TWI849513B - Method for adjusting temperature of chip - Google Patents

Abstract

The present disclosure provides a method for adjusting a temperature of a chip. The method includes: detecting temperature data of a reference chip with a temperature sensor for a plurality of times, when the temperature data of the reference chip is not in a preset temperature region, a first temperature compensation value and a second temperature compensation value can be ensured according to the temperature data of the reference chip and a preset temperature, wherein the first temperature compensation value is configured to adjust a temperature of an adapter, and the second temperature compensation value is configured to adjust a temperature of a test bench; and while testing a chip to be tested, a temperature of the adapter is adjusted with a first temperature adjusting unit, and a temperature of the test bench is adjusted with a second temperature adjusting unit.

Description

A chip temperature regulation method

This application relates to the field of chip testing, and in particular to a chip temperature regulation method.

When testing the chip to be tested, the temperature of the chip to be tested needs to be adjusted to the preset test temperature range before testing.

A temperature control method for a test device in the related art is provided on the test device. The test device is provided with at least one adapter on the machine. The temperature control device of the adapter includes a heating plate and a temperature sensor arranged on the adapter, and a cooling chip arranged above the heating plate. A heat sink is arranged above the cooling chip. When the adapter contacts the electronic component for testing, not only the heating plate can be used to heat the electronic component to the test temperature, but also when the temperature of the electronic component exceeds the test temperature, the cold end below the cooling chip can be used to quickly cool the electronic component, so that the electronic component is kept within a preset test temperature range for testing, thereby ensuring the test pass rate of the product. In the above technical solution, the temperature of the adapter is adjusted by using a heating plate and a cold end, and then the temperature of the test equipment is adjusted. However, the temperature sensor installed on the adapter can only obtain the surface temperature of the electronic component and is easily affected by changes in the ambient temperature. Therefore, the accuracy of this temperature control method is relatively low.

According to various embodiments of the present application, a method for adjusting the temperature of a chip in a test device is provided, wherein the test device comprises a connector, a test seat arranged in cooperation with the connector, the connector and the test seat cooperate to form a test chamber for placing a chip to be tested, a temperature sensor is arranged in the test chamber, the test device further comprises a first temperature adjustment unit for adjusting the temperature of the connector and a second temperature adjustment unit for adjusting the temperature of the test seat, the method comprising: using the temperature sensor to obtain temperature data of a reference chip for multiple times, wherein the reference chip is selected from the same batch of chips to be tested; when the temperature sensor is set to the temperature of the reference chip, the temperature of the reference chip is adjusted to the temperature of the reference chip; When the temperature data of the reference chip is not within the preset temperature range, a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test seat are determined based on the temperature data of the reference chip and the preset temperature value of the reference chip; when testing the chip to be tested, the first temperature adjustment unit is controlled to adjust the temperature of the adapter based on the first temperature compensation value, and the second temperature adjustment unit is controlled to adjust the temperature of the test seat based on the second temperature compensation value, so that the temperature of the chip to be tested is within the preset temperature range.

In some embodiments, determining the first temperature compensation value for adjusting the temperature of the adapter based on the temperature data of the reference chip and the preset temperature value of the reference chip includes: obtaining a corresponding temperature data curve based on the temperature data of the reference chip; obtaining a starting temperature value of the chip to be tested based on the temperature data curve; and determining the first temperature compensation value based on the starting temperature value and the preset temperature value.

In some embodiments, determining the first temperature compensation value based on the starting temperature value and the preset temperature value includes: determining the first temperature compensation value based on the difference between the starting temperature value and the preset temperature value and the corresponding first proportional coefficient.

In some embodiments, the determining the first temperature compensation value based on the difference between the starting temperature value and the preset temperature value and the corresponding first proportional coefficient includes: assuming that the starting temperature value is T ₁ , the preset temperature value is P, the difference between the starting temperature value and the preset temperature value is X, and the first proportional coefficient is M, then X, P and T ₁ satisfy the following relationship: X=PT ₁ , and the first temperature compensation value A satisfies the following relationship: A=X*M

In some embodiments, the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip includes: obtaining a corresponding temperature data curve based on the temperature data of the reference chip; obtaining an average temperature value after the temperature of the chip to be tested reaches stability based on the temperature data curve; and determining a second temperature compensation value based on the average temperature value and the preset temperature value.

