TW201803787A - Electronic component conveying device and electronic component inspecting device includes a model image creating part that can adjust at least one of the brightness of the model image and the intercepting region of the model image to realize high-precision conveying by correcting conveying position - Google Patents

Abstract

The object of this invention is to provide an electronic component conveying device and an electronic component inspecting device which realize high-precision conveying by correcting conveying position. The electronic component conveying device has an electronic component carrying part on which an electronic component can be carried, an imaging part 51 capable of capturing an image of the electronic component carrying part, and a model image creating part 314 capable of creating a model image of the electronic component carrying part based on the image. Furthermore, the model image creating part 314 can adjust at least one of the brightness of the model image and the intercepting region of the model image with respect to the image.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

In the IC processing machine, based on the image captured by the camera, the positions of the transport source and the transport destination are identified by image processing, and the transport position is corrected to realize high-precision transport. In this image processing, a model image of a transport position registered in advance is used. The model image is registered in each transfer position (tray, change kit). Therefore, when creating inspection settings (recipes), it is necessary to register all the model images. In this image operation, "brightness adjustment" and "interception of the model image" are performed according to the subjectivity of the operator, so that the registered model image differs depending on the operator. Even if they are the same operator, they may be different each time they log in. In addition, the operator has to register model images at a plurality of transport positions, and is forced to perform a lot of work, which is a burden. For example, a model image registered to detect the presence or absence of a part is disclosed (for example, refer to Patent Document 1). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2001-67478

[Problems to be Solved by the Invention] However, Patent Document 1 does not disclose an adjustment method when the brightness or position of an image is optimized. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the problems described above, and can be implemented as the following forms or application examples. [Application Example 1] The electronic component transporting device of this application example is characterized by having an electronic component mounting section that can mount electronic components, a camera section that can capture an image of the electronic component mounting section, and a model An image creation unit that can create a model image of the electronic component placement unit based on the image; and the model image creation unit can adjust the brightness of the model image and the model image relative to the image At least one of the interception positions. According to this application example, at least one of the brightness of the model image and the interception position of the model image relative to the image can be adjusted. Thereby, the best model image can be obtained. As a result, it is possible to provide an electronic component transfer device that corrects the transfer position and realizes high-precision transfer. [Application Example 2] The electronic component conveying device described in the above application example, preferably, the model image creation section automatically adjusts the model image based on the brightness of the pixels in the image and the number of pixels. brightness. According to this application example, the brightness can be controlled automatically. [Application Example 3] The electronic component transporting device described in the above application example preferably includes an input section for inputting a brightness adjustment parameter, and the model image creation section adjusts the model using the inputted brightness adjustment parameter. The brightness of the image. According to this application example, the adjusted brightness value can be easily controlled. [Application Example 4] The electronic component transfer device described in the above application example, wherein the adjustment of the interception position of the model image is preferably performed by differentially processing the image data of the image captured by the imaging unit. . According to this application example, it is possible to easily emphasize processing by differentiating and creating an image. [Application Example 5] The electronic component transporting device as described in the above application example, preferably having a display section, and the model image creation section based on the imaging signal of the imaging section to brightness the pixels in the image And the number of pixels are displayed on the display section. According to this application example, the brightness value of the entire brightness-based image can be compared with a specific threshold value (brightness value), etc., and the brightness of the image can be easily adjusted, and the brightness value can be easily confirmed, so it becomes the brightness. Adjustment is very convenient. [Application Example 6] The electronic component transfer device described in the above application example, wherein the model image creation unit preferably digitizes the brightness of the pixels in the image and the number of pixels. According to this application example, the brightness can be easily controlled automatically. [Application Example 7] The electronic component conveying device described in the above application example, wherein the numerical value is preferably set to set the brightness of the pixels in the pixels as the first axis, and set the number of the pixels to A histogram of a second axis orthogonal to the first axis. According to this application example, since the digitization is generated by using the model image creation section by using a well-known histogram, the model image creation section can be simply constructed, and the digitization can be appropriately generated. [Application Example 8] The electronic component transporting device described in the above application example, wherein the model image creation unit preferably displays the histogram on the display unit. According to this application example, the tendency of brightness can be easily grasped by displaying the histogram. [Application Example 9] The electronic component transporting device of this application example is characterized by having an electronic component mounting section capable of mounting electronic components, and an imaging section capable of imaging an image of the electronic component mounting section; and a model An image display setting unit that can display setting information of a model image of the electronic component mounting unit based on the image, and has an instruction acceptance unit that can accept an instruction for automatic registration of the model image; and the model diagram The image display setting section includes an electronic component mounting section selecting section that can select the electronic component mounting section. When the instruction receiving section has an instruction, the image display setting section can automatically adjust the brightness of the model image and compare it with the model image. At least one of the intercepted positions of the above image. According to this application example, at least one of the brightness of the model image and the interception position of the model image relative to the image can be adjusted. Thereby, the best model image can be obtained. As a result, it is possible to provide an electronic component transfer device that corrects the transfer position and realizes high-precision transfer. [Application Example 10] The electronic component inspection device of this application example is characterized by having: an electronic component mounting section that can mount electronic components; a camera section that can capture an image of the electronic component mounting section; a model diagram An image creation unit can create a model image of the electronic component placement unit based on the image; and an inspection unit that inspects the electronic component; and the model image creation unit can adjust the brightness of the model image, and At least one of the interception positions of the model image with respect to the image. According to this application example, at least one of the brightness of the model image and the interception position of the model image relative to the image can be adjusted. Thereby, the best model image can be obtained. As a result, it is possible to provide an electronic component inspection device that corrects the transport position and realizes high-precision transport.

