JP2018018304A - Electronic component conveyance apparatus and electronic component inspection apparatus - Google Patents

Abstract

An electronic component conveyance device and an electronic component inspection device that realize high-precision conveyance by correcting a conveyance position.
An electronic component transport apparatus includes an electronic component placement unit that can place an electronic component, an imaging unit that can capture an image of the electronic component placement unit, and an electronic component placement unit based on the image. A model image creating unit 314 capable of creating a model image, and the model image creating unit 314 can adjust at least one of brightness of the model image and a cut-out position of the model image with respect to the image.
[Selection] Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  The IC handler recognizes the positions of the transfer source and transfer destination from the image captured by the camera by image processing, and corrects the transfer position to realize high-precision transfer. In this image processing, a model image of the transport position registered in advance is used. The model image is registered for each conveyance position (tray, change kit). For this reason, when creating an inspection setting (recipe), it is necessary to register a large number of model images.

  In this image work, “brightness adjustment” and “cutout of model image” are performed according to the subjectivity of the worker, so that the registered model image differs depending on the worker. Even the same worker may be different each time he registers. In addition, since it is necessary for the worker to register model images at a large number of transport positions, a lot of work is required and a burden is imposed.

  For example, registering a model image for detecting the presence or absence of a component is disclosed (for example, refer to Patent Document 1).

JP 2001-67478 A

  However, Patent Document 1 does not disclose an adjustment method for optimizing the brightness and position of an image.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electronic component transport apparatus according to this application example is based on an electronic component placement unit that can place an electronic component, an imaging unit that can capture an image of the electronic component placement unit, and the image. A model image creation unit capable of creating a model image of the electronic component placement unit, and the model image creation unit includes at least one of brightness of the model image and a cut-out position of the model image with respect to the image Can be adjusted.

  According to this application example, at least one of the brightness of the model image and the cutout position of the model image with respect to the image can be adjusted. Thereby, an optimal model image can be obtained. As a result, it is possible to provide an electronic component transport apparatus that corrects the transport position and realizes highly accurate transport.

  Application Example 2 In the electronic component conveying apparatus according to the application example described above, the model image creation unit automatically adjusts the brightness of the model image based on the brightness and the number of pixels in the image. It is preferable.

  According to this application example, the brightness can be automatically controlled.

  Application Example 3 In the electronic component conveying apparatus according to the application example described above, the electronic component transport device includes an input unit that inputs a brightness adjustment parameter, and the model image creation unit uses the input brightness adjustment parameter to input the model. It is preferable to adjust the brightness of the image.

  According to this application example, it is possible to easily control the numerical value of the brightness to be adjusted.

  Application Example 4 In the electronic component transport apparatus according to the application example described above, the adjustment of the cutout position of the model image is preferably performed by differentiating the image data of the image captured by the imaging unit.

  According to this application example, it is possible to easily perform enhancement processing by creating an image by differentiating the image.

  Application Example 5 In the electronic component conveying apparatus according to the application example described above, the electronic component transport device includes a display unit, and the model image creating unit is configured to determine the brightness of the pixels in the image and the pixel based on the imaging signal of the imaging unit. It is preferable to display the number on the display unit.

  According to this application example, it is possible to easily adjust the brightness of the image by comparing the brightness value of the entire image based on the brightness with a predetermined threshold value (brightness value). Since it is easy to confirm the numerical value, it is very convenient for brightness adjustment.

  Application Example 6 In the electronic component transport apparatus according to the application example described above, it is preferable that the model image creation unit digitizes the brightness and the number of pixels in the image.

  According to this application example, the brightness can be automatically controlled easily.

  Application Example 7 In the electronic component transport apparatus according to the application example described above, in the digitization, the brightness of pixels in the image is a first axis, and the number of pixels is a second axis orthogonal to the first axis. It is preferable to create a histogram.

  According to this application example, since the digitization is generated by the model image creation unit by using a known histogram, the model image creation unit can be simply configured, and appropriate digitization can be generated. Become.

  Application Example 8 In the electronic component transport apparatus according to the application example, it is preferable that the model image creation unit displays the histogram on the display unit.

  According to this application example, the tendency of brightness can be easily grasped by displaying the histogram.

  Application Example 9 An electronic component transport apparatus according to this application example is based on an electronic component placement unit that can place an electronic component, an imaging unit that can capture an image of the electronic component placement unit, and the image. A model image display setting unit having an instruction receiving unit capable of displaying setting information of the model image of the electronic component placement unit and receiving an instruction for automatic registration of the model image, and the model image display setting The electronic component placement unit selection unit that can select the electronic component placement unit, and when instructed by the instruction receiving unit, the brightness of the model image and the cutout position of the model image with respect to the image It is characterized in that at least one can be automatically adjusted.

  According to this application example, at least one of the brightness of the model image and the cutout position of the model image with respect to the image can be adjusted. Thereby, an optimal model image can be obtained. As a result, it is possible to provide an electronic component transport apparatus that corrects the transport position and realizes highly accurate transport.

  Application Example 10 An electronic component inspection apparatus according to this application example is based on an electronic component placement unit that can place an electronic component, an imaging unit that can capture an image of the electronic component placement unit, and the image. A model image creation unit capable of creating a model image of the electronic component placement unit, and an inspection unit for inspecting the electronic component, wherein the model image creation unit It is characterized in that at least one of the cutout positions of the model image can be adjusted.

