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TW201438137A - 基板承載件 - Google Patents

基板承載件 Download PDF

Info

Publication number
TW201438137A
TW201438137A TW103102073A TW103102073A TW201438137A TW 201438137 A TW201438137 A TW 201438137A TW 103102073 A TW103102073 A TW 103102073A TW 103102073 A TW103102073 A TW 103102073A TW 201438137 A TW201438137 A TW 201438137A
Authority
TW
Taiwan
Prior art keywords
substrate
top plate
assembly
substrate carrier
plate assembly
Prior art date
Application number
TW103102073A
Other languages
English (en)
Chinese (zh)
Inventor
派特 派卡尼克
安卓 挪頓
Original Assignee
牛津儀器奈米科技工具有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 牛津儀器奈米科技工具有限公司 filed Critical 牛津儀器奈米科技工具有限公司
Publication of TW201438137A publication Critical patent/TW201438137A/zh

Links

Classifications

    • H10P72/7608—
    • H10P72/7611—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • H10P72/76—
    • H10P72/7624—

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
TW103102073A 2013-01-22 2014-01-21 基板承載件 TW201438137A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1301124.2A GB201301124D0 (en) 2013-01-22 2013-01-22 Substrate carrier

Publications (1)

Publication Number Publication Date
TW201438137A true TW201438137A (zh) 2014-10-01

Family

ID=47843717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103102073A TW201438137A (zh) 2013-01-22 2014-01-21 基板承載件

Country Status (3)

Country Link
GB (2) GB201301124D0 (fr)
TW (1) TW201438137A (fr)
WO (1) WO2014114927A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109478525A (zh) * 2016-07-09 2019-03-15 应用材料公司 基板载体
TWI747611B (zh) * 2020-11-13 2021-11-21 天虹科技股份有限公司 晶片預清潔機台
TWI761270B (zh) * 2020-11-13 2022-04-11 天虹科技股份有限公司 晶片預清潔機台
TWI799120B (zh) * 2020-11-13 2023-04-11 天虹科技股份有限公司 晶片預清潔機台

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101692251B1 (ko) * 2014-08-06 2017-01-03 (주)얼라이드 테크 파인더즈 플라즈마 장치
GB201709446D0 (en) * 2017-06-14 2017-07-26 Semblant Ltd Plasma processing apparatus
CN111613506B (zh) * 2020-05-22 2023-10-13 北京北方华创微电子装备有限公司 半导体腔室的固定组件及半导体腔室
CN112885738B (zh) * 2020-09-03 2024-02-23 天虹科技股份有限公司 晶片固定机构及使用该晶片固定机构的晶片预清洁机台
CN112563164B (zh) * 2020-11-25 2022-07-12 鑫天虹(厦门)科技有限公司 晶片预清洁机台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473455A (en) * 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
US5262029A (en) * 1988-05-23 1993-11-16 Lam Research Method and system for clamping semiconductor wafers
US5753133A (en) * 1994-07-11 1998-05-19 Applied Komatsu Technology, Inc. Method and apparatus for etching film layers on large substrates
US8535445B2 (en) * 2010-08-13 2013-09-17 Veeco Instruments Inc. Enhanced wafer carrier
JP5524139B2 (ja) * 2010-09-28 2014-06-18 東京エレクトロン株式会社 基板位置検出装置、これを備える成膜装置、および基板位置検出方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109478525A (zh) * 2016-07-09 2019-03-15 应用材料公司 基板载体
CN109478525B (zh) * 2016-07-09 2023-12-08 应用材料公司 基板载体
TWI747611B (zh) * 2020-11-13 2021-11-21 天虹科技股份有限公司 晶片預清潔機台
TWI761270B (zh) * 2020-11-13 2022-04-11 天虹科技股份有限公司 晶片預清潔機台
TWI799120B (zh) * 2020-11-13 2023-04-11 天虹科技股份有限公司 晶片預清潔機台

Also Published As

Publication number Publication date
WO2014114927A1 (fr) 2014-07-31
GB201401015D0 (en) 2014-03-05
GB2511418B (en) 2018-04-04
GB2511418A (en) 2014-09-03
GB201301124D0 (en) 2013-03-06

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