TW201632902A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

Disclosed is to provide an electronic component conveyance device and an electronic component inspection device, which is capable of accurately detecting the temperature of the IC device, thereby accurately conducting a test on the IC device. The electronic component conveying device includes: an abutting member 41, which has an insertion hole 410 and abuts on the IC device 90; and a temperature sensor 43, which is arranged in the insertion hole 410 and detects the temperature of the abutting member 41. Furthermore, the abutting member 41 and the temperature sensor 43 are in contact with each other by at least a part. Therefore, the temperature sensor 43 is able to detect the temperature of the IC device 90 via the abutting member 41.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC device has been known, and an electronic component transportation device for transporting an IC device to a holding portion of an inspection portion is assembled in the electronic component inspection device. . At the time of inspection of the IC device, the IC device held by the holding portion of the electronic component transfer device is disposed in the holding portion. Then, the holding portion presses the IC device toward the holding portion. Thereby, the plurality of terminals of the IC device are respectively pressed against the plurality of probe pins provided in the holding portion, and the respective terminals of the IC device are brought into contact with and electrically connected to the respective probe pins.

Further, in the inspection of the IC device, there is a case where the IC device is adjusted to a desired temperature and its inspection is performed. In this case, the temperature is detected by the temperature sensor (temperature detecting unit) provided in the holding portion, and the above-described inspection is performed while confirming whether or not the detected temperature is the desired temperature.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-28923

However, in the electronic component conveying apparatus described in Patent Document 1, since the temperature sensor is disposed at a position relatively far from the holding portion or the holding portion, it is difficult to accurately detect The temperature of the IC device disposed in the holding portion. If the actual temperature of the IC device is different from the temperature detected by the temperature sensor, it is difficult to perform an accurate test of the IC device. As a result, the good product is judged to be a defective product, or the defective product is judged to be a good product.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can accurately detect the temperature of an IC device and can accurately perform an IC device test.

Such an object is achieved by the present invention described below.

[Application Example 1]

An electronic component transporting apparatus according to the present invention includes an electronic component abutting portion having a concave portion and abutting against an electronic component, and a temperature detecting portion disposed in the concave portion and detecting a temperature of the electronic component abutting portion And the electronic component abutting portion is in contact with at least a portion of the temperature detecting portion.

Thereby, the temperature of the electronic component can be accurately detected, so that the inspection of the electronic component can be accurately performed.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, preferably, the temperature detecting unit detects a temperature of the electronic component based on a temperature of the electronic component abutting portion.

Thereby, the temperature of the electronic component can be accurately detected through the electronic component abutting portion.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, it is preferable that the concave portion is opened to abut against the contact surface of the electronic component.

Thereby, the temperature detecting portion can be disposed as close as possible to the abutting surface, and when the temperature of the electronic component is detected, the temperature detecting portion is located as close as possible to the proximal end side of the electronic component. Therefore, the accuracy of temperature detection can be improved.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, it is preferable that the temperature detecting portion is press-fitted into the recessed portion.

Thereby, for example, an adhesive or the like may be omitted between the outer circumferential surface of the temperature detecting portion and the inner circumferential surface of the concave portion. Therefore, the heat of the electronic component can be efficiently transmitted to the temperature detecting portion via the electronic component abutting portion.

[Application 5]

In the electronic component transport apparatus of the present invention, preferably, the inner diameter Φd of the concave portion is 1.5 to 2.5 mm, and the tolerance is -0.02 to -0.01 mm; and the outer diameter ΦD of the temperature detecting portion is 1.5 to 2.5. Mm, the tolerance is 0~0.08mm.

Thereby, the electronic component can be effectively pressed into the recess and fixed.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, it is preferable that the temperature detecting portion does not protrude from the abutting surface.

Thereby, when the abutting surface comes into contact with the electronic component, the temperature detecting portion can be prevented from coming into contact with the electronic component. Therefore, it is possible to prevent the temperature detecting portion and the electronic component from being damaged by contact.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that the temperature detecting portion has a cylindrical outer shape.

Thereby, regardless of the direction of the temperature detecting portion, it can be inserted into the concave portion.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, it is preferable that one end of the temperature detecting portion has a curvature.

Thereby, when the electronic component is inserted into the concave portion, even if one end of the temperature detecting portion is pressed by the finger, the finger can be prevented from being damaged.

[Application Example 9]

In the electronic component transport apparatus of the present invention, preferably, the temperature detecting unit is a platinum sensor.

Thereby, the temperature of the electronic component can be accurately detected.

[Application Example 10]

In the electronic component conveying apparatus of the present invention, it is preferable that the concave portion includes a through hole penetrating the abutting surface and a surface different from the abutting surface.

Thereby, the wiring of the temperature detecting portion can be taken out in a direction different from the abutting surface.

[Application Example 11]

In the electronic component conveying apparatus of the present invention, preferably, the wiring of the temperature detecting portion is formed on a surface opposite to the abutting surface, and is disposed in a groove that communicates with the through hole.