  According to this application example, at least one of the brightness of the model image and the cutout position of the model image with respect to the image can be adjusted. Thereby, an optimal model image can be obtained. As a result, it is possible to provide an electronic component inspection apparatus that realizes highly accurate conveyance by correcting the conveyance position.

1 is a schematic perspective view showing an inspection apparatus according to a first embodiment. The schematic plan view of the inspection apparatus shown in FIG. The block diagram which shows the control apparatus, the setting display part, and the mounting part image acquisition part which the inspection apparatus shown in FIG. 1 has. The schematic side view of the mounting part image acquisition part shown in FIG. 6 is a flowchart showing processing for automatically registering a model image according to the present embodiment. 6 is a flowchart illustrating brightness adjustment processing according to the embodiment. The figure explaining the algorithm of the brightness adjustment which concerns on this embodiment. 6 is a flowchart showing processing for determining a model image area according to the present embodiment. The flowchart which shows the flow of the automatic registration of the model image which concerns on this embodiment. The figure which shows the setting screen of the automatic registration of the model image which concerns on 2nd Embodiment. 9 is a flowchart showing a process for automatically registering a model image according to the second embodiment. The figure which shows the model image registration process status screen of the automatic registration of the model image which concerns on 2nd Embodiment. The side view which shows the mounting part image acquisition part of a modification.

(First embodiment)
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

  FIG. 1 is a schematic perspective view showing an inspection apparatus according to this embodiment. FIG. 2 is a schematic plan view of the inspection apparatus shown in FIG. FIG. 3 is a block diagram illustrating a control device, a setting display unit, and a placement unit image acquisition unit included in the inspection apparatus illustrated in FIG. 1. FIG. 4 is a schematic side view of the placement unit image acquisition unit shown in FIG.

  In FIG. 1, FIG. 2, FIG. 4 (described later), and FIG. 13 (described later), the X axis, the Y axis, and the Z axis, which are three axes orthogonal to each other, are indicated by arrows for convenience of description. The tip side of the arrow is “+ (plus)”, and the base side is “− (minus)”. In the following, the direction parallel to the X axis (first direction) is the “X axis direction”, the direction parallel to the Y axis (second direction) is the “Y axis direction”, and the direction parallel to the Z axis is “Z Axial direction ". In the following, for convenience of explanation, the upper side (+ Z-axis direction side) in FIG. 1 is referred to as “upper” and the lower side (−Z-axis direction side) is referred to as “lower”.

  Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIGS. 1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), a CIS (CMOS This is a device for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as an image sensor. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIGS. 1 and 2, an inspection apparatus (electronic component inspection apparatus) 1 includes a conveyance apparatus (electronic component conveyance apparatus) 10 that conveys an IC device (electronic component) 90, an inspection unit 16, and a display unit 41. And a setting display unit 40 having an operation unit 42 and a control device 30. The transport apparatus 10 includes an electronic component placement unit 2 on which an IC device 90 can be placed. The electronic component placement unit 2 is, for example, a tray 200, an electronic component supply unit 14, an electronic component collection unit 18, a temperature adjustment unit 12, a collection tray 19, a rotation stage (not shown), and the like (hereinafter referred to as these). In addition, when the respective mounting parts are not distinguished, they are also referred to as “electronic component mounting part 2”. It has the mounting part image acquisition part 50 provided with (refer FIG. 3).

  In the present embodiment, the conveyance device 10 is configured by a configuration excluding the inspection unit 16 and the inspection control unit 312 included in the control device 30 described later from the inspection device 1 (see FIG. 3).

  As shown in FIGS. 1 and 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area A2, an inspection area A3 in which an inspection unit 16 is provided, a device collection area A4, and a tray removal area A5. It is divided into and.

  Each of these regions is partitioned by a wall portion, a shutter, or the like (not shown). The device supply area A2 is a first chamber R1 defined by walls, shutters, and the like. The inspection area A3 is a second chamber R2 defined by walls, shutters, and the like. The device collection area A4 is a third chamber R3 defined by walls and shutters. In addition, the first chamber R1 (device supply area A2), the second chamber R2 (inspection area A3), and the third chamber R3 (device collection area A4) can each ensure airtightness and heat insulation. It is configured. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. The interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively, and can be inspected, for example, in a normal temperature environment, a low temperature environment, and a high temperature environment. Has been.

In the inspection apparatus 1, the IC device 90 passes through each region in order from the tray supply region A1 to the tray removal region A5, and inspection (electrical inspection) is performed in the intermediate inspection region A3. In the “inspection (electrical inspection)” of the present embodiment, for example, whether or not the IC device 90 is conducted is confirmed or an expected output is obtained when a specific signal is input. Or check if Thereby, it is possible to determine whether the IC device 90 is disconnected or short-circuited. In addition, in the test | inspection part 16, you may perform the test | inspection for confirming operation | movement of the circuit (not shown) etc. with which IC device 90 is provided.
Hereinafter, the inspection apparatus 1 will be described for each of the areas A1 to A5.

(Tray supply area)
As shown in FIG. 2, the tray supply area A1 is an area to which a tray 200 (electronic component placement unit 2) in which a plurality of untested IC devices 90 are arranged is supplied. A large number of trays 200 can be stacked in the tray supply area A1.

