201203628 六、發明說明： 【發明所屬之技術領域】 本發明係揭露一種發光二極體的SMD導線 架製造方法，且特別有關於在導線區域上進行兩 次塑模射出成型。 【先前技術】 ^ 由於發光二極體（Light-Emitting Diode，LED)201203628 VI. Description of the Invention: [Technical Field] The present invention discloses a method of manufacturing an SMD lead frame for a light-emitting diode, and particularly relates to two-time injection molding on a wire region. [Prior Art] ^ Due to Light-Emitting Diode (LED)
V 壽命長、無污染、低功耗的特性備受青睞，乃 成為當前綠色照明浪潮的主流，無論在功能性 照明、景觀裝飾照明、液晶顯示背光照明及汽 車照明等市場中，LED所占比率皆高度成長。 雖然如此，但LED的封裝仍存在一些技術 上的問題，導致LED照明燈具的晶粒壽命比預 期的短，不利於LED照明燈具產業的長期發 展。 • 習知發光二極體的SMD導線架製程技術已 揭露於中華民國發明專利公開號第200849535號， 其主要製程為在導線區域上進行塑模射出一晶 粒座，然後將接腳折彎。其晶粒座内埋端的接 腳可與發光二極體晶片電性連接，其折彎後外 露於外膠壁之接腳則與電路板（Printed Circuit Board，簡稱PCB)電性連接。由於此一習知製 程所生產發光二極體的SMD導線架，其外膠壁 外的接腳無法完全包覆於塑料之内，必須進行 201203628 額外之封膠製程，但該封膠製程通常無法完全 將外膠壁外的該接腳完全包覆，導致水汽會沿 著該外露之接腳滲入，或該外露之接腳易於氧 化、硫化，以致發光二極體晶片毁壞之問題。 為了能夠解決習知技藝之各項問題，本發 明人基於多年研究開發與諸多實務經驗，提出 一種發光二極體的SMD導線架製造方法，以改 善上述習知技藝之缺點並能兼容並蓄其優點。 【發明内容】 有鑑於上述習知技藝之問題，本發明之一 目的即在於提供一種發光二極體的SMD導線架 製造方法，以改善發光二極體的SMD導線架晶 粒座之接腳外露，易於氧化、硫化，導致發光 二極體使用壽命減少之缺點。 緣是，為達上述目的，本發明係揭露一種 ❿ 發光二極體的SMD導線架製造方法，包含步驟 S61〜S68。 首先於步驟S61，提供一金屬基板；接著 於該金屬基板上進行步驟S62，沖壓多數個導 線區域，並且每一導線區域包含至少一接腳； 於步驟S63，電鍍該金屬基板；之後，於步驟 S64，在每一導線區域上進行第一次塑模射出 以成型一基座，該基座具有固接該接腳的功能； 其次，於步驟S65，進行沖模裁切下料去除料 腳；然後，於步驟S66，進行兩段沖模，將接 201203628 腳折彎在該基座上；其後，於步驟S67，在該 基座上進行第二次塑模射出以成型一絕緣殼體， 該絕緣殼體將折彎於該基座上的接腳完全包覆 於該絕緣殼體内即成一晶粒座；最後，於步驟 S68，進行沖模裁切下料去除料腳，得到具有 多數個發光二極體的SMD導線架。 本發明一種發光二極體的SMD導線架製 造方法，在另一具體實施例中，亦可將步驟S66 中的兩段沖模折彎製程中的第一段沖模折彎製 程移至電鍍該金屬基板（步驟S63)前進行。 緣是，本發明一種發光二極體的SMD導線 架製造方法，其特徵在於在發光二極體的SMD 導線架上進行兩次塑模射出。其成品的晶粒座 外膠壁上並無外露之接腳，可以避免以習知製 程技術製造的發光二極體的導線架，水汽會沿 著外露之接腳滲入，或該外露之接腳易於氧化、 硫化或發光二極體的導線架沿著與PCB接面四 周封保護膠卻不易完全封到外露接腳之問題。 另外，發光二極體的下游封裝廠商，將發 光二極體黏晶封裝在導線架之後，為了解決光源 不均勻之散色問題，必須將晶粒座之白色表面以 各種技術將表面處理成黑色，以吸收外部光線及 該發光二極體本身之反射光線。 本發明之進一步特徵在於，第一次塑模射 出成型之基座，其材料為具有高反射率的白色 塑料，以提升發光二極體封裝後之出光效率；第 二次塑模射出成型之絕緣殼體，其材料為有色 201203628 塑料’較佳地該有色塑料為完全不透光之黑色 塑料，則可簡化下游廠商必須將封裝後之晶粒 座以各種技術將表面處理成黑色之製程。 承上所述’本發明之導線架結構，其可具 有下述優點： 本發明之一種發光二極體的SMD導線架製 ie方法，其一目的為在導線架上進行兩次塑模 射出，解決習知技術產生之接腳外露之問題， • 同時也解決了發光二極體的SMD導線架外露之 接腳的封膠問題，更一舉克服了產業界長期以 來無法解決之接腳外露，易於氧化、硫化之問 題。 本發明之一種發光二極體的SMD導線架製 造方法，其另一目的在於第一次塑模射出成型 之基座，其材料為具有高反射率的白色塑料， 以提升發光二極體封裝後之出光效率。 鲁 本發明之一種發光一極體的SMD導線架製 造方法，其又一目的在於第二次塑模射出成型 之絕緣殼體，其材料為有色塑料，較佳地該有 色塑料為完全不透光之黑色塑料，以簡化^游 廠商之製程。 茲為使貴審查委員對本發明之技術特徵 及所達到之功效有更進一步之瞭解與認識，謹 佐以較佳之實施例及配合詳細之說明如後，然 所例舉之具體實施例與圖示僅提供參考與說明用 201203628 並非用來對本發明加以限制者。 【實施方式】 以下將參照相關圖式，說明依本發明一種發光二 極體的SMD導線架製造方法之實施例，為使便於理 解，下述實施例中之相同元件係以相同之符號標示來 說明。 請同時參閱圖1及圖2。圖1係為習知技藝之發 光二極體導線架之製造方法的流程圖。圖中顯示習知 之發光二極體導線架的製造方法包含步驟S11〜S15, 其中步驟S11~S15所述之相關元件如導線區域（2)、 接腳（210)以及晶粒座（20)標示於圖2。 首先於步驟S11，提供一金屬基板；接著於該金 屬基板上進行步驟S12，沖壓複數個導線區域（2)， 並且每一導線區域（2)包含至少一接腳（210);於步 驟S13，電鍍該金屬基板；之後，於步驟S14，以射 出成型方式在每一導線區域（2)上形成晶粒座（20 )， 再將接腳（210)折彎；最後，於步驟S15，在金屬基 板上沖模裁切下料，以得到複數個發光二極體導線 架。 請參閱圖2,其係為習知發光二極體導線架示意 圖。圖中顯示以習知技藝之發光二極體導線架之製造 方法完成的發光二極體導線架，其與發光二極體晶粒 201203628 ^之内埋端之接腳(210)雖可包覆在樹脂封料 =露於外膠壁⑽）之接腳（2⑻會讓環 :兄：的水汽沿著該外露之接腳(21〇)參入，而必須進 = 卜之封膠製程’但該封膠製程通常無法完全將外 )外的該接腳（210)完全包覆，另外該外 =之接腳（21G)也因暴露於外界環境而易於氧化及硫 化。V's long life, no pollution, low power consumption characteristics are favored, and it has become the mainstream of the current green lighting wave. In the market of functional lighting, landscape decorative lighting, LCD backlighting and automotive lighting, the ratio of LEDs Both are highly grown. Despite this, there are still some technical problems in the packaging of LEDs, resulting in the die life of LED lighting fixtures being shorter than expected, which is not conducive to the long-term development of the LED lighting industry. • The SMD lead frame process technology of the conventional light-emitting