Thereby, when the surface on the opposite side to the contact portion is connected to another structure, the wiring can be housed in the groove. Therefore, it is possible to prevent the wiring from being pressed by the above connection.

[Application Example 12]

In the electronic component conveying apparatus of the present invention, it is preferable that the through hole is orthogonal to the groove.

Thereby, it is possible to prevent the wiring from being bent more than necessary at the boundary portion between the through hole and the groove.

[Application Example 13]

In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component abutting portion contains copper.

Thereby, the thermal conductivity of the electronic component abutting portion can be improved, and the temperature of the electronic component can be accurately detected.

[Application Example 14]

In the electronic component conveying apparatus of the present invention, preferably, the electronic component is offset The connector can be replaced.

Thereby, the inspection of the electronic components can be performed regardless of the type of the electronic component.

[Application Example 15]

An electronic component inspection device according to the present invention includes an electronic component contact portion having a concave portion and abutting against an electronic component, and a temperature detecting portion disposed in the concave portion and detecting a temperature of the electronic component abutting portion; And an inspection unit that inspects the electronic component; and the electronic component abutting portion is in contact with at least a portion of the temperature detecting unit.

Thereby, the temperature of the electronic component can be accurately detected, so that the inspection of the electronic component can be accurately performed.

1‧‧‧Checking device

1A‧‧‧Inspection device

1B‧‧‧Inspection device

3‧‧‧Base

4‧‧‧Hand unit

5‧‧‧ fixture

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧ Temperature Adjustment Department

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department

15‧‧‧Tray transport mechanism

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

31‧‧‧ upper surface

32‧‧‧ lower surface

41‧‧‧Abutment components

41A‧‧‧Abutment components

41B‧‧‧Abutment components

41C‧‧‧Abutment components

42‧‧‧Connected components

43‧‧‧Temperature Sensor

44‧‧‧Wiring

45‧‧‧ bolt

46‧‧‧Connector

47‧‧‧Connector

48‧‧‧Wiring

49‧‧‧ steel plate

50‧‧‧Clamp

51‧‧‧ upper surface

52‧‧‧ recess

61‧‧‧1st partition

62‧‧‧2nd partition

63‧‧‧3rd partition

64‧‧‧4th partition

65‧‧‧5th partition

66‧‧‧ inside partition

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧Back cover

75‧‧‧4th door

80‧‧‧Control Department

90‧‧‧IC devices

90A‧‧‧IC devices

200‧‧‧Tray

410‧‧‧ insertion hole

410A‧‧‧ insertion hole

410B‧‧‧ insertion hole

410a‧‧‧ Inner Week

410b‧‧‧ openings

410c‧‧‧ openings

411‧‧‧ base

411A‧‧‧ longitudinal hole

412‧‧‧ convex

412A‧‧‧ transverse hole

413‧‧‧ upper surface

414‧‧‧ lower surface

415‧‧‧ screw holes

416‧‧ ‧ step department

417‧‧‧ lower surface

418‧‧‧Attraction hole

419‧‧‧ slot

421‧‧‧ upper end

422‧‧‧ lower end

423‧‧‧ screw holes

431‧‧‧Bottom

432‧‧‧The outer part

433‧‧‧ base end

521‧‧‧ bottom

522‧‧‧ Protrusion

523‧‧‧ top

711‧‧‧1st door

712‧‧‧2nd door

721‧‧‧1st door

722‧‧‧2nd door

731‧‧‧1st door

732‧‧‧2nd door

733‧‧‧3rd door

A‧‧‧ arrow symbol

A1‧‧‧Tray supply area

A2‧‧‧Supply area

A3‧‧‧ inspection area

A4‧‧‧Recycling area

A5‧‧‧Tray removal area

Q‧‧‧Hot

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

α‧‧‧Tolerance upper limit

β‧‧‧Tolerance lower limit

ΦD‧‧‧ outside diameter

Φd‧‧‧Inner diameter

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2(a) is a view as seen from the direction of the arrow A in Fig. 1, and (b) is an enlarged cross-sectional view of a portion surrounded by a chain line in (a).

Fig. 3 is a longitudinal sectional view for explaining dimensions of a concave portion and a temperature detecting portion.

Fig. 4 is a view showing a state after replacing the abutting portion of the electronic component.

Fig. 5 is a view showing a method of manufacturing the electronic component inspection device shown in Fig. 1, and showing a cross-sectional view of the wiring insertion step.

Fig. 6 is a view showing a method of manufacturing the electronic component inspection device shown in Fig. 1, and showing a cross-sectional view of the pre-pressing step.

Fig. 7 is a view showing a method of manufacturing the electronic component inspection device shown in Fig. 1, and showing a cross-sectional view of the main press-fitting step.

Fig. 8 is a view showing a method of manufacturing the electronic component inspection device shown in Fig. 1, and showing a cross-sectional view of the main press-in step.

