1335651 九、發明說明： 【發明所屬之技術領域】 本發明為一種發光二極體(Light Emitting Diode,LED)座體結 構之製造方法，特別係為一種應用於高功率發光二極體(high power light emitting diode)照明單體之發光二極體座體結構製造方 法。 【先前技術】 近年來，由於發光二極體之發光效率持續的改善，使得發光 一極體之應用市場大幅度成長。發光二極體之所以能有如此高的 市場成長率，主要的成長動力有二，首先是將發光二極體應用於 平面液晶顯示器的背光源市場中，發光二極體與冷陰極螢光燈 (Cold Cathode Fluorescent LampS，CCFL)間的替代應用。其次是在 一般光源市場中，發光二極體與白熾燈泡或螢光燈間的替代應 用。在上述兩個市場的成長動力中，發光二極體均具有環保、省 能及色彩表現性佳的產品優勢，再者「歐盟2〇〇6年禁用汞」的環 保法規，更是驅動發光二極體市場成長的主因。 如第1圖所示，係為一習知發光二極體座體結構1〇之立體 圖。如第2A圖所示，係為―習知絕緣座體與導線架之剖視圖。 第2B圖係為-習知發光二極體座體結構之剖 體座體結構1G，其包括：—散熱基座u ;至少一導線架H 及-絕緣賴13。習知發光二極體麵結構1()製造時，因 ΐϋ1及導線架12均為導体，為了避免散熱基座11及導線架 $在裝造時，因相互接觸而產生電性連接， 體13成型製造時，必須藉由頂針14將散熱基座11 導，2相間關來。因為頂針14只是臨時使用之成型 ”，虽絕緣座體I3之成型作業完成及脫模後，頂針Μ將會與習 5 經由頂口針針開口 15 ’也因此造成水氣或渥氣有機會 作業時，^驻j渗透的現f ’如此將造成發光二極體在封裝 後了容易產座古^體内填充液態的環氧樹脂或發膠在烘烤固化 體運作似水泡的_，進而影響整個發光二極 Ϊί t ^鋪之出發光效率大打折扣。 成絕緣座f 鍾越結構1G，其製造之步驟，係先完 成織再將散絲座11與絕緣座體13填入 合，習4 Ur Γ為了增加散熱基座11與絕緣座體13之結構結 i姓槿基座11會在其與絕緣座體13接觸之表面做成咬花 而：先製與i邑緣座體13接觸面之磨擦力。然 座，η ίΓ緣座體再組合散熱基座11之方式，因為絕緣 仍^^^木入散熱基座11咬花之間隙’因此在結構之穩固性 行ίί水氣或祕會經由散熱基座11與絕緣座體13間 ㈣H Ϊ知發光二極體座體結構1G，在封裝座體⑽以填充 辦广氧f月旨或秒膠時，也會緩慢地沿著散絲座11與絕緣座 / 間隙，滲漏到絕緣座體13的外部，形成毛細流通現象。 下，封裝座體内填充液態的環氧樹脂或雜在烘 奋4將會產生更多的氣泡或類似水泡的嚴重瑕蘇。同時也 =因散熱基座11與絕緣座體13接觸面之磨擦力不足，使散熱 :Μ11鬆脫\滑動，造成么封裝好的發光二極體中，連接發光二 f晶粒40(半導體晶片)和導線架I2間的微細金屬線60斷裂， 造成嚴重的缺失。 【發明内容】 本發明主要係要改善發光二極體減結構製造完減，遺留 頂侧σ和散絲座與絕緣賴間之_，會有水氣或渥 的^ =封装作業時，施以填充液態的環氧樹脂或石夕膠滲 i 成發光二極體在封裝製程中，產生瑕庇的問 漏 此 題 緣座體接座體姻作業之製造方法，因為賴基座其與絕 ，熱融後之注轉會填滿不規赚表面之間隙，而 “行為變因此將可使得發光二極體座體結構之 方沐爲之功效，本發明特提供—種發光二極體座體之製造 步驟:提供一散熱基座’其具有-固晶區，·提 2 一第一側面及一第二側面，第-側面係與散熱 二一道^，緣件相對於111晶區之位置，設有―開口 ；提供至 二她二、’叹置於絕緣件之第二側面側，且導線架係藉由絕緣 =、ί=ίϊ性祕’·提供—麵财，並雜錢之散熱基 ifίί:ί架置入塑型模具内，又塑型模具内具有-絕緣 之雌;進賴緣紐之财㈣；以錢行塑型模具 一藉由本發明的實施，至少可以達到下列之進步功效： 一、 針開σ造成水氣或魏滲透之現象，提高發光二極體 I程品質及良率。 - ^錢基座與絕緣座體躺面之咬合效果，使得發光二極 „構之結構行為變得非常的穩固，且能阻絕水氣或渔 透’並防止封裝作業時，施以填充液態的環氧樹脂或 矽膠滲漏到外部的現象。 二、 =絕緣件來賊頂針的功能，可確實的料與散熱基座 產生電性隔缝轉相對關隙，同時減少麵模具結構的 叫651 複雜性，進而降低塑型模具開發的費用及成本。 【實施方式】 細說ΪΓΐ發明的特徵與實施方式，兹配合圖示作最佳實施例詳 ϋ 3圖所示，係為本發明之一種發光二極體座體結構2〇， 尚未元成絕緣座體製作時之分解實施姻。如第4圖所示，係 本發明之-紐光二極龜難造方法絲圖。本實 丄種 發光,極體座體結構2〇之製造方法，其包括下列步驟：… 提供一散熱基座(S11):散熱基座u例如銅、錫 =亦概、玻璃等非金屬材質所製成，其具有== 散熱基座11主要係用以置放發光二極體晶粒4〇，並 光二極體晶粒401生散熱/散熱之功效，因此散熱基座π 以與發光二極體晶粒40結合之一固晶區ill。 、 散熱基座11除了可以是一平板之型體外，亦可以為一凸形型 ，，也就是說，可以在平板狀散熱基座U之一側，以一體 =方式製造出-延伸部112。當散熱基座u設計成為一凸形型1335651 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a light-emitting diode (LED) body structure, in particular to a high-power light-emitting diode (high power) Light emitting diode) A method of manufacturing a light-emitting diode structure of a single illumination unit. [Prior Art] In recent years, the application efficiency of the light-emitting diode has been greatly increased due to the continuous improvement of the luminous efficiency of the light-emitting diode. The reason why the LED has such a high market growth rate is that there are two main growth drivers. The first is to apply the LED to the backlight market of flat panel liquid crystal display, LED and cold cathode fluorescent lamp. Alternative applications between (Cold Cathode Fluorescent LampS, CCFL). This is followed by an alternative application between a light-emitting diode and an incandescent bulb or fluorescent lamp in the general light source market. Among the growth drivers of the above two markets, the LEDs have the advantages of environmental protection, energy saving and good color performance. In addition, the environmental regulations of “European Union banned mercury for 2-6 years” are driving the second light. The main reason for the growth of the polar market. As shown in Fig. 1, it is a