JP2011198980A - Method of cutting sheet, and device of cutting sheet - Google Patents

Abstract

To provide a sheet cutting method and a sheet cutting apparatus capable of suppressing uncut portions of a notch portion in an adhesive sheet attached to a wafer having a notch.
By cutting the adhesive sheet S by rotating the cutter blade 72 while rotating the cutter blade 72 so that the blade edge is along the slopes K1, K2 and the valley portion K3 of the notch K, the adhesive sheet S is left uncut at the notch K portion. In the back surface grinding process of the wafer W, which is a subsequent process, the uncut part of the adhesive sheet S is sandwiched between the wafer W and the grinding blade. It is possible to prevent the cleaning water from entering due to damage to the surface or peeling off the uncut portion.
[Selection] Figure 2

Description

  The present invention relates to a sheet cutting method and a sheet cutting apparatus for cutting an adhesive sheet attached to a semiconductor wafer.

  Conventionally, in a semiconductor manufacturing process, an adhesive sheet such as a protective tape is applied to the surface of a semiconductor wafer as an adherend (hereinafter sometimes simply referred to as a wafer), and the attached adhesive sheet is cut along the outer edge of the wafer. A cutting device for cutting with a blade is used (see, for example, Patent Document 1). This cutting apparatus targets a semiconductor wafer in which a V-shaped notch is formed on a part of the outer edge for alignment, and cuts the adhesive sheet along the outer edge and also cuts the part of the adhesive sheet along the notch. It is configured as follows.

JP 2009-125871 A

  However, in the cutting device described in Patent Document 1, the cutter blade moves in the notch portion without following the inclination of the notch and cuts the adhesive sheet, so that the adhesive sheet remains in the vicinity of the valley portion of the notch. Become. For this reason, there is a possibility that the adhesive sheet remaining in the notch portion is sandwiched between the wafer and the grinding blade (grinding stone) and damages the wafer in the back surface grinding process of the wafer to which the adhesive sheet is attached. Furthermore, the adhesive sheet portion that has remained in the notch is cut off and the adhesive sheet is peeled off from the wafer, and the cleaning water used in the back surface grinding process etc. enters the wafer surface side, thereby damaging the circuit on the wafer surface. End up.

  An object of the present invention is to provide a sheet cutting method and a sheet cutting apparatus capable of suppressing uncut portions of a notch portion in an adhesive sheet attached to a wafer having a notch.

  In order to achieve the above object, a sheet cutting method of the present invention is a semiconductor wafer in which a V-shaped notch having one slope and the other slope is formed on a part of an outer edge and an adhesive sheet is attached to the surface. A cutting method for cutting the adhesive sheet by relatively moving the cutter blade along the outer edge of the first cutting step, cutting the adhesive sheet along one inclination of the notch, A second inclined cutting step of cutting the adhesive sheet along the other inclination; and an outer edge cutting step of cutting the adhesive sheet along the outer edge of the semiconductor wafer, the first inclined cutting step and the second inclined step. In the cutting step, a configuration is employed in which the adhesive sheet is cut along the cutting edge of the cutter blade along the inclination of the notch.

At this time, in the sheet cutting method of the present invention, the first inclined cutting step is performed with the blade tip directed from the radially outer side to the inner side of the semiconductor wafer, and the cutter blade is rotated following the first inclined cutting step. It is preferable that the second inclined cutting process is performed with the cutting edge directed from the radially outer side to the inner side of the semiconductor wafer.
Further, in the sheet cutting method of the present invention, the first inclined cutting step is performed with the cutting edge directed from the radially outer side to the inner side of the semiconductor wafer, and the cutter blade is rotated following the first inclined cutting step. The second inclined cutting step is performed with the cutting edge directed from the radially inner side to the outer side of the semiconductor wafer, and the cutter blade is rotated following the second inclined cutting step and along the outer edge of the semiconductor wafer. As described above, the outer edge cutting step may be performed while changing the direction of the blade edge.
In the above sheet cutting method, in at least one of the first inclined cutting step and the second inclined cutting step, the adhesive sheet is cut only by the operation of inserting the cutter blade into the adhesive sheet from the plane crossing direction of the semiconductor wafer. May be.

