TWI875362B - Pressing mechanism, testing device, and processing machine - Google Patents

Abstract

The pressing mechanism includes a supporter, a first processing member, a second processing member and a temperature detecting unit. The first processing member is disposed on the supporter, and the second processing member is detachably disposed on the first processing member and has a contact face to press the electronic component. The temperature detecting unit has a first conduction member and a second conduction member which are disposed of the first processing member and the second processing member respectively. The first conduction member and the second conduction member are electrically connected to a first electrical control member and a temperature detecting member. The temperature detecting member detects the temperature of the electronic component. Due to the connection of the first and the second conduction members, the signal of temperature is transmitted to the electrical control device via the first electrical control member from the temperature detecting member.

Description

Joining mechanism, testing device and operating machine

The present invention provides a joining mechanism which is advantageous for space configuration, convenient for repairing and replacing a second operating device, and improves temperature sensing accuracy.

At present, please refer to Figure 1. The testing device 10 is equipped with a plurality of electrically connected circuit boards 11 and test sockets 12 on the machine for testing electronic components 13. A joint mechanism is arranged above the test socket 12. The joint mechanism is equipped with a plurality of rows of floats 15 on the pressing arm 14. Each row is equipped with a plurality of floats 15. The bottom of each float 15 is equipped with a pressing fixture 16 for pressing the electronic components 13. Since the electronic components 13 will generate high temperature during the testing process, in order to know whether the electronic components 13 perform the testing operation at the preset test temperature, the industry has equipped a temperature sensor 17 on the pressing fixture 16 to sense the temperature of the electronic components 13.

However, to test electronic components 13 of different sizes, it is necessary to use pressing fixtures 16 of different sizes. Therefore, the temperature sensing element 17 in each of the multiple rows of pressing fixtures 16 is connected to a socket 18 by a line. The socket 18 can be plugged into and unplugged from a plug 19 of an electronic control device (not shown) to replace the pressing fixture 16. After the pressing fixture 16 is assembled on the float 15, the socket 18 of the temperature sensing element 17 is plugged into the plug 19 of the electronic control device to electrically connect the temperature signal sensed by the temperature sensing element 17 to the electronic control device for analysis and judgment of whether the temperature of the electronic component 13 exceeds the preset test temperature.

However, the sockets 18 of the multiple rows of pressing fixtures 16 are large in size, and it is necessary to reserve operating space for the workers' hands between the multiple rows of pressing fixtures 16, resulting in the need for a larger distance between two adjacent floats 15 and considerable waste of space, so that the pressing arm 14 cannot be equipped with more floats 15 and pressing fixtures 16, thereby failing to improve production efficiency.

On the contrary, if the distance between two adjacent floaters 15 in multiple rows is reduced, the operating space for the workers will be limited, especially for the multiple pressing fixtures 16 in the middle row, it will be more difficult to repair and replace the pressing fixtures 16 and plug and unplug the sockets 18, causing inconvenience in use.

Furthermore, if the temperature sensing element 17 is mounted on the float 15, although it can avoid configuring the socket 18 on the pressing fixture 16, it increases the sensing distance of the temperature sensing element 17, thereby reducing the accuracy of the sensed temperature, and thus cannot effectively ensure the test quality of the electronic component 13.

The first object of the present invention is to provide a bonding mechanism, comprising a mounting device, a first operating device, a second operating device and a temperature sensing unit, wherein the first operating device is mounted on the mounting device, the second operating device can be mounted on the first operating device, and is provided with a bonding surface for bonding electronic components, the temperature sensing unit comprises a first electrical component, a temperature sensing component, a first conductive component and a second conductive component, the first electrical component can be electrically connected to the electronic control device, the temperature sensing component is mounted on the bonding surface of the second operating device to sense the temperature of the electronic component, the first conductive component is mounted on the first operating device, and is electrically The first electrical component is electrically connected to the second conductive part, and the second conductive part is assembled on the second operator and electrically connected to the temperature sensing part. The second conductive part can be connected to or separated from the first conductive part. When the second operator is assembled to the first operator, the first conductive part and the second conductive part are connected to each other, so that the temperature sensing part is quickly electrically connected and transmits the sensed temperature signal to the first electrical component. The first electrical component transmits the temperature signal to the electronic control device, thereby achieving the practical benefit of improving the convenience of use.