(Device supply area)
As shown in FIG. 2, the device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 are provided so as to straddle the tray supply area A1 and the device supply area A2.

  In the device supply area A2, a temperature adjustment unit 12 (electronic component placement unit 2), a supply robot (device transfer head) 13, and a supply empty tray transfer mechanism 15 are provided.

  The temperature adjustment unit 12 is an apparatus that arranges the IC device 90, heats or cools the arranged IC device 90, and adjusts (controls) the IC device 90 to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y-axis direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to and placed on one of the temperature adjustment units 12.

  The supply robot 13 is a transfer unit that transfers the IC device 90, and is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction in the device supply region A2. The supply robot 13 conveys the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the temperature adjustment unit 12 and an electronic component supply unit 14 (electronic component placement unit described later). 2) and the IC device 90. The supply robot 13 has a plurality of gripping units (not shown) that grip the IC device 90. Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction. Similarly to the temperature adjustment unit 12, the supply robot 13 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

  The supply empty tray transport mechanism 15 is a transport unit (transport mechanism) that transports the empty tray 200 from which all IC devices 90 have been removed in the X-axis direction. After this transport, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

(Inspection area)
As shown in FIG. 2, the inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an electronic component supply unit 14, an inspection unit 16, a measurement robot (device transport head) 17, and an electronic component collection unit 18 (electronic component placement unit 2) are provided. In this embodiment, the electronic component supply unit 14 and the electronic component collection unit 18 are configured to be independently movable. However, they are configured to be connected or integrated and movable in the same direction. It may be.

  The electronic component supply unit 14 is a transport unit that places the IC device 90 whose temperature is adjusted (temperature control) and transports the IC device 90 to the vicinity of the inspection unit 16. The electronic component supply unit 14 can reciprocate between the device supply area A2 and the inspection area A3 along the X-axis direction. In the configuration shown in FIG. 2, two electronic component supply units 14 are arranged in the Y-axis direction. The IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the electronic component supply units 14. This conveyance is performed by the supply robot 13. In the electronic component supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, and is a holding unit that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the inspection (electrical inspection) of the IC device 90 is performed via the probe pin. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The measurement robot 17 is a transport unit that transports the IC device 90, and is supported so as to be movable in the inspection region A3. The measuring robot 17 can transport and place the IC device 90 on the electronic component supply unit 14 carried in from the device supply area A2 onto the inspection unit 16. When inspecting the IC device 90, the measurement robot 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected. The measurement robot 17 has a plurality of gripping units (not shown) that grip the IC device 90. Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction. Further, similarly to the temperature adjustment unit 12, the measurement robot 17 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection. In the present embodiment, the number of measuring robots 17 is one as shown in the figure, but two or more measuring robots 17 may be provided.

  The electronic component collection unit 18 is a conveyance unit that places the IC device 90 that has been inspected by the inspection unit 16 and conveys the IC device 90 to the device collection region A4. The electronic component collection unit 18 can reciprocate between the inspection area A3 and the device collection area A4 along the X-axis direction. In the configuration shown in FIG. 2, two electronic component collection units 18 are arranged in the Y-axis direction, like the electronic component supply unit 14. The IC device 90 on the inspection unit 16 is transported to and placed on one of the electronic component collection units 18. This conveyance is performed by the measurement robot 17.

  As shown in FIG. 4, the mounting portion 181 has a concave shape that opens upward, and has a shape in which the cross-sectional area gradually decreases toward the bottom surface. The mounting portion 181 having such a shape includes a bottom surface and four inclined side surfaces. Such a side surface of the mounting portion 181 functions as a guide surface for guiding the IC device 90 to the mounting portion 181 when the IC device 90 is mounted. Thereby, the IC device 90 can be easily placed on the placement portion 181.

  Further, the surfaces (side surface and bottom surface) constituting the mounting portion 181 are subjected to antireflection processing for reducing reflection on the surfaces. Thereby, when imaging the electronic component mounting part 2 with the imaging device 51 which the mounting part image acquisition part 50 mentioned later has, unnecessary light injects into the image pick-up element (not shown) which the imaging device 51 has. Can be suppressed. Therefore, a clearer image can be obtained by the imaging device 51 described later.

  The antireflection treatment is not particularly limited, and examples thereof include formation of an antireflection film, roughening treatment (treatment for increasing light scattering), black treatment (treatment for increasing light absorption), and the like.

(Device collection area)
As shown in FIG. 2, the device collection area A4 is an area where the IC device 90 that has been inspected is collected. In the device recovery area A4, a recovery tray 19, a recovery robot 20, and a recovery empty tray transport mechanism 21 are provided. In addition, three empty trays 200 are also prepared in the device collection area A4.

  The collection tray 19 is the electronic component placement unit 2 on which the IC device 90 is placed. The collection trays 19 are fixed in the device collection area A4, and in the configuration shown in FIG. 2, three collection trays 19 are arranged side by side in the X-axis direction. The empty tray 200 is also the electronic component placement unit 2 on which the IC device 90 is placed, and three empty trays 200 are arranged side by side in the X-axis direction. Then, the IC device 90 on the electronic component recovery unit 18 that has moved to the device recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is collected for each inspection result and sorted (classified). The sorting of the IC device 90 based on the inspection result is performed by the collection robot 20. The collection robot 20 sorts the IC devices 90 according to commands from the control device 30 described later.