diode has been disclosed in the Republic of China Invention Patent Publication No. 200849535. The main process is to mold a crystal seat on the wire area and then bend the pin. The pin of the buried end of the die pad can be electrically connected to the LED chip, and the pin exposed to the outer rubber wall after being bent is electrically connected to a printed circuit board (PCB). Due to the SMD lead frame of the LED produced by the conventional process, the pins outside the outer rubber wall cannot be completely covered in the plastic, and the additional sealing process of 201203628 must be performed, but the sealing process is usually not possible. The pin outside the outer rubber wall is completely covered, causing water vapor to penetrate along the exposed pin, or the exposed pin is easily oxidized and vulcanized, so that the light emitting diode chip is destroyed. In order to solve the problems of the prior art, the present inventors have proposed a method for manufacturing a light-emitting diode SMD lead frame based on years of research and development and many practical experiences, in order to improve the shortcomings of the above-mentioned conventional techniques and to be compatible with the advantages. SUMMARY OF THE INVENTION In view of the above problems in the prior art, an object of the present invention is to provide a method for fabricating an SMD lead frame of a light-emitting diode to improve the exposure of the SMD lead frame die pad of the LED. It is easy to oxidize and vulcanize, resulting in the disadvantage of reducing the service life of the light-emitting diode. In order to achieve the above object, the present invention discloses a method for manufacturing an SMD lead frame of a luminescent diode, comprising steps S61 to S68. First, in step S61, a metal substrate is provided; then, step S62 is performed on the metal substrate, a plurality of wire regions are punched, and each wire region includes at least one pin; in step S63, the metal substrate is plated; thereafter, in the step S64, performing a first molding injection on each of the wire regions to form a pedestal, the pedestal having the function of fixing the pins; secondly, in step S65, performing die cutting to remove the material feet; In step S66, a two-stage die is performed, and the foot of the 201203628 is bent on the base; thereafter, in step S67, a second molding injection is performed on the base to form an insulating case, the insulation The housing folds the pin bent on the base into the insulating housing to form a die seat. Finally, in step S68, the die is cut and the material is removed to obtain a plurality of light-emitting pieces. Polar body SMD lead frame. In the other embodiment, the first segment die bending process in the two-stage die bending process in step S66 can also be moved to the metal substrate. (Step S63) is performed before. The invention relates to a method for manufacturing an SMD lead frame of a light-emitting diode according to the present invention, characterized in that two-mold injection is performed on an SMD lead frame of a light-emitting diode. There is no exposed pin on the outer rubber wall of the finished die, which can avoid the lead frame of the light-emitting diode manufactured by the conventional process technology, the water vapor will penetrate along the exposed pin, or the exposed pin The lead frame which is easy to oxidize, vulcanize or illuminate the diode is sealed around the PCB and is not easily sealed to the exposed pin. In addition, the downstream package manufacturer