TW201606977A - Method of manufacturing electronic package module and structure of electronic package module - Google Patents

Abstract

A method of manufacturing electronic package module includes the steps of: providing a substrate having a surface and at least one conductive pad, where a plurality of electronic device is mounted on the surface; providing at least one first molding covering at least one of the electronic devices; forming a first shielding layer, which is covering the first molding and in contact with the substrate; providing a second molding covering the first molding, the electronic devices, and the surface of the substrate; removing a portion of the first and second moldings to expose a portion of the first shielding layer; and forming a second shielding layer, which is covering the first and the second molding and in direct connection with the first shielding layer.

Description

Manufacturing method of electronic package module and electronic package module structure

The present invention relates to a method and a structure for manufacturing an electronic package module, and more particularly to a method and a structure for manufacturing an electronic package module using two-stage mold sealing and using two-stage shielding.

At present, an electronic package module generally includes a circuit board and a plurality of electronic components mounted on the circuit board. These electronic components are, for example, a chip package or a passive component. In addition, most electronic packaging modules generally include a molding compound for encapsulating the above electronic components to protect the electronic components.

Electronic components are becoming more complex, and users are increasingly demanding faster processing speeds and smaller component sizes. Today's electronic products are light and short, which makes the distribution density of electronic components and circuits too high, which increases some problems, such as electromagnetic interference (EMI). In particular, how to form a multi-block electromagnetic shielding structure on a circuit board with dense electronic components and line distribution, that is, to form a plurality of electromagnetic shielding compartments, becomes a requirement of existing communication products.

One conventional technique is to first form a mold block on a large area on a circuit board, then dig a groove in the mold block, and then fill the groove with a metal material to form a compartment. However, these processes are prone to the fact that the metal material filled in the groove cannot be uniformly distributed in the groove due to the aspect ratio of the groove. For example, the metal material filled in the groove cannot contact the circuit substrate at the bottom of the groove, or has a pore. , air separation, etc. Therefore, the metal formed by this The compartment is prone to problems of poor conduction or uneven conductivity, and the size of the metal compartment is limited by the aspect ratio of the trench and is difficult to reduce.

In addition, U.S. Patent Publication No. US 2008/0055878 discloses an electronic component having an electromagnetic shielding structure which does not have a shielding structure of a metal compartment, and the thickness of the electronic component is limited by the thickness of the molding material and is difficult to reduce.

The invention provides a method for manufacturing an electronic package module, which can form a shield in two stages and two-stage plating to form a shield without completely limiting the aspect ratio of the shield layer, thereby completely protecting electromagnetic interference between the electronic components.

A method for manufacturing an electronic package module, comprising the steps of: providing a circuit substrate having an assembly plane and at least one ground pad, wherein the plurality of electronic components are disposed on the assembly plane; and forming at least one first cavity covering portion a first shielding layer covering the first molding body and contacting the circuit substrate; forming a second molding body covering the first molding body, the electronic component, assembling the plane; removing part of the first molding body and Part of the second molding body to expose a portion of the first shielding layer; and forming a second shielding layer covering the first molding body, the second molding body, and electrically connecting the first shielding layer.

An electronic package module structure includes: a circuit substrate having an assembly plane and a ground pad; the electronic component is disposed on the assembly plane; and the first mold body and the second mold body respectively cover a part of the electronic component The first shielding layer conforms to the first molding body and electrically connects to the grounding pad, and the first molding body and the second molding body are separated by the first shielding layer; and the second shielding layer covers the first mode The first shielding layer is sealed and electrically connected; wherein the first shielding layer is completed before forming the second molding body.

