TW201605001A - Method of manufacturing electronic package module and electronic package module manufactured by the same - Google Patents

Abstract

A method of manufacturing electronic package module is provided. The method performs metal compartment by metal dam and filling process so as to protect electronic element from electromagnetic influence in concert with metal coating.

Description

Manufacturing method and structure of electronic package module

The invention relates to a method for manufacturing an electronic package module and a structure thereof, in particular to a method for manufacturing an electronic package module and a structure thereof for forming a column dam by using a cured photo-curable glue for local selective sealing.

At present, electronic packaging modules usually encapsulate electronic components in a module by using a molding compound to protect the electronic components from moisture and the like. However, some electronic components, especially photoelectric components, charge-coupled components, light-emitting components, or connector components, should not be covered by the molding material to prevent the electronic components from being coated by the molding material to affect the operation or even Can't work.

On the other hand, as the density of integrated components in the electronic package module increases, electromagnetic interaction between components may cause malfunction or even malfunction of the module. For example, the RF component is sensitive to high frequency electromagnetic waves and is easily HF. Component or high-speed digital components interfere. At this stage, the solution is to use a metal sputtering or spraying process to produce an electromagnetic shielding metal layer. However, this method is suitable for comprehensive metal shielding, and it is not possible to create a metal compartment between different electronic components, if a molding material is used. It takes time and labor to hollow out and refill the metal as a compartment.

The invention provides a method for manufacturing an electronic package module, which uses a cured photo-curable adhesive to form a dam to perform partial molding. The manufacturing method comprises the steps of: providing a circuit substrate having an assembly plane, at least one ground pad; and setting at least one electricity a sub-element on the assembly plane; forming at least one dam structure on the assembly plane, wherein the dam structure forms a die-bonding region, and at least one of the electronic components is located in the molding region; The dam structure forms at least one mold block over the mold sealing region; and forms a metal shielding layer on the mold block. The method for forming the structure of the dam includes spraying the photo-curable adhesive with a printing nozzle, and irradiating the photo-curable adhesive with ultraviolet light.

According to the above method, the present invention further provides an electronic package module having a partially molded structure made by the above manufacturing method. Alternatively, there is a structure further having a metal compartment which is formed by a solidified metal paste or a conductive dam structure.

The manufacturing method of the present invention and the structure thereof establish a column dam with a photo-curable glue to mold the electronic component and generate a compartment, and then perform metal coating to form a metal compartment shield for the electronic component, and protect the electronic component Free from electromagnetic interference (EMI).

For a better understanding of the techniques, methods and efficacies of the present invention, reference should be made to the detailed description and drawings of the invention, The drawings and the annexed drawings are for the purpose of illustration and description only

11, 21, 31‧‧‧ circuit substrate

12, 22, 32‧‧‧ bar dam

13, 23, ‧ ‧ die block

14, 34‧‧‧ ink layer

15, 25, 35‧‧‧ metal shield

36‧‧‧Metal glue

17, 27, 37‧‧‧ grounding mat

18, 28, 38, 19, 29, 39‧‧‧ Electronic components

F‧‧‧ fixture

C1, C2‧‧‧ cutting line

1A-1F are side views of a first embodiment of an electronic package module structure according to the present invention; FIG. 2 is a side view of a second embodiment of the electronic package module structure of the present invention; FIG. A side view of a third embodiment of the electronic package module structure in the manufacturing process; FIG. 4 is a top view of the fourth embodiment of the electronic package module structure of the present invention in a manufacturing process.

Hereinafter, an embodiment of an electronic package module of the present invention will be explained through an embodiment. Method of making. It should be noted that the embodiments of the present invention are not intended to limit the invention to any specific environment, application or special mode as described below. Therefore, the description of the embodiments is only for the purpose of illustrating the invention and is not intended to limit the invention.

Please refer to FIG. 1A-1F , which are side views corresponding to the first embodiment of the electronic package module structure in the manufacturing process of the present invention. In this embodiment, referring to FIG. 1A, a circuit substrate 11 is prepared. The circuit substrate 11 has a ground pad 17. The size, shape and range of the ground pad 17 are not particularly limited, and are mainly set according to design requirements. The subsequently formed metal shield layer 15 and the dam structure 12 are electrically connected.