Further, in the sheet cutting method of the present invention, the outer edge cutting step is performed along at least a part of the outer edge of the semiconductor wafer, the cutter blade is rotated following the outer edge inclined cutting step, and the diameter of the semiconductor wafer is determined. The first inclined cutting process is performed with the cutting edge directed from the outer side to the inner side, and the cutter blade is rotated following the first inclined cutting process, and the cutting edge is directed from the inner side to the outer side in the radial direction of the semiconductor wafer. The second inclined cutting step is performed, and after the second inclined cutting step, the cutter blade is rotated, and the remaining edge cutting step is changed while changing the direction of the blade edge along the outer edge of the semiconductor wafer. You may employ | adopt the structure of implementing.
Furthermore, in the sheet cutting method of the present invention, the notch includes a trough that connects the one and the other slopes, and following at least one of the first slope cutting process and the second slope cutting process, It is preferable to cut the adhesive sheet while rotating the cutter blade and changing the direction of the blade edge along the valley.

  On the other hand, the sheet cutting device of the present invention is formed along the outer edge of a semiconductor wafer in which a V-shaped notch having one slope and the other slope is formed in a part of the outer edge and an adhesive sheet is attached to the surface. A sheet cutting device that cuts the adhesive sheet by relatively moving a cutter blade, wherein the adhesive sheet is cut by any one of the sheet cutting methods.

According to the present invention as described above, in the first inclined cutting step and the second inclined cutting step, the adhesive sheet remains in the notch portion by cutting the adhesive sheet with the cutting edge of the cutter blade aligned with the inclination of the notch. Therefore, it is possible to avoid a situation in which the adhesive sheet is sandwiched between the wafer and the grinding blade and damages the wafer in the wafer back grinding process or the like. In addition, since the adhesive sheet does not remain in the notch part, it is possible to prevent the adhesive sheet from being peeled off, and to prevent damage to the circuit of the wafer due to intrusion of cleaning water or the like in the back grinding process. Can do.
Further, in the first inclined cutting process and the second inclined cutting process, if the adhesive sheet is cut only by the operation of inserting the cutter blade, the movement of the cutter blade in the direction along the surface of the semiconductor wafer is omitted. Therefore, the movement control of the cutter blade can be simplified.
Further, following the first inclined cutting step and the second inclined cutting step, if the adhesive sheet is cut by moving the blade edge along the notch valley, the adhesive sheet remains in the notch valley. Can be suppressed.

The whole figure of a sheet sticking device provided with the sheet cutting device of the present invention. Operation | movement explanatory drawing of the sheet cutting device of FIG. The operation | movement explanatory drawing different from FIG. 2 of the sheet | seat cutting device of FIG. Operation | movement explanatory drawing different from FIG. 2, FIG. 3 of the sheet | seat cutting device of FIG. Operation | movement explanatory drawing different from FIGS. 2-4 of the sheet | seat cutting device of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, a sheet sticking apparatus 1 has an adhesive sheet S on a front surface WA on which a circuit is formed on a wafer W as an adherend having a front surface WA that is one surface and a rear surface WB that is the other surface. And affixing the adhered adhesive sheet S along the outer edge WC of the wafer W. Here, a V-shaped notch K (see FIGS. 2 to 5) for indicating the crystal orientation of the wafer W is formed on a part of the outer edge WC of the wafer W. The notch K is formed on the outer edge WC. To the radial inner side of the wafer W, the slope K1 as one slope, the slope K2 as the other slope, and the valley K3 connecting these slopes K1 and K2 are formed.

