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TW201446541A - 模製流體流動結構之技術 - Google Patents

模製流體流動結構之技術 Download PDF

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Publication number
TW201446541A
TW201446541A TW103106568A TW103106568A TW201446541A TW 201446541 A TW201446541 A TW 201446541A TW 103106568 A TW103106568 A TW 103106568A TW 103106568 A TW103106568 A TW 103106568A TW 201446541 A TW201446541 A TW 201446541A
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Taiwan
Prior art keywords
die
molding
sheets
long
grain
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TW103106568A
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English (en)
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TWI538820B (zh
Inventor
Chien-Hua Chen
Michael W Cumbie
Arun K Agarwal
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Hewlett Packard Development Co
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Priority claimed from PCT/US2013/033046 external-priority patent/WO2014133561A1/en
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of TW201446541A publication Critical patent/TW201446541A/zh
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Publication of TWI538820B publication Critical patent/TWI538820B/zh

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    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Impression-Transfer Materials And Handling Thereof (AREA)
  • Pens And Brushes (AREA)

Abstract

在一範例中，用以製造一微裝置結構之一方法包括在一單塊體部材料中模製一微裝置，以及在該體部中形成一流體流動通路，其中流體能夠經過該通路直接通到該微裝置。

Description

模製流體流動結構之技術 發明領域
本發明係有關一種模製流體流動結構之技術。
發明背景
在一噴墨筆或列印桿中的每個列印頭晶粒包括將墨水運載至射出腔室之細微通道。墨水係從該墨水供應源透過通路而分配至該等晶粒通道，該等通路係在該筆或列印上支持該(等)列印頭晶粒的一結構中。可能會想要的是，縮小每個列印頭晶粒的尺寸，例如降低該晶粒的花費以及從而降低該筆或列印桿之花費。然而，使用較小的晶粒會需要改變支持該等晶粒之較大結構，其包括分配墨水到該等晶粒之通路。
