[go: up one dir, main page]

GB201301124D0 - Substrate carrier - Google Patents

Substrate carrier

Info

Publication number
GB201301124D0
GB201301124D0 GBGB1301124.2A GB201301124A GB201301124D0 GB 201301124 D0 GB201301124 D0 GB 201301124D0 GB 201301124 A GB201301124 A GB 201301124A GB 201301124 D0 GB201301124 D0 GB 201301124D0
Authority
GB
United Kingdom
Prior art keywords
substrate carrier
carrier
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1301124.2A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxford Instruments Nanotechnology Tools Ltd
Original Assignee
Oxford Instruments Nanotechnology Tools Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxford Instruments Nanotechnology Tools Ltd filed Critical Oxford Instruments Nanotechnology Tools Ltd
Priority to GBGB1301124.2A priority Critical patent/GB201301124D0/en
Publication of GB201301124D0 publication Critical patent/GB201301124D0/en
Priority to TW103102073A priority patent/TW201438137A/zh
Priority to GB1401015.1A priority patent/GB2511418B/en
Priority to PCT/GB2014/050162 priority patent/WO2014114927A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/7608
    • H10P72/7611
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • H10P72/76
    • H10P72/7624

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
GBGB1301124.2A 2013-01-22 2013-01-22 Substrate carrier Ceased GB201301124D0 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GBGB1301124.2A GB201301124D0 (en) 2013-01-22 2013-01-22 Substrate carrier
TW103102073A TW201438137A (zh) 2013-01-22 2014-01-21 基板承載件
GB1401015.1A GB2511418B (en) 2013-01-22 2014-01-21 Substrate carrier
PCT/GB2014/050162 WO2014114927A1 (fr) 2013-01-22 2014-01-21 Porte-substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1301124.2A GB201301124D0 (en) 2013-01-22 2013-01-22 Substrate carrier

Publications (1)

Publication Number Publication Date
GB201301124D0 true GB201301124D0 (en) 2013-03-06

Family

ID=47843717

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB1301124.2A Ceased GB201301124D0 (en) 2013-01-22 2013-01-22 Substrate carrier
GB1401015.1A Active GB2511418B (en) 2013-01-22 2014-01-21 Substrate carrier

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1401015.1A Active GB2511418B (en) 2013-01-22 2014-01-21 Substrate carrier

Country Status (3)

Country Link
GB (2) GB201301124D0 (fr)
TW (1) TW201438137A (fr)
WO (1) WO2014114927A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101692251B1 (ko) * 2014-08-06 2017-01-03 (주)얼라이드 테크 파인더즈 플라즈마 장치
KR102277918B1 (ko) * 2016-07-09 2021-07-14 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어
GB201709446D0 (en) * 2017-06-14 2017-07-26 Semblant Ltd Plasma processing apparatus
CN111613506B (zh) * 2020-05-22 2023-10-13 北京北方华创微电子装备有限公司 半导体腔室的固定组件及半导体腔室
CN112885738B (zh) * 2020-09-03 2024-02-23 天虹科技股份有限公司 晶片固定机构及使用该晶片固定机构的晶片预清洁机台
TWI747611B (zh) * 2020-11-13 2021-11-21 天虹科技股份有限公司 晶片預清潔機台
TWI761270B (zh) * 2020-11-13 2022-04-11 天虹科技股份有限公司 晶片預清潔機台
TWI799120B (zh) * 2020-11-13 2023-04-11 天虹科技股份有限公司 晶片預清潔機台
CN112563164B (zh) * 2020-11-25 2022-07-12 鑫天虹(厦门)科技有限公司 晶片预清洁机台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473455A (en) * 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
US5262029A (en) * 1988-05-23 1993-11-16 Lam Research Method and system for clamping semiconductor wafers
US5753133A (en) * 1994-07-11 1998-05-19 Applied Komatsu Technology, Inc. Method and apparatus for etching film layers on large substrates
US8535445B2 (en) * 2010-08-13 2013-09-17 Veeco Instruments Inc. Enhanced wafer carrier
JP5524139B2 (ja) * 2010-09-28 2014-06-18 東京エレクトロン株式会社 基板位置検出装置、これを備える成膜装置、および基板位置検出方法

Also Published As

Publication number Publication date
GB2511418B (en) 2018-04-04
GB2511418A (en) 2014-09-03
TW201438137A (zh) 2014-10-01
GB201401015D0 (en) 2014-03-05
WO2014114927A1 (fr) 2014-07-31

Similar Documents

Publication Publication Date Title
GB2521727B (en) Array substrate
SG11201509970WA (en) Improved wafer carrier having thermal uniformity-enhancing features
SG10201803039XA (en) Towers for substrate carriers
HUE044228T2 (hu) Egyszerûsített FDD-TDD vivõ aggregáció
GB201318238D0 (en) Child carrier
SG11201601609RA (en) Glass substrate
GB2511418B (en) Substrate carrier
IL245928A0 (en) Free-flowing elemental carrier
AP00445S1 (en) Substrate
AU354078S (en) Carrier
EP2985219A4 (fr) Méthanier
EP2945186A4 (fr) Substrat de semi-conducteur
EP2967208A4 (fr) Support personnel amélioré
SG11201801454QA (en) Substrate carrier
GB201416836D0 (en) Drinks carrier
AU352839S (en) A carrier
GB2512593B (en) A carrier
PL2969843T3 (pl) Nosidło do pojemników
GB201304735D0 (en) A carrier
GB201313921D0 (en) Bicycle carrier
ZA201304544B (en) Carrier
ZA201407253B (en) Carrier arrangement
GB201320049D0 (en) Artwork substrate
AU2013902553A0 (en) Carrier
TWM432927U (en) Substrate carrier improvement

Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)