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TW201309754A - Thermoplastic resin composition - Google Patents

Thermoplastic resin composition Download PDF

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TW201309754A
TW201309754A TW101126581A TW101126581A TW201309754A TW 201309754 A TW201309754 A TW 201309754A TW 101126581 A TW101126581 A TW 101126581A TW 101126581 A TW101126581 A TW 101126581A TW 201309754 A TW201309754 A TW 201309754A
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group
carbon atoms
butyl
thermoplastic resin
hydrogen atom
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TW101126581A
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Chinese (zh)
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Natsuko Sato
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Sumitomo Chemical Co
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/527Cyclic esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/202Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/06Polyethene

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention provides a thermoplastic resin composition comprising (A) a thermoplastic resin, (B) a compound represented by the formula (1), and (C) carbon black, wherein the content of (C) is 2 to 250 weight parts per one weight part of (B). Wherein R1, R2, R5, R6 and R7 represent a hydrogen atom, an alkyl group, an aralkyl group or a phenyl group, R3 and R4 represent a hydrogen atom or an alkyl group, X1 represents a single bond, a sulfur atom or a group represented by -CHR9-, R9 represents a hydrogen atom, an alkyl group or a cycloalkyl group, A1 represents an alkanediyl group or a group represented by *-COR10-, R10 represents a single bond or an alkanediyl group, * represents a hand bonding to -O-, one of Y1 and Z1 represents a hydroxyl group, an alkoxy group or an aralkyloxy group, and the other represents a hydrogen atom or an alkyl group.

Description

熱可塑性樹脂組成物 Thermoplastic resin composition

本發明係關於熱可塑性樹脂組成物等。 The present invention relates to a thermoplastic resin composition and the like.

JP2001-106832-A中記載一熱可塑性樹脂組成物,其含有熱可塑性樹脂、[6-[3-(3-第三丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四(第三丁基)二苯并[d,f][1,3,2]二磷雜庚環([6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldib enzo[d,f][1,3,2]dioxaphosphepin])及碳黑,且相對於[6-[3-(3-第三丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四(第三丁基)二苯并[d,f][1,3,2]二磷雜庚環]1重量份,碳黑之含量為0.83重量份。 JP2001-106832-A describes a thermoplastic resin composition containing a thermoplastic resin, [6-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propoxy]- 2,4,8,10-tetrakis(t-butyl)dibenzo[d,f][1,3,2] [6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldib enzo[d,f][1 , 3,2]dioxaphosphepin]) and carbon black, and relative to [6-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8 , 10-tetra(t-butyl)dibenzo[d,f][1,3,2] The content of carbon black was 1 part by weight, and the content of carbon black was 0.83 parts by weight.

此外,專利文獻1中記載一熱可塑性樹脂組成物,其含有熱可塑性樹脂、[6-[3-(3-第三丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四(第三丁基)二苯并[d,f][1,3,2]二磷雜庚環]及碳黑,且相對於[6-[3-(3-第三丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四(第三丁基)二苯并[d,f][1,3,2]二磷雜庚環]1重量份,碳黑之含量為1.67重量份。 Further, Patent Document 1 describes a thermoplastic resin composition containing a thermoplastic resin, [6-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propoxy]- 2,4,8,10-tetrakis(t-butyl)dibenzo[d,f][1,3,2] Phosphonium ring and carbon black, and relative to [6-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10- Tetrakis(t-butyl)dibenzo[d,f][1,3,2] The content of carbon black was 1.67 parts by weight, based on 1 part by weight of the phosphonium ring.

以往之熱可塑性樹脂組成物中,有隨著熱劣化而產生的膠量多、加工安定性無法充分滿足之情形。 In the conventional thermoplastic resin composition, there is a case where the amount of glue generated by thermal deterioration is large and the process stability cannot be sufficiently satisfied.

本發明含有以下發明。 The present invention contains the following invention.

[1]一種熱可塑性樹脂組成物,其含有(A)熱可塑性樹脂、(B)式(I)所表示之化合物、以及(C)碳黑,且相對於(B)1重量份,(C)的含量為2至250重量份。 [1] A thermoplastic resin composition comprising (A) a thermoplastic resin, (B) a compound represented by the formula (I), and (C) carbon black, and (B) 1 part by weight, (C) The content is from 2 to 250 parts by weight.

(式中,R1、R2、R5、R6、R7及R8各自獨立地表示氫原子、碳數1至8之烷基、碳數5至8之環烷基、碳數6至12之烷基環烷基、碳數7至12之芳烷基或苯基。 (wherein R 1 , R 2 , R 5 , R 6 , R 7 and R 8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, and a carbon number of 6; An alkylcycloalkyl group of 12, an aralkyl group having 7 to 12 carbon atoms or a phenyl group.

R3及R4各自獨立地表示氫原子或碳數1至8之烷基。 R 3 and R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.

X1表示單鍵、硫原子或-CHR9-基,R9表示氫原子、碳數1至8之烷基或碳數5至8之環烷基。 X 1 represents a single bond, a sulfur atom or a -CHR 9 - group, and R 9 represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms or a cycloalkyl group having 5 to 8 carbon atoms.

A1表示碳數2至8之烷二基或*-COR10-基,R10表示單鍵或碳數1至8之烷二基,*表示與-O-之鍵結。 A 1 represents a C 2 to 8 alkanediyl group or a *-COR 10 - group, R 10 represents a single bond or a C 1 to 8 alkanediyl group, and * represents a bond to -O-.

