含聚酯-胺基樹脂。 具體實施例8：具體實施例1-7的具體實施例中任一項的具體實施例，其中底漆層包含導電顆粒。 具體實施例9：具體實施例1-8的具體實施例中任一項的具體實施例，其中底漆層包含1-90重量%導電顆粒。 具體實施例10：具體實施例1-9的具體實施例中任一項的具體實施例，其中底漆層進一步包含導電二氧化鈦顆粒。 具體實施例11：具體實施例1-10的具體實施例中任一項的具體實施例，其中頂塗層、底漆層和粘合層包含導電顆粒，且其中粘合層中的導電顆粒不同於頂塗層和/或底漆層中的導電顆粒。 具體實施例12：具體實施例1-11的具體實施例中任一項的具體實施例，其中頂塗層和底漆層包含導電二氧化鈦顆粒，且粘合層包含導電鎳顆粒。 具體實施例13：具體實施例1-12的具體實施例中任一項的具體實施例，其中聚烯烴膜包含選自聚醯亞胺、聚酯、聚醚醯亞胺(PEl)、聚萘二甲酸乙二醇酯(PEN)、聚醚碸(PES)、聚碸、聚甲基戊烯(PMP)、聚偏二氟乙烯(PVDF)、乙烯-氯三氟乙烯(ECTFE)或其組合的材料。 具體實施例14：具體實施例1-13的具體實施例中任一項的具體實施例，其中聚烯烴膜包含至少一種聚醯亞胺。 具體實施例15：具體實施例1-14的具體實施例中任一項的具體實施例，其中粘合層包含壓敏粘合劑。 具體實施例16：具體實施例1-15的具體實施例中任一項的具體實施例，其中粘合層包含導電顆粒。 具體實施例17：具體實施例1-16的具體實施例中任一項的具體實施例，其中粘合層包含導電鎳顆粒。 具體實施例18：具體實施例1-17的具體實施例中任一項的具體實施例，其中粘合層包含基於粘合層的總重量1-20重量%導電顆粒。 具體實施例19：具體實施例1-18的具體實施例中任一項的具體實施例，其中頂塗層具有1-50μm的厚度。 具體實施例20：具體實施例1-19的具體實施例中任一項的具體實施例，其中聚烯烴膜具有1-400μm的厚度。 具體實施例21：具體實施例1-20的具體實施例中任一項的具體實施例，其中底漆層具有0.01-50μm的厚度。 具體實施例22：具體實施例1-21的具體實施例中任一項的具體實施例，其中粘合層具有1-200μm的厚度。 具體實施例23：具體實施例1-22的具體實施例中任一項的具體實施例，其中標籤具有小於50V的剝離電壓。 具體實施例24：具體實施例1-23的具體實施例中任一項的具體實施例，其中頂塗層具有小於1011
歐姆的表面電阻。 具體實施例25：具體實施例1-24的具體實施例中任一項的具體實施例，其中底漆層具有小於109
歐姆的表面電阻。 具體實施例26：具體實施例1-25的具體實施例中任一項的具體實施例，其中粘合層具有小於109
歐姆的表面電阻。 具體實施例27：印刷電路板，其包含粘附在印刷電路板的至少一個表面上的根據具體實施例1-26的具體實施例中任一項的具體實施例的標籤。 本發明鑒於以下非限定性實施例更好地理解。實施例
實施例1 本發明標籤如下製備。該標籤從上至下包含頂塗層、聚醯亞胺膜、底漆層、粘合層和襯裡。頂塗層由聚酯-三聚氰胺樹脂形成，具有10μm的厚度且包含20重量%導電TiO2
。頂塗層的表面電阻為107
-108
歐姆。底漆層也由聚酯-三聚氰胺樹脂形成，具有1-2μm的厚度且包含70重量%導電TiO2
。底漆層的表面電阻為107
-108
歐姆。粘合層包含壓敏粘合劑，具有27μm的厚度且包含2重量%鎳。粘合層的表面電阻為107
-108
歐姆。粘合層的剝離強度如通過從鋼板上剝離而測量為大於9N/英寸。 實施例2 標籤如實施例1中製備，不同的是底漆層包含20重量%導電TiO2
。底漆層的表面電阻為109
-1010
歐姆。粘合層具有27μm的厚度且包含2重量%鎳。粘合層的表面電阻為109
-1010
歐姆。粘合層的剝離強度如通過從鋼板上剝離而測量為大於9N/英寸。 比較例A 標籤如上製備，不同的是省去底漆層並調整粘合層以包含約60重量%導電鎳粉。粘合層的表面電阻為大於1012
歐姆，並且與實施例1相比，粘合性能降至幾乎零。 比較例B 標籤如實施例1中製備，不同的是頂塗層包含70重量%導電TiO2
。頂塗層的表面電阻為106
-107
歐姆，但TT-印刷性能是非常差的。 比較例C 標籤如實施例1中製備，不同的是粘合層包含20重量%鎳。粘合層的表面電阻為107
-108
歐姆。粘合層的剝離強度如通過從鋼板上剝離而測量為小於5N/英寸。 儘管詳細描述了本發明，在本發明精神和範圍內的改進是本領域技術人員容易瞭解的。應當理解本文和/或所附請求項書中所述的本發明方面以及各種具體實施例和各種特徵的部分可以全部或部分地組合或者互換。在各個具體實施例的上述描述中，如本領域技術人員所理解，指為另一具體實施例的那些具體實施例可適當地與其它具體實施例組合。此外，本領域技術人員理解上述描述僅作為實例，且不意欲限制本發明。
1‧‧‧標籤
2‧‧‧頂塗層
3‧‧‧聚烯烴膜(“面材”)
4‧‧‧底漆層
5‧‧‧壓敏粘合劑
6‧‧‧襯裡
下面參考附圖詳細描述本發明。 圖1顯示根據本發明的方面的標籤的截面圖。
Claims (27)
- 一種標籤，其包含： (i) 包含聚酯-胺基樹脂的頂塗層； (ii) 聚烯烴膜； (iii) 底漆層；和 (iv) 粘合層。
- 根據請求項1的標籤，其中該標籤進一步包含：(v) 可釋離襯裡。
- 根據請求項1或2的標籤，其中該頂塗層包含20-70重量%聚酯-胺基樹脂。
- 根據請求項1或2的標籤，其中該頂塗層進一步包含10-30重量%導電顆粒。
- 根據請求項1或2的標籤，其中該頂塗層進一步包含選自由金屬顆粒、金屬塗覆顆粒、具有導電殼的無機氧化物顆粒、碳顆粒、石墨顆粒、導電聚合物顆粒及其組合所構成群組的導電顆粒。
- 根據請求項1或2的標籤，其中該頂塗層進一步包含導電二氧化鈦顆粒。
- 根據請求項1或2的標籤，其中該底漆層包含聚酯-胺基樹脂。
- 根據請求項1或2的標籤，其中該底漆層包含導電顆粒。
- 根據請求項1或2的標籤，其中該底漆層包含1-90重量%導電顆粒。