  The collection robot 20 is a conveyance unit that conveys the IC device 90, and is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction in the device collection area A4. The collection robot 20 can transport the IC device 90 from the electronic component collection unit 18 to the collection tray 19 or the empty tray 200. The collection robot 20 has a plurality of gripping units (not shown) that grip the IC device 90. Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction.

  The collection empty tray transport mechanism 21 is a transport unit (transport mechanism) that transports the empty tray 200 carried in from the tray removal area A5 in the X-axis direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

(Tray removal area)
The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. A large number of trays 200 can be stacked in the tray removal area A5. Note that tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the device collection area A4 and the tray removal area A5. The tray transport mechanism 22A transports the tray 200 on which the inspected IC device 90 is placed from the device collection area A4 to the tray removal area A5. The tray transport mechanism 22B transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the device collection area A4.

  The first chamber R1, the second chamber R2, and the third chamber R3 in each of the regions A1 to A5 as described above are not shown, but are temperature sensors (thermometers) that detect the indoor temperature. And a humidity sensor (hygrometer) for detecting indoor humidity (relative humidity) and an oxygen concentration sensor (oxygen meter) for detecting indoor oxygen concentration. In this embodiment, a temperature sensor, a humidity sensor, and an oxygen concentration sensor are provided in each of the first chamber R1, the second chamber R2, and the third chamber R3. However, the temperature sensor, the humidity sensor, The location where the oxygen concentration sensor is provided is arbitrary.

  Although not shown, the inspection apparatus 1 has a dry air supply mechanism. The dry air supply mechanism is configured to be able to supply air such as air with low humidity and nitrogen (hereinafter also referred to as dry air) to the first chamber R1, the second chamber R2, and the third chamber R3. Therefore, condensation and icing (icing) of the IC device 90 can be prevented by supplying dry air as necessary.

  In the above-described embodiment, the inspection apparatus 1 is configured to be able to perform the inspection under a normal temperature environment, a low temperature environment, and a high temperature environment. The structure which test | inspects in at least 1 environment among them may be sufficient. For example, a configuration for a low temperature environment such as a wall portion, a shutter, a hygrometer, an oxygen concentration meter, and dry air may not be included.

(Control device)
As illustrated in FIG. 3, the control device 30 has a function of controlling each unit of the inspection device 1 and includes a control unit 31 and a storage unit 32.

  The control unit 31 includes a CPU (Central Processing Unit), for example, and includes a drive control unit 311, an inspection control unit 312, an imaging control unit 313, and a model image creation unit 314. The storage unit 32 includes, for example, a ROM (read only memory) and a RAM (Random Access Memory).

  The drive control unit 311 includes components (tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a supply robot 13, a supply empty tray transport mechanism 15, an electronic component supply unit 14, an inspection unit 16, a measurement robot 17, and an electronic component recovery unit 18. , The drive of the recovery robot 20, the recovery empty tray transport mechanism 21, and the tray transport mechanisms 22A and 22B) are controlled.

  The inspection control unit 312 can inspect the IC device 90 arranged in the inspection unit 16 based on, for example, a program (software) stored in the storage unit 32.

  The imaging control unit 313 controls driving of the placement unit image acquisition unit 50 and the like. In addition, the imaging control unit 313 processes a signal from the imaging device 51 and converts the image of the electronic component mounting unit 2 acquired by the mounting unit image acquisition unit 50 into data (generates image data).

  The model image creation unit 314 creates a model image of the electronic component placement unit 2 based on the image data. The model image creation unit 314 adjusts the brightness of the model image. The model image creation unit 314 adjusts the cutout position of the model image with respect to the image data. The model image creation unit 314 adjusts at least one of the brightness of the model image and the cutout position of the model image with respect to the image data.

  The model image creation unit 314 displays the brightness of the pixels and the number of pixels in the image on the display unit 41 based on the imaging signal of the imaging device 51. According to this, it is possible to easily adjust the brightness of the image by comparing the brightness value of the entire image based on the brightness with a predetermined threshold value (brightness value) or the like. Since it is easy to confirm the brightness, it is very convenient for brightness adjustment.

  The model image creation unit 314 automatically adjusts the brightness of the model image based on the brightness of the pixels in the image and the number of pixels. According to this, the brightness can be automatically controlled.

  The model image creation unit 314 quantifies the brightness of the pixels and the number of pixels in the image. According to this, the brightness can be easily automatically controlled.

  The digitization creates a histogram in which the brightness of the pixels in the image is the horizontal axis as the first axis, and the number of pixels is the vertical axis as the second axis orthogonal to the first axis. According to this, since the digitization is generated by the model image creation unit 314 by using a known histogram, the model image creation unit 314 can be simply configured, and appropriate digitization can be generated. Become.

  The model image creation unit 314 displays the histogram on the display unit 41. According to this, the tendency of brightness can be easily grasped by displaying the histogram.

  The model image creation unit 314 adjusts the brightness of the model image using the brightness adjustment parameter input from the operation unit (input unit) 42. According to this, it is possible to easily control the brightness value to be adjusted.