In some embodiments, determining the second temperature compensation value based on the average temperature value and the preset temperature value includes: determining the second temperature compensation value based on the difference between the average temperature value and the preset temperature value and the corresponding second proportional coefficient.

In some embodiments, the determining the second temperature compensation value based on the difference between the average temperature value and the preset temperature value and the corresponding second proportional coefficient includes: assuming that the average temperature value is T ₂ , the preset temperature value is P, the difference between the average temperature value and the preset temperature value is Y, and the second proportional coefficient is N, then Y, P and T ₂ satisfy the following relationship: Y=PT ₂ , then the second temperature compensation value B satisfies the following relationship: B=Y*N

In some embodiments, the temperature sensor includes a first temperature sensor disposed on the adapter and a second temperature sensor disposed on the test seat, the first temperature sensor is used to obtain the first temperature data of the reference chip multiple times, and the second temperature sensor is used to obtain the second temperature data of the reference chip multiple times; the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip include: firstly determining the first temperature compensation value based on the first temperature data of the reference chip and the preset temperature value, and then determining the second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value.

In some embodiments, the first temperature compensation value is determined based on the first temperature data of the reference chip and the preset temperature value, and the second temperature compensation value is determined based on the second temperature data of the reference chip and the preset temperature value, including: using the adapter to absorb the reference chip, using the first temperature sensor to obtain the first temperature data of the reference chip multiple times, and determining the first temperature compensation value based on the temperature data of the reference chip and the preset temperature value of the reference chip; after placing the reference chip on the test seat using the adapter, using the second temperature sensor to obtain the second temperature data of the reference chip multiple times, and determining the second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value.

In some embodiments, the temperature sensor includes a first temperature sensor disposed on the adapter and a second temperature sensor disposed on the test seat, the first temperature sensor is used to obtain the first temperature data of the reference chip multiple times, and the second temperature sensor is used to obtain the second temperature data of the reference chip multiple times; the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip include: determining the first temperature compensation value based on the first temperature data of the reference chip and the preset temperature value, and determining the second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value.

In some embodiments, the temperature sensor includes a first temperature sensor disposed on the adapter and a second temperature sensor disposed on the test seat, the first temperature sensor is used to obtain the first temperature data of the reference chip multiple times, and the second temperature sensor is used to obtain the second temperature data of the reference chip multiple times. The first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip include: firstly determining the second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value, and then determining the first temperature compensation value based on the first temperature data of the reference chip and the preset temperature value.

Details of one or more embodiments of the present application are set forth in the following drawings and description. Other features, objects, and advantages of the present application will become apparent from the description, drawings, and scope of the application.

100:Testing equipment

101: Adapter

102: Test socket

103:Test Warehouse

104: First temperature adjustment unit

105: Second temperature control unit

1031: Chip to be tested

1031a: Reference chip

1032: Temperature sensor

1032a: First temperature sensor

1032b: Second temperature sensor

S201~S203: Steps

S301~S303: Steps

S401~S403: Steps

T ₁ : Starting temperature value

T ₂ : Average temperature

In order to better describe and illustrate the embodiments and/or examples of those applications disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered to limit the scope of any of the disclosed applications, the embodiments and/or examples presently described, and the best modes presently understood for those applications.

FIG1 is a schematic diagram of the structure of a test device according to one or more embodiments.

FIG2 is a schematic diagram of a process of a chip temperature adjustment method according to one or more embodiments.

FIG3 is a schematic diagram of a process for determining a first temperature compensation value according to one or more embodiments.

FIG4 is a schematic diagram of the starting temperature value in the temperature data curve according to one or more embodiments.

FIG5 is a schematic diagram of a process for determining a second temperature compensation value according to one or more embodiments.

FIG6 is a schematic diagram of the average temperature value after stabilization in the temperature data curve according to one or more embodiments.

In order to make the purpose, technical solutions and advantages of this application more clear, the following is a further detailed description of this application in combination with drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain this application and are not intended to limit this application.

It should be noted that the terms "first", "second", etc. in the description of this application, the scope of the patent application, and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or precedence.

The method embodiment provided in the embodiment of the present application can be applied to the test equipment 100. FIG1 is a schematic diagram of the structure of the test equipment 100 in the embodiment of the present application. As shown in FIG1, the test equipment 100 includes a connector 101 and a test seat 102 arranged in cooperation with the connector 101. The connector 101 and the test seat 102 cooperate to form a test chamber 103 for placing a wafer 1031 to be tested. A temperature sensor 1032 is arranged in the test chamber 103. The test chamber 103 also includes a first temperature regulating unit 104 for regulating the temperature of the connector 101 and a second temperature regulating unit 105 for regulating the temperature of the test seat 102.