(First Embodiment) Hereinafter, The electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiment shown in the accompanying drawings.  FIG. 1 is a schematic perspective view showing an inspection apparatus according to this embodiment. FIG. 2 is a schematic plan view of the inspection device shown in FIG. 1. FIG. FIG. 3 shows the control device of the inspection device shown in FIG. 1, Set display section, And a block diagram of the image acquisition section of the mounting section. FIG. 4 is a schematic side view of the image acquisition section of the mounting section shown in FIG. 2.  another, In Figure 1, figure 2, Figure 4 (described later), And in FIG. 13 (described later), For ease of explanation, The three axes orthogonal to each other are illustrated by arrows, X axis, Y axis, And the Z axis, Set the front side of the arrow to "+ (positive)", The base end side is set to "-(negative)". also, the following, The direction (first direction) parallel to the X axis is referred to as the "X axis direction", The direction parallel to the Y axis (the second direction) is called the "Y axis direction", The direction parallel to the Z axis is called the "Z axis direction". also, the following, For ease of explanation, The upper side (+ Z-axis direction side) in FIG. 1 is referred to as "upper", The lower side (the side in the -Z axis direction) is called "down".  also, The XY plane containing the X and Y axes becomes horizontal, The Z axis becomes vertical. also, The upstream side of the direction in which electronic parts are transported is also referred to as "upstream side". The downstream side is simply referred to as the "downstream side". also, The "level" mentioned in the description of this case is not limited to the full level. As long as the electronic parts are not hindered, It also includes a state inclined slightly (for example, less than about 5 °) with respect to the horizontal.  The inspection device (electronic component inspection device) 1 shown in Figs. 1 and 2 is used to inspect, Test (hereinafter referred to as "inspection") BGA (Ball grid array: Spherical grid array) package or LGA (Land grid array: Platform grid array) IC devices, etc. LCD (Liquid Crystal Display: LCD Monitor), CIS (CMOS Image Sensor: CMOS image sensor) and other electrical characteristics of electronic components. another, the following, For ease of explanation, As an example, the use of IC devices as the above-mentioned electronic parts for inspection will be described. And set it as "IC device 90".  As shown in Figures 1 and 2, Inspection device (electronic component inspection device) 1 includes a transfer device (electronic component transfer device) 90 for transferring IC devices (electronic components) 90, Inspection Department 16, A setting display section 40 including a display section 41 and an operation section 42, And control device 30. The transfer device 10 includes an electronic component mounting portion 2 on which the IC device 90 can be mounted. The electronic component mounting section 2 is, for example, a tray 200, Electronic parts supply unit 14, Electronic parts recycling department 18, Temperature adjustment section 12, Recycling tray 19, And rotary stage (not shown), etc. (hereinafter, When these mounting portions are not distinguished, they are also referred to as "electronic component mounting portion 2"). also, The transfer device 10 includes: Mounting section image acquisition section 50, It includes an imaging device (imaging section) 51 and an illuminating device 52 (see FIG. 3) that can capture an image of the electronic component mounting section 2.  another, In this embodiment, According to the inspection device 1, The conveying device 10 is configured by a configuration other than the inspection section 16 and an inspection control section 312 included in a control device 30 described later (see FIG. 3).  As shown in Figures 1 and 2, The inspection device 1 is divided into a tray supply area A1, Device supply area A2 Inspection area A3 where inspection section 16 is provided, Device recycling area A4, And tray removal area A5.  Each of these areas is separated from each other by a wall portion, a shutter, or the like, which is not shown. And The device supply region A2 becomes the first chamber R1 divided by a wall portion or a shutter. also, The inspection area A3 is a second room R2 divided by a wall portion or a shutter. also, The device recovery region A4 is a third chamber R3 divided by a wall portion or a shutter. also, Room 1 R1 (device supply area A2), Room 2 R2 (inspection area A3), The third chamber R3 (device recovery area A4) is configured to ensure airtightness or thermal insulation. With this, Room 1 R1 Room 2 R2 And the third room R3 can maintain the humidity or temperature as much as possible. another, The first room R1 and the second room R2 are controlled to a specific humidity and a specific temperature, respectively. E.g, Under normal temperature environment, In low temperature environment, And inspection under high temperature environment.  In the inspection device 1, The IC device 90 sequentially passes through each area from the tray supply area A1 to the tray removal area A5. The inspection (electrical inspection) is performed in the inspection area A3 in the middle. In the above-mentioned "inspection (electrical inspection)" of this embodiment, E.g, Confirm whether to conduct the IC device 90, Or when a specific signal is input, Check whether the desired output is obtained. With this, Whether the IC device 90 is disconnected or short-circuited can be determined. In addition, In the inspection section 16, An inspection for confirming the operation of a circuit (not shown) and the like provided in the IC device 90 may be performed.  the following, Each of the areas A1 to A5 of the inspection device 1 will be described.  (Tray supply area) As shown in Figure 2, The tray supply area A1 is an area in which a tray 200 (electronic component mounting portion 2) in which a plurality of IC devices 90 in an unchecked state are arranged is arranged. In the tray supply area A1, Multiple trays 200 can be stacked.  (Device supply area) As shown in Figure 2, The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. another, By crossing the tray supply area A1 and the device supply area A2, A tray transfer mechanism 11A provided with a transfer tray 200, 11B.  In the device supply area A2, Provided with a temperature adjustment section 12 (electronic component mounting section 2), Supply robot (device transfer head) 13, And supply empty tray transport mechanism 15.  The temperature adjustment section 12 is configured with an IC device 90, And heating or cooling the configured IC device 90, The IC device 90 is adjusted (controlled) to a temperature suitable for inspection. In the structure shown in FIG. 2, Two temperature adjustment sections 12 are arranged and fixed in the Y-axis direction. And The IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to and placed on any one of the temperature adjustment sections 12.  The supply robot 13 is a transfer unit that transfers the IC device 90, In the X-axis direction within the device supply region A2, Y-axis direction, The Z-axis direction is movably supported. The supply robot 13 is responsible for the transportation of And the IC device 90 is transported between the temperature adjustment section 12 and the electronic component supply section 14 (electronic component placement section 2) described later. another, The supply robot 13 includes a plurality of gripping sections (not shown) that grip the IC device 90. Each holding part is provided with a suction nozzle, The IC device 90 can be held by holding it. also, The supply robot 13 may be the same as the temperature adjustment unit 12, Heating or cooling the IC device 90, The IC device 90 is adjusted to a temperature suitable for inspection.  The supply empty tray conveyance mechanism 15 is a conveyance unit (conveyance mechanism) for conveying the empty tray 200 in a state where all IC devices 90 are removed in the X-axis direction. And After the transfer, The empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.  (Inspection area) As shown in Figure 2, The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, Provided with an electronic parts supply unit 14, Inspection Department 16, Measurement robot (device transfer head) 17, And an electronic component recovery section 18 (electronic component placement section 2). another, In this embodiment, The electronic parts supply unit 14 and the electronic parts recovery unit 18 are independently and movably configured, But these can also be linked or integrated, And movably formed in the same direction.  