Fig. 9 is a vertical cross-sectional view showing an electronic component abutting portion provided in a second embodiment of the electronic component inspection device of the present invention.

Fig. 10 is a vertical cross-sectional view showing an electronic component abutting portion provided in a third embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on a preferred embodiment shown in the additional drawings.

<First embodiment>

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2(a) is a view as seen from the direction of the arrow A in Fig. 1, and (b) is an enlarged cross-sectional view of a portion surrounded by a chain line in (a). Fig. 3 is a longitudinal sectional view for explaining dimensions of a concave portion and a temperature detecting portion. Fig. 4 is a view showing a state after replacing the abutting portion of the electronic component. Fig. 5 is a view showing a method of manufacturing the electronic component inspection device shown in Fig. 1, and showing a cross-sectional view of the wiring insertion step. Fig. 6 is a view showing a method of manufacturing the electronic component inspection device shown in Fig. 1, and showing a cross-sectional view of the pre-pressing step. 7 and 8 are views showing a method of manufacturing the electronic component inspection device shown in Fig. 1, and showing a cross-sectional view of the main press-fitting step. In the following, for convenience of explanation, as shown in FIGS. 1 , 2 and 4 to 8 (the same applies to FIGS. 9 and 10 ), the three axes orthogonal to each other are set to the X axis, the Y axis, and the Z axis. axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the upstream side of the transport direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Moreover, the "level" as used in the description of the present invention is not limited to a complete level, and includes a state in which it is slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used for inspection/test (hereinafter referred to as "inspection"), for example, a BGA (Ball Grid Array) package or A device for electrical characteristics of an electronic component such as an IC device such as an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), or a CIS (CMOS Image Sensor: CMOS image sensor). In the following, for the sake of convenience of explanation, a case where the IC device is used as the electronic component to be inspected will be described as a representative, and the IC device will be referred to as "IC device 90".

As shown in Fig. 1, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recycling area") A4, and a tray. Area A5 is removed. Then, the IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5 through the above-described respective areas and in the inspection area A3 in the middle. In this manner, the inspection apparatus 1 is formed as an electronic component transport apparatus that transports the IC device 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80. In the inspection apparatus 1, the supply area A2 to the collection area A4 from the tray supply area A1 to the tray removal area A5 may be referred to as a "Delivery area".

Further, the inspection apparatus 1 is disposed on the side on which the tray supply area A1 and the tray removal area A5 are disposed (the lower side in FIG. 1) as the front side, and on the opposite side, that is, the side on which the inspection area A3 is disposed (in FIG. 1). The upper side is used as the back side.

The tray supply area A1 supplies a supply unit of a tray (arrangement member) 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC devices 90 disposed on the tray 200 from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply area A2, a temperature adjustment unit (soaking plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided.

The temperature adjustment unit 12 mounts a plurality of mounting portions of the IC device 90, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjustment portions 12 are disposed and fixed in the Y direction. Then, the IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12 and placed.

The device transfer head 13 is supported to be movable within the supply area A2. Thereby, the device transfer head 13 can carry the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 to be described later. Transfer.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC devices 90 are removed in the supply region A2 in the X direction. Then, after the transfer, the empty tray 200 is transported back to the tray supply area A1 from the supply area A2 by the tray transport mechanism 11B.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transfer head 17, and a device collection unit (recycling shuttle) 18 are provided.

The device supply unit 14 mounts the mounting portion of the temperature-adjusted IC device 90, and can transport the IC device 90 to the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable between the supply region A2 and the inspection region A3 in the X direction. Further, in the configuration shown in FIG. 1, two device supply units 14 are disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to any of the device supply units 14 and placed thereon.

The inspection unit 16 is a unit that inspects/tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 in a state in which the IC device 90 is held. Further, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the inspection of the IC device 90 is performed via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 16. Further, in the inspection unit 16, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device can be heated. The piece 90 is adjusted to a temperature suitable for inspection.

The device transfer head 17 is supported to be movable within the inspection area A3. Thereby, the device transfer head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply region A2 to the inspection unit 16 and mount it.

The device recovery unit 18 is placed on the mounting portion of the IC device 90 after the inspection by the inspection unit 16, and the IC device 90 can be transported to the recovery area A4. The device recovery portion 18 is supported to be movable between the inspection region A3 and the recovery region A4 in the X direction. Further, in the configuration shown in FIG. 1, in the same manner as the device supply unit 14, two device collection units 18 are disposed in the Y direction, and the IC device 90 on the inspection unit 16 is transferred to the device recovery unit of either one. 18 and placed. This transfer is performed by the device transfer head 17.

The recovery area A4 is a region of a plurality of IC devices 90 after the end of the inspection. In the collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism (second transfer device) 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.

