TW201627161A - Pressure-sensitive adhesive sheet laminate and constituent member laminate of image display device - Google Patents
Pressure-sensitive adhesive sheet laminate and constituent member laminate of image display device Download PDFInfo
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- TW201627161A TW201627161A TW104140373A TW104140373A TW201627161A TW 201627161 A TW201627161 A TW 201627161A TW 104140373 A TW104140373 A TW 104140373A TW 104140373 A TW104140373 A TW 104140373A TW 201627161 A TW201627161 A TW 201627161A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本發明係關於一種具備黏著樹脂層與脫模層之黏著片積層體及使用有該黏著片積層體之圖像顯示裝置構成構件積層體、以及該等之製造方法。 The present invention relates to an adhesive sheet laminate having an adhesive resin layer and a release layer, and an image display device comprising the pressure-sensitive adhesive layer laminate, and a method for manufacturing the same.
作為黏著片,就確保處理性或防止異物於黏著面上附著之觀點而言,通常於黏著面上積層可剝離之保護膜(亦稱為「脫模膜」)作為黏著片積層體而流通。 From the viewpoint of ensuring handleability or preventing foreign matter from adhering to the adhesive surface as an adhesive sheet, a peelable protective film (also referred to as a "release film") is usually deposited as an adhesive sheet laminate on the adhesive surface.
其中,關於用以貼合觸控顯示器之觸控面板或液晶面板、表面保護面板等圖像顯示裝置構成構件之透明兩面黏著片,就確保光學特性或柔軟性之觀點而言,較佳為將透明黏著片本身制為較薄且柔軟者,故而較多作為於透明黏著片上積層脫模膜而成之黏著片積層體而使用。 The transparent double-sided adhesive sheet for constituting a member such as a touch panel, a liquid crystal panel, or a surface protection panel to which the touch display is attached is preferably an optical property or a softness. Since the transparent adhesive sheet itself is made thin and soft, it is often used as an adhesive sheet laminated body formed by laminating a release film on a transparent adhesive sheet.
關於此種黏著片積層體,例如於專利文獻1(日本專利特開2009-102467號公報)中揭示有:將對包含丙烯酸酯及甲基丙烯酸酯之ABA型三嵌段共聚物與具有羥基之樹脂進行聚合物摻合而成之丙烯酸系透明黏著劑組合物夾持於脫模片之間進行熱熔成形而成的黏著片。 For example, the ABA type triblock copolymer containing acrylate and methacrylate and having a hydroxyl group are disclosed in Patent Document 1 (Japanese Patent Laid-Open Publication No. 2009-102467). An adhesive sheet in which an acrylic transparent adhesive composition obtained by blending a resin is sandwiched between release sheets and thermally melt-molded.
於專利文獻2(日本專利特開2010-185037號公報)中揭示有一種黏著片,其特徵在於其係於剝離膜之至少一面具備黏著層,使該黏著層交聯而成者,上述交聯後之黏著層於測定頻率1Hz之拉伸儲存模數之溫度分散行為時,於25℃~120℃之溫度範圍內之任一溫度下均為5萬 Pa以上、100萬Pa以下之範圍。 An adhesive sheet characterized in that an adhesive layer is provided on at least one side of a release film to crosslink the adhesive layer, and the cross-linking is disclosed in Patent Document 2 (Japanese Laid-Open Patent Publication No. 2010-185037). When the adhesive layer is subjected to a temperature dispersion behavior of a tensile storage modulus at a frequency of 1 Hz, it is 50,000 at any temperature within a temperature range of 25 ° C to 120 ° C. Above Pa, 1 million Pa or less.
又,於專利文獻3(日本專利特開2013-181088號公報)中揭示有一種透明兩面黏著片,其特徵在於其係用以貼合相對向之兩個圖像顯示裝置用構成構件者,其第一特徵為於貼合於兩個圖像顯示裝置用構成構件上之狀態下,藉由熱或紫外線使之硬化而使用,且其第二特徵為具備將於在透明兩面黏著片之正面及背面積層有脫模膜之狀態下解析以雷射干涉儀獲得之干擾條紋圖像而求得之平均粗糙度Ra設為(X),將於剝離該脫模膜並貼合於兩個圖像顯示裝置用構成構件上之狀態下解析以雷射干涉儀獲得之干擾條紋圖像而求得之平均粗糙度Ra設為(Y)時,滿足特定條件之表面形狀。 Further, a transparent double-sided adhesive sheet is disclosed in Patent Document 3 (Japanese Patent Laid-Open Publication No. 2013-181088), which is characterized in that it is used to attach a constituent member for two image display devices. The first feature is that it is used by being cured by heat or ultraviolet rays in a state of being attached to the constituent members of the two image display devices, and the second feature is that the front surface of the adhesive sheet to be adhered to the transparent surface is When the back surface layer has a release film, the average roughness Ra obtained by analyzing the interference fringe image obtained by the laser interferometer is set to (X), and the release film is peeled off and attached to the two images. When the average roughness Ra obtained by analyzing the interference fringe image obtained by the laser interferometer in the state in which the display device is formed on the constituent member is (Y), the surface shape satisfying the specific condition is satisfied.
作為此種黏著片積層體中所使用之脫模膜,就剝離性之調整之容易性等而言,使用於PET(polyethylene terephthalate,聚對苯二甲酸乙二酯)膜等膜基材之表面塗佈聚矽氧系脫模劑等進行脫模處理而成者。 The release film used in such an adhesive sheet laminate is used for the surface of a film substrate such as a PET (polyethylene terephthalate) film in terms of ease of adjustment of peelability and the like. The release treatment is carried out by applying a polyfluorene-based release agent or the like.
然而,以聚矽氧系脫模劑等對膜基材之表面進行脫模處理而成之脫模膜存在生產成本變高之傾向,此外存在脫模劑轉印移行至黏著層表面,損害黏著片之品質穩定性之可能性。進而,製造黏著片積層體時,亦存在於膜基材與黏著樹脂層之間混入異物等之可能性。 However, the release film obtained by demolding the surface of the film substrate by a polyoxo-type release agent or the like tends to have a high production cost, and the release agent is transferred to the surface of the adhesive layer to impair adhesion. The possibility of quality stability of the film. Further, when the adhesive sheet laminate is produced, there is a possibility that foreign matter or the like is mixed between the film substrate and the adhesive resin layer.
因此,例如於專利文獻4(日本專利特開2011-256319號公報)及專利文獻5(WO2014/007137號公報)中,揭示有以獲得[含有聚烯烴系樹脂之剝離層]/[包含丙烯酸系樹脂之黏著層]/[包含丙烯酸系樹脂之基材層]之3層之方式共擠壓成形而一體化之黏著片積層體。 For example, in Patent Document 4 (Japanese Patent Laid-Open Publication No. 2011-256319) and Patent Document 5 (WO2014/007137), it is disclosed that [the release layer containing a polyolefin resin] / [including an acrylic system] An adhesive sheet laminate in which the resin adhesive layer]/[the base layer containing the acrylic resin layer] is formed by co-extrusion molding.
[專利文獻1]日本專利特開2009-102467號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-102467
[專利文獻2]日本專利特開2010-185037號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-185037
[專利文獻3]日本專利特開2013-181088號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2013-181088
[專利文獻4]日本專利特開2011-256319號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2011-256319
[專利文獻5]國際公開2014/007137號公報 [Patent Document 5] International Publication No. 2014/007137
於貼合圖像顯示裝置構成構件之情形時,尤其要求貼合後之耐久性。然而,先前提出之黏著片積層體用於貼合圖像顯示裝置構成構件時不具備充分之耐久性。 In the case of bonding the image display device to constitute a member, durability after bonding is particularly required. However, the previously proposed adhesive sheet laminate body does not have sufficient durability when it is used to laminate the image display device constituent members.
因此本發明係提供一種可抑制黏著層與脫模層之界面之異物混入或脫模劑向黏著層之移行轉印,貼合後之耐久性亦優異,可較佳用於圖像顯示裝置構成構件之貼合的新穎之黏著片積層體。 Therefore, the present invention provides a foreign matter in which the interface between the adhesive layer and the release layer can be inhibited or the release agent is transferred to the adhesive layer, and the durability after bonding is also excellent, and can be preferably used for the image display device. A novel adhesive sheet laminate that fits the component.
本發明提出一種黏著片積層體,其特徵在於其係於含有光硬化性黏著樹脂之光硬化性黏著樹脂層(I層)之單側或兩側介隔脫模層(II層)而具備基材層(III層)者,上述光硬化性黏著樹脂層(I層)係由含有(甲基)丙烯酸酯共聚物(A)、交聯劑(B)及光聚合起始劑(C)之樹脂組合物所形成之光硬化前之狀態之層,上述脫模層(II層)係由含有烯烴系聚合物(D)之樹脂組合物所形成之層,且上述光硬化性黏著樹脂層(I層)及上述脫模層(II層)係藉由共擠壓而形成。 The present invention provides an adhesive sheet laminate comprising a release layer (layer II) on one side or both sides of a photocurable adhesive resin layer (layer I) containing a photocurable adhesive resin. In the material layer (layer III), the photocurable adhesive resin layer (layer I) is composed of a (meth) acrylate copolymer (A), a crosslinking agent (B), and a photopolymerization initiator (C). The layer formed in the state before photohardening of the resin composition, the release layer (layer II) is a layer formed of a resin composition containing an olefin polymer (D), and the photocurable adhesive resin layer ( The layer I) and the above-mentioned release layer (layer II) are formed by co-extrusion.
本發明提出之黏著片積層體中,以(甲基)丙烯酸酯共聚物為基礎樹脂之層(I層)與以烯烴系聚合物為基礎樹脂之層(II層)於光硬化前之狀態下,層間強度較弱而易於引起層間剝離,故而可將一方之層(II 層)用作脫模層。儘管如此,上述光硬化性黏著樹脂層(I層)係由含有(甲基)丙烯酸酯共聚物(A)、交聯劑(B)及光聚合起始劑(C)之光硬化型樹脂組合物所形成之層,因此藉由將光硬化性黏著樹脂層(I層)積層於被黏著物後進行光硬化,可使貼合後之光硬化性黏著樹脂層(I層)之耐久性變得優異。因此,例如可較佳用於圖像顯示裝置構成構件之貼合。 In the adhesive sheet laminate according to the present invention, a layer (I layer) based on a (meth) acrylate copolymer and a layer (II layer) based on an olefin polymer are used in a state before photohardening. , the interlayer strength is weak and it is easy to cause interlayer peeling, so one layer can be layered (II The layer) is used as a release layer. In contrast, the photocurable adhesive resin layer (I layer) is a photocurable resin combination containing a (meth) acrylate copolymer (A), a crosslinking agent (B), and a photopolymerization initiator (C). Since the layer formed of the material is laminated on the adherend, the photocurable adhesive resin layer (I layer) is photocured, whereby the durability of the photocurable adhesive resin layer (I layer) after bonding can be changed. Excellent. Therefore, for example, it can be preferably used for bonding of constituent members of an image display device.
進而,本發明提出之黏著片積層體中,藉由共擠壓形成光硬化性黏著樹脂層(I層)與脫模層(II層),故而可降低於光硬化性黏著樹脂層(I層)與脫模層(II層)之界面混入異物之可能性。不僅如此,脫模層(II層)並非自聚矽氧系樹脂形成之層,而係由含有聚烯烴樹脂之樹脂組合物所形成之層,故而亦可防止脫模劑移行轉印至光硬化性黏著樹脂層(I層)而污染被黏著體之不良情形。又,因不必如先前般對基材層之表面進行脫模處理,故而可更經濟地提供黏著片積層體。 Further, in the adhesive sheet laminate according to the present invention, the photocurable adhesive resin layer (I layer) and the release layer (II layer) are formed by co-extrusion, so that the photocurable adhesive resin layer (I layer) can be lowered. The possibility of mixing foreign matter with the interface of the release layer (layer II). Further, the release layer (layer II) is not a layer formed of a polyoxymethylene resin, but is a layer formed of a resin composition containing a polyolefin resin, so that the release agent can be prevented from being transferred to photohardening. Adhesively sticking to the resin layer (I layer) and contaminating the adhesive body. Further, since it is not necessary to perform the release treatment on the surface of the base material layer as before, the adhesive sheet laminate can be provided more economically.
以下,對本發明之實施形態之一例進行詳細說明。但本案發明並不限定於下述實施形態。 Hereinafter, an example of an embodiment of the present invention will be described in detail. However, the invention of the present invention is not limited to the following embodiments.
本實施形態之一例之黏著片積層體(稱為「本黏著片積層體」)係於含有光硬化性黏著樹脂之光硬化性黏著樹脂層(I層)之單側或兩側介隔脫模層(II層)而具備基材層(III層)之黏著片積層體。 The adhesive sheet laminate (referred to as "the present adhesive sheet laminate") according to an embodiment of the present invention is provided on one side or both sides of the photocurable adhesive resin layer (I layer) containing a photocurable adhesive resin. The layer (layer II) is provided with an adhesive sheet laminate of a base material layer (III layer).
光硬化性黏著樹脂層(I層)係由含有(甲基)丙烯酸酯共聚物(A)、交聯劑(B)及光聚合起始劑(C)之樹脂組合物所形成之層,較佳為光硬化前即未硬化之狀態。 The photocurable adhesive resin layer (I layer) is a layer formed of a resin composition containing a (meth) acrylate copolymer (A), a crosslinking agent (B), and a photopolymerization initiator (C). Good is the state that is not hardened before light hardening.
再者,於本發明中,所謂光硬化性黏著樹脂層(I層)為「光硬化前之狀態」係指並非以使光硬化性黏著樹脂層(I層)硬化為目的而照射光使之硬化之狀態。例如因室內光或太陽光等之影響而自然光硬化之狀態係「光硬化前之狀態」。 In the present invention, the photocurable adhesive resin layer (I layer) is "in a state before photocuring", and the light is not irradiated for the purpose of curing the photocurable adhesive resin layer (I layer). The state of hardening. For example, the state of natural light hardening due to the influence of indoor light or sunlight is "the state before light hardening".
此種光硬化性黏著樹脂層(I層)例如可自以下說明之黏著組合物α或黏著組合物β而形成光硬化性黏著樹脂層(I層)。其中,作為形成光硬化性黏著樹脂層(I層)之樹脂組合物,黏著組合物α、β係較佳例,並不限定於該等。 The photocurable adhesive resin layer (I layer) can be formed, for example, from the adhesive composition α or the adhesive composition β described below to form a photocurable adhesive resin layer (I layer). In the resin composition for forming the photocurable adhesive resin layer (I layer), the adhesive compositions α and β are preferably not limited thereto.
若自黏著組合物α或β形成光硬化性黏著樹脂層(I層),即使為光硬化前之未交聯狀態,亦可保持片狀。又,若於未交聯狀態下加熱則可使之熔融或流動(熱熔性),可追隨印刷階差等凹凸部而填充黏著劑,可不產生氣泡等而填充。進而,於未交聯狀態下,於常態下即室溫左右,可具有適度之接著性,例如可剝離之程度之接著性(稱為“黏性”),因此可使貼著時之定位等變得簡單。 When the photocurable adhesive resin layer (I layer) is formed from the adhesive composition α or β, it can be kept in a sheet shape even in the uncrosslinked state before photohardening. In addition, when it is heated in the uncrosslinked state, it can be melted or flowed (hot-melt), and the adhesive can be filled in accordance with the uneven portion such as the printing step, and can be filled without generating bubbles or the like. Further, in the uncrosslinked state, in the normal state, that is, at room temperature, it is possible to have an appropriate adhesion, for example, a peelable degree of adhesion (referred to as "stickiness"), so that positioning at the time of adhesion can be achieved. It becomes simple.
又,如下所述,藉由調整黏著組合物α或β之130℃熔融黏度,可共擠壓光硬化性黏著樹脂層(I層)與脫模層(II層),另一方面於共擠壓後未光硬化之狀態下,與以烯烴系聚合物為基礎樹脂之脫模層(II層)難以相互接著,故而可將共擠壓之脫模層(II層)用作脫模層。 Further, as described below, by adjusting the melt viscosity of the adhesive composition α or β at 130 ° C, the photocurable adhesive resin layer (I layer) and the release layer (layer II) can be co-extruded, and on the other hand, coextrusion In the state where the film is not photo-cured, it is difficult to mutually release the release layer (II layer) based on the olefin-based polymer. Therefore, the co-extruded release layer (layer II) can be used as the release layer.
並且進而,若自黏著組合物α或β形成光硬化性黏著樹脂層(I層),藉由最終光交聯,可充分提高接著性。 Further, when the photocurable adhesive resin layer (I layer) is formed from the adhesive composition α or β, the adhesion can be sufficiently improved by the final photocrosslinking.
<黏著組合物α> <adhesive composition α>
作為黏著組合物α,可列舉:含有包含具備巨單體作為枝成分之接枝共聚物之(甲基)丙烯酸酯共聚物(A1)、交聯劑(B1)及光聚合起始劑(C1)之樹脂組合物。 The adhesive composition α includes a (meth) acrylate copolymer (A1), a crosslinking agent (B1), and a photopolymerization initiator (C1) containing a graft copolymer having a macromonomer as a branch component. a resin composition.
((甲基)丙烯酸酯共聚物(A1)) ((Meth)acrylate copolymer (A1))
作為黏著組合物α中之基礎聚合物之上述(甲基)丙烯酸酯共聚物 (A1)係具備巨單體作為枝成分之接枝共聚物。 The above (meth) acrylate copolymer as a base polymer in the adhesive composition α (A1) is a graft copolymer having a macromonomer as a branch component.
再者,於本發明中,所謂「基礎聚合物」係指成為黏著組合物α之主成分之樹脂。並未規定具體含量。作為標準,係占黏著組合物α中所含之樹脂之50質量%以上,其中更佳為80質量%以上,其中進而較佳為90質量%以上(包含100質量%)之樹脂(再者,於基礎聚合物為兩種以上之情形時,該等之總量相當於上述含量)。 In the present invention, the term "base polymer" means a resin which is a main component of the adhesive composition α. No specific content is specified. The standard is 50% by mass or more, more preferably 80% by mass or more, and more preferably 90% by mass or more (including 100% by mass) of the resin contained in the adhesive composition α (again, When the base polymer is two or more, the total amount is equivalent to the above content).
上述(甲基)丙烯酸酯共聚物(A1)之主幹成分較佳為包含含有源自(甲基)丙烯酸酯之重複單元之共聚物成分。 The main component of the (meth) acrylate copolymer (A1) preferably contains a copolymer component containing a repeating unit derived from (meth) acrylate.
構成上述(甲基)丙烯酸酯共聚物(A1)之主幹成分之共聚物之玻璃轉移溫度較佳為-70~0℃。 The glass transition temperature of the copolymer constituting the main component of the (meth) acrylate copolymer (A1) is preferably -70 to 0 °C.
此時,所謂構成主幹成分之共聚物成分之玻璃轉移溫度係指僅將組成(甲基)丙烯酸酯共聚物(A1)之主幹成分之單體成分共聚合獲得之聚合物之玻璃轉移溫度。具體而言係指由自該共聚物各成分之均聚物獲得之聚合物之玻璃轉移溫度與構成比率,藉由Fox之計算式而算出之值。 In this case, the glass transition temperature of the copolymer component constituting the trunk component means a glass transition temperature of a polymer obtained by copolymerizing only the monomer component constituting the trunk component of the (meth) acrylate copolymer (A1). Specifically, it means the value calculated from the calculation formula of Fox from the glass transition temperature and the composition ratio of the polymer obtained from the homopolymer of each component of the copolymer.
再者,所謂Fox之計算式係指藉由下式求得之計算值,可使用聚合物手冊[Polymer HandBook,J.Brandrup,Interscience,1989]中記載之值而求得。 Further, the calculation formula of Fox refers to a calculated value obtained by the following formula, and can be obtained by using the values described in the Polymer Handbook [Polymer Handbook, J. Brandrup, Interscience, 1989].
1/(273+Tg)=Σ(Wi/(273+Tgi)) 1/(273+Tg)=Σ(Wi/(273+Tgi))
[式中,Wi表示單體i之重量分率,Tgi表示單體i之均聚物之Tg(℃)] [wherein, Wi represents the weight fraction of monomer i, and Tgi represents the Tg (°C) of the homopolymer of monomer i]
構成上述(甲基)丙烯酸酯共聚物(A1)之主幹成分之共聚物成分之玻璃轉移溫度,對室溫狀態下之黏著組合物α之柔軟性或黏著組合物α對被黏著體之潤濕性,即接著性產生影響,故而為使黏著組合物α於室溫狀態下獲得適度之接著性(黏性),該玻璃轉移溫度較佳為-70℃~0℃,其中更佳為-65℃以上或-5℃以下,其中尤佳為-60℃以上或-10 ℃以下。 The glass transition temperature of the copolymer component constituting the main component of the above (meth) acrylate copolymer (A1), the softness of the adhesive composition α at room temperature or the wetting of the adhesive composition α to the adherend The effect of the adhesiveness, that is, the adhesiveness, is such that the adhesive composition α obtains moderate adhesion (viscosity) at room temperature, and the glass transition temperature is preferably -70 ° C to 0 ° C, more preferably -65. Above °C or below -5 °C, especially preferably above -60 °C or -10 Below °C.
其中,即使該共聚物成分之玻璃轉移溫度為相同溫度,亦可藉由調整分子量而調整黏彈性。例如藉由減小共聚物成分之分子量,可使之更柔軟化。 Here, even if the glass transition temperature of the copolymer component is the same temperature, the viscoelasticity can be adjusted by adjusting the molecular weight. For example, by reducing the molecular weight of the copolymer component, it can be made softer.