  The sheet sticking apparatus 1 includes a support unit 2 that supports the wafer W from the back surface WB side, a supply unit 5 that supplies a belt-shaped adhesive sheet S facing the front surface WA of the wafer W, and an outer periphery of the supplied adhesive sheet S. The pressing means 6 for pressing and sticking to the table 32 and the surface WA of the wafer W, the sheet cutting device 7 for cutting the adhesive sheet S attached to the wafer W along the outer edge WC of the wafer W, and the operation of each part And control means 8 for controlling.

  The support means 2 sucks and holds the wafer W from the back surface WB side through a suction port (not shown), and has a disk-shaped table 21 having a flat support surface 22 having the same outer shape as the outer edge WC of the wafer W; An outer peripheral table 32 provided with a square shape in plan view, having a circular hole 34 formed therein, a flat surface 33 parallel to the support surface 22 of the table 21, and a bottom surface portion of the hole 34 And a linear motion motor 41 as a driving device fixed on the lower surface of the table 21. The flat surface 33 is laminated with a fluororesin or the like so that the adhered adhesive sheet S can be peeled off.

  The supply means 5 includes a supply side frame 5A provided on the supply side of the adhesive sheet S on the left side with respect to the support means 2, a collection side frame 5B provided on the collection side on the right side with respect to the support means 2, and And a moving frame 5C which is driven by a driving device such as a linear motor and is provided so as to be movable in the left-right direction.

  On the supply side frame 5A, an adhesive AD is laminated on the base material BS, and a support roller 51 that supports the adhesive sheet S wound in a roll shape, and a guide that guides the adhesive sheet S drawn from the support roller 51. A roller 52, a driving roller 53 that is driven by a motor 53 </ b> A as a driving device to send out the adhesive sheet S, and a pinch roller 54 that sandwiches the adhesive sheet S between the driving roller 53 are provided. The collection side frame 5B has a collection roller 55 that is driven by a driving device such as a motor (not shown) to wind up and collect unnecessary portions of the adhesive sheet S, and two guide rollers 56 that guide the unnecessary portions of the adhesive sheet S. Is provided. The moving frame 5 </ b> C is provided with a driving roller 57 driven by a motor 57 </ b> A as a driving device, and a pinch roller 58 that sandwiches the adhesive sheet S between the driving roller 57.

  The pressing means 6 is driven by a driving device such as a linear motor (not shown) and is provided so as to be movable in the left-right direction. The pressing means 6 is supported by the frame 61 and can be brought into contact with the base material BS side of the adhesive sheet S. The roller 62 and a driving device such as a linear motor (not shown) that moves the frame 61 up and down are provided. The pressing roller 62 is formed of an elastically deformable member made of rubber or resin.

  The sheet cutting device 7 includes an articulated robot 71 as a driving device provided on the rear side of the paper surface in FIG. 1 with respect to the support means 2 and a cutter blade 72 provided at the tip of the articulated robot 71. Has been. The articulated robot 71 includes a base 73, a first arm 711 that is pivotally supported about the vertical axis PA (vertical axis) with respect to the base 73, and a vertical motion with respect to the first arm 711. A second arm 712 that is rotatably supported around a horizontal axis orthogonal to the axis PA (in FIG. 1, an axis perpendicular to the plane of the drawing), and an axis that is rotatable about the horizontal axis with respect to the second arm 712. A third arm 713 that is supported, a fourth arm 714 that is rotatably supported around an extension axis EA of the third arm 713, and a perpendicular to the extension axis EA with respect to the fourth arm 714 A fifth arm 715 that is rotatably supported around an axis (an axis perpendicular to the plane of the drawing in FIG. 1), and a sixth arm that is rotatably supported around an extension axis CA of the fifth arm 715 716 and the sixth a By a chuck mechanism (not shown) provided in the arm 716, it is provided a cutter tool 78 that the cutter blade 72 is mounted for supporting.