  The adjustment of the cut-out position of the model image is adjusted by differentiating the image data of the image captured by the imaging device 51. According to this, it is possible to easily perform the enhancement process by creating the image by differentiating the image.

The control unit 31 has a function of displaying the driving of each unit, inspection results, image data, and the like on the display unit 41, a function of performing processing in accordance with an input from the operation unit 42, and the like.
The storage unit 32 stores programs, data, and the like for the control unit 31 to perform various processes.

(Setting display section)
As shown in FIGS. 1 and 3, the setting display unit 40 includes a display unit 41 and an operation unit 42.

  The display unit 41 includes a monitor 411 that displays driving of each unit, inspection results, and the like. The monitor 411 can be composed of a display panel such as a liquid crystal display panel or an organic EL, for example. The operator can set or check various processes, conditions, and the like of the inspection apparatus 1 via the monitor 411.

The operation unit 42 is an input device such as a mouse 421, and outputs an operation signal corresponding to the operation by the worker to the control unit 31. Therefore, the operator can use the mouse 421 to instruct the control unit 31 for various processes.
In the present embodiment, the mouse 421 is used as the operation unit 42. However, the operation unit 42 is not limited to this, and may be an input device such as a keyboard, a trackball, or a touch panel.

(Placement image acquisition unit)
The placement unit image acquisition unit 50 has a function of acquiring an image of the electronic component placement unit 2. As shown in FIG. 2, the placement unit image acquisition unit 50 is provided in the supply robot 13 and the recovery robot 20 in the tray supply region A2 and the device recovery region A4. That is, the placement unit image acquisition unit 50 is provided at a position where an image of the electronic component placement unit 2 can be acquired.

  The placement unit image acquisition unit 50 includes a first placement unit image acquisition unit 50a and a second placement unit image acquisition unit 50b. The first placement unit image acquisition unit 50 a and the second placement unit image acquisition unit 50 b are provided above the electronic component placement unit 2.

  In the present embodiment, when each of the first placement unit image acquisition unit 50a and the second placement unit image acquisition unit 50b is regarded as one placement unit image acquisition unit 50, the placement unit image acquisition unit 50 The number of 50 is two, but the number of placement unit image acquisition units 50 is not limited to this and is arbitrary.

  The placement unit image acquisition unit 50 is supported by the supply robot 13 and the collection robot 20 so as to be disposed above the electronic component placement unit 2. Accordingly, the placement unit image acquisition unit 50 can acquire an image of the state of the upper surface 911 of the electronic component placement unit 2 from above the electronic component placement unit 2.

  The first placement unit image acquisition unit 50a and the second placement unit image acquisition unit 50b include an imaging device 51 and an illumination device 52, respectively. The illumination device 52 may be not only continuous illumination but also intermittently strong light (flash) as long as the exposure time can be controlled.

  The imaging device 51 has an imaging element that receives light from the electronic component placement unit 2 and converts it into an electrical signal. The imaging device 51 is not particularly limited. For example, a camera (CCD camera) using a CCD (Charge Coupled Device) image sensor as an imaging device, and a camera using a CMOS (Complementary Metal Oxide Semiconductor) image sensor as an imaging device. An electronic camera (digital camera) such as a camera using a MOS image sensor as an image pickup device can be used. Further, by analyzing the image data using, for example, differential interference method, Fourier transform method, or the like, it is possible to emphasize a fine shape or a shape that is difficult to see, and improve the shape detection sensitivity. In addition, it is possible to emphasize fine scratches and scratches that are difficult to see and improve the detection sensitivity of the scratches.

  The imaging device 51 is configured such that the imaging area is substantially equal to or larger than the size of the upper surface 911 of the electronic component placement unit 2.

  Although not shown, the imaging device 51 preferably includes an optical system such as an optical lens or an autofocus mechanism. Thereby, for example, even when the height (the height in the Z-axis direction) of the electronic component placement unit 2 with respect to the imaging device 51 is different, a clear image can be obtained.

  The illumination device 52 is a light source device that is driven when the electronic device placement unit 2 is imaged by the imaging device 51 and irradiates the electronic product placement unit 2 with light. By this illumination device 52, it is possible to suppress the image from becoming dark due to insufficient light quantity and to obtain a clearer image.

  In this embodiment, the illumination device 52 has an annular shape and is disposed around the imaging device 51. Thereby, light can be uniformly irradiated to the electronic component mounting part 2. The shape and arrangement of the lighting device 52 are not limited to the above-described configuration.

  The placement unit image acquisition unit 50 having such a configuration irradiates the electronic component placement unit 2 with light by the illumination device 52 and images the electronic component placement unit 2 with the imaging device 51. A signal from the imaging device 51 is taken into the imaging control unit 313 described above. The imaging control unit 313 processes a signal from the imaging device 51 and generates an image of the electronic component placement unit 2 as two-dimensional image data.

  Further, three-dimensional image data may be generated using the image of the electronic component placement unit 2 acquired by the placement unit image acquisition unit 50. In this case, for example, although not shown, two or more (for example, three) placement unit image acquisition units 50 may be provided for one arrangement row.

(Example)
Hereinafter, acquisition of an image of the electronic component placement unit 2 will be described while describing a series of operations of the inspection apparatus 1 having the above-described configuration.
FIG. 5 is a flowchart showing a process for automatically registering a model image according to the present embodiment.
An example of the flow at the time of automatic registration of model images in the model image creation unit 314 will be described below.