作為上述(甲基)丙烯酸酯共聚物(A1)之主幹成分所含有之(甲基)丙烯酸酯單體,例如可列舉:(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸甲酯等。亦可使用於該等中具有親水基或有機官能基等之(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、丙烯酸、甲基丙烯酸、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、(甲基)丙烯腈等。 Examples of the (meth) acrylate monomer contained in the main component of the (meth) acrylate copolymer (A1) include 2-ethylhexyl (meth) acrylate and (meth) acrylate. Octyl ester, isooctyl (meth)acrylate, n-butyl (meth)acrylate, ethyl (meth)acrylate, methyl (meth)acrylate, and the like. It can also be used for hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, acrylic acid, methacrylic acid, glycidyl (meth)acrylate, or the like having a hydrophilic group or an organic functional group or the like. Methyl) acrylamide, N,N-dimethyl(meth)acrylamide, (meth)acrylonitrile, and the like.
又,亦可適宜使用可與上述丙烯酸系單體或甲基丙烯酸系單體共聚合之乙酸乙烯酯或烷基乙烯醚、羥基烷基乙烯醚等各種乙烯基單體。 Further, various vinyl monomers such as vinyl acetate, alkyl vinyl ether or hydroxyalkyl vinyl ether copolymerizable with the above acrylic monomer or methacrylic monomer can be suitably used.
又,(甲基)丙烯酸酯共聚物(A1)之主幹成分較佳為含有疏水性之(甲基)丙烯酸酯單體與親水性之(甲基)丙烯酸酯單體作為構成單元。 Further, the main component of the (meth) acrylate copolymer (A1) preferably contains a hydrophobic (meth) acrylate monomer and a hydrophilic (meth) acrylate monomer as constituent units.
疏水性之(甲基)丙烯酸酯單體可抑制丙烯酸系共聚物(A)之吸水或調整丙烯酸系共聚物(A)之相對介電常數等電特性,故而較佳。 The hydrophobic (meth) acrylate monomer is preferred because it can suppress the water absorption of the acrylic copolymer (A) or adjust the relative dielectric constant of the acrylic copolymer (A).
另一方面,若(甲基)丙烯酸酯共聚物(A1)之主幹成分僅由疏水性單體構成,則存在濕熱白化之傾向,故而較佳為亦於主幹成分中導入親水性單體而防止濕熱白化。 On the other hand, when the main component of the (meth) acrylate copolymer (A1) is composed only of a hydrophobic monomer, there is a tendency for wet heat to whiten. Therefore, it is preferred to introduce a hydrophilic monomer into the main component to prevent it. Damp heat whitening.
具體而言,作為上述(甲基)丙烯酸酯共聚物(A1)之主幹成分,可列舉:使疏水性之(甲基)丙烯酸酯單體與親水性之(甲基)丙烯酸酯單體與巨單體之末端之聚合性官能基無規共聚合而成的共聚物成分。 Specifically, examples of the main component of the (meth) acrylate copolymer (A1) include a hydrophobic (meth) acrylate monomer and a hydrophilic (meth) acrylate monomer and a giant A copolymer component obtained by randomly copolymerizing a polymerizable functional group at the terminal of a monomer.
此處,作為上述疏水性之(甲基)丙烯酸酯,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯 酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸山萮酯等。 Here, examples of the hydrophobic (meth) acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, and (meth)acryl. Isobutyl acrylate, second butyl (meth) acrylate, tert-butyl (meth) acrylate, isopropyl (meth) acrylate, propyl (meth) acrylate, amyl (meth) acrylate, Isoamyl (meth)acrylate, neopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate , 2-ethylhexyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (methyl) , undecyl acrylate, dodecyl (meth) acrylate, stearyl (meth) acrylate, cetyl (meth) acrylate, behenyl (meth) acrylate, and the like.
另外,亦可列舉:(甲基)丙烯酸異酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸3,5,5-三甲基環己酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯基氧基乙酯、丙烯酸萜烯酯或其衍生物、丙烯酸氫化松香酯或其衍生物等具有脂肪族環狀結構之(甲基)丙烯酸酯或苯乙烯等。 In addition, it can also be mentioned that (meth)acrylic acid Ester, cyclohexyl (meth)acrylate, 3,5,5-trimethylcyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, (meth) acrylate or styrene having an aliphatic cyclic structure such as dicyclopentenyloxyethyl (meth) acrylate, decene acrylate or a derivative thereof, hydrogenated rosin acrylate or a derivative thereof .
其中,(甲基)丙烯酸2-乙基己酯或(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸硬脂酯等具有長鏈烷基結構之單體或具有環狀結構之單體可有效地用於調整丙烯酸系聚合物(A)之相對介電常數之情形。 Among them, a monomer having a long-chain alkyl structure or a monomer having a cyclic structure such as 2-ethylhexyl (meth)acrylate or dodecyl (meth)acrylate or stearyl (meth)acrylate The body can be effectively used to adjust the relative dielectric constant of the acrylic polymer (A).
作為上述親水性之(甲基)丙烯酸酯單體,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、甘油(甲基)丙烯酸酯等含羥基之(甲基)丙烯酸酯,(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基琥珀酸、2-(甲基)丙烯醯氧基丙基琥珀酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸、順丁烯二酸單甲酯、伊康酸單甲酯等含羧基之單體,(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯等含胺 基之(甲基)丙烯酸酯系單體,(甲基)丙烯醯胺、N-第三丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、二丙酮丙烯醯胺、順丁烯二醯胺、順丁烯二醯亞胺、N,N-二甲基丙烯醯胺、羥乙基丙烯醯胺等含醯胺基之單體,乙烯基吡咯啶酮、乙烯基吡啶、乙烯基咔唑等雜環系鹼性單體等。另外亦可列舉:(甲基)丙烯酸四氫糠酯或(甲基)丙烯醯啉等具有環狀醚結構之單體,或(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯,或丙烯酸甲酯等。 Examples of the hydrophilic (meth) acrylate monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate. a hydroxyl group-containing (meth) acrylate such as glycerin (meth) acrylate, (meth)acrylic acid, 2-(meth)acryloxyethyl hexahydrophthalic acid, 2-(methyl) Propylene methoxypropyl hexahydrophthalic acid, 2-(meth) propylene methoxyethyl phthalate, 2-(methyl) propylene methoxy propyl phthalate, 2-( Methyl) propylene oxiranyl ethyl maleic acid, 2-(methyl) propylene methoxy propyl maleic acid, 2-(methyl) propylene methoxyethyl succinic acid, 2- (Methyl) propylene methoxy propyl succinic acid, crotonic acid, fumaric acid, maleic acid, itaconic acid, maleic acid monomethyl ester, itaconic acid monomethyl ester, etc. a monomer of a carboxyl group, an amino group-containing (meth)acrylate monomer such as dimethylaminoethyl (meth)acrylate or diethylaminoethyl (meth)acrylate, (meth)acrylamide , N-tert-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methoxy Methyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, diacetone acrylamide, maleimide, maleimide, N, N a monomer containing a guanamine group such as dimethyl methacrylate or hydroxyethyl acrylamide, a heterocyclic basic monomer such as vinyl pyrrolidone, vinyl pyridine or vinyl carbazole. Further, there may be mentioned: tetrahydrofurfuryl (meth)acrylate or (meth)acrylic acid a monomer having a cyclic ether structure such as porphyrin, or an alkoxyalkyl (meth)acrylate such as methoxyethyl (meth)acrylate or ethoxyethyl (meth)acrylate, or methyl acrylate Wait.
(甲基)丙烯酸酯共聚物(A1)較佳為導入巨單體作為接枝共聚物之枝成分,含有源自巨單體之重複單元。 The (meth) acrylate copolymer (A1) is preferably a branch component in which a macromonomer is introduced as a graft copolymer, and a repeating unit derived from a macromonomer is contained.
所謂巨單體係指具有末端之聚合性官能基與高分子量骨架成分之高分子單體。 The macromonomer system refers to a polymer monomer having a terminal polymerizable functional group and a high molecular weight skeleton component.
巨單體之玻璃轉移溫度(Tg)較佳為高於構成上述(甲基)丙烯酸酯共聚物(A1)之共聚物成分之玻璃轉移溫度。 The glass transition temperature (Tg) of the macromonomer is preferably higher than the glass transition temperature of the copolymer component constituting the above (meth) acrylate copolymer (A1).
具體而言,巨單體之玻璃轉移溫度(Tg)對黏著組合物α之加熱熔融溫度(熱熔溫度)產生影響,故而巨單體之玻璃轉移溫度(Tg)較佳為30℃~120℃,其中更佳為40℃以上或110℃以下,其中進而較佳為50℃以上或100℃以下。 Specifically, the glass transition temperature (Tg) of the macromonomer affects the heating and melting temperature (hot melt temperature) of the adhesive composition α, so the glass transition temperature (Tg) of the macromonomer is preferably from 30 ° C to 120 ° C. More preferably, it is 40 ° C or more or 110 ° C or less, and further preferably 50 ° C or more or 100 ° C or less.
若為此種玻璃轉移溫度(Tg),則藉由調整分子量,可保持優異之加工性或保管穩定性,並且可調整為於80℃左右熱熔。 In the case of such a glass transition temperature (Tg), excellent workability or storage stability can be maintained by adjusting the molecular weight, and it can be adjusted to be hot-melted at about 80 °C.
所謂巨單體之玻璃轉移溫度係指該巨單體本身之玻璃轉移溫度,可藉由示差掃描熱量計(DSC)而測定。 The glass transition temperature of the macromonomer refers to the glass transition temperature of the macromonomer itself, which can be determined by a differential scanning calorimeter (DSC).
又,於室溫狀態下,枝成分彼此互相牽引而可作為黏著組合物維持為如物理性交聯之狀態,並且可藉由加熱至適度之溫度而使上述物理性交聯分解從而獲得流動性,因此調整巨單體之含量亦較佳。 Further, in the room temperature state, the branch components are pulled to each other to maintain the physical cross-linking state as the adhesive composition, and the physical cross-linking can be decomposed by heating to a moderate temperature to obtain fluidity. It is also preferred to adjust the content of macromonomers.
就該觀點而言,巨單體較佳為於(甲基)丙烯酸酯共聚物(A1)中以 5質量%~30質量%之比例含有,其中更佳為6質量%以上或25質量%以下,其中進而較佳為8質量%以上或20質量%以下。 In this regard, the macromonomer is preferably in the (meth) acrylate copolymer (A1). It is contained in a ratio of 5 mass% to 30 mass%, more preferably 6% by mass or more or 25% by mass or less, and further preferably 8% by mass or more or 20% by mass or less.
構成巨單體之高分子量骨架之成分較佳為包含丙烯酸系單體或乙烯系單體,其更佳為疏水性之單體。 The component constituting the high molecular weight skeleton of the macromonomer is preferably an acrylic monomer or a vinyl monomer, and more preferably a hydrophobic monomer.
作為上述構成巨單體之高分子量骨架之成分,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸山萮酯等。另外,例如亦可列舉:(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯,(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、甘油(甲基)丙烯酸酯等含羥基之(甲基)丙烯酸酯,(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基琥珀酸、2-(甲基)丙烯醯氧基丙基琥珀酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸、順丁烯二酸單甲酯、伊康酸單甲酯等含羧基之單體,順丁烯二酸酐、伊康酸酐等含酸酐基之單體,(甲基)丙烯酸縮水甘油酯、α-乙基丙烯酸縮水甘油酯、(甲基)丙烯酸3,4-環氧丁酯等含環氧基之單體,(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯等含胺 基之(甲基)丙烯酸酯系單體,(甲基)丙烯醯胺、N-第三丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、二丙酮丙烯醯胺、順丁烯二醯胺、順丁烯二醯亞胺等含醯胺基之單體,乙烯基吡咯啶酮、乙烯基吡啶、乙烯基咔唑等雜環系鹼性單體,苯乙烯、乙烯基甲苯、α-甲基苯乙烯、丙烯腈、甲基丙烯腈、乙酸乙烯酯、丙酸乙烯酯等乙烯系單體,甲氧基乙二醇烯丙醚、甲氧基聚乙二醇烯丙醚、甲氧基聚丙二醇烯丙醚、丁氧基聚乙二醇烯丙醚、丁氧基聚丙二醇烯丙醚、甲氧基聚乙二醇-聚丙二醇烯丙醚、丁氧基聚乙二醇-聚丙二醇烯丙醚等末端烷氧基烯丙基化聚醚單體,(甲基)丙烯酸環己酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸異酯、(甲基)丙烯酸3,5,5-三甲基環己酯、對異丙苯基苯酚EO改性(甲基)丙烯酸酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯基氧基乙酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧基乙酯、苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、乙烯基甲苯等。 Examples of the component of the high molecular weight skeleton constituting the macromonomer include methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, and isobutyl (meth)acrylate. , (butyl) (meth)acrylate, tert-butyl (meth)acrylate, isopropyl (meth)acrylate, propyl (meth)acrylate, amyl (meth)acrylate, (methyl) Isoamyl acrylate, neopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, (methyl) ) 2-ethylhexyl acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, (methyl) acrylate Alkyl ester, dodecyl (meth)acrylate, stearyl (meth)acrylate, cetyl (meth)acrylate, behenyl (meth)acrylate, and the like. Further, examples thereof include a (meth)acrylic acid alkoxyalkyl ester such as methoxyethyl (meth)acrylate or ethoxyethyl (meth)acrylate, and 2-hydroxyethyl (meth)acrylate. Hydroxy-containing (meth) acrylate such as ester, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, glycerol (meth) acrylate, (meth) acrylate, 2- (methyl) propylene oxiranyl ethyl hexahydrophthalic acid, 2-(methyl) propylene methoxy propyl hexahydrophthalic acid, 2-(methyl) propylene oxiranyl ethyl benzene Dicarboxylic acid, 2-(methyl) propylene methoxy propyl phthalate, 2-(methyl) propylene oxiranyl ethyl maleate, 2-(methyl) propylene methoxy propyl Maleic acid, 2-(methyl) propylene methoxyethyl succinic acid, 2-(methyl) propylene methoxy propyl succinic acid, crotonic acid, fumaric acid, maleic acid a carboxyl group-containing monomer such as acid, itaconic acid, maleic acid monomethyl ester or itaconic acid monomethyl ester, an acid anhydride group-containing monomer such as maleic anhydride or itaconic acid anhydride, or (meth)acrylic acid Glycidyl ester, α-ethyl methacrylate, 3,4-cyclo(meth)acrylate An epoxy group-containing monomer such as oxybutyl ester, an amino group-containing (meth) acrylate monomer such as dimethylaminoethyl (meth)acrylate or diethylaminoethyl (meth)acrylate, (Meth) acrylamide, N-tert-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methoxymethyl (meth) acrylamide, a monomer containing a guanamine group such as N-butoxymethyl (meth) acrylamide, diacetone acrylamide, maleimide, maleimide, vinyl pyrrolidone, a heterocyclic basic monomer such as vinyl pyridine or vinyl carbazole, or a vinyl compound such as styrene, vinyl toluene, α-methyl styrene, acrylonitrile, methacrylonitrile, vinyl acetate or vinyl propionate. Monomer, methoxyethylene glycol allyl ether, methoxy polyethylene glycol allyl ether, methoxy polypropylene glycol allyl ether, butoxy polyethylene glycol allyl ether, butoxy polypropylene glycol Terminal alkoxyallyylated polyether monomer such as propyl ether, methoxy polyethylene glycol-polypropylene glycol allyl ether, butoxy polyethylene glycol-polypropylene glycol allyl ether, (meth)acrylic acid ring Hexyl ester, tert-butyl ring (meth)acrylate Ester, (meth) isobutyl acrylate, Ester, 3,5,5-trimethylcyclohexyl (meth)acrylate, EO modified (meth) acrylate of p-cumylphenol, dicyclopentyl (meth)acrylate, (methyl) Dicyclopentenyl acrylate, dicyclopentenyloxyethyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, styrene, tert-butyl styrene , α-methyl styrene, vinyl toluene, and the like.
上述成分中,進而較佳為使構成巨單體之高分子量骨架之上述成分成為均聚物時之玻璃轉移溫度為30℃~120℃之單體。具體而言,作為該單體,例如可列舉:甲基丙烯酸甲酯、丙烯酸3,5,5-三甲基環己酯、丙烯酸異酯、丙烯酸二環戊酯、甲基丙烯酸環己酯等。 Among the above components, a monomer having a glass transition temperature of 30 ° C to 120 ° C when the above-mentioned components constituting the high molecular weight skeleton of the macromonomer is a homopolymer is more preferable. Specifically, examples of the monomer include methyl methacrylate, 3,5,5-trimethylcyclohexyl acrylate, and acrylic acid. Ester, dicyclopentanyl acrylate, cyclohexyl methacrylate, and the like.
又,上述成分中,於構成巨單體之高分子量骨架之上述成分具有結晶性之情形時,進而較佳為使該上述成分成為均聚物時之結晶熔化溫度為30℃~120℃之單體。具體而言,作為該單體,例如可列舉:丙烯酸硬脂酯、甲基丙烯酸硬脂酯、丙烯酸鯨蠟酯、甲基丙烯酸鯨蠟酯、丙烯酸山萮酯、甲基丙烯酸山萮酯等。 Further, in the case where the above-mentioned component constituting the high molecular weight skeleton of the macromonomer has crystallinity, it is more preferred that the crystal melting temperature of the component is 30 ° C to 120 ° C when the component is a homopolymer. body. Specifically, examples of the monomer include stearyl acrylate, stearyl methacrylate, cetyl acrylate, cetyl methacrylate, behenyl acrylate, and behenyl methacrylate.
再者,構成巨單體之高分子量骨架時,可使該等單體之一種均聚合而使用,亦可使該等複數種單體共聚合而使用。 Further, when a high molecular weight skeleton of a macromonomer is formed, one of the monomers may be polymerized and used, and the plurality of monomers may be copolymerized and used.
作為上述巨單體之末端聚合性官能基,例如可列舉:甲基丙烯醯、丙烯醯基、乙烯基等。 Examples of the terminal polymerizable functional group of the above-mentioned macromonomer include a methyl methacrylate, an acryl fluorenyl group, and a vinyl group.
上述(甲基)丙烯酸酯共聚物(A1)於溫度130℃,頻率0.02Hz下之複黏度較佳為100~800Pa.s,更佳為150~700Pa.s,進而較佳為170~600Pa.s。 The (meth) acrylate copolymer (A1) preferably has a viscosity at a temperature of 130 ° C and a frequency of 0.02 Hz of 100 to 800 Pa. s, more preferably 150~700Pa. s, and further preferably 170 to 600 Pa. s.
上述(甲基)丙烯酸酯共聚物(A1)於溫度130℃下之複黏度對使該透明兩面黏著材熱熔而使用時之黏著組合物α之流動性產生影響,故而若該複黏度為100~800Pa.s,則可具有優異之熱熔適性。 The re-adhesion of the (meth) acrylate copolymer (A1) at a temperature of 130 ° C affects the fluidity of the adhesive composition α when the transparent double-sided adhesive is used for heat fusion, so if the complex viscosity is 100 ~800Pa. s, can have excellent hot melt suitability.
為將上述(甲基)丙烯酸酯共聚物(A1)之複黏度調整為上述範圍,例如可列舉調整構成(甲基)丙烯酸酯共聚物(A1)之主幹成分之共聚物成分之玻璃轉移溫度。可列舉調整為較佳為-70℃~0℃,其中更佳為-65℃以上或-5℃以下,其中進而更佳為-60℃以上或-10℃以下,並且調整該共聚物成分之分子量而調整黏彈性的方法。但並不限定於該方法。 In order to adjust the viscosity of the (meth) acrylate copolymer (A1) to the above range, for example, the glass transition temperature of the copolymer component constituting the main component of the (meth) acrylate copolymer (A1) can be adjusted. The adjustment is preferably from -70 ° C to 0 ° C, more preferably -65 ° C or more or -5 ° C or less, and still more preferably -60 ° C or more or -10 ° C or less, and adjusting the copolymer component. The method of adjusting the viscoelasticity by molecular weight. However, it is not limited to this method.
上述(甲基)丙烯酸酯共聚物(A1)之分子量如下所述,就將130℃熔融黏度調整為特定範圍之觀點而言,較佳為10萬~100萬,其中更佳為15萬以上或80萬以下,其中尤佳為20萬以上或70萬以下。 The molecular weight of the (meth) acrylate copolymer (A1) is preferably from 100,000 to 1,000,000, more preferably 150,000 or more, from the viewpoint of adjusting the melt viscosity at 130 ° C to a specific range as described below. Less than 800,000, of which more than 200,000 or less is less than 700,000.
(交聯劑(B1)) (crosslinking agent (B1))
作為交聯劑(B1),例如可適宜選擇環氧交聯劑或異氰酸酯交聯劑,包含氧雜環丁烷化合物、矽烷化合物、丙烯酸系化合物等之交聯劑。其中,就反應性或所得硬化物之強度之方面而言,較佳為具有2個以上之(甲基)丙烯醯基之多官能(甲基)丙烯酸酯單體。 As the crosslinking agent (B1), for example, an epoxy crosslinking agent or an isocyanate crosslinking agent can be suitably selected, and a crosslinking agent such as an oxetane compound, a decane compound or an acrylic compound can be used. Among them, a polyfunctional (meth) acrylate monomer having two or more (meth) acrylonitrile groups is preferred in terms of reactivity or strength of the obtained cured product.
例如,介隔光硬化性黏著樹脂層(I層)貼合圖像顯示裝置構成構件而一體化後,使光硬化性黏著樹脂層(I層)中所含之交聯劑(B1)進行交聯反應,藉此光硬化性黏著樹脂層(I層)失去熱熔性,取而代之可表現出高溫環境下之高凝集力,獲得優異之耐發泡可靠性。 For example, after the photocurable adhesive resin layer (I layer) is bonded to the image display device constituent member and integrated, the crosslinking agent (B1) contained in the photocurable adhesive resin layer (I layer) is dispensed. By the reaction, the photocurable adhesive resin layer (layer I) loses its hot melt property, and instead, it exhibits high cohesive force in a high temperature environment, and excellent foaming reliability is obtained.
