TW201203339A - Sheet cutting method and sheet cutting device - Google Patents

Abstract

By cutting an adhesive sheet (S) by moving a cutter blade (72) while rotating said cutter blade (72) so that the blade tip follows the inclinations (K1, K2) and valley (K3) of a notch (K), uncut portions of the adhesive sheet (S) on the notch (K) can be eliminated or minimized. During a subsequent rear surface grinding step or the like, the disclosed sheet cutting method and sheet cutting device can prevent damage to a wafer (W) due to the uncut portion of the adhesive sheet (S) being stuck between the wafer (W) and a grinding blade, and can also prevent washing water from entering when the uncut portion of the adhesive sheet (S) peels off.

Description

201203339 • EMBODIMENT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a sheet cutting method and a sheet cutting device for cutting a sheet attached to a semiconductor wafer. [Prior Art] Conventionally, in the semiconductor manufacturing process, a cutting device is used for attaching: a bonding film to a surface of a semiconductor wafer as a body to be attached, and along the crystal The outer edge of the circle is cut by a knife blade (for example, the 12th bulletin). This cut-through 俜:=.曰本特开2_-分成成形形凹==I think 1 alignment and the outer edge of the part of the grooved conductor wafer is the object::... Two:: J two =, there will be a follow-up piece left by the movement of the knife-bean pin and cutting the vicinity of the valley. Therefore, the back grinding process of the circle of the groove or the like remains, and the crystal of the succeeding piece and the core of the grinding blade (10) are left, and the wafer which is damaged by the wafer is left in the end portion of the groove portion as a source, and is widely dispersed. Causes damage to the circuit on the surface of the wafer. The present invention is directed to a sheet cutting method and a sheet cutting device capable of suppressing cutting residue attached to a wafer portion having a groove. . Groove in the splicer sheet In order to achieve the above (4), the sheet cutting method of the present invention is formed with a slanted and another slanted < v-shaped groove along the outer edge portion and attached to the surface Next, the outer edge of the semiconductor wafer of the sheet is moved by two pairs of the cutters to cut the adhesive sheet. The following configuration is adopted: > one of the grooves is obliquely cut to cut the third slope of the adhesive sheet. Breaking; the other side of the groove is inclined to cut the 帛 2 oblique cutting step of the slab; and the severing step of cutting the outer edge of the slab along the outer edge of the semiconductor wafer In the 帛1 tilt cutting step and the second tilt cutting step, the blade edge of the blade is cut along the inclination of the groove. In the sheet cutting method of the present invention, it is preferable that the blade edge is subjected to a (four) " oblique cutting step from the outer side toward the inner side of the semiconductor wafer; and the third oblique cutting step is continued to make the blade The blade is rotated to perform the first oblique cutting step by moving the blade edge from the outer side toward the inner side in the radial direction of the semiconductor wafer. Further, in the sheet cutting method of the present invention, the blade may be subjected to the slanting step from the outer side toward the inner side of the semiconductor wafer in the radial direction; and the first oblique cutting step may be followed to rotate the blade. The second oblique cutting step is performed by moving the blade from the inner side toward the outer side in the radial direction of the semiconductor wafer; and the second oblique cutting step is followed to rotate the blade while being along the semiconductor wafer. The edge cutting step is performed while changing the direction of the blade. In the sheet cutting method of 201203339 and the second tilt cutting step, the surface of the first tilt cutting step is further divided into four directions, and only the semiconductor wafer is used. The cutting edge of the blade is inserted into the film to cut the film. The film cutting method of the present invention is also formed along the outer edge of the semiconductor wafer to form a small step, that is, the step is followed by a further edge cutting. The step of breaking: the knife performs the outer edge to cut the radial direction of the semiconductor wafer _ _ 疋 将 锋 锋 从 从 从 从 $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体In the radial direction inner/front cutting step, the second inclination is performed on the seventh oblique side, and the second oblique cutting step is performed along the semi-conductive η & the stool and the blade are red-turned, and &quot Α 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外 之外- At least the slanting step and the slanting step of the slanting step are slanting and cutting the slab. 丨The direction of the blade is changed, and the splicing portion is cut off: the shape of the sheet cutting device of the invention 'The line is along the outer edge: the outer edge of the semiconductor wafer with the bonding piece, so that the blade is opposite = cut the piece The feature is that the backing piece is cut since the tenth movement. (4) The method of cutting the W according to the present invention, the drawing is performed by the first oblique cutting step and the second 201203339 oblique cutting step. The blade of the knife is cut at the inclination of the groove of the groove, and then the knives and knives are left without the remaining pieces. When waiting, you can avoid the 步骤# u grinding step damage on the back of the sun circle. Again A + circle and If the wafer is broken between the grinding knives, since there is no slab in the groove portion, κ Θ can prevent the γ Ζ 洗 洗 洗 洗 洗 洗 洗 洗 洗 Ζ Ζ Ζ Ζ Ζ Ζ Ζ Ζ And the circuit of the wafer is damaged. In the first tilt cutting step and the step of cutting the knife edge obliquely, if the knife insert is inserted, the side of the semiconductor wafer is cut. Then, W moves slightly along the edge of the ...s blade, and the movement of the blade can be simplified. The heart sand is controlled again. If the blade is left along the valley of the groove, the blade remains in the valley portion of the groove 1 and the second tilting step, and the front moves to cut the film, thereby suppressing [Embodiment] Hereinafter, "above" and "as a reference" will be described with reference to the drawings. An embodiment of the present invention will be described with reference to the drawings. J, "Right" and other aspects of the language used in Figure 1, the thin film attached step, and ^