  The model image creation unit 314 according to the present embodiment automatically creates a model image. The model image creation unit 314 automatically performs operations of “brightness adjustment” and “cutout of model image”.

  First, in step S <b> 10, the imaging control unit 313 moves the placement unit image acquisition unit 50 above the electronic component placement unit 2.

  Next, in step S <b> 20, the model image creation unit 314 adjusts the brightness of the image of the electronic component placement unit 2.

  Next, in step S <b> 30, the model image creation unit 314 determines a model image area of the image of the electronic component placement unit 2.

  Next, in step S40, the model image creation unit 314 cuts out and registers the model image of the electronic component placement unit 2. Then, the automatic registration of the model image ends.

FIG. 6 is a flowchart showing brightness adjustment processing according to the present embodiment.
An example of the “brightness adjustment” process in step S20 will be described below.

  The model image creation unit 314 quantifies the brightness of the pixels and the number of pixels in the image. According to this, the brightness can be easily automatically controlled. In the automation of “brightness adjustment”, the model image creation unit 314 determines an appropriate setting value from the brightness distribution in the captured image. At this time, settings to be adjusted include exposure time, shutter speed, illumination intensity, aperture, illumination lighting time, and the like. The illumination lighting time may be for adjustment when the flash is used.

  First, in step S <b> 210, the placement unit image acquisition unit 50 images the electronic component placement unit 2.

  Next, in step S220, the model image creation unit 314 creates the brightness distribution of the image of the electronic component placement unit 2.

  The model image creation unit 314 displays the brightness of the pixels and the number of pixels in the image on the display unit 41 based on the imaging signal of the imaging device 51. According to this, it is possible to easily adjust the brightness of the image by comparing the brightness value of the entire image based on the brightness with a predetermined threshold value (brightness value) or the like. Since it is easy to confirm the brightness, it is very convenient for brightness adjustment.

  In the digitization, a histogram is created with the brightness of the pixels in the image as the horizontal axis (first axis) and the number of pixels as the vertical axis (second axis). According to this, since the digitization is generated by the model image creation unit 314 by using a known histogram, the model image creation unit 314 can be simply configured, and appropriate digitization can be generated. Become.

  Next, in step S230, the model image creation unit 314 determines whether the brightness is appropriate. Evaluate the histogram distribution and determine the brightness.

FIG. 7 is a diagram for explaining an algorithm for brightness adjustment according to the present embodiment.
As shown in the lower diagram of FIG. 7, when the right end of the distribution of the histogram 70 is on the right side of the reference value, it is determined that the image is bright. If it is bright, the process proceeds to step S240.
As shown in the upper diagram of FIG. 7, when the right end of the distribution of the histogram 74 is on the left side of the reference value, it is determined that the image is dark. If it is dark, the process proceeds to step S250.

  Next, in step S240, the model image creation unit 314 darkens the pixels in the image (exposure time is short). The distribution is set to fall within a predetermined reference value. Specifically, the distribution of the histogram 70 is narrowed so that it falls within the reference value like the distribution of the histogram 72.

Next, in step S250, the model image creation unit 314 brightens the pixels in the image (lengthens the exposure time). The distribution is set to fall within a predetermined reference value. Specifically, the distribution of the histogram 74 is expanded so that it fits within the reference value like the distribution of the histogram 72.
Then go back.

FIG. 8 is a flowchart showing a model image area determination process according to this embodiment.
An example of the “model image area determination” process in step S30 will be described below.

The adjustment of the cut-out position of the model image is adjusted by differentiating the image data of the image captured by the imaging device 51. According to this, it is possible to easily perform the enhancement process by creating the image by differentiating the image. In the automation of “cutting out a model image”, a model image area in a captured image is determined based on the dimensions of the IC device 90 and the electronic component placement unit 2, and the image is cut out. The feature (symmetry) in the image is also used for determining the model image area. The adjustment of the cutout position of the model image is determined by confirming the edge in the image.
For example, the edge is confirmed by the following method.

  First, in step S310, the model image creation unit 314 determines a temporary model image area of the image of the electronic component placement unit 2. At the center of the image, the size is larger than the size of the electronic component placement unit 2. Create a differential image of the image and extract the edges. A cutting frame is determined based on the size of the electronic component placement unit 2 (electronic component placement unit size + α).

Next, in step S320, the model image creation unit 314 evaluates the symmetry of the model image area while changing the temporary model image area vertically and horizontally.
For example, the model image creation unit 314 calculates the rotational symmetry of the model image. The model image creation unit 314 cuts out the model image. The model image creation unit 314 extracts the area of the edge portion of the model image. The model image creation unit 314 widens the cutout frame and repeats the cutout of the model image and the extraction of the area of the edge portion (up to a maximum specified in advance).

  Next, in step S330, the model image creation unit 314 sets the position with the highest symmetry as the model image area. The model image creation unit 314 regards a position with high symmetry as the center of the model image. The model image creation unit 314 determines the optimum edge position from the cutout frame and the distribution of the edge area, and determines the cutout position of the model image. The optimum edge position is determined using, for example, a size at which the edge area is saturated, or an edge area that is greater than a certain threshold. Then go back.