Y1及Z1任一者表示羥基、碳數1至8之烷氧基或碳數7至12之芳烷氧基,另一者表示氫原子或碳數1至8之烷基)。 Any of Y 1 and Z 1 represents a hydroxyl group, an alkoxy group having 1 to 8 carbon atoms or an aralkyloxy group having 7 to 12 carbon atoms, and the other represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms).

[2]如[1]所述之熱可塑性樹脂組成物,其中,Y1為羥基,R7及R8至少一者為碳數3至8之烷基、碳數5至8之環烷基、碳數6至12之烷基環烷基、碳數7至12之芳烷基或 苯基。 [2] The thermoplastic resin composition according to [1], wherein Y 1 is a hydroxyl group, and at least one of R 7 and R 8 is an alkyl group having 3 to 8 carbon atoms and a cycloalkyl group having 5 to 8 carbon atoms. An alkylcycloalkyl group having 6 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms or a phenyl group.

[3]如[1]或[2]所述之可塑性樹脂組成物,其中,(A)為聚乙烯。 [3] The plastic resin composition according to [1] or [2] wherein (A) is polyethylene.

根據本發明之熱可塑性樹脂組成物,其隨著熱劣化所產生的膠量少,且加工安定性優異。 According to the thermoplastic resin composition of the present invention, the amount of glue generated by thermal deterioration is small, and the process stability is excellent.

<(A)熱可塑性樹脂> <(A) Thermoplastic Resin>

就(A)而言,可舉出例如以下所述者。 The (A) is exemplified by the following.

(1)聚乙烯,例如高密度聚乙烯(HD-PE)、低密度聚乙烯(LD-PE)或直鏈狀低密度聚乙烯(LLDPE);(2)聚丙烯;(3)甲基戊烯聚合物;(4)EEA(乙烯/丙烯酸乙酯共聚合)樹脂;(5)乙烯/醋酸乙烯酯共聚合樹脂;(6)聚苯乙烯類,例如聚苯乙烯、聚(對甲基苯乙烯)或聚(α-甲基苯乙烯);(7)AS(丙烯腈/苯乙烯共聚合)樹脂;(8)ABS(丙烯腈/丁二烯/苯乙烯共聚合)樹脂;(9)AAS(特殊丙烯酸系橡膠/丙烯腈/苯乙烯共聚合)樹脂;(10)ACS(丙烯腈/氯化聚乙烯/苯乙烯共聚合)樹脂;(11)氯化聚乙烯、聚氯丁二烯或氯化橡膠;(12)聚氯乙烯或聚二氯乙烯;(13)甲基丙烯酸系樹脂;(14)乙烯/乙烯醇共聚合樹脂;(15)氟樹脂;(16)聚縮醛;(17)接枝化聚苯醚(grafted polyphenylene ether)樹脂及聚苯硫醚樹脂;(18)聚胺甲酸乙酯;(19)聚醯胺;(20)聚酯樹脂,例如聚對苯二甲酸乙二酯或聚對苯二甲酸丁二酯等;(21)聚碳酸酯;(22)聚丙烯酸酯;(23)聚碸、聚醚醚酮、聚醚碸;(24) 芳香族聚酯樹脂;(25)苯二甲酸二烯丙酯預聚物;(26)聚矽氧樹脂;(27)1,2-聚丁二烯;(28)聚異戊二烯;(29)苯乙烯/丁二烯共聚物;(30)丁二烯/丙烯腈共聚物;(31)乙烯/丙烯共聚物;(32)乙烯/MMA(甲基丙烯酸甲酯)共聚物。 (1) Polyethylene, such as high density polyethylene (HD-PE), low density polyethylene (LD-PE) or linear low density polyethylene (LLDPE); (2) polypropylene; (3) methyl pentyl Ethene polymer; (4) EEA (ethylene/ethyl acrylate copolymerization) resin; (5) ethylene/vinyl acetate copolymer resin; (6) polystyrene, such as polystyrene, poly(p-methylbenzene) Ethylene) or poly(α-methylstyrene); (7) AS (acrylonitrile/styrene copolymerization) resin; (8) ABS (acrylonitrile/butadiene/styrene copolymerization) resin; (9) AAS (special acrylic rubber / acrylonitrile / styrene copolymerization) resin; (10) ACS (acrylonitrile / chlorinated polyethylene / styrene copolymerization) resin; (11) chlorinated polyethylene, polychloroprene Or chlorinated rubber; (12) polyvinyl chloride or polydichloroethylene; (13) methacrylic resin; (14) ethylene/vinyl alcohol copolymer resin; (15) fluororesin; (16) polyacetal; (17) grafted polyphenylene ether resin and polyphenylene sulfide resin; (18) polyurethane; (19) polyamine; (20) polyester resin, such as poly(p-phenylene) Ethylene formate or polybutylene terephthalate; (21) polycarbonate; (22) Acrylate; (23) poly sulfone, polyether ether ketone, polyether sulfone; (24) Aromatic polyester resin; (25) diallyl phthalate prepolymer; (26) polyoxyl resin; (27) 1,2-polybutadiene; (28) polyisoprene; 29) styrene/butadiene copolymer; (30) butadiene/acrylonitrile copolymer; (31) ethylene/propylene copolymer; (32) ethylene/MMA (methyl methacrylate) copolymer.