Next, the electronic component 18 is mounted on the assembly plane (for example, the upper surface) of the circuit substrate 11. The assembly method can be performed by using Surface Mount Technology (SMT), but not limited thereto.

Referring again to FIG. 1B, a dam structure 12 is formed on the assembly plane of the circuit substrate 11, wherein the dam structure 12 does not contact the ground pad 17. The dam structure 12 is formed of a photo-curable adhesive, and the photo-curable adhesive component is, for example, a polymer material containing ultraviolet sensing. The method for forming the dam structure 12 can use a general PCB board text printer (not shown) to spray the photo-curable glue while curing the photo-curable glue with ultraviolet light, and by reciprocating spraying, To form a dam structure 12 having a certain height, as shown in FIG. 1B. Referring to FIG. 1B and FIG. 4 simultaneously, FIG. 1B shows a portion of the dam structure 12 and the molding area above the circuit substrate 11. The dam structure 12 can be electrically conductive or non-conductive. If it is electrically conductive, a photoconductive adhesive having good conductivity can be selected, for example, the composition includes metal particles and a photo-curable resin.

Then, the mold block 13 is formed in the mold sealing region and the electronic component 18 is covered. The method of forming the mold block 13 can be generally formed by injection molding or injection molding, but not limited thereto. The barrier properties of the dam structure 12 can be utilized to inject or fill the liquid molding compound to the height of the electronic component 18 in the molding region formed by the dam structure 12, and the molding block 13 is cured. In a preferred embodiment, the entire circuit substrate can be displaced after filling the liquid molding compound. Defoaming is carried out in a vacuum furnace (not shown) to prevent air from being mixed in the mold block 13; thereafter, the liquid molding compound is cured and cured by heating. In addition, in a preferred embodiment, referring to FIG. 4 at the same time, the barrier property of the frame fixture F and the dam structure 12 can be utilized together, and the molding region surrounded by the frame fixture F and the dam structure 12 can be used. The mold block 13 is formed therein, wherein the frame jig F is temporarily mounted on the outermost periphery of the circuit substrate 11 and surrounds the circuit substrate 11. It should be particularly noted that the present embodiment is molded by using the frame fixture F to match the molding area surrounded by the dam structure 12, and in other practical applications, the overall design of the dam structure 12 can also be adopted. The frame fixture F is omitted, for example, forming a fenced structure 12 that is entirely enclosed on a predetermined section forming the mold block 13.

Referring to FIG. 1C, before the metal shielding layer 15 for electromagnetic shielding is established, the upper surface of the molding block 13 and the dam structure 12 may be selectively polished, for example, by a grinding machine or a laser, but not by This is limited. Next, an ink layer 14 is formed on the reserved area on the assembly plane of the circuit substrate 11. The ink layer 14 may use an ink composed of a photosensitive curable resin or a thermosetting resin, such as a liquid photosensitive ink, and can be simply removed after a subsequent process. As shown in FIG. 1C, the reserved area is used, for example, for subsequent electrical connection to other electronic components, and the ink layer 14 does not cover the mold block 13 nor covers the ground pad 17.

Referring to FIG. 1D, the metal shield layer 15 is entirely coated on the entire surface, and the metal shield layer 15 completely covers the mold block 13 and is electrically connected to the ground pad 17 on the assembly plane. Furthermore, the metal shield layer 15 can cover the side surface of the circuit substrate 11 and be electrically connected to the metal pads 17 on the side of the circuit substrate 11. The metal masking layer 15 can be formed by a common metal coating process such as a spray coating, an electroless plating or a sputtering process, or a conductive tape, but not This is limited to this.

Next, referring to FIG. 1E, the ink layer 14 is removed. The above-mentioned method of using the ink layer 14 is formed in the reserved area, and then the metal shielding layer 15 is completely formed, and then the ink layer 14 is removed. Alternatively, the metal shielding layer 15 may be formed on the molding block 13 in other manners. The ground pad 17 is electrically connected, for example, with a patterned mask and a metal coating process such as a spray coating or a sputtering process.