For a better understanding of the techniques, methods and efficacies of the present invention, reference should be made to the detailed description and drawings of the invention, The drawings and the annexed drawings are for the purpose of illustration and description only

1‧‧‧Electronic package module structure

11‧‧‧Line substrate

111‧‧‧ Assembly plane

12‧‧‧ Grounding mat

131‧‧‧First electronic components

132, 132'‧‧‧ second electronic components

141'‧‧‧First initial molded body

141‧‧‧First molded body

151‧‧‧First shield

161'‧‧‧Second initial molded body

161‧‧‧Second formwork

171‧‧‧Second shield

181‧‧‧ sacrificial layer

191‧‧‧ underfill

2‧‧‧ mask

S1~S6‧‧‧Steps

1 is a cross-sectional view showing the structure of an electronic package module according to an embodiment of the present invention.

2 to 8 are schematic cross-sectional views showing the structure of the electronic package module of FIG. 1 during the manufacturing process.

9 is a flow chart of a method of manufacturing an electronic package module according to an embodiment of the present invention.

The terms first, second, third, etc. may be used herein to describe various elements, but such elements are not limited by the terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of the inventive concept.

Please refer to FIG. 1. FIG. 1 is a cross-sectional view showing the structure of an electronic package module according to an embodiment of the present invention. The embodiment of the present invention provides an electronic package module structure 1. The electronic package module structure 1 includes a circuit substrate 11, a plurality of electronic components (for example, the first electronic component 131, the second electronic component 132, 132'), and a first shield. The layer 151, the second shield layer 171, the first mold body 141, and the second mold body 161 adjacent to the first mold body 141. The circuit substrate 11 has an assembly plane 111. The assembly plane 111 includes a first area (not shown) and a second area (not shown). The circuit substrate 11 further includes a plurality of ground pads 12, wherein a portion of the ground pads 12 are exposed on the assembly plane 111 of the circuit substrate 11, and some of the ground pads 12 are selectively disposed and exposed on the side of the circuit substrate 11 according to design requirements.

The first electronic component 131 is in a first region of the assembly plane 111 and the second electronic component 132, 132' is located in a second region of the assembly plane 111. The first molding body 141 is located in the first region and covers the first electronic component 131; the second molding body 161 is located on the assembly plane 111 outside the molding body 141. The first shielding layer 151 is electrically connected to the ground pad 12 of the circuit substrate 11 , and the first molding body 141 and the second molding body 161 are separated by the first shielding layer 151 . The second shielding layer 171 is formed over the circuit substrate 11 to cover the first molding body 141, the second molding body 161, the assembly plane 111, and a portion of the second electronic component, and directly contacts the first shielding layer. Floor 151. The second shielding layer 171 can also be directly electrically connected to the ground pad 12, and even includes the ground pad 12 exposed on the side of the circuit substrate 11. In other embodiments, the first electronic component may also be exposed from the first molding body 141 to directly contact the second shielding layer 171.

The area corresponding to the area where the first molding body is formed is the first area, and the area corresponding to the second molding body is the second area, which is convenient for explanation and understanding, and is not intended to limit the interpretation of the first area and the second area. For example, the first mold body may also be a package material of an IC package. Therefore, if the second electronic component 132' is an electronic component of an IC package, or a semiconductor wafer is stacked and mounted on the circuit substrate 11 by flip-chip bonding, it is not covered by the second molding body. , the area in which it is located may also be referred to as the first area.

Hereinafter, a method of manufacturing an electronic package module of the present invention will be explained by way of embodiments. Please refer to FIG. 2 to FIG. 8 . FIG. 2 to FIG. 8 are schematic cross-sectional views showing the structure of the electronic package module of FIG. 1 during the manufacturing process.

As shown in FIG. 1, first, a circuit substrate 11 having an assembly plane 111 (for example, an upper surface of the wiring substrate 11) is provided. The assembly plane 111 includes a first area and a second area (not shown).

The circuit substrate 11 has a plurality of pre-set ground pads 12 and circuit layers (not shown). The ground pad 12 is made of a conductive material and is electrically connected to a conductive line (not shown) or a ground plane (not shown). The ground pad 12 and the circuit layer are both located on the assembly plane 111 or buried in the substrate, and the ground pad 12 is further exposed on the side of the circuit substrate 11.