perspective view of a conventional light-emitting diode structure. As shown in Fig. 2A, it is a cross-sectional view of a conventional insulated body and a lead frame. Fig. 2B is a cross-sectional body structure 1G of a conventional light-emitting diode structure, comprising: a heat sink base u; at least one lead frame H and an insulating layer 13. In the manufacture of the conventional light-emitting diode structure 1 (), since the crucible 1 and the lead frame 12 are both conductors, in order to prevent the heat-dissipating pedestal 11 and the lead frame $ from being electrically connected when being mounted, the body 13 is electrically connected. At the time of molding, the heat sink base 11 must be guided by the ejector pin 14, and the two phases are closed. Because the thimble 14 is only temporarily used for molding, although the molding operation of the insulating seat I3 is completed and the mold is released, the thimble will be operated with the needle 5 through the top needle opening 15', thereby causing moisture or suffocation. At this time, the current infiltration of the j-sinking will cause the light-emitting diode to be easily filled in the package. The epoxy resin or the hair gel filled in the body of the baked solidified body acts like a blisters, thereby affecting the whole The luminous efficiency of the light-emitting diodes is greatly reduced. The insulating structure f is the 1G structure of the clock, and the manufacturing steps are to complete the weaving and then fill the loose wire base 11 and the insulating seat 13 together, Xi 4 Ur Γ In order to increase the structure of the heat dissipation base 11 and the insulating base 13 , the base 11 is made to bite on the surface of the base 11 which is in contact with the insulating base 13 : firstly, the surface of the contact surface of the rim seat 13 is formed. Friction force. However, the η Γ Γ 座 再 再 再 再 再 再 再 再 再 再 再 再 再 再 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为Between the heat dissipation base 11 and the insulating base 13 (4) H Ϊ 发光 发光 发光 发光 发光 发光 发光1G, when the package body (10) is filled with the oxygen or the second glue, it will slowly leak along the loose seat 11 and the insulating seat/gap to the outside of the insulating seat 13 to form a capillary flow phenomenon. Underneath, the encapsulating cavity is filled with liquid epoxy resin or miscellaneous in the baking 4 will produce more bubbles or serious blisters like blisters. Also = because the heat sink base 11 and the insulating seat 13 contact surface Insufficient friction, so that heat dissipation: Μ11 loose/sliding, resulting in a packaged light-emitting diode, the fine metal wire 60 connecting the light-emitting two-f crystal 40 (semiconductor wafer) and the lead frame I2 is broken, causing serious [Description of the Invention] The present invention mainly aims to improve the reduction of the structure of the light-emitting diode structure, leaving the top side σ and the gap between the loose wire holder and the insulating layer, and there is water vapor or helium in the package operation. Applying a liquid-filled epoxy resin or a luminescent gel to a light-emitting diode in a packaging process, creating a method of manufacturing a smear-in-the-shoulder body, because of the susceptor Absolutely, after the hot melt, the note will fill the gap between the irregular surface and The behavior change will thus make the structure of the light-emitting diode body structure