The above procedure is applicable to the structure of the dam structure 12 being electrically conductive or non-conducting. If the dam structure 12 is not electrically conductive, the metal shielding layer 15 needs to cover the upper surface of the molding block 13 and the dam structure 12, and the metal shielding layer 15 is required. Further extending the sidewall of the fence dam structure 12 and the grounding pad 17, and the grounding pad 17 is not overlapped or connected with the dam structure 12, thereby maximizing the contact area between the metal shielding layer 15 and the grounding pad 17 to increase the grounding effect. . If the dam structure 12 is electrically conductive, the metal shielding layer 15 may cover only the upper surface of the molding block 13 and the dam structure 12 without covering the side wall of the dam structure 12. At this time, the grounding pad 17 needs to be at least with the dam structure 12. Partially overlapping for electrical connection, as exemplified below.

Referring to FIG. 1F, the electronic component 19 can be disposed on the circuit substrate 11 without the molding block. The electronic component 19 is, for example, a photovoltaic component that is not covered by the molding block, such as a CMOS image sensor, a CCD, or the like. Light-emitting diodes or connectors, etc., can be assembled by using surface adhesion technology, but not limited thereto.

Next, please refer to FIG. 2, which is a side view of a second embodiment of the electronic package module structure of the present invention. In this embodiment, most of the processes are similar to the first embodiment, such as the adhesion mode of the electronic component, the formation mode of the die block, the formation mode of the metal shield layer, the material of the bar dam structure, and the formation manner, etc. The details will not be described again in the second embodiment. The main difference between this second embodiment and the first embodiment is that in the first embodiment (FIG. 1E, FIG. 1F), the dam structure 12 can form a plurality of mold blocks on the assembly plane of the circuit substrate 11. For example, the two mold blocks in the first embodiment are respectively located on different sides of the assembly plane; in the second embodiment, the column dam structure 22 can form only one mold block on the assembly plane. However, the individual sizes, shapes, and ranges of the dam structures 12, 22 are not limited, and may be designed differently according to requirements. For example, in the molded area, the dam structure 22 may be further present between the respective electronic components. Taking FIG. 2 as an example, the bar dam structure 22 exists between the three electronic components 28 in the figure, so that three mold blocks can be formed.

3A-3F, FIG. 3A-3F are side views of a third embodiment of the electronic package module structure of the present invention in a manufacturing process. In this embodiment, most of the processes are similar to the first and second embodiments, such as the manner in which the electronic components are adhered, the manner in which the mold blocks are formed, and the manner in which the metal shield is formed, etc., which will not be in the third embodiment. Let us repeat the details. The most important difference between the third embodiment and the first and second embodiments is that the dam structure 32 has electrical conductivity, for example, formed by curing with a conductive paste, and the dam structure 32 is electrically connected to the ground pad 37. The metal shield layer 35 is electrically connected to the column dam structure 32.

In detail, referring to FIG. 3A, a circuit substrate 31 is prepared. The circuit substrate 31 has a ground pad 37. The size, shape, and range of the ground pad 37 are not particularly limited, and are mainly set according to design requirements, and are subsequently formed. The dam structure 32 can be electrically connected to the ground pad 37.

Next, the electronic component 38 is mounted on the wiring substrate 31. Then, the dam structure 32 is formed on the ground pad 37 of the circuit substrate 31, and the dam structure 32 is formed of a conductive photo-curable metal glue, and the component thereof is a metal-containing polymer material, and the general PCB board text can be utilized. A printing machine (not shown) sprays the photo-curable metal glue while irradiating the photo-curable metal glue with ultraviolet light to cure it, and re-spraying to form a dam structure 32 having a certain height. . Thereafter, a mold block 33 is formed in the region surrounded by the dam structure 32 and covers the electronic component 38.

