TW201824443A - Chip positioning device comprising an absolute precision marking member, a chip attachment body, an image capturing member, an attaching member, and a positioning adjustment member - Google Patents

Abstract

The present invention provides a chip positioning device comprising an absolute precision marking member, a chip attachment body, an image capturing member, an attaching member, and a positioning adjustment member. A surface of the absolute precision marking member has an absolute precision mark of a predetermined graphic contour. The chip attachment body is disposed on the surface of the absolute precision marking member. The chip attachment body has a chip attachment surface and a back surface opposite to the chip attachment surface, wherein the back surface faces the absolute precision marking member, and the chip attachment body can be penetrated by electromagnetic waves. The image capturing member captures a chip positioning image comprising the absolute precision mark from the chip attachment surface. The positioning adjustment member performs precision adjustment according to the chip positioning image in order to allow the attaching member to correspondingly match a chip attachment position of the chip attachment surface.

Description

Grain positioning device

The present invention relates to a grain positioning device, and more particularly, to a grain positioning device having an absolute accuracy mark.

In the semiconductor wafer-level packaging process, the wafer must be cut into multiple dies, then good products can be picked out, and reattached to the adhesive film or substrate for subsequent processing. The attachment process uses precise equipment such as a robotic arm and a movable stage to accurately control the attachment position of the die.

However, the traditional grain positioning method uses the attached grains as a reference point, so there is relative accuracy between two adjacent grains, but the overall grain attachment position may not have absolute accuracy. If there are some slight errors in the attachment position of the initial grain (such as deviation from the X-axis, Y-axis, or incorrect angle), these errors may accumulate to a considerable degree after attaching several grains, which seriously affects the subsequent processing and leads to Rising costs and low yields.

Therefore, in order to solve the above problems, an object of the present invention is to provide a crystal grain positioning device having an absolute accuracy mark.

The technical means adopted by the present invention to solve the problems of the conventional technology is to provide a crystal grain positioning device, which includes: an absolute accuracy mark member whose surface has an absolute accuracy mark with a predetermined graphic profile; a crystal A grain attachment body is disposed on the surface of the absolute accuracy mark member. The grain attachment body has a grain attachment surface and a back surface opposite to the grain attachment surface, wherein the back surface faces the absolute accuracy mark. A component, and the die attaching system can be penetrated by electromagnetic waves; an image capturing component, which captures an image for die positioning including the absolute accuracy mark on the die attaching surface; an attaching component; And a positioning adjusting member, the signal is connected to the attaching member and the image capturing member, and the positioning adjusting member is precisely adjusted according to the grain positioning image so that the attaching member correspondingly matches a die on the die attaching surface. Attach position.

According to an embodiment of the present invention, a grain positioning device is provided. The absolute accuracy mark system is arranged as a plurality of coordinate points in a rectangular coordinate system.

According to an embodiment of the present invention, a grain positioning device is provided, and the absolute accuracy mark is in a vertical mesh shape.

According to an embodiment of the present invention, a grain positioning device is provided. The positioning adjustment member includes a control member and a die bearing adjustment member, and the control member signals are connected to the die bearing adjustment member and the attaching member. The grain bearing adjustment member is disposed on a back of the absolute precision marking member opposite to the surface and is arranged to drive the die attachment body and the absolute precision marking member to move. The control member controls the attachment member to move from a crystal. A die supply area picks a die and attaches the die to the die attaching surface according to the preset die attach position.

According to an embodiment of the present invention, a grain positioning device is provided. The control member controls the attaching member to move to a preliminary crystal placement position. The control member is based on at least one absolute accuracy mark in the grain positioning image. Position, by precisely adjusting the relative relationship between the die bearing adjustment member and the attaching member, the attaching member correspondingly matches the attaching position of the crystal grain on the die attaching surface.

According to an embodiment of the present invention, a grain positioning device is provided. The control component is configured to capture an image of the grain picked by the attached component through a second image capturing component to analyze a position error value. And according to the position error value and the grain positioning image, fine adjustment is performed so that the attaching member correspondingly matches the preset die attaching position of the die attaching surface.

According to an embodiment of the present invention, a grain positioning device is provided. The control member controls the attaching member to move to a preliminary crystal placement position. The control member is based on at least one absolute accuracy mark in the image for grain positioning and The grain position error value allows the attached member to match the preset die attaching position of the die attaching surface by precisely adjusting the relative relationship between the die carrying adjustment member and the attaching member.

According to an embodiment of the present invention, a grain positioning device is further provided, which further includes a light emitting member, and is arranged to emit an auxiliary positioning light toward the die attaching surface.

