JP2017015481A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and electronic component inspection device capable of acquiring information of a surface state of an electronic component with high accuracy.SOLUTION: An electronic component conveyance device 10 includes a conveying part that can mount an electronic component and can travel in a first direction, and a surface state acquiring part that can travel in a second direction different from the first direction and can acquire information of a surface state of an electronic component mounted on the conveying part. An electronic component inspection device 1 has a conveying part that can mount an electronic component and can travel in a first direction, a surface state acquiring part that can travel in a second direction different from the first direction and can acquire information of a surface state of an electronic component mounted on the conveying part, and an inspecting part that inspects an electronic component.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that conveys an electronic component such as an IC device and inspects electrical characteristics of the electronic component is known.

  As an example of an electronic component inspection apparatus, for example, Patent Document 1 discloses an auto handler for a device tester. The auto handler according to Patent Document 1 includes a measurement unit that tests various electrical characteristics of a measurement device, and an appearance inspection unit that performs an appearance inspection that inspects the presence or absence of scratches on the surface of the measurement device.

  The measurement unit includes a movable body that picks up the measurement device, a movable arm that moves the movable body, and a contact unit that contacts the measurement device and tests various electrical characteristics. On the other hand, the appearance inspection unit includes a movable body that picks up the measurement device, a movable arm that moves the movable body, an appearance measurement table that fixes the measurement device, and a CCD camera that obtains image data on the surface of the measurement device.

JP-A-8-105937

  In such a conventional electronic component inspection apparatus, when inspecting the surface of an electronic component (measurement device of Patent Document 1) for a scratch or the like, a plurality of electronic components are simultaneously imaged by a CCD camera, and the captured image The inspection is performed based on the data. For this reason, the conventional electronic component inspection apparatus has a problem that it is difficult to confirm a relatively small scratch and to perform a high-precision appearance inspection because the resolution of imaging is low.

  The objective of this invention is providing the electronic component conveyance apparatus and electronic component inspection apparatus which can acquire the information of the surface state of an electronic component with high precision.

The above object is achieved by the present invention described below.
An electronic component transport apparatus according to the present invention can place an electronic component and can move in a first direction;
It has a surface state acquisition part which can move in the 2nd direction different from the 1st direction, and can acquire the information on the surface state of the electronic parts laid in the conveyance part.

  As described above, since the surface state acquisition unit is movable in the second direction, the surface state of the electronic component can be acquired by dividing or scanning the surface of the electronic component. Thereby, for example, the resolution of the surface state acquisition unit can be increased in a pseudo manner, and thus information on the surface state of the electronic component can be acquired with high accuracy.

  In the electronic component transport device of the present invention, it is preferable that each of the first direction and the second direction is along a horizontal plane.

  Accordingly, the electronic component can be placed on the transport unit with the surface to be inspected of the electronic component facing upward, and information on the surface state of the electronic component can be acquired.

In the electronic component transport apparatus according to the aspect of the invention, the transport unit may include a first placement row in which a plurality of first placement portions on which the electronic components are placed are arranged in the first direction, and the first placement row. A plurality of second placement portions arranged in the second direction, and a plurality of second placement portions on which the electronic components are placed are arranged in the first direction, and
It is preferable that the surface state acquisition unit is capable of acquiring the information of the electronic components placed in the first arrangement row and the electronic components placed in the second arrangement row.

  As described above, by placing a plurality of electronic components along the first direction that is the moving direction of the transport unit, the surface state acquisition unit can more efficiently acquire the surface state information of the plurality of electronic components. Can do.

  In the electronic component transport device of the present invention, the surface state acquisition unit acquires the information of the plurality of electronic components placed in the first arrangement row, and then moves in the second direction, thereby It is preferable to acquire the information of the plurality of electronic components placed in the second arrangement row.

  Thereby, for example, the surface state information of a plurality of electronic components can be acquired more accurately and more quickly with a smaller number of surface state acquisition units than in the arrangement row.

In the electronic component transport device of the present invention, the transport unit is configured to be capable of reciprocating in the first direction,
The surface state acquisition unit acquires the information of the electronic components placed in the first arrangement row on the outward path, and the surface state acquisition unit returns the second arrangement row on the return path. It is preferable to acquire the information of the electronic component placed on the board.

  Thereby, for example, the surface state information of a plurality of electronic components can be acquired more efficiently with a smaller number of surface state acquisition units than the arrangement row.

In the electronic component transport apparatus of the present invention, the transport unit mounts the first arrangement row in which a plurality of first mounting units on which the electronic component is mounted are arranged in the first direction, and the electronic component. A plurality of second placement portions, a second arrangement row arranged in the first direction,
The surface state acquisition unit includes a first surface state acquisition unit that acquires the information of the electronic component placed in the first arrangement row, and the information of the electronic component that is placed in the second arrangement row. It is preferable to have the 2nd surface state acquisition part which acquires.

  Accordingly, for example, the surface of each electronic component in each arrangement row (first arrangement row and second arrangement row) is divided by moving the first surface state acquisition unit and the second surface state acquisition unit in the second direction, respectively. Or it can scan and can acquire the information of the surface state of a plurality of electronic parts with higher accuracy.

  In the electronic component conveying apparatus of the present invention, it is preferable to perform an appearance inspection of the electronic component based on the information acquired by the surface state acquisition unit.

  Since appearance inspection can be performed to determine the presence or absence of scratches (including defects such as cracks, dents, and chips) on electronic components based on the information thus obtained, for example, separately from the transportation of electronic components It is possible to save the trouble of performing an appearance inspection. Therefore, a series of operations of transporting electronic components and visual inspection of electronic components can be performed more quickly.

  In the electronic component conveying apparatus of the present invention, it is preferable that the appearance inspection is an inspection for determining whether or not the electronic component is flawed.

  As described above, since it is possible to perform an appearance inspection to determine the presence or degree of scratches (including defects such as cracks, dents, and chips) of electronic components, for example, the trouble of performing an appearance inspection separately from the transportation of electronic components Can be omitted. Therefore, a series of operations of transporting electronic components and visual inspection of electronic components can be performed more quickly.

In the electronic component transport device of the present invention, it is possible to provide an inspection unit that performs an electrical inspection of the electronic component,
It is preferable that the surface state acquisition unit acquires the information after the electrical inspection is performed.

  As a result, even if a scratch or the like occurs in the electronic component during the electrical inspection of the electronic component, the scratch or the like can be found. Therefore, it is possible to improve the reliability of electronic components that are finally shipped as products.

  In the electronic component conveying apparatus of the present invention, it is preferable that the conveying unit is an electronic component collecting unit that conveys the electronic component after the electrical inspection is performed.