(A)可單獨使用上述例示之樹酯,或是使用上述例示之樹酯的混合物。 (A) The above-exemplified resin may be used singly or as a mixture of the above-exemplified resins.

(A)較佳為聚乙烯(例如HD-PE、LD-PE、LLDPE)或聚丙烯等聚烯烴,特佳為聚乙烯。 (A) is preferably a polyolefin such as polyethylene (for example, HD-PE, LD-PE, LLDPE) or polypropylene, and particularly preferably polyethylene.

熱可塑性樹脂之製造方法並無特別限定,例如可為藉由自由基聚合而獲得者,也可為藉由使用含有週期表第IVb族、第Vb族、第VIb族或第VIII族之金屬的觸媒之聚合所製造者。 The method for producing the thermoplastic resin is not particularly limited, and may be, for example, obtained by radical polymerization, or by using a metal containing Group IVb, Group Vb, Group VIb or Group VIII of the periodic table. Manufacturer of catalyst polymerization.

相關之含有金屬的觸媒只要是具有一個以上配位基,例如具有藉由π鍵結或σ鍵結所配位之氧化物、鹵化合物、醇化物(alcoholate)、酯、芳基等的金屬錯合物即可,可直接使用該錯合物,也可擔持於氯化鎂、氯化鈦、氧化鋁、氧化矽等基材上。 The related metal-containing catalyst may be any metal having one or more ligands, for example, an oxide, a halogen compound, an alcoholate, an ester, an aryl group or the like coordinated by a π bond or a sigma bond. The complex compound may be used as it is, and the complex may be used as it is, or may be supported on a substrate such as magnesium chloride, titanium chloride, aluminum oxide or cerium oxide.

例如在聚烯烴之製造中,較佳為使用例如齊格勒-納他觸媒(Ziegler-Natta catalyst)、茂金屬觸媒(metallocene catalyst)、飛利浦觸媒(Phillips catalyst)等。 For example, in the production of a polyolefin, for example, a Ziegler-Natta catalyst, a metallocene catalyst, a Phillips catalyst, or the like is preferably used.

<(B)式(I)所表示之化合物> <(B) Compound represented by formula (I)>

碳數1至8之烷基例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、 異戊基、正己基、正庚基、正辛基等。 Examples of the alkyl group having 1 to 8 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, second butyl group, tert-butyl group, and n-pentyl group. Isoamyl, n-hexyl, n-heptyl, n-octyl and the like.

碳數5至8之環烷基例如可列舉:環戊基、環己基、環庚基、環辛基等。 Examples of the cycloalkyl group having 5 to 8 carbon atoms include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group and the like.

碳數6至12之烷基環烷基例如可列舉:甲基環戊基、甲基環己基、甲基環庚基、甲基環辛基等。 Examples of the alkylcycloalkyl group having 6 to 12 carbon atoms include a methylcyclopentyl group, a methylcyclohexyl group, a methylcycloheptyl group, a methylcyclooctyl group and the like.

碳數7至12之芳烷基例如可列舉:苄基、苯基乙基、苯基丙基、三苯甲基、萘基甲基、萘基乙基等。 Examples of the aralkyl group having 7 to 12 carbon atoms include a benzyl group, a phenylethyl group, a phenylpropyl group, a trityl group, a naphthylmethyl group, and a naphthylethyl group.

碳數1至8之烷二基例如可列舉:亞甲基、伸乙基、三亞甲基、四亞甲基、五亞甲基、六亞甲基、伸異丙基、伸異丁基、2-甲基三亞甲基、伸異戊基、伸異己基、伸異辛基、2-乙基伸己基等。 Examples of the alkanediyl group having 1 to 8 carbon atoms include a methylene group, an ethylidene group, a trimethylene group, a tetramethylene group, a pentamethylene group, a hexamethylene group, an isopropyl group, and an isobutyl group. 2-methyltrimethylene, isopentyl, exohexyl, isooctyl, 2-ethylhexyl and the like.

碳數5至8之環烷二基例如可列舉:伸環戊基、伸環己基、伸環庚基、伸環辛基等。 Examples of the cycloalkanediyl group having 5 to 8 carbon atoms include a cyclopentylene group, a cyclohexylene group, a cycloheptyl group, a cyclooctyl group, and the like.

碳數1至8之烷氧基例如可列舉:甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、第二丁氧基、第三丁氧基、正戊氧基、正己氧基等。 Examples of the alkoxy group having 1 to 8 carbon atoms include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a n-butoxy group, a second butoxy group, a third butoxy group, and a n-pentyl group. Oxyl, n-hexyloxy and the like.

碳數7至12之芳烷氧基例如可列舉:苄氧基、苯基乙氧基、苯基丙氧基、三苯甲氧基、萘基甲氧基、萘基乙氧基等。 Examples of the aralkyloxy group having 7 to 12 carbon atoms include a benzyloxy group, a phenylethoxy group, a phenylpropoxy group, a triphenylmethoxy group, a naphthylmethoxy group, and a naphthylethoxy group.