  The control means 8 controls various information related to the wafer W, the adhesive sheet S, and the like based on an operator's operation and appropriate detection means based on a control device 81 including a computing means such as a CPU and a storage means such as a memory. An input means 82 for inputting to the device 81 is provided. Here, as various information, the diameter dimension and thickness dimension of the wafer W, the dimension regarding the shape of the notch K, position information, the thickness dimension of the adhesive sheet S, etc. can be illustrated. The information may be input from the input unit 82 to the control device 81, may be automatically input to the control device 81 by a detection unit such as a sensor (not shown), or is previously stored in the memory of the control device 81. May be. The control device 81 cuts the control command such as the cutting path of the adhesive sheet S along the outer edge WC, the cutting procedure of the notch K portion, and the insertion depth of the cutter blade 72 into the adhesive sheet S according to various information. Output to a driving device such as the device 7.

Hereinafter, operation | movement of the sheet sticking apparatus 1 is demonstrated.
First, various information is input from the input means 82 to the control device 81, and the sheet sticking device 1 is set in a standby state. Thereafter, when the wafer W is placed on the support surface 22 of the table 21, the supply unit 5 moves the moving frame 5 </ b> C from the left side of the support unit 2 to the right while stopping the driving roller 57. Synchronously, the unused portion of the adhesive sheet S is fed out from the support roller 51, and unnecessary portions of the adhesive sheet S are wound up by the collection roller 55. Thereby, the adhesive AD side of the adhesive sheet S is supplied to the upper side of the front surface WA of the wafer W so as to be opposed. Next, the linear motion motor 41 that has received a command from the control device 81 raises or lowers the table 21 so that the surface WA of the wafer W and the flat surface 33 of the outer peripheral table 32 are located in the same plane. Next, the pressing means 6 drives a linear motion motor (not shown) to lower the pressing roller 62, and presses down the adhesive sheet S with the pressing roller 62 to press the adhesive AD surface against the flat surface 33. Further, the pressing means 6 drives a linear motor (not shown) while pressing the pressing roller 62, moves the pressing roller 62 leftward to roll on the adhesive sheet S, and the flat surface 33 and the surface of the wafer W The adhesive AD surface is sequentially pressed and pasted on the WA.

  After affixing the adhesive sheet S to the flat surface 33 and the surface WA of the wafer W as described above, the sheet cutting device 7 drives the articulated robot 71 to determine the diameter dimension of the wafer W input to the control means 8. Based on the information, the adhesive sheet S is cut by the cutter blade 72 along the outer edge WC of the wafer W. At this time, the control device 81 controls the operation of the articulated robot 71 and the cutter tool 78, and changes the movement path of the cutter blade 72 and the direction of the blade edge 72A appropriately according to the shape of the notch K. Disconnect.