The second object of the present invention is to provide a joint mechanism, wherein the temperature sensing unit can transmit the temperature signal of the temperature sensing component to the first electronic component by connecting the first conductive component of the first operator and the second conductive component of the second operator. It is not necessary to reserve a larger operating space and socket accommodation space around the first operator and the second operator, thereby effectively shortening the distance to facilitate space configuration and the addition of the first and second operators, thereby achieving the practical benefit of improving production efficiency.

The third object of the present invention is to provide a joint mechanism, wherein the temperature sensing unit can transmit the temperature signal of the temperature sensing component to the first electronic component by connecting the first conductive component of the first operator with the second conductive component of the second operator. There is no need to configure a socket or other components on the second operator, so that the first electronic component can be plugged in and out of the electronic control device outside the first operator, thereby improving the convenience of maintenance operations for workers.

The fourth object of the present invention is to provide a joint mechanism, wherein the temperature sensing unit is connected to the first conductive member of the first operator and the second conductive member of the second operator. There is no need to configure a socket or other components on the second operator, and the temperature sensing component can be configured on the second operator to effectively shorten the sensing distance, thereby improving the accuracy of the temperature-sensitive electronic component and achieving the practical benefit of ensuring the quality of electronic component testing.

The fifth object of the present invention is to provide a testing device, including a testing mechanism and the bonding mechanism of the present invention, wherein the testing mechanism is provided with at least one tester for testing electronic components; the bonding mechanism of the present invention includes a mounting device, at least one first operator, at least one second operator and at least one temperature sensing unit for crimping and sensing the temperature of the electronic components of the tester.

The sixth object of the present invention is to provide an operating machine, comprising a machine, a feeding device, a receiving device, a testing device of the present invention, a conveying device and a central control device, wherein the feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiver for accommodating at least one electronic component that has been tested; the testing device of the present invention is arranged on the machine and is provided with a testing mechanism and a bonding mechanism for testing and temperature sensing electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying electronic components; the central control device is used to control and integrate the actions of each device to perform automated operations.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

Please refer to FIGS. 2 and 3 , the bonding mechanism of the present invention includes a mounting device 21 , at least one first operating device, at least one second operating device and at least one temperature sensing unit.

According to the operation requirements, the joint mechanism further includes a mounting driver (not shown), and the mounting driver is used to drive the mounting device 21 to move in at least one direction.

The mounting device 21 is a fixed configuration or a movable configuration; for example, the mounting device 21 is a fixed frame for the tester (not shown) to make a relative displacement toward the mounting device 21; for example, the mounting device 21 is driven by a mounting driver (not shown) to make a displacement in at least one direction, so that the mounting device 21 makes a relative displacement toward the tester. Furthermore, the mounting driver is a cylinder, a linear motor, or includes a motor and at least one transmission group, and the transmission group is a belt pulley group or a screw screw seat group. In this embodiment, the mounting device 21 is a movable transfer arm, and the joint mechanism is provided with a mounting driver (not shown) to drive the mounting device 21 to make a displacement in the Y-Z direction.

At least one first operating device is mounted on the mounting device 21. Furthermore, the first operating device can be directly mounted on the mounting device 21, or mounted on at least one connecting plate, and the connecting plate is mounted on the mounting device 21, so that the first operating device is indirectly mounted on the mounting device 21. According to the operation requirements, the first operating device can include a floating device and/or a temperature control device. In this embodiment, a connecting plate 22 is provided on the bottom surface of the mounting device 21, and at least one first operator is assembled on the bottom surface of the connecting plate 22. The at least one first operator includes a plurality of rows of first operators, and each row is provided with a plurality of first operators. The first operator includes a floater 23 and a temperature control device. The floater 23 can allow the electronic component to float and move, and defines a first surface 231 on the bottom surface. The temperature control device is a heating element, a cooling chip or a seat with a fluid for temperature control of the electronic component. In this embodiment, the temperature control device is a heating element 24, and is assembled inside the floater 23.

At least one second operator can be mounted and disassembled on the first operator for joining electronic components. According to the operation requirements, the second operator is used for pressing electronic components, or transferring and pressing electronic components. A plurality of first operators are assembled with a plurality of second operators. In this embodiment, at least one second operator includes a plurality of second operators, each of which is a pressing fixture 25, and the pressing fixture 25 can be assembled or disassembled on the floating device 23 by at least one coupling member (not shown); further, the coupling member can be a bolt, a buckle or a magnetic member; the top surface of the pressing fixture 25 is defined as a second surface 251, and relative to the first surface 231 of the floating device 23, the bottom surface of the pressing fixture 25 is defined as a bonding surface 252 for pressing electronic components (not shown). In addition, at least one suction portion 253 is provided on the joint surface 252 of the pressing fixture 25 for taking and placing electronic components.