(B)中特佳之化合物為6-[3-(3-第三丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四(第三丁基)二苯并[d,f][1,3,2]二磷雜庚環(以下稱為(B-1))、6-[3-(3,5-二(第三丁基)-4-羥基苯基)丙氧基]-2,4,8,10-四(第三丁基)二苯并[d,f][1,3,2]二磷雜庚環、6-[3-(3,5-二(第三丁基) -4-羥基苯基)丙氧基]-4,8-二(第三丁基)-2,10-二甲基-12H-二苯并[d,g][1,3,2]二磷雜辛環、6-[3-(3,5-二(第三丁基)-4-羥基苯基)丙醯氧基]-4,8-二(第三丁基)2,10-二甲基-12H-二苯并[d,g][1,3,2]二磷雜辛環等,最佳之化合物為6-[3-(3-第三丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四(第三丁基)二苯并[d,f][1,3,2]二磷雜庚環。 (B) The best compound is 6-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra (third Diphenyl[d,f][1,3,2] Phosphonium ring (hereinafter referred to as (B-1)), 6-[3-(3,5-di(t-butyl)-4-hydroxyphenyl)propoxy]-2,4,8, 10-tetra(t-butyl)dibenzo[d,f][1,3,2] Phosphonium, 6-[3-(3,5-di(t-butyl)-4-hydroxyphenyl)propoxy]-4,8-di(t-butyl)-2,10- Dimethyl-12H-dibenzo[d,g][1,3,2] Phosphonium ring, 6-[3-(3,5-di(t-butyl)-4-hydroxyphenyl)propenyloxy]-4,8-di(t-butyl) 2,10- Dimethyl-12H-dibenzo[d,g][1,3,2] Phosphonium ring, etc., the most preferred compound is 6-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra ( Tertiary butyl)dibenzo[d,f][1,3,2] Phosphorus heptane ring.

相對於每100重量份之(A),(B)之含量為0.001至1重量份,較佳為0.01至0.5重量份,更佳為0.03至0.5重量份,特佳為0.03至0.3重量份。 The content of (B) is 0.001 to 1 part by weight, preferably 0.01 to 0.5 part by weight, more preferably 0.03 to 0.5 part by weight, particularly preferably 0.03 to 0.3 part by weight, per 100 parts by weight of (A).

<(C)碳黑> <(C) carbon black>

(C)可列舉:熱碳黑、爐黑、乙炔黑、科琴碳黑(Ketjen black)。 (C) may be exemplified by hot carbon black, furnace black, acetylene black, and Ketjen black.

相對於每100重量份之(A),(C)之含量為0.01至5重量份,較佳為0.3至5重量份。 The content of (C) is from 0.01 to 5 parts by weight, preferably from 0.3 to 5 parts by weight, per 100 parts by weight of (A).

相對於(B)1重量份,(C)之含量為2至250重量份,更佳為3至250重量份,又更佳為3至60重量份,特佳為15至60重量份。 The content of (C) is 2 to 250 parts by weight, more preferably 3 to 250 parts by weight, still more preferably 3 to 60 parts by weight, particularly preferably 15 to 60 parts by weight, based on 1 part by weight of (B).

若相對於(B)1重量份(C)之含量為2重量份以上,則藉由併用(B)及(C)而可充分實現加工安定性之提昇,若為250重量份以下,則使碳黑的量不會過剩,使(A)之加工容易。 When the content is 1 part by weight or more based on 1 part by weight of (B), the processing stability can be sufficiently improved by using (B) and (C) in combination, and if it is 250 parts by weight or less, The amount of carbon black is not excessive, making the processing of (A) easy.

本發明之熱可塑性樹脂組成物可復含無機顏料、抗氧化劑、光安定劑、中和劑、助滑劑、抗靜電劑、阻燃劑、 交聯劑等。 The thermoplastic resin composition of the present invention may further comprise an inorganic pigment, an antioxidant, a light stabilizer, a neutralizing agent, a slip aid, an antistatic agent, a flame retardant, Crosslinking agent, etc.

<無機顏料> <Inorganic Pigments>

無機顏料例如可列舉:氧化鈦(鈦白)、氧化鋅、鐵丹、碳酸鈣或氫氧化鋁等。 Examples of the inorganic pigment include titanium oxide (titanium white), zinc oxide, iron oxide, calcium carbonate or aluminum hydroxide.

<抗氧化劑> <antioxidant>

抗氧化劑(但與(B)相異)可列舉:(D)磷系抗氧化劑、酚系抗氧化劑及硫系抗氧化劑等。 Examples of the antioxidant (other than (B)) include (D) a phosphorus-based antioxidant, a phenol-based antioxidant, and a sulfur-based antioxidant.

<(D)磷系抗氧化劑> <(D) Phosphorus Antioxidants>

(D)可舉出例如下式(II)至(IV)所表示之化合物。 (D) may, for example, be a compound represented by the following formulas (II) to (IV).

(式(II)中,R11及R12各自獨立地表示氫原子、碳數1至8之烷基、碳數5至8之環烷基、碳數6至12之烷基環烷基、碳數7至12之芳烷基或苯基)。 (In the formula (II), R 11 and R 12 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, an alkylcycloalkyl group having 6 to 12 carbon atoms, An aralkyl group having a carbon number of 7 to 12 or a phenyl group).

碳數1至8之烷基、碳數5至8之環烷基、碳數6至12之烷基環烷基、碳數7至12之芳烷基係舉出與式(I)中所例示之基相同者。 The alkyl group having 1 to 8 carbon atoms, the cycloalkyl group having 5 to 8 carbon atoms, the alkylcycloalkyl group having 6 to 12 carbon atoms, and the aralkyl group having 7 to 12 carbon atoms are given by the formula (I). The examples are the same.