  As a result, even if a scratch or the like occurs in the electronic component during the electrical inspection of the electronic component, the scratch or the like can be found. Therefore, it is possible to improve the reliability of electronic components that are finally shipped as products.

  In the electronic component transport device of the present invention, it is preferable that the surface state acquisition unit acquires the information for the electronic component that has passed the electrical inspection.

  Thereby, only the surface state of the electronic component that has passed the electrical inspection can be confirmed, and the acquisition of the surface state of the electronic component that has failed is not performed. For example, unnecessary appearance inspection can be omitted.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the surface state acquisition unit includes an imaging device capable of imaging the electronic component.

  Thereby, the surface state of the electronic component can be acquired as image data. Therefore, for example, the presence or absence of scratches on the surface of the electronic component can be more easily determined.

In the electronic component transport device of the present invention, the surface state acquisition unit has a strobe.
It is preferable that when the electronic component is imaged by the imaging device, the strobe is driven to irradiate the electronic component with light.

  Thereby, it can suppress that an image becomes dark by insufficient light quantity, and can obtain a clearer image.

An electronic component inspection apparatus according to the present invention can place an electronic component and can move in a first direction;
A surface state acquisition unit capable of moving in a second direction different from the first direction and capable of acquiring information on a surface state of the electronic component placed on the transport unit;
And an inspection unit for inspecting the electronic component.

  As described above, since the surface state acquisition unit is movable in the second direction, the surface state of the electronic component can be acquired by dividing or scanning the surface of the electronic component. Thereby, for example, the resolution of the surface state acquisition unit can be increased in a pseudo manner, and thus information on the surface state of the electronic component can be acquired with high accuracy.

1 is a schematic perspective view showing an inspection apparatus (electronic component inspection apparatus) according to a first embodiment of the present invention. It is a schematic plan view of the inspection apparatus shown in FIG. It is a block diagram which shows the control apparatus, the setting display part, and surface state acquisition part which the inspection apparatus shown in FIG. 1 has. FIG. 3 is an enlarged schematic plan view of the inspection area shown in FIG. 2. It is a schematic side view of the surface state acquisition part shown in FIG. It is a figure for demonstrating the moving direction of the surface state acquisition part shown in FIG. It is a figure for demonstrating conveyance of the electronic component collection | recovery part shown in FIG. It is a schematic plan view which shows the IC device imaged using the surface state acquisition part shown in FIG. It is a schematic plan view which shows the IC device imaged using the test | inspection apparatus which concerns on 2nd Embodiment of this invention. It is an expansion schematic plan view of the inspection area | region which the inspection apparatus which concerns on 3rd Embodiment of this invention has. It is a figure for demonstrating conveyance of the electronic component collection | recovery part shown in FIG. It is a figure for demonstrating conveyance of the electronic component collection | recovery part shown in FIG.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component transport device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic perspective view showing an inspection apparatus (electronic component inspection apparatus) according to the first embodiment of the present invention. FIG. 2 is a schematic plan view of the inspection apparatus shown in FIG. FIG. 3 is a block diagram illustrating a control device, a setting display unit, and a surface state acquisition unit included in the inspection apparatus illustrated in FIG. FIG. 4 is an enlarged schematic plan view of the inspection region shown in FIG. FIG. 5 is a schematic side view of the surface state acquisition unit shown in FIG. FIG. 6 is a diagram for explaining the movement direction of the surface state acquisition unit shown in FIG. FIG. 7 is a view for explaining conveyance of the electronic component collection unit shown in FIG. FIG. 8 is a schematic plan view showing an IC device imaged using the surface state acquisition unit shown in FIG.

  1, 2, and 4 to 10, for convenience of explanation, the X axis, the Y axis, and the Z axis, which are three axes orthogonal to each other, are illustrated by arrows, and the tip side of the arrow is indicated by “ “+ (Plus)”, and “− (minus)” on the base end side. In the following, the direction parallel to the X axis (first direction) is the “X axis direction”, the direction parallel to the Y axis (second direction) is the “Y axis direction”, and the direction parallel to the Z axis is “Z Axial direction ". Hereinafter, for convenience of explanation, the upper side (+ Z-axis direction side) in FIGS. 1 and 5 is referred to as “upper”, and the lower side (−Z-axis direction side) is referred to as “lower”.

  Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), a CIS (CMOS). This is a device for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as an image sensor. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIGS. 1 and 2, an inspection apparatus (electronic component inspection apparatus) 1 includes a conveyance apparatus (electronic component conveyance apparatus) 10 that conveys an IC device (electronic component) 90, an inspection unit 16, and a display unit 41. And a setting display unit 40 having an operation unit 42 and a control device 30. The inspection apparatus 1 also includes a surface state acquisition unit 50 including an imaging device 51 and a strobe 52, and a moving mechanism 60 that moves the surface state acquisition unit 50 along the Y-axis direction (see FIG. 5). ).

  In the present embodiment, the transport apparatus 10 is configured from the inspection apparatus 1 except for the inspection unit 16 and the inspection control unit 312 included in the control device 30 described later (see FIG. 3).

  As shown in FIGS. 1 and 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area A2, an inspection area A3 in which an inspection unit 16 is provided, a device collection area A4, and a tray removal area A5. It is divided into and.

  Each of these regions is partitioned from each other by a wall portion, a shutter, or the like (not shown). The device supply area A2 is a first chamber R1 defined by walls and shutters, and the inspection area A3 is a second chamber R2 defined by walls and shutters. The device collection area A4 is a third chamber R3 defined by walls, shutters, and the like. The first chamber R1 (device supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (device collection region A4) can each ensure airtightness and heat insulation. It is configured. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. The interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively, and can be inspected, for example, in a normal temperature environment, a low temperature environment, and a high temperature environment. ing.

  In the inspection apparatus 1, the IC device 90 passes through each region in order from the tray supply region A1 to the tray removal region A5, and inspection (electrical inspection) is performed in the intermediate inspection region A3. In the “inspection (electrical inspection)” of the present embodiment, for example, whether or not the IC device 90 is conducted is confirmed or an expected output is obtained when a specific signal is input. Or check if Thereby, it is possible to determine whether the IC device 90 is disconnected or short-circuited. In addition, in the test | inspection part 16, you may perform the test | inspection for confirming operation | movement of the circuit (not shown) etc. with which IC device 90 is provided.

Hereinafter, the inspection apparatus 1 will be described for each of the areas A1 to A5.
<Tray supply area A1>
As shown in FIG. 2, the tray supply area A1 is an area to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

<Device supply area A2>
As shown in FIG. 2, the device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms (transport units) 11A and 11B that transport the tray 200 are provided so as to straddle the tray supply region A1 and the device supply region A2.

  In the device supply area A2, a temperature adjustment unit (soak plate) 12, a supply robot (device transfer head) 13, and a supply empty tray transfer mechanism 15 are provided.