According to an embodiment of the present invention, a crystal grain positioning device is provided. The light emitting member is a visible light emitting member, an infrared light emitting member, an ultraviolet light emitting member, or an X-ray light emitting member.

According to the technical means adopted by the present invention, according to the position of the absolute accuracy mark in the grain positioning image, the actual placement position of each die can be matched with the preset die attach position to have absolute accuracy, and each There is also relative accuracy between the grains, thus improving the accuracy of the die attach.

The specific embodiments used in the present invention will be further explained by the following embodiments and accompanying drawings.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 4. This description is not intended to limit the embodiment of the present invention, but is an example of the embodiment of the present invention.

As shown in FIG. 1 and FIG. 2, a die positioning device 100 according to an embodiment of the present invention includes a die attaching body 1, an absolute accuracy marking member 2, a first image capturing member C1, and a sticker. Attachment member 6 and a positioning adjustment member.

The surface 21 of the absolute accuracy mark member 2 has an absolute accuracy mark 23 having a predetermined graphic contour. As shown in FIG. 2, the absolute accuracy symbol 23 is a plurality of cross-shaped coordinate points arranged in a rectangular coordinate system. However, the present invention is not limited to this. In other embodiments, for example, as shown in FIG. 3, the absolute accuracy symbol 23a is a plurality of dot coordinate points arranged in a rectangular coordinate system. As shown in FIG. 4, the absolute accuracy mark 23 b has a vertical mesh shape.

The die attach body 1 is provided on the surface 21 of the absolute accuracy mark member 2. The die attaching body 1 has a die attaching surface 11 and a back surface 12 opposite to the die attaching surface 11, wherein the back surface 12 faces the absolute accuracy marking member 2, and the die attaching body 1 is capable of being Electromagnetic waves penetrate. For example, the die attach body 1 is, for example, a transparent or translucent blue film, a UV film, or a rigid transparent plate, or a carrier (such as plastic) that can be penetrated by infrared, ultraviolet, or X-rays. And the present invention is not limited to this.

The first image capturing component C1 captures an image for crystal grain positioning including the absolute accuracy mark 23 on the crystal grain attaching surface 11.

The positioning adjustment member signal is connected to the attachment member 6 and the first image capturing member C1. The positioning adjustment member is precisely adjusted according to the crystal positioning image so that the attaching member corresponds to a preset crystal attaching position of the crystal attaching surface 11.

In detail, in this embodiment, the positioning adjustment member includes a control member 31 and a die load adjustment member 32, and the control member 31 is connected to the die load adjustment member 32 and the attachment member 6 by signals. The die bearing adjustment member 32 is provided on the back 22 of the absolute precision mark member 2 opposite to the surface 21, and is arranged to move the die attach body 1 and the absolute precision mark member 2 together (for example, a parallel view in FIG. 1). Move up and down, or move back and forth vertically, or rotate to adjust the angle. The control member 31 controls the attaching member 6 to pick a die D from a die supply area, and controls the relative movement of the attaching member 6 and / or the die load adjusting member 32 to a preliminary die placement position. Due to the effects of mechanical vibration, temperature changes, or other factors that cause errors, the prepared crystal placement position is often different from the ideal preset die attachment position. Therefore, the control member 31 uses the The position of the at least one absolute accuracy mark 23 is adapted to match the predetermined die attaching position of the die attaching surface 11 by precisely adjusting the relative relationship between the die bearing adjustment member 32 and the attaching member 6. In this way, the actual placement position of each die D can be matched with the preset die attachment position with absolute accuracy, and there is relative accuracy between each die D, so that a plurality of die D can be attached to the die. The surface 11 is neatly arranged.

Further, in this embodiment, the attachment member 6 may include a suction-type robot arm. In another embodiment, the control member 31 can precisely adjust the attaching member 6 according to the position of at least one absolute accuracy mark 23 in the grain positioning image to make the attaching member 6 correspondingly match the preset die attach. Attached location.

Further, due to the effects of mechanical vibration, temperature change, or other factors that cause errors, the prepared crystal placement position often differs from the ideal preset die attachment position. The control member 31 is set to capture the image of the die D through a second image capture member C2 to pick up the image of the die D to analyze a position error value. The control member 31 controls the attachment member 6 to move to a pre-set crystal. Position, the control member 31 corresponds to the attachment member 6 by precisely adjusting the relative relationship between the die load adjustment member 32 and the attachment member 6 according to the position error value and at least one absolute accuracy symbol 23 in the grain positioning image The predetermined die attaching position of the die attaching surface 11 is matched.