(式(III)中,R13、R14、R15及R16各自獨立地表示氫原子、碳數1至8之烷基、碳數5至8之環烷基、碳數6至12之烷基環烷基、碳數7至12之芳烷基或苯基。 (In the formula (III), R 13 , R 14 , R 15 and R 16 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, and a carbon number of 6 to 12; An alkylcycloalkyl group, an aralkyl group having 7 to 12 carbon atoms or a phenyl group.

m及n各自獨立地表示0至2的整數,m為2時,2個R13可相同或相異,n為2時,2個R15可相同或相異)。 m and n each independently represent an integer of 0 to 2, and when m is 2, two R 13 's may be the same or different, and when n is 2, two R 15 's may be the same or different).

碳數1至8之烷基、碳數5至8之環烷基、碳數6至12之烷基環烷基、碳數7至12之芳烷基係舉出與式(I)中所例示之基相同者。 The alkyl group having 1 to 8 carbon atoms, the cycloalkyl group having 5 to 8 carbon atoms, the alkylcycloalkyl group having 6 to 12 carbon atoms, and the aralkyl group having 7 to 12 carbon atoms are given by the formula (I). The examples are the same.

(式(IV)中,R17及R18各自獨立地表示氫原子或甲基)。 (In the formula (IV), R 17 and R 18 each independently represent a hydrogen atom or a methyl group).

式(II)至式(IV)所表示之化合物中特佳之化合物為:三(2,4-二(第三丁基)苯基)亞磷酸鹽(以下稱為D-1)、雙(2,4-二(第三丁基)苯基)新戊四醇二亞磷酸鹽、雙(2,6-二(第三丁基)-4-甲基苯基)新戊四醇二亞磷酸鹽、雙(2,4-二(異丙苯基)苯基)新戊四醇二亞磷酸鹽、及四(2,4-二(第三丁基)苯基)-4,4’-伸聯苯二亞磷酸鹽。 Particularly preferred compounds among the compounds represented by the formulae (II) to (IV) are: tris(2,4-di(t-butyl)phenyl)phosphite (hereinafter referred to as D-1), bis (2) ,4-di(t-butyl)phenyl)neopentanol diphosphite, bis(2,6-di(t-butyl)-4-methylphenyl)neopentanol diphosphite Salt, bis(2,4-di(isopropylphenyl)phenyl)neopentanol diphosphite, and tetrakis(2,4-di(t-butyl)phenyl)-4,4'- Extending biphenyl diphosphite.

相對於每100重量份之(A),(D)之含量較佳為1重量份以下,特佳為0.3重量份以下。 The content of (D) is preferably 1 part by weight or less, and particularly preferably 0.3 part by weight or less per 100 parts by weight of (A).

<酚系抗氧化劑及硫系抗氧化劑> <Phenolic antioxidants and sulfur-based antioxidants>

酚系抗氧化劑及硫系抗氧化劑可列舉:2,6-二(第三丁 基)-4-甲基酚、3-(3,5-二(第三丁基)-4-羥基苯基)丙酸正十八烷酯、新戊四醇四(3-(3,5-二(第三丁基)-4-羥基苯基)丙酸酯)、三乙二醇雙(3-(3-第三丁基-5-甲基-4-羥基苯基)丙酸酯)、1,3,5-三甲基-2,4,6-三(3,5-二(第三丁基)-4-羥基苄基)苯、三聚異氰酸三(3,5-二(第三丁基)-4-羥基苄基)酯(以下稱為AO-1)、1,3,5-三(4-第三丁基-3-羥基-2,6-二甲基苄基)-1,3,5-三-2,4,6-(1H、3H、5H)-三酮(以下稱為AO-2)、3,9-雙(2-(3-(3-第三丁基-4-羥基-5-甲基苯基)丙醯氧基)-1,1-二甲基乙基)-2,4,8,10-四螺[5.5]十一烷、2,2’-亞甲基雙(6-第三丁基-4-甲基酚)、4,4’-亞丁基雙(6-第三丁基-3-甲基酚)、4,4’-硫基雙(6-第三丁基-3-甲基酚)、丙烯酸2-第三丁基-6-(3-第三丁基-2-羥基-5-甲基苄基)-4-甲基苯酯、丙烯酸2-(1-(2-羥基-3,5-第三戊基苯基)乙基)-4,6-二-第三戊基苯酯、3,3’-硫代二丙酸二烷基(C12-18)酯、新戊四醇四(3-月桂基硫基丙酸酯)等。 Examples of the phenolic antioxidant and the sulfur-based antioxidant include 2,6-di(t-butyl)-4-methylphenol and 3-(3,5-di(t-butyl)-4-hydroxyphenyl. n-Octadecyl propionate, pentaerythritol tetrakis(3-(3,5-di(t-butyl)-4-hydroxyphenyl)propionate), triethylene glycol bis(3-( 3-tert-butyl-5-methyl-4-hydroxyphenyl)propionate), 1,3,5-trimethyl-2,4,6-tris(3,5-di(third) (4-hydroxybenzyl)benzene, tris(3,5-di(t-butyl)-4-hydroxybenzyl) isocyanate (hereinafter referred to as AO-1), 1,3, 5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-three -2,4,6-(1H,3H,5H)-trione (hereinafter referred to as AO-2), 3,9-bis(2-(3-(3-tert-butyl-4-hydroxy-5) -methylphenyl)propenyloxy)-1,1-dimethylethyl)-2,4,8,10-tetra Spiro[5.5]undecane, 2,2'-methylenebis(6-tert-butyl-4-methylphenol), 4,4'-butylenebis(6-t-butyl-3- Methylphenol), 4,4'-thiobis(6-tert-butyl-3-methylphenol), 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-acrylate- 5-methylbenzyl)-4-methylphenyl ester, 2-(1-(2-hydroxy-3,5-tripentylphenyl)ethyl)-4,6-di-third pentyl acrylate Phenylphenyl ester, 3,3'-thiodipropionic acid dialkyl (C 12-18 ) ester, neopentyl alcohol tetrakis(3-laurylthiopropionate), and the like.