依據本發明之一可行實施例，係特地提出一種用以製造列印桿之方法，其包含下列步驟：以用於一列印桿的一圖案在一載體上安置多個列印頭晶粒長薄片，每個晶粒長薄片具有可供流體經過而進入該晶粒長薄片之一入口、和附有小孔之一正面，流體可經由該等小孔自該晶粒長薄片分配，且該等晶粒長薄片安置於該載體上讓每個晶 粒長薄片之正面面對該載體；繞著每個晶粒長薄片模製一體部材料，但不覆蓋該晶粒長薄片的該正面上之該等小孔；於該體部內在該等入口處形成開口；從該載體移除該等晶粒長薄片；以及將晶粒長薄片的群組分離成多個列印桿。
10‧‧‧列印頭結構、列印桿
12‧‧‧列印頭
14‧‧‧體部、模製物
16‧‧‧列
18、68‧‧‧列印頭晶粒
20‧‧‧射出腔室
22‧‧‧小孔
24、66‧‧‧通道
26‧‧‧歧管
28‧‧‧埠
30‧‧‧晶粒表面
32‧‧‧基材
34‧‧‧層
36‧‧‧小孔板
38‧‧‧導體、傳導線跡
40‧‧‧保護層
42‧‧‧電氣端子
44‧‧‧撓曲電路
46‧‧‧載體
48‧‧‧釋開帶
50‧‧‧開口
52‧‧‧轉移模製工具
54‧‧‧預模製成型體
55‧‧‧模製複合物
56‧‧‧模製物
58‧‧‧列印頭組合、條帶
60‧‧‧黏接墊
62‧‧‧箭頭
64‧‧‧蓋體
102~122‧‧‧步驟
圖1~5描繪實作一新式列印頭流動結構的範例之一噴墨列印桿。
圖6~11和12~15描繪用以製造一列印頭流動結構之範例程序，該列印頭流動結構例如可能在圖1~5中所顯示的列印桿中所使用。
圖16~21描繪用以製造例如在圖1~5中所顯示的列印桿之一列印桿之一晶圓層級程序的一範例。
圖22~24描繪一新式列印頭流動結構之其他範例。
圖25~27和28~30描繪用以製造例如於圖22~24中所顯示的一列印頭流動結構之範例程序。
相同部件的號碼指出遍及該等圖式之相同或類似部件。該等圖式不必然依比例。某些部件的相對尺寸被誇大以更清楚地描繪所顯示的範例。
較佳實施例之詳細說明
利用一基材寬列印桿總成之噴墨印表機已被發展來幫助增加列印速度及降低列印花費。基材寬列印桿總 成包括多個部件，其將列印流體從列印流體供應源運載至小的列印頭晶粒，該列印流體係從該等小列印頭晶粒射出至紙張或其他列印基材。當降低列印頭晶粒的尺寸和空間對於降低花費持續重要，從較大的供應源構件輸送列印流體到更為較小、更緊縮空間的晶粒需要複雜的流動結構及實際上會增加花費之製造過程。
一個新的程序已被發展來製造列印頭流體結構，其幫助使較小列印頭晶粒能夠在基材寬噴墨印表機中使用。在一範例中，該新的程序包括在多個列印頭晶粒周圍的材料之一體部中形成流體流動通道，使得該等通道中之一或更多者接觸到該等晶粒的每一者內之一流動通路。在此範例的一實作中，與繞著該等晶粒模製該體部同時，利用一轉移模製工具，該等通道係模製於該體部內。
該新的程序之範例並不限於製造列印頭結構，亦可用於製造其他裝置且可用於其他流體流動應用。因此，在一範例中，該新的程序包括在材料的一單塊體部中模製一微裝置並在該體部中形成一流體流動通路，流體能夠經過該流體流動通路直接通至該微裝置。舉例而言，該微裝置能夠是一電子裝置、一機械裝置、或一微電機系統(MEMS)裝置。該流體流動例如可為流入該微裝置中或在其上流動之一冷卻流體、或是流入一列印頭晶粒或其他流體分配微裝置中之流體。
顯示於圖式中並於下文描述的這些和其他範例例示但並未限制本發明，本發明係由此描述文件後之申請 專利範圍所定義。
如同在本文件中所使用地，一「微裝置」表示具有小於或等於30mm的一或更多一外尺寸之一裝置；「薄」表示小於或等於650μm之一厚度；一「長薄片」表示一薄的微裝置具有至少為三的一長寬(L/W)比；一「列印頭」和一「列印頭晶粒」表示用於從一或更多開口分配流體之一噴墨印表機的部件或其他噴墨型分配器的部件。一列印頭包括一或更多列印頭晶粒。「列印頭」和「列印頭晶粒」不限於以墨水和其他列印流體列印，而是也包括其他流體及/或用於列印以外用途之噴墨類型分配。