The collection tray 19 is mounted on the mounting portion of the IC device 90, and is fixed in the recovery area A4. In the configuration shown in FIG. 1, three are arranged in the X direction. Moreover, the empty tray 200 is also placed on the mounting portion of the IC device 90, and three are arranged in the X direction. Then, the IC device 90 moved to the device recovery unit 18 of the recovery area A4 is transported to any of the recovery trays 19 and the empty trays 200 and placed thereon. Thereby, the IC device 90 is separately recovered and classified for each inspection result.

The device transfer head 20 is supported to be movable within the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction in the collection area A4. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be any one of the above three empty trays 200. In the inspection apparatus 1 as described above, the tray conveyance mechanism 21 is provided in the collection area A4. Further, a tray transport mechanism 15 is provided in the supply area A2. By this, the transport of the empty tray 200 to the X direction is performed by, for example, one transport mechanism, and the throughput (the number of transports of the IC device 90 per unit time) can be improved.

In addition, the configuration of the tray transport mechanisms 15 and 21 is not particularly limited, and examples thereof include a suction member having the adsorption tray 200 and a support mechanism such as a ball screw that supports the adsorption member in the X direction.

The tray removal area A5 is a material removal unit that collects and removes the tray 200 of the plurality of IC devices 90 in which the inspection state is completed. In the tray removal area A5, a plurality of trays 200 can be stacked.

Moreover, the tray conveyance mechanisms 22A and 22B of the transfer trays 200 are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the IC device 90 for inspection is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the tray 200 for collecting the empty space of the IC device 90 from the tray removal area A5 to the collection area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray transport mechanisms 11A and 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, the device transport head 17, the device recovery unit 18, and the device transport head 20. The tray transport mechanism 21 and the respective portions of the tray transport mechanisms 22A and 22B are driven.

In addition, the inspection control unit of the tester performs inspection of electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

In the inspection apparatus 1 as described above, the device transfer head 13, the device supply unit 14, and the device transfer head 17 are configured to heat or cool the IC device 90 in addition to the temperature adjustment unit 12 or the inspection unit 16. Thereby, the IC device 90 is kept stationary while being transported.

As shown in FIG. 1, the inspection apparatus 1 is partitioned (separated) between the tray supply area A1 and the supply area A2 by the first partition plate 61, and the second partition 62 divides between the supply area A2 and the inspection area A3. By dividing the inspection area A3 and the recovery area A4 by the third partition 63, by the The partition plate 64 divides between the recovery area A4 and the tray removal area A5. Further, the supply area A2 and the recovery area A4 are also divided by the fifth partition plate 65. These separators have a function of maintaining the airtightness of each region. Further, the outermost layer of the inspection device 1 is covered with a cover, and among the covers, there are, for example, a front cover 70, side covers 71 and 72, and a rear cover 73.

Further, the supply region A2 is the first chamber R1 partitioned by the first partition plate 61, the second partition plate 62, the fifth partition plate 65, the side cover 71, and the rear cover 73. In the first chamber R1, a plurality of IC devices 90 in an unchecked state are carried in together with the tray 200.

The inspection area A3 is the second chamber R2 partitioned by the second partition 62, the third partition 63, and the rear cover 73. Further, in the second chamber R2, the inner partition plate 66 is disposed inside the rear cover 73.

The recovery area A4 is the third chamber R3 partitioned by the third partition plate 63, the fourth partition plate 64, the fifth partition plate 65, the side cover 72, and the rear cover 73. In the third chamber R3, a plurality of IC devices 90 that have been inspected are carried in from the second chamber R2.

As shown in FIG. 1, the side door 71 is provided with a first door (left side first door) 711 and a second door (left side second door) 712. By opening the first door 711 or the second door 712, for example, maintenance in the first chamber R1 or release of the pressing of the IC device 90 can be performed (hereinafter, collectively referred to as "work"). Further, the first shutter 711 and the second shutter 712 are so-called "double doors" that are opened and closed in opposite directions. Further, during the operation in the first chamber R1, the movable portion such as the device transfer head 13 in the first chamber R1 is stopped.

Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 or the second door 722, for example, the work in the third chamber R3 can be performed. Further, the first shutter 721 and the second shutter 722 are also referred to as "double doors" which are opened and closed in opposite directions. Further, during the operation in the third chamber R3, the movable portion such as the device transfer head 20 in the third chamber R3 is stopped.

Further, the rear cover 73 is also provided with a first door (the first door on the back side) 731, a second door (the second door on the back side) 732, and a third door (the third door on the back side). ) 733. By opening the first door 731, for example, the work in the first chamber R1 can be performed. By opening the third door 733, For example, work in the third chamber R3 can be performed. Further, a fourth shutter 75 is provided on the inner partition plate 66. Further, by opening the second door 732 and the fourth door 75, for example, the work in the second chamber R2 can be performed. Further, the first shutter 731, the second shutter 732, and the fourth shutter 75 are connected in the same direction, and the third shutter 733 is opened and closed in the opposite direction to the shutters. Further, during the operation in the second chamber R2, the movable portion such as the device transfer head 17 in the second chamber R2 is stopped.