The device 1 is a pair of wafers W having one surface, that is, the surface WA, and the other surface, the back surface WB. The wafer W' as a broken body is attached to the formed film s*, the clothing surface WA, and The device of the attached tab 6 is cut along the outer edge wc of the wafer W. Here, a part of the outer edge w C of the wafer W is formed.

Further, a V 6 201203339 shaped groove 1C (volume, day, and surface) is formed to indicate the crystal orientation of the wafer W. The edge wc is formed toward the wafer w θ 为 to have From the outer Κ1, as the Α . 〇 〇 〇 〇 〇 〇 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜 倾斜The supporting means 2 of the circle W and the supporting means 5 for supporting the carrier sheet S with respect to the contact sheet s of the wafer-like strip s from the side WB side are provided. And attaching and feeding the outer peripheral flat sheet S to the outer sheet 5 attached to the wafer W by the outer edge WC of the surface WA along the surface WA of the 兮曰Mw 曰曰 round W The sheet cutting device 7 is a control means 8 for controlling the operation of each of the sliders S.

The support hand & 2 has a disk shape which is formed by suctioning and holding the wafer from the back surface WB side through a suction port (not shown) and having a support surface 22 which is substantially the same as the outer edge WC of the wafer W and has a flat outer shape. The platform 21' is disposed in a shape of a square shape in a plan view, and the outer surface of the flat surface 33 in which the support surface 22 is parallel and flat is formed to be fixed to the bottom surface portion 31 of the hole 34. At the same time, the output shaft 42 is fixed to the direct drive motor 41 as a drive machine below the platform 21. In addition, the flat surface layer fluororesin or the like is provided with a non-adhesive treatment, and the attached sheet S 〇 supply means 5 can be peeled off, and is provided to be provided on the left side of the support means 2, that is, the supply of the succeeding sheet S. The side supply side frame 5a is provided on the recovery side frame 5B on the right side of the support means 2, that is, on the recovery side, and the moving frame 5C which is driven by a drive machine such as a linear motor (not shown) and which is movable in the left-right direction. 7 201203339 In the supply side frame 5A, there is provided a support roller 51 that supports an adhesive sheet AD and a continuous sheet s wound in a reel shape, and a guide sheet s which is pulled out from the support roller 51. The guide roller 52, the drive roller 53 that is driven by the motor 53A as the drive machine to feed the adhesive sheet s, and the presser roller S that sandwiches the adhesive sheet S between the drive sheet 53 and the drive roller 53 are buckled on the recovery side frame 5B. The recovery drum 55 that drives the machine drive, such as a motor that is not shown, and that winds up the unnecessary portion of the succeeding sheet s, and the two guide rollers 56 that guide the unnecessary portion of the succeeding sheet S are provided. In the moving frame 5c, then. Further, a drive roller 57 driven by a motor 57A for driving the machine, and a clamp roller 58 for sandwiching the upper sheet s between the drive roller 57 and the drive roller 57. The pressing means 6 is configured to include a frame 61 that is driven by a driving device such as a linear motor (not shown) and that is movable in the left-right direction, and is supported by the frame 61 and is capable of abutting against the substrate BS side of the adhesive sheet s. The pressing roller 62' and the driving motor such as a linear motor (not shown) that moves the frame 61 up and down are advantageous. Further, the pressing roller 62 is formed of a member which is elastically deformable by rubber or resin. The four-piece cutting device 7 is configured to include a multi-joint robot π as a driving device and a blade provided at a front end portion of the multi-joint robot 71 on the inner side of the paper 1 in the support 1 . The multi-joint robot 7 1 includes a pedestal 73', and the shaft is supported by the t-arm and the shaft that can rotate about the vertical axis PA (the axis in the vertical direction) with respect to the susceptor 73.