圖1~5繪示一個新的模製噴墨列印頭結構10的一範例。在此範例中，列印頭結構10係組配成例如可能在一單一通過基材寬印表機中所使用之一長形列印桿。圖6~21繪示用以製造一列印桿10之一新的程序之範例。首先參照圖1的俯視圖，列印頭12係埋設於塑膠或其他可模製材料之一長形單塊體部14，以及係安置成以一錯開組態大體端對端地呈多列16，其中每一列中的該等列印頭與該列中的另一列印頭重疊。一模製的體部14在本文也被表示為一模製物14。雖然顯示出錯列的列印頭12之四列16，例如用以列印四種不同顏色，但是可能有其他合適的組態。
圖2係沿著圖1中的線2-2提取之一剖視圖。圖3和4係圖2之細節圖，以及圖5係顯示列印頭12的一些形貌體之布局的一俯視圖。現在參照圖1~5，在所顯示的範例中，每個列印頭12包括一單一列印頭晶粒18，其具有兩列射出腔 室20和對應的小孔22，列印流體係透過該等小孔22自腔室20射出。在模製物14中的一通道24供應列印流體給每個列印頭晶粒18。可能有用於各個列印頭12之其他合適的組態。舉例來說，較多或較少的列印頭晶粒18可被用於較多或較少的射出腔室20及通道24。列印流體從一歧管26流入各個射出腔室20，該歧管26係在射出腔室20的兩列之間沿著每個晶粒18縱向延伸。列印流體經過多個埠28進送至歧管26，該等埠28係連接至在晶粒表面30的一列印流體供應通道24。
僅為了方便來清楚顯示射出腔室20、小孔22、歧管26和埠28，圖1~5中的一列印頭12之理想化表示描繪為三層32、34、36。一實際的噴墨列印頭晶粒18係形成在具有未示於圖1~5中的層和元件之一矽基材32之一典型複雜的積體電路(IC)結構。舉例而言，在各個射出腔室20，於基材32上形成一熱射出器元件或一壓電射出器元件(未示出)係被致動來從小孔22射出墨水或其他列印流體的液滴或液流。由一保護層40所覆蓋且附接於基材32上的電氣端子42之導體38運載電氣信號至射出器及/或列印頭晶粒18的其他元件。
圖6~10描繪用以製造例如圖1~5中所顯示的這種列印桿10之範例程序。圖11係描繪於圖6~10中的程序之一流程圖。首先參照圖6，具有傳導線跡38和保護層40之一撓曲電路44係以一熱釋開帶48層疊於一載體46上，另或是被施加於一載體46(圖11中的步驟102)。可施加撓曲電路44， 例如，為大約與載體46相同尺寸之一薄板或是連接多個晶粒18和黏接墊60(黏接墊60顯示於圖16和21)的條帶。如同圖7和8所顯示地，列印頭晶粒18係往下安置在載體46上的開口50中的小孔側(圖11中的步驟104)，以及導體38以焊料、傳導性黏性材、金屬對金屬壓縮黏接或其他合適的技術來黏接至電氣端子42(圖11中的步驟106)。在圖9中，一轉移模製工具52形成圍繞列印頭晶粒18之一單塊體部14(圖11中的步驟108)。在此範例中，通道24係被模製於體部14內。在模製之後，列印桿10係自載體46釋開(圖11中的步驟110)以形成圖10中所顯示的完成部件，其中導體38係由層40所覆蓋且由模製物14所圍繞。
圖12~14繪示用以製造一列印桿10之另一範例程序。圖15係繪示於圖12~14中的程序之一流程圖。首先參照圖12，列印頭晶粒18已被安置於載體46上並在如同上文所參照圖6和7(圖15中的步驟112、114和116)之撓曲電路44上方，以及一預模製成型體54係以用於通道24之想要的組態之一圖案，膠黏或以其他方式附著於晶粒18的後側(圖15中之步驟118)。在圖13中，一轉移模製工具52圍繞列印頭晶粒18，形成一單塊模製物56(圖15中之步驟120)。在此範例中，模製複合物55流入晶粒18附近的空隙中，但於通道24中被成型體54阻擋。體部14因此由預模製成型體54和模製物56的組成物所形成，並具有由成型體54所界定之通道24。在模製之後，列印桿10係從載體46釋開((圖15中之步驟122)，以形成圖14中所顯示的完整部件。
界定具有一預模製成型體54之通道24可允許一較簡單的模製工具52與較大的寬容度。在預模製成型體54中的通道24可被視為比埠28更寬，來為成型體54在晶粒18上允許一明顯的未對準寬容度。舉例來說，對於大約100μm寬的列印流體埠28來說，300μm寬的通道24讓預模製成型體未對準高達100μm，且不會影響列印流體對於埠28的流動。成型體54可為環氧化物、聚合物、不銹鋼、印刷電路板層體或其他合適的體部材料。