Another difference between this embodiment and the foregoing embodiment is that in order to further form a metal compartment for certain electronic components to shield electromagnetic interference with adjacent electronic components, the object can be achieved by two technical solutions, one for the metal The compartment is part of the dam structure 32 and the other is to use a laser to open or slot and fill the metal material to form a metal compartment. A method of forming a metal compartment by using a laser to open or grooving and filling a metal material is as follows. Referring to FIG. 3B, after the molding block 33 is formed by the dam structure 32 and the upper surface is finished, a portion of the circuit substrate 31 and the molding block 33 are covered with an ink layer 34 to protect the surface from subsequent processes. The resulting dirt adheres. Next, in order to form a separate metal compartment screen for certain electronic components 38 The masking block 33 can be directly slotted by laser using a laser, and the grounding pad 37 can be used as the laser cutting end end by using the grounding pad 37 and the sealing block 33 to different degrees of laser absorption. The present invention is not limited to this concept as long as it can achieve the means of cutting only the mold block 33 while leaving the circuit substrate 31. For example, the mold block 33 can also be grooved by external routing.

After the grooving, the metal glue 36 can be injected into the groove and the metal glue 36 can be solidified as shown in Fig. 3C. Here, the metal glue 36 can use a conventional metal glue, and it is preferable to use a heat-curable metal glue, but it is not limited thereto, as long as it can meet the finer and deeper characteristics of the groove opened by the above laser. The metal glue can be completely cured.

Next, the ink layer 34 over the mold block 33 is removed, as shown in Figure 3D. In detail, after the ink layer 34 is completely removed, the ink layer 34 is partially formed on the unmolded area by a mask having a patterned design. In practice, if the upper surface flatness is required, a polishing or grinding step may be performed to smooth the upper surface of the mold block 33 and the dam structure 32. In this case, the above comprehensive removal of the ink may be omitted. Layer 34 then forms portions of ink layer 34 on the unmolded regions. In this way, the purpose of forming the respective metal compartments for the selected electronic components 38 can be achieved, for example, mutual interference between the radio frequency components and the high-frequency components, so that a complete electromagnetic process can be formed between the electronic components by a simple process. Protection.

Referring to FIG. 3E, a metal shield layer 35 is formed to cover the top of the mold block 33, the dam structure 32, the ground pad 37, and the ink layer 34. In this way, the metal shield layer 35 can be electrically connected to the ground pad 37 via the metal shield layer 35 itself and the dam structure 32.

Next, as shown in FIG. 3F, the ink layer 34 is removed, and the electronic component 39 can be subsequently disposed on the area of the circuit substrate 31 without the mold block. The electronic component 39 is, for example, a connector or an optical sensing component.

Next, please refer to FIG. 4. FIG. 4 is a top view of the fourth embodiment of the electronic package module structure of the present invention in a manufacturing process. In the fourth embodiment, a plurality of electronic package module structures can be simultaneously completed, and FIG. 1C can only represent a plurality of electronic packages as shown in FIG. A single electronic package module structure in the module structure.

Further, the steps of FIGS. 1A-1C of the plurality of electronic package module structures can be simultaneously performed on the same circuit substrate 11. After the steps of FIG. 1A-1C are completed, the cutting process can be further performed along the cutting lines C1 and C2 shown in FIG. 4 to cut out the electronic package modules by cutting or laser cutting. Forming a plurality of independent electronic package modules, the steps of FIGS. 1D-1F can be followed to obtain a plurality of electronic package modules having complete metal shields.

In addition, the above embodiments may also select other technical solutions for collocation or replacement on the process, as described below. The electronic components 19, 29, 39 on the predetermined area of the photovoltaic element (ie, the moldless block area) can be disposed on the circuit substrate in the same process as the other electronic components 18, 28, 38; for example, the electronic component of FIG. 3F 39 is disposed on the circuit board 31 without the mold block region, and may be combined with the electronic component 39 disposed on the circuit substrate 31 when the electronic component 38 is mounted on the circuit substrate 31 in FIG. 3A. Thus, the third embodiment The ink layer 34 on the middle moldless block region can be omitted, and the process of forming the ink layer 34 over the mold block 33 and forming the metal shield layer 35 can be used to cover the region to make the electronic component. 39 is not affected. Second, when the dam structure is electrically conductive, the metal shielding layer covers only the upper surface of the molding block and the top of the dam structure but does not cover the side wall of the dam structure. At this time, the metal shielding layer is electrically connected to the grounding pad through the dam structure. . Thirdly, for example, after forming the mold block, a cutting process is performed to form a plurality of independent electronic package modules, and then the metal shielding layers 15, 25, 35 cover the outer surface of the entire independent electronic package module, including the mold seal. The upper surface of the block and dam structure, the side wall of the dam structure, the grounding pad, and even the grounding pad on the side of the substrate.