In some embodiments, the first temperature regulating unit 104 includes a heating rod disposed on the adapter 101 and a low-temperature flow channel for inputting low-temperature gas, and the second temperature regulating unit 105 includes a flow channel for inputting high-temperature or low-temperature gas. It should be noted that the first temperature regulating unit 104 and the second temperature regulating unit 105 can also adopt other temperature regulating structures, which are not limited in this embodiment.

In some embodiments, as shown in FIG. 2 , a chip temperature adjustment method is provided, and the method is described by applying the method to the test equipment 100 in FIG. 1 , including the following steps.

S201: Use the temperature sensor 1032 to obtain the temperature data of the reference chip 1031a multiple times.

The reference chip 1031a is selected from the test chips 1031 of the same batch, and the temperature of the test chips 1031 of the same batch is basically the same.

S202: When the temperature data of the reference chip 1031a is not within the preset temperature range, based on the temperature data of the reference chip 1031a and the preset temperature value, determine the first temperature compensation value for adjusting the temperature of the adapter 101 and the second temperature compensation value for adjusting the temperature of the test socket 102.

When testing the chip 1031 to be tested, the temperature of the chip 1031 to be tested needs to be adjusted to a preset temperature range. In this embodiment, the reference chip 1031a is used as a reference. If the temperature of the reference chip 1031a is within the preset temperature range, the temperature of the chip 1031 to be tested does not need to be adjusted; if the temperature of the reference chip 1031a is not within the preset temperature range, a first temperature compensation value for adjusting the temperature of the adapter 101 and a second temperature compensation value for adjusting the temperature of the test seat 102 need to be determined. The temperature of the reference chip 1031a can be adjusted to a preset temperature range through the first temperature compensation value and the second temperature compensation value. It should be noted that the preset temperature range can be set according to actual needs.

S203: When testing the chip 1031 to be tested, the first temperature adjustment unit 104 is controlled to adjust the temperature of the adapter 101 based on the first temperature compensation value, and the second temperature adjustment unit 105 is controlled to adjust the temperature of the test seat 102 based on the second temperature compensation value, so that the temperature of the chip 1031 to be tested is within the preset temperature range.

In the related art, the temperature of the chip to be tested is adjusted only through the adapter 101. In this embodiment, when the chip to be tested is tested, the first temperature regulating unit 104 is controlled to regulate the temperature of the adapter 101 based on the first temperature compensation value and the second temperature regulating unit 105 is controlled to regulate the temperature of the test socket 102 based on the second temperature compensation value, that is, the temperature is regulated by the adapter 101 and the test socket 102. In addition to using the adapter 101 to regulate the temperature of the chip to be tested 1031, the test socket 102 is also used to regulate the ambient temperature of the chip to be tested 1031. Since the ambient temperature is closer to the actual temperature of the chip to be tested 1031, compared with the related art in which the temperature of the chip to be tested is regulated only by the adapter 101, the temperature regulation accuracy of the chip to be tested in this embodiment is higher.

It should also be noted that the related technology needs to obtain the temperature compensation value of the wafer to be tested and then adjust the temperature in each test process, so the temperature adjustment efficiency of the wafer to be tested is low. In this embodiment, a reference wafer 1031a is selected from the wafers to be tested 1031 of the same batch. Since the temperatures of the wafers to be tested 1031 of the same batch are basically the same, the first temperature compensation value for adjusting the temperature of the adapter 101 and the second temperature compensation value for adjusting the temperature of the test seat 102 can be determined based on the temperature data of the reference wafer 1031a and the preset temperature value. Then, the first temperature compensation value and the second temperature compensation value are used as the temperature adjustment compensation value of the chip 1031 to be tested, and the temperature adjustment compensation value of the chip 1031 to be tested does not need to be obtained again during each test process, thereby improving the temperature adjustment efficiency of the chip 1031 to be tested, thereby also improving the test efficiency of the chip 1031 to be tested.

In some embodiments, as shown in FIG. 3 , based on the temperature data of the reference chip 1031a and the preset temperature value, determining the first temperature compensation value for adjusting the temperature of the adapter 101 includes the following steps.