Next, the electronic component is mounted on the circuit board 11, and the assembly method can be performed by Surface Mount Technology (SMT), but not limited thereto.

Referring to Fig. 3, next, a first initial mold body 141' is provided in the first region to cover the first electronic component 131. The first initial mold body 141' is formed, for example, by a molding process on a first region by a molding material, and An initial molding body 141' is a portion of the assembly plane 111 surrounding the first electronic component 131 and the first electronic component 131. It should be noted that, in this embodiment, after the step of providing the first initial molded body 141 ′ is completed, at least a portion of the at least one ground pad 12 adjacent to the first electronic component 131 is exposed to the assembly plane 111 , and Not covered by the first initial molded body 141'. The sealing process in this case is, for example, injection molding, mold chase, over-molding process, transfer molding, top-gate molding, and point. Dispenser. The materials used to form the mold body are, for example, epoxy resin, molding compound, Epoxy Molding Compound (EMC), polyimide (PI), and phenolic resin (Phenolics). , silicone or silicone resin (Silicones).

In addition, in the step of the above-mentioned encapsulation process, the underfill 191 may be simultaneously provided to cover the exposed conductive pins of the second electronic component 132' to protect the conductive pins and to form the first and subsequent conductive pins. The shield layer 151 (Fig. 5) is electrically isolated.

Next, as shown in FIG. 4, a sacrificial layer 181 is provided to cover a portion of the second electronic component 132. For example, the sacrificial layer 181 coating process can be performed on the circuit substrate 11 through the mask 2 having a pattern design, and the sacrificial layer 181 is provided to cover a portion of the second electronic component 132 and the partial assembly plane 111 according to the pattern of the mask 2. The sacrificial layer 181 is for removing a substance formed on the sacrificial layer 181 by a subsequent process, and protecting a portion of the second electronic component 132 covered by the sacrificial layer 181. The material of the sacrificial layer 181 may include an acrylic glue or silicone. In another embodiment, the material of the sacrificial layer 181 may comprise an ink composed of a photosensitive curable resin or a thermosetting resin, such as a liquid photosensitive ink, and may be simply removed by using an organic solvent, but not This is limited.

Then, a first shield layer 151 is formed. The first shielding layer 151 can serve as a metal shield in the vertical direction between different electronic components, that is, to isolate electromagnetic interference between adjacent electronic components. As shown in FIG. 5, the first shielding layer 151 is formed integrally and conformally to cover the first initial molding body 141', the sacrificial layer 181, and the second electron element. The piece 132', the underfill 191, and the partially assembled plane 111 are in contact with the ground pad 12 of the circuit substrate 11 to be electrically connected to the ground pad 12. A method of forming the first shield layer 151 is, for example, spray coating, electroplating, electroless plating, evaporation, or sputtering. It is known to those skilled in the art that conformal means that the object formed has substantially the same shape as the outer contour of the person it covers, in the embodiment of Fig. 5, that is, outside the first shielding layer 151. The outline is the same as the outer contour of the first initial cavity 141', the sacrificial layer 181, and the second electronic component 132'.

Next, as shown in FIG. 6, the sacrificial layer 181 is removed to remove the first shield layer 151 overlying the sacrificial layer 181 and expose the second electronic component 132. Thus, electromagnetic interference between the electronic components 131, 132, 132' in the electronic package module structure 1 can be isolated.

4-6 above, in conjunction with the patterned sacrificial layer 181 to form the first shielding layer 151, a patterned mask may be used instead to cover the entire assembly plane, followed by spray coating and curing. The first shield layer 151 is formed.