作為此種多官能(甲基)丙烯酸酯單體,例如可列舉:1,4-丁二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油縮水甘油醚二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、雙酚A聚乙氧基二(甲基)丙烯酸酯、雙酚A聚丙氧基二(甲基)丙烯酸酯、雙酚F聚乙氧基二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、三羥甲基丙烷三氧基乙基(甲基)丙烯酸酯、ε-己內酯改性三(2-羥基乙基)異氰尿酸酯三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、丙氧化季戊四醇三(甲基)丙烯酸酯、乙氧化季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、丙氧化季戊四醇四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、三(丙烯醯氧基乙基)異氰尿酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、三季戊四醇六(甲基)丙烯酸酯、三季戊四醇五(甲基)丙烯酸酯、羥基特戊酸新戊二醇二(甲基)丙烯酸酯、羥基特戊酸新戊二醇之ε-己內酯加成物之二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷聚乙氧基三(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯等紫外線硬化型之多官能單體類,另外亦可列舉:聚酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯、聚醚(甲基)丙烯酸酯等多官能丙烯酸酯低聚物類。 Examples of such a polyfunctional (meth) acrylate monomer include 1,4-butanediol di(meth)acrylate, glycerol di(meth)acrylate, and neopentyl glycol di(methyl). Acrylate, glycerol glycidyl ether di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, tricyclodecane Dimethanol di(meth)acrylate, bisphenol A polyethoxy di(meth)acrylate, bisphenol A polypropoxy di(meth)acrylate, bisphenol F polyethoxy di(methyl) Acrylate, ethylene glycol di(meth) acrylate, neopentyl glycol di(meth) acrylate, trimethylolpropane trioxyethyl (meth) acrylate, ε-caprolactone Tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentoxide tetraol tris(methyl) Acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, poly Glycol di(meth)acrylate, tris(propyleneoxyethyl)isocyanurate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta (methyl) Acrylate, tripentaerythritol hexa(meth) acrylate, tripentaerythritol penta (meth) acrylate, hydroxypivalic acid neopentyl glycol di(meth) acrylate, hydroxypivalic acid neopentyl glycol ε - caprolactone adducts of di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane polyethoxy tri(meth)acrylate, di-trishydroxyl An ultraviolet-curable polyfunctional monomer such as methyl propane tetra(meth)acrylate, and examples thereof include polyester (meth) acrylate, epoxy (meth) acrylate, and (meth) acrylate A multifunctional acrylate oligomer such as a carbamic acid ester or a polyether (meth) acrylate.
上述例示中,就提高對被黏著體之密接性或濕熱白化抑制之效果的觀點而言,上述多官能(甲基)丙烯酸酯單體較佳為含有羥基等極性官能基之多官能單體或低聚物。其中,較佳為使用具有羥基之多官能(甲基)丙烯酸酯。 In the above-described examples, the polyfunctional (meth) acrylate monomer is preferably a polyfunctional monomer containing a polar functional group such as a hydroxyl group, from the viewpoint of improving the adhesion to the adherend or the effect of suppressing the wet heat whitening. Oligomer. Among them, a polyfunctional (meth) acrylate having a hydroxyl group is preferably used.
因此,就防止濕熱白化之觀點而言,作為上述(甲基)丙烯酸酯共 聚物(A1),即接枝共聚物之主幹成分,較佳為含有疏水性之丙烯酸酯單體與親水性之丙烯酸酯單體,進而,作為交聯劑(B1),較佳為使用具有羥基之多官能(甲基)丙烯酸酯。 Therefore, as a result of preventing wet heat whitening, as the above (meth) acrylate The polymer (A1), that is, the main component of the graft copolymer, preferably contains a hydrophobic acrylate monomer and a hydrophilic acrylate monomer, and further, as a crosslinking agent (B1), preferably has a A polyfunctional (meth) acrylate of a hydroxyl group.
又,為調整密接性或耐濕熱性、耐熱性等之效果,亦可添加與交聯劑(B1)反應之單官能之(甲基)丙烯酸酯。 Further, in order to adjust the effects of adhesion, moist heat resistance, heat resistance and the like, a monofunctional (meth) acrylate which reacts with the crosslinking agent (B1) may be added.
交聯劑(B1)之含量並無特別限制。作為標準,較佳為相對於(甲基)丙烯酸酯共聚物(A1)100質量份為0.5~20質量份,其中更佳為1質量份以上或15質量份以下,其中進而較佳為2質量份以上或10質量份以下之比例。 The content of the crosslinking agent (B1) is not particularly limited. The standard is preferably 0.5 to 20 parts by mass, more preferably 1 part by mass or more or 15 parts by mass or less, and further preferably 2 parts by mass based on 100 parts by mass of the (meth) acrylate copolymer (A1). A ratio of more than 10 parts by weight.
藉由於上述範圍內含有交聯劑(B1),可兼具未交聯狀態之光硬化性黏著樹脂層(I層)之形狀穩定性與交聯後之光硬化性黏著樹脂層(I層)之耐發泡可靠性。其中,考慮到與其他要素之平衡,亦可超過該範圍。 The photocurable adhesive resin layer (I layer) having an uncrosslinked state and the photocurable adhesive resin layer (I layer) after crosslinking can be obtained by containing the crosslinking agent (B1) in the above range. Resistant to foaming reliability. Among them, considering the balance with other elements, it is also possible to exceed this range.
(光聚合起始劑(C1)) (Photopolymerization initiator (C1))
光聚合起始劑(C1)係發揮作為上述交聯劑(B1)之交聯反應之反應起始助劑之功能。光聚合起始劑可適宜使用現今公知者。其中,就控制交聯反應之容易性之觀點而言,較佳為感應波長380nm以下之紫外線之光聚合起始劑。 The photopolymerization initiator (C1) functions as a reaction initiation aid for the crosslinking reaction of the above crosslinking agent (B1). The photopolymerization initiator can be suitably used in the art. Among them, from the viewpoint of controlling the easiness of the crosslinking reaction, a photopolymerization initiator which induces ultraviolet rays having a wavelength of 380 nm or less is preferable.
另一方面,若使用感應波長長於波長380nm之光之光聚合起始劑,則就交聯反應易於進行,例如即使於介隔缺乏紫外線透過性之構件進行光照射之情形時亦可使光硬化性樹脂層(I層)硬化的方面而言較佳。 On the other hand, when a photopolymerization initiator which induces light having a wavelength longer than a wavelength of 380 nm is used, the crosslinking reaction proceeds easily, for example, even when light is irradiated through a member which lacks ultraviolet ray permeability. The resin layer (I layer) is preferred in terms of hardening.
光聚合起始劑根據自由基產生機制而大致分類為兩種,可大致分為:可使光聚合性起始劑自身之單鍵斷裂分解而產生自由基之斷裂型光聚合起始劑,以及光激發之起始劑與系統中之氫供與體形成激發錯合物而可轉移氫供與體之氫的氫抽出型光聚合起始劑。 The photopolymerization initiator is roughly classified into two types according to a radical generation mechanism, and can be roughly classified into a cleavage type photopolymerization initiator which can decompose a single bond of a photopolymerization initiator itself to generate a radical, and The photoexcited initiator and the hydrogen donor in the system form a hydrogen-extracting photopolymerization initiator which promotes the complex and transfers hydrogen to the hydrogen donor.
該等中之斷裂型光聚合起始劑藉由光照射而產生自由基時分解而成為其他化合物,若暫時被激發則無法具有作為反應起始劑之功能。故而,不會於交聯反應結束後之黏著材中作為活性物質而殘存,不存在對黏著材帶來未預期之光劣化等之可能性,故而較佳。 In the above-mentioned cleavage type photopolymerization initiator, when a radical is generated by light irradiation, it is decomposed into other compounds, and if it is temporarily excited, it does not have a function as a reaction initiator. Therefore, it is preferable that the adhesive material does not remain as an active material in the adhesive material after completion of the crosslinking reaction, and there is no possibility of causing undesired photodegradation or the like to the adhesive material.
另一方面,氫抽出型之光聚合起始劑於藉由紫外線等活性能量線照射之自由基產生反應時,不會產生如斷裂型光聚合起始劑之分解物,故而反應結束後難以成為揮發成分,可減少對被黏著體之損害的方面有用。 On the other hand, when a hydrogen-extracting photopolymerization initiator is reacted by a radical irradiated with an active energy ray such as ultraviolet rays, a decomposition product such as a cleavage type photopolymerization initiator does not occur, so that it is difficult to become a reaction after completion of the reaction. Volatile ingredients are useful in reducing damage to the adherend.
作為上述斷裂型光聚合起始劑,例如可列舉:2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、1-(4-(2-羥基乙氧基)苯基)-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-[4-{4-(2-羥基-2-甲基-丙醯基)苄基1苯基]-2-甲基-丙烷-1-酮、低聚(2-羥基-2-甲基-1-(4-(1-甲基乙烯基)苯基)丙酮)、苯基乙醛酸甲酯、2-苄基-2-二甲胺基-1-(4-啉基苯基)丁烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-啉基丙烷-1-酮、2-(二甲胺基)-2-[(4-甲基苯基)甲基]-1-[4-(4-啉基)苯基]-1-丁酮、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦或該等之衍生物等。 As the above-mentioned cleavable photopolymerization initiator, for example, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy- 2-methyl-1-phenyl-propan-1-one, 1-(4-(2-hydroxyethoxy)phenyl)-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-[4-{4-(2-hydroxy-2-methyl-propenyl)benzyl 1phenyl]-2-methyl-propan-1-one, oligomeric (2-hydroxyl) -2-methyl-1-(4-(1-methylvinyl)phenyl)propanone), methyl phenylglyoxylate, 2-benzyl-2-dimethylamino-1-(4- Polinylphenyl)butan-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2- Lolinylpropan-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4- Phenyl)phenyl]-1-butanone, bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide, 2,4,6-trimethylbenzimidyl diphenyl Phosphine oxide or such derivatives and the like.
作為上述氫抽出型光聚合起始劑,例如可列舉:二苯甲酮、4-甲基-二苯甲酮、2,4,6-三甲基二苯甲酮、4-苯基二苯甲酮、3,3'-二甲基-4-甲氧基二苯甲酮、2-苯甲醯基苯甲酸甲酯、苯甲醯基甲酸甲酯、雙(2-苯基-2-乙醛酸)氧基雙乙烯、4-(1,3-丙烯醯基-1,4,7,10,13-五氧代十三烷基)二苯甲酮、9-氧硫、2-氯-9-氧硫、3-甲基-9-氧硫、2,4-二甲基9-氧硫、2-甲基蒽醌、2-乙基蒽醌、2-第三丁基蒽醌、2-胺基蒽醌或其衍生物等。 Examples of the hydrogen extraction-type photopolymerization initiator include benzophenone, 4-methyl-benzophenone, 2,4,6-trimethylbenzophenone, and 4-phenyldiphenyl. Methyl ketone, 3,3'-dimethyl-4-methoxybenzophenone, methyl 2-benzimidylbenzoate, methyl benzylidenecarboxylate, bis(2-phenyl-2- Glyoxylate)oxydiethylene, 4-(1,3-propenylmercapto-1,4,7,10,13-pentaoxytridecyl)benzophenone, 9-oxosulfur 2-chloro-9-oxosulfur 3-methyl-9-oxosulfur 2,4-dimethyl 9-oxosulfur , 2-methyl hydrazine, 2-ethyl hydrazine, 2-tert-butyl fluorene, 2-amino hydrazine or a derivative thereof.
其中,作為光聚合起始劑,並不限定於上述列舉之物質。可使用斷裂型光聚合起始劑及氫抽出型光聚合起始劑之任一者,亦可組合 使用兩者。 However, the photopolymerization initiator is not limited to the above-exemplified substances. Any one of a rupture type photopolymerization initiator and a hydrogen extraction type photopolymerization initiator may be used, or may be combined Use both.
光聚合起始劑(C1)之含量並無特別限制。作為標準,較佳為以相對於(甲基)丙烯酸酯共聚物(A1)100質量份為0.1~10質量份,其中更佳為0.5質量份以上或5質量份以下,其中進而較佳為1質量份以上或3質量份以下之比例含有。 The content of the photopolymerization initiator (C1) is not particularly limited. The standard is preferably 0.1 to 10 parts by mass, more preferably 0.5 part by mass or more or 5 parts by mass or less, and still more preferably 1 part by mass based on 100 parts by mass of the (meth)acrylate copolymer (A1). It is contained in the ratio of the mass part or more or 3 parts by mass or less.
藉由使光聚合起始劑(C1)之含量為上述範圍,可獲得對活性能量線之適度之反應感度。 By setting the content of the photopolymerization initiator (C1) to the above range, a moderate reaction sensitivity to the active energy ray can be obtained.
(其他成分) (other ingredients)
黏著組合物α亦可含有通常黏著組合物中所調配之公知之成分作為上述以外之成分。例如可適宜含有:黏著賦予樹脂或抗氧化劑、光穩定化劑、金屬惰性化劑、防銹劑、抗老化劑、吸濕劑、防銹劑、抗水解劑等各種添加劑。 The adhesive composition α may also contain a known component formulated in a usual adhesive composition as a component other than the above. For example, various additives such as an adhesion-imparting resin, an antioxidant, a photostabilizer, a metal inerting agent, a rust preventive, an anti-aging agent, a moisture absorbent, a rust preventive, and an anti-hydrolysis agent may be contained.
又,視需要可適宜含有反應觸媒(三級胺系化合物、四級銨系化合物、月桂酸錫化合物等)。 Moreover, a reaction catalyst (a tertiary amine compound, a quaternary ammonium compound, a lauric acid compound, etc.) may be contained as needed.
<黏著組合物β> <Adhesive composition β>
作為黏著組合物β,可列舉含有玻璃轉移溫度(Tg)未達0℃之單體a1與玻璃轉移溫度(Tg)為0℃以上且未達80℃之單體a2與玻璃轉移溫度(Tg)為80℃以上之單體a3以a1:a2:a3=10~40:90~35:0~25之莫耳比率進行共聚合而成之重量平均分子量為50000~400000之(甲基)丙烯酸酯共聚物(A2)、交聯劑(B2)及光聚合起始劑(C2)之樹脂組合物。 Examples of the adhesive composition β include a monomer a1 having a glass transition temperature (Tg) of less than 0 ° C and a monomer a 2 and a glass transition temperature (Tg) having a glass transition temperature (Tg) of 0 ° C or more and less than 80 ° C. A (meth) acrylate having a weight average molecular weight of 50,000 to 400,000 obtained by copolymerizing a monomer a3 at 80 ° C or higher at a molar ratio of a1:a2:a3=10 to 40:90 to 35:0 to 25 A resin composition of a copolymer (A2), a crosslinking agent (B2), and a photopolymerization initiator (C2).
((甲基)丙烯酸酯共聚物(A2)) ((Meth)acrylate copolymer (A2))
於黏著組合物β中,就兼具室溫狀態下之形狀保持性與熱熔性之觀點而言,又,如下所述,就將130℃熔融黏度調整為特定範圍之觀點而言,作為基礎聚合物之(甲基)丙烯酸酯共聚物(A2)之重量平均分子量較佳為50000~400000,其中更佳為60000以上或350000以下,其 中進而較佳為70000以上或300000以下。 In the viewpoint of the shape retention property and the hot-melt property in the room temperature state, the adhesion composition β is based on the viewpoint of adjusting the melt viscosity of 130 ° C to a specific range as described below. The weight average molecular weight of the (meth) acrylate copolymer (A2) of the polymer is preferably from 50,000 to 400,000, more preferably more than 60,000 or less than 350,000. Further, it is preferably 70,000 or more or 300,000 or less.
(甲基)丙烯酸酯共聚物(A2)可藉由適宜選擇用以調整其之丙烯酸系單體或甲基丙烯酸系單體之種類、組成比率、進而聚合條件等,而適宜調整玻璃轉移溫度(Tg)或分子量等物性。 The (meth) acrylate copolymer (A2) can be suitably adjusted to adjust the glass transition temperature by appropriately selecting the type, composition ratio, polymerization conditions, and the like of the acrylic monomer or methacrylic monomer. Tg) or physical properties such as molecular weight.
此時,作為構成丙烯酸酯共聚物之丙烯酸系單體,例如可列舉:(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸乙酯等作為主原料。 In this case, examples of the acrylic monomer constituting the acrylate copolymer include 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, and isooctyl (meth)acrylate. As the main raw material, n-butyl methacrylate, ethyl (meth) acrylate or the like.
該等之外,根據凝集力賦予或極性賦予等目的,亦可使具有各種官能基之(甲基)丙烯酸系單體與上述丙烯酸系單體共聚合。 In addition to these, it is also possible to copolymerize a (meth)acrylic monomer having various functional groups with the above acrylic monomer for the purpose of imparting aggregating power or imparting polarity.
作為該具有官能基之(甲基)丙烯酸系單體,例如可列舉:甲基丙烯酸甲酯、丙烯酸甲酯、丙烯酸羥基乙酯、丙烯酸、(甲基)丙烯酸縮水甘油酯、N-取代(甲基)丙烯醯胺、丙烯腈、甲基丙烯腈、(甲基)丙烯酸含氟烷基酯、含有機矽烷氧基之(甲基)丙烯酸酯等。 Examples of the (meth)acrylic monomer having a functional group include methyl methacrylate, methyl acrylate, hydroxyethyl acrylate, acrylic acid, glycidyl (meth)acrylate, and N-substituted (A). Base) acrylamide, acrylonitrile, methacrylonitrile, fluoroalkyl (meth) acrylate, (meth) acrylate containing a decyloxy group, and the like.
作為(甲基)丙烯酸酯共聚物(A2),較佳為玻璃轉移溫度(Tg)未達0℃之單體a1與玻璃轉移溫度(Tg)為0℃以上且未達80℃之單體a2與玻璃轉移溫度(Tg)為80℃以上之單體a3以a1:a2:a3=10~40:90~35:0~25之莫耳比率進行共聚合而成之(甲基)丙烯酸酯共聚物。 As the (meth) acrylate copolymer (A2), a monomer a1 having a glass transition temperature (Tg) of less than 0 ° C and a monomer a2 having a glass transition temperature (Tg) of 0 ° C or more and less than 80 ° C are preferable. (Meth) acrylate copolymerization with a monomer a3 having a glass transition temperature (Tg) of 80 ° C or higher and a molar ratio of a1: a2: a3 = 10 to 40: 90 to 35: 0 to 25 Things.
此時,單體a1、a2及a3之各玻璃轉移溫度(Tg)係指自該單體製作聚合物時(均聚物化)之各玻璃轉移溫度(Tg)。 At this time, the respective glass transition temperatures (Tg) of the monomers a1, a2, and a3 refer to the respective glass transition temperatures (Tg) when the polymer is produced from the monomer (homopolymerization).
上述單體a1例如較佳為具有具備碳數4以上之側鏈之烷基結構之(甲基)丙烯酸酯單體。 The monomer a1 is preferably a (meth) acrylate monomer having an alkyl structure having a side chain having 4 or more carbon atoms.
此時,碳數4以上之側鏈可為包含直鏈者,亦可為包含分支之碳鏈者。 In this case, the side chain having 4 or more carbon atoms may be a linear chain or a carbon chain containing a branch.
更具體而言,上述單體a1較佳為具有碳數4~10之直鏈烷基結構之(甲基)丙烯酸酯單體、或具有碳數6~18之支鏈烷基結構之(甲基)丙烯酸酯單體。 More specifically, the monomer a1 is preferably a (meth) acrylate monomer having a linear alkyl structure of 4 to 10 carbon atoms or a branched alkyl structure having a carbon number of 6 to 18 (A) Base) acrylate monomer.
此處,作為「具有碳數4~10之直鏈烷基結構之(甲基)丙烯酸酯單體」,可列舉:丙烯酸正丁酯、丙烯酸正己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸正癸酯等。 Here, examples of the (meth) acrylate monomer having a linear alkyl structure having 4 to 10 carbon atoms include n-butyl acrylate, n-hexyl acrylate, and n-octyl (meth) acrylate. N-decyl methacrylate, n-decyl (meth) acrylate, and the like.
另一方面,作為「具有碳數6~18之支鏈烷基結構之(甲基)丙烯酸酯單體」,可列舉:(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸2-甲基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸異癸酯等。 On the other hand, as the (meth) acrylate monomer having a branched alkyl structure having 6 to 18 carbon atoms, 2-ethylhexyl (meth)acrylate and (meth)acrylic acid 2 are exemplified. -methylhexyl ester, isooctyl (meth)acrylate, isodecyl (meth)acrylate, isodecyl (meth)acrylate, and the like.
上述單體a2較佳為碳數4以下之(甲基)丙烯酸酯單體、側鏈具有環狀骨架之(甲基)丙烯酸酯單體、碳數4以下之乙烯基單體、或側鏈具有環狀骨架之乙烯基單體。 The monomer a2 is preferably a (meth) acrylate monomer having a carbon number of 4 or less, a (meth) acrylate monomer having a cyclic skeleton in a side chain, a vinyl monomer having a carbon number of 4 or less, or a side chain. A vinyl monomer having a cyclic skeleton.
其中,上述單體a2尤佳為側鏈之碳數為4以下之乙烯基單體。 Among them, the monomer a2 is particularly preferably a vinyl monomer having a carbon number of 4 or less in the side chain.
此處,作為「碳數4以下之(甲基)丙烯酸酯單體」,可列舉:丙烯酸甲酯、甲基丙烯酸乙酯、丙烯酸正丙酯、甲基丙烯酸正丙酯、丙烯酸異丙酯、甲基丙烯酸異丙酯、甲基丙烯酸正丁酯、丙烯酸第三丁酯、丙烯酸異丁酯、甲基丙烯酸異丁酯等。 Here, examples of the "(meth) acrylate monomer having 4 or less carbon atoms include methyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, and isopropyl acrylate. Isopropyl methacrylate, n-butyl methacrylate, tributyl acrylate, isobutyl acrylate, isobutyl methacrylate, and the like.