effective, and the present invention provides a manufacturing step of the light-emitting diode body: providing a heat-dissipating pedestal having a-solid crystal region, 2 a first side and a second side, the first side is combined with the heat sink 2, the edge of the edge is opposite to the position of the 111 crystal region, and is provided with an opening; The second side of the side, and the lead frame is provided by the insulation =, ί = ϊ ϊ ' · · · · · , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , - Insulation of the female; into the wealth of the New Zealand (four); with the money to mold the mold - by the implementation of the present invention, at least the following progressive effects: First, the needle open σ caused by water vapor or Wei penetration phenomenon, improve light Diode I quality and yield. - ^The bite effect of the money base and the insulating seat lying on the surface makes the structure of the light-emitting diode very stable, and can block the water vapor or fish-through and prevent the filling operation when filling the liquid The phenomenon that epoxy resin or silicone leaks to the outside. Second, the function of the thief thimble is the same as that of the thief. The positive material and the heat dissipation base can produce the electrical gap to turn the relative clearance, while reducing the surface mold structure is called 651. And further reduce the cost and cost of the development of the molding die. [Embodiment] The features and embodiments of the invention are described in detail with reference to the drawings. The diode structure of the diode is 2〇, and the decomposition of the insulating body has not yet been formed. As shown in Fig. 4, it is a wire drawing of the method of making the New Zealand two-pole turtle. The manufacturing method of the polar body structure 2〇 comprises the following steps: providing a heat dissipation base (S11): a heat dissipation base u such as copper, tin=general, glass or the like, which has a non-metal material, and has = The heat sink base 11 is mainly used for illuminating The diode grain is 4 〇, and the photodiode die 401 has the effect of heat dissipation/heat dissipation. Therefore, the heat dissipation pedestal π is combined with the luminescent diode die 40 to form a solid crystal region ill. It may be a type of flat plate, or may be a convex type, that is, the extension portion 112 may be manufactured in one body on one side of the flat heat dissipation base U. When the heat dissipation base u is designed Become a convex type
Hi f 將會職於延伸部112處，也就是形成於延伸 ^ 方㈣’而此時，絕緣件21之開口 213係正好套設於 延伸部112的週邊，意即讓出固晶區U1的空間和位置。 為了使發光二極體晶粒40能更方便的結合，或者 ，光二極體晶粒4〇上覆蓋取光層或級轉制(例如 光 粉塗佈層等），因此固晶區πι亦可再次形成有一凹槽邙113 ί熱基座11其與絕緣座體13接觸之表面，係&有-i規 =大表面114，例如螺紋、咬花、凸體或凹體之表 行絕緣座體13之成型作業時’熱融後之注膠料會填滿不規則& 1335651 =4之間隙，所以當注膠料冷卻固化後，散熱基座u與絕緣 座體13就會緊密_互咬合。這樣相互緊密咬合的結果，不但可 或溼氣之滲透、防止封裝作業時，施以填充液態的環 氧樹月曰或石夕膠滲漏到外部的現象，同時也因此使得散熱基座η與 ^座體13穩固且緊密的結合，所以發光二極體座體結構20之 結構行為變得非常的穩固。 除了不規則狀表面114之設計外，散熱基座！ i其與絕緣座體 U接觸之表面或者散熱基座n之水平斷面，亦可設計為多邊形Hi f will be in the extension 112, that is, formed in the extension (four)'. At this time, the opening 213 of the insulating member 21 is just placed around the periphery of the extension portion 112, that is, the solid crystal region U1 is given. Space and location. In order to make the light-emitting diode die 40 more convenient to bond, or the light-emitting diode die 4 is covered with a light-receiving layer or a grade-converted layer (for example, a powder coating layer, etc.), the solid crystal region πι can be again Forming a groove 邙113 ί the surface of the thermal pedestal 11 in contact with the insulating body 13, is <i gauge = large surface 114, such as a thread, a flower, a convex or a concave body insulating body 13 During the molding operation, the hot-melt adhesive will fill the irregular & 1335651 = 4 gap, so when the injection compound cools and solidifies, the heat-dissipating base u and the insulating base 13 will be tightly _ interdigitated . As a result of such close engagement with each other, not only the penetration of moisture or moisture can be prevented, but also the phenomenon of leakage of the liquid-filled epoxy tree or the smectite to the outside when the packaging operation is prevented, and thus the heat-dissipating base η and Since the seat body 13 is firmly and tightly coupled, the structural behavior of the light-emitting diode body structure 20 becomes very stable. In addition to the design of the irregular surface 114, the heat sink base! i The surface of the contact with the insulating base U or the horizontal section of the heat sink base n may also be designed as a polygon
^體或不規則型體，例如三角型、矩型、五角型、鑽石型…等。 此處所&之多邊形型體’係泛指任何非圓型、圓柱型或球型之型 體者，如此將可防止散熱基座u在絕緣座體13内旋轉，而造成 結構不穩定的現象。 提供一絕緣件(S12):絕緣件21，特別係為一絕緣墊片，其主 要係用以阻絕散絲座11與導絲η間之雜連接並維持相對 的間隙，不直接接觸到。 絕緣件21具有一第一側面211及一第二侧面212，第一側面 11係與散熱基座11貼合，又絕緣件21相對於固晶區111之位 置’設有-開π 213。設置開口 213之目的係要讓發光二極體晶 粒40，在不受絕緣件21干涉之情況下，能完整的結合於散熱基 座11之固晶區111上。 ' 當散熱基座11設計成為一凸型體時，絕緣件21之開口 213 將會套设於散熱基座11其延伸部112之週邊。為了方便絕緣件21 之套《d乍業或者考慮絕緣座體13成型時熱漲冷縮之現象，絕緣件 21又可再形成有至少一剖開部214，而剖開部214係由開口 213 為中心向四週放射狀的延伸為較佳。 絕緣件21 —般係選自一鐵氣龍、一塑膠(例如工程塑膠、麥 杈）、一陶瓷、一木質及一橡膠材質等不具導電性材質之其中之 9 緣件21亦可以為一金屬材質且於金屬材質之表面形 極體置，發光二 並且使得料Let!線（賴導麵12的電性連接， 牟12 SH 能與外㈣力紐連接、導通。導線 ;宴始J為成對的設置，每―組發光二極體晶粒4G會對廡到二 導綠ί 件21之第二側面21;此、 12就可u藉由鱗件21與散熱基 定的間隙，不直接接觸到。 厘1職_並維持〆 〜導緣㈣的形式，除了有金屬製的導線架12之外，其 二列如陶瓷電路板(以陶瓷為基材並於 別 t^CP^gC,cuitB0ard,PCB)^ 緣座並組合(S14):麵模具5。主要贱製造絕 導線牟m/製&絕緣座體13時將散熱基座n、絕緣件21及 ttT併一體成型包覆其中’又絕緣座體13 一般係以 後加以製成。當塑型模具50提供後，接著將組合 ίίΐϊίΐ絕緣件21及導線架12置入塑型模具50内。 絕绫;I内同時具有—絕緣座體13之形成空間，因此當 轉料進人_模具5G内後，在填滿絕緣座 iiL#加形成空間時，也將一併包覆住散熱基座11、絕緣件21及 12又富絕緣座體丨3之注膠料冷卻固化後，絕緣座體13、 散,、、、基座11、絕緣件21及導線架12，將會一體成型之。 絕緣座體成型(SIS):此-步驟係將組合後之散熱基座n、絕 緣4、及導線架12置入塑型模具5〇内，然後進行絕緣座體13 之^型作業。⑽謂的成型作討以是射出成型、注膠成型或膠 注成型···専任何一種方式。 1335651 脫模作業(S16):此一步驟也係將完成絕緣座體13成型作業 之塑型模具50，於絕緣座體13之注膠料冷卻後，進行塑型模具 5〇之脫模作業。如此即可完成發光二極體座體結構2〇之製作。 如第5圖所示，係為第3圖之發光二極體座體結構2〇之剖視 實關圖。第6圖所示，係為本發明又—種發光二極體座體結構 3〇，尚未完成絕緣座體製作時之分解施例圖。如第7圖所示，係 為第6圖完成麟座聽作後讀光二極體座體結構3()剖視實施 例圖。^ Body or irregular body, such as triangle, rectangular, pentagonal, diamond type, etc. The "polygonal body" referred to herein generally refers to any non-circular, cylindrical or spherical type, so that the heat dissipation base u can be prevented from rotating in the insulating seat 13 and the structure is unstable. . An insulating member (S12) is provided: the insulating member 21, in particular, an insulating spacer, which is mainly used to block the miscellaneous connection between the loose wire holder 11 and the guide wire n and maintain a relative gap without being directly contacted. The insulating member 21 has a first side surface 211 and a second side surface 212. The first side surface 11 is attached to the heat dissipation base 11, and the insulating member 21 is provided with an opening π 213 with respect to the position of the solid crystal region 111. The purpose of the opening 213 is to allow the light-emitting diode particles 40 to be completely bonded to