圖16~21繪示用以製造多個列印桿10之一晶圓等級程序之一範例。請參照圖16，列印頭12係設置在一圖案的多個列印桿中之一玻璃或其它合適的載體晶圓46。一「晶圓(wafer)」在產業中有時用於表示一圓形基材，而一「平板(panel)」係用於表示一矩形基材。然而，在本文件中，一「晶圓」係包括任何形狀的載體。並且，雖然顯示出一載體，然而亦可使用具有高溫度帶的一切割環、一引線框或其它合適的載體。如參照圖6和圖11中的步驟102上文所述者，在首先施加或形成一圖案的導體38和晶粒開口50之後，列印頭12可被放置在載體46上。
在圖16中所顯示的範例中，各具有四行列印頭12之五個組合58係佈置於載體46以形成五個列印桿。用於在信紙或A4尺寸的基材上列印並具有四行列印頭12之一基材寬列印桿，例如為大約230mm長和16mm寬。如此，五個列印頭組合58可被佈置於如圖16中所示之一單一270mm乘以90mm的載體晶圓上。圖17係四行列印頭12中之一組合的一 特寫截面圖，其係沿著圖16中的17至17線截取。(為了清楚，在圖17中省略斷面線。)在圖17中所顯示的範例中，每個列印頭12包括一對列印頭晶粒18。並且，一陣列的導體38延伸至黏接墊60靠近列印頭12的每一行之邊緣，如同圖16和21所顯示者。圖18顯示在繞著列印頭晶粒18模製具有通道24之體部14之後，製程中的晶圓結構。個別列印桿的條帶58係在圖19中分離，以及在圖20中自載體46釋開，以形成五個個別的列印桿10。
圖22~24繪示一個新的列印頭結構10之其它範例。在這些範例中，通道16係沿著列印頭晶粒12的各側模製於體部14內。參照圖22~24，列印流體直接地從通道24，自通道24流經過埠28，側向地進入各射出腔室20，如同圖23和24中的流動箭頭62所指示者。在圖23的範例中，一蓋體64係在小孔板36上方形成，以關閉通道24。在圖24的範例中，小孔板36係在模製體部14之後施用，來關閉通道24。
圖25~27繪示用以製造圖23中所示之列印頭結構10的一程序之一範例。參照圖25，列印頭晶粒18係置放在一載體46上的小孔側下，並且以一熱釋開帶48或其它合適的暫時黏接物來固定。在圖26中，一轉移模製工具52繞著列印頭形成一體部14，並且在模製之後，列印頭結構10係從該載體46釋開，如同圖27中所示者。在此範例中，部分形成的通道66係模製於體部14內。如圖23中所示，蓋體64係被施用至圖27之該製程中的結構以完成通道24。
圖28~30繪示用以製造圖24中所示的列印頭結構 10之程序的一範例。在此範例中，並參照圖28，部分完成的列印頭晶粒68係被放置在載體46上且與一暫時黏接物48固定。在圖29中，轉移模製工具52繞著部分列印頭晶粒68形成一體部14，其具有模製於體部14內之部分形成的通道66(圖30)。如圖30所示，在模製之後，列印頭結構10係從載體46釋開，以及然後一小孔板36被施加到圖30的製程中的結構上或是在該結構上形成，以完成圖24中所示之通道24和晶粒18。
模製流體結構10幫助能夠使用長、窄且非常薄的列印頭晶粒18。舉例來說，已顯示的是25mm長和500μm寬之一100μm厚的列印頭晶粒18能夠被模製於一500μm厚的體部14內，以取代一傳統500μm厚的矽列印頭晶粒。相較於在一矽基材中形成進送通道，將通道24模製於體部14內不僅較便宜且較容易，而且也比在一較薄的晶粒12中形成列印流體埠28較便宜且較簡單。舉例而言，一100μm厚的列印頭晶粒12中之埠28可藉由不是特別針對較厚基材的乾式蝕刻和其他合適的微加工技術所形成。非形成傳統槽件，而是將一高密度陣列的通孔28微加工至一薄的矽、玻璃或其他基材32，會留下一較強健的基材，同時仍然提供充足的列印流體流。預期的是，流動晶粒處理設備與微裝置模製工具和技術，能夠適於如50μm的薄度並具有最高達150的一長/寬比之模製晶粒18，以及適於模製或以其他方式形成如30μm的窄度之通道24。並且，該模製物14提供一有效但不昂貴的結構，其中多行的此種晶粒長薄片能夠在 一單一單塊體部中獲支持。
如同在本說明的開始所提示地，圖式中所顯示與上文所描述的範例係例示但不會限制本發明。有可能有其它範例。因此，前述描述應不會被詮釋為限制本發明的範圍，其是由後附的申請專利範圍所界定。
12‧‧‧列印頭
14‧‧‧體部、模製物
18‧‧‧列印頭晶粒
24‧‧‧通道

