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TW201235153A - Chemical mechanical polishing pad and chemical mechanical polishing method using same - Google Patents

Chemical mechanical polishing pad and chemical mechanical polishing method using same Download PDF

Info

Publication number
TW201235153A
TW201235153A TW100144867A TW100144867A TW201235153A TW 201235153 A TW201235153 A TW 201235153A TW 100144867 A TW100144867 A TW 100144867A TW 100144867 A TW100144867 A TW 100144867A TW 201235153 A TW201235153 A TW 201235153A
Authority
TW
Taiwan
Prior art keywords
honing
layer
chemical mechanical
pad
hardness
Prior art date
Application number
TW100144867A
Other languages
English (en)
Chinese (zh)
Inventor
Ayako Maekawa
Satoshi Kamo
Naoki Nishiguchi
Hirotaka Shida
Takahiro Okamoto
Koutarou Kubo
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW201235153A publication Critical patent/TW201235153A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW100144867A 2010-12-07 2011-12-06 Chemical mechanical polishing pad and chemical mechanical polishing method using same TW201235153A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010272450 2010-12-07

Publications (1)

Publication Number Publication Date
TW201235153A true TW201235153A (en) 2012-09-01

Family

ID=46207081

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100144867A TW201235153A (en) 2010-12-07 2011-12-06 Chemical mechanical polishing pad and chemical mechanical polishing method using same

Country Status (5)

Country Link
US (1) US20130316621A1 (fr)
JP (1) JPWO2012077592A1 (fr)
KR (1) KR20130124331A (fr)
TW (1) TW201235153A (fr)
WO (1) WO2012077592A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106661434A (zh) * 2014-07-07 2017-05-10 Jh罗得股份有限公司 用于抛光硬表面的抛光材料、包括所述材料的介质及其形成和使用方法
TWI792225B (zh) * 2020-03-17 2023-02-11 南韓商Ｓｋｃ索密思股份有限公司 研磨墊及使用該研磨墊之用於製備半導體裝置的方法
TWI838883B (zh) * 2021-09-27 2024-04-11 日商可樂麗股份有限公司 研磨墊
TWI848378B (zh) * 2021-09-27 2024-07-11 日商可樂麗股份有限公司 研磨墊

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150056895A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Ultra high void volume polishing pad with closed pore structure
JP6311183B2 (ja) * 2014-03-31 2018-04-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP6248857B2 (ja) * 2014-08-05 2017-12-20 信越半導体株式会社 研磨布の評価方法
JP2016087770A (ja) 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
CN119567090A (zh) * 2023-09-05 2025-03-07 湖北鼎汇微电子材料有限公司 抛光垫及半导体器件的制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049396A (en) * 1973-05-01 1977-09-20 National Research Development Corporation Molded abrasive article comprising non-foamed, friable polyurethane and process
JP4163756B2 (ja) * 1997-01-13 2008-10-08 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法
JP2002066905A (ja) * 2000-08-28 2002-03-05 Hitachi Ltd 半導体装置の製造方法及びその装置
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
JP2004025407A (ja) * 2002-06-27 2004-01-29 Jsr Corp 化学機械研磨用研磨パッド
JP2004266186A (ja) * 2003-03-04 2004-09-24 Hitachi Chem Co Ltd 研磨用パッド及び研磨物の製造法
JP2005303121A (ja) * 2004-04-14 2005-10-27 Psiloquest Inc 耐剥離性研磨パッド
JP3769581B1 (ja) * 2005-05-18 2006-04-26 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
EP2135707A4 (fr) * 2007-03-20 2013-10-09 Kuraray Co Coussin pour tampon de polissage et tampon de polissage utilisant le coussin
JP5044763B2 (ja) * 2007-08-01 2012-10-10 東洋ゴム工業株式会社 研磨パッド
US8388799B2 (en) * 2008-01-24 2013-03-05 Jsr Corporation Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method
JP2010153781A (ja) * 2008-11-20 2010-07-08 Hitachi Chem Co Ltd 基板の研磨方法
JP2010153782A (ja) * 2008-11-20 2010-07-08 Hitachi Chem Co Ltd 基板の研磨方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106661434A (zh) * 2014-07-07 2017-05-10 Jh罗得股份有限公司 用于抛光硬表面的抛光材料、包括所述材料的介质及其形成和使用方法
CN106661434B (zh) * 2014-07-07 2019-10-01 Jh罗得股份有限公司 用于抛光硬表面的抛光材料、包括所述材料的介质及其形成和使用方法
CN110871404A (zh) * 2014-07-07 2020-03-10 Jh罗得股份有限公司 用于抛光硬表面的抛光材料、包括所述材料的介质及其形成和使用方法
CN110871404B (zh) * 2014-07-07 2022-05-10 Jh罗得股份有限公司 用于抛光硬表面的抛光材料、包括所述材料的介质及其形成和使用方法
TWI792225B (zh) * 2020-03-17 2023-02-11 南韓商Ｓｋｃ索密思股份有限公司 研磨墊及使用該研磨墊之用於製備半導體裝置的方法
TWI838883B (zh) * 2021-09-27 2024-04-11 日商可樂麗股份有限公司 研磨墊
TWI848378B (zh) * 2021-09-27 2024-07-11 日商可樂麗股份有限公司 研磨墊

Also Published As

Publication number Publication date
US20130316621A1 (en) 2013-11-28
JPWO2012077592A1 (ja) 2014-05-19
WO2012077592A1 (fr) 2012-06-14
KR20130124331A (ko) 2013-11-13

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