<光安定劑> <Light stabilizer>

光安定劑可列舉:癸二酸雙(2,2,6,6-四甲基-4-哌啶基)酯、琥珀酸二甲酯‧1-(2-羥基乙基)-4-羥基-2,2,6,6-四甲基哌啶聚縮物(以下稱為H-1)、聚[{6-(1,1,3,3-四甲基丁基)胺基-1,3,5-三-2,4-二基}{(2,2,6,6-四甲基-4-哌啶基)亞胺基}六亞甲基{(2,2,6,6-四甲基-4-哌啶基)亞胺基}](以下稱為H-2)、2-羥基-4-正辛氧基二苯基酮、2-(2-羥基-5-甲基苯基)苯并三唑、2-(3-第三丁基-2-羥基 -5-甲基苯基)-5-氯苯并三唑、3,5-二(第三丁基)-4-羥基苄酸2,4-二(第三丁基)苯酯。 The light stabilizer can be exemplified by bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate and dimethyl succinate ‧1-(2-hydroxyethyl)-4-hydroxyl -2,2,6,6-tetramethylpiperidine polycondensate (hereinafter referred to as H-1), poly[{6-(1,1,3,3-tetramethylbutyl)amino-1 , 3,5-three -2,4-diyl}{(2,2,6,6-tetramethyl-4-piperidinyl)imido}hexamethylene {(2,2,6,6-tetramethyl-) 4-piperidinyl)imido}] (hereinafter referred to as H-2), 2-hydroxy-4-n-octyloxydiphenyl ketone, 2-(2-hydroxy-5-methylphenyl)benzene Triazole, 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole, 3,5-di(t-butyl)-4-hydroxybenzyl Acid 2,4-di(t-butyl)phenyl ester.

<中和劑> <neutralizer>

中和劑可舉出合成水滑石、天然水滑石、氫氧化鈣等。 The neutralizing agent may, for example, be synthetic hydrotalcite, natural hydrotalcite, calcium hydroxide or the like.

<助滑劑> <slip agent>

助滑劑可列舉:石蠟、聚乙烯蠟、硬脂酸、硬脂酸丁酯、硬脂醇、硬脂酸鈣及硬化蓖麻油等。 Examples of the slip agent include paraffin wax, polyethylene wax, stearic acid, butyl stearate, stearyl alcohol, calcium stearate, and hardened castor oil.

<抗靜電劑> <antistatic agent>

抗靜電劑可列舉:第1級胺鹽、第3級胺鹽、第4級胺鹽及吡啶衍生物等陽離子系抗靜電劑;硫酸化油、肥皂、硫酸化酯油、硫酸化醯胺油、烯烴之硫酸化酯鹽類、脂肪醇硫酸酯鹽類、烷基硫酸酯鹽、脂肪酸乙酯磺酸鹽、烷基萘磺酸鹽、烷基苯磺酸鹽、琥珀酸酯磺酸鹽及磷酸酯鹽等陰離子系抗靜電劑;多元醇之部分脂肪酸酯、脂肪醇之環氧乙烷加成物、脂肪酸之環氧乙烷加成物、脂肪胺或脂肪醯胺之環氧乙烷加成物、烷基酚之環氧乙烷加成物、多元醇之部分脂肪酸酯之環氧乙烷加成物及聚乙二醇等非離子系抗靜電劑;羧酸衍生物及咪唑啉衍生物等兩性系抗靜電劑。 Examples of the antistatic agent include cationic antistatic agents such as a first-grade amine salt, a third-order amine salt, a fourth-order amine salt, and a pyridine derivative; a sulfated oil, a soap, a sulfated ester oil, and a sulfated guanamine oil. Sulfated ester salts of olefins, fatty alcohol sulfate salts, alkyl sulfate salts, fatty acid ethyl esters, alkyl naphthalenesulfonates, alkylbenzenesulfonates, succinate sulfonates and Anionic antistatic agent such as phosphate salt; partial fatty acid ester of polyhydric alcohol, ethylene oxide adduct of fatty alcohol, ethylene oxide adduct of fatty acid, ethylene oxide of fatty amine or fatty decylamine An adduct, an ethylene oxide adduct of an alkylphenol, an ethylene oxide adduct of a partial fatty acid ester of a polyhydric alcohol, and a nonionic antistatic agent such as polyethylene glycol; a carboxylic acid derivative and an imidazole An amphoteric antistatic agent such as a morphine derivative.