The electronic component supply unit 14 is an IC device 90 after temperature adjustment (temperature control), and is transferred to a transfer unit near the inspection unit 16. The electronic component supply unit 14 can reciprocate in the X-axis direction between the device supply region A2 and the inspection region A3. also, In the structure shown in FIG. 2, Two electronic component supply units 14 are arranged in the Y-axis direction. The IC device 90 on the temperature adjustment section 12 is transferred to and placed on any one of the electronic component supply sections 14. another, This transfer is performed by the supply robot 13. also, In the electronic parts supply section 14, Like the temperature adjustment unit 12, Heating or cooling the IC device 90, The IC device 90 is adjusted to a temperature suitable for inspection.  Inspection department 16 series inspection, Unit for testing the electrical characteristics of IC device 90, That is, when the IC device 90 is inspected, the holding portion of the IC device 90 is held. A plurality of probe pins are provided in the inspection section 16 to maintain the state of the IC device 90 and the terminals of the IC device 90 are electrically connected. And The terminals of the IC device 90 are electrically connected (contacted) with the probe pins, Inspection (electrical inspection) of the IC device 90 is performed through a probe pin. also, In the inspection section 16, Like the temperature adjustment unit 12, Heating or cooling the IC device 90, The IC device 90 is adjusted to a temperature suitable for inspection.  The measurement robot 17 is a transfer unit that transfers the IC device 90, It is movably supported in the inspection area A3. The measurement robot 17 can transfer and place the IC device 90 on the electronic component supply section 14 carried in from the device supply area A2 to the inspection section 16. also, When inspecting the IC device 90, The measurement robot 17 presses the IC device 90 toward the inspection unit 16, With this, The IC device 90 is brought into contact with the inspection section 16. With this, As mentioned above, The terminals of the IC device 90 are electrically connected to the probe pins of the inspection section 16. another, The measurement robot 17 includes a plurality of gripping sections (not shown) that grip the IC device 90. Each holding part is provided with a suction nozzle, The IC device 90 can be held by holding it. also, The measurement robot 17 may be the same as the temperature adjustment unit 12. Heating or cooling the IC device 90, The IC device 90 is adjusted to a temperature suitable for inspection. another, In this embodiment, As shown, The number of measuring robots 17 is one, Two or more may be provided.  The electronic component recovery section 18 is an IC device 90 on which the inspection performed by the inspection section 16 is placed and transferred to the transport section of the device recovery area A4. The electronic component recovery section 18 can reciprocate along the X-axis direction between the inspection area A3 and the device recovery area A4. also, In the structure shown in FIG. 2, The electronic parts recovery unit 18 is the same as the electronic parts supply unit 14. Two are arranged in the Y-axis direction. The IC device 90 on the inspection section 16 is transported to any of the electronic part recovery sections 18, And placed. another, This transfer is performed by the measurement robot 17.  As shown in Figure 4, The mounting portion 181 is formed in a concave shape opened at the top, And it is formed in the shape whose cross-sectional area decreases toward the bottom surface. The mounting portion 181 having such a shape is composed of a bottom surface and four inclined side surfaces. When the side surface of the mounting portion 181 is mounted on the IC device 90, It functions as a guide surface that guides the IC device 90 to the placement portion 181. With this, The IC device 90 can be easily placed on the placement portion 181.  also, For the surfaces (side surface and bottom surface) constituting the mounting portion 181, An antireflection treatment is performed to reduce the reflection on the surface. With this, When the electronic component mounting section 2 can be imaged by the imaging device 51 included in the mounting section image acquisition section 50 described later, The useless light is suppressed from being incident on an imaging element (not shown) included in the imaging device 51. therefore, A sharper image can be obtained by the imaging device 51 described later.  As anti-reflection treatment, It is not particularly limited. Examples include the formation of antireflection films, Roughening treatment (treatment to increase light scattering), Black processing (processing to increase the absorption of light), etc.  (Device Recycling Area) As shown in Figure 2, The device recovery area A4 is an area of the IC device 90 after the recovery inspection is completed. A recycling tray 19 is provided in the device recycling area A4. Recycling robot 20, And recovering the empty tray conveying mechanism 21. also, Three empty trays 200 are also prepared in the device recovery area A4.  The recycling tray 19 is an electronic component mounting portion 2 on which the IC device 90 is mounted. The recovery tray 19 is fixed in the device recovery area A4, And in the structure shown in FIG. 2, Three are arranged in the X-axis direction. also, The empty tray 200 is also an electronic component placement section 2 on which the IC device 90 is placed. Three are arranged in the X-axis direction. And The IC device 90 on the electronic parts collection section 18 moved to the device collection area A4 is transferred to one of the collection trays 19 and the empty tray 200, And placed. With this, The IC device 90 is collected and classified (sorted) according to each inspection result. The classification of the IC device 90 based on the inspection result is performed by the recovery robot 20. The recovery robot 20 is instructed by a control device 30 described later, The IC device 90 is classified.  The collection robot 20 is a transfer unit that transfers the IC device 90, In the X-axis direction within the device recovery area A4, Y-axis direction, The Z-axis direction is movably supported. The collection robot 20 can transfer the IC device 90 from the electronic component collection unit 18 to the collection tray 19 or the empty tray 200. another, The collection robot 20 includes a plurality of holding portions (not shown) that hold the IC device 90. Each holding part is provided with a suction nozzle, The IC device 90 can be held by holding it.  The collected empty tray transfer mechanism 21 is a transfer unit (transfer mechanism) that transfers the empty tray 200 carried in from the tray removal area A5 in the X-axis direction. And After the transfer, The empty tray 200 is disposed at the position of the recovered IC device 90. This can be any one of the three empty trays 200 described above.  (Tray removal area) The tray removal area A5 is a collection of the trays 200 in which a plurality of IC devices 90 are arranged in a checked state. And remove the area. In the tray removal area A5, Multiple trays 200 can be stacked. another, By crossing the device recovery area A4 and the tray removal area A5, A tray transfer mechanism 22A provided with a piece-by-piece transfer tray 200, 22B. The tray transfer mechanism 22A transfers the tray 200 on which the IC devices 90 having been inspected are loaded from the device recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B transfers the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the device collection area A4.  The first room R1 in each of the areas A1 to A5 described above. Room 2 R2 And room 3 R3, Although not shown, However, there are temperature sensors (thermometers) for detecting indoor temperature, Humidity sensor (hygrometer) for detecting indoor humidity (relative humidity), And an oxygen concentration sensor (oxygen concentration meter) that detects the oxygen concentration in the room. another, Although in this embodiment, In Room 1, R1 Room 2 R2 And each of the third room R3 is provided with a temperature sensor, Humidity sensor, And oxygen concentration sensor, But with a temperature sensor, Humidity sensor, The location of the oxygen concentration sensor is arbitrary.  also, Although not shown, However, the inspection apparatus 1 includes a dry air supply mechanism. The dry air supply mechanism is configured so that Room 2 R2 And the third room R3 supplies low humidity air, Gases such as nitrogen (hereinafter also referred to as dry air). therefore, By supplying dry air as needed, Prevents condensation on IC devices 90, Freezing (with ice).  another, In the above embodiment, The inspection device 1 is configured so that In low temperature environment, And inspection under high temperature environment, But it is not limited to this, The inspection may be performed in at least one of the three environments. It also does not include e.g. walls, Blocking, Hygrometer, Oxygen concentration meter, And dry air and other low temperature environment.  (Control device) As shown in FIG. 3, The control device 30 has a function of controlling each part of the inspection device 1, And has a control unit 31, And memory 32.  The control unit 31 includes, for example, a CPU (Central Processing Unit: Central processing unit), With drive control section 311, Inspection control section 312, Imaging control section 313, And model image creation unit 314. The memory unit 32 includes, for example, a ROM (Read Only Memory: Read-only memory), And RAM (Random Access Memory: Random access memory).  The drive control section 311 controls each section (the tray transport mechanism 11A, 11B, Temperature adjustment section 12, Supply robot 13, Supply empty tray conveying mechanism 15, Electronic parts supply unit 14, Inspection Department 16, Measuring robot 17, Electronic parts recycling department 18, Recycling robot 20, Empty pallet transfer mechanism 21, And pallet transfer mechanism 22A, 22B).  The inspection control unit 312 may also be based on a program (software) stored in the storage unit 32, for example, An inspection or the like of the IC device 90 arranged in the inspection section 16 is performed.  The imaging control section 313 controls the driving of the mounting section image acquisition section 50 and the like. also, The imaging control unit 313 processes signals from the imaging device 51, The image of the electronic component placement unit 2 obtained by the placement unit image acquisition unit 50 is converted into data (image data is generated).  The model image creation unit 314 creates a model image of the electronic component placement unit 2 based on the image data. The model image creation unit 314 adjusts the brightness of the model image. The model image creation unit 314 adjusts the interception position of the model image with respect to the image data. The model image creation unit 314 adjusts the brightness of the model image, At least one of the interception positions of the image data with respect to the model image.  The model image creation unit 314 displays the brightness of the pixels in the image and the number of pixels on the display unit 41 based on the imaging signal of the imaging device 51. With this, Can compare the brightness value of the whole image based on brightness, And specific thresholds (brightness values), etc. Easily adjust the brightness of the image, Because it ’s easy to check the brightness value, Therefore, it is very convenient to adjust the brightness.  The model image creation unit 314 automatically adjusts the brightness of the model image based on the brightness of the pixels in the image and the number of pixels. With this, Can automatically control brightness.  The model image creation unit 314 digitizes the brightness of the pixels in the image and the number of pixels. With this, The brightness can be easily and automatically controlled.  The digitization is made by setting the brightness of the pixels in the image as the horizontal axis of the first axis, The number of pixels is set as a histogram of the vertical axis of the second axis orthogonal to the first axis. With this, The numerical value is generated by using the model image creation unit 314 by using a well-known histogram. Therefore, the model image creation unit 314 can be simply constructed. Numerical value can be generated appropriately.  The model image creation unit 314 displays a histogram on the display unit 41. With this, The tendency of brightness can be easily grasped by displaying the histogram.  The model image creation section 314 adjusts the brightness of the model image using the brightness adjustment parameters input from the operation section (input section) 42. With this, The brightness value can be easily controlled and adjusted.  The adjustment of the interception position of the model image is performed by differentially processing the image data of the image captured by the imaging device 51. With this, The processing can be easily emphasized by differentiating and creating an image.  also, The control unit 31 includes a drive unit for each unit, The function of displaying the inspection results and image data on the display section 41, Or a function for processing based on an input from the operation section 42.  The memory unit 32 is a program or data used by the memory control unit 31 to perform various processes.  (Setting display section) As shown in Figs. 1 and 3, The setting display section 40 includes a display section 41 and an operation section 42.  The display unit 41 includes a monitor 411 that displays the driving and inspection results of each unit. The monitor 411 may be configured by, for example, a liquid crystal display panel or a display panel such as an organic EL. The operator can set via this monitor 411, Or check various processes and conditions of the inspection device 1.  The operation unit 42 is an input device such as a mouse 421, An operation signal corresponding to the operator's operation is output to the control section 31. therefore, The operator can use the mouse 421 to instruct the control unit 31 for various processes and the like.  another, In this embodiment, Although a mouse 421 is used as the operation portion 42, However, the operation section 42 is not limited to this. It can also be, for example, a keyboard, Trackball, Input devices such as touch panels.  (Placement section image acquisition section) The placement section image acquisition section 50 has a function of acquiring an image of the electronic component placement section 2. as shown in picture 2, The mounting section image acquisition section 50 is located between the tray supply area A2 and the device collection area A4. It is installed in the supply robot 13 and the collection robot 20. which is, The mounting section image acquisition section 50 is provided at a position where an image of the electronic component mounting section 2 can be acquired.  The mounting section image acquisition section 50 includes a first mounting section image acquisition section 50a, And the second placement section image acquisition section 50b. The first mounting section image acquisition section 50 a and the second mounting section image acquisition section 50 b are provided above the electronic component mounting section 2.  another, In this embodiment, When each of the first placement unit image acquisition unit 50a and the second placement unit image acquisition unit 50b is regarded as one placement unit image acquisition unit 50, The number of the mounting section image acquisition sections 50 is two, However, the number of the mounting section image acquisition sections 50 is not limited to this, It's arbitrary.  The mounting section image acquisition section 50 is supported by the supply robot 13 and the recovery robot 20 so as to be disposed above the electronic component mounting section 2. With this, The mounting section image acquisition section 50 can acquire an image of the state of the upper surface 911 of the electronic component mounting section 2 from above the electronic component mounting section 2 vertically.  The first placement section image acquisition section 50a and the second placement section image acquisition section 50b include an imaging device 51 and an illumination device 52, respectively. another, In addition to the continuous lighting of the lighting device 52, Can also be intermittent light (flash), As long as the exposure time can be controlled, Can be either.  The imaging device 51 includes an imaging element that receives light from the electronic component mounting portion 2 and converts the light into an electrical signal. As this imaging device 51, It is not particularly limited. E.g, Examples include the use of CCD (Charge Coupled Device: Charge-coupled device) camera with image sensor (CCD camera), Using CMOS (Complementary Metal Oxide Semiconductor: (Complementary Metal Oxide Semiconductor) image sensor as a camera, Electronic cameras (digital cameras) and the like that use MOS image sensors as cameras for imaging elements. also, By using, for example, differential interference, Fourier transform and other analytical image data, Emphasizes fine shapes or difficult-to-see shapes, Increase the detection sensitivity of the shape. also, Can emphasize fine scars or scars that are not easily seen, Increase the detection sensitivity of the flaw.  The imaging device 51 is configured such that the imaging area is substantially equal to or larger than the size of the upper surface 911 of the electronic component mounting portion 2.  