Relative to this!臂2 arm 712, which is perpendicular to the horizontal axis of the vertical axis pA (the axis in the direction orthogonal to the plane of the U-paper), is Φ2, & μ, μ, and the axis is capable of rotating relative to the second The third arm 713 and the shaft 8 201203339, which are rotated about the horizontal axis, are supported by the fourth arm 7 1 4 which is rotatable about the extension axis EA of the third arm 713, and the axial support can be compared with the fourth The arm 7 is a fifth arm 715 that rotates about an axis orthogonal to the axis of the extension axis Ea (the axis in the direction orthogonal to the plane of the paper in Fig. 1), and the axis is supported by the extension axis CA of the fifth arm 715 The sixth member 716 that is rotated centrally is provided with a cutter 78 that can support the blade 72 by a chuck mechanism (not shown) provided in the sixth arm 716. The control means 8 is configured to include a control device 81 composed of a computer having a computing means such as cpu or a memory means such as a memory, and a wafer w or a slab s according to an operation of an operator or an appropriate detecting means. Various kinds of related information are input to the input means 82 of the control device 81. Here, for various information, the diameter or thickness of the wafer w, the size related to the shape of the groove K, the positional information, and the thickness of the slab § can be exemplified. Further, the information may be input from the input means 82 to the control means 81, or automatically input to the control means 8 by means of a detecting means such as a sensor (not shown) or may be stored in advance in the control means to store the memory. The control device 81 outputs a control command along the cutting path of the outer edge wc, the cutting step of the groove K portion, the cutting blade 72 into the depth of the succeeding piece s, etc., to the sheet cutting, based on various kinds of information. The device 7 or the like drives the machine. *. 5 First, 'information of various information from the input means 82 to the control device 81' in advance to cause the sheet attaching device to be in a standby state" Then, when the wafer W is loaded; the support surface 22 of the platform 21 is followed by 'supply means 5, that is, the moving frame 5C is moved from the left side of the supporting means 2 to the right direction in a state where the driving roller 7 is stopped, and the portion of the succeeding sheet 51 which is not used for the 201203339 is fed out from the supporting roller 51 in synchronization with this movement, and the recovery roller 55 is used. Roll up the next part of the piece s. Thereby, the adhesive AD side of the succeeding sheet S is relatively supplied above the surface WA of the wafer w. Next, the linear motor 41 receiving the command from the control unit 81 raises or lowers the stage 21 such that the surface wa of the wafer w is in the same plane as the flat surface 33 of the outer peripheral platform 32. Then, the pressing section 6 is driven to drive the linear motor (not shown) to lower the pressing roller 62, whereby the pressing roller 62 presses down the sheet S to press the adhesive AD surface to the flat surface 233. Further, the pressing means 6 drives the linear motor 'not shown in the state in which the pressing roller 62 is pressed to move the pressing roller 62 to the left direction and rotates the bearing on the adhesive sheet S, and sequentially connects the (four) AD faces. Press and attach to the surface WA of 'Tan 33 and Wafer w. In the above-described manner, 'the bonding sheet S is attached to the flat surface 33 and the wafer 〜 after the 'the sheet cutting device 7 drives the multi-joint robot η, and the information of the diameter of the wafer W input to the (4) means 8 is along. The outer edge wc of the wafer W is cut by the knife 72. At this time, the control device controls the articulated robot 7丨 or