Specifically, the cutter blade 72 is rotated by the operation of the articulated robot 71, the blade edge 72A is directed inward in the radial direction of the wafer W, and the left side surface 72B of the blade forming the blade edge 72A is parallel to the inclination K1. To do. Next, as shown in FIG. 2A, the cutter blade 72 is lowered to the outside in the radial direction of the wafer W at the inclination K1, and the cutter blade 72 is pierced into the adhesive sheet S. Next, the cutter blade 72 is moved inward in the radial direction of the wafer W along the inclination K1 (first inclined cutting step). Thereafter, the cutter blade 72 is rotated, and the cutter blade 72 is moved along the shape of the valley portion K3 of the notch K while changing the direction of the blade edge 72A along the valley portion K3. Or the adhesive sheet S is cut | disconnected along all, and the 1st cutting part C1 is formed (refer FIG.2 (B)).
Then, once the cutter blade 72 is separated from the adhesive sheet S, the cutter blade 72 is rotated, the blade edge 72A is directed inward in the radial direction of the wafer W, and the right side surface 72C of the blade forming the blade edge 72A is inclined with the inclination K2. Try to be parallel. Next, as shown in FIG. 2B, the cutter blade 72 is lowered to the outside in the radial direction of the wafer W at the inclination K2, and the cutter blade 72 is pierced into the adhesive sheet S. Next, the cutter blade 72 is moved inward in the radial direction of the wafer W along the inclination K2 (second inclined cutting process). Thereafter, the cutter blade 72 is rotated, and the cutter blade 72 is moved along the shape of the valley K3 of the notch K while changing the direction of the blade edge 72A along the valley K3. The adhesive sheet S is cut to form a second cut portion C2 that is continuous with the first cut portion C1 (see FIG. 2C).
After that, after the cutter blade 72 is separated from the adhesive sheet S again, the cutter blade 72 is rotated, the blade edge 72A is directed in the circumferential direction of the wafer W, and the left side surface 72B of the blade is tangential to the wafer W (the blade edge 72A). In the tangential direction at the outer edge of the wafer W, and is hereinafter referred to as “circumferential cutting direction”) (see FIG. 2C). Next, as shown in FIG. 2C, the cutter blade 72 is pierced into the adhesive sheet S so as to continue to the radially outer side of the wafer W of the second cutting portion C2, the cutter blade 72 is rotated, and the outer edge of the wafer W The cutter blade 72 is moved along the shape of the outer edge WC of the wafer W while turning the blade edge 72A along the WC and changing the direction of the blade edge 72A along the outer edge WC of the wafer W. And the adhesive sheet S is cut | disconnected along the perimeter of the wafer W because the cutting part cut | disconnected along the outer edge WC continues to the 1st cutting part C1 (outer edge cutting process).

  When the adhesive sheet S is cut as described above, the sheet cutting device 7 is retracted from the wafer W and the pressing roller 62 is raised, and the wafer W to which the adhesive sheet S is adhered is unloaded by an appropriate transfer device. Sent to subsequent processes such as back grinding. Thereafter, the supply means 5 moves the moving frame 5C in the left direction so that the unnecessary portion of the adhesive sheet S cut along the outer edge WC of the wafer W and stuck on the flat surface 33 is removed by the driving roller 57. Peel off. When the next wafer W is supported by the support means 2, the same operation as described above is repeated thereafter.

Note that the cutting procedure of the adhesive sheet S by the sheet cutting device 7 is not limited to the one described in FIG. 2, and the adhesive sheet S may be cut by each procedure shown in FIGS. 3 to 5.
In the cutting procedure shown in FIG. 3, first, the cutter blade 72 is rotated so that the blade edge 72A is directed radially inward of the wafer W so that the left side surface 72B of the blade is parallel to the inclination K1. Next, as shown in FIG. 3A, the cutter blade 72 is lowered to the outside in the radial direction of the wafer W at the inclination K1, and the cutter blade 72 is pierced into the adhesive sheet S. Next, the cutter blade 72 is moved inward in the radial direction of the wafer W along the inclination K1, thereby forming the cutting portion C3 (see FIG. 3B) (first inclined cutting step). Thereafter, the cutter blade 72 is rotated, and the cutter blade 72 is moved along the shape of the valley portion K3 of the notch K while changing the direction of the blade edge 72A along the valley portion K3. As shown, the adhesive sheet S is cut along the valley K3. Then, without separating the cutter blade 72 from the adhesive sheet S, the cutter blade 72 is rotated so that the blade edge 72A is directed outward in the radial direction of the wafer W so that the left side surface 72B of the blade is parallel to the inclination K2. Next, the cutter blade 72 is moved radially outward of the wafer W along the inclination K2 (second inclined cutting process). Thereafter, without separating the cutter blade 72 from the adhesive sheet S, as shown in FIG. 3C, the cutter blade 72 is rotated to direct the blade edge 72A in the circumferential cutting direction. Next, the cutter blade 72 is rotated so that the blade edge 72A is directed along the outer edge WC of the wafer W and the direction of the blade edge 72A is changed along the outer edge WC of the wafer W. Move along the shape of the WC. And the adhesive sheet S is cut | disconnected along the perimeter of the wafer W because the cutting part cut | disconnected along the outer edge WC continues to the cutting part C3 cut | disconnected previously (outer edge cutting process).
As shown in the cutting procedure shown in FIG. 4, the cutter blade 72 is pierced into the adhesive sheet S at a predetermined position on the outer edge WC of the wafer W to form the cutting portion C4, and then the cutting procedure shown in FIG. 3 is performed. It may be.