the die-bonding region 111 of the heat-dissipating base 11 without being interfered by the insulating member 21. When the heat sink base 11 is designed as a convex body, the opening 213 of the insulator 21 will be sleeved around the extension portion 112 of the heat sink base 11. In order to facilitate the sleeve of the insulating member 21 or to consider the phenomenon of heat expansion and contraction during the molding of the insulating seat 13, the insulating member 21 may be further formed with at least one opening portion 214, and the opening portion 214 is formed by the opening 213. It is preferred to extend radially around the center. The insulating member 21 is generally selected from the group consisting of a Teflon, a plastic (for example, engineering plastics, wheat bran), a ceramic, a wood, and a rubber material. 9 of the non-conductive materials may also be a metal. The material is placed on the surface of the metal material, and the light is emitted and the material is connected to the Let! line (the electrical connection of the Lai guide surface 12, and the 牟12 SH can be connected and connected to the external (four) force. Wire; For the setting of the pair, the light-emitting diode die 4G will 庑 to the second side 21 of the green guide member 21; this, 12 can be separated by the gap between the scale member 21 and the heat dissipation base, not directly In contact with the PCT and the lead rim (4), in addition to the metal lead frame 12, the two columns are ceramic circuit boards (ceramic substrate and other t^CP^gC, cuitB0ard, PCB)^ Edge seat and combination (S14): face mold 5. Mainly manufacture the absolute wire 牟m/ system & insulation seat 13 when the heat sink base n, the insulation 21 and ttT are integrally molded 'The insulating base 13 is generally made later. When the molding die 50 is provided, then the insulating member 21 and the wire are combined. 12 is placed in the molding die 50. The inside of the I has a space for forming the insulating seat 13, so that when the material is transferred into the mold 5G, when the insulating seat iiL# is filled, the space is also formed. After the heat sink base 11, the insulating members 21 and 12, and the insulating material of the insulating body 丨3 are cooled and solidified, the insulating body 13, the scatter, the pedestal 11, the susceptor 11, the insulating member 21 and the wire The frame 12 will be integrally formed. Insulation Seat Forming (SIS): This step is to place the combined heat sink base n, the insulation 4, and the lead frame 12 into the molding die 5, and then perform the insulation seat. The work of the body 13 (10) is called injection molding, injection molding or plastic injection molding. · 1335651 demoulding operation (S16): this step will also complete the insulation seat The molding die 50 for forming the body 13 is subjected to a mold release operation of the molding die 5 after the injection molding material of the insulating base 13 is cooled. Thus, the production of the LED body structure 2 can be completed. Figure 5 is a cross-sectional view of the light-emitting diode structure of Figure 3 in Figure 3, which is shown in Figure 6. In addition, the light-emitting diode body structure is 3〇, and the decomposition example of the insulating seat is not completed. As shown in Fig. 7, it is the 6th picture to complete the reading of the light-emitting diode body. Structure 3 () is a cross-sectional view of the embodiment.