乂 7 movements of 78, corresponding to the groove K 2, - appropriately change the movement path of the knife 72 or the blade 72 to the side of the blade S. In the case of rotation::, by the action of the articulated robot 71, the knife is rotated to face the blade 72A toward the inner side of the wafer chrome 79 Δ β 々 only in the direction of the inner side, so that the left side of the blade forming the knives 2 Α 72Β, so that the blade 72 is tilted toward the K1 towel. Next, as shown in Fig. 2Α Μ ^ nr, the outer diameter W of the day is lowered outward in the radial direction, and the blade 72 is pricked on the succeeding piece K1, and the blade 72 is moved inward in the radial direction of the inclination w (first inclination) Cut off step). Then, 10 201203339 rotates the blade 72 to move the blade 72 along the shape of the valley κ3 of the groove κ while changing the direction of the blade edge 72a along the valley portion K3, thereby moving along the valley portion 3 Some or all of the succeeding sheets s are cut to form the first cut portion C 1 (see FIG. 2B ). Next, once the blade 72 is once separated from the succeeding sheet S, the blade 72 is rotated to face the blade edge 72A toward the inner side in the radial direction of the wafer w, and the right side surface 72C of the blade forming the blade edge 7_2A is parallel to the inclination K2. Next, as shown in Fig. 2, the blade 72 is caused to puncture the "Hui knife 72" to the succeeding sheet s to the outer side 2 of the wafer w in the tilt Κ2. Next, the blade 72 is moved to the inner side in the radial direction of the wafer w along the tilting direction 2 (the second tilt = ... rotates, and the blade edge is made along the valley portion K3). The blade 72 moves along the valley portion Κ3 of the groove ,, and the :3 cuts the succeeding piece s, and forms the second cut portion C2 with the first cut portion ( (see Fig. 2c). Rotate: 2 separates the knife Μ from the splicing sheet. S, so that the blade 72 is oriented toward the 曰: toward the circumferential direction of the wafer W, the tangential side of the left side edge of the knife = the tangential direction of W (the blade 72A is located The wafer W is second, such as ® 2d ® (four) off direction) (see Figure 2C). The square t on the outer side in the radial direction punctures the blade 72 to the succeeding piece 8 by the rotary pattern of the wafer connected to the second cutting portion C2, and the blade 72 is oriented, and the outer edge of the blade is ^ The way to adjust the direction of the blade W is changed, and the second ": the outer edge of the wafer W WC moves the blade 72A. Next, the cutting blade 77 72 is cut along the shape of the outer edge WC of the wafer W, and the cutting portion that is cut by the edge WC is connected to the second 201203339 Π: '. Thereby, the succeeding sheet s is cut along the entire circumference of the wafer W (the outer edge is cut and the sheet s is cut as described above, the sheet cutting device 7 is retracted from the crystal, and the pressing roller 62 is raised, and the sheet is raised. The wafer W with the adhesive sheet s is carried out by a suitable transport device and sent to a subsequent step such as back grinding. Then, the supply means 5 moves the moving frame 5C to the left direction "along the wafer W". The outer edge is cut off and the unnecessary portion of the adhesive sheet s attached to the flat surface 33 is peeled off by the driving roller 57. Then, when each lower wafer W is supported by the supporting means 2, the same as above is repeated: In addition, the step of cutting the succeeding sheet S by the sheet cutting device 7 is not limited to the one illustrated in FIG. 2A to HI 9Γ1 na soil jl. circle 2C, and may also be illustrated by FIGS. 3A to 5E. In each step of the cutting process shown in FIGS. 3A to 3C, the blade 72 is first rotated to face the blade edge 72A toward the inner side in the radial direction of the wafer w, and the left side surface 72B of the blade. Parallel to the tilt K1. Next, as shown in Fig. 3, the blade edge η is tilted to the radial direction of the wafer w in the κ丨When the outer side is lowered, the blade 72 is pricked on the succeeding piece s. Then, the blade 72 is moved inward in the radial direction of the wafer w along the inclination κ to form the cut portion C3 (see Fig. 3b) (first tilt) Then, the cutting step 72 is performed. Then, the blade 72 is rotated to change the direction of the blade edge 72 along the valley portion, thereby moving the blade 72 along the shape of the groove Κ3. As shown in Fig. 3A, the succeeding piece s is cut along the valley portion κ3. Next, the blade 72 is not rotated from the succeeding piece s, and the blade 72 is rotated to face the blade edge 72A toward the outer side in the radial direction of the wafer w. 201203339, the left side surface 72B of the blade is parallel to the inclination K2. Secondly, the slanting blade (1) is moved outward in the radial direction of the wafer W (the second inclination cutting step). Then, the blade 72 is not caused to be removed from the film. S is separated, m as shown in Fig. 3C, the blade 72 is rotated to face the blade 72A toward the circular blade. Then, the blade 72 is rotated to follow the edge of the wafer boundary wc. The way of L adjusts the direction of the blade 72, and the direction of the blade edge 72A is made along the outer edge WC of the wafer w. Further, the shape of the outer edge W of the sunroof W is moved by the knife's mouth. Then, the cut portion that is cut along the outer edge wc is connected to the cut portion C3 that has been cut before, thereby The succeeding sheet S is cut along the entire circumference of the wafer W (outer edge cutting step). Further, as in the cutting step shown in FIGS. 4A to 4D, the blade 72 can be stabbed on the wafer w. The cutting piece s at the predetermined position of the outer edge wc is formed after the cutting portion C4 is formed, and the cutting step shown in Figs. 3A to 