  The temperature adjustment unit 12 is an apparatus that arranges the IC device 90, heats or cools the arranged IC device 90, and adjusts (controls) the IC device 90 to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y-axis direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to and placed on one of the temperature adjustment units 12.

  The supply robot 13 is a transfer unit that transfers the IC device 90, and is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction within the device supply region A2. The supply robot 13 conveys the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and the IC device between the temperature adjustment unit 12 and an electronic component supply unit 14 described later. It is responsible for 90 transports. The supply robot 13 has a plurality of gripping units (not shown) that grip the IC device 90. Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction. Similarly to the temperature adjustment unit 12, the supply robot 13 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

  The supply empty tray transport mechanism 15 is a transport unit (transport mechanism) that transports the empty tray 200 from which all IC devices 90 have been removed in the X-axis direction. After this transport, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

<Inspection area A3>
As shown in FIG. 2, the inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an electronic component supply unit (supply shuttle) 14, an inspection unit 16, a measurement robot (device transport head) 17, and an electronic component recovery unit (recovery shuttle) 18 are provided. In the present embodiment, the electronic component supply unit 14 and the electronic component collection unit 18 are configured to be independently movable. However, they are configured to be connected or integrated and movable in the same direction. It may be.

  The electronic component supply unit 14 is a transport unit that places the IC device 90 whose temperature is adjusted (temperature control) and transports the IC device 90 to the vicinity of the inspection unit 16. The electronic component supply unit 14 can reciprocate between the device supply area A2 and the inspection area A3 along the X-axis direction. In the configuration shown in FIG. 2, two electronic component supply units 14 are arranged in the Y-axis direction, and the IC device 90 on the temperature adjustment unit 12 is conveyed to one of the electronic component supply units 14, Placed. This conveyance is performed by the supply robot 13. In the electronic component supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, and is a holding unit that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the inspection (electrical inspection) of the IC device 90 is performed via the probe pin. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The measurement robot 17 is a transport unit that transports the IC device 90, and is supported so as to be movable in the inspection region A3. The measuring robot 17 can transport and place the IC device 90 on the electronic component supply unit 14 carried in from the device supply area A2 onto the inspection unit 16. When inspecting the IC device 90, the measurement robot 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected. The measurement robot 17 has a plurality of gripping units (not shown) that grip the IC device 90. Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction. Further, like the temperature adjustment unit 12, the measurement robot 17 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection. In the present embodiment, the number of measuring robots 17 is one as shown in the figure, but two or more measuring robots 17 may be provided.

  The electronic component collection unit 18 is a conveyance unit that places the IC device 90 that has been inspected by the inspection unit 16 and conveys the IC device 90 to the device collection region A4. The electronic component collection unit 18 can reciprocate between the inspection area A3 and the device collection area A4 along the X-axis direction. In the configuration shown in FIG. 2, two electronic component collection units 18 are arranged in the Y-axis direction, like the electronic component supply unit 14, and the IC device 90 on the inspection unit 16 has any electronic component. It is transported to and placed on the component collection unit 18. This conveyance is performed by the measurement robot 17.

  Moreover, as shown in FIG. 4, the two electronic component collection | recovery parts 18 respectively have the 1st arrangement row 180a and the 2nd arrangement row 180b. The first arrangement row 180a and the second arrangement row 180b are arranged side by side in the Y-axis direction.

  Each of the first arrangement row 180a and the second arrangement row 180b has four placement portions 181 on which the IC devices 90 are placed. The placement units 181 are arranged at substantially equal intervals along the X-axis direction that is the conveyance direction of the electronic component recovery unit 18.

  In the present embodiment, one electronic component collection unit 18 has eight placement units 181, but the number of placement units 181 is not limited to this and may be one. A plurality other than eight may be used.

  As shown in FIG. 5, the mounting portion 181 has a concave shape that opens upward, and has a shape in which the cross-sectional area gradually decreases toward the bottom surface. The mounting portion 181 having such a shape includes a bottom surface and four inclined side surfaces.

  Such a side surface of the mounting portion 181 functions as a guide surface for guiding the IC device 90 to the mounting portion 181 when the IC device 90 is mounted. Thereby, the IC device 90 can be easily placed on the placement portion 181.

  Further, the surfaces (side surface and bottom surface) constituting the mounting portion 181 are subjected to an antireflection treatment for reducing reflection on the surfaces. Accordingly, it is possible to suppress unnecessary light from entering an imaging element (not shown) included in the imaging device 51 when the IC device 90 is captured by the imaging device 51 included in the surface state acquisition unit 50 described later. it can. Therefore, a clearer image can be obtained by the imaging device 51 described later.

  The antireflection treatment is not particularly limited, and examples thereof include formation of an antireflection film, roughening treatment (treatment for increasing light scattering), black treatment (treatment for increasing light absorption), and the like.

<Device collection area A4>
As shown in FIG. 2, the device collection area A4 is an area where the IC device 90 that has been inspected is collected. In the device collection area A4, a collection tray 19, a collection robot (sorting robot) 20, and a collection empty tray transport mechanism (tray transport mechanism) 21 are provided. In addition, three empty trays 200 are also prepared in the device collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the device collection area A4. In the configuration shown in FIG. 2, three collection trays 19 are arranged side by side in the X-axis direction. The empty trays 200 are also mounting parts on which the IC devices 90 are mounted, and three empty trays 200 are arranged side by side in the X-axis direction. Then, the IC device 90 on the electronic component collection unit 18 that has moved to the device collection area A4 is transported and placed in one of the collection tray 19 and the empty tray 200. Thereby, the IC device 90 is collected for each inspection result and sorted (classified). The sorting of the IC device 90 based on the inspection result is performed by the collection robot 20. The collection robot 20 sorts the IC device 90 according to a command from the control device 30 described later.

  The collection robot 20 is a conveyance unit that conveys the IC device 90, and is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction in the device collection area A4. The collection robot 20 can transport the IC device 90 from the electronic component collection unit 18 to the collection tray 19 or the empty tray 200. The collection robot 20 has a plurality of gripping units (not shown) that grip the IC device 90. Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction.

  The collection empty tray transport mechanism 21 is a transport unit (transport mechanism) that transports the empty tray 200 carried in from the tray removal area A5 in the X-axis direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

<Tray removal area A5>
The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked. In addition, tray transport mechanisms (transport sections) 22A and 22B that transport the tray 200 one by one are provided so as to straddle the device collection area A4 and the tray removal area A5. The tray transport mechanism 22A transports the tray 200 on which the inspected IC device 90 is placed from the device collection area A4 to the tray removal area A5. The tray transport mechanism 22B transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the device collection area A4.