FIG. 9 is a flowchart showing a flow of automatic registration of model images according to the present embodiment.
An example of the flow of processing a plurality of times at the time of automatic registration of the model image in the model image creation unit 314 will be described below.
The model image registration process of FIG. 5 can be performed more than once to obtain a more appropriate model image. In order to obtain a more optimal model image, “brightness adjustment” and “cutout of model image” are repeated a plurality of times.

  First, in step S <b> 10, the imaging control unit 313 moves the placement unit image acquisition unit 50 above the electronic component placement unit 2.

  Next, in step S <b> 20, the model image creation unit 314 adjusts the brightness of the image of the electronic component placement unit 2.

  Next, in step S <b> 30, the model image creation unit 314 determines a model image area of the electronic component placement unit 2.

  Next, in step S <b> 32, the imaging control unit 313 moves the placement unit image acquisition unit 50 to a position where the model image area of the electronic component placement unit 2 can be imaged.

  Next, in step S <b> 34, the model image creation unit 314 performs brightness adjustment in the model image area of the electronic component placement unit 2 to make it more optimal.

  Next, in step S <b> 36, the model image creation unit 314 determines a model image area of the electronic component placement unit 2. Thereby, the model image of the electronic component placement unit 2 captured at the center of the placement unit image acquisition unit 50 can be used.

  Next, in step S40, the model image creation unit 314 cuts out and registers the model image of the electronic component placement unit 2. Then, the automatic registration of the model image ends.

  As described above, in the inspection apparatus 1, the image of the electronic component placement unit 2 is obtained by the placement unit image acquisition unit 50.

  According to the present embodiment, at least one of the brightness of the model image and the cutout position of the model image with respect to the image can be adjusted. Thereby, an optimal model image can be obtained. As a result, it is possible to provide the transfer device 10 and the inspection device 1 that correct the transfer position and realize high-precision transfer.

  In addition, optimal model registration independent of the worker can be performed. The burden on registration workers is reduced.

(Second Embodiment)
FIG. 10 is a diagram showing a setting screen for automatic registration of model images according to the present embodiment.
Hereinafter, although this embodiment is described, it demonstrates centering around difference with 1st Embodiment mentioned above, The description is abbreviate | omitted about the same matter.

  The transport apparatus 10 according to the present embodiment can display setting information of the model image of the electronic component placement unit 2 based on the image and can receive an instruction for automatic registration of the model image (an instruction reception unit). ) 82 and a supply conveyance correction setup screen (model image display setting unit) 80.

  The supply conveyance correction setup screen 80 includes a detection pocket selection button (electronic component placement portion selection portion) 84 that can select the electronic component placement portion 2. The operator (operator) selects the electronic component placement unit 2 with the detection pocket selection button 84. Automatic registration of the model image is executed by the operator (operator) selecting the model automatic registration button 82. When the model automatic registration button 82 is selected, the model image creation unit 314 automatically adjusts at least one of the brightness of the model image and the cutout position of the model image with respect to the image.

The operation of the operation unit 42 of the operator (operator) is performed by, for example, operating the mouse 421, moving the cursor to the position of each operation button (icon) displayed on the display unit 41, and selecting (clicking). Is made by
Note that some or all of the operation buttons displayed on the display unit 41 may be provided as mechanical operation buttons such as push buttons.

FIG. 11 is a flowchart showing a process for automatically registering a model image according to the present embodiment.
An example of the flow at the time of automatic registration of model images in the model image creation unit 314 will be described below.

  First, in step S50, the model image creation unit 314 registers the model image of the tray 200 (electronic component placement unit 2) (see FIGS. 5 and 9).

  Next, in step S60, the model image creation unit 314 registers the model image of the electronic component supply unit 14 (electronic component placement unit 2) (see FIGS. 5 and 9).

  Next, in step S70, the model image creation unit 314 registers the model image of the temperature adjustment unit 12 (electronic component placement unit 2) (see FIGS. 5 and 9).

  Next, in step S80, the model image creation unit 314 registers the model image of the rotary stage (not shown) (electronic component placement unit 2) (see FIGS. 5 and 9). Then, the automatic registration of the model image ends.

FIG. 12 is a diagram showing a model image registration process state screen for automatic registration of model images according to the present embodiment.
During automatic registration, a model registration processing status screen 86 indicating that the model (model screen) of the supply shuttle (electronic component supply unit 14) is being registered is displayed.

(Modification)
The placement unit image acquisition unit 50 may be supported by the support unit 60 so as to be disposed above the electronic component placement unit 2. Thereby, the mounting part image acquisition part 50 can acquire information on the state of the upper surface 911 of the electronic component mounting part 2 from vertically above the electronic part mounting part 2. The support unit 60 is attached to, for example, a support leg (not shown) that supports the inspection unit 16 and the measurement robot 17.

FIG. 13 is a schematic side view showing a placement unit image acquisition unit 50 according to a modification.
Moreover, the mounting part image acquisition part 50 may be supported by the measurement robot 17 so that it may be arrange | positioned above the electronic component mounting part 2, as shown in FIG. Thereby, the placement unit image acquisition unit 50 can acquire the image of the inspection unit 16 from vertically above the inspection unit 16.