of the light-emitting diode has a light-emitting diode bonded to the lead frame. In order to solve the problem of uneven color dispersion of the light source, the white surface of the die pad must be surface-treated into black by various techniques. To absorb external light and the reflected light of the light-emitting diode itself. The invention is further characterized in that the first molding injection molding base is made of a white plastic having high reflectivity to improve the light-emitting efficiency after the LED package is encapsulated; and the second molding injection molding is insulated. The housing is made of colored 201203628 plastic. Preferably, the colored plastic is a completely opaque black plastic, which simplifies the process in which downstream manufacturers must process the surface of the packaged die to black by various techniques. The above-mentioned lead frame structure of the present invention can have the following advantages: The SMD lead frame method of the light-emitting diode of the present invention has a purpose of performing two-mold injection on the lead frame. Solve the problem of pin exposure caused by the conventional technology, and also solve the sealing problem of the exposed pins of the SMD lead frame of the LED, and overcome the long-term uncoverable pin exposure of the industry. The problem of oxidation and vulcanization. Another method for manufacturing an SMD lead frame of a light-emitting diode of the present invention is to use a first-time injection molding base, which is made of a white plastic having high reflectivity to enhance the light-emitting diode package. Light extraction efficiency. A further method for manufacturing a SMD lead frame for a light-emitting diode according to the invention is a second injection molding of an insulating casing, the material of which is a colored plastic, preferably the colored plastic is completely opaque. The black plastic is used to simplify the process of the manufacturer. For a better understanding and understanding of the technical features and the efficacies of the present invention, the preferred embodiments and the detailed description are as follows, and the specific embodiments and illustrations are illustrated. References and descriptions are provided only to 201203628 and are not intended to limit the invention. [Embodiment] Hereinafter, an embodiment of a method for manufacturing an SMD lead frame of a light-emitting diode according to the present invention will be described with reference to the related drawings. For ease of understanding, the same components in the following embodiments are denoted by the same reference numerals. Description. Please also refer to Figure 1 and Figure 2. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow diagram of a method of fabricating a light-emitting diode leadframe of the prior art. The manufacturing method of the conventional light-emitting diode lead frame includes steps S11 to S15, wherein the relevant components described in steps S11 to S15, such as the wire region (2), the pin (210), and the die pad (20) are marked. In Figure 2. First, in step S11, a metal substrate is provided; then, step S12 is performed on the metal substrate, a plurality of wire regions (2) are punched, and each wire region (2) includes at least one pin (210); and in step S13, Electroplating the metal substrate; then, in step S14, forming a die pad (20) on each wire region (2) in an injection molding manner, and then bending the pin (210); finally, in step S15, in the metal The die is cut