  The first chamber R1, the second chamber R2, and the third chamber R3 in each of the regions A1 to A5 as described above include a temperature sensor (thermometer) that detects the indoor temperature, although not shown. A humidity sensor (hygrometer) for detecting indoor humidity (relative humidity) and an oxygen concentration sensor (oxygen meter) for detecting indoor oxygen concentration are provided. In the present embodiment, the temperature sensor, the humidity sensor, and the oxygen concentration sensor are provided in each of the first chamber R1, the second chamber R2, and the third chamber R3. However, the temperature sensor, the humidity sensor, and the oxygen concentration are provided. The location where the sensor is provided is arbitrary.

  Although not shown, the inspection apparatus 1 has a dry air supply mechanism. The dry air supply mechanism is configured to be able to supply gas such as air with low humidity and nitrogen (hereinafter also referred to as dry air) to the first chamber R1, the second chamber R2, and the third chamber R3. Therefore, condensation and icing (icing) of the IC device 90 can be prevented by supplying dry air as necessary.

(Control device 30)
As illustrated in FIG. 3, the control device 30 has a function of controlling each unit of the inspection device 1 and includes a control unit 31 and a storage unit 32.

  The control unit 31 includes, for example, a CPU (Central Processing Unit), and includes a drive control unit 311, an inspection control unit 312, and an imaging control unit (surface state acquisition control unit) 313. The storage unit 32 includes, for example, a read only memory (ROM) and a random access memory (RAM).

  The drive control unit 311 includes components (tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a supply robot 13, a supply empty tray transport mechanism 15, an electronic component supply unit 14, an inspection unit 16, a measurement robot 17, and an electronic component recovery unit 18. The drive of the recovery robot 20, the recovery empty tray transport mechanism 21, the tray transport mechanisms 22A and 22B, and the moving mechanism 60) is controlled.

  The inspection control unit 312 can inspect the IC device 90 arranged in the inspection unit 16 based on, for example, a program (software) stored in the storage unit 32.

  The imaging control unit 313 controls driving of the surface state acquisition unit 50 and the like. Further, the imaging control unit 313 processes a signal from the imaging device 51 and converts the surface state information of the IC device 90 acquired by the surface state acquisition unit 50 into data (generates image data).

Further, the control unit 31 has a function of displaying the driving of each unit, inspection results, image data, and the like on the display unit 41, a function of performing processing in accordance with an input from the operation unit 42, and the like.
The storage unit 32 stores programs, data, and the like for the control unit 31 to perform various processes.

(Setting display section 40)
As shown in FIGS. 1 and 3, the setting display unit 40 includes a display unit 41 and an operation unit 42.

  The display unit 41 includes a monitor 411 that displays driving of each unit, inspection results, and the like. The monitor 411 can be composed of a display panel such as a liquid crystal display panel or an organic EL, for example. The operator can set or check various processes, conditions, and the like of the inspection apparatus 1 via the monitor 411.

  The operation unit 42 is an input device such as a mouse 421, and outputs an operation signal corresponding to the operation by the worker to the control unit 31. Therefore, the operator can use the mouse 421 to instruct the control unit 31 for various processes.

  In the present embodiment, the mouse 421 is used as the operation unit 42. However, the operation unit 42 is not limited to this, and may be an input device such as a keyboard, a trackball, or a touch panel.

(Surface condition acquisition unit 50)
The surface state acquisition unit 50 has a function of acquiring information on the surface state of the IC device 90 that is placed on the electronic component recovery unit 18.

  As shown in FIGS. 2 and 4, the surface state acquisition unit 50 is provided in the vicinity of the above-described inspection region A3 and device recovery region A4 and in the middle of the conveyance path C18 of the electronic component recovery unit 18. . That is, the surface state acquisition unit 50 is provided at a position where information on the surface state of the IC device 90 after inspection (electrical inspection) can be acquired.

  As illustrated in FIG. 4, the surface state acquisition unit 50 includes two first surface state acquisition units 50 a and two second surface state acquisition units 50 b. The first surface state acquisition unit 50a and the second surface state acquisition unit 50b are arranged side by side in the Y-axis direction. The first surface state acquisition unit 50 a is provided above the first arrangement row 180 a of the electronic component collection unit 18. The second surface state acquisition unit 50 b is provided above the second arrangement row 180 b of the electronic component collection unit 18.

  In the present embodiment, when each of the first surface state acquisition unit 50a and the second surface state acquisition unit 50b is regarded as one surface state acquisition unit 50, the number of the surface state acquisition units 50 is four. However, the number of the surface state acquisition units 50 is not limited to this and is arbitrary. However, the number of surface state acquisition units 50 is preferably the same as the number of arrangement rows. Thereby, compared with the case where the number of the surface state acquisition parts 50 is less than the number of arrangement | sequence rows, the information of the surface state of the IC device 90 can be acquired more efficiently like this embodiment.

  As shown in FIG. 5, the surface state acquisition unit 50 is supported by a moving mechanism 60 described later so as to be disposed above the electronic component collection unit 18. Thereby, the surface state acquisition unit 50 can acquire information on the state of the upper surface 911 of the IC device 90 from vertically above the IC device 90 in the electronic component recovery unit 18.

  The first surface state acquisition unit 50a and the second surface state acquisition unit 50b include an imaging device 51 and a strobe 52, respectively.

  The imaging device 51 has an imaging element that receives light from the IC device 90 and converts it into an electrical signal. The imaging device 51 is not particularly limited. For example, a camera (CCD camera) using a CCD (Charge Coupled Device) image sensor as an imaging device, and a camera using a CMOS (Complementary Metal Oxide Semiconductor) image sensor as an imaging device. An electronic camera (digital camera) such as a camera using a MOS image sensor as an image pickup device can be used. Further, by analyzing the image data using, for example, differential interference method, Fourier transform method or the like, it is possible to emphasize fine scratches and scratches that are difficult to see and improve the detection sensitivity of the scratches.

  The imaging device 51 is configured so that the imaging area is about ¼ or larger than the size of the upper surface 911 of the IC device 90 in the electronic component collection unit 18.

  Although not shown, the imaging device 51 preferably includes an optical system such as an optical lens or an autofocus mechanism. Thereby, for example, even when the height (the height in the Z-axis direction) of the IC device 90 on the electronic component collection unit 18 with respect to the imaging device 51 is different, a clear image can be obtained.

  The strobe 52 is a light source device that is driven when the imaging device 51 images the IC device 90 and irradiates the IC device 90 with light. With this strobe 52, it is possible to suppress the image from becoming dark due to insufficient light quantity, and to obtain a clearer image.

  In the present embodiment, the strobe 52 has an annular shape and is disposed around the imaging device 51. As a result, the IC device 90 can be irradiated with light uniformly. The shape and arrangement of the strobe 52 are not limited to the above-described configuration.