Moreover, by closing each of the shutters, airtightness or heat insulation in the respective chambers can be ensured.

Next, the device transfer head 17 will be described in detail.

As shown in FIG. 2(a), the device transfer head 17 has a susceptor 3 and a plurality of hand units 4 disposed on the susceptor 3 and abutting against the IC device 90.

The base 3 has a plate shape, and its upper surface 31 is fixed to a moving frame (not shown). A plurality of hand units 4 are disposed on the lower surface 32 of the base 3.

Since each hand unit 4 has the same configuration, one hand unit 4 will be representatively described below.

The hand unit 4 shown in FIG. 2(b) has an abutting member (electronic component abutting portion) 41 that abuts on the IC device 90, and a connecting member 42 that connects the abutting member 41 and the susceptor 3, and is disposed at abutment A temperature sensor (temperature detecting portion) 43 of the member 41 is connected.

The connecting member 42 has a quadrangular shape in outer shape. Further, the connecting member 42 has its upper end surface 421 fixed to the base lower surface 32, and the lower end surface 422 is detachably coupled to the abutting member 41. Further, the coupling member 42 has a screw hole 423 that is open at the lower end surface 422 thereof.

The abutting member 41 has a block-shaped base portion 411 and a convex portion 412 which is formed to protrude from the lower surface 414 of the base portion 411.

The base portion 411 has a quadrangular shape when viewed from the lower side. Further, the base portion 411 has a screw hole 415 formed at a position different from the convex portion 412 and formed from the upper surface 413 of the base portion 411 to the lower surface 414. The screw hole 415 is in communication with the screw hole 423. The screw holes 415 and the screw holes 423 are detachably fixed to the abutting member 41 and the connecting member by the unified insertion/threading bolt 45. 42.

Further, in the screw hole 415, a step portion 416 in which the inner diameter abruptly changes in the axial direction is formed. By the step portion 416, the insertion limit of the bolt 45 toward the screw hole 415 is restricted.

The convex portion 412 has a quadrangular shape when viewed from the lower side. Further, the lower surface (top portion) 417 of the convex portion 412 is a surface that abuts on the IC device 90 when the above inspection is performed.

Such an abutment member 41 has a suction hole 418 formed from the upper surface 413 of the base portion 411 to the lower surface 417 of the convex portion 412. The suction hole 418 has a circular cross-sectional shape as shown in the auxiliary cross-sectional view of FIG. 2(b), and is formed at a substantially central portion of the lower surface 417 of the convex portion 412 when viewed from the lower side.

The suction hole 418 is connected to a suction pump (not shown), and the IC device 90 can be attracted to the lower surface 417 of the convex portion 412 by the action of the suction pump.

Further, the abutting member 41 has an insertion hole (recess) 410 into which the temperature sensor 43 is inserted. The insertion hole 410 has a circular cross-sectional shape. The insertion hole 410 is formed by a through hole penetrating from the lower surface 417 of the convex portion 412 to the upper surface 413 of the base portion 411. Thereby, the temperature sensor 43 can be inserted into the insertion hole 410 from either the upper side or the lower side. Further, the temperature sensor 43 may be inserted into the insertion hole 410, and the wiring 44 connected to the upper end of the temperature sensor 43 may be led out to the outside of the insertion hole 410.

Further, the abutting member 41 has a groove 419 which is open on the upper surface 413 of the base portion 411. The groove 419 extends in the x-axis direction, and the left end (one end) communicates with the insertion hole 410. Thereby, the wiring 44 led out from the insertion hole 410 can be disposed in the groove 419. Therefore, it is possible to prevent the wiring 44 from being pressed in a state where the abutting member 41 is connected to the connecting member 42.

Further, the insertion hole 410 is orthogonal to the groove 419. Thereby, it is possible to prevent the wiring 44 from being excessively bent at the boundary portion between the insertion hole 410 and the groove 419. Therefore, disconnection of the wiring 44 can be prevented.

The constituent material of the contact member 41 is not particularly limited, and examples thereof include various metals such as iron, nickel, cobalt, gold, platinum, silver, copper, aluminum, magnesium, titanium, and tungsten, or the like. At least one alloy or intermetallic compound, and further examples of the metals Oxides, nitrides, carbides, and the like. It is convenient for them, especially silver or copper, because the thermal conductivity is relatively high, so the heat Q of the IC device 90 can be easily transmitted to the temperature sensor 43.

Further, on the surface of the contact member 41, it is preferable to form an oxidation resistant film which prevents oxidation of the contact member 41. By providing such an oxidation resistant film, the abutting member 41 can be prevented from being oxidized, so that the temperature sensor 43 can accurately detect the temperature of the IC device 90.