  In the cutting procedure shown in FIG. 5, first, the cutter blade 72 is rotated so that the blade edge 72A is directed radially inward of the wafer W so that the left side surface 72B of the blade is parallel to the inclination K1. Next, as shown in FIG. 5A, the cutter blade 72 is lowered to the outside in the radial direction of the wafer W at the inclination K1, and the cutter blade 72 is pierced into the adhesive sheet S from the plane crossing direction of the wafer W. Next, without moving the cutter blade 72 along the inclination K1, as shown in FIG. 5 (B), the cutter blade 72 is inserted deeply, thereby bonding along the inclination K1 depending on the width of the cutter blade 72 in the cutting direction. A cutting portion C5 of the sheet S is formed (see FIG. 5C) (first inclined cutting step). The lengths of the inclinations K1 and K2 of the notch K are about 0.5 mm to 3 mm, and the width of the cutter blade 72 in the cutting direction is set to 10 mm. Then, once the cutter blade 72 is separated from the adhesive sheet S, the cutter blade 72 is rotated so that the blade edge 72A is directed radially inward of the wafer W, and the right side surface 72C of the blade is parallel to the inclination K2. To do. Next, as shown in FIG. 5C, the cutter blade 72 is moved downward in the radial direction of the wafer W at the inclination K <b> 2, and the cutter blade 72 is pierced into the adhesive sheet S. Then, without moving the cutter blade 72 along the inclination K2, as shown in FIG. 5 (D), the cutter blade 72 is inserted deeply, thereby bonding along the inclination K2 depending on the width of the cutter blade 72 in the cutting direction. A cutting portion C6 of the sheet S is formed (see FIG. 5E) (second inclined cutting step). Thereafter, as shown in FIG. 5 (E), the cutter blade 72 is moved upward to reduce the insertion depth of the cutter blade 72, the cutter blade 72 is rotated, and the direction of the blade edge 72A is along the valley K3. By moving the cutter blade 72 along the shape of the valley portion K3 of the notch K while changing the angle, the adhesive sheet S is cut along the valley portion K3, and the cutting portion C6 is continuous with the cutting portion C5. Next, after the cutter blade 72 is separated from the adhesive sheet S again, the cutter blade 72 is rotated to direct the blade edge 72A in the circumferential cutting direction. Next, the cutter blade 72 is pierced into the adhesive sheet S so as to be continuous with the radially outer side of the wafer W of the sixth cutting portion C6, the cutter blade 72 is rotated, and the blade edge 72A is directed along the outer edge WC of the wafer W. At the same time, the cutter blade 72 is moved along the shape of the outer edge WC of the wafer W while changing the direction of the blade edge 72A along the outer edge WC of the wafer W. And an adhesive sheet S is cut | disconnected along the perimeter of the wafer W because a cutting part continues to the cutting part C5 (outer edge cutting process).

According to this embodiment as described above, the following effects are obtained.
That is, by rotating the cutter blade 72 so that the blade edge is aligned with the slopes K1, K2 and the valley K3 of the notch K, and cutting the adhesive sheet S with the blade edge 72A directed in the cutting direction, the adhesive sheet S is applied to the notch K portion. In the back surface grinding process of the wafer W, which is a subsequent process, the uncut residue of the adhesive sheet S is sandwiched between the wafer W and the grinding blade. Thus, it is possible to prevent the wafer W from being damaged or the uncut portion from being peeled off and the cleaning water entering.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, examples of the semiconductor wafer in the present invention include a silicon semiconductor wafer and a compound semiconductor wafer. Further, the adhesive sheet S may be various sheets, tapes, and films attached to a semiconductor wafer such as a mounting sheet, a protective sheet, a dicing tape, and a die bonding tape.
Moreover, although the said embodiment demonstrated the structure which provided the sheet cutting device 7 in a part of the sheet sticking apparatus 1, the sheet cutting device of this invention may be provided separately from a sheet sticking device, and a sheet sticking is carried out. It may be provided as a part of a device other than the device.
In the above embodiment, the sheet cutting device 7 is configured to include the articulated robot 71. However, the present invention is not limited to this, and the operation of the cutter blade can be controlled to such an extent that the above-described cutting procedure can be performed. I just need it.
Furthermore, the drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. (Some overlap with those exemplified in the embodiment).