Next, as shown in FIG. 7, a second initial molding body 161' is provided on the assembly plane 111 to cover the first initial molding body 141', the second electronic component 132, 132', the first shielding layer 151, and the portion. Assembly plane 111. The first initial molding body 141' and the second initial molding body 161' are separated from each other by the first shielding layer 151, that is, the first shielding layer 151 is embedded in the molding material. The second initial molding body 161 ′ is formed, for example, by a molding process of the entire assembly plane 111 by using a molding material, for example, by overmolding, general transfer molding, injection molding or cavity injection molding. The material of the second initial mold body 161 ′ may be the same as the material of the first initial mold body 141 ′, for example, epoxy resin or silicone rubber.

Next, as shown in FIG. 8, a portion of the first initial mold body 141' and a portion of the second initial mold body 161' are removed to expose a portion of the first shield layer 151 while forming the first mold seal of FIG. The body 141 and the second mold body 161. For example Grinding or laser trimming, etc., part of the first initial molding body 141' and part of the second initial molding body 161' are removed, thereby reducing the overall structure of the electronic package module 1. the height of. The height of the first molding body 141 may be smaller than the height of the first initial molding body 141 ′, and the height of the second molding body 161 may be smaller than the height of the second initial molding body 161 ′, the first molding body 141 The upper surface may be aligned with the upper surface of the second mold body 161. At the same time, a part of the first shielding layer 151 is also removed together, and the unshielded first shielding layer 151 forms a shielding structure with a certain height between the electronic components 131, 132.

Next, a second shielding layer 171 is formed. As shown in FIG. 1 , in the embodiment, the second shielding layer 171 can be formed in a full surface to cover the first molding body 141 , the second molding body 161 , and the second layer. The upper surface of the electronic component 132'. The second shielding layer 171 can completely cover the side edges of the circuit substrate 11 and electrically connect the ground pads 12 on the side. The process for forming the second shielding layer may be a common metal coating process such as a spray coating, an electroless plating or a sputtering process, or a conductive tape, but not This is limited to this.

The above embodiment can be summarized as a method of manufacturing an electronic package module according to an embodiment of the present invention. Please refer to FIG. 9. In step S1, a circuit substrate is provided. The circuit substrate has an assembly plane and a ground pad, and a plurality of electronic components are disposed on the assembly plane; in step S2, a first mold body is formed to cover a portion of the electronic component; and in step S3, a first shield is formed. a layer covering the first mold body and contacting the ground pad on the assembly plane; in step S4, forming a second mold body covering the first mold body and the electronic component not covered by the mold body on the assembly plane; step S5, shifting Part of the molding body is exposed and a portion of the first shielding layer is exposed; in step S6, a second shielding layer is formed to cover the entire outer surface of the molding body and electrically connect the first shielding layer.

In another embodiment, before the forming of the second shielding layer 171, the step of removing a portion of the first initial molding body 141' and a portion of the second initial molding body 161' is performed by using different heights of the molding body. The area created by the drop provides other electronic components or electronic modules for stereoscopic stacking and electrical connection. In detail, you can pre- The lower-level components are designed in one area and the higher-level components are designed in another area, such that the subsequently formed molded body has a larger distance from the top of the lower electronic component than the distance of the other higher-distance electronic component. Therefore, the molding body above the lower-element component region can be removed more to form regions of the molding body having different heights. The conductive structure may be formed in the mold body of the lower-level component region to connect the electronic component, the ground pad 12 or the circuit layer of the circuit substrate 11, or form a line layout over the mold body, and then electrically connect the stack. The electronic component or the electronic module is placed thereon, and finally the second shielding layer 171 is electrically connected to the ground pad 12. The actual method is as follows: forming a plurality of holes in the mold body, wherein each hole exposes a ground pad or an electrical connection end of the electronic component; forming a plurality of metal pillars in the hole, and forming a first metal pattern layer on the mold seal Above the body and the metal column, each of the metal posts is electrically connected to the ground pad or the electrical connection end of the electronic component. Then, the electronic component or the electronic module is stacked on the mold body and electrically connected to the first metal pattern layer or the metal pillar. Thereafter, the molding body is formed to cover the entire assembly plane, including the stacked electronic components or electronic modules, and the formed molding body.