絕緣座體13，包覆於散熱基座11、絕緣件21及導線架12週 邊:於製造絕緣座體13時可將散熱基座u、絕緣件21及導線架 U等也-併-體成型，並形成完整之發光二極體座體結構％。絕 緣座體13 -般係以娜料以塑型模具5〇成型之方式加以製成。 而所謂的成型作業可以是射出成型、轉成型或縣成型… 何一種方式。 之二產製造時，為了大量生產’因此可將上述各實施例 ^散熱基座11 ;-絕緣件21 ;至少―導線架12等，藉由其它臨The insulating base 13 is wrapped around the heat dissipation base 11, the insulating member 21 and the periphery of the lead frame 12: the heat dissipation base u, the insulating member 21, the lead frame U, and the like can also be formed in the same manner when manufacturing the insulating base 13 And form a complete luminous diode body structure %. The insulating seat 13 is generally made by molding a plastic mold 5〇. The so-called molding operation can be injection molding, transformation molding or county molding... any way. When the second production is manufactured, it is produced in large quantities. Therefore, the above embodiments can be used to dissipate the heat sink base 11; the insulator 21; at least the lead frame 12, etc., by other
件’使其相互連接成板狀或捲軸狀，如此便可以整片或整 捲的加以大量製造，以提高生產效率。 物ΐΐΐί實施例制以制本發明之特點，其目的在使熟習 解本發明之内容並據以實施’而非限林發明之專 =其他未脫離本發明所揭示之精神而完成之i效修二 或6改，仍應包含在以下所述之申請專利範圍中。 【圖式簡單說明】 ，1圖係為-習知發光二極體座體結構之立體圖。 f2A圖係為一習知絕緣座體與導線架之剖視圖。 2B圖係為一習知發光二極體座體結構之剖視圖。 1335651 第3圖係為本發明之一種發光二極體座體結構尚未完成絕緣座 體製作時之分解實施例圖。 第4圖係為本發明之一種發光二極體座體製造方法流程圖。 第5圖係為第3圖之發光二極體座體結構之剖視實施例圖。 第6圖係為本發明又一種發光二極體座體結構尚未完成絕緣座 體製作時之分解施例圖。 第7圖係為第6圖完成絕緣座體製作後之發光二極體座體結構剖 視實施例圖。 【主要元件符號說明】 10 習知發光二極體座體結構 11 散熱基座 111 固晶區 112 延伸部 113 凹槽部 114 不規則狀表面 12 導線架 13 絕緣座體 14 頂針 15 頂針開口 20 >30 發光二極體座體結構 21 絕緣件 211 第一側面 212 第二側面 213 開口 214 剖開部 40 發光二極體晶粒 12 1335651 50 60 塑型模具 金屬線The pieces are connected to each other in a plate shape or a reel shape, so that the entire piece or the entire roll can be mass-produced to improve production efficiency. The present invention is made to exemplify the features of the present invention, and the purpose of the present invention is to make it possible to implement the contents of the present invention and to implement the 'instead of the invention'. Or 6 modifications should still be included in the scope of the patent application described below. [Simple description of the diagram], 1 is a perspective view of a conventional light-emitting diode structure. The f2A diagram is a cross-sectional view of a conventional insulated body and lead frame. 2B is a cross-sectional view of a conventional light-emitting diode body structure. 1335651 Fig. 3 is a view showing an exploded embodiment of the structure of the light-emitting diode of the present invention when the insulating body is not completed. 4 is a flow chart of a method for manufacturing a light-emitting diode body according to the present invention. Fig. 5 is a cross-sectional view showing the structure of the light-emitting diode of the third embodiment. Fig. 6 is a view showing an exploded view of another embodiment of the invention in which the light-emitting diode body structure has not been completed. Fig. 7 is a cross-sectional view showing the structure of the light-emitting diode body after the fabrication of the insulating spacer in Fig. 6. [Main component symbol description] 10 Conventional light-emitting diode body structure 11 Heat sink base 111 Solid crystal region 112 Extension portion 113 Groove portion 114 Irregular surface 12 Lead frame 13 Insulator base 14 Thimble 15 Thimble opening 20 > 30 illuminating diode body structure 21 insulating member 211 first side 212 second side 213 opening 214 cut-away portion 40 light-emitting diode die 12 1335651 50 60 plastic mold wire