- 根據請求項1或2的標籤，其中該底漆層進一步包含導電二氧化鈦顆粒。
- 根據請求項1或2的標籤，其中該頂塗層、底漆層和粘合層包含導電顆粒，且其中該粘合層中的導電顆粒不同於該頂塗層和/或底漆層中的導電顆粒。
- 根據請求項1或2的標籤，其中該頂塗層和底漆層包含導電二氧化鈦顆粒，且該粘合層包含導電鎳顆粒。
- 根據請求項1或2的標籤，其中該聚烯烴膜包含選自由聚醯亞胺、聚酯、聚醚醯亞胺(PEl)、聚萘二甲酸乙二醇酯(PEN)、聚醚碸(PES)、聚碸、聚甲基戊烯(PMP)、聚偏二氟乙烯(PVDF)、乙烯-氯三氟乙烯(ECTFE)或其組合所構成群組的材料。
- 根據請求項1或2的標籤，其中該聚烯烴膜包含至少一種聚醯亞胺。
- 根據請求項1或2的標籤，其中該粘合層包含壓敏粘合劑。
- 根據請求項1或2的標籤，其中該粘合層包含導電顆粒。
- 根據請求項1或2的標籤，其中該粘合層包含導電鎳顆粒。
- 根據請求項1或2的標籤，其中該粘合層包含基於粘合層的總重量1-20重量%導電顆粒。
- 根據請求項1或2的標籤，其中該頂塗層具有1-50μm的厚度。
- 根據請求項1或2的標籤，其中該聚烯烴膜具有1-400μm的厚度。
- 根據請求項1或2的標籤，其中該底漆層具有0.01-50μm的厚度。
- 根據請求項1或2的標籤，其中該粘合層具有1-200μm的厚度。
- 根據請求項1或2的標籤，其中該標籤具有小於50V的剝離電壓。
- 根據請求項1或2的標籤，其中該頂塗層具有小於1011 歐姆的表面電阻。
- 根據請求項1或2的標籤，其中該底漆層具有小於109 歐姆的表面電阻。
- 根據請求項1或2的標籤，其中該粘合層具有小於109 歐姆的表面電阻。
- 一種印刷電路板，其包含粘附在印刷電路板的至少一個表面上的根據請求項1至26中任一項的標籤。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/071919 WO2018133031A1 (en) | 2017-01-20 | 2017-01-20 | Electrostatic discharge polyimide label |
| ??PCT/CN2017/071919 | 2017-01-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201834866A true TW201834866A (zh) | 2018-10-01 |
| TWI659843B TWI659843B (zh) | 2019-05-21 |
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| TW106146595A TWI659843B (zh) | 2017-01-20 | 2017-12-29 | 靜電放電聚醯亞胺標籤 |
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| US (1) | US20200048509A1 (zh) |
| EP (1) | EP3571255B8 (zh) |
| JP (1) | JP6882491B2 (zh) |
| KR (1) | KR102279980B1 (zh) |
| CN (1) | CN107987744B (zh) |
| BR (1) | BR112019014801A2 (zh) |
| MX (1) | MX2019008654A (zh) |
| TW (1) | TWI659843B (zh) |
| WO (1) | WO2018133031A1 (zh) |
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| CN116923879A (zh) * | 2022-03-30 | 2023-10-24 | 张家港百盛新材料有限公司 | 一种防静电屏蔽包装袋 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE24906E (en) | 1955-11-18 | 1960-12-13 | Pressure-sensitive adhesive sheet material | |
| US2973286A (en) | 1956-03-30 | 1961-02-28 | Minnesota Mining & Mfg | Solvent-resistant pressure-sensitive polyacrylic adhesive tape and method of preparing same |
| US5958573A (en) | 1997-02-10 | 1999-09-28 | Quantum Energy Technologies | Electroluminescent device having a structured particle electron conductor |
| US5958537A (en) * | 1997-09-25 | 1999-09-28 | Brady Usa, Inc. | Static dissipative label |
| JP2003308016A (ja) * | 2002-04-16 | 2003-10-31 | Nitto Denko Corp | 表示用粘着ラベル |
| KR20050090073A (ko) * | 2003-01-07 | 2005-09-12 | 애버리 데니슨 코포레이션 | 고온 내성 필름 및 그로 제조된 접착제 물품 |
| US7081288B2 (en) * | 2003-07-24 | 2006-07-25 | Brady Worldwide, Inc. | Tamper-evident, heat resistant cast label stock |