The invention utilizes two stages to respectively form a first shielding layer, a second shielding layer, and a two-stage molding to selectively form a metal shielding in a vertical direction between individual electronic components, and the metal shielding compartment formed by the method does not There is a problem of poor conductivity or unevenness caused by the known aspect ratio of the metal shielding compartment, and then the second shielding layer on the top of the molding body can completely protect the electronic components from electromagnetic interference. Moreover, by cutting off part of the mold body, the overall height of the electronic package module structure can be reduced at the same time. Furthermore, the electronic package module structure 1 can effectively utilize the height difference between the electronic components, and provides a structure for three-dimensional stacking. Thus the present invention can provide a form factor having a small thickness.

The above is only an embodiment of the present invention, and is not intended to limit the scope of the invention. It is still within the scope of patent protection of the present invention to make any substitutions and modifications of the modifications made by those skilled in the art without departing from the spirit and scope of the invention.

S1~S6‧‧‧Steps

Claims (10)

A manufacturing method of an electronic package module, comprising the steps of: providing a circuit substrate having an assembly plane and at least one ground pad, wherein a plurality of electronic components are disposed on the assembly plane; and forming at least one first cavity Coating a portion of the electronic components; forming a first shielding layer covering the first molding body and contacting the circuit substrate; forming a second molding body covering the first molding body, the electronic components, and the Forming a plane; removing a portion of the first mold body and a portion of the second mold body to expose a portion of the first shield layer; and forming a second shield layer covering the first mold body and the second mold The body is sealed and electrically connected to the first shielding layer. The method of manufacturing the electronic package module of claim 1, wherein the method of forming the first shielding layer comprises: covering the entire assembly plane with a patterned mask, and performing a metal spraying and curing. The method of manufacturing the electronic package module of claim 1, wherein the method of forming the first shielding layer comprises: providing a sacrificial layer to cover portions of the electronic components; forming the first shielding layer in a conformal manner to cover the a first mold body, the sacrificial layer, and electrically connected to one of the ground pads; and removing the sacrificial layer. The method of manufacturing an electronic package module according to claim 3, wherein the material of the sacrificial layer comprises an acrylic glue or a silicone rubber. The method of manufacturing the electronic package module of claim 1, wherein the method further comprises: forming a plurality of holes in the first mold body, wherein each of the holes exposes one of the ground pads or at least An electrical connection end of the electronic components; Forming a plurality of metal pillars in the holes, and forming a first metal pattern layer on the first mold body and the metal pillars, wherein each of the metal pillars is electrically connected to one of the grounding pads or At least one electrical connection end of the electronic components. The method of manufacturing the electronic package module of claim 5, wherein the method further comprises stacking at least one electronic component over the first mold body and electrically connecting the first metal pattern layer or the metal pillars . The method of manufacturing an electronic package module according to claim 6, wherein the method further comprises forming a third mold body covering the stacked electronic components and the first mold body. The method for manufacturing an electronic package module according to claim 1, wherein the method of removing is a grinding or laser processing. The method for manufacturing an electronic package module according to claim 1, wherein the method of forming the first mold body or the second mold body is injection molding, mold chase molding, and overmolding molding process. Over-molding process, transfer molding, top-gate molding, or dispenser. An electronic package module structure according to the manufacturing method of claim 1, comprising: a circuit substrate having an assembly plane and at least one ground pad; at least one electronic component disposed on the assembly plane; a first sealing body and a second sealing body respectively covering a portion of the electronic component; a first shielding layer conforming the first molding body and electrically connecting one of the grounding pads, and the first The mold body and the second mold body are separated from the first shield layer; and a second shield layer covering the first mold body and electrically connected to the first shield layer; wherein the first shield layer The layer is formed before forming the second mold body to make.