S301: Based on the temperature data of the reference chip 1031a, obtain the corresponding temperature data curve.

The collected temperature data is discrete data and cannot be directly analyzed. Therefore, the temperature data is processed by a smoothing algorithm to give it curve characteristics and obtain the temperature data curve.

S302: Based on the temperature data curve, obtain the starting temperature value of the chip 1031 to be tested.

S303: Determine the first temperature compensation value based on the starting temperature value and the preset temperature value.

Based on the difference between the starting temperature value and the preset temperature value and the corresponding first proportional coefficient, the first temperature compensation value is determined. The first proportional coefficient is set according to the actual adjustment requirements.

Specifically, as shown in FIG4 , assuming that the starting temperature value is defined as T ₁ , the preset temperature value is defined as P, the difference between the starting temperature value and the preset temperature value is defined as X, and the first proportionality coefficient is defined as M, then X, P and T ₁ satisfy the following relationship: X=PT ₁ , and the first temperature compensation value is defined as A and satisfies the following relationship: A=X*M.

The difference between the starting temperature value and the preset temperature value is multiplied by the first proportional coefficient to obtain a first temperature compensation value, and the first temperature compensation value is used to adjust the temperature of the adapter 101.

In some embodiments, as shown in FIG. 5 , based on the temperature data of the reference chip 1031a and the preset temperature value, determining the second temperature compensation value for adjusting the temperature of the test socket 102 includes the following steps.

S401: Based on the temperature data of the reference chip 1031a, the corresponding temperature data curve is obtained.

The collected temperature data is discrete data and cannot be directly analyzed. Therefore, the temperature data is processed by a smoothing algorithm to give it curve characteristics and obtain the temperature data curve.

S402: Based on the temperature data curve, obtain the average temperature value of the chip 1031 to be tested after the temperature reaches stability.

S403: Determine the second temperature compensation value based on the average temperature value and the preset temperature value.

Based on the difference between the average temperature value and the preset temperature value and the corresponding second proportional coefficient, the second temperature compensation value is determined. The second proportional coefficient is set according to the actual adjustment requirements.

Specifically, as shown in FIG6 , assuming that the average temperature value of the test chip 1031 after the temperature reaches a stable state is defined as T ₂ , the preset temperature value is defined as P, the difference between the average temperature value and the preset temperature value is defined as Y, and the second proportional coefficient is defined as N, then Y, P and T ₂ satisfy the following relationship: Y=PT ₂ , then the second temperature compensation value is defined as B and satisfies the following relationship: B=Y*N.

The difference between the average temperature value and the preset temperature value is multiplied by the second proportional coefficient to determine the second temperature compensation value, and the second temperature compensation value is used to adjust the temperature of the test socket 102.

In some embodiments, the temperature sensor 1032 includes a first temperature sensor 1032a disposed on the adapter 101 and a second temperature sensor 1032b disposed on the test base 102. The first temperature sensor 1032a is used to obtain first temperature data of the reference chip 1031a multiple times, and the second temperature sensor 1032b is used to obtain second temperature data of the reference chip 1031a multiple times. Based on the temperature data of the reference chip 1031a and the preset temperature value, the method for determining the first temperature compensation value for adjusting the temperature of the adapter 101 and the second temperature compensation value for adjusting the temperature of the test socket 102 is: firstly determining the first temperature compensation value based on the first temperature data of the reference chip 1031a and the preset temperature value, and then determining the second temperature compensation value based on the second temperature data of the reference chip 1031a and the preset temperature value.

Specifically, the adapter 101 absorbs the reference chip 1031a, and during the absorption process, the first temperature data of the reference chip 1031a is obtained multiple times using the first temperature sensor 1032a. Based on the first temperature data of the reference chip 1031a and a preset temperature value, a first temperature compensation value is determined, and the temperature of the adapter 101 is adjusted using the first temperature compensation value. The method for determining the first temperature compensation value has been described in the above embodiment and will not be repeated here. After the adapter 101 places the reference chip 1031a on the test seat 102, the second temperature sensor 1032b is used to obtain the second temperature data of the reference chip 1031a multiple times, and the second temperature compensation value is determined based on the second temperature data of the reference chip 1031a and the preset temperature value, and then the temperature of the test seat 102 is adjusted using the second temperature compensation value. The method for determining the second temperature compensation value has been described in the above embodiment and will not be repeated here.