  The surface state acquisition unit 50 having such a configuration irradiates the IC device 90 with light using the strobe 52 and images a plurality of IC devices 90 placed on the electronic component recovery unit 18 with the imaging device 51. A signal from the imaging device 51 is taken into the imaging control unit 313 described above. The imaging control unit 313 processes a signal from the imaging device 51 and generates information on the surface state of the IC device 90 as two-dimensional image data.

  Further, the three-dimensional image data may be generated using the surface state information of the IC device 90 acquired by the surface state acquisition unit 50. In that case, for example, although not illustrated, two or more (for example, three) surface state acquisition units 50 may be provided for one arrangement row. By generating three-dimensional image data, in addition to the presence or absence of scratches on the surface of the IC device 90 as described later, the size (particularly depth) of the scratches can be measured. For example, a three-dimensional image (3D image image) may be acquired by a laser measuring device (laser length measuring device) using a triangulation method.

(Movement mechanism 60)
The moving mechanism 60 has a function of moving the surface state acquisition unit 50 in the Y-axis direction different from the X-axis direction that is the conveyance direction of the electronic component recovery unit 18.

  In the present embodiment, the movement mechanism 60 can move the two first surface state acquisition units 50a and the two second surface state acquisition units 50b together in the same direction by the single movement mechanism 60. These may be configured to be independently movable.

  As illustrated in FIG. 5, the moving mechanism 60 includes a support member 61 to which the surface state acquisition unit 50 is attached, and a moving unit 62 that supports the support member 61 so as to be movable in the Y-axis direction. The moving mechanism 60 is attached to, for example, a support leg (not shown) that supports the inspection unit 16 and the measurement robot 17.

  The support member 61 can be reciprocated in the Y-axis direction, which is the arrangement direction of the first arrangement row 180a and the second arrangement row 180b, of the electronic component collection unit 18 by the moving unit 62. The support member 61 is configured to reciprocate at a predetermined pitch P1. For this reason, as shown in FIG. 6, the surface state acquisition unit 50 can reciprocate in the Y-axis direction at a predetermined pitch P1.

  In the present embodiment, the pitch P1 is set to approximately half the width W (the length in the Y-axis direction) of the IC device 90.

  The moving unit 62 includes a drive source (not shown) that generates power for moving the support member 61, and a power transmission mechanism (not shown) that transmits the power of the drive source to the support member 61. Yes.

Examples of the driving source include motors such as servo motors, stepping motors, linear motors, hydraulic cylinders, pneumatic cylinders, and the like. Examples of the power transmission mechanism include a mechanism including a combination of a belt, a gear, a rack and a pinion, a combination of a ball screw and a ball nut, and the like.
The driving of the moving mechanism 60 is controlled by the drive control unit 311 described above.

  Hereinafter, acquisition of information on the surface state of the IC device 90 will be described while describing a series of operations of the inspection apparatus 1 configured as described above.

  As described above, the IC device 90 is inspected in the inspection area A3 through the tray supply area A1 and the device supply area A2 in this order (see FIG. 2). In the inspection area A3, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected, and thereby the continuity of the IC device 90 is inspected. In this inspection, an IC device 90 that satisfies a condition equal to or higher than the standard that the conduction state is set to pass, and an IC device 90 that does not satisfy the standard is rejected. The set standard can be arbitrarily adjusted. In addition, the inspection result may be not only two results of pass and fail but also a result classified into a plurality of results.

  The IC device 90 that has been inspected is transferred from the inspection unit 16 to the electronic component recovery unit 18 by the measuring robot 17 and placed thereon.

  As shown in FIG. 7, the electronic component collection unit 18 on which the IC device 90 is placed is transported from the inspection area A3 to the device collection area A4 along the arrow X1 direction (+ X axis direction). While being conveyed in the direction of the arrow X1, the surface state acquisition unit 50 images each IC device 90. In addition, the surface state acquisition unit 50 is configured so that two placement units 181 placed in each placement row (the first placement row 180a and the second placement row 180b) are spaced apart from each other (two adjacent rows arranged along the X-axis direction). Each IC device 90 is imaged by irradiating light at a predetermined timing according to the pitch of the mounting portions 181). Thereby, the surface state acquisition part 50 images the some IC device 90 continuously. In this imaging, as shown in FIG. 8, the surface state acquisition unit 50 captures an image in the imaging region Y <b> 1 so as to include the first portion 91 that is the upper right portion in FIG. 8 of each IC device 90.

  Next, as illustrated in FIG. 7, the electronic component recovery unit 18 is transported from the device recovery area A4 to the inspection area A3 along the arrow X2 direction (−X axis direction). While being conveyed in the arrow X2 direction, the surface state acquisition unit 50 continuously images the plurality of IC devices 90 in the same manner as described above. In this imaging, as illustrated in FIG. 8, the surface state acquisition unit 50 captures an image in the imaging region Y <b> 2 so as to include the second portion 92 that is the upper left portion in FIG. 8 of each IC device 90.

  Next, as shown in FIG. 6, the surface state acquisition unit 50 moves at the pitch P <b> 1 in the −Y axis direction by driving the moving mechanism 60 under the control of the drive control unit 311.

  Next, as described above, as shown in FIG. 7, while the electronic component recovery unit 18 is reciprocatingly moved in the arrow X1 direction and the arrow X2 direction, the surface state acquisition unit 50 includes a plurality of IC devices 90. Are continuously imaged. In this imaging, as shown in FIG. 8, the surface state acquisition unit 50 includes a third portion 93 that is a lower right portion of each IC device 90 in FIG. 8 and a lower left portion of each IC device 90 in FIG. 8. The fourth portion 94, which is the portion of, is imaged in this order.

  In this way, the surface state acquisition unit 50 images the IC device 90 in four divisions while moving to the electronic component collection unit 18. As a result, the information can be acquired with higher accuracy than when the information on the upper surface 911 of the IC device 90 is acquired collectively.

  In the above-described imaging, the surface state acquisition unit 50 performs imaging so as to include an area where the imaging area Y1 and the imaging area Y2 overlap. As a result, the IC device 90 is imaged so as to include a portion where the first portion 91 and the second portion 92 overlap.

  Furthermore, as described above, the pitch P <b> 1 of the moving mechanism 60 is approximately half the width W of the IC device 90. Therefore, the surface state acquisition unit 50 moved in the −Y-axis direction by the moving mechanism 60 captures an image in the imaging region Y1 so that a portion overlapping the first portion 91 is generated, and a portion overlapping the second portion 92 is generated. It is possible to take an image in the imaging area Y2. Thereby, the IC device 90 is imaged so that the first portion 91, the second portion 92, the third portion 93, and the fourth portion 94 have portions that overlap each other. By imaging in this way, it is possible to prevent or reduce the occurrence of an imaging omission area of the IC device 90.