The anti-oxidation film is made of, for example, a metal such as Ni, Co, Cr, W, Au, Pt, Zn, or Mo, or an alloy containing one or more of these metals. That is, it is preferable to use Ni, Pt, Mo or an alloy mainly composed of an oxide (pseudo oxide) at a high temperature.

Further, the anti-oxidation film can be formed by a method such as electroplating, immersion plating, electroless plating, vapor deposition, sputtering, CVD, or the like as described above.

As shown in FIG. 2, a temperature sensor 43 is inserted into the insertion hole 410. The temperature sensor 43 has a cylindrical shape. Thereby, when the temperature sensor 43 is inserted into the insertion hole 410, the radial direction of the temperature sensor 43 can be inserted.

Further, the temperature sensor 43 does not protrude from the lower surface 417 of the convex portion 412. That is, the lower end (front end) 431 of the temperature sensor 43 is located on the upper side than the lower surface 417 of the convex portion 412. Thereby, as shown in FIG. 2, even if the lower surface 417 of the convex portion 412 is in contact with the IC device 90, the temperature sensor 43 can be prevented from coming into direct contact with the IC device 90. Therefore, it is possible to prevent the temperature sensor 43 and the IC device 90 from being damaged during the inspection.

Also, the lower end 431 of the temperature sensor 43 has a curvature, that is, a circularity. Thereby, when the IC device 90 is inserted into the insertion hole 410, even if the lower end 431 of the temperature sensor 43 is pressed with a finger, the finger can be prevented from being damaged.

In the inspection apparatus 1, when the lower surface 417 of the convex portion 412 abuts against the IC device 90, the heat Q is transmitted between the IC device 90 and the temperature sensor 43 via the convex portion 412. Thereby, the temperature sensor 43 can detect the temperature of the IC device 90.

Further, one end of the wiring 44 is connected to the upper end portion of the temperature sensor 43. Further, at the other end of the wiring 44, a connector 46 is provided, and the connector 46 is connected to the connector. 47. The connector 47 is disposed on the steel plate 49 fixed to the side surface of the base 3, and the wiring 48 is connected to the side opposite to the connector 46. The wiring 48 is electrically connected to the control unit 80.

Further, the wiring 44 is fixed to the connecting member 42 by the jig 50. Thereby, the position in the middle of the wiring 44 can be restricted, and the wiring 44 can be prevented from becoming an obstacle of other members. Further, the fixing and liberation of the connecting member 42 by the jig 50 can be easily realized, and the replacement work of the abutting member 41 is not particularly troublesome.

The temperature sensor 43 is not particularly limited, and for example, a platinum sensor can be used. Thereby, the temperature of the IC device 90 can be accurately detected.

Here, the outer peripheral portion 432 of the temperature sensor 43 is in direct contact with the inner peripheral portion 410a of the insertion hole 410. Therefore, the adhesive can be omitted as compared with the case where an adhesive or the like is interposed between the outer peripheral portion 432 of the temperature sensor 43 and the inner peripheral portion 410a of the insertion hole 410, so that the conduction efficiency of the heat Q can be improved. . Thereby, the temperature of the convex portion 412 can be accurately detected. By considering the detected temperature as the temperature of the IC device 90, the temperature of the IC device 90 can be detected.

Further, as shown in FIG. 2, the temperature sensor 43 is pressed into the insertion hole 410. By this means, for example, the temperature sensor 43 can be simply fixed to the insertion hole 410 while arranging, for example, an adhesive or the like between the outer peripheral portion 432 of the temperature sensor 43 and the inner peripheral portion 410a of the insertion hole 410. .

As shown in FIG. 3, the outer diameter ΦD of the temperature sensor 43 is about 1.5 to 2.5 mm. Further, the tolerance of the outer diameter ΦD is about 0.08 mm, and the lower limit β is about 0 mm.

Further, the inner diameter Φd of the insertion hole 410 is about 1.5 to 2.5 mm. The tolerance of the inner diameter Φd is about -0.01 mm, and the lower limit β is about -0.02 mm.

With this configuration, the temperature sensor 43 can be pressed into the insertion hole 410, and the temperature sensor 43 can be fixed in the insertion hole 410.

In the inspection apparatus 1 as described above, since the temperature sensor 43 is in direct contact with the abutting member 41, the thermal conductivity between the temperature sensor 43 and the abutting member 41 can be improved. Thereby, the heat Q of the IC device 90 can be efficiently transmitted to the temperature sensor 43 via the abutment member 41. because Thus, the temperature of the IC device 90 can be accurately detected by the temperature sensor 43. As a result, it is possible to accurately judge whether it is a good product or a defective product.

Moreover, as shown in FIG. 4, in each hand unit 4, the contact member 41 is detachable with respect to the connection member 42. Thereby, the abutting member 41 can be detached from the state shown in FIG. 2, and the abutting member 41C having the lower surface 417 of the convex portion 412 larger than the abutting member 41 can be attached to the connecting member 42. Therefore, inspection of the IC device 90A larger than the IC device 90 can be performed. As described above, in each of the hand units 4, since the contact member 41 can be replaced with the contact member 41C in accordance with the size (type) of the IC device 90, the inspection can be performed regardless of the size of the IC device.