7 Sheet cutting device 72 Cutter blade 72A Cutting edge K Notch K1, K2 Inclination K3 Valley S Adhesive sheet W Wafer WA Front WB Back WC Outer edge

Claims (7)

The adhesive sheet is formed by relatively moving the cutter blade along the outer edge of the semiconductor wafer in which a V-shaped notch having one slope and the other slope is formed in a part of the outer edge and the adhesive sheet is attached to the surface. A sheet cutting method for cutting
A first inclined cutting step of cutting the adhesive sheet along one inclination of the notch;
A second inclined cutting step of cutting the adhesive sheet along the other inclination of the notch;
An outer edge cutting step of cutting the adhesive sheet along the outer edge of the semiconductor wafer,
In the first inclined cutting step and the second inclined cutting step, the adhesive sheet is cut along a cutting edge of the cutter blade along the inclination of the notch. Performing the first inclined cutting step with the cutting edge directed from the radially outer side to the inner side of the semiconductor wafer;
The cutter blade is rotated subsequent to the first inclined cutting step, and the second inclined cutting step is performed with the cutting edge directed from the radially outer side to the inner side of the semiconductor wafer. Sheet cutting method. Performing the first inclined cutting step with the cutting edge directed from the radially outer side to the inner side of the semiconductor wafer;
Following the first inclined cutting step, the cutter blade is rotated, and the second inclined cutting step is performed with the cutting edge directed from the radially inner side to the outer side of the semiconductor wafer,
The said edge cutting process is implemented, changing the direction of the said blade edge along the outer edge of the said semiconductor wafer while rotating the said cutter blade following this 2nd inclination cutting process. The sheet cutting method as described.   The adhesive sheet is cut only by an operation of inserting the cutter blade into the adhesive sheet from a plane crossing direction of the semiconductor wafer in at least one of the first inclined cutting step and the second inclined cutting step. The sheet cutting method according to any one of claims 1 to 3. Performing the outer edge cutting step along at least a portion of the outer edge of the semiconductor wafer;
Following the outer edge inclined cutting step, the cutter blade is rotated, and the first inclined cutting step is performed with the cutting edge directed from the radially outer side to the inner side of the semiconductor wafer,
Following the first inclined cutting step, the cutter blade is rotated, and the second inclined cutting step is performed with the cutting edge directed from the radially inner side to the outer side of the semiconductor wafer,
2. The cutter blade is rotated after the second inclined cutting step, and the rest of the outer edge cutting step is performed while changing the direction of the blade edge along the outer edge of the semiconductor wafer. The sheet cutting method described in 1. The notch comprises a trough connecting the one and the other slopes,
Following at least one of the first inclined cutting step and the second inclined cutting step, the cutter blade is rotated, and the adhesive sheet is cut while changing the direction of the blade edge along the valley. The sheet cutting method according to any one of claims 1 to 5, wherein: The adhesive sheet is formed by relatively moving the cutter blade along the outer edge of the semiconductor wafer in which a V-shaped notch having one slope and the other slope is formed in a part of the outer edge and the adhesive sheet is attached to the surface. A sheet cutting device for cutting
A sheet cutting apparatus that cuts the adhesive sheet by the sheet cutting method according to any one of claims 1 to 6.

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