  Further, in the above description, the placement unit image acquisition unit 50 images one electronic component placement unit 2 by one imaging, but a plurality of electronic component placement units 2 are obtained by one imaging. You may image. Moreover, the mounting part image acquisition part 50 may divide and image the one electronic component mounting part 2 into a plurality. In this case, the number of divisions is not particularly limited, and may be set as appropriate according to various conditions such as the performance of the imaging device 51. The larger the number, the better. Thereby, the said image can be acquired with high precision compared with the case where the image of the electronic component mounting part 2 is acquired collectively.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part is arbitrary which has the same function. It can be replaced with that of the configuration. In addition, any other component may be added to the present invention.

  For example, in the above-described embodiment, the configuration including the imaging device 51 and the illumination device 52 is given as the placement unit image acquisition unit 50, but the configuration of the placement unit image acquisition unit 50 is not limited thereto. For example, the placement unit image acquisition unit 50 may be a device that irradiates the surface of an electronic component with a laser beam, scans the laser beam, and receives the laser beam reflected on the surface.

  Further, in the embodiment described above, the placement unit image acquisition unit 50 is configured to image the top surface of the electronic component placement unit 2 in the vertical direction. The unit 50 may be configured to be able to image the back surface, the side surface, and the like of the electronic component.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus) 2 ... Electronic component mounting part 10 ... Conveyance apparatus (electronic component conveyance apparatus) 11A, 11B ... Tray conveyance mechanism 12 ... Temperature adjustment part (electronic component mounting part) 13 ... Supply robot (Device transport head) 14 ... Electronic component supply unit (electronic component placement unit) 15 ... Supply empty tray transport mechanism 16 ... Inspection unit 17 ... Measurement robot (device transport head) 18 ... Electronic component collection unit (electronic component placement unit) 19 ... Tray for collection (electronic component placement unit) 20 ... Recovery robot 21 ... Recovery empty tray transport mechanism 22A, 22B ... Tray transport mechanism 30 ... Control device 31 ... Control unit 32 ... Storage unit 40 ... Setting display unit 41 ... Display unit 42 ... operation unit (input unit) 50 ... placement unit image acquisition unit 50a ... first placement unit image acquisition unit 50b ... second placement unit image acquisition unit 51 ... imaging device ( Image unit) 52 ... Illuminating device 60 ... Supporting unit 70, 72, 74 ... Histogram 80 ... Supply conveyance correction setup screen (model image display setting unit) 82 ... Automatic model registration button (instruction receiving unit) 84 ... Detection pocket selection button ( Electronic component placement unit selection unit) 86 ... Model registration processing status screen 90 ... IC device (electronic component) 181 ... Placement unit 200 ... Tray (electronic component placement unit) 311 ... Drive control unit 312 ... Inspection control unit 313 ... Imaging control unit 314 ... model image creation unit 411 ... monitor 421 ... mouse 911 ... upper surface A1 ... tray supply area A2 ... device supply area A3 ... inspection area A4 ... device recovery area A5 ... tray removal area R1 ... first chamber R2 ... first 2 rooms R3 ... 3rd room.

Claims (10)

An electronic component placement section capable of placing electronic components;
An imaging unit capable of capturing an image of the electronic component placement unit;
A model image creation unit capable of creating a model image of the electronic component placement unit based on the image;
The model image creation unit is an electronic component transport apparatus capable of adjusting at least one of brightness of the model image and a cut-out position of the model image with respect to the image.   The electronic component transport apparatus according to claim 1, wherein the model image creation unit automatically adjusts the brightness of the model image based on the brightness of the pixels and the number of pixels in the image. It has an input unit for entering brightness adjustment parameters,
The electronic component transport apparatus according to claim 1, wherein the model image creating unit adjusts the brightness of the model image using the input brightness adjustment parameter.   The electronic component conveying apparatus according to claim 1, wherein the adjustment of the cutout position of the model image is performed by performing differential processing on the image data of the image captured by the imaging unit. Having a display,
5. The electronic component according to claim 1, wherein the model image creation unit displays the brightness and the number of pixels in the image on the display unit based on an imaging signal of the imaging unit. Conveying device.   The electronic component transport apparatus according to claim 1, wherein the model image creation unit quantifies the brightness and the number of pixels in the image.   The electronic component conveying apparatus according to claim 6, wherein the digitization creates a histogram in which the brightness of pixels in the image is a first axis and the number of pixels is a second axis orthogonal to the first axis.   The electronic component conveying apparatus according to claim 7, wherein the model image creating unit displays the histogram on the display unit. An electronic component placement section capable of placing electronic components;
An imaging unit capable of capturing an image of the electronic component placement unit;
A model image display setting unit that can display setting information of the model image of the electronic component placement unit based on the image and has an instruction receiving unit capable of receiving an instruction for automatic registration of the model image;
The model image display setting unit
An electronic component placement unit selection unit capable of selecting the electronic component placement unit;
An electronic component transport apparatus capable of automatically adjusting at least one of brightness of the model image and a cut-out position of the model image with respect to the image when instructed by the instruction receiving unit. An electronic component placement section capable of placing electronic components;
An imaging unit capable of capturing an image of the electronic component placement unit;
A model image creation unit capable of creating a model image of the electronic component placement unit based on the image;
An inspection unit for inspecting the electronic component,
The model image creation unit is an electronic component inspection apparatus capable of adjusting at least one of brightness of the model image and a cut-out position of the model image with respect to the image.