3c is performed. In the cutting step shown in Figs. 5A to 5E, the knife is firstly made. The knife "rotates" to bring the blade edge 72A toward the inner side in the radial direction of the wafer W, and the left side surface 72B of the blade is parallel to the inclination K1. Next, as shown in Fig. 5A, the blade 72 is lowered outward in the radial direction of the wafer w in the inclination K1, and the blade 72 is pricked from the surface of the wafer w to the succeeding sheet s. Next, the blade "is not moved along the inclination K1, as shown in Fig. 5B, by inserting the blade 72 deeply, the cutting portion of the blade s along the inclination K1 is formed by the width of the cutting direction of the blade 72. C5 (refer to Fig. 5C) (i-th oblique cutting step). Further, the length of the top slope K1, K2 of the groove is about 55 mm to about 3 mm, and the width of the cutting direction of the blade 72 is set to l〇mm. Then, once the blade 72 is once separated from the succeeding piece s, the blade 72 is rotated to move the blade edge 72A toward the inner side in the radial direction of the wafer % 13 201203339, and the right side surface 72C of the blade and the inclination are as shown in FIG. 5C. The knife 72 is inclined to the K2:: square owing 'outer two lower', the knife 72 is stabbed to the slab, and the yaw is moved to the slanting Κ2, as the circle is inserted, the width of the cutting direction of the 72 is cut. By the person following the "cutting section C6 (refer to Figure 5) (the second two ^^ money, as shown in Figure 5, the blade 72 is moved upwards, reducing the knife = 2 blade 72 groove, - edge along The side of the valley K3 - change the direction of the blade 72A 'while making the knife and the heart of the groove κ valley: the shape of the K3 moves' to cut the slab along the valley K3 C, 6 is connected to the cutting portion C5. Then, the knife 72 is again rotated from the succeeding piece s: the knife 72 is rotated to cut the blade edge 72A toward the circumference. The "knife break portion C6" is connected. The crystal...the radial method 'punctures the blade 72 to the succeeding piece s, so that the blade "turns the direction of the blade edge 72A so as to rotate the outer edge wc of the wafer w, and the outer edge WC of the second W makes the blade edge 72A When the direction is changed, the blade 72 is moved along the shape of the outer edge wc of the wafer w. Then, the cutting portion is connected to the cutting portion to cut the succeeding sheet S along the entire circumference of the wafer W (outer edge cutting) According to the present embodiment described above, the following effects are obtained: that is, the blade edge 7 is formed by the blade K1, K2 and the valley portion K3 along the groove κ, Gan a§l τι, etc. The blade 7 2 Α is oriented in the cutting direction to cut the tab s, whereby the cutting residue of the tab 8 can be prevented from being present in the groove κ π knife or only minimally cutting the residue, in the subsequent step 14 201203339 I: In the second back grinding step, etc., it is possible to prevent the cutting of the succeeding sheet s from remaining, and between the Japanese yen w and the grinding blade. The wafer w is broken, or the portion where the residue is cut is peeled off and enters the washing water, etc. As described above, the above-described description discloses a preferred configuration method and the like for carrying out the invention. However, the present invention is not limited thereto. In other words, the present invention is specifically illustrated and described with respect to specific embodiments. However, the present invention does not exceed the scope of the technical idea and the object of the present invention, and the shape, material, quantity, and And other details can be applied to various types of people. In addition, the description of the shape, the quality, and the like as described above is exemplarily described in order to make the present invention easy to understand, and not used. In order to limit the present invention, the description of the names of the members that have been limited to some or all of the limitations of the shapes, the likes, and the like is included in the present invention. For example, the semiconductor wafer in the present invention may be a semiconductor wafer or a compound semiconductor wafer, etc., and a sheet s-mounting sheet, a dicing tape, a die bonding tape, or the like, attached to a semiconductor crystal. A variety of round sheets or tapes and films are available. Further, in the above-described embodiment, the sheet cutting device 7 is provided in a portion of the sheet attaching device ii. However, the sheet cutting device of the present invention may be separately provided with the sheet attaching device, or may be separately provided. It is provided as part of a device other than the sheet attaching device. Further, in the above-described embodiment, the cymbal cutting device 7 is configured to have a plurality of off-state persons 71, but is not limited thereto. The actor can control the blade as long as the cutting step can be performed. Just fine. Further, in the driving device according to the above-described embodiment, a motor such as a rotary motor, a linear motion motor, a single-axis robot, or a multi-robot may be used, and those exemplified in the embodiment may be used. (There is a thin overall view of the sheet cutting device of the present invention, which is shown in Fig. 1A. Fig. 2A is a diagram of the operation of the sheet cutting device of Fig. 1 (Fig. 2B) Fig. 1 is a diagram of the operation of the sheet cut and sturdy ro. The figure is shown in Fig. 1. Fig. 2C is the sheet of Fig. 1 and the operation of the sheet is shown in Fig. 1. Fig. 3A is the sheet of Fig. 1 Fig. 2 动作 Operation diagram. Attachment device Fig. 2C is different from Fig. 3, Fig. 1 is a sheet cut, and Fig. 3 is different from Fig. 2A to Fig. 2C. Fig. 3C is a sheet cutting device of Fig. 1. Recognition

