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TW201726279A - 覆Sn銅粉及使用其之導電性糊,以及覆Sn銅粉之製造方法 - Google Patents

覆Sn銅粉及使用其之導電性糊,以及覆Sn銅粉之製造方法 Download PDF

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Publication number
TW201726279A
TW201726279A TW105132138A TW105132138A TW201726279A TW 201726279 A TW201726279 A TW 201726279A TW 105132138 A TW105132138 A TW 105132138A TW 105132138 A TW105132138 A TW 105132138A TW 201726279 A TW201726279 A TW 201726279A
Authority
TW
Taiwan
Prior art keywords
copper powder
coated
copper
dendritic
alloy
Prior art date
Application number
TW105132138A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroshi Okada
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015197813A external-priority patent/JP2017071809A/ja
Priority claimed from JP2015198911A external-priority patent/JP2017071821A/ja
Priority claimed from JP2015198910A external-priority patent/JP2017071820A/ja
Priority claimed from JP2015198914A external-priority patent/JP2017071822A/ja
Priority claimed from JP2015198915A external-priority patent/JP2017071823A/ja
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of TW201726279A publication Critical patent/TW201726279A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C5/00Electrolytic production, recovery or refining of metal powders or porous metal masses
    • C25C5/02Electrolytic production, recovery or refining of metal powders or porous metal masses from solutions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
TW105132138A 2015-10-05 2016-10-05 覆Sn銅粉及使用其之導電性糊,以及覆Sn銅粉之製造方法 TW201726279A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015197813A JP2017071809A (ja) 2015-10-05 2015-10-05 Snコート銅粉及びそれを用いた導電性ペースト、並びにSnコート銅粉の製造方法
JP2015198911A JP2017071821A (ja) 2015-10-06 2015-10-06 Snコート銅粉及びそれを用いた導電性ペースト
JP2015198910A JP2017071820A (ja) 2015-10-06 2015-10-06 Snコート銅粉及びそれを用いた導電性ペースト、並びにSnコート銅粉の製造方法
JP2015198914A JP2017071822A (ja) 2015-10-06 2015-10-06 Snコート銅粉及びそれを用いた導電性ペースト、並びにSnコート銅粉の製造方法
JP2015198915A JP2017071823A (ja) 2015-10-06 2015-10-06 Snコート銅粉及びそれを用いた導電性ペースト、並びにSnコート銅粉の製造方法

Publications (1)

Publication Number Publication Date
TW201726279A true TW201726279A (zh) 2017-08-01

Family

ID=58487800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105132138A TW201726279A (zh) 2015-10-05 2016-10-05 覆Sn銅粉及使用其之導電性糊,以及覆Sn銅粉之製造方法

Country Status (2)

Country Link
TW (1) TW201726279A (ja)
WO (1) WO2017061443A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7143223B2 (ja) * 2017-07-21 2022-09-28 三井金属鉱業株式会社 銅粉、それを用いた光造形物の製造方法、および銅による光造形物
JP2024538419A (ja) 2021-11-22 2024-10-18 ビーエーエスエフ ソシエタス・ヨーロピア ピラゾール型酸化防止剤を含むスズ又はスズ合金電気めっき用組成物
CN114378299B (zh) * 2021-12-30 2023-09-05 安徽壹石通材料科学研究院有限公司 一种核壳结构金属复合材料的制备方法
CN114932336B (zh) * 2022-05-27 2023-05-23 郑州机械研究所有限公司 一种铜磷锌锡焊片及其制备方法和应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4144694B2 (ja) * 2002-11-01 2008-09-03 三井金属鉱業株式会社 スズコート銅粉並びにそのスズコート銅粉の製造方法及びそのスズコート銅粉を用いた導電性ペースト
JP2006225691A (ja) * 2005-02-15 2006-08-31 Mitsui Mining & Smelting Co Ltd スズコート銅粉及び当該スズコート銅粉を用いた導電性ペースト
JP5695879B2 (ja) * 2010-10-25 2015-04-08 石原ケミカル株式会社 スズめっき銅粉の製造方法
EP3187279A4 (en) * 2014-08-26 2018-04-18 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet each of which uses same
KR20170031215A (ko) * 2014-09-12 2017-03-20 스미토모 긴조쿠 고잔 가부시키가이샤 은코팅 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트
JP6274076B2 (ja) * 2014-10-31 2018-02-07 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
JP2016139598A (ja) * 2015-01-26 2016-08-04 住友金属鉱山株式会社 銀コート銅粉、及びそれを用いた銅ペースト、導電性塗料、導電性シート
JP5907301B1 (ja) * 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法

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