also, Although the imaging device 51 is not shown, However, an optical system including an optical lens or an autofocus mechanism is preferred. With this, E.g, In a case where the height (the height in the Z-axis direction) of the electronic component mounting portion 2 relative to the imaging device 51 is different, Vivid images can also be obtained.  The illuminating device 52 is driven when imaging is performed by the electronic component mounting portion 2 of the imaging device 51, A light source device for irradiating light to the electronic component mounting portion 2. With this lighting device 52, It can prevent the image from darkening when the amount of light is insufficient, Get sharper images.  In the present embodiment, the lighting device 52 Formed into a ring shape, It is arranged around the imaging device 51. With this, The electronic component mounting portion 2 can be uniformly irradiated with light. another, The shape or arrangement of the lighting device 52 is not limited to the above-mentioned configuration.  The mounting section image acquisition section 50 configured as described above irradiates the electronic component mounting section 2 with light through an irradiation device 52, The electronic component mounting section 2 is imaged by the imaging device 51. The signal from the imaging device 51 is captured to the imaging control section 313 described above. The imaging control unit 313 processes a signal from the imaging device 51, An image of the electronic component mounting portion 2 is generated as a two-dimensional image data.  also, The three-dimensional image data may also be generated using the image of the electronic component placement section 2 obtained by the placement section image acquisition section 50. In that case, E.g, Although not shown, But as long as you set more than two for one configuration line (for example, 3) The mounting section image acquisition section 50 is sufficient.  (Example) The following, Describe a series of operations of the inspection device 1 configured as described above, The acquisition of an image of the electronic component mounting section 2 will be described.  FIG. 5 is a flowchart showing a process of automatically registering a model image in this embodiment.  An example of a flow of automatic registration of the model image in the model image creation unit 314 will be described below.  The model image creation unit 314 in this embodiment automatically creates a model image. The model image creation unit 314 automatically performs the operations of "brightness adjustment" and "interception of the model image".  First of all, In step S10, The imaging control section 313 moves the mounting section image acquisition section 50 above the electronic component mounting section 2.  then, In step S20, The model image creation section 314 adjusts the brightness of the image of the electronic component placement section 2.  then, In step S30, The model image creation section 314 determines a model image area of an image of the electronic component placement section 2.  then, In step S40, The model image creation unit 314 captures and registers the model image of the electronic component placement unit 2. And End the automatic registration of the model image.  FIG. 6 is a flowchart showing the process of brightness adjustment in this embodiment.  An example of the processing of the "brightness adjustment" in step S20 described above will be described below.  The model image creation unit 314 digitizes the brightness of the pixels in the image and the number of pixels. With this, The brightness can be easily and automatically controlled. The model image creation unit 314 is in the automation of "brightness adjustment". The appropriate setting value is determined according to the brightness distribution in the captured image. at this time, Adjustment settings include exposure time, Shutter speed, Lighting intensity, aperture, Lighting time and so on. another, The lighting time can also be adjusted when the flash is used.  First of all, In step S210, The mounting section image acquisition section 50 is an imaging electronic component mounting section 2.  then, In step S220, The model image creation section 314 creates a brightness distribution of an image of the electronic component placement section 2.  The model image creation unit 314 displays the brightness of the pixels in the image and the number of pixels on the display unit 41 based on the imaging signal of the imaging device 51. With this, Can compare the brightness value of the whole image based on brightness, And specific thresholds (brightness values), etc. Easily adjust the brightness of the image, Because it ’s easy to check the brightness value, Therefore, it is very convenient to adjust the brightness.  The digitization is made by setting the brightness of the pixels in the image to the horizontal axis (the first axis), The number of pixels is set as a histogram of the vertical axis (second axis). With this, The numerical value is generated by using the model image creation unit 314 by using a well-known histogram. Therefore, the model image creation unit 314 can be simply constructed. Numerical value can be generated appropriately.  then, In step S230, The model image creation unit 314 determines whether the brightness is appropriate. Evaluate the distribution of the histogram, And judge the brightness.  FIG. 7 is a diagram illustrating an algorithm for brightness adjustment in this embodiment.  As shown in the lower figure of Figure 7, When the right end of the distribution of the histogram 70 is further to the right of the reference value, Judgment image is brighter. In brighter situations, Go to step S240.  As shown in the upper diagram of Figure 7, When the right end of the distribution of the histogram 74 is further to the left of the reference value, Judgment image is dark. In darker situations, Go to step S250.  then, In step S240, The model image creation unit 314 dims the pixels in the image (reduces the exposure time). The distribution is included in a predetermined benchmark value. in particular, The distribution of the histogram 70 is narrowed and included in the reference value like the distribution of the histogram 72.  then, In step S250, The model image creation unit 314 brightens pixels in the image (increases the exposure time). The distribution is included in a predetermined benchmark value. in particular, The distribution of the histogram 74 is enlarged and fully included in the reference value as the distribution of the histogram 72.  Then return.  FIG. 8 is a flowchart showing a process of determining a model image area in this embodiment.  An example of the processing of "model image area determination" in step S30 described above will be described below.  The adjustment of the interception position of the model image is performed by differentially processing the image data of the image captured by the imaging device 51. With this, The processing can be easily emphasized by differentiating and creating an image. In the automation of "Capturing Model Images", Based on the dimensions of the IC device 90 and the electronic component mounting portion 2, Determine the model image area in the captured image, And capture the image. When determining the model image area, Features (symmetry) within the image are also used. The adjustment of the interception position of the model image is determined by confirming the edges in the image.  E.g, Confirm the edges as follows.  First of all, In step S310, The model image creation section 314 is a dummy model image area that determines the image of the electronic component placement section 2. In the center of the image, It is set larger than the size of the electronic component mounting portion 2. Make a differential image of the image, And capture the edges. Based on the size of the electronic component mounting portion 2, Decide on the capture frame (size of electronic component mounting section + α).  then, In step S320, The model image creation unit 314 changes the dummy model image area up and down, left and right, and evaluates the symmetry of the model image area.  E.g, The model image creation unit 314 calculates the rotational symmetry of the model image. The model image creation unit 314 intercepts a model image. The model image creation unit 314 extracts the area of the edge portion of the model image. The model image creation section 314 expands the capture frame. Repeated model image capture and edge area extraction (up to the maximum specified in advance).  then, In step S330, The model image creation unit 314 uses the position with the highest symmetry as the model image area. The model image creation unit 314 regards the position with higher symmetry as the center of the model image. The model image creation unit 314 determines the optimal edge position based on the distribution of the frame and the edge area. And determine the interception position of the model image. The optimal edge position is, for example, the size at which the edge area is saturated, Or the edge area above a certain threshold. Then return.  