作為「側鏈具有環狀骨架之(甲基)丙烯酸酯單體」,可列舉:丙烯酸異酯、丙烯酸環己酯、甲基丙烯酸環己酯、1,4-環己烷二甲醇單丙烯酸酯、甲基丙烯酸四氫糠酯、丙烯酸苄酯、甲基丙烯酸苄酯、丙烯酸苯氧基乙酯、甲基丙烯酸苯氧基乙酯、丙烯酸2-羥基-3-苯氧基丙酯、3,3,5-三甲基環己醇丙烯酸酯、環狀三羥甲基丙烷甲縮醛丙烯酸酯、4-乙氧化異丙苯基苯酚丙烯酸酯、丙烯酸二環戊烯基氧基乙酯、甲基丙烯酸二環戊烯基氧基乙酯、丙烯酸二環戊烯酯等。 Examples of the (meth) acrylate monomer having a cyclic chain in the side chain include acrylic acid Ester, cyclohexyl acrylate, cyclohexyl methacrylate, 1,4-cyclohexane dimethanol monoacrylate, tetrahydrofurfuryl methacrylate, benzyl acrylate, benzyl methacrylate, phenoxy acrylate Ester, phenoxyethyl methacrylate, 2-hydroxy-3-phenoxypropyl acrylate, 3,3,5-trimethylcyclohexanol acrylate, cyclic trimethylolpropane methyl acetal Ester, 4-ethoxylated cumylphenol acrylate, dicyclopentenyloxyethyl acrylate, dicyclopentenyloxyethyl methacrylate, dicyclopentenyl acrylate, and the like.
作為「碳數4以下之乙烯基單體」,可列舉:乙酸乙烯酯、丙烯乙烯酯、丁酸乙烯酯、正丙基乙烯醚、異丙基乙烯醚、正丁基乙烯醚、異丁基乙烯醚等。 Examples of the "vinyl monomer having 4 or less carbon atoms" include vinyl acetate, propylene vinyl ester, vinyl butyrate, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, and isobutylene. Vinyl ether and the like.
作為「側鏈具有環狀骨架之乙烯基單體」,可列舉:苯乙烯、環 己基乙烯醚、降基乙烯醚,降烯基乙烯醚等。其中,尤佳為側鏈之碳數為4以下之乙烯基單體或側鏈之碳數為4以下之丙烯酸酯單體。 Examples of the "vinyl monomer having a cyclic skeleton in the side chain" include styrene, cyclohexyl vinyl ether, and lowering. Vinyl ether Alkenyl vinyl ether and the like. Among them, an acrylate monomer having a carbon number of 4 or less in the side chain or a carbon number of 4 or less in the side chain is particularly preferable.
上述單體a3較佳為側鏈之碳數為1以下之(甲基)丙烯酸酯單體、或側鏈具有環狀骨架之(甲基)丙烯酸酯單體。 The monomer a3 is preferably a (meth) acrylate monomer having a carbon number of 1 or less in a side chain or a (meth) acrylate monomer having a cyclic skeleton in a side chain.
此處,作為「側鏈之碳數為1以下之(甲基)丙烯酸酯單體」,可列舉:甲基丙烯酸甲酯、丙烯酸、甲基丙烯酸等。 Here, examples of the "(meth) acrylate monomer having a carbon number of 1 or less in the side chain include methyl methacrylate, acrylic acid, methacrylic acid, and the like.
作為「側鏈具有環狀骨架之(甲基)丙烯酸酯單體」,可列舉:甲基丙烯酸異酯、甲基丙烯酸3,3,5-三甲基環己酯、丙烯酸二環戊酯、甲基丙烯酸二環戊酯、甲基丙烯酸二環戊烯酯等。 Examples of the (meth) acrylate monomer having a cyclic chain in the side chain include methacrylic acid Ester, 3,3,5-trimethylcyclohexyl methacrylate, dicyclopentanyl acrylate, dicyclopentanyl methacrylate, dicyclopentenyl methacrylate, and the like.
若(甲基)丙烯酸酯共聚物(A2)含有單體a1與單體a2與單體a3以a1:a2:a3=10~40:90~35:0~25之莫耳比率進行共聚合而成之(甲基)丙烯酸酯共聚物,則可將Tanδ之波峰調整為0~20℃,於通常狀態,即室溫狀態下,可保持為片狀之形狀,並且可表現出可剝離之程度之接著性(稱為“黏性”)。又,若加熱為可熱熔之溫度,則可表現出流動性,可追隨貼合面之階差部而填充至各個角落。 If the (meth) acrylate copolymer (A2) contains monomer a1 and monomer a2 and monomer a3 is copolymerized at a molar ratio of a1:a2:a3=10~40:90~35:0-25 The (meth) acrylate copolymer can adjust the peak of Tan δ to 0 to 20 ° C, and can maintain a sheet shape in a normal state, that is, at room temperature, and can exhibit a peelable degree. The continuum (called "stickiness"). Further, when the temperature is heated to a heat-fusible temperature, fluidity can be exhibited, and the step portion of the bonding surface can be followed to fill the respective corners.
因此,就該觀點而言,構成(甲基)丙烯酸酯共聚物(A2)之(甲基)丙烯酸酯共聚物中之單體a1與單體a2與單體a3之莫耳比率較佳為a1:a2:a3=10~40:90~35:0~25,其中較佳為13~40:87~35:0~23,其中更佳為15~40:85~38:2~20。 Therefore, from this point of view, the molar ratio of the monomer a1 and the monomer a2 to the monomer a3 in the (meth) acrylate copolymer constituting the (meth) acrylate copolymer (A2) is preferably a1. :a2:a3=10~40:90~35:0~25, preferably 13~40:87~35:0~23, and more preferably 15~40:85~38:2~20.
又,就與上述相同之觀點而言,構成(甲基)丙烯酸酯共聚物(A2)之(甲基)丙烯酸酯共聚物或乙烯基共聚物中之單體a1與單體a2與單體a3之莫耳比率較佳為a2>a1>a3。 Further, in the same viewpoint as described above, the monomer a1 and the monomer a2 and the monomer a3 in the (meth) acrylate copolymer or the vinyl copolymer constituting the (meth) acrylate copolymer (A2) The molar ratio is preferably a2>a1>a3.
(交聯劑(B2)) (crosslinking agent (B2))
藉由使交聯劑(B2)進行交聯反應,可使黏著組合物β於高溫環境下表現較高之凝集力,獲得優異之耐發泡可靠性。 By crosslinking the crosslinking agent (B2), the adhesive composition β can exhibit a high cohesive force in a high-temperature environment, and excellent foaming reliability can be obtained.
作為此種交聯劑(B2),例如可適宜選擇環氧交聯劑或異氰酸酯交 聯劑,包含氧雜環丁烷化合物、矽烷化合物、丙烯酸系化合物等之交聯劑。其中,就反應性或所得硬化物之強度之方面而言,較佳為具有2個以上之(甲基)丙烯醯基,其中較佳為具有3個以上之(甲基)丙烯醯基之多官能(甲基)丙烯酸酯單體。 As such a crosslinking agent (B2), for example, an epoxy crosslinking agent or an isocyanate crosslinking can be suitably selected. The crosslinking agent includes a crosslinking agent such as an oxetane compound, a decane compound, or an acrylic compound. Among them, in terms of reactivity or strength of the obtained cured product, it is preferred to have two or more (meth) acrylonitrile groups, and among them, it is preferred to have three or more (meth) acryl fluorenyl groups. Functional (meth) acrylate monomer.
作為此種多官能(甲基)丙烯酸酯單體,例如可列舉:1,4-丁二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、雙酚A聚乙氧基二(甲基)丙烯酸酯、雙酚A聚丙氧基二(甲基)丙烯酸酯、雙酚F聚乙氧基二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、三羥甲基丙烷三氧基乙基(甲基)丙烯酸酯、ε-己內酯改性三(2-羥基乙基)異氰尿酸酯三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、丙氧化季戊四醇三(甲基)丙烯酸酯、乙氧化季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、丙氧化季戊四醇四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、三(丙烯醯氧基乙基)異氰尿酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、三季戊四醇六(甲基)丙烯酸酯、三季戊四醇五(甲基)丙烯酸酯、羥基特戊酸新戊二醇二(甲基)丙烯酸酯、羥基特戊酸新戊二醇之ε-己內酯加成物之二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷聚乙氧基三(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯等紫外線硬化型之多官能單體類,另外亦可列舉:聚酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯、聚醚(甲基)丙烯酸酯等多官能丙烯酸酯低聚物類。 Examples of such a polyfunctional (meth) acrylate monomer include 1,4-butanediol di(meth)acrylate, glycerol di(meth)acrylate, and 1,6-hexanediol. (Meth) acrylate, 1,9-nonanediol di(meth) acrylate, tricyclodecane dimethanol di(meth) acrylate, bisphenol A polyethoxy di(meth) acrylate , bisphenol A polypropoxy di(meth) acrylate, bisphenol F polyethoxy di(meth) acrylate, neopentyl glycol di (meth) acrylate, ethylene glycol di(methyl) Acrylate, trimethylolpropane trioxyethyl (meth) acrylate, ε-caprolactone modified tris(2-hydroxyethyl)isocyanurate tri(meth) acrylate, pentaerythritol III (meth) acrylate, pentaerythritol tri(meth) acrylate, pentaerythritol tri(meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tetra(meth) acrylate, B Pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth) acrylate, polyethylene glycol di(meth) acrylate, tris(propylene decyloxyethyl)isocyanurate, penta Alcohol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol penta (meth) acrylate, hydroxyl Di(meth)acrylate of pivalic acid neopentyl glycol di(meth)acrylate, ε-caprolactone adduct of hydroxypivalic acid neopentyl glycol, trimethylolpropane tris(methyl) UV-curable polyfunctional monomers such as acrylate, trimethylolpropane polyethoxy tris(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, etc. Polyfunctional acrylate oligomers such as polyester (meth) acrylate, epoxy (meth) acrylate, (meth) acrylate, and polyether (meth) acrylate.
上述例示中,就提高對被黏著體之密接性或耐熱性、濕熱白化抑制之效果之觀點而言,較佳為含有極性官能基之多官能單體或低聚 物。其中,較佳為使用具有異三聚氰酸環骨架之多官能(甲基)丙烯酸酯單體。 In the above-described examples, from the viewpoint of improving the adhesion to the adherend, the heat resistance, and the effect of suppressing the wet heat whitening, a polyfunctional monomer or oligomer having a polar functional group is preferred. Things. Among them, a polyfunctional (meth) acrylate monomer having a hetero-cyanuric acid ring skeleton is preferably used.
交聯劑(B2)之含量並無特別限制。作為標準,較佳為相對於(甲基)丙烯酸酯共聚物(A2)100質量份為0.5~20質量份,其中更佳為1質量份以上或15質量份以下,其中進而較佳為2質量份以上或10質量份以下之比例。 The content of the crosslinking agent (B2) is not particularly limited. The standard is preferably 0.5 to 20 parts by mass, more preferably 1 part by mass or more or 15 parts by mass or less, more preferably 2 parts by mass, per 100 parts by mass of the (meth) acrylate copolymer (A2). A ratio of more than 10 parts by weight.
藉由於上述範圍內含有交聯劑(B2),可兼具未交聯狀態之光硬化性黏著樹脂層(I層)之形狀穩定性與交聯後之光硬化性黏著樹脂層(I層)之耐發泡可靠性。其中,考慮到與其他要素之平衡,亦可超過該範圍。 By the crosslinking agent (B2) in the above range, the shape-stable stability of the photocurable adhesive resin layer (I layer) in an uncrosslinked state and the photocurable adhesive resin layer (I layer) after crosslinking Resistant to foaming reliability. Among them, considering the balance with other elements, it is also possible to exceed this range.
(光聚合起始劑(C2)) (Photopolymerization initiator (C2))
光聚合起始劑(C2)係發揮作為上述交聯劑(B2)之交聯反應之反應起始助劑之功能。可適宜使用以活性能量線為觸發而產生自由基之有機過氧化物或光聚合起始劑等。其中,就控制交聯反應之容易性之觀點而言,較佳為光聚合起始劑,尤其感應波長380nm以下之紫外線之光聚合起始劑。 The photopolymerization initiator (C2) functions as a reaction initiation aid for the crosslinking reaction of the above crosslinking agent (B2). An organic peroxide or a photopolymerization initiator which generates a radical by activating the active energy ray may be suitably used. Among them, from the viewpoint of controlling the easiness of the crosslinking reaction, a photopolymerization initiator, in particular, a photopolymerization initiator which induces ultraviolet rays having a wavelength of 380 nm or less is preferable.
另一方面,若使用感應波長長於波長380nm之光之光聚合起始劑,則就交聯反應易於進行,例如即使於介隔缺乏紫外線透過性之構件進行光照射之情形時亦可使光硬化性樹脂層(I層)硬化的方面而言較佳。 On the other hand, when a photopolymerization initiator which induces light having a wavelength longer than a wavelength of 380 nm is used, the crosslinking reaction proceeds easily, for example, even when light is irradiated through a member which lacks ultraviolet ray permeability. The resin layer (I layer) is preferred in terms of hardening.
光聚合起始劑根據自由基產生機制而大致分類為兩種,可大致分為:可使光聚合性起始劑自身之單鍵斷裂分解而產生自由基之斷裂型光聚合起始劑,以及光激發之起始劑與系統中之氫供與體形成激發錯合物而可轉移氫供與體之氫的氫抽出型光聚合起始劑。 The photopolymerization initiator is roughly classified into two types according to a radical generation mechanism, and can be roughly classified into a cleavage type photopolymerization initiator which can decompose a single bond of a photopolymerization initiator itself to generate a radical, and The photoexcited initiator and the hydrogen donor in the system form a hydrogen-extracting photopolymerization initiator which promotes the complex and transfers hydrogen to the hydrogen donor.
該等中之斷裂型光聚合起始劑藉由光照射而產生自由基時分解而成為其他化合物,若暫時被激發則無法具有作為反應起始劑之功 能。故而,不會於交聯反應結束後之黏著片中作為活性物質而殘存,不存在對黏著片帶來未預期之光劣化等之可能性,故而較佳。 In the above-mentioned cleavage type photopolymerization initiator, it is decomposed into other compounds by generating a radical by light irradiation, and if it is temporarily excited, it cannot have the work as a reaction initiator. can. Therefore, it is preferable that the adhesive sheet does not remain as an active material in the adhesive sheet after completion of the crosslinking reaction, and there is no possibility of causing undesired photodegradation or the like to the adhesive sheet.
另一方面,氫抽出型之光聚合起始劑於藉由紫外線等活性能量線照射之自由基產生反應時,不會產生如斷裂型光聚合起始劑之分解物,故而反應結束後難以成為揮發成分,可減少對被黏著體之損害的方面有用。 On the other hand, when a hydrogen-extracting photopolymerization initiator is reacted by a radical irradiated with an active energy ray such as ultraviolet rays, a decomposition product such as a cleavage type photopolymerization initiator does not occur, so that it is difficult to become a reaction after completion of the reaction. Volatile ingredients are useful in reducing damage to the adherend.
作為上述斷裂型光聚合起始劑,例如可列舉:安息香丁醚、苯偶醯二甲基縮酮、2-羥基苯乙酮、二苯基-2,4,6-三甲基苯甲醯基氧化膦或該等之衍生物等。 Examples of the above-mentioned cleavage type photopolymerization initiator include benzoin butyl ether, benzoin dimethyl ketal, 2-hydroxyacetophenone, and diphenyl-2,4,6-trimethylbenzhydrazide. Phosphine oxide or such derivatives and the like.
作為上述氫抽出型光聚合起始劑,例如可列舉:二苯甲酮、米其勒酮、2-乙基蒽醌、噻噸酮或其衍生物等。 Examples of the hydrogen extraction-type photopolymerization initiator include benzophenone, mischoketone, 2-ethylhydrazine, thioxanthone or a derivative thereof.
其中,並不限定於作為光聚合起始劑而於上述列舉之物質。黏著組合物β可使用斷裂型光聚合起始劑及氫抽出型光聚合起始劑之任一種,亦可組合兩者使用。 However, it is not limited to the above-mentioned thing as a photopolymerization initiator. As the adhesive composition β, either a cleavage type photopolymerization initiator or a hydrogen extraction type photopolymerization initiator may be used, or both may be used in combination.
光聚合起始劑(C2)之含量並無特別限制。作為標準,較佳為以相對於(甲基)丙烯酸酯共聚物(A2)100質量份為0.1~10質量份,其中更佳為0.5質量份以上或5質量份以下,其中進而較佳為1質量份以上或3質量份以下之比例含有。 The content of the photopolymerization initiator (C2) is not particularly limited. The standard is preferably 0.1 to 10 parts by mass, more preferably 0.5 part by mass or more or 5 parts by mass or less, and still more preferably 1 part by mass based on 100 parts by mass of the (meth)acrylate copolymer (A2). It is contained in the ratio of the mass part or more or 3 parts by mass or less.
藉由使光聚合起始劑(C2)之含量為上述範圍,可獲得對活性能量線之適度之反應感度。 By setting the content of the photopolymerization initiator (C2) to the above range, a moderate reaction sensitivity to the active energy ray can be obtained.
(其他成分) (other ingredients)
黏著組合物β亦可含有通常黏著組合物中所調配之公知之成分作為上述以外之成分。例如視需要可適宜含有:黏著賦予樹脂或抗氧化劑、光穩定化劑、金屬惰性化劑、防銹劑、抗老化劑、吸濕劑等各種添加劑。 The adhesive composition β may also contain a known component formulated in a usual adhesive composition as a component other than the above. For example, various additives such as an adhesion-imparting resin or an antioxidant, a photostabilizer, a metal inerting agent, a rust preventive, an anti-aging agent, and a moisture absorbent may be contained as needed.
又,視需要可適宜含有反應觸媒(三級胺系化合物、四級銨系化 合物、月桂酸錫化合物等)。 Further, a reaction catalyst (a tertiary amine compound or a quaternary ammonium system) may be suitably contained as needed. Compound, tin laurate compound, etc.).
脫模層(II層)較佳係由含有烯烴系聚合物(D)作為基礎聚合物之樹脂組合物所形成之層。 The release layer (layer II) is preferably a layer formed of a resin composition containing an olefin-based polymer (D) as a base polymer.
<烯烴系聚合物(D)> <Olefin polymer (D)>
作為烯烴系聚合物(D),例如可列舉:乙烯-α-烯烴共聚物、苯乙烯系彈性體、聚異丁烯樹脂、聚丁烯樹脂、聚丁二烯樹脂、聚異戊二烯樹脂、乙烯-環狀烯烴共聚物等,較佳為使用該等中之一種或組合兩種以上使用。 Examples of the olefin-based polymer (D) include an ethylene-α-olefin copolymer, a styrene-based elastomer, a polyisobutylene resin, a polybutene resin, a polybutadiene resin, a polyisoprene resin, and ethylene. The cyclic olefin copolymer or the like is preferably used alone or in combination of two or more.
其中,就可賦予電特性或水蒸氣阻隔性、透明性、柔軟性、片材加工性、耐候可靠性等之觀點而言,尤佳使用乙烯-α-烯烴共聚物、苯乙烯系彈性體及聚異丁烯樹脂中之任一種或組合使用兩種以上。 Among them, an ethylene-α-olefin copolymer, a styrene-based elastomer, and the like are preferably used from the viewpoint of imparting electrical properties, water vapor barrier properties, transparency, flexibility, sheet processability, and weather resistance reliability. Any one or a combination of two or more kinds of polyisobutylene resins may be used.
此時,亦可使用組成或分子量不同之兩種以上之烯烴系聚合物。 In this case, two or more kinds of olefin polymers having different compositions or molecular weights may also be used.
作為上述「乙烯-α-烯烴共聚物」,若為乙烯與α-烯烴之共聚物即可。 The "ethylene-α-olefin copolymer" may be a copolymer of ethylene and an α-olefin.
作為與乙烯共聚合之α-烯烴之種類,並無特別限定。通常可較佳使用碳數為3~20之α-烯烴。例如可列舉:丙烯、1-丁烯、1-戊烯、1-己烯、1-庚烯、1-辛烯、1-壬烯、1-癸烯、3-甲基-1-丁烯、4-甲基-1-戊烯等。其中,就工業性獲取之容易性、經濟性等之觀點而言,作為α-烯烴,較佳為將1-丁烯、1-己烯或1-辛烯作為共聚合成分之共聚物。此時,與乙烯共聚合之α-烯烴可僅單獨使用一種,亦可以任意比率組合使用兩種以上。 The type of the α-olefin copolymerized with ethylene is not particularly limited. Generally, an α-olefin having a carbon number of 3 to 20 can be preferably used. For example, propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-decene, 1-decene, 3-methyl-1-butene , 4-methyl-1-pentene, and the like. Among them, the α-olefin is preferably a copolymer of 1-butene, 1-hexene or 1-octene as a copolymerization component from the viewpoints of ease of industrial availability, economy, and the like. In this case, the α-olefin copolymerized with ethylene may be used alone or in combination of two or more kinds in any ratio.