Claims (15)

  1. 一種用以製造列印桿之方法，其包含下列步驟：以用於一圖案的一列印桿在一載體上安置多個列印頭晶粒長薄片，每個晶粒長薄片具有可供流體經過而進入該晶粒長薄片之一入口、和附有小孔之一正面，流體可經過該等小孔自該晶粒長薄片分配，且該等晶粒長薄片安置於該載體上讓每個晶粒長薄片之正面面對該載體；繞著每個晶粒長薄片模製一體部材料，但不覆蓋該晶粒長薄片的該正面上之該等小孔；於該體部內在該等入口處形成開口；從該載體移除該等晶粒長薄片；以及將晶粒長薄片的群組分離成多個列印桿。
  2. 如請求項1之方法，進一步包含下列步驟：將一圖案的電氣導體施加至該載體；將各個晶粒長薄片上之一電氣端子連接至一導體；以及與繞著各個晶粒長薄片模製該體部同時，繞著該等導體模製該體部。
  3. 如請求項1之方法，其中形成該等開口之步驟包含與繞著每個晶粒長薄片模製該體部同時，將該等開口模製進該體部內。
  4. 如請求項1之方法，其中形成該等開口之步驟包含將一 預模製成型體以界定該等開口的一圖案施加於該等晶粒長薄片，以及然後繞著該等晶粒長薄片模製該體部之材料。
  5. 如請求項1之方法，其中模製該體部之步驟包含同時繞著所有的該等晶粒長薄片模製一單塊體部材料。
  6. 如請求項5方法，其中同時繞著所有晶粒長薄片模製該體部的步驟包含同時繞著所有的該等晶粒長薄片，轉移模製一單塊體部材料。
  7. 如請求項1之方法，其中移除該等晶粒長薄片係在分離晶片長薄片的群組為多個列印桿之後執行。
  8. 一種用以製造列印頭結構之方法，其包含在圍繞多個列印頭晶粒之一體部材料中形成流體流動通道，使得該等通道中之一或更多者接觸進入該等晶粒的中每一者之一流動通路。
  9. 如請求項8之方法，其中在圍繞該等晶粒之一體部中形成該等通道之步驟，包括將該等通道模製進該體部內，同時繞著該等晶粒模製該體部。
  10. 如請求項8之方法，其中在圍繞該等晶粒之一體部中形成該等通道之步驟，包括把該體部的一預模製成型部分以界定該等通道的一圖案施加到該等晶粒，以及然後繞著該等晶粒模製該體部的另一部分。
  11. 如請求項8之方法，其中在圍繞該等晶粒之一體部中形成該等通道之步驟，包括與繞著該等晶粒模製該體部同時，將部分成型通道模製於該體部中，以及然後覆蓋該 等部分成型通道。
  12. 如請求項11之方法，其中該等列印頭晶粒係部分完成的列印頭晶粒，以及覆蓋該等部分成型通道包括以一列印頭晶粒小孔板覆蓋該等部分成型通道。
  13. 一種用以製造微裝置結構之方法，其包含在一單塊體部材料中模製一微裝置，以及在該體部中形成一流體流動通路，流體能夠經過該通路直接通到該微裝置。
  14. 如請求項13之方法，其中該微裝置包含一列印頭晶粒長薄片。
  15. 如請求項13之方法，其中該流體流動通道係與模製該微裝置於該體部中同時地形成。
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