Fig. 2C is an illustration of a different circle 3C. Fig. 4A is an explanatory view of the sheet cutting operation of Fig. 1. FIG. 4B is a cut-off operation of the sheet of FIG. 1 and an operation diagram is different from FIG. 2A to FIG. 3C.

Fig. 4C is an explanatory view of the operation of the sheet cutting 图 of Fig. 1. The breaking device is different from that of Figs. 2A to 3C. Fig. 4 is a diagram showing the operation of the film of Fig. 1 which is different from Fig. 3C of Fig. 2A. Fig. 5A is a view similar to the operation of the sheet cutting device of Fig. 1 in Fig. 2A to Fig. 4D. Fig. 5B is a view similar to the operation of the sheet cutting device of Fig. 1 in Fig. 2A to Fig. 4D. Fig. 5C is a view similar to the operation of the sheet cutting device of Fig. 1 in Fig. 2A to Fig. 4D. Fig. 5D is an explanatory view of the operation of the sheet cutting device of Fig. 1 which is different from Figs. 2A to 4D. Fig. 5E is an explanatory view of the operation of the sheet cutting device of Fig. 1 which is different from Fig. 2A to Fig. 4D. [Description of main component symbols] 1 Sheet attaching device 2 Supporting means 5 Supply means 5A Supply side frame 5B Recycling side frame 5C Moving frame 6 Pressing means 7 Sheet cutting device 8 Control means 21 Platform 22 Support surface 17 201203339 31 Bottom portion 32 Peripheral platform 33 Flat surface 34 Sub L 41 Direct motor 42 Output shaft 51 Support roller 52 Guide roller 53 Drive roller 53A Motor 54 Press roller 55 Recovery roller 56 Guide roller 57 Drive roller 57A Motor 58 Press roller 61 Frame 62 Press roller 71 Multi-joint robot 72 Blade 72A Blade 72B Left side 72C Right side 73 Base 18 201203339 78 Tool 81 Control device 82 Input means 711 First arm 712 Second arm 713 Third arm 714 Fourth arm 715 Fifth arm 716 Sixth arm