又,與乙烯共聚合之α-烯烴之含量並無特別限定。例如,相對於共聚合中所使用之單體整體,較佳為2莫耳%~40莫耳%,其中更佳為 3莫耳%以上或30莫耳%以下,其中進而較佳為5莫耳%以上或25莫耳%以下。若與乙烯共聚合之α-烯烴之含量為上述範圍內,則藉由共聚合成分而使結晶性減低、透明性(例如全光線透過率、霧度等)提高,故而較佳。又,若與乙烯共聚合之α-烯烴之含量為上述範圍內,則於製作原料顆粒之情形時可抑制黏連之發生等,故而較佳。 Further, the content of the α-olefin copolymerized with ethylene is not particularly limited. For example, it is preferably 2% by mole to 40% by mole based on the total amount of the monomers used in the copolymerization, and more preferably 3 mol% or more or 30 mol% or less, and further preferably 5 mol% or more or 25 mol% or less. When the content of the α-olefin copolymerized with ethylene is within the above range, the crystallinity is lowered by the copolymerization component, and transparency (for example, total light transmittance, haze, etc.) is improved, which is preferable. In addition, when the content of the α-olefin copolymerized with ethylene is within the above range, it is preferable to suppress the occurrence of adhesion or the like in the case of producing the raw material particles.
再者,與乙烯共聚合之α-烯烴之種類及含量可藉由眾所周知之方法,例如核磁共振(NMR:Nuclear Magnetic Resonance)測定裝置、其他機器分析裝置進行分析。 Further, the kind and content of the α-olefin copolymerized with ethylene can be analyzed by a well-known method such as a nuclear magnetic resonance (NMR: Nuclear Magnetic Resonance) measuring device or another machine analyzing device.
上述乙烯-α-烯烴共聚物亦可含有基於α-烯烴以外之單體之單體單元。 The above ethylene-α-olefin copolymer may also contain a monomer unit based on a monomer other than the α-olefin.
作為上述單體單元,例如可列舉:環狀烯烴、乙烯基芳香族化合物(苯乙烯等)、多烯化合物等。 Examples of the monomer unit include a cyclic olefin, a vinyl aromatic compound (such as styrene), and a polyene compound.
作為上述單體單元之含量,於將乙烯-α-烯烴共聚物中之全部單體單元設為100莫耳%之情形時,較佳為20莫耳%以下,更佳為15莫耳%以下。 When the content of the monomer unit is 100 mol% of all the monomer units in the ethylene-α-olefin copolymer, it is preferably 20 mol% or less, more preferably 15 mol% or less. .
又,乙烯-α-烯烴共聚物之立體結構、分支、分支度分佈、分子量分佈或共聚合形式(無規、嵌段等)並無特別限制,例如,具有長鏈分支之共聚物,即主鏈本身具有分支之共聚物通常機械物性良好,又,具有形成膜時之熔融張力(melt tension)變高,成形性提高等之優點。 Further, the stereostructure, branching, branching distribution, molecular weight distribution or copolymerization form (random, block, etc.) of the ethylene-α-olefin copolymer is not particularly limited, and for example, a copolymer having a long-chain branch, that is, a main The copolymer having a branched chain itself is generally excellent in mechanical properties, and has an advantage that the melt tension at the time of film formation is increased, and the formability is improved.
上述乙烯-α-烯烴共聚物可具有結晶熔融波峰亦可不具有結晶熔融波峰。結晶熔融波峰溫度之上限並無特別限定。若考慮透明性或低溫柔軟性,則較佳為100℃以下,更佳為80℃以下,進而較佳為65℃以下。又,若考慮原料顆粒之抗黏連或黏著材之處理性、室溫下之形狀保持性能等,則結晶熔融波峰溫度之下限較佳為20℃以上,更佳為30℃以上,進而較佳為40℃以上。又,結晶熔融波峰溫度可為複數 個。 The above ethylene-α-olefin copolymer may have a crystal melting peak or no crystal melting peak. The upper limit of the crystal melting peak temperature is not particularly limited. In consideration of transparency or low-temperature flexibility, it is preferably 100 ° C or lower, more preferably 80 ° C or lower, and still more preferably 65 ° C or lower. Further, in consideration of the anti-blocking property of the raw material particles or the shape retention property at room temperature, the lower limit of the crystal melting peak temperature is preferably 20 ° C or more, more preferably 30 ° C or more, and further preferably It is 40 ° C or more. Also, the crystal melting peak temperature can be plural One.
上述乙烯-α-烯烴共聚物之結晶熔融熱量並無特別限定。較佳為0~100J/g,其中更佳為5J/g以上或80J/g以下,其中更佳為10J/g以上或65J/g以下。若為上述範圍內,則可確保柔軟性或透明性等,故而較佳。 The heat of crystal fusion of the ethylene-α-olefin copolymer is not particularly limited. It is preferably 0 to 100 J/g, more preferably 5 J/g or more or 80 J/g or less, and more preferably 10 J/g or more or 65 J/g or less. When it is in the above range, flexibility, transparency, and the like can be secured, which is preferable.
再者,上述結晶熔融波峰溫度及結晶熔融熱量可使用示差掃描熱量計(DSC),依據JIS K-7121以加熱速度10℃/分鐘進行測定。 Further, the crystal melting peak temperature and the crystal melting heat amount can be measured by a differential scanning calorimeter (DSC) at a heating rate of 10 ° C/min in accordance with JIS K-7121.
上述乙烯-α-烯烴共聚物之JIS K-7210之MFR(melt mass-flow rate,熔體質量流速)較佳為1~80g/10min,其中更佳為5g/10min以上或60g/10min以下,其中尤佳為8g/10min以上或50g/10min以下。 The MFR (melt mass-flow rate) of the above-mentioned ethylene-α-olefin copolymer JIS K-7210 is preferably from 1 to 80 g/10 min, more preferably from 5 g/10 min to 60 g/10 min. More preferably, it is 8 g/10 min or more or 50 g/10 min or less.
作為乙烯-α-烯烴共聚物,為賦予優異之透明性或低溫特性等,較佳為密度為0.850~0.900g/cm3之乙烯-α-烯烴共聚物,更佳為密度為0.860~0.885g/cm3之乙烯-α-烯烴共聚物(線狀低密度聚乙烯)。 The ethylene-α-olefin copolymer is preferably an ethylene-α-olefin copolymer having a density of 0.850 to 0.900 g/cm 3 , more preferably a density of 0.860 to 0.885 g, in order to impart excellent transparency or low-temperature characteristics. /cm 3 ethylene-α-olefin copolymer (linear low density polyethylene).
乙烯-α-烯烴共聚物中,就結晶性較低,光之透過率及柔軟性優異之觀點而言,更佳為乙烯-α-烯烴無規共聚物。該等可僅單獨使用一種,又,亦可混合兩種以上使用。 Among the ethylene-α-olefin copolymers, an ethylene-α-olefin random copolymer is more preferable from the viewpoint of low crystallinity and excellent light transmittance and flexibility. These may be used alone or in combination of two or more.
上述乙烯-α-烯烴共聚物之製造方法並無特別限定,可採用使用有公知之乙烯聚合用觸媒之公知之聚合方法。作為公知之聚合方法,例如可列舉:使用有以齊格勒-納塔型觸媒為代表之多點觸媒或以茂金屬系觸媒或後茂金屬系觸媒為代表之單點觸媒的漿料聚合法、溶液聚合法、氣相聚合法等,以及使用有自由基起始劑之塊狀聚合法等。 The method for producing the ethylene-α-olefin copolymer is not particularly limited, and a known polymerization method using a known catalyst for ethylene polymerization can be employed. As a known polymerization method, for example, a single catalyst represented by a Ziegler-Natta type catalyst or a single catalyst represented by a metallocene catalyst or a metallocene catalyst may be used. A slurry polymerization method, a solution polymerization method, a gas phase polymerization method, and the like, and a bulk polymerization method using a radical initiator.
就聚合後之造粒(pelletize)之容易性或原料顆粒之抗黏連等之觀點而言,較佳為利用使用有低分子量之成分較少且分子量分佈較窄之原料可聚合之單點觸媒之聚合方法而製造。 From the viewpoints of easiness of pelletization after polymerization or anti-blocking of raw material particles, etc., it is preferred to use a single-touch which can be polymerized using a material having a low molecular weight component and a narrow molecular weight distribution. Manufactured by a polymerization method of a medium.
作為上述「苯乙烯系彈性體」,例如可列舉:SBR(苯乙烯-丁二 烯橡膠)、SIB(苯乙烯-異丁烯橡膠)、SBS(苯乙烯-丁烯-苯乙烯嵌段共聚物)、SIS(苯乙烯-異丁烯-苯乙烯嵌段共聚物)、SEBS(苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物)、SEBC(苯乙烯-乙烯-丁烯-乙烯嵌段共聚物)、SIB(苯乙烯-異丁烯嵌段共聚物)、HSBR(氫化苯乙烯丁二烯橡膠)等。 Examples of the "styrene-based elastomer" include SBR (styrene-butadiene). Ethylene rubber), SIB (styrene-isobutylene rubber), SBS (styrene-butylene-styrene block copolymer), SIS (styrene-isobutylene-styrene block copolymer), SEBS (styrene-ethylene) -butylene-styrene block copolymer), SEBC (styrene-ethylene-butylene-ethylene block copolymer), SIB (styrene-isobutylene block copolymer), HSBR (hydrogenated styrene butadiene rubber) )Wait.
苯乙烯系彈性體中之苯乙烯含量並無特別限制。例如就耐候性之觀點而言,較佳為相對於構成彈性體之全部單體成分為20莫耳%以下。 The styrene content in the styrene-based elastomer is not particularly limited. For example, from the viewpoint of weather resistance, it is preferably 20 mol% or less based on the total monomer components constituting the elastomer.
上述苯乙烯系彈性體之MFR(JIS K7210:溫度190℃,荷重21.18N)並無特別限制。較佳為5g/10min~100g/10min,其中更佳為8g/10min以上或80g/10min以下,其中進而較佳為10g/10min以上或50g/10min以下。 The MFR of the above styrene-based elastomer (JIS K7210: temperature: 190 ° C, load: 21.18 N) is not particularly limited. It is preferably 5 g/10 min to 100 g/10 min, more preferably 8 g/10 min or more or 80 g/10 min or less, and further preferably 10 g/10 min or more or 50 g/10 min or less.
作為上述「聚異丁烯樹脂」,若為於主鏈或側鏈具有聚異丁烯骨架之樹脂即可。例如,異丁烯單體之均聚物、異丁烯與少量異戊二烯之共聚物、異丁烯與正丁烷或丁二烯之共聚物等。 The "polyisobutylene resin" may be a resin having a polyisobutylene skeleton in a main chain or a side chain. For example, a homopolymer of an isobutylene monomer, a copolymer of isobutylene and a small amount of isoprene, a copolymer of isobutylene and n-butane or butadiene, and the like.
上述聚異丁烯樹脂之黏度平均分子量(Mv)並無特別限制。較佳為5萬~40萬,其中更佳為7萬以上或30萬以下,其中進而較佳為10萬以上或20萬以下。藉由使黏度平均分子量(Mv)為上述範圍內,可使加工性、加工後之形狀穩定性及實用上之耐熱性均變得容易提高。 The viscosity average molecular weight (Mv) of the above polyisobutylene resin is not particularly limited. It is preferably 50,000 to 400,000, more preferably 70,000 or more, or 300,000 or less, and further preferably 100,000 or more and 200,000 or less. When the viscosity average molecular weight (Mv) is within the above range, workability, shape stability after processing, and practical heat resistance can be easily improved.
烯烴系聚合物(D)可具有官能基。藉由使用具有官能基之烯烴系聚合物,可提高與下述抗氧化劑等添加劑之相容性,並且可調整與光硬化性樹脂層(I層)或基材層(III層)之接著強度。又,該等可單獨使用,亦可與不具有官能基之烯烴系聚合物併用,若考慮片材化時之成形加工性、經濟性等,則較佳為併用不具有官能基之烯烴系聚合物。 The olefin-based polymer (D) may have a functional group. By using an olefin-based polymer having a functional group, compatibility with an additive such as the following antioxidant can be improved, and the adhesion strength to the photocurable resin layer (I layer) or the substrate layer (III layer) can be adjusted. . Further, these may be used singly or in combination with an olefin-based polymer having no functional group, and in view of moldability, economy, and the like at the time of sheet formation, it is preferred to use an olefin polymerization having no functional group in combination. Things.
作為具有官能基之烯烴系聚合物,較佳為選自由矽烷改性烯烴系聚合物或酸改性烯烴系聚合物、乙烯-乙酸乙烯酯共聚物(EVA)、乙 烯-乙烯醇共聚物(EVOH)、乙烯-甲基丙烯酸甲酯共聚物(E-MMA)、乙烯-丙烯酸乙酯共聚物(E-EAA)、乙烯-甲基丙烯酸縮水甘油酯共聚物(E-GMA)所組成之群中之至少一種樹脂。 The olefin-based polymer having a functional group is preferably selected from a decane-modified olefin-based polymer or an acid-modified olefin-based polymer, an ethylene-vinyl acetate copolymer (EVA), and B. Ethylene-vinyl alcohol copolymer (EVOH), ethylene-methyl methacrylate copolymer (E-MMA), ethylene-ethyl acrylate copolymer (E-EAA), ethylene-glycidyl methacrylate copolymer (E -GMA) at least one resin of the group consisting of.
烯烴系聚合物(D)之分子量如下所述,就將130℃熔融黏度調整為特定範圍之觀點而言,較佳為5萬~40萬,其中更佳為6萬以上或30萬以下,其中尤佳為7萬以上或20萬以下。 The molecular weight of the olefin polymer (D) is preferably from 50,000 to 400,000, more preferably from 60,000 to 300,000, and more preferably from 60,000 to 300,000, from the viewpoint of adjusting the melt viscosity at 130 ° C to a specific range as described below. It is especially good for more than 70,000 or less than 200,000.
<其他樹脂> <Other resins>
脫模層(II層)中,除上述烯烴系聚合物(D)以外,可視需要添加各種添加劑。 In the mold release layer (layer II), various additives may be added as needed in addition to the above olefin polymer (D).
作為該添加劑,例如可列舉:矽烷偶合劑、抗氧化劑、耐候穩定劑、加工助劑、造核劑、紫外線吸收劑、阻燃劑、防變色劑等。該等添加劑可單獨使用,亦可組合兩種以上使用。 Examples of the additive include a decane coupling agent, an antioxidant, a weathering stabilizer, a processing aid, a nucleating agent, an ultraviolet absorber, a flame retardant, and an anti-tarnishing agent. These additives may be used singly or in combination of two or more.
上述基材層(III層)若可作為用以使脫模層(II層)易於剝離之基材而發揮功能即可。因此,較佳為具有某種程度之硬度或黏度,至少較之與以(甲基)丙烯酸酯共聚物(A)為基礎樹脂之光硬化性黏著樹脂層(I層)之接著強度,與以烯烴系聚合物(D)為基礎樹脂之脫模層(II層)之接著強度更高。 The base material layer (III layer) may function as a base material for easily releasing the release layer (layer II). Therefore, it is preferred to have a certain degree of hardness or viscosity, at least as compared with the bonding strength of the photocurable adhesive resin layer (I layer) based on the (meth) acrylate copolymer (A)-based resin, and The olefin-based polymer (D) is a release layer (layer II) of the base resin having a higher bonding strength.
就該觀點而言,基材層(III層)較佳為含有選自由聚酯、聚烯烴、聚碳酸酯、丙烯酸系樹脂所組成之群中之一種或兩種以上之熱塑性樹脂作為基礎樹脂之層。 In this regard, the base material layer (III layer) preferably contains one or two or more thermoplastic resins selected from the group consisting of polyester, polyolefin, polycarbonate, and acrylic resin as a base resin. Floor.
其中,為提高與脫模層(II層)之接著強度,較佳為使用聚烯烴系樹脂。 Among them, in order to improve the adhesion strength to the release layer (layer II), a polyolefin resin is preferably used.
再者,基材層(III層)除上述基礎樹脂以外,亦可視需要而添加各種添加劑。 Further, in addition to the above base resin, the base material layer (III layer) may be added with various additives as needed.
作為該添加劑,例如可列舉:矽烷偶合劑、抗氧化劑、耐候穩 定劑、加工助劑、造核劑、紫外線吸收劑、阻燃劑、防變色劑等。該等添加劑可單獨使用,亦可組合兩種以上使用。 Examples of the additive include a decane coupling agent, an antioxidant, and weathering stability. A fixative, a processing aid, a nucleating agent, a UV absorber, a flame retardant, an anti-tarnishing agent, and the like. These additives may be used singly or in combination of two or more.
本黏著片積層體可為於光硬化性黏著樹脂層(I層)之一側介隔脫模層(II層)而具備基材層(III層),另一方面於光硬化性黏著樹脂層(I層)之另一側具備脫模層(IV層)及基材層(V層)的構成。此時,較佳為光硬化性黏著樹脂層(I層)與兩側之脫模層(II層)2種2層共擠壓。 The adhesive sheet laminate may have a base layer (III layer) on one side of the photocurable adhesive resin layer (I layer), and a photocurable adhesive resin layer on the other hand. The other side of the (I layer) has a structure of a release layer (IV layer) and a base material layer (V layer). In this case, it is preferred that the photocurable adhesive resin layer (I layer) and the release layer (II layer) on both sides are coextruded in two layers.
此時,於光硬化性黏著樹脂層(I層)之另一側積層之脫模層(IV層)及基材層(V層)例如可使用膜表面經脫模處理而成之公知之脫模膜。 In this case, the release layer (IV layer) and the base material layer (V layer) which are laminated on the other side of the photocurable adhesive resin layer (I layer) can be, for example, a known method in which the surface of the film is subjected to release treatment. Mold film.
又,亦可為於光硬化性黏著樹脂層(I層)之兩側分別介隔脫模層(II層)而具備基材層(III層)的構成。此時,光硬化性黏著樹脂層(I層)與一側之脫模層(II層)2種3層共擠壓即可。 In addition, a structure in which a base layer (III layer) is provided on both sides of the photocurable adhesive resin layer (I layer) with a release layer (II layer) may be provided. In this case, the photocurable adhesive resin layer (I layer) may be coextruded with two types of three layers of the release layer (layer II).
又,藉由使位於光硬化性黏著樹脂層(I層)之兩側之脫模層(II層)之組成不同,亦可3種3層共擠壓。 Further, by making the composition of the release layer (layer II) located on both sides of the photocurable adhesive resin layer (I layer) different, three types of three layers can be co-extruded.
進而,亦可包含其他層,具體可列舉:SiO2或Al2O3等透明無機氧化膜層或阻隔膜層、顯示器用相位差膜層、抗靜電層等。 Further, other layers may be contained, and specific examples thereof include a transparent inorganic oxide film layer such as SiO 2 or Al 2 O 3 , a barrier film layer, a retardation film layer for display, and an antistatic layer.
本黏著片積層體之厚度可藉由減少片材厚度而實現厚度變薄之要求,但若厚度變得過薄,則例如於貼合構件表面存在凹凸部之情形時,考慮存在階差周圍產生氣泡之可能性。 The thickness of the adhesive sheet laminate body can be reduced in thickness by reducing the thickness of the sheet. However, if the thickness becomes too thin, for example, when there is a concavo-convex portion on the surface of the bonding member, it is considered that there is a step around the generation. The possibility of bubbles.
就該觀點而言,本黏著片積層體之厚度較佳為80~2000μm,其中更佳為100μm以上或1500μm以下,其中尤佳為150μm以上或1000μm以下。 From this point of view, the thickness of the adhesive sheet laminate is preferably from 80 to 2000 μm, more preferably from 100 μm to 1500 μm, and particularly preferably from 150 μm to 1000 μm.
上述光硬化性黏著樹脂層(I層)之厚度較佳為50μm~1000μm,其中更佳為70μm以上或500μm以下,其中進而較佳為100μm以上或350μm以下,上述脫模層(II層)之厚度較佳為5μm~500μm,其中更 佳為10μm以上或350μm以下,其中進而較佳為18μm以上或250μm以下,且上述基材層(III層)之厚度較佳為25μm~500μm,其中更佳為38μm以上或350μm以下,其中進而較佳為50μm以上或250μm以下。 The thickness of the photocurable adhesive resin layer (I layer) is preferably 50 μm to 1000 μm, more preferably 70 μm or more or 500 μm or less, further preferably 100 μm or more or 350 μm or less, and the release layer (layer II). The thickness is preferably from 5 μm to 500 μm, of which Preferably, it is 10 μm or more or 350 μm or less, and further preferably 18 μm or more or 250 μm or less, and the thickness of the base material layer (III layer) is preferably 25 μm to 500 μm, more preferably 38 μm or more or 350 μm or less. Preferably, it is 50 μm or more or 250 μm or less.
本黏著片積層體可獲得以下物性。 The adhesive sheet laminate can obtain the following physical properties.
<熔融黏度> <Fused viscosity>
於本黏著片積層體中,構成上述光硬化性黏著樹脂層(I層)之樹脂組合物之130℃之I層熔融黏度ηI與構成上述脫模層(II層)之樹脂組合物之130℃之II層熔融黏度ηII均為1×101~5×103Pa.s之範圍內,且該I層熔融黏度ηI與該II層熔融黏度ηII之比ηII/ηI較佳為0.05~30。 In the adhesive sheet laminate, the I layer melt viscosity η I at 130 ° C of the resin composition constituting the photocurable adhesive resin layer (I layer) and the resin composition constituting the release layer (layer II) are 130 The melt viscosity η II of the layer II of °C is 1×10 1 ~5×10 3 Pa. Within the range of s, the ratio η II /η I of the melt viscosity η I of the layer I to the melt viscosity η II of the layer II is preferably 0.05 to 30.
藉由將構成以(甲基)丙烯酸酯共聚物(A)為基礎樹脂之光硬化性黏著樹脂層(I層)之樹脂組合物之I層熔融黏度ηI與構成含有烯烴系聚合物(D)作為基礎樹脂之脫模層(II層)之樹脂組合物之II層熔融黏度ηII調整為特定範圍內,可於同一溫度下顯示同程度之黏度特性,因此可共擠壓,藉由共擠壓可於一體化時提高層間之密接性,故而可提高兩層間之界面接著性。 The first layer melt viscosity η I of the resin composition constituting the photocurable adhesive resin layer (I layer) based on the (meth) acrylate copolymer (A) and the olefin-containing polymer (D) The second layer melt viscosity η II of the resin composition as the release layer (II layer) of the base resin is adjusted to a specific range, and can exhibit the same degree of viscosity characteristics at the same temperature, so that it can be co-extruded by a total of Extrusion can improve the adhesion between the layers when integrated, so the interfacial adhesion between the two layers can be improved.