  Further, the signal acquired by the surface state acquisition unit 50 is taken into the imaging control unit 313, and the imaging control unit 313 generates two-dimensional image data. An appearance inspection is performed based on the image data. In this appearance inspection, the presence and extent of scratches (including defects such as cracks, dents, and chips) on the IC device 90 are determined. In this appearance inspection, an IC device 90 that satisfies a condition equal to or higher than a set standard for the degree of scratches is accepted, and an IC device 90 that does not meet the standard is rejected. The set standard can be arbitrarily adjusted. Further, the size of a scratch or the like is measured or the position is specified as necessary.

  By performing such an appearance inspection, for example, it is possible to save the trouble of performing the appearance inspection separately from the conveyance of the IC device 90. Therefore, a series of operations for transporting the IC device 90 and visual inspection of the IC device 90 can be performed more quickly.

  Further, by generating two-dimensional image data using the surface state information of the IC device 90 acquired by the surface state acquisition unit 50, for example, it is possible to easily determine whether or not there is a scratch or the like on the surface of the IC device 90. be able to.

  In addition, the imaging control unit 313 preferably generates a plurality of signals obtained by dividing by the surface state acquisition unit 50 as described above as combined (composite) image data. Accordingly, the appearance inspection can be performed collectively for each IC device 90 based on the synthesized image data without performing the appearance inspection for each portion acquired by dividing the surface state information of the IC device 90. it can. For this reason, throughput can be increased.

  After the imaging of the IC device 90 by the surface state acquisition unit 50 is completed, the IC device 90 is converted into the result of the electrical inspection and the result of the appearance inspection by the electronic component collection unit 18 provided in the device collection area A4. Based on the classification (see FIG. 2). The IC devices 90 that pass both the electrical inspection result and the appearance inspection result are sorted into empty trays 200 provided in the device collection area A4. On the other hand, the IC device 90 in which one of the result of the electrical inspection and the result of the appearance inspection fails is classified into the collection tray 19 or the like.

  Then, the IC devices 90 separated into empty trays 200 provided in the device collection area A4 are transported to the tray removal area A5.

  As described above, in the inspection apparatus 1, the surface state acquisition unit 50 acquires information on the surface state of the IC device 90 that is placed on the electronic component collection unit 18. As described above, by imaging the IC device 90 in a state where the IC device 90 is placed on the electronic component collecting unit 18, it is omitted to provide a dedicated appearance inspection region for performing an appearance inspection of the IC device 90. can do. Further, as compared with a case where a dedicated appearance inspection area for performing appearance inspection is provided, useless movement of the IC device 90 is reduced, and the appearance inspection of the IC device 90 can be performed more quickly. Furthermore, since the number of times the IC device 90 is gripped or released can be reduced, it is possible to prevent the IC device 90 from being damaged.

  Further, the surface state acquisition unit 50 is movable in the Y-axis direction, which is a different direction from the electronic component recovery unit 18 movable in the X-axis direction, so that the first part 91 and the second part of the IC device 90 can be moved. After the portion 92 is imaged, the third portion 93 and the fourth portion 94 can be imaged. In this way, the first portion 91, the second portion 92, the third portion 93, and the fourth portion 94 can be divided and imaged, so that, for example, the resolution of the surface state acquisition unit 50 is simulated. Can be increased. As a result, information on the surface state of the IC device 90 can be obtained with high accuracy.

  In particular, as described above, the X-axis direction in which the electronic component collection unit 18 moves and the Y-axis direction in which the surface state acquisition unit 50 moves are perpendicular to each other along the horizontal plane. For this reason, a plurality of IC devices 90 provided along the X-axis direction can be continuously divided and imaged. Therefore, the information on the surface states of the plurality of IC devices 90 can be acquired more easily and more quickly. Further, since the electronic component collection unit 18 and the surface state acquisition unit 50 each move along a horizontal plane, the IC device 90 is placed in the state where the upper surface 911 to be inspected of the IC device 90 is directed upward. 18, and information on the surface state of the IC device 90 can be acquired.

  Further, as described above, the surface state acquisition unit 50 is movable at a predetermined pitch P1. Then, the surface state acquisition unit 50 images the first part 91 and the third part 93 of the plurality of IC devices 90 on the movement path (outward path) in the X1 direction of the electronic part recovery part 18 to recover the electronic part. The second part 92 and the fourth part 94 of the plurality of IC devices 90 are imaged on the movement path (return path) of the unit 18 in the X2 direction. In this way, the movement of the electronic component collection unit 18 and the movement of the surface state acquisition unit 60 are synchronized or linked. For this reason, the information of the surface state of the plurality of IC devices 90 can be acquired more efficiently. Thus, throughput can be increased.

  In the present embodiment, as described above, the surface state acquisition unit 50 acquires information on the surface state of the IC device 90 on the electronic component collection unit 18 that is a transport unit that transports the IC device 90 after inspection. ing. Thereby, for example, even if the IC device 90 is scratched during the electrical inspection of the IC device 90, the scratch or the like can be found. Therefore, the reliability of the IC device 90 that is finally shipped as a product can be improved.

  In addition to the electronic component recovery unit 18, there is a tray transport mechanism 22A as a transport unit for placing and transporting the IC device 90 after inspection. A surface state acquisition unit 50 may be provided in the vicinity of the tray transport mechanism 22A. When the surface state acquisition unit 50 is provided in the vicinity of the tray conveyance mechanism 22A, the surface state acquisition unit 50 may acquire information on the surface states of all the IC devices 90, but the electrical inspection result is It is preferable to acquire only the information on the surface state of the IC device 90 that is passed. Thereby, since acquisition of the surface state of the IC device 90 which is unacceptable is not performed, an unnecessary appearance inspection can be omitted.

  In addition, when performing an appearance inspection of the IC device 90 in an uninspected state (an IC device 90 that has not been electrically inspected), any of the tray transport mechanism 11A and the transport unit of the electronic component supply unit 14 is transported. What is necessary is just to provide the surface state acquisition part 50 in the vicinity of a part.

  Further, the imaging device 51 images the IC device 90 from above the IC device 90. Thereby, it is possible to determine whether or not the upper surface 911 of the IC device 90 is scratched. Circuits are concentrated on the upper surface 911 of the IC device 90. Therefore, by determining whether the upper surface 911 of the IC device 90 is scratched or not, the reliability of the IC device 90 that is finally shipped as a product can be improved.

Second Embodiment
FIG. 9 is a schematic plan view showing an IC device imaged using the inspection apparatus according to the second embodiment of the present invention.