Next, the method of manufacturing the hand unit 4 will be described. However, since the portion other than the step of inserting the temperature sensor 43 into the insertion hole 410 can be manufactured by a known method, the description thereof will be omitted.

The manufacturing method has a wiring insertion step, a pre-pressing step, and a final pressing step. First, before describing these steps, the jig 5 used in the formal press-in step will be described.

As shown in FIG. 7, the jig 5 has a block shape and has a concave portion 52 whose upper surface 51 is open. The recess 52 is sized to allow the projection 412 of the abutment member 41 to be inserted. Further, a protrusion 522 is formed to protrude from the bottom portion 521 of the recess 52. The protrusion 522 has a cylindrical shape and is formed to a size that can be inserted into the insertion hole 410.

[Wiring insertion step]

First, as shown in FIG. 5, the abutting member 41 is prepared, and the wiring 44 connected to the temperature sensor 43 is inserted into the insertion hole 410 of the abutting member 41. This insertion is performed from the opening 410b on the lower surface 417 side of the convex portion 412 in a state where the connector 46 is detached from the wiring. Then, after the end of the wiring 44 protrudes from the opening 410c on the upper surface 413 side of the base portion 411, the connector 46 is attached to the end portion. At this time, the temperature sensor 43 has not been inserted into the insertion hole 410 but below the convex portion 412.

[Pre-press step]

Next, as shown in FIG. 6, the base end portion 433 of the temperature sensor 43 is inserted (pre-pressed) from the opening 410b of the insertion hole 410. This pre-pressing is performed by pressing the lower end 431 of the temperature sensor 43 with a finger. As described above, since the lower end 431 of the temperature sensor 43 holds the roundness, it is possible to prevent finger damage or the like.

The length of the pressed portion of the temperature sensor 43 in the pre-pressing step is not particularly limited, and the temperature sensor 43 does not fall off the insertion hole 410 as long as the pre-pressing is performed and the finger is separated. .

[Formal press step]

Next, as shown in FIG. 7, the jig 5 is disposed below the abutting member 41. At this time, the jig 5 is disposed such that the lower end 431 of the temperature sensor 43 is supported by the top 523 of the protrusion 522.

Then, as shown in FIG. 8, the jig 5 is pressed toward the abutting member 41 side. This pressing is performed until the bottom portion 521 of the concave portion 52 abuts against the lower surface 417 of the convex portion 412. By this pressing, the temperature sensor 43 moves upward together with the jig 5, and is pressed into the insertion hole 410.

Further, in a state after the above pressing is completed, the projection 522 of the jig 5 enters the insertion hole 410. Thereby, it is possible to set the state in which the temperature sensor 43 does not protrude from the opening 410b on the lower side of the insertion hole 410.

Thus, by using the jig 5, the temperature sensor 43 can be easily and accurately inserted into the insertion hole 410.

<Second embodiment>

Fig. 9 is a vertical cross-sectional view showing an electronic component abutting portion provided in a second embodiment of the electronic component inspection device of the present invention.

In the following, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted. .

This embodiment is different from the first aspect except that the configuration of the electronic component abutting portion is different. The embodiment is the same.

As shown in FIG. 9, in the abutting member 41A of the inspection apparatus 1A, the insertion hole 410A can be divided into a longitudinal hole 411A extending in the z-axis direction and a lateral hole 412A extending in the x-axis direction.

The longitudinal hole 411A is inserted into a portion of the temperature sensor 43. The longitudinal hole 411A is open on the lower side of the lower surface 417 of the convex portion 412, and the upper side is located near the boundary between the base portion 411 and the convex portion 412. Further, the upper side of the longitudinal hole 411A communicates with the lateral hole 412A.

The lateral hole 412A is inserted through the portion of the wiring 44. The lateral hole 412A is in one side communicating with the longitudinal hole 411A, and the other side is open on the outer surface of the convex portion 412.

As described above, in the inspection apparatus 1A, the insertion hole 410A is formed by a through hole that is bent midway. When the insertion hole 410A is connected to the connection member 42 while maintaining the state shown in FIG. 9, the wire 44 can be prevented from being interposed between the lower end surface 422 of the coupling member 42 and the upper surface 413 of the base portion 411. Therefore, it is possible to reliably prevent the wire 44 from being crushed or broken during the attaching and detaching operation of the abutting member 41A.

<Third embodiment>

Fig. 10 is a vertical cross-sectional view showing an electronic component abutting portion provided in a third embodiment of the electronic component inspection device of the present invention.

In the following, the third embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted. .

This embodiment is the same as the above-described first embodiment except that the configuration of the electronic component abutting portion is different.