on the substrate to obtain a plurality of light-emitting diode lead frames. Please refer to FIG. 2, which is a schematic diagram of a conventional light-emitting diode lead frame. The figure shows a light-emitting diode lead frame completed by the manufacturing method of the light-emitting diode lead frame of the prior art, which can be covered with the pin (210) of the buried end of the light-emitting diode die 201203628. In the resin sealing material = exposed to the outer rubber wall (10), the pin (2 (8) will let the ring: brother: the water vapor along the exposed pin (21 〇), and must enter the _ _ _ _ _ _ _ The sealing process usually cannot completely completely cover the pin (210) outside the outer casing, and the outer pin (21G) is also easily oxidized and vulcanized due to exposure to the external environment.
請參閱圖3、圖4及圖5。圖3係為本發明一種發 =-極體的SMD導㈣製造方法之較佳實施例流程 ^，圖4係為本發明一種發光二極體的SMD導線架 製程之較佳實施例示意圖。圖中顯示本發明一種發光 ^極體的議導線架製造方法包含步驟S61福，其 中步驟S61〜S68所述之相關元件如導線區域⑺、接 腳（210)、基座（610)、絕緣殼體（63〇) u及晶粒座 (20)標示於圖4及圖5。 首先於步驟S61 ’提供一金屬基板；接著於該金 屬基板上進行步驟S62,沖壓複數個導線區域（2)， 並且每一導線區域（2)包含至少一接腳（21〇);於步 驟S63，電鍍該金屬基板；之後’於步驟s64，在每 一導線區域（2)上進行第-次塑模射出以成型一基座 ^610)，該基座（610)具有固接該接腳（21〇)之功 月匕，其次，於步驟S65，進行沖模裁切下料去除料腳； 然後，於步驟S66，進行兩段沖模，將每一導線區域 (2)上之接腳（210)折彎在該基座（61〇)上；其後， 201203628 於步驟S67，在該基座（610)上進行第二次塑模射出 以成型一絕緣殼體（630)，該絕緣殼體（630)將折彎 於該基座上的接腳（21〇)完全包覆於該絕緣殼體（63〇；) 内即成一晶粒座（20);最後’於步驟S68，進行沖模 裁切下料去除料腳，得到具有複數個發光二極體的 SMD導線架。 請參見圖5,其係以本發明一種發光二極體的 SMD導線架製造方法製造之晶粒座示意圖。圖中，該 接腳（210)完全包覆於該絕緣殼體（630)内。 由於本發明一種發光二極體的SMD導線架製造 方法’在該導線區域（2 )進行第一次塑模射出時，將 接腳（210)的一端固接於該基座（610)上，再以兩 段沖模折彎該接腳（210)的另一端，並以第二次塑模 射出成型絕緣殼體（ 630)將該折彎的接腳（210)完 全包覆在樹脂封料内，因此習知技術接腳（21〇)外露 之問題迎刃而解。 本發明一種發光二極體的SMD導線架製造方法， 在本較佳實施例中，係在第一次塑模射出成型與沖模 裁切下料（步驟S64與步驟S65)後，進行步驟S66之 兩段沖模折彎製程。但在另一具體實施例中，亦可將 步驟S66中之兩段沖模折彎製程中之第一段沖模折彎 製程移至電鍍該金屬基板（步驟S63)前進行。 本發明一種發光二極體的SMD導線架製造方法， 9 201203628 在另一較佳實施例中，於第一次塑模射出成型之基座 (610)，其材料為具有高反射率的白色塑料，以提升 發光二極體封裝後之出光效率。 本發明一種發光二極體的SMD導線架製造方法， 在又一較佳實施例中，該第二次塑模射出成型之絕緣 殼體（630)，其材料為有色塑料，該有色塑料較佳為 完全不透光之黑色塑料。 本發明一種發光二極體的SMD導線架製造方法， 亦可應用於其他固態發光元件的導線架製造，如 OLED (Organic Light Emitting Diode)的導線架製造、 EL(Electro Luminescence)的導線架製造。 以上具體實施例所述僅為本發明之例舉，而非為 限制性者。任何未脫離本發明之精神與範疇，而對其 進行之等效修改或變更，均應包含於後附之申請專利 範圍中。 【圖式簡單說明】 圖1係為習知技藝之發光二極體導線架之製造 方法的流程圖。 圖2係為習知發光二極體導線架示意圖。 圖3係為本發明一種發光二極體的SMD導線架 製造方法之較佳實施例流程圖。 201203628 圖4係為本發明一種發光二極體的SMD導線架 製程之較佳實施例示意圖。 圖5係以本發明一種發光二極體的SMD導線架 製造方法製造之晶粒座示意圖。 【主要元件符號說明】 φ 2 導線區域 20 晶粒座 210 接腳 230 外膠壁 610 基座 630 絕緣殼體 S11〜S15 製造方法步驟 S61〜S68製造方法步驟 11Please refer to Figure 3, Figure 4 and Figure 5. 3 is a flow chart of a preferred embodiment of a method for fabricating an SMD conductor of the present invention, and FIG. 4 is a schematic diagram of a preferred embodiment of an SMD lead frame process for a light-emitting diode according to the present invention. The method for manufacturing a lead frame of the present invention includes the step S61, wherein the related components such as the wire region (7), the pin (210), the base (610), and the insulating shell are described in steps S61 to S68. Body (63〇) u and die pad (20) are shown in Figures 4 and 5. First, a metal substrate is provided in step S61'; then step S62 is performed on the metal substrate, a plurality of wire regions (2) are punched, and each wire region (2) includes at least one pin (21A); in step S63 And plating the metal substrate; then, in step s64, performing a first-time mold injection on each of the wire regions (2) to form a pedestal 610), the pedestal (610) having the pin attached ( 21〇), the next step, in step S65, performing die cutting to remove the material foot; then, in step S66, performing