  The inspection apparatus according to the present embodiment is the same as the inspection apparatus according to the first embodiment described above except that the imaging area of the imaging apparatus included in the surface state acquisition unit is different.

  In the following description, the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. Moreover, in FIG. 9, the same code | symbol is attached | subjected about the structure similar to 1st Embodiment mentioned above.

  In the imaging device 51 of the surface state acquisition unit 50 included in the inspection device 1 of the present embodiment, the imaging regions Y3 and Y4 are about ½ of the size of the upper surface 911 of the IC device 90 in the electronic component collection unit 18 or more. It is configured to be large. The imaging regions Y3 and Y4 are set to have a length in the X-axis direction that is longer than a length in the Y-axis direction and is almost twice as long as the length in the Y-axis direction.

  Hereinafter, acquisition of information on the surface state of the IC device 90 in the present embodiment will be described.

  First, as shown in FIG. 7 described above, while the electronic component collection unit 18 on which the IC device 90 is placed is moving in the arrow X1 direction (+ X axis direction), a plurality of surface state acquisition units 50 are provided. The IC device 90 is continuously imaged. In this imaging, as illustrated in FIG. 9, the surface state acquisition unit 50 captures an image in the imaging region Y3 so as to include the first portion 95 that is a portion on the + Y-axis direction side of each IC device 90.

  Next, as illustrated in FIG. 7, the surface state acquisition unit 50 moves at the pitch P <b> 1 in the −Y-axis direction by driving the moving mechanism 60 under the control of the drive control unit 311.

  After that, as shown in FIG. 7 described above, the surface state acquisition unit 50 is in the process of moving the electronic component collection unit 18 on which the IC device 90 is placed in the direction of the arrow X2 (−X axis direction). A plurality of IC devices 90 are continuously imaged. In this imaging, as shown in FIG. 9, the surface state acquisition unit 50 captures an image in the imaging region Y4 so as to include a second portion 96 that is a portion on the −Y axis direction side of each IC device 90.

  In this way, the surface state acquisition unit 50 images the IC device 90 in two while the electronic component collection unit 18 is moving. As a result, the information can be acquired with higher accuracy than in the case where the information on the surface state of the upper surface 911 of the IC device 90 is acquired collectively.

  Further, in the imaging, the surface state acquisition unit 50 performs imaging so as to include an area where the imaging area Y3 and the imaging area Y4 overlap. As a result, the IC device 90 is imaged so as to include a portion where the first portion 95 and the second portion 96 overlap. By imaging in this way, it is possible to prevent or reduce the occurrence of an imaging omission area of the IC device 90.

  Also with the inspection apparatus according to the second embodiment as described above, information on the surface state of the electronic component can be obtained with high accuracy.

  In the above-described embodiment, the surface state acquisition unit 50 images one IC device 90 in two or four divisions. However, the number of divisions is not particularly limited, and various conditions such as the performance of the imaging device 51 are satisfied. It is set accordingly. However, the number of divisions is preferably an even number, more preferably 2 or more and 64 or less, and further preferably 2 or more and 16 or less. Specifically, 2 divisions or 4 divisions are preferable, and 4 divisions are particularly preferable. Thereby, compared with the case where the information on the surface state of the IC device 90 is acquired collectively, the information can be acquired with high accuracy.

<Third Embodiment>
FIG. 10 is an enlarged schematic plan view of an inspection region included in the inspection apparatus according to the third embodiment of the present invention. 11 and 12 are diagrams for explaining the conveyance of the electronic component recovery unit shown in FIG.

  The inspection apparatus according to the present embodiment is the same as the inspection apparatus according to the first embodiment described above, except that the number and movement range of the surface state acquisition unit are different from the imaging region of the imaging device included in the surface state acquisition unit. It is.

  In the following description, the third embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. In FIGS. 10, 11 and 12, the same reference numerals are assigned to the same configurations as those of the first embodiment described above.

As shown in FIG. 10, the present embodiment has two surface state acquisition units 50.
The two surface state acquisition units 50 are provided side by side in the Y-axis direction. One surface state acquisition unit 50 is provided above the electronic component recovery unit 18 provided on the + Y axis direction side. The other surface state acquisition unit 50 is provided above the electronic component recovery unit 18 provided on the −Y axis direction side. Thus, in the present embodiment, the surface state acquisition unit 50 is provided for each electronic component collection unit 18.

  In addition, the imaging region of the surface state acquisition unit 50 is configured to be equal to or larger than the size of the upper surface 911 of the IC device 90 in the electronic component collection unit 18.

  Each support member 61 can be reciprocated in the Y-axis direction, which is the direction in which the two electronic component collection units 18 are arranged, by the moving unit 62. Further, as shown in FIG. 11, the support member 61 is configured to reciprocate at a predetermined pitch P2 between the first arrangement row 180a and the second arrangement row 180b of one electronic component collection unit 18. Has been. For this reason, the surface state acquisition unit 50 is capable of reciprocating in the Y-axis direction and has a predetermined predetermined pitch between the first arrangement row 180a and the second arrangement row 180b of one electronic component collection unit 18. It is configured to reciprocate at P2.

  In the present embodiment, the pitch P2 is the pitch P3 between the placement portion 181 provided in the first placement row 180a and the placement portion 181 provided in the second placement row 180b adjacent to the placement portion. Is set to be almost equivalent.

  Hereinafter, acquisition of information on the surface state of the IC device 90 in the present embodiment will be described.

  First, as shown in FIG. 11, the surface state acquisition unit 50 is in the first arrangement while the electronic component collection unit 18 on which the IC device 90 is mounted is moving in the arrow X1 direction (+ X axis direction). The plurality of IC devices 90 provided in the column 180a are continuously imaged.

  Next, as illustrated in FIG. 12, the surface state acquisition unit 50 moves at the pitch P <b> 2 in the −Y axis direction by driving the moving mechanism 60 under the control of the drive control unit 311.

  Thereafter, as shown in FIG. 12, the surface state acquisition unit 50 performs the second operation while the electronic component collection unit 18 on which the IC device 90 is placed is moving in the arrow X2 direction (−X axis direction). The plurality of IC devices 90 provided in the arrangement row 180b are continuously imaged.

  In this way, the surface state acquisition unit 50 continuously images the plurality of IC devices 90 while the electronic component collection unit 18 is moving.

  In the present embodiment, as described above, the surface state acquisition unit 50 can be moved between the first arrangement row 180a and the second arrangement row 180b by the moving mechanism 60, and the first arrangement row 180a and the second arrangement row. Information on the surface state of the IC device 90 placed on 180b can be acquired. For this reason, without providing the number of surface state acquisition units 50 corresponding to the number of arrangement rows, information on the surface states of the IC devices 90 placed in a plurality of arrangement rows by one surface state acquisition unit 50 is obtained. It can be acquired efficiently.