FIG. 9 is a flowchart showing a flow of automatic registration of a model image in this embodiment.  The following describes an example of a flow of a plurality of processes during automatic registration of the model image in the model image creation unit 314.  The registration process of the model image in FIG. 5 can also be processed multiple times. Get more appropriate model images. In order to obtain even better model images, Repeat the "brightness adjustment" and "the interception of the model image" several times.  First of all, In step S10, The imaging control section 313 moves the mounting section image acquisition section 50 above the electronic component mounting section 2.  then, In step S20, The model image creation section 314 adjusts the brightness of the image of the electronic component placement section 2.  then, In step S30, The model image creation section 314 determines a model image area of the electronic component placement section 2.  then, In step S32, The imaging control section 313 moves the placement section image acquisition section 50 toward a position where the model image region of the electronic component placement section 2 can be photographed centrally.  then, In step S34, The model image creation section 314 performs brightness adjustment in the model image area of the electronic component placement section 2. It is further optimized.  then, In step S36, The model image creation section 314 determines a model image area of the electronic component placement section 2. With this, A model image of the electronic component placement section 2 that can be used for the center imaging of the placement section image acquisition section 50 can be used.  then, In step S40, The model image creation unit 314 captures and registers the model image of the electronic component placement unit 2. And End the automatic registration of the model image.  As mentioned above, In the inspection device 1, An image of the electronic component placement section 2 is acquired by the placement section image acquisition section 50.  According to this embodiment, Adjust the brightness of the model image, At least one of the interception positions of the model image and the image. With this, Get the best model image. the result, A transfer device 10 and an inspection device 1 capable of correcting the transfer position and realizing high-precision transfer can be provided.  also, The best model registration that does not depend on the operator can be performed. Reduce the burden on login operators.  (Second Embodiment) Fig. 10 is a view showing a setting screen for automatic registration of a model image according to this embodiment.  the following, Although this embodiment has been described, However, the differences from the first embodiment described above will be mainly described. The description of the same matters is omitted.  The transfer device 10 of this embodiment includes: Supply conveyance correction setting screen (model image display setting section) 80, It can display the setting information of the model image of the electronic component mounting section 2 based on the image, The model has an automatic model registration button (instruction accepting unit) 82 that can accept an instruction for automatic registration of the model image.  The supply conveyance correction setting screen 80 is provided with a detection groove selection button (electronic component placement portion selection portion) 84 that can select the electronic component placement portion 2. The operator (operator) selects the electronic component placement section 2 with the detection groove selection button 84. The automatic registration of the model image is performed by the operator (operator) selecting the model automatic registration button 82. When the model automatic registration button 82 is selected, The model image creation unit 314 automatically adjusts the brightness of the model image, At least one of the interception positions of the model image and the image.  another, The operation of the operation unit 42 of the operator (operator) is, for example, by operating the mouse 421, The cursor is moved to the position of each operation button (icon) displayed on the display section 41 and selected (clicked) to complete.  another, Some or all of the operation buttons displayed on the display section 41 may be provided as mechanical operation buttons such as a push button.  FIG. 11 is a flowchart showing a process of automatically registering a model image in this embodiment.  An example of a flow of automatic registration of the model image in the model image creation unit 314 will be described below.  First of all, In step S50, The model image creation section 314 is a model image of the registration tray 200 (electronic component placement section 2) (see FIGS. 5 and 9).  then, In step S60, The model image creation unit 314 is a model image registered in the electronic component supply unit 14 (electronic component placement unit 2) (see FIGS. 5 and 9).  then, In step S70, The model image creation unit 314 is a model image of the registration temperature adjustment unit 12 (electronic component placement unit 2) (see FIGS. 5 and 9).  then, In step S80, The model image creation unit 314 is a model image (see FIGS. 5 and 9) for registering a rotary stage (not shown) (electronic component placement unit 2). And End the automatic registration of the model image.  FIG. 12 is a diagram showing a model image registration process status screen for automatic registration of a model image in this embodiment.  During automatic registration, a model registration process status screen 86 displayed during registration of a model (model screen) of the supply shuttle (electronic parts supply unit 14) is displayed.  (Modification) In addition, The mounting part image acquisition part 50 may be supported by the support part 60 so that it may be arrange | positioned above the electronic component mounting part 2. With this, The mounting section image acquisition section 50 can obtain information on the state of the upper surface 911 of the electronic component mounting section 2 from vertically above the electronic component mounting section 2. another, The support unit 60 is, for example, a support leg (not shown) attached to the support inspection unit 16 or the measurement robot 17.  FIG. 13 is a schematic side view showing a mounting section image acquisition section 50 according to a modification.  also, The mounting section image acquisition section 50 may be as shown in FIG. 13, It is supported by the measurement robot 17 so that it may be arrange | positioned above the electronic component mounting part 2. With this, The mounting section image acquisition section 50 can acquire an image of the inspection section 16 from vertically above the inspection section 16.  also, In the above description, The mounting section image acquisition section 50 takes one image, 1 electronic component mounting section 2 was imaged, But you can also take one shot. The plurality of electronic component mounting portions 2 are imaged. also, The mounting section image acquisition section 50 may divide one electronic component mounting section 2 into a plurality of pieces and take an image. The number of divisions in this case is appropriately set according to various conditions such as the performance of the imaging device 51 and is not particularly limited. But the more the better. With this, Compared with the case where the image of the electronic component mounting section 2 is acquired together, The above-mentioned image can be acquired with high accuracy.  the above, The electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, The structure of each part can be replaced with an arbitrary structure having the same function. also, You may add another arbitrary structure to this invention.  E.g, In the above embodiment, As the mounting section image acquisition section 50, The configuration including the imaging device 51 and the lighting device 52 is listed. However, the configuration of the mounting section image acquisition section 50 is not limited to this. E.g, The mounting section image acquisition section 50 may irradiate the surface of the electronic component with laser light, Scan the laser light, And a device for receiving laser light reflected from the surface.  also, In the above embodiment, The mounting section image acquisition section 50 is configured to image the vertical upper surface of the electronic component mounting section 2, But it is not limited to this, E.g, The image acquisition section 50 of the mounting section may be configured to be able to Wait for the side camera.