At least one temperature sensing unit includes a first electrical component 261, a temperature sensing component 262, a first conductive component 263 and a second conductive component 264; the first electrical component 261 is used to transmit a temperature signal; the temperature sensing component 262 is mounted on a second operating device to sense the temperature of an electronic component; the first conductive component 263 is mounted on the first operating device and is electrically connected to the first electrical component 261; the second conductive component 264 is mounted on the second operating device and is opposite to the first conductive component 263 and is electrically connected to the temperature sensing component 262, and the second conductive component 264 can be connected to or separated from the first conductive component 263.

According to the operation requirements, at least one temperature sensing unit includes a plurality of temperature sensing units, and the plurality of temperature sensing units are arranged between a plurality of first operating devices and a plurality of second operating devices. The plurality of first circuits 265 of the plurality of first conductive elements 263 of the plurality of temperature sensing units can be electrically connected to at least one first electrical component 261.

As mentioned above, the first electric control unit 261 of the temperature sensing unit can be a plug, a socket or a gold finger, etc., for transmitting the temperature signal to the electronic control device (not shown in the figure). The first electric control unit 261 can be inserted into or removed from the second electric control unit 31 of the electronic control device (not shown in the figure) to connect or disconnect the temperature signal to the electronic control device. The temperature sensing element 262 is assembled inside the pressing fixture 25, and the sensing part at one end faces the joint surface 252 to sense the temperature of the electronic component.

According to the operation requirements, the first conductive member 263 and/or the second conductive member 264 can be extended and displaced along the assembly direction; further, the first conductive member 263 and/or the second conductive member 264 are equipped with elastic members.

According to the operation requirements, the first conductive member 263 and/or the second conductive member 264 can be a fixing member.

According to the operation requirements, the first conductive member 263 or the second conductive member 264 can be a conductive pin or a conductive pad.

In this embodiment, the first conductive member 263 is a conductive pin and is assembled in the receiving hole 232 of the float 23. One end of the conductive member 263 is connected to an elastic member 267, and can be extended and retracted in the receiving hole 232 and along the assembly direction, so that the other end protrudes or retracts in the first surface 231. One end of the first conductive member 263 is electrically connected to the first electrical component 261 by the first line 265 for transmitting the temperature signal. Based on the above, the multiple first lines 265 of the multiple first conductive members 263 are electrically connected to a first electrical component 261, and the first electrical component 261 can be inserted into or removed from the second electrical component 31 of the electronic control device (not shown) to connect or disconnect the transmission of the temperature signal to the electronic control device. The second conductive member 264 is a conductive pad and is fixed to the second surface 251 of the pressing fixture 25. One surface of the second conductive member 264 is opposite to the first conductive member 263, and the other surface is electrically connected to the temperature sensing member 262 via a second circuit 266 for transmitting a temperature signal.

Please refer to Figure 4. The pressing fixture 25 is attached to the first surface 231 of the float 23 with the second surface 251. A plurality of fasteners (not shown) are used to lock and assemble the pressing fixture 25 to the bottom of the float 23, so that the joint surface 252 of the pressing fixture 25 can press the electronic components, and the suction part 253 can be used to pick up and transfer the electronic components. Since the first conductive member 263 of the temperature sensing unit is provided with an elastic member 267, when the second conductive member 264 of the pressing fixture 25 is butted against and the first conductive member 263 of the floating fixture 23 is pressed upward, the first conductive member 263 compresses the elastic member 267 and moves upward in the receiving hole 232 along the assembly direction; when the first conductive member 263 is electrically connected to the second conductive member 264, the temperature sensing unit can be provided. The temperature signal sensed by the component 262 is transmitted to the second conductive component 264 via the second line 266. The second conductive component 264 transmits the temperature signal to the first electrical component 261 via the first conductive component 263 and the first line 265. When the first electrical component 261 is inserted into the second electrical component 31 electrically connected to the electrical control device (not shown), the temperature signal can be transmitted to the electrical control device for analysis and judgment.

Therefore, under the condition that the pressing fixture 25 is not equipped with wiring and sockets, there is no need to reserve a larger operating space and socket accommodation space around the two adjacent floating devices 23 and the pressing fixture 25, and the distance can be effectively shortened to facilitate space configuration and additional floating devices 23, heating components 24 and pressing fixtures 25, thereby improving production efficiency.