就該觀點而言,構成光硬化性黏著樹脂層(I層)之樹脂組合物之I層熔融黏度ηI及構成脫模層(II層)之樹脂組合物之II層熔融黏度ηII較佳為均為1×101~5×103Pa.s。若均為1×101Pa.s以上,則易於一面加熱一面片材化,若為5×103Pa.s以下,則可維持層間之密接性,易於積層一體化,故而較佳。其中,該130℃熔融黏度η較佳為2×101Pa.s以上或3×103Pa.s以下,其中尤佳為3×101Pa.s以上或1×103Pa.s以下。 From this point of view, the layer I melt viscosity η I of the resin composition constituting the photocurable adhesive resin layer (I layer) and the II layer melt viscosity η II of the resin composition constituting the release layer (layer II) are preferably Both are 1 × 10 1 ~ 5 × 10 3 Pa. s. If both are 1 × 10 1 Pa. Above s, it is easy to heat one side of the sheet, if it is 5 × 10 3 Pa. Below s, it is preferable to maintain the adhesion between the layers and to facilitate integration of the layers. Wherein, the 130 ° C melt viscosity η is preferably 2 × 10 1 Pa. s above or 3 × 10 3 Pa. Below s, especially preferably 3 × 10 1 Pa. s above or 1 × 10 3 Pa. s below.
又,同樣就上述觀點而言,I層熔融黏度ηI與II層熔融黏度ηII之ηII/ηI較佳為0.05~30,其中較佳為0.1以上或25以下,其中進而較佳 為0.2以上或20以下,進而其中尤佳為0.3以上或15以下。 Further, from the above viewpoints, the η II /η I of the melt viscous η I of the I layer and the melt viscosity η II of the II layer are preferably 0.05 to 30, preferably 0.1 or more, or 25 or less, and further preferably 0.2 or more or 20 or less, and further preferably 0.3 or more or 15 or less.
作為調整I層熔融黏度ηI及II層熔融黏度ηII之方法之一,可列舉調整作為各個樹脂組合物之主成分之樹脂,即(甲基)丙烯酸酯共聚物(A)及烯烴系聚合物(D)之分子量的方法。 One of the methods for adjusting the melt viscosity η I of the first layer and the melt viscosity η II of the layer II is a resin which is a main component of each resin composition, that is, a (meth) acrylate copolymer (A) and an olefin polymerization. A method of molecular weight of the substance (D).
就該觀點而言,(甲基)丙烯酸酯共聚物(A)之重量平均分子量(Mw)較佳為10萬~80萬,其中更佳為15萬以上或55萬以下,其中尤佳為20萬以上或50萬以下。 From this point of view, the weight average molecular weight (Mw) of the (meth) acrylate copolymer (A) is preferably from 100,000 to 800,000, more preferably more than 150,000 or less than 550,000, of which 20 is particularly preferred. More than 10,000 or less than 500,000.
另一方面,烯烴系聚合物(D)之重量平均分子量(Mw)較佳為5萬~40萬,其中更佳為6萬以上或20萬以下,其中尤佳為7萬以上或15萬以下。 On the other hand, the weight average molecular weight (Mw) of the olefin-based polymer (D) is preferably 50,000 to 400,000, more preferably 60,000 or more, or 200,000 or less, and particularly preferably 70,000 or more and 150,000 or less. .
另外,亦可藉由增減交聯劑或光交聯起始劑等添加成分之調配量而調整熔融黏度。 Further, the melt viscosity can be adjusted by increasing or decreasing the amount of the component added such as the crosslinking agent or the photocrosslinking initiator.
<I層表面之Si存在比> <Si existence ratio of surface of layer I>
光硬化性黏著樹脂層(I層)之表面之Si存在比較佳為未達2.0atom%。 The Si of the surface of the photocurable adhesive resin layer (I layer) is preferably less than 2.0 atom%.
若光硬化性黏著樹脂層(I層)之表面之Si存在比未達2.0atom%,則不存在因Si之移行而導致光硬化性黏著樹脂層之接著力下降或污染被黏著體之虞,較佳。 When the ratio of the Si of the surface of the photocurable adhesive resin layer (I layer) is less than 2.0 atom%, there is no possibility that the adhesion of the photocurable adhesive resin layer is lowered or the adherend is contaminated by the migration of Si. Preferably.
就該觀點而言,光硬化性黏著樹脂層(I層)之表面之Si存在比較佳為未達2.0atom%,其中更佳為未達1.5atom%,其中尤佳為未達1.0atom%。 From this point of view, the Si of the surface of the photocurable adhesive resin layer (I layer) is preferably less than 2.0 atom%, more preferably less than 1.5 atom%, and particularly preferably less than 1.0 atom%.
若欲使光硬化性黏著樹脂層(I層)之表面之Si存在比未達2.0atom%,只要不混入脫模層(II層)相關之移行性成分即可。其中,此種方法並無限定。 If the ratio of Si on the surface of the photocurable adhesive resin layer (I layer) is less than 2.0 atom%, the transition component related to the release layer (layer II) may not be mixed. Among them, this method is not limited.
<II層剝離力> <II layer peeling force>
將上述脫模層(II層)自光硬化性黏著樹脂層(I層)以剝離速度300 mm/min進行180°剝離時之剝離力較佳為0.3N/cm以下。 The release layer (layer II) is removed from the photocurable adhesive resin layer (I layer) at a peeling speed of 300 The peeling force at the time of 180° peeling of mm/min is preferably 0.3 N/cm or less.
若該剝離力為0.3N/cm以下,則剝離阻力較少且作業性優異,故而較佳。其中,若該剝離力過小,則存在作業中於未預期之場面下發生隆起或剝離,或作為捲繞體保管時發生穿透之虞。 When the peeling force is 0.3 N/cm or less, the peeling resistance is small and the workability is excellent, which is preferable. However, if the peeling force is too small, there is a possibility that bulging or peeling occurs in an unintended scene during work or when it is stored as a wound body.
因此,就該觀點而言,該剝離力較佳為0.3N/cm以下,其中更佳為0.01N/cm以上或0.25N/cm以下,其中尤佳為0.02N/cm以上或0.2N/cm以下。 Therefore, from this point of view, the peeling force is preferably 0.3 N/cm or less, more preferably 0.01 N/cm or more or 0.25 N/cm or less, and particularly preferably 0.02 N/cm or more or 0.2 N/cm. the following.
又,較佳為基材層(III層)與脫模層(II層)之剝離力大於光硬化性黏著樹脂層(I層)與脫模層(II層)之間之剝離力。 Moreover, it is preferable that the peeling force of the base material layer (III layer) and the mold release layer (II layer) is larger than the peeling force between the photocurable adhesive resin layer (I layer) and the release layer (II layer).
藉由使基材層(III層)與脫模層(II層)之剝離力大於光硬化性黏著樹脂層(I層)與脫模層(II層)之間之剝離力,可自光硬化性黏著樹脂層(I層)一併剝離基材層(III層)與脫模層(II層)。 Self-photohardening by the peeling force between the base layer (III layer) and the release layer (II layer) is greater than the peeling force between the photocurable adhesive resin layer (I layer) and the release layer (II layer) The adhesive layer (layer I) was peeled off from the substrate layer (layer III) and the release layer (layer II).
進而又,於本黏著片積層體係於光硬化性黏著樹脂層(I層)之一側介隔脫模層(II層)而具備基材層(III層),另一方面於光硬化性黏著樹脂層(I層)之另一側具備脫模層(IV層)及基材層(V層)的構成之情形時,可使光硬化性黏著樹脂層(I層)與脫模層(II層)之剝離力不同於光硬化性黏著樹脂層(I層)與脫模層(IV層)之剝離力。 Further, in the present adhesive layer system, a release layer (layer II) is provided on one side of the photocurable adhesive resin layer (I layer) to provide a base layer (III layer), and photocurable adhesive is provided on the other hand. When the other side of the resin layer (I layer) is provided with a release layer (IV layer) and a base layer (V layer), the photocurable adhesive resin layer (I layer) and the release layer (II) can be used. The peeling force of the layer) is different from the peeling force of the photocurable adhesive resin layer (I layer) and the release layer (IV layer).
如此,若光硬化性黏著樹脂層(I層)與脫模層(II層)之剝離力不同於光硬化性黏著樹脂層(I層)與脫模層(IV層)之剝離力,則例如於自剝離力較小,換言之易於剝離側之脫模層剝離時,可防止另一側之脫模層一併剝離,可提高作業性。 Thus, if the peeling force of the photocurable adhesive resin layer (I layer) and the release layer (II layer) is different from the peeling force of the photocurable adhesive resin layer (I layer) and the release layer (IV layer), for example, When the peeling force is small, in other words, the release layer on the side which is easy to peel off is peeled off, the release layer on the other side can be prevented from being peeled off at the same time, and workability can be improved.
<I層黏著力> <I layer adhesion>
上述光硬化性黏著樹脂層(I層)之黏著力較佳為3N/cm~30N/cm。 The adhesion of the photocurable adhesive resin layer (I layer) is preferably from 3 N/cm to 30 N/cm.
若光硬化性黏著樹脂層(I層)之黏著力為3N/cm~30N/cm,則易於獲得貼合之積層體之耐發泡可靠性。 When the adhesion of the photocurable adhesive resin layer (I layer) is from 3 N/cm to 30 N/cm, it is easy to obtain the foaming reliability of the laminated body.
因此,就該觀點而言,上述光硬化性黏著樹脂層(I層)之黏著力較佳為3N/cm~30N/cm,其中更佳為4N/cm以上或25N/cm以下,其中尤佳為5N/cm以上或20N/cm以下。 Therefore, from the viewpoint of the above, the adhesion of the photocurable adhesive resin layer (I layer) is preferably from 3 N/cm to 30 N/cm, more preferably from 4 N/cm to 25 N/cm, and particularly preferably It is 5 N/cm or more or 20 N/cm or less.
再者,為將光硬化性黏著樹脂層(I層)之黏著力調整為3N/cm~30N/cm,較佳為除調整組成(I層)之(甲基)丙烯酸酯共聚物(A)之組成或分子量或調整交聯劑(B)外,亦適宜添加矽烷偶合劑等有助於提高接著力之添加劑。但並不限定於此種方法。 Further, in order to adjust the adhesion of the photocurable adhesive resin layer (I layer) to 3 N/cm to 30 N/cm, it is preferred to adjust the composition (I layer) of the (meth) acrylate copolymer (A). In addition to the composition or molecular weight or the adjustment of the crosslinking agent (B), it is also suitable to add an additive such as a decane coupling agent which contributes to the improvement of the adhesion. However, it is not limited to this method.
其次,對製造本黏著片積層體之方法之一例加以說明。但其僅為一例,本黏著片積層體之製造方法並不限定於以下之製造方法。 Next, an example of a method of manufacturing the present adhesive sheet laminate will be described. However, this is only an example, and the manufacturing method of the adhesive sheet laminate is not limited to the following manufacturing method.
本黏著片積層體例如可藉由如下方式製造:藉由對形成光硬化性黏著樹脂層(I層)之樹脂組合物,即,含有(甲基)丙烯酸酯共聚物(A)、交聯劑(B)及光聚合起始劑(C)之樹脂組合物,與形成脫模層(II層)之樹脂組合物,即含有烯烴系聚合物(D)之樹脂組合物進行共擠壓,而於光硬化性黏著樹脂層(I層)之單側或兩側積層脫模層(II層)後不使之光硬化,於該脫模層(II層)上積層基材層(III層),藉此製造於含有光硬化性黏著樹脂之光硬化性黏著樹脂層(I層)之單側或兩側介隔脫模層(II層)而具備基材層(III層)之黏著片積層體。 The adhesive sheet laminate can be produced, for example, by a resin composition for forming a photocurable adhesive resin layer (I layer), that is, a (meth) acrylate copolymer (A), a crosslinking agent. The resin composition of (B) and the photopolymerization initiator (C) is co-extruded with the resin composition forming the release layer (layer II), that is, the resin composition containing the olefin polymer (D). After the release layer (layer II) is laminated on one side or both sides of the photocurable adhesive resin layer (I layer), it is not photohardened, and a base material layer (III layer) is laminated on the release layer (layer II). The adhesive sheet layer provided with the base material layer (III layer) on one side or both sides of the photocurable adhesive resin layer (I layer) containing the photocurable adhesive resin is formed by interposing the release layer (II layer). body.
此時,亦可藉由對形成光硬化性黏著樹脂層(I層)之樹脂組合物與形成脫模層(II層)之樹脂組合物與進而形成基材層(III層)之樹脂組合物進行共擠壓而製造本黏著片積層體。 In this case, the resin composition for forming the photocurable adhesive resin layer (I layer) and the resin composition for forming the release layer (II layer) and the resin composition for further forming the base material layer (III layer) may be used. The present adhesive sheet laminate was produced by co-extrusion.
其次,對使用本黏著片積層體製造圖像顯示裝置構成構件積層體(稱為「本圖像顯示裝置構成構件積層體」)之圖像顯示裝置構成構件積層體之製造方法加以說明。 Next, a method of manufacturing an image-displaying device constituent member laminated body using the present adhesive sheet laminate to form an image-displaying device constituent member laminated body (referred to as "the present image display device constituting member laminated body") will be described.
本圖像顯示裝置構成構件積層體例如可使用如上述方法製造之 本黏著片積層體,自該本黏著片積層體之光硬化性黏著樹脂層(I層)將脫模層(II層)及基材層(III層)一併剝離後,介隔該光硬化性黏著樹脂層(I層)積層2個圖像顯示裝置構成構件,介隔一個或兩個該圖像顯示裝置構成構件對光硬化性黏著樹脂層(I層)照射光使之硬化,從而製造本圖像顯示裝置構成構件積層體。 The image display device constituting member laminate can be manufactured, for example, by the method described above. The adhesive sheet laminate is obtained by separating the release layer (II layer) and the base material layer (III layer) from the photocurable adhesive resin layer (I layer) of the adhesive sheet laminate, and then separating the light hardening layer. Adhesive adhesive layer (I layer) is formed by two image display device constituent members, and one or two of the image display device constituent members are irradiated with light to cure the photocurable adhesive resin layer (I layer), thereby manufacturing The image display device constitutes a component laminate.
<賦形加工> <Shaping processing>
亦可預先對本黏著片積層體賦形與圖像顯示裝置構成構件之貼合面之凹凸形狀相同之面形狀,如上所述使用本黏著片積層體製造本圖像顯示裝置構成構件積層體。 Alternatively, the present adhesive sheet laminate may be formed in the same shape as the uneven shape of the bonding surface of the image display device constituent member, and the present image forming apparatus constituent member laminate may be produced by using the adhesive sheet laminate as described above.
再者,作為賦形方法,例如可對本黏著片積層體實施藉由加壓模框之賦形、使用模具之賦形、藉由輥之賦形、藉由積層之賦形等適宜賦形方法。 Further, as the shaping method, for example, the adhesive sheet laminate can be formed by a shape of a pressurizing mold, shaping using a mold, forming by a roll, forming by lamination, and the like. .
其中,就生產性、賦形加工之精度等之觀點而言,較佳為藉由加壓模框或輥之賦形方法。即,作為賦形與上述圖像顯示裝置構成構件之貼合面之凹凸形狀相同之面形狀的方法,可較佳例示:將模造上述圖像顯示裝置構成構件之貼合面之凹凸形狀之模具隔著脫模層(II層)及基材層(III層)壓抵於光硬化性黏著樹脂層(I層)之至少一側面,即與脫模層(II層)及基材層(III層)一併賦形的方法。 Among them, from the viewpoints of productivity, precision of forming processing, and the like, it is preferably a forming method by a press frame or a roll. In other words, as a method of forming a surface shape having the same shape as the uneven shape of the bonding surface of the image forming device constituent member, a mold for molding the uneven shape of the bonding surface of the image forming device constituent member can be preferably exemplified. Pressing at least one side surface of the photocurable adhesive resin layer (I layer) via the release layer (layer II) and the substrate layer (layer III), that is, with the release layer (layer II) and the substrate layer (III) Layer) A method of forming together.
於如上所述隔著脫模膜賦形,換言之與脫模膜一併賦形之情形時,作為上述脫模層(II層)之脫模膜,較佳為使用未延伸膜。藉由使用未延伸膜,於以加壓處理等進行賦形處理時,可具有易於形成與原本模具之凹凸形狀大致相同之面形狀的效果。 In the case where the release film is formed as described above, in other words, when the release film is formed together, it is preferable to use an unstretched film as the release film of the release layer (layer II). When the forming treatment is performed by a press treatment or the like by using the unstretched film, it is possible to have an effect of easily forming a surface shape substantially the same as that of the original mold.
上述未延伸膜中,就膜本身之機械強度、柔軟性、耐化學品性之觀點而言,更佳為使用未延伸聚丙烯膜、未延伸聚乙烯膜、未延伸聚酯膜中之任一種。 In the above unstretched film, it is more preferable to use any of an unstretched polypropylene film, an unstretched polyethylene film, and an unstretched polyester film from the viewpoint of mechanical strength, flexibility, and chemical resistance of the film itself. .
藉由加壓模框之賦形可列舉隔著脫模層(II層)及基材層(III層), 對光硬化性黏著樹脂層(I層)之至少一側面進行加壓的方法。 The shape of the pressurizing mold frame can be exemplified by the release layer (layer II) and the substrate layer (layer III). A method of pressurizing at least one side surface of the photocurable adhesive resin layer (I layer).
又,亦可以加壓模框對脫模層(II層)及基材層(III層)加壓進行賦形加工,藉由於該脫模層(II層)及基材層(III層)上將黏著劑組合物流塗佈或流入等,而製造經賦形加工之本黏著片積層體。此時,使用模具之賦形亦可藉由將黏著劑組合物流入模框並使之固化而製作經賦形加工之兩面黏著片。 Further, the mold release layer (II layer) and the base material layer (III layer) may be press-formed by a press mold, and the mold release layer (II layer) and the base material layer (III layer) may be formed thereon. The adhesive composition layer is coated or inflowed to produce a shaped adhesive sheet. At this time, the shaping of the mold can also be carried out by forming the adhesive composition into the mold frame and solidifying it to produce a shaped double-sided adhesive sheet.
藉由輥之賦形可藉由使具備光硬化性黏著樹脂層(I層)、脫模層(II層)及基材層(III層)之黏著片積層體通過輥間而進行賦形加工。 By forming the roll, the adhesive sheet layer having the photocurable adhesive resin layer (I layer), the release layer (II layer), and the base material layer (III layer) can be formed by passing between the rolls. .
藉由積層之賦形可藉由製作大小不同之2個平面狀之黏著片並將該等重疊而製作經賦形加工之兩面黏著片1。 By forming the laminate, the two-sided adhesive sheet 1 can be formed by forming two planar adhesive sheets of different sizes and overlapping them.
若預先對本黏著片積層體賦形與圖像顯示裝置構成構件之貼合面之凹凸形狀相同之面形狀,即使於圖像顯示裝置構成構件之貼合面具有印刷等導致之階差部,亦可無間隙地貼合表面保護面板或觸控面板等各圖像顯示裝置用構成構件。 When the surface of the adhesive sheet laminate is formed in the same shape as the uneven surface of the bonding surface of the image display device constituent member, even if the bonding surface of the image display device constituent member has a step portion due to printing or the like, A constituent member for each image display device such as a surface protection panel or a touch panel can be bonded without a gap.
以下說明具體之賦形方法。但並不限定於該等方法。 The specific shaping method will be described below. However, it is not limited to these methods.
(利用加壓框之賦形方法) (Formation method using a pressurizing frame)
a)隔著脫模層(II層)及基材層進行加壓之方法 a) a method of pressurizing through a release layer (layer II) and a substrate layer
適宜切割具備光硬化性黏著樹脂層(I層)、脫模層(II層)及基材層(III層)之黏著片積層體,一面捲送出經切割之黏著片積層體,一面使用沿著被黏著體之表面凹凸形狀、即被著面之面形狀之加壓模框,隔著脫模層(II層)及基材層(III層)進行熱加壓而進行表面賦形。 It is suitable to cut an adhesive sheet layer having a photocurable adhesive resin layer (I layer), a release layer (II layer), and a base material layer (III layer), and roll the cut adhesive sheet laminate body while using it along the side. The surface of the adherend, which is a concave-convex shape of the surface of the adherend, that is, the surface of the surface to be coated, is heat-pressed through the release layer (layer II) and the base layer (layer III) to form a surface.
其次,剝離脫模層(II層),沿著賦形形狀之外形切割露出之黏著片,棄去外形外周之不需要之黏著邊料後,重新貼合大於外形切割尺寸之新脫模膜。 Next, the release layer (layer II) is peeled off, and the exposed adhesive sheet is cut along the shape of the shaped shape, and the unnecessary adhesive layer of the outer periphery of the outer shape is discarded, and the new release film larger than the outer cut size is reattached.
再次,單片切割為可操作之形狀,而製作本黏著片積層體。 Again, the monolithic cut is made into an operable shape, and the adhesive sheet laminate is produced.
b)對黏著片直接加壓之方法 b) method of directly pressing the adhesive sheet
適宜切割具備光硬化性黏著樹脂層(I層)、脫模層(II層)及基材層(III層)之黏著片積層體,一面捲送出經切割之黏著片積層體,一面剝離脫模層(II層),使用沿著被黏著體之表面凹凸形狀、即被著面2a之面形狀之加壓模框,對光硬化性黏著樹脂層(I層)直接進行熱加壓而進行表面賦形。 It is suitable to cut an adhesive sheet layer having a photocurable adhesive resin layer (I layer), a release layer (II layer), and a base material layer (III layer), and roll off the cut adhesive sheet laminate body while peeling off the release sheet In the layer (layer II), the photocurable adhesive resin layer (I layer) is directly subjected to thermal pressurization using a pressure mold frame along the surface uneven shape of the adherend, that is, the surface shape of the surface 2a to be faced. Forming.