<阻燃劑> <Flame retardant>

阻燃劑例如可列舉:氫氧化鋁、氫氧化鎂、水滑石、溴系阻燃劑、三氧化銻、多磷酸系阻燃劑、碳酸鎂、碳酸鈣、二氧化矽、滑石、沸石、黏土等。 Examples of the flame retardant include aluminum hydroxide, magnesium hydroxide, hydrotalcite, bromine-based flame retardant, antimony trioxide, polyphosphoric acid flame retardant, magnesium carbonate, calcium carbonate, cerium oxide, talc, zeolite, and clay. Wait.

<交聯劑> <crosslinker>

交聯劑係舉出有機過氧化物,例如可列舉:2,5-二甲基己烷、2,5-二氫過氧化物、2,5-二甲基-2,5-二(過氧化第三丁基)己烷、3-二(過氧化第三丁基);過氧化第三二異丙苯基、2,5-二甲基-2,5-雙(過氧化第三丁基)己烷、2,5-二甲基-2,5-二(過氧化第三丁基)己炔、3,5-二甲基-2,5-(過氧化第三丁基)己烷、2,5-二甲基-2,5-二(過氧化第三丁基)己烷-3、4,4’-雙(過氧化第三丁基)二異丙基苯、過氧化二異丙苯基、過氧化第三丁基異丙苯基、α,α’-雙(第三丁基過氧化異丙基)苯、α,α’-雙(過氧化第三丁基)二異丙基苯、正丁基-4,4-雙(過氧化第三丁基)丁烷、2,2-雙(過氧化第三丁基)丁烷、1,1-雙(過氧化第三丁基)環己烷、1,1-雙(過氧化第三丁基)-3,3,5-三甲基環己烷、1,1-二(過氧化第三丁基)-2-甲基環己烷、2,2-二[4,4-二(過氧化第三丁基)環己烷]丙烷、過氧化苄酸第三丁酯、過氧化苄醯基、過氧化異丙基單碳酸第三己酯、過氧化順丁烯二酸第三丁酯、過氧化-3,5,5-三甲基己酸第三丁酯、過氧化月桂酸第三丁酯、過氧化異丙基單碳酸第三丁酯、過氧化-2-乙基己基單碳酸第三丁酯、過氧化苄酸第三己酯等。該等可單獨使用,也可併用兩種以上。 The crosslinking agent is exemplified by an organic peroxide, and examples thereof include 2,5-dimethylhexane, 2,5-dihydroperoxide, and 2,5-dimethyl-2,5-di (by Oxidized tert-butyl)hexane, 3-di(t-butylperoxide); third diisopropylphenyl peroxide, 2,5-dimethyl-2,5-bis (peroxidized third Base) hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne, 3,5-dimethyl-2,5-(t-butylperoxide) Alkane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane-3,4,4'-bis(t-butylperoxy)diisopropylbenzene, peroxidation Diisopropylphenyl, tributyl cumyl peroxide, α,α'-bis(t-butylperoxyisopropyl)benzene, α,α'-bis(tributylbutyl peroxide) Diisopropylbenzene, n-butyl-4,4-bis(t-butylperoxy)butane, 2,2-bis(tributylbutyl peroxide)butane, 1,1-double (peroxidation) Third butyl)cyclohexane, 1,1-bis(t-butylperoxide)-3,3,5-trimethylcyclohexane, 1,1-di(t-butylperoxide)- 2-methylcyclohexane, 2,2-bis[4,4-di(t-butylperoxy)cyclohexane]propane, tert-butyl peroxybenzylate, benzalkonium peroxide, Third hexyl isopropyl monocarbonate, tert-butyl peroxy maleate, tert-butyl peroxy-3,5,5-trimethylhexanoate, tert-butyl peroxy laurate , butyl tributyl methoxide monoperlate, tert-butyl peroxy-2-ethylhexyl monocarbonate, third hexyl peroxybenzoate, and the like. These may be used singly or in combination of two or more.

<製造方法> <Manufacturing method>

本發明之熱可塑性樹脂組成物之製造方法中,製造所使用的裝置例如可列舉:滾筒攪拌機(tumbler blender)、亨歇爾混合機(Henschel mixer)、超級混合機等混合機;單軸或多軸之擠壓機、捏合機或班布里混合機(Banbury mixer)等。 In the method for producing a thermoplastic resin composition of the present invention, for example, a mixer such as a tumbler blender, a Henschel mixer, or a super mixer may be used; and a single shaft or more Shaft extruder, kneader or Bamburi mixer (Banbury) Mixer) and so on.

例如藉由將(A)、(B)及(C)等以滾筒攪拌機、亨歇爾混合機、超級混合機等混合機預先均勻混合後,以單軸擠壓機或多軸擠壓機而融熔混練造粒之方法;或是以捏合機或班布里混合機等融熔混練後再使用擠壓機造粒之方法等,而可製造本發明之熱可塑性樹脂組成物。 For example, by uniformly mixing (A), (B), and (C) in a mixer such as a drum mixer, a Henschel mixer, or a super mixer, a single-axis extruder or a multi-axis extruder is used. The method of melt-kneading granulation; or the method of granulating by a kneading machine or a Banbury mixer, followed by granulation using an extruder, etc., can produce the thermoplastic resin composition of the present invention.

<用途> <Use>

本發明之熱可塑性樹脂組成物伴隨著熱劣化所產生的膠量少,且加工安定性優異。 The thermoplastic resin composition of the present invention has a small amount of glue due to thermal deterioration and is excellent in process stability.