Based on the above, the temperature sensing unit can configure the temperature sensing element 262 on the pressing fixture 25 to effectively shorten the sensing distance, thereby improving the accuracy of the temperature sensing electronic components and ensuring the quality of the electronic component testing.

Furthermore, since the float 23 does not need to be frequently replaced with different sizes and is fixed to the connection plate 22, a first electrical component 261 connected to a plurality of first circuits 265 can be arranged outside the joint mechanism to facilitate maintenance by workers.

Please refer to Figures 4 and 5. The test device 20 of the present invention includes a test mechanism and a bonding mechanism of the present invention. The test mechanism is provided with at least one tester for testing electronic components. In this embodiment, the tester is provided with an electrically connected circuit board 271 and a test socket 272. The test socket 272 has a plurality of probes for testing electronic components. The bonding mechanism of the present invention is arranged above the test mechanism, and includes a mounting device 21, at least one first operator, at least one second operator and at least one temperature sensing unit for crimping and temperature sensing electronic components of the tester. In this embodiment, the bonding surface 252 of the pressing fixture 25 under the bonding mechanism contacts the electronic components, and the suction part 253 picks up the electronic components. The mounting driver (not shown) drives the mounting device 21 and the connecting plate 22 , the floating device 23, the pressing fixture 25 and the electronic components are synchronously displaced in the Y-Z direction, and the electronic components are placed and pressed into the test seat 272 to perform the test operation; during the test, the joint mechanism senses the temperature of the electronic components with the temperature sensing unit 262, and transmits the temperature signal to the first electric control unit 261 through the second conductive component 264, the first conductive component 263 and the first line 265 via the second line 266. The first electric control unit 261 then transmits the temperature signal to the electric control device (not shown) via the second electric control unit 31 to determine whether the electronic components perform the test operation at the preset test temperature.

Please refer to Figure 6. When replacing the pressing fixture 25A of different sizes, if the pressing fixture 25A is not equipped with wires and sockets, it is only necessary to disassemble and separate the old pressing fixture and the floating device 23, so that the second conductive part of the old pressing fixture and the first conductive part 263 of the floating device 23 can be quickly separated, and the first wire 265 and the first electrical component 261 on the floating device 23 still maintain electrical connection with the second electrical component 31, so that the pressing fixture 25A of different sizes can be quickly and conveniently replaced.

Please refer to Figures 2 to 5 and 7. The test device 20 of the present invention is applied to an electronic component processing machine, which includes a machine 40, a feeding device 50, a receiving device 60, a testing device 20, a conveying device 70 and a central control device (not shown). The feeding device 50 is mounted on the machine 40 and is provided with at least one feeder to accommodate at least one electronic component to be tested; the receiving device 60 is mounted on the machine 40 and is provided with at least one receiving device , to accommodate at least one tested electronic component; the test device 20 of the present invention is arranged on the machine 40, including a test mechanism and a bonding mechanism, the test mechanism is provided with at least one tester for testing electronic components; in this embodiment, the tester is provided with an electrically connected circuit board 271 and a test seat 272, the test seat 272 is used to hold and test electronic components; the bonding mechanism of the present invention is arranged above the test mechanism, including a mounting device 2 1. At least one first operator, at least one second operator and at least one temperature sensing unit for crimping and temperature sensing electronic components of the tester; a conveying device 70 is mounted on the machine 40 and is provided with at least one conveyor for conveying electronic components. In this embodiment, the conveying device 70 uses a first conveyor 71 to take out the electronic components to be tested from the feeder of the feeder device 50, and transfers the electronic components to be tested to the second conveyor 72. The second conveyor 72 carries the electronic component to be tested to the side of the test device 20; the joint mechanism of the test device 20 uses the mounting device 21 to drive the floating device 23, the pressing fixture 25 and the temperature sensing unit to move in the Y-Z direction to the top of the second conveyor 72, so that the pressing fixture 25 takes out the electronic component to be tested from the second conveyor 72, and transfers it to the test seat 272 to perform the test operation, and the tested electronic component is The electronic components are transferred to the third conveyor 73 of the conveyor device 70. The third conveyor 73 takes out the tested electronic components for the fourth conveyor 74 to take out the tested electronic components. According to the test results, the tested electronic components are transported to the receiver of the receiving device 60 for classification and storage. The central control device (not shown) is used to control and integrate the actions of each device to perform automated operations and achieve practical benefits of improving operation efficiency.