In the above embodiment, the temperature of the adapter 101 is adjusted using the first temperature compensation value during the process of sucking the reference chip 1031a, and the temperature of the test seat 102 is adjusted using the second temperature compensation value after the test chip 1031 is placed in the test chamber 103. Compared with adjusting the temperature of the adapter 101 and the test seat 102 after the test chip 1031 is placed in the test chamber 103, the temperature of the test chip 1031 can be adjusted more quickly. Secondly, the temperature of the adapter 101 is preliminarily adjusted using the first temperature compensation value, and then the temperature of the test seat 102 is finely adjusted using the second temperature compensation value, so that the temperature adjustment is more accurate.

In some embodiments, the temperature sensor 1032 includes a first temperature sensor 1032a disposed on the adapter 101 and a second temperature sensor 1032b disposed on the test base 102. The first temperature sensor 1032a is used to obtain first temperature data of the reference chip 1031a multiple times, and the second temperature sensor 1032b is used to obtain second temperature data of the reference chip 1031a multiple times. Based on the temperature data of the reference chip 1031a and the preset temperature value, the method for determining the first temperature compensation value for adjusting the temperature of the adapter 101 and the second temperature compensation value for adjusting the temperature of the test socket 102 is as follows: based on the first temperature data of the reference chip 1031a and the preset temperature value, the first temperature compensation value is determined, and based on the second temperature data of the reference chip 1031a and the preset temperature value, the second temperature compensation value is determined.

In the above embodiment, after the adapter 101 places the reference chip 1031a into the test socket 102, it obtains the first temperature data, and the test socket 102 obtains the second temperature data at the same time. Since the first temperature compensation value and the second temperature compensation value are used to adjust the temperature of the adapter 101 and the test socket 102 respectively, the adjustment time is shorter.

In some embodiments, the temperature sensor 1032 includes a first temperature sensor 1032a disposed on the adapter 101 and a second temperature sensor 1032b disposed on the test socket 102, the first temperature sensor 1032a is used to obtain first temperature data of the reference chip 1031a multiple times, and the second temperature sensor 1032b is used to obtain second temperature data of the reference chip 1031a multiple times. The method for determining the first temperature compensation value for adjusting the temperature of the adapter 101 and the second temperature compensation value for adjusting the temperature of the test socket 102 based on the temperature data of the reference chip 1031a and the preset temperature value is as follows: firstly determining the second temperature compensation value based on the second temperature data of the reference chip 1031a and the preset temperature value, and then determining the first temperature compensation value based on the first temperature data of the reference chip 1031a and the preset temperature value.

In the above embodiment, by placing the reference chip 1031a into the test chamber 103, the second temperature compensation value is determined according to the second temperature data of the reference chip 1031a, and the temperature of the test seat 102 is adjusted by the second temperature compensation value. Then, the adapter 101 is pressed down to obtain the first temperature data to determine the first temperature compensation value, and the temperature of the adapter 101 is adjusted by the first temperature compensation value, so that the temperature of the chip 1031 to be tested can be accurately adjusted.

It should be understood that, although the steps in the above flowchart are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this application, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the steps in the above flowchart may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed in turn or alternating with other steps or at least a part of the steps or stages in other steps.

The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The above-mentioned embodiments only express several implementation methods of this application, and the description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the invention patent. It should be pointed out that for those with ordinary knowledge in the technical field to which the invention belongs, several variations and improvements can be made without departing from the concept of this application, which are all within the scope of protection of this application. Therefore, the scope of protection of this application patent shall be based on the scope of the attached application patent.

S201~S203: Steps

Claims (9)