其次,沿著賦形形狀之外形切割一面側露出之光硬化性黏著樹脂層(I層),棄去外形外周之不需要之黏著邊料後,重新貼合大於外形切割尺寸之新脫模膜。 Next, the photocurable adhesive resin layer (I layer) exposed on one side is cut along the shape of the shape, and the unnecessary release adhesive material on the outer periphery of the outer shape is discarded, and the new release film larger than the outer cut size is reattached. .
再次,單片切割為可操作之形狀,而製作本黏著片積層體。 Again, the monolithic cut is made into an operable shape, and the adhesive sheet laminate is produced.
加壓模框之材質並無特別限定,亦可利用脫模性優異之聚矽氧樹脂或氟系樹脂。又,即使為不鏽鋼、鋁等無脫模性之材質,亦可藉由塗佈各種脫模劑而較佳地使用。 The material of the pressurizing mold frame is not particularly limited, and a polyphthalocyanine resin or a fluorine-based resin excellent in mold release property can also be used. Further, even if it is a material having no mold release property such as stainless steel or aluminum, it can be preferably used by applying various release agents.
熱加壓之溫度例如為室溫以上,較佳為80℃以上,更佳為100℃以上。又,加壓壓力、加壓深度、加壓時間可根據尺寸、形狀、賦形狀態而適宜調整。 The temperature of the hot press is, for example, room temperature or higher, preferably 80 ° C or higher, more preferably 100 ° C or higher. Further, the pressurizing pressure, the pressurizing depth, and the pressurizing time can be appropriately adjusted depending on the size, shape, and shaping state.
又,作為切割方法,例如可列舉利用湯姆生刀、旋轉刀之切割方法。 Further, as the cutting method, for example, a cutting method using a Tomson knife or a rotary knife can be cited.
進而,亦有將表面賦形與外形切割如上所述以分別不同之製程進行之方法,例如若使用將賦形用之模具與切割模具一體化之模具,則亦可以一步驟進行表面賦形與外形切割。 Further, there is a method in which the surface forming and the outer shape cutting are performed in different processes as described above. For example, if a mold for integrating the forming mold and the cutting mold is used, the surface forming can be performed in one step. Shape cutting.
(利用經賦形加工之脫模膜之賦形方法) (Formation method using the release film of the shaped processing)
將預先賦形為與被黏著體之表面凹凸形狀、即被著面之面形狀大致相同之面形狀之脫模膜至少配置於一面側,塗佈黏著劑,而製膜為表面賦形之黏著片即光硬化性黏著樹脂層(I層)之原片。 The release film which is previously formed into a surface shape which is substantially the same as the surface unevenness of the adherend, that is, the surface shape of the surface to be coated, is disposed at least on one side, and an adhesive is applied to form a surface-forming adhesive. The sheet is the original sheet of the photocurable adhesive resin layer (I layer).
其次,依照原片之表面凹凸形狀之寬度進行適宜切割後,將所切割之黏著片於下一步驟中剝離一面側之脫模膜,沿著外形切割露出 之黏著片面,棄去外形外周之不需要之黏著邊料後,重新貼合大於外形切割尺寸之新脫模膜。 Next, after appropriately cutting according to the width of the surface irregular shape of the original sheet, the cut adhesive sheet is peeled off from the one side of the release sheet in the next step, and is cut along the outer shape. After sticking to the one side, discard the unwanted adhesive material on the outer circumference of the outer shape, and then reattach the new release film larger than the outer cut size.
再次,單片切割為可操作之形狀,而製作本黏著片積層體。 Again, the monolithic cut is made into an operable shape, and the adhesive sheet laminate is produced.
(使用模具之賦形方法) (using the shaping method of the mold)
對模造被黏著體之表面凹凸形狀、即被著面之面形狀之模具塗佈或注入黏著劑,而成形經表面賦形之黏著片即光硬化性黏著樹脂層(I層)。 A surface-formed adhesive sheet, that is, a photocurable adhesive resin layer (I layer), is formed by applying or injecting an adhesive to a surface of the surface of the adherend which is molded into a concave-convex shape, that is, a surface to be coated.
於模具為僅單面之情形時,塗佈或注入黏著劑後,於相反側貼合脫模膜,自其上利用橡膠輥等進行密接。 When the mold is only one side, after applying or injecting the adhesive, the release film is bonded to the opposite side, and the rubber sheet or the like is adhered thereto.
使黏著劑固化後,藉由提拉脫模膜而將本黏著片積層體自模具拉離。 After the adhesive is cured, the adhesive sheet laminate is pulled away from the mold by pulling off the release film.
模具之材質並無特別限定,亦可利用脫模性優異之聚矽氧樹脂或氟系樹脂。又,即使為不鏽鋼、鋁等無脫模性之材質之模具,亦可藉由塗佈各種脫模劑而較佳地使用。 The material of the mold is not particularly limited, and a polyoxymethylene resin or a fluorine-based resin excellent in mold release property can also be used. Further, even a mold having a material such as stainless steel or aluminum which is not released from the mold can be preferably used by applying various release agents.
(利用輥之賦形方法) (Using the shape of the roller)
於平坦之兩張脫模膜之間塗佈黏著劑即光硬化性黏著樹脂層(I層)後,於至少一面側配置模造被黏著體之表面凹凸形狀、即被著面之面形狀之賦形輥,於該輥與另一面側之輥之間夾持並通過而進行表面賦形,而製膜為黏著片即光硬化性黏著樹脂層(I層)之原片。 After applying a photocurable adhesive resin layer (I layer) between the two flat release films, the surface irregularities of the molded adherend are disposed on at least one side, that is, the surface shape of the surface to be coated. The roll is formed by sandwiching and passing between the roll and the roll on the other side, and the film is formed into an original sheet of an adhesive sheet, that is, a photocurable adhesive resin layer (I layer).
其次,依照原片之表面凹凸形狀之寬度進行適宜切割後,將所切割之黏著片於下一步驟中剝離一面側之脫模膜,沿著賦形形狀之外形切割露出之黏著片,棄去外形外周之不需要之黏著邊料後,重新貼合大於外形切割尺寸之新脫模膜。 Next, after appropriately cutting according to the width of the surface irregular shape of the original sheet, the cut adhesive sheet is peeled off from the release film on one side in the next step, and the exposed adhesive sheet is cut along the shape of the shaped shape, and discarded. After the outer edge of the outer shape is not required to be adhered to the edge material, the new release film is larger than the outer cut size.
再次,單片切割為可操作之形狀,而製作本黏著片積層體。 Again, the monolithic cut is made into an operable shape, and the adhesive sheet laminate is produced.
關於輥溫度,配置賦形輥,於該輥與另一面側之輥之間夾持並通過而進行表面賦形時之溫度較佳為室溫以上,更佳為80℃以上,進 而較佳為100℃以上。 Regarding the roll temperature, the shaping roll is disposed, and the temperature at the time of surface forming between the roll and the roll on the other side is preferably room temperature or more, more preferably 80 ° C or more. More preferably, it is 100 ° C or more.
(藉由積層之賦形) (by layering)
適宜切割兩面積層有脫模膜之平坦之黏著片即光硬化性黏著樹脂層(I層)之原片,分別製作預先切割為視認開口面之形狀的平坦之第1黏著片與切割為階差部之表面形狀的大小不同之形狀之平坦之第2黏著片。 It is suitable for cutting a flat sheet of a light-curable adhesive resin layer (I layer) which is a flat adhesive sheet having a release film of two areas, and respectively forming a flat first adhesive sheet which is cut into a shape of the open surface, and is cut into steps. A second adhesive sheet having a flat shape having a different surface shape.
其後,分別剝離一面側之脫模膜,將露出之黏著面彼此重疊貼合,而製作具有所需之表面賦形之本黏著片積層體。 Thereafter, the release film on one side is peeled off, and the exposed adhesive faces are superposed on each other to form a desired adhesive sheet laminate having a desired surface shape.
<語句之說明> <Description of statement>
於本案發明中,表述為「X~Y」(X、Y為任意之數字)之情形時,只要無特別說明,則除「X以上且Y以下」之含義外,亦包括「較佳為大於X」或「較佳為小於Y」之含義。 In the case of the present invention, the expression "X~Y" (where X and Y are arbitrary numbers), unless otherwise specified, includes "more preferably greater than the meaning of "X or more and Y or less". X" or "preferably less than Y" means.
又,表述為「X以上」(X為任意數字)或「Y以下」(Y為任意數字)之情形時,意在包括「較佳為大於X」或「較佳為未達Y」之含義。 In the case of "X or above" (X is an arbitrary number) or "Y below" (Y is an arbitrary number), it is intended to include the meaning of "better than X" or "preferably not up to Y". .
又,通常所謂「片」,於JIS之定義上係指較薄,通常其厚度小於長度與寬度而較平之產品,通常所謂「膜」係指較之長度及寬度,厚度極小,最大厚度任意限定之薄且較平之產品,通常係以捲筒之形態供給(日本工業標準JIS K6900)。例如就厚度而言,狹義上有時將100μm以上者稱為片,將未達100μm者稱為膜。但是,片與膜之界限並不確定,於本發明中無需於書面上區別兩者,故而於本發明中,稱為「膜」之情形時亦包括「片」,稱為「片」之情形時亦包括「膜」。 In addition, the term "slice" in the definition of JIS generally means a product which is relatively thin and generally has a thickness smaller than the length and width. Generally, the term "film" means that the thickness is extremely small and the maximum thickness is arbitrary. A thin, flat product is usually supplied in the form of a reel (Japanese Industrial Standard JIS K6900). For example, in terms of thickness, a person who is 100 μm or more in a narrow sense is sometimes referred to as a sheet, and a person who is less than 100 μm is referred to as a film. However, the boundary between the sheet and the film is not certain, and it is not necessary to distinguish the two in writing in the present invention. Therefore, in the present invention, the case of "film" also includes "slice", which is called "slice". It also includes "film".
以下,藉由實施例進一步詳細說明。但本發明不受該等之任何限制。 Hereinafter, the details will be described in further detail by way of examples. However, the invention is not limited by these.
將作為(甲基)丙烯酸酯共聚物(A)之使數量平均分子量為2400之 聚甲基丙烯酸甲酯巨單體15重量份與丙烯酸丁酯81重量份與丙烯酸4重量份無規共聚合而成之丙烯酸酯共聚物(A-1)(重量平均分子量:23萬)1kg、作為交聯劑(B)之甘油二甲基丙烯酸酯(共榮社化學公司製造,產品名:G101P)(B-1)100g、作為光聚合起始劑(C)之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,產品名:Esacure TZT)(C-1)15g均勻混合,而製作I層用樹脂組合物(I-1)。 The number average molecular weight of the (meth) acrylate copolymer (A) is 2,400. 15 parts by weight of a polymethyl methacrylate macromonomer, and an acrylate copolymer (A-1) (weight average molecular weight: 230,000) obtained by randomly copolymerizing 81 parts by weight of butyl acrylate and 4 parts by weight of acrylic acid, Glycerol dimethacrylate (manufactured by Kyoeisha Chemical Co., Ltd., product name: G101P) (B-1) 100 g as a crosslinking agent (B), 2, 4, 6- as a photopolymerization initiator (C) A mixture of trimethylbenzophenone and 4-methylbenzophenone (manufactured by Lanberti Co., Ltd., product name: Esacure TZT) (C-1) 15 g was uniformly mixed to prepare a resin composition for layer I (I-1) ).
I層用樹脂組合物(I-1)之130℃熔融黏度ηI為4.7×101Pa.s。 The 130 ° C melt viscosity η I of the resin composition for layer I (I-1) is 4.7 × 10 1 Pa. s.
對於作為(甲基)丙烯酸酯共聚物(A)之使丙烯酸2-乙基己酯55質量份與乙酸乙烯酯40質量份與丙烯酸5質量份無規共聚合而成之乙烯基共聚物(A-2)(重量平均分子量:17萬)1kg,均勻混合作為交聯劑(B)之三丙烯酸(2,4,6-三氧代-1,3,5-三-1,3,5-三基)三伸乙酯(B-2)(東亞合成公司製造,產品名:ARONIX M315)75g與作為光聚合起始劑(C)之Esacure KTO46(C-2)(Lanberti公司製造)15g,而製作I層用樹脂組合物(I-2)。 A vinyl copolymer obtained by randomly copolymerizing 55 parts by mass of 2-ethylhexyl acrylate as a (meth) acrylate copolymer (A) with 40 parts by mass of vinyl acetate and 5 parts by mass of acrylic acid (A) -2) (weight average molecular weight: 170,000) 1 kg, uniformly mixed as a crosslinking agent (B) of triacrylic acid (2,4,6-trioxo-1,3,5-three -1,3,5-triyl)trisole (B-2) (manufactured by Toagosei Co., Ltd., product name: ARONIX M315) 75 g and Esacure KTO46 (C-2) as photopolymerization initiator (C) 15 g of (manufactured by Lanberti Co., Ltd.) was used to prepare a resin composition (I-2) for layer I.
I層用樹脂組合物(I-2)之130℃熔融黏度ηI為4.0×102Pa.s。 The 130 ° C melt viscosity η I of the resin composition for layer I (I-2) is 4.0 × 10 2 Pa. s.
作為I層用樹脂組合物3,準備甲基丙烯酸甲酯與丙烯酸丁酯之嵌段共聚物(可樂麗公司製造,產品名:KURARITY LA2140e,密度:1080kg/m3,熔點:55℃,重量平均分子量(Mw):10萬,MFR(190℃,21.18N):35g/10min)作為I層用樹脂組合物(I-3)。 As the resin composition for layer I 3, a block copolymer of methyl methacrylate and butyl acrylate was prepared (manufactured by Kuraray Co., Ltd., product name: KURARITY LA2140e, density: 1080 kg/m 3 , melting point: 55 ° C, weight average Molecular weight (Mw): 100,000, MFR (190 ° C, 21.18 N): 35 g/10 min) was used as the resin composition (I-3) for the I layer.
I層用樹脂組合物(I-3)之130℃熔融黏度ηI為1.7×105Pa.s。 The 130 ° C melt viscosity η I of the resin composition for layer I (I-3) is 1.7 × 10 5 Pa. s.
作為烯烴系聚合物(D),將乙烯-丁烯無規共聚物(d-1)(密度:870kg/m3,熔點:55℃,重量平均分子量(Mw):10萬,MFR(190℃,21.18N):35g/10min)作為II層用樹脂組合物(II-1)。 As the olefin-based polymer (D), an ethylene-butene random copolymer (d-1) (density: 870 kg/m 3 , melting point: 55 ° C, weight average molecular weight (Mw): 100,000, MFR (190 ° C) 21.18N): 35 g/10 min) as a resin composition (II-1) for a layer II.
II層用樹脂組合物(II-1)之130℃熔融黏度ηII為7.3×102Pa.s。 The melt viscosity η II at 130 ° C of the resin composition for layer II (II-1) is 7.3 × 10 2 Pa. s.
作為烯烴系聚合物(D),對於乙烯-丁烯無規共聚物(d-1)1kg,混合矽烷改性乙烯-辛烯無規共聚物(d-2)(密度:870kg/m3,熔點:50℃,MFR(190℃,21.18N):36g/10min,重量平均分子量(Mw):25萬)100g而作為II層用樹脂組合物(II-2)。 As the olefin-based polymer (D), for the ethylene-butene random copolymer (d-1) 1 kg, a mixed decane-modified ethylene-octene random copolymer (d-2) (density: 870 kg/m 3 , Melting point: 50 ° C, MFR (190 ° C, 21.18 N): 36 g/10 min, weight average molecular weight (Mw): 250,000) 100 g, and used as the resin composition (II-2) for the second layer.
II層用樹脂組合物(II-2)之130℃熔融黏度ηII為7.5×102Pa.s。 The 130 ° C melt viscosity η II of the resin composition for layer II (II-2) is 7.5 × 10 2 Pa. s.
作為烯烴系聚合物(D),對於作為乙烯-丁烯無規共聚物之(d-1)(密度:870kg/m3,熔點:55℃,重量平均分子量(Mw):10萬,MFR(190℃,21.18N):35g/10min)1kg,混合乙烯-甲基丙烯酸酯共聚物(d-3)(密度:946kg/m3,熔點:93℃,重量平均分子量(Mw):16萬,MFR(190℃,21.18N):5.0g/10min)110g,而製作II層用樹脂組合物(II-3)。 As the olefin-based polymer (D), as the ethylene-butene random copolymer (d-1) (density: 870 kg/m 3 , melting point: 55 ° C, weight average molecular weight (Mw): 100,000, MFR ( 190 ° C, 21.18 N): 35 g/10 min) 1 kg, mixed ethylene-methacrylate copolymer (d-3) (density: 946 kg / m 3 , melting point: 93 ° C, weight average molecular weight (Mw): 160,000, MFR (190 ° C, 21.18 N): 5.0 g/10 min) 110 g, and a resin composition (II-3) for a layer II was produced.
II層用樹脂組合物(II-3)之130℃熔融黏度ηII為9.9×102Pa.s。 The 130 ° C melt viscosity η II of the resin composition for layer II (II-3) is 9.9×10 2 Pa. s.
以於作為基材層(III層)之聚對苯二甲酸乙二酯膜(III-1:三菱樹脂公司製造,產品名:DIAFOIL T-100,厚度50μm)上,依序積層作為脫模層(II層)之樹脂組合物(II-1)(厚度:38μm)、作為光硬化性黏著樹脂層(I層)之樹脂組合物(I-1)(厚度:150μm)之方式,以擠壓溫度130℃進行共擠壓而成形為片狀後,將經脫模處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,產品名:DIAFOIL MRA,厚度:100μm,表中記為「脫模PET」)重疊被覆於上述光硬化性黏著樹脂層(I層)上,而製作黏著片積層體1。 For the polyethylene terephthalate film (III-1: manufactured by Mitsubishi Plastics Co., Ltd., product name: DIAFOIL T-100, thickness 50 μm) as a base material layer (III layer), the layer was sequentially laminated as a release layer. The resin composition (II-1) (thickness: 38 μm) of the (II layer) and the resin composition (I-1) (thickness: 150 μm) as the photocurable adhesive resin layer (I layer) were extruded. After being co-extruded at 130 ° C and formed into a sheet shape, the release-treated polyethylene terephthalate film (manufactured by Mitsubishi Plastics Co., Ltd., product name: DIAFOIL MRA, thickness: 100 μm, marked as " The release sheet ") is overlaid on the photocurable adhesive resin layer (I layer) to form an adhesive sheet laminate 1.
除了使用樹脂組合物(I-2)代替樹脂組合物(I-1)以外,以與實施例 1相同之方式製作黏著片積層體2。 In addition to the use of the resin composition (I-2) in place of the resin composition (I-1), The adhesive sheet laminate 2 is produced in the same manner.
除了使用樹脂組合物(II-2)代替樹脂組合物(II-1)以外,以與實施例1相同之方式製作黏著片積層體3。 The adhesive sheet laminate 3 was produced in the same manner as in Example 1 except that the resin composition (II-2) was used instead of the resin composition (II-1).
除了使用樹脂組合物(II-3)代替樹脂組合物(II-1)以外,以與實施例1相同之方式製作黏著片積層體4。 The adhesive sheet laminate 4 was produced in the same manner as in Example 1 except that the resin composition (II-3) was used instead of the resin composition (II-1).
以於作為基材層(III層)之雙軸延伸聚丙烯膜(III-2:厚度38μm)上,依序積層作為脫模層(II層)之樹脂組合物(II-2)(厚度:50μm)、作為光硬化性黏著樹脂層(I層)之樹脂組合物(I-1)(厚度:100μm)之方式,以擠壓溫度130℃進行共擠壓而成形為片狀後,將經脫模處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,產品名:DIAFOIL MRF,厚度:75μm)重疊被覆於上述光硬化性黏著樹脂層(I層)上,製作黏著片積層體5。 A resin composition (II-2) as a release layer (II layer) was sequentially laminated on a biaxially oriented polypropylene film (III-2: thickness: 38 μm) as a substrate layer (III layer) (thickness: 50 μm), a resin composition (I-1) (thickness: 100 μm) as a photocurable adhesive resin layer (I layer), which is co-extruded at a pressing temperature of 130 ° C to form a sheet, and then A release-treated polyethylene terephthalate film (manufactured by Mitsubishi Plastics Co., Ltd., product name: DIAFOIL MRF, thickness: 75 μm) was overlaid on the photocurable adhesive resin layer (I layer) to form an adhesive sheet laminate. 5.
於預先藉由聚矽氧樹脂而進行有脫模處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,產品名:DIAFOIL MRF,厚度:75μm)之脫模處理面上,僅使作為光硬化性黏著樹脂層(I層)之I層用樹脂組合物(I-1)(厚度:150μm)成形為片狀後,以經脫模處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,產品名:DIAFOIL MRA,厚度:100μm)被覆光硬化性黏著樹脂層(I層),製作黏著片積層體6。 The release treatment surface of the polyethylene terephthalate film (manufactured by Mitsubishi Plastics Co., Ltd., product name: DIAFOIL MRF, thickness: 75 μm) which has been subjected to mold release treatment by a polyoxyl resin in advance is used only as a release surface. After the resin composition (I-1) (thickness: 150 μm) of the layer I of the photocurable adhesive resin layer (I layer) is formed into a sheet shape, the release-treated polyethylene terephthalate film (Mitsubishi) The resin company, product name: DIAFOIL MRA, thickness: 100 μm) was coated with a photocurable adhesive resin layer (I layer) to form an adhesive sheet laminate 6.