Further, the die positioning device 100 further includes a light-emitting member 4 configured to emit an auxiliary positioning light L toward the die attaching surface 11 for C1 to capture an image, and the auxiliary control member 31 controls the positioning adjustment member to adjust the preliminarily. Set the die attach position. The light emitting member 4 is a visible light emitting member, an infrared light emitting member, an ultraviolet light emitting member, or an X-ray light emitting member.

In summary, compared with the prior art, the crystal grain positioning device of the present invention can make the crystal grains and crystal grains, and the crystal grain and the crystal grain attachment body have absolute accuracy, thereby improving the accuracy of crystal grain attachment.

The above descriptions and descriptions are merely illustrations of the preferred embodiments of the present invention. Those with ordinary knowledge of this technology should make other modifications based on the scope of the patent application as defined below and the above description, but these modifications still belong to The spirit of the invention is within the scope of the invention.

100‧‧‧ Grain positioning device

1‧‧‧ Grain Attachment

11‧‧‧ die attach surface

12‧‧‧ back

2‧‧‧ Absolute accuracy mark component

21‧‧‧ surface

22‧‧‧ back

23‧‧‧ absolute accuracy mark

23a‧‧‧ absolute accuracy mark

23b‧‧‧ absolute accuracy mark

31‧‧‧Control component

32‧‧‧ Grain load adjustment member

4‧‧‧Light-emitting components

6‧‧‧ Attachment

C1‧‧‧First image capture component

C2‧‧‧Second image capture component

D‧‧‧ Grain

L‧‧‧ auxiliary positioning light

FIG. 1 is a schematic diagram showing a die positioning device according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing an absolute accuracy mark member according to an embodiment of the present invention. FIG. 3 is a schematic diagram showing an absolute accuracy marking member according to another embodiment of the present invention. FIG. 4 is a schematic diagram showing an absolute accuracy mark member according to another embodiment of the present invention.

Claims (9)

A grain positioning device includes: an absolute precision mark member, a surface of the absolute precision mark member having an absolute precision mark having a predetermined graphic profile; a die attaching body disposed on the surface of the absolute precision mark member, the The die attaching body has a die attaching surface and a back face opposite to the die attaching face, wherein the back face faces the absolute accuracy marking member, and the die attaching system is transparent to electromagnetic waves; An image capturing component, which captures an image for grain positioning including the absolute accuracy mark on the die attaching surface; an attaching component; and a positioning adjusting component, which signals connect the attaching component and the image capture A component is taken, and the positioning adjustment component is precisely adjusted according to the image for grain positioning so that the attaching member correspondingly matches a preset die attaching position of the die attaching surface. The grain positioning device according to claim 1, wherein the absolute accuracy marks are arranged as a plurality of coordinate points in a rectangular coordinate system. The grain positioning device according to claim 1, wherein the absolute accuracy symbol is a vertical mesh. The grain positioning device according to claim 1, wherein the positioning adjustment member includes a control member and a grain bearing adjustment member, and the control member signal is connected to the grain bearing adjustment member and the attaching member, and the grain bearing The adjusting member is disposed on a back of the absolute precision marking member opposite to the surface and is arranged to drive the die attachment body and the absolute precision marking member to move. The control member controls the attachment member from a die supply area. Pick a die and attach the die to the die attaching surface according to the preset die attach position. The grain positioning device according to claim 4, wherein the control member controls the attachment member to move to a preliminary crystal placement position, and the control member transmits the position of at least one absolute accuracy mark in the grain positioning image through The relative relationship between the die bearing adjustment member and the attaching member is precisely adjusted so that the attaching member correspondingly matches the preset die attaching position of the die attaching surface. The grain positioning device according to claim 4, wherein the control component is set to capture an image of the grain picked by the attached component through a second image capturing component to analyze a grain position error value, and According to the crystal grain position error value and the crystal grain positioning image, fine adjustment is performed so that the attaching member correspondingly matches the preset crystal grain attaching position of the crystal grain attaching surface. The grain positioning device according to claim 6, wherein the control member controls the attaching member to move to a prepared crystal placement position, and the control member is based on at least one absolute accuracy mark in the image for grain positioning and the crystal grain The position error value enables the attached member to match the preset die attaching position of the die attaching surface by precisely adjusting the relative relationship between the die carrying adjustment member and the attaching member. The grain positioning device according to claim 1, further comprising a light-emitting component, which is arranged to emit an auxiliary positioning light toward the die attaching surface. The crystal grain positioning device according to claim 8, wherein the light emitting member is a visible light emitting member, an infrared light emitting member, an ultraviolet light emitting member, or an X-ray light emitting member.