A chip temperature adjustment method is used for testing equipment, the test equipment comprising a connector, a test seat arranged in cooperation with the connector, a test chamber formed by the connector and the test seat for placing a chip to be tested, a first temperature adjustment unit for adjusting the temperature of the connector, and a second temperature adjustment unit for adjusting the temperature of the test seat, wherein a temperature sensor is arranged in the test chamber, and the method comprises: using The temperature sensor obtains temperature data of a reference chip for multiple times, wherein the reference chip is selected from the chips to be tested in the same batch; when the temperature data of the reference chip is not within a preset temperature range, a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test seat are determined based on the temperature data of the reference chip and the preset temperature value of the reference chip; and when the temperature data of the reference chip is not within a preset temperature range, a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test seat are determined; When the chip to be tested is tested, the first temperature regulating unit is controlled to regulate the temperature of the adapter based on the first temperature compensation value, and the second temperature regulating unit is controlled to regulate the temperature of the test seat based on the second temperature compensation value, so that the temperature of the chip to be tested is within the preset temperature range; wherein the temperature data of the reference chip and the preset temperature value of the reference chip are used to determine the temperature of the adapter. The first temperature compensation value for adjusting the temperature of the test seat includes: determining the first temperature compensation value based on the difference between the starting temperature value and the preset temperature value and the corresponding first proportional coefficient; the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip includes: determining the second temperature compensation value based on the difference between the average temperature value and the preset temperature value and the corresponding second proportional coefficient. The method of claim 1, wherein the determining of the first temperature compensation value for adjusting the temperature of the adapter based on the temperature data of the reference chip and the preset temperature value of the reference chip comprises: obtaining a corresponding temperature data curve based on the temperature data of the reference chip; obtaining a starting temperature value of the chip to be tested based on the temperature data curve; and determining the first temperature compensation value based on the starting temperature value and the preset temperature value. A method as described in claim 1, wherein determining the first temperature compensation value based on the difference between the starting temperature value and the preset temperature value and the corresponding first proportional coefficient includes: assuming that the starting temperature value is _T1 , the preset temperature value is P, the difference between the starting temperature value and the preset temperature value is X, and the first proportional coefficient is M, then X, P and _T1 satisfy the following relationship: X= _PT1 , and the first temperature compensation value A satisfies the following relationship: A=X*M. As described in claim 1, the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip comprises: obtaining a corresponding temperature data curve based on the temperature data of the reference chip; obtaining an average temperature value after the temperature of the test chip reaches a stable state based on the temperature data curve; and determining a second temperature compensation value based on the average temperature value and the preset temperature value. A method as described in claim 1, wherein determining the second temperature compensation value based on the difference between the average temperature value and the preset temperature value and the corresponding second proportional coefficient includes: assuming that the average temperature value is _T2 , the preset temperature value is P, the difference between the average temperature value and the preset temperature value is Y, and the second proportional coefficient is N, then the Y, the P and the _T2 satisfy the following relationship: Y= _PT2 , then the second temperature compensation value B satisfies the following relationship: B=Y*N. The method as described in any one of claim items 1-5, wherein the temperature sensor includes a first temperature sensor disposed on the adapter and a second temperature sensor disposed on the test seat, the first temperature sensor is used to obtain the first temperature data of the reference chip multiple times, and the second temperature sensor is used to obtain the second temperature data of the reference chip multiple times; the method of determining the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip includes: first determining the first temperature compensation value based on the first temperature data of the reference chip and the preset temperature value, and then determining the second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value. As described in claim 6, the first temperature compensation value is determined based on the first temperature data of the reference chip and the preset temperature value, and the second temperature compensation value is determined based on the second temperature data of the reference chip and the preset temperature value, comprising: using the adapter to absorb the reference chip, using the first temperature sensor to obtain the first temperature data of the reference chip multiple times, and determining the first temperature compensation value based on the first temperature data of the reference chip and the preset temperature value; and after placing the reference chip on the test seat using the adapter, using the second temperature sensor to obtain the second temperature data of the reference chip multiple times, and determining the second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value. A method as described in any one of claim items 1-5, wherein the temperature sensor includes a first temperature sensor disposed on the adapter and a second temperature sensor disposed on the test seat, the first temperature sensor is used to obtain the first temperature data of the reference chip multiple times, and the second temperature sensor is used to obtain the second temperature data of the reference chip multiple times; the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip include: determining the first temperature compensation value based on the first temperature data of the reference chip and the preset temperature value, and determining the second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value. The method as described in any one of claim items 1-5, wherein the temperature sensor includes a first temperature sensor disposed on the adapter and a second temperature sensor disposed on the test seat, the first temperature sensor is used to obtain the first temperature data of the reference chip multiple times, and the second temperature sensor is used to obtain the second temperature data of the reference chip multiple times, and the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test seat based on the temperature data of the reference chip and the preset temperature value of the reference chip is determined, including: firstly determining the second temperature compensation value based on the second temperature data of the reference chip and the preset temperature value, and then determining the first temperature compensation value based on the first temperature data of the reference chip and the preset temperature value.

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