As shown in FIG. 10, in the abutting member 41B of the inspection apparatus 1B, the insertion hole 410B is constituted by a lateral hole extending in the x-axis direction. The insertion hole 410B is formed by a through hole that does not communicate with the suction hole 418 but intersects with the suction hole 418. The temperature sensor 43 is laterally inserted into such an insertion hole 410B.

The contact member 41B and the abutting member 41 or the second embodiment in the first embodiment The temperature sensor 43 as a whole can be disposed relatively close to the lower surface 417 of the convex portion 412 as compared with the abutting member 41A in the embodiment. Thereby, the heat Q of the IC device 90 can be more efficiently transmitted to the temperature sensor 43 via the convex portion 412. Therefore, the inspection apparatus 1B can detect the temperature of the IC device 90 more accurately.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above with reference to the embodiments shown in the drawings, the present invention is not limited thereto, and the respective components constituting the electronic component conveying device and the electronic component inspection device may be replaced with the same. Any member who performs the same function. Further, any constituent may be added.

Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be combined with any two or more of the configurations (characteristics) of the above embodiments.

Further, in the above-described embodiments, the inner circumferential surface of the outer circumferential surface of the temperature detecting portion and the concave portion of the electronic component abutting portion are in contact with the entire circumference. However, the present invention is not limited thereto, and for example, the same At least a part of the contact can exert the effects of the present invention.

3‧‧‧Base

4‧‧‧Hand unit

17‧‧‧Device transfer head

31‧‧‧ upper surface

32‧‧‧ lower surface

41‧‧‧Abutment components

42‧‧‧Connected components

43‧‧‧Temperature Sensor

44‧‧‧Wiring

45‧‧‧ bolt

46‧‧‧Connector

47‧‧‧Connector

48‧‧‧Wiring

49‧‧‧ steel plate

50‧‧‧Clamp

90‧‧‧IC devices

410‧‧‧ insertion hole

410a‧‧‧ Inner Week

410b‧‧‧ openings

410c‧‧‧ openings

411‧‧‧ base

412‧‧‧ convex

413‧‧‧ upper surface

414‧‧‧ lower surface

415‧‧‧ screw holes

416‧‧ ‧ step department

417‧‧‧ lower surface

418‧‧‧Attraction hole

419‧‧‧ slot

421‧‧‧ upper end

422‧‧‧ lower end

423‧‧‧ screw holes

431‧‧‧Bottom

432‧‧‧The outer part

433‧‧‧ base end

Q‧‧‧Hot

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Claims (15)

An electronic component conveying apparatus comprising: an electronic component abutting portion having a concave portion and abutting against an electronic component; and a temperature detecting portion disposed in the concave portion and detecting a temperature of the electronic component abutting portion; Further, the electronic component abutting portion is in contact with at least a part of the temperature detecting portion. The electronic component transporting apparatus of claim 1, wherein the temperature detecting unit detects a temperature of the electronic component based on a temperature of the electronic component abutting portion. The electronic component transporting apparatus according to claim 1 or 2, wherein the concave portion is open to abutting on an abutting surface of the electronic component. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the temperature detecting portion is press-fitted into the concave portion. The electronic component conveying device of claim 4, wherein the inner diameter Φd of the concave portion is 1.5 to 2.5 mm, the tolerance is -0.02 to -0.01 mm; and the outer diameter ΦD of the temperature detecting portion is 1.5 to 2.5 mm, and the tolerance thereof is It is 0~0.08mm. The electronic component conveying apparatus according to any one of claims 1 to 5, wherein the temperature detecting portion does not protrude from the abutting surface. The electronic component conveying apparatus according to any one of claims 1 to 6, wherein the temperature detecting portion has a cylindrical shape. The electronic component conveying apparatus according to any one of claims 1 to 7, wherein one end of the temperature detecting portion has a curvature. The electronic component transporting apparatus according to any one of claims 1 to 8, wherein the temperature detecting section is a platinum sensor. The electronic component transporting apparatus according to any one of claims 1 to 9, wherein the recessed bag A through hole penetrating through the abutting surface and a surface different from the abutting surface. The electronic component conveying apparatus according to claim 10, wherein the wiring of the temperature detecting portion is formed on a surface opposite to the abutting surface, and is disposed in a groove that communicates with the through hole. The electronic component transport apparatus of claim 10 or 11, wherein the through hole is orthogonal to the groove. The electronic component transporting apparatus according to any one of claims 1 to 12, wherein the electronic component abutting portion contains copper. The electronic component transporting apparatus according to any one of claims 1 to 13, wherein the electronic component abutting portion is replaceable. An electronic component inspection device comprising: an electronic component contact portion having a concave portion and abutting against an electronic component; and a temperature detecting portion disposed in the concave portion and detecting a temperature of the electronic component abutting portion; An inspection unit that inspects the electronic component; and the electronic component abutting portion is in contact with at least a portion of the temperature detecting portion.