除將I層用樹脂組合物(I-3)代替I層用樹脂組合物(I-1),以擠壓溫度160℃進行共擠壓而成形為片狀以外,以與實施例1相同之方式進行,製作黏著片積層體7。 The same procedure as in Example 1 except that the resin composition (I-3) for the first layer was replaced by the resin composition (I-1) for the first layer, and co-extruded at a pressing temperature of 160 ° C to form a sheet. In the manner, the adhesive sheet laminate 7 is produced.
以於經脫模處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,產品名:DIAFOIL MRA,厚度:100μm)之脫模處理面上,依序積層作為光硬化性黏著樹脂層(I層)之樹脂組合物(I-1)(厚度:150μm)、作為脫模層(II層)之樹脂組合物(II-3)(厚度:100μm)之方式,以擠壓溫度180℃進行共擠壓而成形為片狀,製作黏著片積層體8。 The release layer of the polyethylene terephthalate film (manufactured by Mitsubishi Plastics Co., Ltd., product name: DIAFOIL MRA, thickness: 100 μm) which has been subjected to release treatment is sequentially laminated as a photocurable adhesive resin layer ( The resin composition (I-1) (thickness: 150 μm) of the layer I, and the resin composition (II-3) (thickness: 100 μm) as the release layer (layer II) were extruded at 180 ° C. The adhesive sheet laminate 8 was produced by co-extrusion and forming into a sheet shape.
(剝離力) (Peel force)
將寬度75mm,長度200mm,厚度3mm之鈉鈣玻璃作為脫模層(II層)之剝離力測定用之支持基板。 A soda lime glass having a width of 75 mm, a length of 200 mm, and a thickness of 3 mm was used as a support substrate for measuring the peeling force of the release layer (layer II).
將實施例及比較例中製作之黏著片積層體剪裁為寬度50mm,長度200mm,使用兩面膠帶(日東電工公司製造,產品名:No5000)以手壓輥將基材層(III層)之相反面,即經脫模處理之聚對苯二甲酸乙二酯膜之積層面壓接於上述支持基板上。 The adhesive sheet laminate produced in the examples and the comparative examples was cut into a width of 50 mm and a length of 200 mm, and the opposite side of the base material layer (III layer) was hand-pressed using a double-sided tape (manufactured by Nitto Denko Corporation, product name: No. 5000). That is, the laminate of the release-treated polyethylene terephthalate film is pressure-bonded to the support substrate.
將上述樣品之基材層(III層)/脫模層(II層)以剝離角180°,剝離角度300mm/min自光硬化性黏著樹脂層(I層)剝離,測定脫模層(II層)自光硬化性黏著樹脂層(I層)之剝離力(N/cm),表中表示為「II層剝離力」。 The base material layer (III layer)/release layer (II layer) of the above sample was peeled off from the photocurable adhesive resin layer (I layer) at a peeling angle of 180° and a peeling angle of 300 mm/min, and the release layer (layer II) was measured. The peeling force (N/cm) of the photocurable adhesive resin layer (I layer) is shown as "II layer peeling force" in the table.
再者,因比較例3之黏著片積層體8未積層基材層(III層),因此僅將脫模層(II層)自光硬化性黏著樹脂層(I層)剝離。 In addition, since the base material layer (III layer) was not laminated in the adhesive sheet laminate 8 of Comparative Example 3, only the release layer (II layer) was peeled off from the photocurable adhesive resin layer (I layer).
又,對於比較例1之黏著片積層體6,將聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,產品名:DIAFOIL MRA,厚度:100μm)側貼合於支持基板,將剝離經脫模處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,產品名:DIAFOIL MRF,厚度:75μm)時之值記載於表中。 Further, in the adhesive sheet laminate 6 of Comparative Example 1, a polyethylene terephthalate film (manufactured by Mitsubishi Plastics, Inc., product name: DIAFOIL MRA, thickness: 100 μm) was attached to the support substrate, and the peeling was removed. The value of the mold-treated polyethylene terephthalate film (manufactured by Mitsubishi Plastics Co., Ltd., product name: DIAFOIL MRF, thickness: 75 μm) is shown in the table.
(黏著力) (adhesion)
對於實施例及比較例中製作之黏著片積層體,將脫模層(II層)自光硬化性黏著樹脂層(I層)剝離,於露出之黏著面上貼合作為襯底膜之100μm之PET膜(東洋紡公司製造,產品名:COSMOSHINE A4300,厚度:100μm)而製作積層品。將該積層品剪裁為寬度10mm,長度150mm後,剝離剩餘之脫模膜,使用手壓輥將露出之黏著面輥壓接於鈉鈣玻璃上。對如此獲得之貼合品實施高壓釜處理(80℃,表壓:0.2MPa,30分鐘)進行最終貼合後,自襯底PET膜側,使用高壓水銀泵以累計光量成為2000mJ/cm2之方式照射365nm之紫外線而使黏著片硬化。於23℃、50%RH下固化15小時,製作接著力測定用樣品。 In the adhesive sheet laminate produced in the examples and the comparative examples, the release layer (layer II) was peeled off from the photocurable adhesive resin layer (I layer), and the exposed adhesive surface was bonded to a substrate film of 100 μm. A PET film (manufactured by Toyobo Co., Ltd., product name: COSMOSHINE A4300, thickness: 100 μm) was used to produce a laminate. After the laminated product was cut into a width of 10 mm and a length of 150 mm, the remaining release film was peeled off, and the exposed adhesive surface roll was pressure-bonded to the soda lime glass using a hand roller. After the final bonding was carried out by autoclaving (80 ° C, gauge pressure: 0.2 MPa, 30 minutes) of the thus obtained laminate, a high-pressure mercury pump was used from the side of the substrate PET film to have a cumulative light amount of 2000 mJ/cm 2 . The 365 nm ultraviolet light is irradiated to harden the adhesive sheet. The mixture was cured at 23 ° C and 50% RH for 15 hours to prepare a sample for adhesion measurement.
將上述剝離力測定試樣於23℃、40%RH之環境下以剝離角180°,剝離速度60mm/min進行剝離,測定I層相對於玻璃之黏著力(N/cm),表中表示為「I層黏著力」。 The peeling force measurement sample was peeled off at a peeling angle of 180° in an environment of 23° C. and 40% RH at a peeling speed of 60 mm/min, and the adhesion of the layer I to the glass (N/cm) was measured. "I layer adhesion".
(藉由ESCA之元素分析) (by elemental analysis of ESCA)
將實施例及比較例中製作之黏著片積層體之脫模層(II層)剝離,對於露出之光硬化性黏著樹脂層(I層),使用黏著光電子光譜分析裝置(ULVAC-PHI公司製造,產品名:ESCA-5100)求出Si之表面組成比(atom%),表中表示為「I層表面Si存在比」。 The release layer (layer II) of the adhesive sheet laminate produced in the examples and the comparative examples was peeled off, and an adhesive photoelectron spectroscopy device (manufactured by ULVAC-PHI Co., Ltd.) was used for the exposed photocurable adhesive resin layer (I layer). Product name: ESCA-5100) The surface composition ratio (atom%) of Si was determined, and the table shows "the ratio of Si on the surface of the layer I".
此時,於Si之表面組成比(atom%)未達檢測極限之情形時,表中表示為「未檢測」。 At this time, when the surface composition ratio (atom%) of Si does not reach the detection limit, the table indicates "undetected".
再者,對於比較例1之黏著片積層體6,剝離聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,產品名:DIAFOIL MRF,厚度:75μm)而對露出之光硬化性黏著樹脂層(I層)之表面進行測定。 Further, with respect to the adhesive sheet laminate 6 of Comparative Example 1, the polyethylene terephthalate film (manufactured by Mitsubishi Plastics Co., Ltd., product name: DIAFOIL MRF, thickness: 75 μm) was peeled off to expose the photocurable adhesive resin layer. The surface of (I layer) was measured.
(加工適性) (Processability)
使用湯姆生衝壓機以50mm×80mm之湯姆生刀將實施例及比較例中製作之黏著片積層體1~8切割為100片,確認脫模層(II層)或脫模膜有無隆起。將於端部有10片以上隆起者判定為「×(差)」,未達10片 者判定為「○(好)」。 The adhesive sheet laminates 1 to 8 produced in the examples and the comparative examples were cut into 100 pieces using a Tomson punch with a 50 mm × 80 mm to confirm the presence or absence of the release layer (layer II) or the release film. Those who have more than 10 ridges at the end will be judged as "×(poor)", less than 10 It is judged as "○ (good)".
(保管穩定性) (keeping stability)
將50片上述加工適性評價中製作之黏著片積層體之剪裁品於40℃之環境下重疊靜置3日。 50 pieces of the cut pieces of the adhesive sheet laminated body produced in the above-mentioned processing suitability evaluation were allowed to stand for 3 days in an environment of 40 ° C.
將固化後可見重疊放置之黏著片積層體彼此之膠著者判定為「×(差)」,將未見者判定為「○(好)」。 The adhesives of the adhesive sheet laminates which were placed in an overlapping manner after curing were judged to be "x (poor)", and those who were not observed were judged as "○ (good)".
(耐發泡可靠性) (Flame resistance reliability)
對鈉鈣玻璃(82mm×53mm×厚度0.5mm)之周緣部5mm實施厚度20μm之黑色印刷,製作周緣部具有20μm之印刷階差之評價用玻璃基板。 A black film having a thickness of 20 μm was applied to a peripheral portion of 5 mm of soda lime glass (82 mm × 53 mm × thickness: 0.5 mm) to prepare a glass substrate for evaluation having a printing step of 20 μm in the peripheral portion.
作為貼合於該評價用玻璃基板之評價用被黏著體,製作將偏光板(Sanritz公司製造「HLC2-5618」)預先整面貼合於玻璃板上(83×52mm×t0.5mm)之單面者。 A single polarizing plate ("HLC2-5618" manufactured by Sanritz Co., Ltd.) was bonded to a glass plate (83 × 52 mm × t 0.5 mm) in advance as a coating adherend for evaluation. Face.
將實施例及比較例中製作之黏著片積層體1~8剪裁為80mm×50mm。剝離脫模層(II層),使用手壓輥將露出之光硬化性黏著樹脂層(I層)貼著於上述評價用剝離基板之具有印刷階差之面而覆蓋印刷階差部。繼而,剝離剩餘之剝離膜,於露出之黏著面上於減壓下(絕對壓力:5kPa)加壓貼合上述評價用被黏著體之偏光板面,實施高壓釜處理(80℃,表壓:0.2MPa,30分鐘)進行最終貼合,製作評價用積層體。 The adhesive sheet laminates 1 to 8 produced in the examples and the comparative examples were cut into 80 mm × 50 mm. The release layer (layer II) was peeled off, and the exposed photocurable adhesive resin layer (I layer) was adhered to the surface having the printing step of the evaluation release substrate by using a hand roller to cover the printing step portion. Then, the remaining release film was peeled off, and the polarizing plate surface of the above-mentioned evaluation adherend was pressure-bonded to the exposed adhesive surface under reduced pressure (absolute pressure: 5 kPa), and autoclave treatment was performed (80 ° C, gauge pressure: 0.2 MPa, 30 minutes) The final bonding was performed, and the laminated body for evaluation was produced.
對上述評價用積層體,自於周緣部實施有印刷之評價用玻璃基板側,以365nm之累計光量成為2000mJ/cm2之方式照射紫外線而使黏著片硬化,於23℃、50%RH下固化15小時,作為耐發泡可靠性評價用之試樣。 The laminated body for evaluation was irradiated with ultraviolet rays so that the cumulative light amount at 365 nm became 2000 mJ/cm 2 from the side of the glass substrate for evaluation, and the adhesive sheet was cured at 23 ° C and 50% RH. 15 hours as a sample for evaluation of foaming reliability.
將如此製作之耐發泡可靠性評價試樣於85℃、85%RH之環境下保管100小時後,目視觀察外觀,將環境試驗後產生黏著材之變形或發泡、剝離者判定為「×(差)」,將未產生者判定為「○(好)」。 The foaming reliability evaluation sample prepared in this manner was stored in an environment of 85 ° C and 85% RH for 100 hours, and then the appearance was visually observed, and the deformation or foaming of the adhesive material after the environmental test was performed, and the peeling was judged as "×. (Poor), and the unproduced person is judged as "○ (good)".
(綜合評價) (Overview)
將於所有上述各評價項目中顯示良好結果者綜合評價為「○(好)」,將一個以上之評價項目中未顯示良好結果者綜合評價為「×(差)」。 A comprehensive evaluation of all the above-mentioned evaluation items is shown as "○ (good)", and a comprehensive evaluation of one or more evaluation items that does not show good results is "x (poor)".
實施例1~實施例5中製作之黏著片積層體均為不僅脫模層(II層)與光硬化性黏著樹脂層(I層)之剝離性優異,並且藉由共擠壓成形,亦不會產生因剪裁加工而導致之隆起,加工性優異者。又,與脫模層(II層)相接之面之光硬化性黏著樹脂層(I層)表面中未確認有聚矽氧脫模劑等移行成分,係被黏著體之耐污染性亦優異者。進而,光硬化性黏著樹脂層具有光硬化性,藉此貼合黏著片後之耐發泡可靠性亦優異。 The adhesive sheet laminates produced in Examples 1 to 5 are excellent in not only the release layer (II layer) but also the photocurable adhesive resin layer (I layer), and are formed by co-extrusion. There is a rise due to the trimming process, and the workability is excellent. Further, in the surface of the photocurable adhesive resin layer (I layer) which is in contact with the release layer (layer II), a migration component such as a polyfluorene release agent is not confirmed, and the stain resistance of the adherend is also excellent. . Further, the photocurable adhesive resin layer has photocurability, and is excellent in foaming resistance after bonding the adhesive sheet.
相對於此,比較例1之黏著片積層體係於光硬化性黏著樹脂層(I層)之兩表面積層脫模處理膜而成之構成,故而上述I層之表面附著有脫模劑,確認於貼合時脫模劑向被黏著體移行。又,若欲提高剝離膜之脫模性,即,使用剝離力較小之剝離膜,則剪裁時易於產生剝離膜 之隆起,與上述實施例相比較,加工性較差。 On the other hand, the adhesive sheet layer system of Comparative Example 1 was formed by releasing the film on the two surface areas of the photocurable adhesive resin layer (I layer). Therefore, the release agent was adhered to the surface of the first layer, and it was confirmed that The release agent migrates to the adherend when it is attached. Further, if the release property of the release film is to be improved, that is, a release film having a small peeling force is used, a release film is likely to be formed at the time of cutting. The bulging is inferior in workability as compared with the above embodiment.
比較例2之黏著片積層體使用不具有光硬化性之樹脂作為黏著樹脂層,結果加工性雖優異,但難以與凹凸面親和,又高溫高濕環境化下產生發泡,作為黏著片之品質較差。 In the adhesive sheet laminate of Comparative Example 2, a resin having no photocurability was used as the adhesive resin layer, and as a result, the workability was excellent, but it was difficult to affinity with the uneven surface, and foaming occurred under high-temperature and high-humidity environment, and the quality of the adhesive sheet was obtained. Poor.
比較例3之黏著片積層體不具有基材層(III層),故而露出之脫模層(II層)與重疊放置之剝離膜經時性產生一部分膠著(黏連),保管穩定性較差。 Since the adhesive sheet laminate of Comparative Example 3 does not have the base material layer (III layer), the exposed release layer (layer II) and the release film which are placed in an overlapping manner are partially gelled (adhesively) with a long period of time, and the storage stability is inferior.
作為實施例1~5中獲得之黏著片積層體,均確認基材層(III層)與脫模層(II層)之剝離力大於光硬化性黏著樹脂層(I層)與脫模層(II層)之間剝離力。 As the adhesive sheet laminates obtained in Examples 1 to 5, it was confirmed that the peeling force of the base material layer (III layer) and the release layer (II layer) was larger than that of the photocurable adhesive resin layer (I layer) and the release layer ( Stripping force between layers II).
自上述實施例及發明者至今進行之試驗之結果等,可認為較佳為構成上述光硬化性黏著樹脂層(I層)及上述脫模層(II層)之樹脂組合物之130℃熔融黏度ηI及ηII為1×101~5×103Pa.s,且構成光硬化性黏著樹脂層(I層)之樹脂組合物之130℃熔融黏度ηI與構成上述脫模層(II層)之樹脂組合物之130℃熔融黏度ηII之比ηII/ηI為0.05~30之範圍內。 It is considered that the 130 ° C melt viscosity of the resin composition constituting the photocurable adhesive resin layer (I layer) and the release layer (II layer) is preferably the result of the test conducted by the above-described examples and the inventors. η I and η II are 1 × 10 1 ~ 5 × 10 3 Pa. s, and the melt viscosity of 130 ℃ constituting the light-curing adhesive resin layer (I layer) of the resin composition of the melt viscosity η 130 ℃ I constituting the parting layer (II layer) of the resin composition of η II ratio η II /η I is in the range of 0.05 to 30.
自上述實施例及發明者至今進行之試驗之結果等,可認為較佳為上述光硬化性黏著樹脂層(I層)之厚度較佳為50μm~1000μm,其中更佳為70μm以上或500μm以下,其中進而較佳為100μm以上或350μm以下,上述脫模層(II層)之厚度較佳為5μm~500μm,其中更佳為10μm以上或350μm以下,其中進而較佳為18μm以上或250μm以下,且上述基材層(III層)之厚度較佳為25μm~500μm,其中更佳為38μm以上或350μm以下,其中進而較佳為50μm以上或250μm以下。 It is preferable that the thickness of the photocurable adhesive resin layer (I layer) is preferably 50 μm to 1000 μm, and more preferably 70 μm or more or 500 μm or less, from the results of the above-described examples and the results of experiments conducted by the inventors. Further, it is preferably 100 μm or more or 350 μm or less, and the thickness of the release layer (layer II) is preferably 5 μm to 500 μm, more preferably 10 μm or more or 350 μm or less, and further preferably 18 μm or more or 250 μm or less. The thickness of the base material layer (III layer) is preferably 25 μm to 500 μm, more preferably 38 μm or more or 350 μm or less, and further preferably 50 μm or more or 250 μm or less.
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| CN109715753A (en) * | 2016-09-15 | 2019-05-03 | 三菱化学株式会社 | Adhesive sheet laminate, shaped adhesive sheet laminate, and method for producing same |
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| JP6882857B2 (en) * | 2016-06-27 | 2021-06-02 | 日東電工株式会社 | Polarizing film with adhesive layer and liquid crystal display device |
| JP6984249B2 (en) * | 2016-09-15 | 2021-12-17 | 三菱ケミカル株式会社 | Adhesive sheet laminate, excipient adhesive sheet laminate and its manufacturing method |
| JP6880839B2 (en) * | 2017-03-07 | 2021-06-02 | 三菱ケミカル株式会社 | Coating film and adhesive sheet laminate |
| CN114410231A (en) * | 2016-12-02 | 2022-04-29 | 三菱化学株式会社 | Photocurable composition, pressure-sensitive adhesive sheet, pressure-sensitive adhesive sheet laminate, image display device configuration laminate, and image display device |
| JP6984250B2 (en) * | 2017-01-19 | 2021-12-17 | 三菱ケミカル株式会社 | Manufacturing method of excipient adhesive sheet laminate |
| JP6581704B1 (en) * | 2018-08-27 | 2019-09-25 | 日東電工株式会社 | Reinforcement film |
| TWI826613B (en) * | 2018-12-14 | 2023-12-21 | 日商三菱化學股份有限公司 | Adhesive resin composition, adhesive resin cured product, adhesive sheet, and image display device laminate |
| JP7047750B2 (en) * | 2018-12-21 | 2022-04-05 | 味の素株式会社 | Manufacturing method of laminated wiring board |
| KR102761585B1 (en) * | 2020-03-27 | 2025-02-04 | 도요보 가부시키가이샤 | Heterogeneous film and its manufacturing method |
| WO2025198045A1 (en) * | 2024-03-22 | 2025-09-25 | リンテック株式会社 | Method for peeling object from adhesive sheet and method for manufacturing article |
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| JPS5534249A (en) * | 1978-09-01 | 1980-03-10 | Toppan Printing Co Ltd | Manufacturing of pressure-sensitive adhesive tape film |
| JP5415658B2 (en) * | 2001-05-28 | 2014-02-12 | 三菱樹脂株式会社 | Intermediate film adhesive sheet and transparent laminate |
| US9486982B2 (en) * | 2008-12-19 | 2016-11-08 | 3M Innovative Properties Company | Method of manufacturing adhesive articles |
| JP2011256320A (en) * | 2010-06-11 | 2011-12-22 | Nitto Denko Corp | Adhesive sheet and use of same |
| JP5858469B2 (en) * | 2011-01-28 | 2016-02-10 | サン・トックス株式会社 | Release film-bonded double-sided PSA sheet and method for producing the same |
| JP2014012784A (en) * | 2012-07-05 | 2014-01-23 | Nitto Denko Corp | Method for producing pressure sensitive adhesive sheet |
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| CN109715753A (en) * | 2016-09-15 | 2019-05-03 | 三菱化学株式会社 | Adhesive sheet laminate, shaped adhesive sheet laminate, and method for producing same |
| CN109715753B (en) * | 2016-09-15 | 2021-12-07 | 三菱化学株式会社 | Adhesive sheet laminate, shaped adhesive sheet laminate, and method for producing same |
| TWI761369B (en) * | 2016-09-15 | 2022-04-21 | 日商三菱化學股份有限公司 | Adhesive sheet laminate, shaped adhesive sheet laminate, and method for producing the same |
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| JPWO2016088697A1 (en) | 2017-09-14 |
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| WO2016088697A1 (en) | 2016-06-09 |
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