1‧‧‧Inspection device (electronic parts inspection device)
2‧‧‧Electronic parts placement section
10‧‧‧ transport device (electronic parts transport device)
11A‧‧‧Tray transfer mechanism
11B‧‧‧Tray transfer mechanism
12‧‧‧Temperature adjustment section (electronic parts placement section)
13‧‧‧ supply robot (device transfer head)
14‧‧‧Electronic parts supply section (electronic parts placement section)
15‧‧‧Supply empty pallet transfer mechanism
16‧‧‧ Inspection Department
17‧‧‧Measurement robot (device transfer head)
18‧‧‧Electronic parts recycling section (electronic parts placement section)
19‧‧‧Tray for recycling (electronic parts placement section)
20‧‧‧Recycling robot
21‧‧‧Recycling empty pallet transfer mechanism
22A‧‧‧Tray transfer mechanism
22B‧‧‧Tray transfer mechanism
30‧‧‧Control device
31‧‧‧Control Department
32‧‧‧Memory Department
40‧‧‧ Setting display section
41‧‧‧Display
42‧‧‧Operation section (input section)
50‧‧‧mounting section image acquisition section
50a‧‧‧ 1st mounting section image acquisition section
50b‧‧‧ 2nd placement section image acquisition section
51‧‧‧ camera (camera section)
52‧‧‧Lighting installation
60‧‧‧Support Department
70‧‧‧ Histogram
72‧‧‧ Histogram
74‧‧‧ Histogram
80‧‧‧Supply transport correction setting screen (model image display setting section)
82‧‧‧model automatic registration button (instruction reception department)
84‧‧‧Detection groove selection button (electronic parts placement section selection section)
86‧‧‧Model registration process status screen
90‧‧‧IC devices (electronic parts)
181‧‧‧mounting section
200‧‧‧Tray (electronic parts placement section)
311‧‧‧Drive Control Department
312‧‧‧ Inspection Control Department
313‧‧‧ Camera Control Department
314‧‧‧model image creation department
411‧‧‧Monitor
421‧‧‧Mouse
911‧‧‧ Upper surface of electronic parts mounting section
A1‧‧‧Tray supply area
A2‧‧‧Device supply area
A3‧‧‧ Inspection area
A4‧‧‧device recycling area
A5‧‧‧Tray removal area
R1‧‧‧Room 1
R2‧‧‧Room 2
R3‧‧‧Room 3
S10 ～ S80‧‧‧‧steps
Steps S32 ～ S36‧‧‧‧
S210 ～ S250‧‧‧‧Steps
S310 ～ S330‧‧‧step
X‧‧‧axis
Y‧‧‧axis
Z‧‧‧axis