  Further, as described above, the surface state acquisition unit 50 picks up the plurality of IC devices 90 placed on the first placement row 180a and then moves in the Y-axis direction, thereby placing them on the second placement row 180b. The plurality of IC devices 90 placed are imaged. Then, as described above, the surface state acquisition unit 50 images the plurality of IC devices 90 placed in the first arrangement row 180a in the movement path (outward path) in the X1 direction of the electronic component collection unit 18; The plurality of IC devices 90 placed in the second arrangement row 180b are imaged along the movement path (return path) in the X2 direction of the electronic component collection unit 18. Thereby, even if it is the surface state acquisition part 50 of a number smaller than an arrangement | sequence row | line | column, the information of the surface state of the some IC device 90 can be acquired more efficiently.

  Also with the inspection apparatus according to the third embodiment as described above, information on the surface state of the electronic component can be obtained with high accuracy.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part is arbitrary which has the same function. It can be replaced with that of the configuration. In addition, any other component may be added to the present invention.

  For example, in the above-described embodiment, the configuration including the imaging device and the strobe is described as the surface state acquisition unit, but the configuration of the surface state acquisition unit is not limited to this. For example, the surface state acquisition unit may be a device that irradiates the surface of an electronic component with laser light, scans the laser light, and receives the laser light reflected on the surface. When such an apparatus is used, information on the surface state of the electronic component may be acquired while moving the surface state acquisition unit. As a result, the electronic components can be imaged collectively, and for example, the resolution of the surface state acquisition unit can be artificially increased.

  In the above-described embodiment, the surface state acquisition unit is configured to image the top surface of the electronic component in the vertical direction. You may comprise so that it can image. When imaging the back surface of the electronic component, for example, the lower part of the mounting part included in the electronic component recovery part is formed of a light transmissive member (transparent member), or a hole is formed in the lower part of the mounting part. It may be formed.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus, 10 ... Conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Supply robot, 14 ... Electronic component supply part, 15 ... Supply empty tray conveyance mechanism, 16 ... Inspection unit, 17 ... measuring robot, 18 ... electronic component collection unit, 19 ... collection tray, 20 ... collection robot, 21 ... collection empty tray conveyance mechanism, 22A ... tray conveyance mechanism, 22B ... tray conveyance mechanism, 30 ... control device , 31 ... control unit, 32 ... storage unit, 40 ... setting display unit, 41 ... display unit, 42 ... operation unit, 50 ... surface state acquisition unit, 50a ... first surface state acquisition unit, 50b ... second surface state acquisition , 51 ... imaging device, 52 ... strobe, 60 ... moving mechanism, 61 ... support member, 62 ... moving part, 90 ... IC device, 91 ... first part, 92 ... second part, 93 ... third Part 94 ... No. 95 ... first part, 96 ... second part, 180a ... first arrangement row, 180b ... second arrangement row, 181 ... mounting section, 200 ... tray, 311 ... drive control section, 312 ... inspection Control unit, 313 ... Imaging control unit, 411 ... Monitor, 421 ... Mouse, 911 ... Upper surface, A1 ... Tray supply area, A2 ... Device supply area, A3 ... Inspection area, A4 ... Device collection area, A5 ... Tray removal area, C18: transport path, P1 ... pitch, P2 ... pitch, P3 ... pitch, R1 ... first chamber, R2 ... second chamber, R3 ... third chamber, X1 ... arrow, X2 ... arrow, Y1 ... imaging area, Y2 ... Imaging area, Y3 ... imaging area, Y4 ... imaging area, W ... width

Claims (14)

A transport unit capable of placing electronic components and movable in a first direction;
An electronic component comprising: a surface state acquisition unit capable of moving in a second direction different from the first direction and capable of acquiring information on a surface state of the electronic component placed on the transport unit Conveying device.   The electronic component transport apparatus according to claim 1, wherein each of the first direction and the second direction is along a horizontal plane. The transport unit is arranged in the second direction with respect to the first arrangement row, a first arrangement row in which a plurality of first placement portions for placing the electronic components are arranged in the first direction, A plurality of second placement portions on which electronic components are placed have a second arrangement row arranged in the first direction;
The said surface state acquisition part can acquire the said information of the said electronic component mounted in the said 1st arrangement row, and the said electronic component mounted in the said 2nd arrangement row. The electronic component conveying apparatus as described.   The surface state acquisition unit is placed in the second arrangement row by acquiring the information of the plurality of electronic components placed in the first arrangement row and then moving in the second direction. The electronic component transport apparatus according to claim 3, wherein the information on the plurality of electronic components is acquired. The transport unit is configured to be capable of reciprocating in the first direction,
The surface state acquisition unit acquires the information of the electronic components placed in the first arrangement row on the outward path, and the surface state acquisition unit returns the second arrangement row on the return path. The electronic component conveying apparatus according to claim 3, wherein the information on the electronic component placed on the electronic device is acquired. The transport unit includes: a first arrangement row in which a plurality of first placement portions on which the electronic components are placed are arranged in the first direction; and a plurality of second placement portions on which the electronic components are placed A second arrangement row arranged in the first direction,
The surface state acquisition unit includes a first surface state acquisition unit that acquires the information of the electronic component placed in the first arrangement row, and the information of the electronic component that is placed in the second arrangement row. The electronic component transport apparatus according to claim 1, further comprising: a second surface state acquisition unit that acquires   The electronic component transport apparatus according to claim 1, wherein an appearance inspection of the electronic component is performed based on the information acquired by the surface state acquisition unit.   The electronic component conveying apparatus according to claim 7, wherein the appearance inspection is an inspection for determining whether or not the electronic component is scratched. It is possible to provide an inspection unit that performs an electrical inspection of the electronic component,
The electronic component conveying apparatus according to claim 1, wherein the surface state acquisition unit acquires the information after the electrical inspection is performed.   The electronic component conveying apparatus according to claim 9, wherein the conveying unit is an electronic component collecting unit that conveys the electronic component after the electrical inspection is performed.   The electronic component transport apparatus according to claim 9 or 10, wherein the surface state acquisition unit acquires the information for the electronic component that has passed the electrical inspection.   The electronic component transport apparatus according to claim 1, wherein the surface state acquisition unit includes an imaging device capable of imaging the electronic component. The surface state acquisition unit has a strobe,
The electronic component transport apparatus according to claim 12, wherein when the electronic component is imaged by the imaging device, the electronic device is irradiated with light by driving the strobe. A transport unit capable of placing electronic components and movable in a first direction;
A surface state acquisition unit capable of moving in a second direction different from the first direction and capable of acquiring information on a surface state of the electronic component placed on the transport unit;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component.

Images