Furthermore, in another embodiment of the present invention, one surface of the circuit substrate may have two or more compartments surrounded by a plurality of conductive or non-conductive bar dam structures. At least one of the conductive bar dam structures may be shared by two adjacent metal compartment shields. The individual dimensions, shapes, and extents of the dam structure can be designed differently according to requirements, providing products with selective partial molding. Design flexibility in its process.

Moreover, in another embodiment of the invention not shown, the individual dimensions, shapes and ranges of the dam structure can be designed for a plurality of die areas on the circuit substrate. Specifically, the column dam structure can not only surround the electronic components, but also divide the circuit substrate into a plurality of regions. Then, according to actual needs, at least one of the regions surrounded and separated by the dam structure may be selected to form a molding block and cover the electronic components in the regions. Then, the surface of the mold block is trimmed, and then the metal shield process is performed to form a partially sealed, partially shielded metal compartment shield.

In summary, the electronic package module of the present invention utilizes a photo-curable adhesive, and a bar-like structure can be established similar to the concept of 3D printing by using a general printing nozzle with ultraviolet light, and then the barrier property of the bar dam structure is used to form a mode. Blocking, with metal coating, can form a plurality of metal compartment shields in a simple process to achieve electromagnetic interference protection for electronic components. Not only can metal compartments of any shape be completed according to requirements, but also formed by this method. The thin side wall of the metal compartment (that is, the dam structure of the guide pad) is thinner, which can increase space utilization and design flexibility.

11‧‧‧Line substrate

12‧‧‧ Grounding mat

13‧‧‧ dam

15‧‧‧Metal shield

17‧‧‧ Grounding mat

18‧‧‧Electronic components

19‧‧‧Electronic components

Claims (10)

A method for manufacturing an electronic package module, comprising the steps of: providing a circuit substrate having an assembly plane and at least one ground pad; disposing at least one electronic component on the assembly plane; forming at least one column dam structure An assembly plane, wherein the dam structure forms a die-bonding region, and at least one of the electronic components is located in the molding region; and the dam structure is used to form at least one molding block over the molding region; A metal shielding layer is formed on the mold block. The manufacturing method according to claim 1, wherein the method of forming the dam structure comprises the steps of: spraying a photo-curable adhesive with a printing head while irradiating the photo-curable adhesive with an ultraviolet light. The manufacturing method of claim 1, wherein the method of forming the mold block in the mold region comprises the steps of: pouring a liquid mold compound into a space enclosed by the dam structure and the mold region; And curing the liquid molding compound to form the mold block. The manufacturing method of claim 1, wherein before the forming the metal shielding layer over the molding block, further comprising: polishing the molding block and an upper surface of the dam structure. The manufacturing method of claim 1, wherein after forming the mold block, the method further comprises: slotting the mold block with a laser, injecting a metal glue into the groove, and curing the metal glue. An electronic package module structure comprising: a circuit substrate having an assembly plane and at least one ground pad; and a plurality of electronic components disposed on the assembly plane; At least one column dam structure is formed on the assembly plane, and is composed of a photo-curable glue, the dam structure and the assembly plane form a molding region, and some of the electronic components are located in the molding region; and at least a mold block disposed on the mold sealing area; and a metal shielding layer disposed on the mold block. The electronic package module structure of claim 6, wherein the photo-curable adhesive is electrically conductive, consisting of metal particles and a photo-curable resin, and part of the dam structure is overlapped and electrically connected to the portion. These grounding pads. The electronic package module structure of claim 6, wherein the metal shielding layer further extends to cover sidewalls of the dam structure and is electrically connected to a portion of the ground pads. The electronic package module structure of claim 6, wherein the molding blocks on the molding area are spaced apart by a structure formed by curing the column dam structure or a conductive paste. The electronic package module structure of claim 6, wherein the circuit substrate further has a side, the side has at least one ground pad, and the metal shield electrically connects the ground pads of the side.