[Knowledge] 10: Test device 11: Circuit board 12: Test seat 13: Electronic component 14: Pressing arm 15: Floater 16: Pressing fixture 17: Temperature sensor 18: Socket 19: Plug [Invention] 20: Test device 21: Mounting device 22: Connecting plate 23: Floater 231: First surface 232: Accommodation hole 24: Heating element 25, 25A: Pressing fixture 251: Second surface 252: Joint surface 253: Suction part 261: First electric control unit 262: Temperature sensor 263: First conductive element 264: Second conductive element 265: First circuit 266: Second circuit 267: Elastic part 271: Circuit board 272: Test socket 31: Second electric control unit 40: Machine 50: Feeding device 60: Receiving device 70: Conveying device 71: First conveyor 72: Second conveyor 73: Third conveyor 74: Fourth conveyor

Figure 1: Schematic diagram of a known test device. Figure 2: Schematic diagram of the joint mechanism of the present invention. Figure 3: Schematic diagram of a part of the joint mechanism. Figure 4: Schematic diagram of the assembly of the joint mechanism of the present invention. Figure 5: Schematic diagram of the use of the joint mechanism of the present invention applied to the test device. Figure 6: Schematic diagram of the use of the joint mechanism of the present invention to replace the pressing fixture. Figure 7: Schematic diagram of the test device of the present invention applied to the operating machine.

21: Mounting device

22: Connecting plate

23: Floating device

231: First veneer

232: Accommodation hole

24: Heating element

25: Pressing fixture

251: Second veneer

252: Joint surface

253: Suction unit

261: First electronic control unit

262: Temperature sensing device

263: First contact piece

264: Second conductive part

265: First Line

266: Second Line

267: Elastic parts

31: Second electronic control unit

Claims (10)

A bonding mechanism, comprising: A mounting device; At least one first operator: mounted on the mounting device; At least one second operator: detachable from the first operator for bonding electronic components; At least one temperature sensing unit: including a first electrical component, a temperature sensing component, a first conductive component and a second conductive component. The first electrical component is used to transmit signals. The temperature sensing component is mounted on the second operating device to sense the temperature of the electronic component. The first conductive component is mounted on the first surface of the first operating device and is electrically connected to the first electrical component. The second conductive component is mounted on the second surface of the second operating device. The second surface is opposite to the first surface, and the second conductive component is opposite to the first conductive component. The second conductive component is electrically connected to the temperature sensing component. The second surface of the second operating device is separated from or attached to the first surface of the first operating device. The second conductive component can be connected to or separated from the first conductive component. In the joint mechanism described in claim 1, the first conductive member and/or the second conductive member of the temperature sensing unit can be extended and displaced along the assembly direction. In the coupling mechanism described in claim 2, the first conductive member and/or the second conductive member are equipped with an elastic member. In the joint mechanism described in claim 1, the first conductive part or/and the second conductive part of the temperature sensing unit can be a fixing part. In the joining mechanism as described in claim 1, the first conductive member of the temperature sensing unit is electrically connected to the first electrical component via a first circuit, and the second conductive member is electrically connected to the temperature sensing component via a second circuit. The coupling mechanism as described in claim 1, wherein the mounting device is capable of assembling a plurality of the first operators, a plurality of the first operators assemble a plurality of the second operators, and a plurality of the temperature sensing units are arranged between the plurality of the first operators and the plurality of the second operators, and a plurality of first circuits of a plurality of the first conductive parts of the plurality of the temperature sensing units are electrically connected to at least one of the first electrical controls. The joining mechanism as described in any one of claims 1 to 6, wherein the first operator further comprises at least one temperature controller. The coupling mechanism as described in any one of claims 1 to 6 further includes a mounting actuator, which is used to drive the mounting device to move in at least one direction. A testing device, comprising: A testing mechanism: at least one tester is provided for testing electronic components; At least one bonding mechanism as described in claim 1: for crimping and temperature sensing the electronic component of the tester. A work machine, comprising: a machine; a feeding device: arranged on the machine and provided with at least one feeder for accommodating at least one electronic component to be tested; a receiving device: arranged on the machine and provided with at least one receiver for accommodating at least one electronic component that has been tested; at least one testing device as described in claim 9: arranged on the machine for testing the electronic component; a conveying device: arranged on the machine and provided with at least one conveyor for conveying the electronic component; a central control device: for controlling and integrating the actions of various devices to perform automated operations.

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