本發明之熱可塑性樹脂組成物例如可加工為電線用披覆材、汽車零件、船舶用零件、電氣/電子零件用零件、電氣絕緣零件等。 The thermoplastic resin composition of the present invention can be processed, for example, as a sheath for electric wires, automobile parts, marine parts, parts for electric/electronic parts, electrical insulating parts, and the like.

(實施例) (Example)

以下藉由實施例及比較例更詳細說明本發明,但本發明並不限制於該等例子。在未特別說明下,份表示重量基準。 Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the invention is not limited thereto. Unless otherwise stated, the parts represent the weight basis.

(實施例1) (Example 1)

將聚乙烯(住友化學公司製LDPEF-218)100份與(B-1)[6-[3-(3-第三丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四(第三丁基)二苯并[d,f][1,3,2]二磷雜庚環]0.1份與碳黑3份,使用實驗室塑料研磨機(Labo plastomill)(商品名「4C-150」、東洋精機公司製),在氮氛圍下以180℃、旋轉數50rpm之條件混練,並測定實驗室塑料研磨機之轉矩(torque)到達最大值為止之時間而作 為膠增長時間(gel buildup time)。膠增長時間越長則隨著熱劣化產生的膠量少,且加工安定性優異。結果表示於表1。 100 parts of polyethylene (LDPEF-218, manufactured by Sumitomo Chemical Co., Ltd.) and (B-1) [6-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propoxy]- 2,4,8,10-tetrakis(t-butyl)dibenzo[d,f][1,3,2] 0.1 parts of phosphorus and heptane, and 3 parts of carbon black, using a laboratory plastic grinder (Labo plastomill) (trade name "4C-150", manufactured by Toyo Seiki Co., Ltd.) under a nitrogen atmosphere at 180 ° C, a number of revolutions of 50 rpm Conditional kneading, and determining the time until the torque of the laboratory plastic grinder reaches the maximum value as the gel buildup time. The longer the gel growth time is, the less the amount of glue is generated with thermal deterioration, and the processing stability is excellent. The results are shown in Table 1.

實施例2至4及比較例1至3係除了以表1之方式變更(B-1)及碳黑的量以外,以與實施例1同樣方式測定膠增長時間。 In Examples 2 to 4 and Comparative Examples 1 to 3, the gel growth time was measured in the same manner as in Example 1 except that the amount of (B-1) and carbon black was changed as shown in Table 1.

若根據本發明之熱可塑性樹脂組成物,則隨著熱劣化產生的膠量少,且加工安定性優異。 According to the thermoplastic resin composition of the present invention, the amount of glue generated by thermal deterioration is small, and the process stability is excellent.

Claims (3)

一種熱可塑性樹脂組成物,其含有(A)熱可塑性樹脂、(B)式(I)所表示之化合物、以及(C)碳黑,且相對於(B)1重量份,(C)的含量為2至250重量份, (式中,R1、R2、R5、R6、R7及R8各自獨立地表示氫原子、碳數1至8之烷基、碳數5至8之環烷基、碳數6至12之烷基環烷基、碳數7至12之芳烷基或苯基;R3及R4各自獨立地表示氫原子或碳數1至8之烷基;X1表示單鍵、硫原子或-CHR9-基,R9表示氫原子、碳數1至8之烷基或碳數5至8之環烷基;A1表示碳數2至8之烷二基或*-COR10-基,R10表示單鍵或碳數1至8之烷二基,*表示與-O-之鍵結;Y1及Z1任一者表示羥基、碳數1至8之烷氧基或碳數7至12之芳烷氧基,另一者表示氫原子或碳數1至8之烷基)。 A thermoplastic resin composition comprising (A) a thermoplastic resin, (B) a compound represented by the formula (I), and (C) carbon black, and a content of (C) relative to (B) 1 part by weight 2 to 250 parts by weight, (wherein R 1 , R 2 , R 5 , R 6 , R 7 and R 8 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, and a carbon number of 6; An alkylcycloalkyl group to 12, an aralkyl group having 7 to 12 carbon atoms or a phenyl group; R 3 and R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms; X 1 represents a single bond, sulfur Atom or -CHR 9 - group, R 9 represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms or a cycloalkyl group having 5 to 8 carbon atoms; and A 1 represents an alkanediyl group having 2 to 8 carbon atoms or *-COR 10 a group, R 10 represents a single bond or an alkylenediyl group having 1 to 8 carbon atoms, * represents a bond to -O-; and any of Y 1 and Z 1 represents a hydroxyl group, an alkoxy group having 1 to 8 carbon atoms or The aralkyloxy group having 7 to 12 carbon atoms, the other of which represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms). 如申請專利範圍第1項所述之熱可塑性樹脂組成物,其中,Y1為羥基,R7及R8至少一者為碳數3至8之烷基、 碳數5至8之環烷基、碳數6至12之烷基環烷基、碳數7至12之芳烷基或苯基。 The thermoplastic resin composition according to claim 1, wherein Y 1 is a hydroxyl group, and at least one of R 7 and R 8 is an alkyl group having 3 to 8 carbon atoms and a cycloalkyl group having 5 to 8 carbon atoms. An alkylcycloalkyl group having 6 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms or a phenyl group. 如申請專利範圍第1項或第2項所述之可塑性樹脂組成物,其中,(A)為聚乙烯。 The plastic resin composition according to claim 1 or 2, wherein (A) is polyethylene.
TW101126581A 2011-07-26 2012-07-24 Thermoplastic resin composition TW201309754A (en)

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