FIG. 1 is a schematic perspective view showing an inspection apparatus according to a first embodiment. FIG. 2 is a schematic plan view of the inspection device shown in FIG. 1. FIG. FIG. 3 is a block diagram showing a control device, a setting display portion, and an image acquisition portion of a placement portion of the inspection device shown in FIG. 1. FIG. FIG. 4 is a schematic side view of the image acquisition section of the mounting section shown in FIG. 2. FIG. 5 is a flowchart showing a process of automatically registering a model image in this embodiment. FIG. 6 is a flowchart showing the process of brightness adjustment in this embodiment. FIG. 7 is a diagram illustrating an algorithm for brightness adjustment in this embodiment. FIG. 8 is a flowchart showing a process of determining a model image area in this embodiment. FIG. 9 is a flowchart showing a flow of automatic registration of a model image in this embodiment. FIG. 10 is a view showing a setting screen for automatic registration of a model image according to the second embodiment. FIG. 11 is a flowchart showing a process of automatically registering a model image in the second embodiment. FIG. 12 is a diagram showing a model image registration process status screen for automatic registration of a model image according to the second embodiment. FIG. 13 is a side view showing a mounting section image acquisition section of a modified example.

30‧‧‧Control device

31‧‧‧Control Department

32‧‧‧Memory Department

40‧‧‧ Setting display section

41‧‧‧Display

42‧‧‧Operation section (input section)

50‧‧‧mounting section image acquisition section

50a‧‧‧ 1st mounting section image acquisition section

50b‧‧‧ 2nd placement section image acquisition section

51‧‧‧ camera (camera section)

52‧‧‧Lighting installation

311‧‧‧Drive Control Department

312‧‧‧ Inspection Control Department

313‧‧‧ Camera Control Department

314‧‧‧model image creation department

411‧‧‧Monitor

421‧‧‧Mouse

Claims (10)

An electronic component conveying device includes: an electronic component mounting section that can mount electronic components; a camera section that can capture an image of the electronic component mounting section; and a model image creation section that can be based on the above-mentioned drawings The image of the electronic component mounting portion is used to create a model image of the electronic component mounting portion; and the model image generating portion may adjust at least one of the brightness of the model image and the interception position of the model image with respect to the image. For example, the electronic component transfer device of claim 1, wherein the model image creation unit automatically adjusts the brightness of the model image based on the brightness of the pixels in the image and the number of pixels. For example, the electronic component transporting device of claim 1 has an input section for inputting a brightness adjustment parameter; and the model image creation section adjusts the brightness of the model image using the inputted brightness adjustment parameter. According to the electronic component conveying device according to any one of claims 1 to 3, the adjustment of the interception position of the model image is performed by differentially processing and adjusting image data of the image captured by the imaging unit. The electronic component conveying device according to any one of claims 1 to 4, which has a display section; and the model image creation section is based on the imaging signal of the imaging section to adjust the brightness of the pixels in the image and the number of pixels. The number is displayed on the display section. For example, the electronic component transfer device according to any one of claims 1 to 5, wherein the model image creation unit digitizes the brightness of the pixels in the image and the number of pixels. For example, the electronic component transfer device of claim 6, wherein the digitization is made by setting the brightness of the pixels in the image as the first axis, and setting the number of the pixels to be the second orthogonal to the first axis Histogram of axes. For example, the electronic component transfer device of claim 7, wherein the model image creation unit displays the histogram on the display unit. An electronic component conveying device includes: an electronic component mounting section that can mount electronic components; a camera section that can capture an image of the electronic component mounting section; and a model image display setting section that can be based on the above An image to display the setting information of the model image of the electronic component mounting section, and has an instruction accepting section that can accept the instruction of automatic registration of the model image; and the model image display setting section has the option of selecting the electronic Electronic component placement section selection section of the component placement section; when instructed by the instruction accepting section, it can automatically adjust the brightness of the model image and at least 1 of the interception position of the model image with respect to the image. By. An electronic component inspection device includes: an electronic component mounting portion that can mount electronic components; an imaging portion that can image an image of the electronic component placement portion; a model image creation portion that can be based on the image And creating a model image of the electronic component mounting portion; and an inspection portion that inspects the electronic component; and the model image creating portion can adjust the brightness of the model image and the ratio of the model image to the image. At least one of the interception positions.