| JP2007087438A (ja) * | 2005-09-20 | 2007-04-05 | Nitto Denko Corp | ハードディスクドライブ用粘着ラベルおよび該ハードディスクドライブ用粘着ラベルが用いられたハードディスクドライブ |
| CN100386395C (zh) * | 2006-05-18 | 2008-05-07 | 复旦大学 | 一种水性纳米复合聚酯氨基树脂涂层材料及其制备方法 |
| US20080026215A1 (en) * | 2006-07-28 | 2008-01-31 | 3M Innovative Properties Company | Print-receptive electrostatic dissipating label |
| KR20100087156A (ko) * | 2007-11-26 | 2010-08-03 | 린텍 코포레이션 | 박리 시트 및 점착체 |
| WO2010117767A1 (en) * | 2009-03-30 | 2010-10-14 | Avery Dennison Corporation | Removable adhesive label containing high tensile modulus polymeric film layer |
| CN102850536B (zh) * | 2012-09-18 | 2014-04-02 | 江苏柏鹤涂料有限公司 | 含硅丙烯酸酯-聚酯树脂及其面漆和应用 |
| CN203319919U (zh) | 2013-06-18 | 2013-12-04 | 深圳市摩码科技有限公司 | 防静电pi不干胶 |
| CN105873753B (zh) * | 2013-12-20 | 2018-12-14 | 艾利丹尼森公司 | 聚酯-三聚氰胺涂料和包括其的标签 |
| US9916776B2 (en) * | 2013-12-20 | 2018-03-13 | Avery Dennison Corporation | Polyester-melamine coatings and labels including the same |
| CN204265680U (zh) | 2014-11-25 | 2015-04-15 | 安徽明讯新材料科技股份有限公司 | 一种新型聚酰亚胺胶带 |
| CN205313454U (zh) | 2015-12-14 | 2016-06-15 | 苏州统协胶带有限公司 | 一种改进的kapton薄膜胶带 |
-
2017
- 2017-01-20 KR KR1020197021150A patent/KR102279980B1/ko active Active
- 2017-01-20 EP EP17892319.9A patent/EP3571255B8/en active Active
- 2017-01-20 US US16/478,579 patent/US20200048509A1/en not_active Abandoned
- 2017-01-20 JP JP2019539252A patent/JP6882491B2/ja active Active
- 2017-01-20 BR BR112019014801-9A patent/BR112019014801A2/pt not_active Application Discontinuation
- 2017-01-20 WO PCT/CN2017/071919 patent/WO2018133031A1/en not_active Ceased
- 2017-01-20 MX MX2019008654A patent/MX2019008654A/es unknown
- 2017-12-29 TW TW106146595A patent/TWI659843B/zh active
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2018
- 2018-01-18 CN CN201810048187.0A patent/CN107987744B/zh active Active
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| Publication number | Publication date |
|---|---|
| JP2020505253A (ja) | 2020-02-20 |
| BR112019014801A2 (pt) | 2020-02-27 |
| MX2019008654A (es) | 2019-09-23 |
| KR20190098207A (ko) | 2019-08-21 |
| EP3571255A4 (en) | 2020-09-02 |
| CN107987744B (zh) | 2020-10-23 |
| KR102279980B1 (ko) | 2021-07-21 |
| WO2018133031A1 (en) | 2018-07-26 |
| JP6882491B2 (ja) | 2021-06-02 |
| US20200048509A1 (en) | 2020-02-13 |
| CN107987744A (zh) | 2018-05-04 |
| EP3571255A1 (en) | 2019-11-27 |
| EP3571255B8 (en) | 2022-08-03 |
| EP3571255B1 (en) | 2022-06-15 |
| TWI659843B (zh) | 2019-05-21 |
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