two-stage dies to connect the pins (210) on each wire region (2) Bending on the base (61〇); thereafter, 201203628, in step S67, performing a second molding injection on the base (610) to form an insulating housing (630), the insulating housing ( 630) The pin (21〇) bent on the base is completely covered in the insulating housing (63〇;) to form a die seat (20); finally, in step S68, die cutting is performed. The material is removed to remove the material to obtain an SMD lead frame having a plurality of light emitting diodes. Referring to FIG. 5, it is a schematic diagram of a die pad manufactured by the method for manufacturing an SMD lead frame of a light-emitting diode according to the present invention. In the figure, the pin (210) is completely covered in the insulating housing (630). Since the SMD lead frame manufacturing method of the LED of the present invention performs the first molding injection in the wire region (2), one end of the pin (210) is fixed to the base (610). Then, the other end of the pin (210) is bent by a two-stage die, and the bent pin (210) is completely covered in the resin sealing material by a second molding injection molded insulating case (630). Therefore, the problem of the exposed technology pin (21〇) is solved. In the preferred embodiment, the method for manufacturing the SMD lead frame of the light-emitting diode is performed in the first molding injection molding and the die cutting (step S64 and step S65), and then step S66 is performed. Two-stage die bending process. However, in another embodiment, the first segment bending process in the two-stage die bending process in step S66 may be moved to the plating of the metal substrate (step S63). The invention discloses a method for manufacturing an SMD lead frame of a light-emitting diode, 9 201203628. In another preferred embodiment, the base (610) of the first injection molding is made of a white plastic having high reflectivity. In order to improve the light extraction efficiency of the LED package. In a preferred embodiment of the invention, in a second preferred embodiment, the second injection molding of the insulating housing (630) is made of a colored plastic, and the colored plastic is preferably used. It is a black plastic that is completely opaque. The invention relates to a method for manufacturing an SMD lead frame of a light-emitting diode, which can also be applied to the manufacture of lead frames of other solid-state light-emitting elements, such as OLED (Organic Light Emitting Diode) lead frame manufacturing, EL (Electro Luminescence) lead frame manufacturing. The above specific embodiments are merely illustrative of the invention and are not intended to be limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing a method of manufacturing a light-emitting diode lead frame of the prior art. 2 is a schematic view of a conventional light-emitting diode lead frame. 3 is a flow chart of a preferred embodiment of a method for fabricating an SMD lead frame of a light emitting diode according to the present invention. 201203628 FIG. 4 is a schematic view showing a preferred embodiment of an SMD lead frame process for a light-emitting diode according to the present invention. Fig. 5 is a schematic view showing a die pad manufactured by the method for manufacturing an SMD lead frame of a light-emitting diode of the present invention. [Main component symbol description] φ 2 wire area 20 die pad 210 pin 230 outer rubber wall 610 base 630 insulating case S11~S15 manufacturing method steps S61~S68 manufacturing method step 11