Cl, C2, C3, C4, C5, C6 Cutting section K Groove ΚΙ, K2 Tilt K3 Valley AD Adhesive BS Substrate CA, EA Extension axis PA Vertical axis S Next piece w Wafer WA Surface WB Back WC Edge 19

Claims (1)

201203339 VII. Patent application scope: 1. A method for cutting a sheet, which is formed by forming a v-shaped groove having 7 inclinations and another inclination on one side of the outer edge and attaching a semiconductor wafer to the surface of the bonding sheet. a rim, the knife 37 is relatively moved to cut the slab', characterized in that: an ith oblique cutting step of cutting the slanting piece along the groove; tilting along the groove Step 2 of cutting the slab of the slab: and cutting the outer edge cutting step of the slab along the outer edge of the semiconductor wafer in the first slant cutting step and the second slant cutting step The blade is cut by the blade of the 1 knife along the inclination of the groove. 2' If you apply for a patent range! In the sheet cutting method of the item, the blade edge is moved from the outer direction of the semiconductor wafer (four) to (four); (1) the oblique cutting step; the outer side of the radial direction of the wood is applied to the inner side to perform the first connection. The semiconductor wafer cutting step is performed. To Τ Τ 画 画 画 艾 艾 艾 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中In the sheet cutting method, the blade is tilted from the outer side toward the inner side in the radial direction of the semiconductor wafer; and the first step is reversed from the semiconductor wafer, and the blade is rotated to rotate the blade. The second tilt 20 201203339 cutting step is performed on the inner side in the radial direction, and the second oblique cutting step is followed to rotate the blade while the blade is edged along the outer edge of the semiconductor wafer. The direction is changed, and the outer edge cutting step is performed. 4. The sheet cutting method according to the first aspect of the invention, wherein at least one of the first oblique cutting step and the second oblique cutting step is performed only by the direction intersecting from the surface of the semiconductor wafer The blade is inserted into the tab to cut the tab. 5. The sheet cutting method according to the scope of the patent application of the third aspect of the invention further comprises at least a part of the outer edge of the semiconductor wafer to perform the outer edge cutting; 7 following the cutting edge cutting step to rotate the knife, the blade is turned Performing the second tilting step from the outer side toward the inner side in the radial direction of the semiconductor wafer; stepping the blade from the second oblique cut to the first oblique cutting step to rotate the blade to the radial direction of the semiconductor wafer The cutting step is performed on the inner side toward the outer side; the knife rotates and the direction of the blade edge is changed, and after the second oblique cutting step, the knife is caused to perform the outer edge along the outer edge of the semiconductor wafer. The residue of the cutting step. 6. The sheet cutting method groove according to item i of the patent application scope is provided with a valley portion connecting the one and the other inclined sides; and the first oblique cutting step and the second oblique cutting step are performed to make the groove When the knife rotates, the blade 21 is provided along the side of the blade 1 201203339, and the film is cut and changed. 7. A sheet cutting device for forming a V-shaped groove having a slope and another inclination along a portion of the outer edge and attaching an outer edge of the semiconductor wafer to the surface to relatively move the blade to cut the edge Next, it is characterized in that the sheet is cut by the sheet cut-off side of any one of claims 1 to 6. Schema: (such as the next page) 22